US9976736B2 - Lighting assembly and associated method - Google Patents

Lighting assembly and associated method Download PDF

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Publication number
US9976736B2
US9976736B2 US14/232,291 US201214232291A US9976736B2 US 9976736 B2 US9976736 B2 US 9976736B2 US 201214232291 A US201214232291 A US 201214232291A US 9976736 B2 US9976736 B2 US 9976736B2
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US
United States
Prior art keywords
light source
board
heat sink
lighting assembly
drive board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related, expires
Application number
US14/232,291
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English (en)
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US20140140078A1 (en
Inventor
Alberto Alfier
Lorenzo Roberto Trevisanello
Franco Zanon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Osram SpA
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Assigned to OSRAM S.P.A. - SOCIETA` RIUNITE OSRAM EDISON CLERICI reassignment OSRAM S.P.A. - SOCIETA` RIUNITE OSRAM EDISON CLERICI ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ALFIER, ALBERTO, TREVISANELLO, LORENZO ROBERTO, ZANON, FRANCO
Assigned to OSRAM GMBH reassignment OSRAM GMBH ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OSRAM S.P.A. SOCIETA´ RIUNITE OSRAM EDISON CLERICI
Publication of US20140140078A1 publication Critical patent/US20140140078A1/en
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Expired - Fee Related legal-status Critical Current
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Classifications

