USD1070797S1 - Furnace for substrate processing apparatus - Google Patents

Furnace for substrate processing apparatus Download PDF

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Publication number
USD1070797S1
USD1070797S1 US29/849,023 US202229849023F USD1070797S US D1070797 S1 USD1070797 S1 US D1070797S1 US 202229849023 F US202229849023 F US 202229849023F US D1070797 S USD1070797 S US D1070797S
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United States
Prior art keywords
furnace
processing apparatus
substrate processing
view
elevational view
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Active
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US29/849,023
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English (en)
Inventor
Hideto TATENO
Takatomo Yamaguchi
Daiki KIMOTO
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Kokusai Electric Corp
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Kokusai Electric Corp
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Assigned to Kokusai Electric Corporation reassignment Kokusai Electric Corporation ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: YAMAGUCHI, TAKATOMO, Kimoto, Daiki, TATENO, HIDETO
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US29/849,023 2022-03-15 2022-08-08 Furnace for substrate processing apparatus Active USD1070797S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022005265F JP1731671S (enrdf_load_stackoverflow) 2022-03-15 2022-03-15
JP2022-005265D 2022-03-15

Publications (1)

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USD1070797S1 true USD1070797S1 (en) 2025-04-15

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US29/849,023 Active USD1070797S1 (en) 2022-03-15 2022-08-08 Furnace for substrate processing apparatus

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US (1) USD1070797S1 (enrdf_load_stackoverflow)
JP (1) JP1731671S (enrdf_load_stackoverflow)
TW (1) TWD231014S (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1086086S1 (en) * 2021-10-01 2025-07-29 Kokusai Electric Corporation Separator of substrate processing apparatus

Citations (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD406113S (en) * 1997-01-31 1999-02-23 Tokyo Electron Limited Processing tube for use in a semiconductor wafer heat processing apparatus
US6225602B1 (en) * 1997-05-02 2001-05-01 Advanced Semiconductor Materials International N.V. Vertical furnace for the treatment of semiconductor substrates
USD594488S1 (en) * 2007-04-20 2009-06-16 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD610559S1 (en) * 2008-05-30 2010-02-23 Hitachi Kokusai Electric, Inc. Reaction tube
USD611013S1 (en) * 2008-03-28 2010-03-02 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD711843S1 (en) * 2013-06-28 2014-08-26 Hitachi Kokusai Electric Inc. Reaction tube
USD719114S1 (en) * 2013-06-28 2014-12-09 Hitachi Kokusai Electric Inc. Reaction tube
USD720309S1 (en) * 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD720707S1 (en) * 2013-06-28 2015-01-06 Hitachi Kokusai Electric Inc. Reaction tube
USD725055S1 (en) * 2013-06-28 2015-03-24 Hitachi Kokusai Electric Inc. Reaction tube
USD725053S1 (en) * 2011-11-18 2015-03-24 Tokyo Electron Limited Outer tube for process tube for manufacturing semiconductor wafers
USD739832S1 (en) * 2013-06-28 2015-09-29 Hitachi Kokusai Electric Inc. Reaction tube
USD770993S1 (en) * 2015-09-04 2016-11-08 Hitachi Kokusai Electric Inc. Reaction tube
USD772824S1 (en) * 2015-02-25 2016-11-29 Hitachi Kokusai Electric Inc. Reaction tube
USD790490S1 (en) * 2015-09-04 2017-06-27 Hitachi Kokusai Electric Inc. Reaction tube
USD791090S1 (en) * 2015-09-04 2017-07-04 Hitachi Kokusai Electric Inc. Reaction tube
USD800080S1 (en) * 2016-03-30 2017-10-17 Tokyo Electron Limited Reactor tube for semiconductor production devices
USD823363S1 (en) 2016-02-12 2018-07-17 Hitachi Kokusai Electric Inc. Heater of substrate processing apparatus
USD824440S1 (en) * 2016-02-12 2018-07-31 Hitachi Kokusai Electric Inc. Heater of substrate processing apparatus
USD825502S1 (en) * 2016-10-14 2018-08-14 Hitachi Kokusai Electric Inc. Heater for substrate processing apparatus
USD842823S1 (en) * 2017-08-10 2019-03-12 Kokusai Electric Corporation Reaction tube
USD843958S1 (en) * 2017-08-10 2019-03-26 Kokusai Electric Corporation Reaction tube
USD853979S1 (en) * 2017-12-27 2019-07-16 Kokusai Electric Corporation Reaction tube
USD860419S1 (en) * 2018-02-27 2019-09-17 Kokusai Electric Corporation Electric furnace for substrate processing apparatus
USD860420S1 (en) * 2018-02-27 2019-09-17 Kokusai Electric Corporation Electric furnace for substrate processing apparatus
USD901406S1 (en) * 2019-03-20 2020-11-10 Kokusai Electric Corporation Inner tube of reactor for semiconductor fabrication
US20230089509A1 (en) * 2021-09-21 2023-03-23 Kokusai Electric Corporation Furnace opening structure, substrate processing apparatus and method of manufacturing semiconductor device
USD1053156S1 (en) * 2022-03-15 2024-12-03 Kokusai Electric Corporation Furnace for substrate processing apparatus

