US9943010B2 - Electronic unit - Google Patents

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Publication number
US9943010B2
US9943010B2 US15/534,825 US201515534825A US9943010B2 US 9943010 B2 US9943010 B2 US 9943010B2 US 201515534825 A US201515534825 A US 201515534825A US 9943010 B2 US9943010 B2 US 9943010B2
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United States
Prior art keywords
heat
electronic
generating
component
casing
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Application number
US15/534,825
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English (en)
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US20170347491A1 (en
Inventor
Yuuji DAIMON
Norio Fujii
Hideki Sunaga
Haruo Suzuki
Yuuzou SHIMAMURA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marelli Corp
Original Assignee
Calsonic Kansei Corp
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Publication date
Application filed by Calsonic Kansei Corp filed Critical Calsonic Kansei Corp
Assigned to CALSONIC KANSEI CORPORATION reassignment CALSONIC KANSEI CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FUJII, NORIO, SUZUKI, HARUO, DAIMON, Yuuji, SHIMAMURA, Yuuzou, SUNAGA, HIDEKI
Publication of US20170347491A1 publication Critical patent/US20170347491A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Definitions

  • the present invention relates to an electronic unit.
  • a large number of electrical components are disposed in respective portions of a vehicle body.
  • a large number of electronic units are used.
  • Such electronic units include one which simultaneously includes a heat generating electronic component that generates heat through energization and a heat-susceptible electronic component (See Patent Literature 1, for example).
  • a heat generating electronic component that generates heat through energization
  • a heat-susceptible electronic component See Patent Literature 1, for example.
  • a heat generating electronic component and a heat-susceptible electronic component are separately disposed in a casing by interposing a sealed space for thermal insulation between the components, for example.
  • each of the heat generating electronic component and the heat-susceptible electronic component is individually sealed with a thermosetting potting material having a heat conductivity higher than that of air.
  • Patent Literature 1 JP 4043930 B
  • heating treatment is performed to cure the potting material.
  • heat generated at this time expands the air in the sealed space for thermal insulation.
  • air bubbles are formed in the potting material to develop and burst upon reaching a breaking point, thus causing the formation of a crater or the like.
  • a moisture preventing effect by the potting material becomes incomplete.
  • dew condensation water may accumulate in the crater to cause a problem such as: a short circuit due to water exposure in an electronic component, especially a heat generating electronic component or a heat-susceptible electronic component, or in the circuit in which the electronic component is placed; or a circuit breakdown due to the phenomenon of material loss resulting from migration, i.e., ionization.
  • the present invention provides an electronic unit including a heat releasing member on which a heat generating electronic component is mounted, the heat generating electronic component generating heat through energization, and a casing capable of containing a heat generating electronic component within the casing in a tightly sealed state.
  • the casing has an opening that abuts the heat releasing member.
  • the casing has a heat-generating-electronic-component placement section in which the heat generating electronic component is placed, the heat-generating-electronic-component placement section being filled with a thermosetting potting material; a partition wall that partitions the heat-generating-electronic-component placement section within the opening; an adjacent section that is adjacent to the heat-generating-electronic-component placement section via the partition wall; and a lateral wall that covers the adjacent section. An end of the partition wall abuts the heat releasing member.
  • the partition wall, the lateral wall, and the heat releasing member define a space.
  • the lateral wall has a communicating hole that communicates with the inside of the casing that is in the tightly sealed state.
  • FIG. 1 is an exploded perspective view of an electronic unit according to the present embodiment.
  • FIG. 2 is a vertical cross-sectional view of the electronic unit of FIG. 1 .
  • FIG. 3 is a bottom view of the casing of FIG. 1 .
  • FIG. 4 is a plan view of the casing of FIG. 1 .
  • FIGS. 1 to 4 are intended to illustrate the embodiment.
  • such an electronic unit 1 is configured to include a casing 4 having an electronic component containing space 3 capable of containing electronic components 2 therein, and a heat releasing member 5 on which heat generating electronic components 2 a that generate heat through energization are mounted.
  • the casing 4 has an opening 6 to which the heat releasing member 5 can be fixed in an abutting manner.
  • the electronic unit 1 is provided as a PWM module for performing PWM control such as a controller of a radiator fan.
  • the electronic unit 1 is not limited to the above.
  • the casing 4 has a frame-shaped casing body 11 , a lid 13 covering an opening 12 in the top surface of the casing body 11 , and a bottom member 14 covering the opening 6 in the back surface of the casing body 11 .
  • the casing body 11 is provided with connection holes 11 a for connection to external connecters or the like.
  • Each of the lid 13 and the bottom member 14 is adhesively fixed to the respective peripheral edge portions of the openings 6 , 12 of the casing body 11 using an adhesive to achieve sealing. Accordingly, the peripheral edge portion of the opening 6 in the back surface of the casing 4 is formed with an adhesion margin 15 corresponding to the peripheral edge portion of the bottom member 14 .
  • the peripheral edge portion of the opening 12 in the top surface of the casing 4 is formed with an adhesion groove 17 into which a projecting adhesion rim 16 formed around the peripheral edge portion of the lid 13 is to be fitted and adhesively fixed using an adhesive.
  • Each of the heat generating electronic components 2 a may be a heat generating semiconductor such as a MOS-type FET, a coil, a shunt resistor, or the like, for example.
  • the heat generating electronic components 2 a are not limited to above.
  • the heat generating electronic components 2 a are collectively mounted on a circuit board 18 .
  • the heat releasing member 5 is provided as a heat sink made of metal having a high heat conductivity, such as aluminum, or the like.
  • the circuit board 18 on which the heat generating electronic components 2 a are mounted is fixed to the heat releasing member 5 via a heat conductive material 19 such as a heat conductive adhesive or a heat-transfer sheet.
  • the bottom member 14 of the casing 4 is used as the heat releasing member 5 .