    • F21V29/22—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Definitions

  • Various embodiments relate to lighting assemblies.
  • the description may refer to LED lighting assemblies, for example of the multi-chip type.
  • LED light sources for example of the multi-chip type, i.e. with several chips which are arranged on a metal panel and connected directly to a connector of the module without providing any “intelligence” within the circuit.
  • This method of operation may result in:
  • Various embodiments provide lighting assemblies, for example of the LED type, able to be used, for example, for street lighting applications, which have modular characteristics and are able to provide one or more of the following advantages:
  • various embodiments provide a lighting assembly having the characteristic features mentioned in the claims below.
  • the disclosure also relates to a corresponding method.
  • FIG. 1 is a general perspective view of an embodiment
  • FIG. 2 is a view of some parts of an embodiment
  • FIG. 3 is a substantially cross-sectional view along the line III-III of FIG. 1 , reproduced on an enlarged scale;
  • FIG. 4 shows parts of embodiments shown cross-sectioned
  • FIG. 5 shows, in a manner substantially similar to that of FIG. 4 , some details of embodiments.
  • an embodiment in the context of this description indicates that a particular configuration, structure or characteristic feature described in relation to the embodiment is included in at least one embodiment. Therefore, phrases such as “in an embodiment”, which may occur at various points in this description, do not necessarily refer to the same embodiment. Moreover, particular forms, structures or characteristic features may be combined in any suitable manner in one or more embodiments.
  • the reference number 10 denotes overall a lighting assembly which can be used, for example, in a street lighting system.
  • the assembly 10 uses, as a light radiation source, an LED module.
  • the assembly 10 may comprise three parts:
  • the board 14 with the light source 14 a may be sandwiched between the heat sink 12 and the “drive” board 16 .
  • the board 16 may be made with a rectangular form. Obviously, other forms such as a square, polygonal, mixtilinear or other form are possible.
  • the board 16 may have an aperture 160 with an inner edge 160 a having a progression (rectangular in the example of embodiment shown here) complementing the progression (in this case also rectangular) of the perimetral edge 140 of the board 14 .
  • FIGS. 4 and 5 show the assembled condition of the boards 14 and 16 , the heat sink 12 being omitted for the sake of simplicity. It can be seen from this how the same boards 14 and 16 may form an independent module.
  • the light source 14 a may be left uncovered by the circuit board 16 , so that the light radiation emitted by the source 14 a may be diffused freely towards the outside environment without being masked/obscured by the board 16 .
  • the inner edge 160 a of the aperture 160 has a frame formation 1600 which extends (continuously or discontinuously) along the contour of the aperture 160 protruding towards the inside of the aperture 160 itself.
  • the frame formation 1600 may be aligned with the top surface of the board 16 .
  • the outer perimetral edge 140 abuts against the frame formation 1600 , so that the board 14 carrying the light source 14 a is arranged firmly in position inside the aperture 160 .
  • the peripheral connection between the board 14 (along the edge 140 ) and the circuit board 16 (along the frame formation 1600 ) may be made stronger by applying glue (not explicitly visible in the drawings).
  • the frame formation 1600 may be provided, in a position facing the outer perimetral edge 140 of the board 14 , with an indentation 1600 a —visible in FIG. 2 —so as to form a seat for receiving this glue.
  • the reference number 16 b denotes openings (for example four in number, located at the corners of the aperture 160 ) for receiving screws 18 (or similar fixing means) which allow the drive board 16 to be fixed on the heat sink 18 with the board 14 firmly sandwiched between them (namely between the drive board 16 and the heat sink 18 ).
  • the thickness of the board 14 is chosen depending on the thickness of the board 16 (in particular as regards the positioning and thickness of the frame formation 1600 ) such that the board 14 carrying the light source 14 a is, as it were, “thicker” or “higher” than the depth of the aperture 1600 defined by the positioning and depth of the frame formation 1600 .
  • a gap or clearance 20 is formed between the bottom side of the board 16 and the top surface of the heat sink 12 —see in particular FIG. 3 .
  • the board 14 with the light source 14 a (for example made using CoB technology) can be pressed by the board 16 against the surface of the heat sink 12 , minimizing the thermal resistance and optimizing the heat dissipation flow from the source 14 a towards the sink 12 .
  • the mounting solution shown is able to ensure a precise mechanical connection, which takes up any working tolerances.
  • FIGS. 3 to 5 illustrate the possibility, in various embodiments, of providing electrical contacts 22 , for example of the spring-loaded type, acting between the drive board 16 and the board 14 carrying the light source 14 a , for example allowing the electrical connection between metallization strips or tracks provided on these boards.
  • these contacts may have a coil-like—for example C-shaped—form and be arranged astride the board 16 and the board 14 , for example with end loops resting (directly or by means of projecting side lugs, see for example FIGS. 3 and 4 ) on the board 16 and on the board 14 , respectively.
  • a coil-like—for example C-shaped—form and be arranged astride the board 16 and the board 14 , for example with end loops resting (directly or by means of projecting side lugs, see for example FIGS. 3 and 4 ) on the board 16 and on the board 14 , respectively.
  • the contacts 22 may be arranged inside interruptions in the frame formation 1600 (see for example the interruptions indicated by 1600 b in FIG. 2 , in FIG. 4 and in FIG. 5 ).
  • the contacts 22 may be mounted inside protective casings 22 a able to act as mounting elements for the contacts 22 .
  • fixing of the contacts 22 on the board 16 may instead be performed by means of the aforementioned side lugs of these contacts 22 , in which case the casings 22 a perform principally only a covering function

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
US14/232,291 2011-07-14 2012-07-12 Lighting assembly and associated method Expired - Fee Related US9976736B2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
ITTO20110624 2011-07-14
ITTO2011A0624 2011-07-14
ITTO2011A000624 2011-07-14
PCT/EP2012/063724 WO2013007796A1 (en) 2011-07-14 2012-07-12 Lighting assembly and associated method

Publications (2)

Publication Number Publication Date
US20140140078A1 US20140140078A1 (en) 2014-05-22
US9976736B2 true US9976736B2 (en) 2018-05-22

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
US14/232,291 Expired - Fee Related US9976736B2 (en) 2011-07-14 2012-07-12 Lighting assembly and associated method

Country Status (4)

