USD404375S - Heat retaining tube base for use in a semiconductor wafer head processing apparatus - Google Patents

Heat retaining tube base for use in a semiconductor wafer head processing apparatus Download PDF

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Publication number
USD404375S
USD404375S US29/083,718 US8371898F USD404375S US D404375 S USD404375 S US D404375S US 8371898 F US8371898 F US 8371898F US D404375 S USD404375 S US D404375S
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US
United States
Prior art keywords
processing apparatus
semiconductor wafer
heat retaining
tube base
retaining tube
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/083,718
Inventor
Tomohisa Shimazu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SHIMAZU, TOMOHISA
Application granted granted Critical
Publication of USD404375S publication Critical patent/USD404375S/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 a perspective view of a heat retaining tube base for use in a semiconductor wafer heat processing apparatus;
FIG. 2 a front elevational view thereof;
FIG. 3 a top plan view thereof;
FIG. 4 a right side view thereof;
FIG. 5 a bottom plan view thereof; and,
FIG. 6 a cross-sectional view taken along line VI--VI in Fig. 3.

Claims (1)

  1. I claim the ornamental design for a heat retaining tube base for use in a semiconductor wafer heat processing apparatus, as shown and described.
US29/083,718 1997-08-20 1998-02-12 Heat retaining tube base for use in a semiconductor wafer head processing apparatus Expired - Lifetime USD404375S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9-65105 1997-08-20
JP6510597 1997-08-20

Publications (1)

Publication Number Publication Date
USD404375S true USD404375S (en) 1999-01-19

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ID=71729425

Family Applications (1)

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US29/083,718 Expired - Lifetime USD404375S (en) 1997-08-20 1998-02-12 Heat retaining tube base for use in a semiconductor wafer head processing apparatus

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD574792S1 (en) * 2006-08-23 2008-08-12 Tokyo Electron Limited Lower heat insulating cylinder for manufacturing semiconductor wafers
USD579885S1 (en) * 2007-02-20 2008-11-04 Tokyo Electron Limited Upper heat insulating cylinder for manufacturing semiconductor wafers
USD601979S1 (en) * 2008-03-28 2009-10-13 Tokyo Electron Limited Pedestal base of a heat insulating cylinder for manufacturing semiconductor wafers
USD616395S1 (en) * 2009-03-11 2010-05-25 Tokyo Electron Limited Support of wafer boat for manufacturing semiconductor wafers
USD616394S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Support of wafer boat for manufacturing semiconductor wafers
USD798250S1 (en) * 2015-12-01 2017-09-26 Nuflare Technology, Inc. Heater
USD1032549S1 (en) * 2020-11-06 2024-06-25 Hitachi Energy Ltd Reinforced straight turret for electrical equipment
USD1036400S1 (en) * 2020-11-06 2024-07-23 Hitachi Energy Ltd Reinforced external turret for electrical equipment

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4857689A (en) 1988-03-23 1989-08-15 High Temperature Engineering Corporation Rapid thermal furnace for semiconductor processing
US5314574A (en) 1992-06-26 1994-05-24 Tokyo Electron Kabushiki Kaisha Surface treatment method and apparatus
US5320218A (en) 1992-04-07 1994-06-14 Shinko Electric Co., Ltd. Closed container to be used in a clean room
US5752796A (en) 1996-01-24 1998-05-19 Muka; Richard S. Vacuum integrated SMIF system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4857689A (en) 1988-03-23 1989-08-15 High Temperature Engineering Corporation Rapid thermal furnace for semiconductor processing
US5320218A (en) 1992-04-07 1994-06-14 Shinko Electric Co., Ltd. Closed container to be used in a clean room
US5314574A (en) 1992-06-26 1994-05-24 Tokyo Electron Kabushiki Kaisha Surface treatment method and apparatus
US5752796A (en) 1996-01-24 1998-05-19 Muka; Richard S. Vacuum integrated SMIF system

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD574792S1 (en) * 2006-08-23 2008-08-12 Tokyo Electron Limited Lower heat insulating cylinder for manufacturing semiconductor wafers
USD579885S1 (en) * 2007-02-20 2008-11-04 Tokyo Electron Limited Upper heat insulating cylinder for manufacturing semiconductor wafers
USD601979S1 (en) * 2008-03-28 2009-10-13 Tokyo Electron Limited Pedestal base of a heat insulating cylinder for manufacturing semiconductor wafers
USD616394S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Support of wafer boat for manufacturing semiconductor wafers
USD616395S1 (en) * 2009-03-11 2010-05-25 Tokyo Electron Limited Support of wafer boat for manufacturing semiconductor wafers
USD798250S1 (en) * 2015-12-01 2017-09-26 Nuflare Technology, Inc. Heater
USD1032549S1 (en) * 2020-11-06 2024-06-25 Hitachi Energy Ltd Reinforced straight turret for electrical equipment
USD1036400S1 (en) * 2020-11-06 2024-07-23 Hitachi Energy Ltd Reinforced external turret for electrical equipment

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