USD448739S1 - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- USD448739S1 USD448739S1 US29/138,165 US13816501F USD448739S US D448739 S1 USD448739 S1 US D448739S1 US 13816501 F US13816501 F US 13816501F US D448739 S USD448739 S US D448739S
- Authority
- US
- United States
- Prior art keywords
- semiconductor device
- view
- elevational view
- side elevational
- sectional
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Description
FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a right side elevational view thereof, the left side elevational view is omitted as that is symmetrical to the right side elevational view thereof;
FIG. 7 is an enlarged cross-sectional view thereof, taken along line 7—7 of FIG. 2, with the internal system omitted; and,
FIG. 8 is an enlarged cross-sectional view thereof, taken along line 8—8 of FIG. 2, with the internal system omitted.
Claims (1)
- The ornamental design for a semiconductor device, as shown and described.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000025466 | 2000-09-12 | ||
| JP12-025466 | 2000-09-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD448739S1 true USD448739S1 (en) | 2001-10-02 |
Family
ID=18551323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/138,165 Expired - Lifetime USD448739S1 (en) | 2000-09-12 | 2001-03-08 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD448739S1 (en) |
Cited By (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD470825S1 (en) | 2001-12-28 | 2003-02-25 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD505399S1 (en) * | 2003-03-14 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD505400S1 (en) * | 2004-03-26 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD539761S1 (en) * | 2006-08-22 | 2007-04-03 | Kabushiki Kaisha Toshiba | Semiconductor |
| USD548203S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
| USD548202S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
| USD554587S1 (en) * | 2006-07-19 | 2007-11-06 | Mitsumi Electric Co., Ltd. | Circuit module for protecting the battery |
| USD556687S1 (en) * | 2006-06-06 | 2007-12-04 | Mitsumi Electric Co., Ltd. | Circuit module for protecting the battery |
| USD694724S1 (en) * | 2012-10-03 | 2013-12-03 | Honda Motor Co., Ltd. | Semiconductor device |
| USD699693S1 (en) * | 2012-10-03 | 2014-02-18 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD703625S1 (en) * | 2012-12-06 | 2014-04-29 | Samsung Electro-Mechanics Co., Ltd. | Power semiconductor module |
| USD717256S1 (en) | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717255S1 (en) | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717253S1 (en) | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717254S1 (en) | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD719113S1 (en) | 2012-09-20 | 2014-12-09 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD719926S1 (en) | 2012-09-20 | 2014-12-23 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD731491S1 (en) * | 2014-02-07 | 2015-06-09 | NimbeLink L.L.C. | Embedded cellular modem |
| USD770994S1 (en) * | 2014-04-02 | 2016-11-08 | Mitsubishi Electric Corporation | Power semiconductor device |
| US9497570B2 (en) | 2014-02-06 | 2016-11-15 | Nimbelink Corp. | Embedded wireless modem |
| USD839220S1 (en) * | 2013-02-19 | 2019-01-29 | Sony Corporation | Semiconductor device |
| USD852765S1 (en) * | 2017-10-19 | 2019-07-02 | Rohm Co., Ltd. | Semiconductor device |
| USD853343S1 (en) * | 2017-10-19 | 2019-07-09 | Rohm Co., Ltd. | Semiconductor device |
| USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
| USD873226S1 (en) * | 2018-04-13 | 2020-01-21 | Rohm Co., Ltd. | Semiconductor module |
| USD874412S1 (en) * | 2018-04-13 | 2020-02-04 | Rohm Co., Ltd. | Semiconductor module |
| USD874411S1 (en) * | 2008-04-13 | 2020-02-04 | Rohm Co., Ltd. | Semiconductor module |