Country Link
US (1) US9976736B2 (zh)
EP (1) EP2732208B1 (zh)
CN (1) CN103649635B (zh)
WO (1) WO2013007796A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3087078B1 (en) 2013-12-26 2019-05-15 Purdue Pharma LP 7-beta-alkyl analogs of orvinols
JP6358576B2 (ja) * 2014-09-11 2018-07-18 パナソニックＩｐマネジメント株式会社 発光モジュールのホルダおよび照明装置
US10378733B1 (en) 2017-10-30 2019-08-13 Race, LLC Modular optical assembly and light emission system
US10801678B1 (en) 2017-10-30 2020-10-13 Race, LLC Modular emitting device and light emission system
EP3671032B1 (en) * 2018-12-19 2021-11-03 Nichia Corporation Light-emitting module
JP7219401B2 (ja) * 2018-12-19 2023-02-08 日亜化学工業株式会社 発光モジュール
DE102020102941A1 (de) * 2020-02-05 2021-08-05 Marelli Automotive Lighting Reutlingen (Germany) GmbH Leiterplattenanordnung und Verfahren zum Herstellen einer Leiterplattenanordnung

Citations (6)

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Publication number Priority date Publication date Assignee Title
WO2004071143A1 (en) 2003-02-07 2004-08-19 Matsushita Electric Industrial Co., Ltd. Socket for led light source and lighting system using the socket
CN101101093A (zh) 2006-07-07 2008-01-09 株式会社小糸制作所 发光模块及车辆用灯具
US20090046469A1 (en) * 2007-08-16 2009-02-19 Ama Precision Inc. Light Emitting Diode Module
US20110069502A1 (en) * 2010-04-14 2011-03-24 David Hum Mounting Fixture for LED Lighting Modules
US20110090691A1 (en) * 2009-10-15 2011-04-21 Joshua Josiah Markle Lamp assemblies and methods of making the same
US8354684B2 (en) * 2011-01-09 2013-01-15 Bridgelux, Inc. Packaging photon building blocks having only top side connections in an interconnect structure

Patent Citations (10)

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Publication number Priority date Publication date Assignee Title
WO2004071143A1 (en) 2003-02-07 2004-08-19 Matsushita Electric Industrial Co., Ltd. Socket for led light source and lighting system using the socket
US20060141851A1 (en) * 2003-02-07 2006-06-29 Nobuyuki Matsui Socket for led light source and lighting system using the socket
CN101101093A (zh) 2006-07-07 2008-01-09 株式会社小糸制作所 发光模块及车辆用灯具
US20080008427A1 (en) 2006-07-07 2008-01-10 Koito Manufacturing Co., Ltd. Light emitting module and lighting device for vehicle
US20090046469A1 (en) * 2007-08-16 2009-02-19 Ama Precision Inc. Light Emitting Diode Module
TW200910627A (en) 2007-08-16 2009-03-01 Ama Precision Inc Light emitting diode module
US20110090691A1 (en) * 2009-10-15 2011-04-21 Joshua Josiah Markle Lamp assemblies and methods of making the same
WO2011046695A2 (en) 2009-10-15 2011-04-21 Cree, Inc. Lamp assemblies and methods of making the same
US20110069502A1 (en) * 2010-04-14 2011-03-24 David Hum Mounting Fixture for LED Lighting Modules
US8354684B2 (en) * 2011-01-09 2013-01-15 Bridgelux, Inc. Packaging photon building blocks having only top side connections in an interconnect structure

Non-Patent Citations (4)

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Title
Chinese Office Action based on Application No. 201280034408.X (8 Pages and 9 Pages of English translation) dated Oct. 10, 2015 (Reference Purpose Only).
Chinese Office Action based on Application No. 201280034408.X(9 Pages and 11 pages of English translation) dated May 23, 2016 (Reference Purpose Only).
European Office Action based on applicatopn No. 12738078.0 (6 pages) dated Feb. 25, 2015.
International Search Report of PCT/EP2012/063724 dated Oct. 10, 2012.

Also Published As

Publication number Publication date
US20140140078A1 (en) 2014-05-22
WO2013007796A1 (en) 2013-01-17
CN103649635A (zh) 2014-03-19
EP2732208B1 (en) 2016-04-20
CN103649635B (zh) 2017-02-15
EP2732208A1 (en) 2014-05-21

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