USD444132S1 - Semiconductor element - Google Patents

Semiconductor element Download PDF

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Publication number
USD444132S1
USD444132S1 US29/128,169 US12816900F USD444132S US D444132 S1 USD444132 S1 US D444132S1 US 12816900 F US12816900 F US 12816900F US D444132 S USD444132 S US D444132S
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US
United States
Prior art keywords
semiconductor element
view
elevational view
ornamental design
mirror image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/128,169
Inventor
Masaaki Iwanishi
Toshihisa Inoue
Kazuhiko Kurahashi
Kenji Suzuki
Shinjiro Yano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
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Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to US29/128,169 priority Critical patent/USD444132S1/en
Assigned to KABUSHIKI KAISHA TOSHIBA reassignment KABUSHIKI KAISHA TOSHIBA (ASSIGNMENT OF ASSIGNOR'S INTEREST) RE-RECORD TO CORRECT THE RECORDATION DATE OF 11-28-00 TO 11-8-00 PREVIOUSLY RECORDED AT REEL/FRAME 11307/0349 Assignors: YANO, SHINJIRO, IWANISHI, MASAAKI, INOUE, TOSHIHISA, KURAHASHI, KAZUHIKO, SUZUKI, KENJI
Assigned to KABUSHIKI KAISHA TOSHIBA reassignment KABUSHIKI KAISHA TOSHIBA INVALID RECORDING, DOCUMENT RE-RECORDED TO CORRECT THE RECORDATION DATE. SEE DOCUMENT AT REEL 11421, FRAME 0190. Assignors: YANO, SHINJIRO, IWANISHI, MASAAKI, INOUE, TOSHIHISA, KURAHASHI, KAZUHIKO, SUZUKI, KENJI
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Publication of USD444132S1 publication Critical patent/USD444132S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front, bottom and right side perspective view of a semiconductor element showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a right side elevational view thereof; a left side view being a mirror image thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a front, bottom and right side perspective view of a second embodiment of the semiconductor element;
FIG. 8 is a front elevational view thereof;
FIG. 9 is a right side elevational view thereof; a left side elevational view being a mirror image thereof;
FIG. 10 is a top plan view thereof;
FIG. 11 is a rear elevational view thereof; and,
FIG. 12 is a bottom plan view thereof.

Claims (1)

  1. The ornamental design for a semiconductor element, as shown and described.
US29/128,169 2000-08-23 2000-08-23 Semiconductor element Expired - Lifetime USD444132S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/128,169 USD444132S1 (en) 2000-08-23 2000-08-23 Semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/128,169 USD444132S1 (en) 2000-08-23 2000-08-23 Semiconductor element

Publications (1)

Publication Number Publication Date
USD444132S1 true USD444132S1 (en) 2001-06-26

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Family Applications (1)

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US29/128,169 Expired - Lifetime USD444132S1 (en) 2000-08-23 2000-08-23 Semiconductor element

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US (1) USD444132S1 (en)

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD668659S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
USD668658S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
USD680119S1 (en) * 2011-11-15 2013-04-16 Connectblue Ab Module
USD680545S1 (en) * 2011-11-15 2013-04-23 Connectblue Ab Module
USD689053S1 (en) * 2011-11-15 2013-09-03 Connectblue Ab Module
USD692896S1 (en) * 2011-11-15 2013-11-05 Connectblue Ab Module
US8975694B1 (en) 2013-03-07 2015-03-10 Vlt, Inc. Low resistance power switching device
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD732488S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD732487S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD752000S1 (en) 2013-03-07 2016-03-22 Vlt, Inc. Semiconductor device
USD758329S1 (en) * 2013-08-06 2016-06-07 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD760230S1 (en) * 2014-09-16 2016-06-28 Daishinku Corporation Piezoelectric vibration device
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD845921S1 (en) * 2017-05-02 2019-04-16 Rohm Co., Ltd. Semiconductor device
USD902877S1 (en) * 2018-06-12 2020-11-24 Rohm Co., Ltd. Packaged semiconductor module
USD904325S1 (en) * 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
USD945384S1 (en) * 2019-09-26 2022-03-08 Lapis Semiconductor Co., Ltd. Semiconductor module
USD1042376S1 (en) * 2022-02-25 2024-09-17 Rohm Co., Ltd. Semiconductor module

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Extract of Denpa Shimbun (Newspaper), Oct. 2, 1999.

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD668659S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
USD668658S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
USD680119S1 (en) * 2011-11-15 2013-04-16 Connectblue Ab Module
USD680545S1 (en) * 2011-11-15 2013-04-23 Connectblue Ab Module
USD689053S1 (en) * 2011-11-15 2013-09-03 Connectblue Ab Module
USD692896S1 (en) * 2011-11-15 2013-11-05 Connectblue Ab Module
US8975694B1 (en) 2013-03-07 2015-03-10 Vlt, Inc. Low resistance power switching device
US9269661B1 (en) 2013-03-07 2016-02-23 Vlt, Inc. Low resistance power switching device
USD752000S1 (en) 2013-03-07 2016-03-22 Vlt, Inc. Semiconductor device
USD732488S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD732487S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD758329S1 (en) * 2013-08-06 2016-06-07 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD767571S1 (en) 2014-09-16 2016-09-27 Daishinku Corporation Piezoelectric vibration device
USD760230S1 (en) * 2014-09-16 2016-06-28 Daishinku Corporation Piezoelectric vibration device
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD845921S1 (en) * 2017-05-02 2019-04-16 Rohm Co., Ltd. Semiconductor device
USD902877S1 (en) * 2018-06-12 2020-11-24 Rohm Co., Ltd. Packaged semiconductor module
USD904325S1 (en) * 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module
USD945384S1 (en) * 2019-09-26 2022-03-08 Lapis Semiconductor Co., Ltd. Semiconductor module
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
USD969762S1 (en) 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package
USD1042376S1 (en) * 2022-02-25 2024-09-17 Rohm Co., Ltd. Semiconductor module

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