| USD877102S1 (en) * | 2017-12-28 | 2020-03-03 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor module |
| USD888673S1 (en) * | 2018-06-26 | 2020-06-30 | Rohm Co., Ltd. | Semiconductor module |
| USD902877S1 (en) * | 2018-06-12 | 2020-11-24 | Rohm Co., Ltd. | Packaged semiconductor module |
| USD906271S1 (en) | 2018-04-13 | 2020-12-29 | Rohm Co., Ltd. | Semiconductor module |
| USD913978S1 (en) | 2018-06-26 | 2021-03-23 | Rohm Co., Ltd. | Semiconductor module |
| USD914621S1 (en) * | 2019-05-14 | 2021-03-30 | Rohm Co., Ltd. | Packaged semiconductor module |
| USD920264S1 (en) * | 2019-11-27 | 2021-05-25 | The Noco Company | Semiconductor device |
| USD932452S1 (en) * | 2019-11-27 | 2021-10-05 | The Noco Company | Semiconductor device |
| USD971863S1 (en) * | 2020-01-28 | 2022-12-06 | Rohm Co., Ltd. | Semiconductor module |
| USD972516S1 (en) * | 2020-01-28 | 2022-12-13 | Rohm Co., Ltd. | Semiconductor module |
| USD981356S1 (en) * | 2020-01-28 | 2023-03-21 | Rohm Co., Ltd. | Semiconductor module |
| USD1042376S1 (en) * | 2022-02-25 | 2024-09-17 | Rohm Co., Ltd. | Semiconductor module |
| USD1046800S1 (en) * | 2022-01-28 | 2024-10-15 | Mitsubishi Electric Corporation | Semiconductor device |
| USD1046801S1 (en) * | 2022-01-28 | 2024-10-15 | Mitsubishi Electric Corporation | Semiconductor device |
| USD1073632S1 (en) * | 2021-04-23 | 2025-05-06 | Wolfspeed, Inc. | Power module |
| USD1095474S1 (en) * | 2022-12-02 | 2025-09-30 | Semiconductor Components Industries, Llc | Power module package |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5089929A (en) | 1990-03-08 | 1992-02-18 | The United States Of America As Represented By The Secretary Of The Air Force | Retrofit integrated circuit terminal protection device |
| US5221859A (en) | 1990-02-26 | 1993-06-22 | Hitachi, Ltd. | Lead frame for semiconductor device |
| USD401912S (en) | 1995-11-27 | 1998-12-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD421969S (en) | 1998-09-29 | 2000-03-28 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD428859S (en) | 1999-01-28 | 2000-08-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
-
2001
- 2001-03-08 US US29/138,165 patent/USD448739S1/en not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5221859A (en) | 1990-02-26 | 1993-06-22 | Hitachi, Ltd. | Lead frame for semiconductor device |
| US5089929A (en) | 1990-03-08 | 1992-02-18 | The United States Of America As Represented By The Secretary Of The Air Force | Retrofit integrated circuit terminal protection device |
| USD401912S (en) | 1995-11-27 | 1998-12-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD421969S (en) | 1998-09-29 | 2000-03-28 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD428859S (en) | 1999-01-28 | 2000-08-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
Non-Patent Citations (1)
| Title |
|---|
| Catalogue of Toshiba Corp., Toshiba APRES series, "Intelligent power module", 1999. |
Cited By (51)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD470825S1 (en) | 2001-12-28 | 2003-02-25 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD505399S1 (en) * | 2003-03-14 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD505400S1 (en) * | 2004-03-26 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD548203S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
| USD548202S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
| USD556687S1 (en) * | 2006-06-06 | 2007-12-04 | Mitsumi Electric Co., Ltd. | Circuit module for protecting the battery |
| USD554587S1 (en) * | 2006-07-19 | 2007-11-06 | Mitsumi Electric Co., Ltd. | Circuit module for protecting the battery |
| USD539761S1 (en) * | 2006-08-22 | 2007-04-03 | Kabushiki Kaisha Toshiba | Semiconductor |
| USD874411S1 (en) * | 2008-04-13 | 2020-02-04 | Rohm Co., Ltd. | Semiconductor module |
