US9462735B2 - LC module for installation in a motor vehicle control device - Google Patents

LC module for installation in a motor vehicle control device Download PDF

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Publication number
US9462735B2
US9462735B2 US14/441,592 US201314441592A US9462735B2 US 9462735 B2 US9462735 B2 US 9462735B2 US 201314441592 A US201314441592 A US 201314441592A US 9462735 B2 US9462735 B2 US 9462735B2
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United States
Prior art keywords
module
chamber
chambers
coil
electrolytic capacitor
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Active
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US14/441,592
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US20150305214A1 (en
Inventor
Marcus Ulherr
Cristian Minzat
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Vitesco Technologies Germany GmbH
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Conti Temic Microelectronic GmbH
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Assigned to CONTI TEMIC MICROELECTRONIC GMBH reassignment CONTI TEMIC MICROELECTRONIC GMBH ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MINZAT, Cristian, ULHERR, MARCUS
Publication of US20150305214A1 publication Critical patent/US20150305214A1/en
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Publication of US9462735B2 publication Critical patent/US9462735B2/en
Assigned to VITESCO TEHNOLOGIES GERMANY GMBH reassignment VITESCO TEHNOLOGIES GERMANY GMBH ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CONTI TEMIC MICROELECTRONIC GMBH
Assigned to VITESCO TECHNOLOGIES GERMANY GMBH reassignment VITESCO TECHNOLOGIES GERMANY GMBH CORRECTIVE ASSIGNMENT TO CORRECT THE CORRECT THE SPELLING OF THE ASSIGNEE FROM VITESCO TEHNOLOGIES GERMANY GMBH TO VITESCO TECHNOLOGIES GERMANY GMBH PREVIOUSLY RECORDED ON REEL 053100 FRAME 0385. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: CONTI TEMIC MICROELECTRONIC GMBH
Assigned to VITESCO TECHNOLOGIES GERMANY GMBH reassignment VITESCO TECHNOLOGIES GERMANY GMBH CORRECTIVE ASSIGNMENT TO CORRECT THE THE SPELLING OF THE ASSIGNEE NAME FROM VITESCO TEHNOLOGIES GERMANY GMBH TO VITESCO TECHNOLOGIES GERMANY GMBH PREVIOUSLY RECORDED ON REEL 053100 FRAME 0385. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNOR'S INTEREST. Assignors: CONTI TEMIC MICROELECTRONIC GMBH
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0023—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • B60R16/03—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for supply of electrical power to vehicle subsystems or for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10—Housing; Encapsulation
    • H01G2/106—Fixing the capacitor in a housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/26—Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices with each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/28—Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices with other electric components not covered by this subclass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
    • H05K5/0056—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by features for protecting electronic components against vibration and moisture, e.g. potting, holders for relatively large capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0256—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
    • H05K5/0286—Receptacles therefor, e.g. card slots, module sockets, card groundings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/04—Mountings specially adapted for mounting on a chassis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations

Definitions

  • the invention relates to an LC module for installing in a housing of a motor vehicle control device, wherein the LC module comprises a carrier place, at least one electrolytic capacitor and a coil, and to a method for producing said module as claimed, and also a control device having an LC module as claimed.
  • control devices for motors or transmissions into the motor vehicle assembly that is to be controlled, in particular motors or transmissions.
  • the transmission control devices form an extremely compact unit as a periphery control device.
  • this arrangement has enormous advantages in relation to quality, costs, weight and functionality. As a result of said arrangement, in particular the number of plug connections and lines and consequently the possible causes of failure are reduced.
  • control device in the transmission places great demands on its ability to withstand thermal and mechanical loads.
  • the functionality must be ensured both over a wide temperature range (approximately ⁇ 40° C. to 150° C.) as well as in the case of extreme mechanical vibrations (up to 40 g).
  • a control device of this type is described in EP 1 995 439 A2.
  • An LC module having an amplifying coil and an electrolytic capacitor is arranged in the control device housing.
  • the LC module comprises a block made from resin that can withstand extreme temperatures into which is molded a current rail made of copper. This current rail is in turn equipped with external contacts by way of which the LC module is connected to the switch carrier of the control device in an electrical manner.
  • a resilient plate having a high conductivity is arranged between the LC module and the lid of the control device in order to effectively dissipate the heat that is produced by the amplifying coil and the electrolytic capacitor by way of the lid to the surrounding area of the control device.
  • the LC module is by way of example screwed to the housing.
  • the amplifying coil and the electrolytic capacitor are bonded to the block made from resin that can withstand extreme temperatures, whereby the susceptibility to malfunction due to vibrations is to be reduced.
  • the carrier plate of the LC module comprises two spatially separated chambers, wherein at least one electrolytic capacitor is arranged in the first chamber and a coil is arranged in the second chamber.
  • the electrolytic capacitor and the coil are embedded and therefore fixed in the respective chamber at least in part in a casting compound, in particular a standard, thermosetting casting compound.
  • the carrier plate comprises a connecting piece between the two chambers and the carrier plate can be connected to the housing of a control device in a positive-locking or non-positive-locking manner for example by means of a screw or a rivet in the region of said connecting piece.
  • Each chamber advantageously comprises at least on its inner surface or outer surface throughplated contacts that render possible an electrical connection between the supply lines of the electronic components of the LC module and components, such as actuators or sensors, outside of the LC module or rather control device.
  • a third chamber is embodied between the chambers.
  • At least one wall of this third chamber comprises a slot to mechanically “decouple” the mass of the first and the second chamber to further improve the resistance to vibration of the LC module.
  • the slot or rather the slots advantageously have a V-form.
  • two electrolytic-capacitors can also be housed in the first chamber.
  • a further object of the present invention is to provide a method for producing an LC module as claimed.
  • the method in accordance with the invention comprises the steps:
  • the casting compound is initially poured into the chambers of the LC module, and the electronic components are subsequently inserted and electrically connected, wherein the sequence of producing the connection is irrelevant.
  • This alternative method has the advantage that the fill level of the casting compound can be better controlled in a chamber.
  • the LC module is preferably installed in the motor vehicle control devices, wherein the carrier plate of the LC module is connected to the housing of the control device in a positive-locking manner or a non-positive-locking manner, by way of example by means of a screw or a rivet.
  • the space between the electrolytic capacitor and the housing or rather the coil and the housing is filled with heat-conducting paste. This is used on the one hand in particular as a further measure to damp oscillation, on the other hand the heat that is produced in the electronic components is dissipated to the housing.
  • FIG. 1 illustrates a plan view of the LC module
  • FIG. 2 illustrates a side view of the LC module
  • FIG. 3 illustrates a section through the LC module and a housing section.
  • FIG. 1 illustrates an LC module 1 for installing in a housing of a motor vehicle control device, in particular a so-called periphery control device.
  • the LC module 1 essentially comprises a carrier plate 3 , an electrolytic capacitor 4 and a coil 5 .
  • the carrier plate 3 essentially comprises two spatially separated chambers 6 , 7 , wherein the electrolytic capacitor 4 is arranged in the first chamber 6 , and the coil 5 is arranged in the second chamber 7 .
  • the electrolytic capacitor 4 and the coil 5 are at least in part surrounded by the casting compound 8 .
  • the casting compound 8 is for example a heat-resistant resin and fixes the electronic components 4 and 5 in the corresponding chambers 6 , 7 .
  • the electrical supply lines 15 , 16 of the electrolytic capacitor 4 are electrically connected to the throughplated contacts 11 , 12 , for example welded or soldered.
  • the throughplated contacts 11 , 12 are integrated on an inner surface of the chamber 6 .
  • the electrical supply lines 17 , 18 of the coil 5 are electrically connected to the throughplated contacts 13 , 14 , wherein the throughplated contacts 13 , 14 are arranged on an outer surface of the chamber 7 .
  • the throughplated contacts 11 , 12 , 13 , 14 can in each case be selectively arranged on an inner surface or an outer surface of the corresponding chamber 6 , 7 .
  • the throughplated contacts 11 , 12 , 13 , 14 render possible the electrical connection between the supply lines 15 , 16 , 17 , 18 and components outside the LC module or rather the control device.
  • the carrier plate 3 comprises a connecting piece 9 between the two chambers 6 , 7 .
  • a fastening device in the form of a circular aperture 10 is arranged in this connecting piece 9 .
  • the form can deviate from the circular form.
  • the LC module 1 can be connected to the housing 2 of the control device by means of this aperture 10 in a positive-locking manner or a non-positive-locking manner by way of example by means of a screw or a rivet. This is in particular illustrated in FIG. 3 .
  • This positive-locking or non-positive-locking connection of the LC module 1 to the housing 2 in the region of the connecting piece 9 between the chambers 6 , 7 delivers the greatest contribution to the damping of the oscillations, both in relation to the frequency as well as the amplitude that are transmitted by means of the vibration above all of the motor to the LC module, and therefore to the electrolytic capacitor 4 and the coil 5 .
  • the damping of the oscillations is all the more important the larger and heavier the electronic components 4 , 5 that are installed in the chambers 6 and 7 , in particular for larger electrolytic capacitors 4 having a cup diameter greater than or equal to 18 mm and a weight from 12 g or rather for coils 5 having a weight from 40 g.
  • two walls 20 , 21 are arranged on the carrier plate 3 of the LC module 1 in the region of the connecting piece 9 between the two chambers 6 , 7 in such a manner that as a consequence, a third chamber 19 is embodied between the chambers 6 , 7 .
  • FIG. 2 illustrates a side view of the LC module 1 .
  • At least one wall 20 , 21 of the third chamber 19 comprises a slot 22 for mechanically “decoupling” the masses in the first chamber 6 and the second chamber 7 to further improve the resistance to vibration of the LC module 1 .
  • the slot or rather the slots 22 advantageously have a V-form but can also be embodied by way of example in a right-angled manner.
  • FIG. 3 illustrates a section through the LC module 1 and a housing 2 of a control device, said housing being connected to the LC module 1 , wherein the housing 2 is illustrated only in sections.
  • heat-conducting paste is arranged between the electrolytic capacitor 4 and the housing 2 or rather between the coil 5 and the housing 2 . This is used on the one hand in particular as a further measure to damp oscillation, on the other hand the heat that occurs in the electronic components 4 , 5 is reliably dissipated to the housing.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Motor Or Generator Frames (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Filters And Equalizers (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Arrangement Or Mounting Of Propulsion Units For Vehicles (AREA)
US14/441,592 2012-11-08 2013-11-04 LC module for installation in a motor vehicle control device Active US9462735B2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102012110683.5A DE102012110683A1 (de) 2012-11-08 2012-11-08 LC-Modul zum Einbau in einem Kraftfahrzeugsteuergerät
DE102012110683 2012-11-08
DE102012110683.5 2012-11-08
PCT/DE2013/200266 WO2014071941A2 (de) 2012-11-08 2013-11-04 Lc-modul zum einbau in einem kraftfahrzeugsteuergerät