  • the casing 4 has a partition wall 23 that partitions the opening 6 into a heat-generating-electronic-component placement section 21 where the heat generating electronic components 2 a are placed and an adjacent section 22 that is adjacent to the heat-generating-electronic-component placement section 21 when the heat releasing member 5 is fixed to the opening 6 .
  • the heat-generating-electronic-component placement section 21 is filled with a thermosetting potting material 24 for moisture prevention up to a height which allows at least the heat generating electronic components 2 a to be buried in the potting material 24 .
  • the adjacent section 22 has a communicating portion 25 that communicates with a position in the electronic component containing space 3 of the casing 4 which is apart from the heat-generating-electronic-component placement section 21 filled with the potting material 24 .
  • the heat-generating-electronic-component placement section 21 is provided as a closed region which occupies the major part of the opening 6 in the back surface of the casing body 11 .
  • the circuit board 18 described above is mainly mounted on a portion of the heat releasing member 5 , the portion corresponding to the heat-generating-electronic-component placement section 21 .
  • the adjacent section 22 is provided as a relatively small closed region corresponding to the rest of the opening 6 in the back surface of the casing body 11 .
  • the adjacent section 22 is provided as an elongate section which extends along one of the sides of the casing body 11 and has a generally rectangular shape in plan view. Partition means to divide the opening 6 along a boundary line.
  • An edge of the partition wall 23 which is positioned in a side of the opening 6 is used as an abutting portion 26 abutting on the surface of the heat releasing member 5 , the extension portion of the circuit board 18 , or the like, and also used as an adhesion margin to be bonded to the heat releasing member 5 , the extension portion of the circuit board 18 , and the like.
  • the partition wall 23 is higher than at least the height of the potting material 24 which fills the section 21 and formed as a dam plate for preventing the potting material 24 from entering the adjacent section 22 .
  • the potting material 24 a resin having a high heat conductivity, such as a silicone-based resin, is used.
  • a resin having a high heat conductivity such as a silicone-based resin.
  • the heat-generating-electronic-component placement section 21 is filled with the potting material 24 before the adhesive dries.
  • the potting material 24 is subjected to heating treatment performed using a heating furnace at, e.g., 80 degrees Celsius for 20 minutes or the like to be cured.
  • the communicating portion 25 may also formed to entirely open a top portion of the adjacent section 22 .
  • the communicating portion 25 will be described later.
  • An electronic-component placement wall portion 31 on which other electronic components 2 b different from the heat generating electronic components 2 a can be placed is formed atop the adjacent section 22 .
  • the communicating portion 25 is a communicating hole 25 a formed in the electronic-component placement wall portion 31 .
  • each of the other electronic components 2 b may be any electronic component 2 other than the heat generating electronic components 2 a.
  • the electronic-component placement wall portion 31 is configured as a lateral wall covering at least the top portion of the adjacent section 22 .
  • the electronic-component placement wall portion 31 has a surface substantially parallel with each of the lid 13 and the bottom member 14 .
  • the electronic-component placement wall portion 31 may also have a concave-convex shape in accordance with other electronic components 2 b placed on the wall portion 31 , or the like.
  • the electronic-component placement wall portion 31 may have a size same as the top portion of the adjacent section 22 described above or may also have a size which extends from the top portion of the adjacent section 22 in accordance with the other electronic components 2 b placed on the wall portion 31 . In this embodiment, the electronic-component placement wall portion 31 has the latter size.
  • a wiring portion 35 is embedded as required.
  • the circuit board 18 described above and the electronic components 2 are electrically connected to the wiring portion 35 .
  • the electronic components 2 generally include the heat generating electronic components 2 a , the other electronic components 2 b , and the like.
  • a portion of the electronic-component placement wall portion 31 which is located above the heat-generating-electronic-component placement section 21 may be provided with through space portions 36 or filling ports for filling the potting material 24 or the like as appropriate.
  • the through space portions 36 are formed in the adjacent section 22 , the wiring portion 35 , or the like.
  • the communicating holes 25 a are small holes. Any number of the communicating holes 25 a , each of which has any shape and any size, may be provided on any places of the electronic-component placement wall portion 31 . However, to efficiently dissipate the air in the adjacent section 22 which has been expanded by heat during the heating treatment of the potting material 24 , the plurality of communicating holes 25 a are preferably located as even as possible relative to the electronic-component placement wall portion 31 . By contrast, to enhance the thermally insulating effect in the adjacent section 22 , the size and number of the communicating holes 25 a are preferably minimized. Accordingly, the communicating holes 25 a are set in consideration of the balance between an air dissipation property during the heating treatment of the potting material 24 described above and a thermal insulation property under normal conditions.
  • the electronic-component placement wall portion 31 is provided with engagement claws 41 that engage with the other electronic components 2 b to hold the other electronic components 2 b .
  • Each of the communicating holes 25 a has a punch-out hole 42 which is formed when the engagement claws 41 are molded.
  • Each of the engagement claws 41 is configured to extend integrally from the electronic-component placement wall portion 31 toward the other electronic components 2 b , for example.
  • the punch-out hole 42 is a hollow portion formed in the base portion of the each engagement claw 41 after a slide die used to mold the engagement claws 41 is retracted.
  • each of the communicating holes 25 a may also include a dedicated breathing hole or the like in addition to the punch-out hole 42 for the engagement claws 41 .
  • the other electronic components 2 b are heat-susceptible electronic components 2 c.
  • the heat-susceptible electronic components 2 c i.e., heat-sensitive electronic components can be an electrolytic capacitor, a varistor, an oscillator, and the like, for example.
  • the heat-susceptible electronic components 2 c are not limited thereto.
  • the casing 4 contains the electronic components 2 within the electronic component containing space 3 and protects the electronic components 2 .