| USD717256S1 (en) | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717255S1 (en) | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD719113S1 (en) | 2012-09-20 | 2014-12-09 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD719926S1 (en) | 2012-09-20 | 2014-12-23 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD699693S1 (en) * | 2012-10-03 | 2014-02-18 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD694724S1 (en) * | 2012-10-03 | 2013-12-03 | Honda Motor Co., Ltd. | Semiconductor device |
| USD717253S1 (en) | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717254S1 (en) | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD703625S1 (en) * | 2012-12-06 | 2014-04-29 | Samsung Electro-Mechanics Co., Ltd. | Power semiconductor module |
| USD839220S1 (en) * | 2013-02-19 | 2019-01-29 | Sony Corporation | Semiconductor device |
| US9497570B2 (en) | 2014-02-06 | 2016-11-15 | Nimbelink Corp. | Embedded wireless modem |
| USD731491S1 (en) * | 2014-02-07 | 2015-06-09 | NimbeLink L.L.C. | Embedded cellular modem |
| USD770994S1 (en) * | 2014-04-02 | 2016-11-08 | Mitsubishi Electric Corporation | Power semiconductor device |
| USD772182S1 (en) * | 2014-04-02 | 2016-11-22 | Mitsubishi Electric Corporation | Power semiconductor device |
| USD777124S1 (en) * | 2014-04-02 | 2017-01-24 | Mitsubishi Electric Corporation | Power semiconductor device |
| USD783550S1 (en) * | 2014-04-02 | 2017-04-11 | Mitsubishi Electric Corporation | Power semiconductor device |
| USD852765S1 (en) * | 2017-10-19 | 2019-07-02 | Rohm Co., Ltd. | Semiconductor device |
| USD853343S1 (en) * | 2017-10-19 | 2019-07-09 | Rohm Co., Ltd. | Semiconductor device |
| USD864135S1 (en) | 2017-10-26 | 2019-10-22 | Mitsubishi Electric Corporation | Semiconductor device |
| USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
| USD877102S1 (en) * | 2017-12-28 | 2020-03-03 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor module |
| USD906271S1 (en) | 2018-04-13 | 2020-12-29 | Rohm Co., Ltd. | Semiconductor module |
| USD874412S1 (en) * | 2018-04-13 | 2020-02-04 | Rohm Co., Ltd. | Semiconductor module |
| USD978809S1 (en) | 2018-04-13 | 2023-02-21 | Rohm Co., Ltd. | Semiconductor module |
| USD873226S1 (en) * | 2018-04-13 | 2020-01-21 | Rohm Co., Ltd. | Semiconductor module |
| USD902877S1 (en) * | 2018-06-12 | 2020-11-24 | Rohm Co., Ltd. | Packaged semiconductor module |
| USD888673S1 (en) * | 2018-06-26 | 2020-06-30 | Rohm Co., Ltd. | Semiconductor module |
| USD903613S1 (en) | 2018-06-26 | 2020-12-01 | Rohm Co., Ltd. | Semiconductor module |
| USD913978S1 (en) | 2018-06-26 | 2021-03-23 | Rohm Co., Ltd. | Semiconductor module |
| USD914621S1 (en) * | 2019-05-14 | 2021-03-30 | Rohm Co., Ltd. | Packaged semiconductor module |
| USD920264S1 (en) * | 2019-11-27 | 2021-05-25 | The Noco Company | Semiconductor device |
| USD932452S1 (en) * | 2019-11-27 | 2021-10-05 | The Noco Company | Semiconductor device |
| USD971863S1 (en) * | 2020-01-28 | 2022-12-06 | Rohm Co., Ltd. | Semiconductor module |
| USD972516S1 (en) * | 2020-01-28 | 2022-12-13 | Rohm Co., Ltd. | Semiconductor module |
| USD981356S1 (en) * | 2020-01-28 | 2023-03-21 | Rohm Co., Ltd. | Semiconductor module |
| USD1073632S1 (en) * | 2021-04-23 | 2025-05-06 | Wolfspeed, Inc. | Power module |
| USD1046800S1 (en) * | 2022-01-28 | 2024-10-15 | Mitsubishi Electric Corporation | Semiconductor device |
| USD1046801S1 (en) * | 2022-01-28 | 2024-10-15 | Mitsubishi Electric Corporation | Semiconductor device |
| USD1042376S1 (en) * | 2022-02-25 | 2024-09-17 | Rohm Co., Ltd. | Semiconductor module |
| USD1095474S1 (en) * | 2022-12-02 | 2025-09-30 | Semiconductor Components Industries, Llc | Power module package |
| USD1098055S1 (en) * | 2022-12-02 | 2025-10-14 | Semiconductor Components Industries, Llc | Power module package |
| USD1113776S1 (en) * | 2022-12-02 | 2026-02-17 | Semiconductor Components Industries, Llc | Power module package |
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