JP1624353S - - Google Patents

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Publication number
JP1624353S
JP1624353S JPD2018-15809F JP2018015809F JP1624353S JP 1624353 S JP1624353 S JP 1624353S JP 2018015809 F JP2018015809 F JP 2018015809F JP 1624353 S JP1624353 S JP 1624353S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2018-15809F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2018-15809F priority Critical patent/JP1624353S/ja
Priority to TW107306663F priority patent/TWD197466S/zh
Priority to US29/672,222 priority patent/USD924823S1/en
Application granted granted Critical
Publication of JP1624353S publication Critical patent/JP1624353S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2018-15809F 2018-07-19 2018-07-19 Active JP1624353S (enExample)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JPD2018-15809F JP1624353S (enExample) 2018-07-19 2018-07-19
TW107306663F TWD197466S (zh) 2018-07-19 2018-11-12 基板處理裝置用隔熱板
US29/672,222 USD924823S1 (en) 2018-07-19 2018-12-04 Adiabatic plate for substrate processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2018-15809F JP1624353S (enExample) 2018-07-19 2018-07-19

Publications (1)

Publication Number Publication Date
JP1624353S true JP1624353S (enExample) 2019-02-12

Family

ID=65269381

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2018-15809F Active JP1624353S (enExample) 2018-07-19 2018-07-19

Country Status (3)

Country Link
US (1) USD924823S1 (enExample)
JP (1) JP1624353S (enExample)
TW (1) TWD197466S (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1053157S1 (en) 2022-08-10 2024-12-03 Kokusai Electric Corporation Heat reflector for semiconductor manufacturing equipment
USD1112115S1 (en) 2023-06-12 2026-02-10 Kokusai Electric Corporation Insulation plate for a semiconductor manufacturing apparatus

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USD971900S1 (en) 2019-06-03 2022-12-06 Space Exploration Technologies Corp. Antenna apparatus
USD976242S1 (en) 2019-06-03 2023-01-24 Space Exploration Technologies Corp. Antenna apparatus
USD971192S1 (en) 2019-06-03 2022-11-29 Space Exploration Technologies Corp. Antenna apparatus
USD940131S1 (en) * 2019-07-29 2022-01-04 Samsung Display Co., Ltd. Display panel
USD966276S1 (en) 2019-07-29 2022-10-11 Samsung Display Co., Ltd. Display module for wearable device
USD958094S1 (en) 2019-07-29 2022-07-19 Samsung Display Co., Ltd. Display panel
TWI735115B (zh) * 2019-12-24 2021-08-01 力成科技股份有限公司 晶圓儲存裝置及晶圓承載盤
USD962206S1 (en) * 2020-01-09 2022-08-30 Space Exploration Technologies Corp. Antenna apparatus
JP1700781S (ja) 2021-03-22 2021-11-29 基板処理装置用断熱板
USD1054388S1 (en) * 2021-10-15 2024-12-17 Shin-Etsu Chemical Co., Ltd. Carrier substrate for handling
JP1730244S (ja) * 2021-12-21 2022-11-21 フレキシブルプリント基板

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US5088006A (en) * 1991-04-25 1992-02-11 International Business Machines Corporation Liquid film interface cooling system for semiconductor wafer processing
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USD404374S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Fin for use in a semiconductor wafer heat processing apparatus
US6783299B2 (en) * 1999-07-26 2004-08-31 Ovadia Meron Latch for detachably attaching and mounting a semiconductor wafer to a support ring
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USD616392S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
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USD654884S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD654883S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD720309S1 (en) * 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
TWD174921S (zh) * 2014-12-17 2016-04-11 日本碍子股份有限公司 複合基板之部分
CN107408505B (zh) * 2015-02-25 2021-03-09 株式会社国际电气 衬底处理装置、加热器及半导体器件的制造方法
JP1568061S (enExample) 2016-03-30 2017-01-30
USD843184S1 (en) * 2016-06-02 2019-03-19 David Harold Woodcock Cutting tool for adhesive tape dispensers
USD793352S1 (en) * 2016-07-11 2017-08-01 Asm Ip Holding B.V. Getter plate
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JP6770461B2 (ja) * 2017-02-21 2020-10-14 クアーズテック株式会社 縦型ウエハボート
JP6916413B2 (ja) * 2017-04-25 2021-08-11 株式会社島津製作所 電源一体型真空ポンプ
USD852763S1 (en) * 2017-08-31 2019-07-02 ebm-papst Lanshut GmbH Circuit board
US10861727B2 (en) * 2018-03-13 2020-12-08 Samsung Electronics Co., Ltd. Segmented vertical wafer boat
USD879730S1 (en) * 2018-12-18 2020-03-31 SiFive, Inc. Circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1053157S1 (en) 2022-08-10 2024-12-03 Kokusai Electric Corporation Heat reflector for semiconductor manufacturing equipment
USD1112115S1 (en) 2023-06-12 2026-02-10 Kokusai Electric Corporation Insulation plate for a semiconductor manufacturing apparatus

Also Published As

Publication number Publication date
USD924823S1 (en) 2021-07-13
TWD197466S (zh) 2019-05-11

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