  • the casing 4 has the opening 6 and the heat releasing member 5 on which the heat generating electronic components 2 a are mounted abuts on the opening 6 and is fixed to the opening 6 . Thereby, heat generated from the heat generating electronic components 2 a can be released from the entire surface of the heat releasing member 5 to the outside by using the heat releasing member 5 .
  • the electronic unit 1 described above is manufactured as follows. That is, first, in the electronic component containing space 3 of the casing 4 , the electronic components 2 such as the other electronic components 2 b and the heat-susceptible electronic components 2 c are mounted. These electronic components 2 are fixed to the engagement claws 41 or the like and also electrically connected to the wiring portion 35 . Next, an adhesive is applied to the opening 6 in the back surface of the casing 4 to bond the bottom member 14 to the opening 6 .
  • the bottom member 14 is particularly configured as the heat releasing member 5 on which the circuit board 18 having the heat generating electronic components 2 a is mounted in advance.
  • the heat-generating-electronic-component placement section 21 is filled with the potting material 24 and immediately subjected, together with the casing 4 , to the heating treatment using the heating furnace to cure the potting material 24 . Finally, an adhesive is applied to the opening 12 in the top surface of the casing 4 and the lid 13 is bonded to the opening 12 .
  • the partition wall 23 is provided in the opening 6 of the casing 4 . Accordingly, the partition wall 23 can partition the opening 6 into two regions which are the heat-generating-electronic-component placement section 21 and the adjacent section 22 to ensure the adjacent section 22 where the heat generating electronic components 2 a are not placed. As a result, it is possible to use the adjacent section 22 where the heat generating electronic components 2 a are not placed as a thermally insulated space.
  • the heat-generating-electronic-component placement section 21 is filled with the thermosetting potting material 24 for moisture prevention up to a height which allows at least the heat generating electronic components 2 a to be buried in the potting material 24 .
  • This allows the heat generating electronic components 2 a to be encapsulated with the thermosetting potting material 24 and to have moisture resistance. Since the potting material 24 has a heat conductivity higher than that of air, heat generated from the heat generating electronic components 2 a through energization can efficiently be transferred to the heat releasing member 5 or the like via the potting material 24 .
  • the height of the potting material 24 filling the heat-generating-electronic-component placement section 21 to a level in which the potting material 24 bury the heat generating electronic components 2 a and by preventing the adjacent section 22 from being filled with the potting material 24 , it is possible to minimize the used amount of the potting material 24 and suppress a cost increase and a weight increase because of the potting material 24 .
  • the communicating portion 25 is provided in the adjacent section 22 to communicate the adjacent section 22 with a position in the electronic component containing space 3 of the casing 4 which is apart from the heat-generating-electronic-component placement section 21 .
  • This can positively dissipate the air in the adjacent section 22 which has been expanded by heat resulting from the heating treatment for curing the potting material 24 and the pressure thereof to another portion within the casing 4 other than the heat-generating-electronic-component placement section 21 .
  • the moisture preventing effect due to the potting material 24 becomes incomplete.
  • dew condensation water may accumulate in the crater CR to cause a failure such as: a short circuit due to water exposure in the heat generating electronic components 2 a or in the circuit in which the heat generating electronic components 2 a are placed or a circuit breakdown due to the phenomenon of material loss resulting from migration, i.e., ionization.
  • the air in the adjacent section 22 which has been expanded by heat resulting from the heating treatment is positively dissipated via the communicating portion 25 to another portion within the casing 4 other than the heat-generating-electronic-component placement section 21 filled with the potting material 24 .
  • the electronic-component placement wall portion 31 is formed atop the adjacent section 22 . This allows the adjacent section 22 to be closed by the electronic-component placement wall portion 31 and provide a tightly-sealed thermally insulated space and also allows the other electronic components 2 b different from the heat generating electronic components 2 a to be positively placed at positions atop the adjacent section 22 using the electronic-component placement wall portion 31 .
  • the communicating holes 25 a are formed as the communicating portion 25 .
  • the communicating portion 25 is configured as the communicating holes 25 a , it is possible to minimize the entrance and exit of air into and from the adjacent section 22 and thus enhance a thermal insulation property due to the adjacent section 22 .
  • the electronic-component placement wall portion 31 is formed with the engagement claws 41 . This allows the electronic-component placement wall portion 31 to easily engage with the other electronic components 2 b to hold the other electronic components 2 b by using the engagement claws 41 .
  • the punch-out hole 42 is formed in the base portion of each engagement claw 41 , and the punch-out hole 42 is used at least a portion of each of the communicating holes 25 a .
  • the heat-susceptible electronic components 2 c are provided as the other electronic components 2 b .
  • the heat-susceptible electronic components 2 c are isolated by the adjacent section 22 from the heat releasing member 5 .
  • the heat generating electronic components 2 a generate heat through energization
  • the heat generated from the heat generating electronic components 2 a is transferred to the heat releasing member 5 , and the heat releasing member 5 releases the heat from the entire surface thereof to the outside, the heat-susceptible electronic components 2 c can effectively be protected from the heat.
  • This can eliminate the need to make a specification change from the heat-susceptible electronic components 2 c to a costly heat-resistant electronic component such as, e.g., a heat resistant capacitor and can accordingly reduce component cost.
  • the term “and/or the like (such as)” is used to indicate that any equivalent is also included. Also, when such a term as “substantially”, “about”, or “approximately” is used, this means that a value or the like within a range or accuracy which is reasonably acceptable is also included.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)
US15/534,825 2014-12-09 2015-09-04 Electronic unit Active US9943010B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014-248663 2014-12-09
JP2014248663A JP6328044B2 (ja) 2014-12-09 2014-12-09 電子ユニット
PCT/JP2015/075196 WO2016092919A1 (ja) 2014-12-09 2015-09-04 電子ユニット