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1682719S (enrdf_load_stackoverflow) 2020-06-15 2021-04-05

Patent Citations (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD406113S (en) * 1997-01-31 1999-02-23 Tokyo Electron Limited Processing tube for use in a semiconductor wafer heat processing apparatus
US6225602B1 (en) * 1997-05-02 2001-05-01 Advanced Semiconductor Materials International N.V. Vertical furnace for the treatment of semiconductor substrates
USD594488S1 (en) * 2007-04-20 2009-06-16 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD611013S1 (en) * 2008-03-28 2010-03-02 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD610559S1 (en) * 2008-05-30 2010-02-23 Hitachi Kokusai Electric, Inc. Reaction tube
USD720309S1 (en) * 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD725053S1 (en) * 2011-11-18 2015-03-24 Tokyo Electron Limited Outer tube for process tube for manufacturing semiconductor wafers
USD719114S1 (en) * 2013-06-28 2014-12-09 Hitachi Kokusai Electric Inc. Reaction tube
USD720707S1 (en) * 2013-06-28 2015-01-06 Hitachi Kokusai Electric Inc. Reaction tube
USD725055S1 (en) * 2013-06-28 2015-03-24 Hitachi Kokusai Electric Inc. Reaction tube
USD739832S1 (en) * 2013-06-28 2015-09-29 Hitachi Kokusai Electric Inc. Reaction tube
USD711843S1 (en) * 2013-06-28 2014-08-26 Hitachi Kokusai Electric Inc. Reaction tube
USD772824S1 (en) * 2015-02-25 2016-11-29 Hitachi Kokusai Electric Inc. Reaction tube
USD790490S1 (en) * 2015-09-04 2017-06-27 Hitachi Kokusai Electric Inc. Reaction tube
USD770993S1 (en) * 2015-09-04 2016-11-08 Hitachi Kokusai Electric Inc. Reaction tube
USD791090S1 (en) * 2015-09-04 2017-07-04 Hitachi Kokusai Electric Inc. Reaction tube
USD823363S1 (en) 2016-02-12 2018-07-17 Hitachi Kokusai Electric Inc. Heater of substrate processing apparatus
USD824440S1 (en) * 2016-02-12 2018-07-31 Hitachi Kokusai Electric Inc. Heater of substrate processing apparatus
USD800080S1 (en) * 2016-03-30 2017-10-17 Tokyo Electron Limited Reactor tube for semiconductor production devices
USD825502S1 (en) * 2016-10-14 2018-08-14 Hitachi Kokusai Electric Inc. Heater for substrate processing apparatus
USD842823S1 (en) * 2017-08-10 2019-03-12 Kokusai Electric Corporation Reaction tube
USD843958S1 (en) * 2017-08-10 2019-03-26 Kokusai Electric Corporation Reaction tube
USD853979S1 (en) * 2017-12-27 2019-07-16 Kokusai Electric Corporation Reaction tube
USD860419S1 (en) * 2018-02-27 2019-09-17 Kokusai Electric Corporation Electric furnace for substrate processing apparatus
USD860420S1 (en) * 2018-02-27 2019-09-17 Kokusai Electric Corporation Electric furnace for substrate processing apparatus
USD901406S1 (en) * 2019-03-20 2020-11-10 Kokusai Electric Corporation Inner tube of reactor for semiconductor fabrication
US20230089509A1 (en) * 2021-09-21 2023-03-23 Kokusai Electric Corporation Furnace opening structure, substrate processing apparatus and method of manufacturing semiconductor device
USD1053156S1 (en) * 2022-03-15 2024-12-03 Kokusai Electric Corporation Furnace for substrate processing apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1086086S1 (en) * 2021-10-01 2025-07-29 Kokusai Electric Corporation Separator of substrate processing apparatus

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Publication number Publication date
TWD231014S (zh) 2024-05-01
JP1731671S (enrdf_load_stackoverflow) 2022-12-08

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