USD1112115S1 - Insulation plate for a semiconductor manufacturing apparatus - Google Patents

Insulation plate for a semiconductor manufacturing apparatus

Info

Publication number
USD1112115S1
USD1112115S1 US29/920,441 US202329920441F USD1112115S US D1112115 S1 USD1112115 S1 US D1112115S1 US 202329920441 F US202329920441 F US 202329920441F US D1112115 S USD1112115 S US D1112115S
Authority
US
United States
Prior art keywords
manufacturing apparatus
semiconductor manufacturing
insulation plate
view
insulation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/920,441
Other languages
English (en)
Inventor
Yusaku OKAJIMA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
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Publication of USD1112115S1 publication Critical patent/USD1112115S1/en
Active legal-status Critical Current
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US29/920,441 2023-06-12 2023-12-11 Insulation plate for a semiconductor manufacturing apparatus Active USD1112115S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023012019F JP1760960S (enExample) 2023-06-12 2023-06-12
JP2023-012019D 2023-06-12

Publications (1)

Publication Number Publication Date
USD1112115S1 true USD1112115S1 (en) 2026-02-10

Family

ID=89452058

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/920,441 Active USD1112115S1 (en) 2023-06-12 2023-12-11 Insulation plate for a semiconductor manufacturing apparatus

Country Status (3)

Country Link
US (1) USD1112115S1 (enExample)
JP (1) JP1760960S (enExample)
TW (1) TWD240926S (enExample)

Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5358781A (en) * 1990-11-30 1994-10-25 Somar Corporation Heat insulating plate comprising synthetic paper sheets and metal films
US6093644A (en) * 1997-06-26 2000-07-25 Toshiba Ceramics Co., Ltd. Jig for semiconductor wafers and method for producing the same
US20040256284A1 (en) * 2002-11-26 2004-12-23 Masatoshi Nanjo Cassette for storing a plurality of semiconductor wafers
US7329947B2 (en) * 2003-11-07 2008-02-12 Sumitomo Mitsubishi Silicon Corporation Heat treatment jig for semiconductor substrate
USD600220S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
US20100055555A1 (en) * 2008-09-01 2010-03-04 Sony Corporation Insulating plate of nonaqueous electrolyte secondary cell, nonaqueous electrolyte secondary cell, and method for producing insulating plate of nonaqueous electrolyte secondary cell
USD615937S1 (en) * 2009-03-06 2010-05-18 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD616392S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD616393S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD654884S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD654883S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
US20170335458A1 (en) * 2015-02-25 2017-11-23 Hitachi Kokusai Electric Inc. Substrate Processing Apparatus, Heater and Method of Manufacturing Semiconductor Device
USD804437S1 (en) * 2016-09-30 2017-12-05 Norton (Waterford) Limited Circuit board
US10008402B1 (en) * 2017-02-21 2018-06-26 Coorstek Kk Vertical wafer boat
JP1624353S (enExample) 2018-07-19 2019-02-12
USD852763S1 (en) * 2017-08-31 2019-07-02 ebm-papst Lanshut GmbH Circuit board
US10453713B2 (en) * 2016-11-29 2019-10-22 Taiwan Semiconductor Manufacturing Co., Ltd. Method for controlling temperature of furnace in semiconductor fabrication process
USD979506S1 (en) * 2019-08-22 2023-02-28 Asm Ip Holding B.V. Insulator
USD981972S1 (en) * 2021-03-22 2023-03-28 Kokusai Electric Corporation Adiabatic plate for substrate processing appratus
USD1003834S1 (en) * 2021-06-28 2023-11-07 Kokusai Electric Corporation Heat insulator cover of semiconductor manufacturing apparatus
USD1053157S1 (en) * 2022-08-10 2024-12-03 Kokusai Electric Corporation Heat reflector for semiconductor manufacturing equipment
USD1054388S1 (en) * 2021-10-15 2024-12-17 Shin-Etsu Chemical Co., Ltd. Carrier substrate for handling

Patent Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5358781A (en) * 1990-11-30 1994-10-25 Somar Corporation Heat insulating plate comprising synthetic paper sheets and metal films
US6093644A (en) * 1997-06-26 2000-07-25 Toshiba Ceramics Co., Ltd. Jig for semiconductor wafers and method for producing the same
US20040256284A1 (en) * 2002-11-26 2004-12-23 Masatoshi Nanjo Cassette for storing a plurality of semiconductor wafers
US7329947B2 (en) * 2003-11-07 2008-02-12 Sumitomo Mitsubishi Silicon Corporation Heat treatment jig for semiconductor substrate
USD600220S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
US20100055555A1 (en) * 2008-09-01 2010-03-04 Sony Corporation Insulating plate of nonaqueous electrolyte secondary cell, nonaqueous electrolyte secondary cell, and method for producing insulating plate of nonaqueous electrolyte secondary cell
USD615937S1 (en) * 2009-03-06 2010-05-18 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD616392S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD616393S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD654883S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD654884S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
US20170335458A1 (en) * 2015-02-25 2017-11-23 Hitachi Kokusai Electric Inc. Substrate Processing Apparatus, Heater and Method of Manufacturing Semiconductor Device
USD804437S1 (en) * 2016-09-30 2017-12-05 Norton (Waterford) Limited Circuit board
US10453713B2 (en) * 2016-11-29 2019-10-22 Taiwan Semiconductor Manufacturing Co., Ltd. Method for controlling temperature of furnace in semiconductor fabrication process
US10008402B1 (en) * 2017-02-21 2018-06-26 Coorstek Kk Vertical wafer boat
USD852763S1 (en) * 2017-08-31 2019-07-02 ebm-papst Lanshut GmbH Circuit board
JP1624353S (enExample) 2018-07-19 2019-02-12
USD924823S1 (en) 2018-07-19 2021-07-13 Kokusai Electric Corporation Adiabatic plate for substrate processing apparatus
USD979506S1 (en) * 2019-08-22 2023-02-28 Asm Ip Holding B.V. Insulator
USD981972S1 (en) * 2021-03-22 2023-03-28 Kokusai Electric Corporation Adiabatic plate for substrate processing appratus
USD1003834S1 (en) * 2021-06-28 2023-11-07 Kokusai Electric Corporation Heat insulator cover of semiconductor manufacturing apparatus
USD1054388S1 (en) * 2021-10-15 2024-12-17 Shin-Etsu Chemical Co., Ltd. Carrier substrate for handling
USD1053157S1 (en) * 2022-08-10 2024-12-03 Kokusai Electric Corporation Heat reflector for semiconductor manufacturing equipment

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
High Temperature Insulation Sheets,https://id.misumi-ec.com/vona2/detail/110300530810/?list=PageCategory, 2025. (Year: 2025). *
High Temperature Insulation Sheets,https://id.misumi-ec.com/vona2/detail/110300530810/?list=PageCategory, 2025. (Year: 2025). *

Also Published As

Publication number Publication date
JP1760960S (enExample) 2024-01-10
TWD240926S (zh) 2025-10-11

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