Publications (2)

Publication Number Publication Date
US20170347491A1 US20170347491A1 (en) 2017-11-30
US9943010B2 true US9943010B2 (en) 2018-04-10

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US15/534,825 Active US9943010B2 (en) 2014-12-09 2015-09-04 Electronic unit

Country Status (5)

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US (1) US9943010B2 (zh)
EP (1) EP3232748A1 (zh)
JP (1) JP6328044B2 (zh)
CN (1) CN107432090B (zh)
WO (1) WO2016092919A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD929477S1 (en) * 2020-01-07 2021-08-31 Worthington Cylinders Corporation Electronic module for a tank lid
USD924952S1 (en) * 2020-01-07 2021-07-13 Worthington Cylinders Corporation Electronic module for a tank lid
FR3115653B1 (fr) * 2020-10-22 2022-09-09 Continental Automotive Gmbh Elément de boitier électronique comprenant un radiateur et procédé d’ajustement associé
CN113301756B (zh) * 2021-06-07 2022-11-01 国网黑龙江省电力有限公司供电服务中心 一种高寒地区电能表数据采集信号强化器

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0527526U (ja) 1991-09-19 1993-04-09 三菱重工業株式会社 コントロールボツクスのトランス固定構造
JPH0550788U (ja) 1991-12-02 1993-07-02 株式会社東芝 パネルの取付構造
JPH05166954A (ja) 1991-12-16 1993-07-02 Nippondenso Co Ltd Ｉｃ応用製品の防水構造
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