Publications (2)

Publication Number Publication Date
US20150305214A1 US20150305214A1 (en) 2015-10-22
US9462735B2 true US9462735B2 (en) 2016-10-04

Family

ID=49958133

Family Applications (1)

Application Number Title Priority Date Filing Date
US14/441,592 Active US9462735B2 (en) 2012-11-08 2013-11-04 LC module for installation in a motor vehicle control device

Country Status (8)

Country Link
US (1) US9462735B2 (es)
EP (1) EP2918148B1 (es)
JP (1) JP6125029B2 (es)
CN (1) CN104956783B (es)
DE (2) DE102012110683A1 (es)
ES (1) ES2600468T3 (es)
MX (1) MX340812B (es)
WO (1) WO2014071941A2 (es)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016060446A (ja) * 2014-09-22 2016-04-25 日立オートモティブシステムズ株式会社 電子制御装置
CN109612052B (zh) * 2018-12-13 2020-12-29 深圳创维空调科技有限公司 一种电器盒、安装方法及空调
CN110001411A (zh) * 2019-03-25 2019-07-12 深圳开沃汽车有限公司 一种新型方块电容安装结构及其安装方法

Citations (12)

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Publication number Priority date Publication date Assignee Title
US3219884A (en) * 1961-09-11 1965-11-23 Gen Electric Resin encased electrical apparatus
FR2347851A1 (fr) 1976-04-08 1977-11-04 Rifa Ab Procede et monture pour enrober un composant electrique
US4453144A (en) * 1980-06-04 1984-06-05 Matsushita Electric Industrial Co., Ltd. LC Composite component
US4777461A (en) * 1986-07-01 1988-10-11 Murata Manufacturing Co., Ltd. LC composite component
US6445593B1 (en) * 1999-08-19 2002-09-03 Murata Manufacturing Co., Ltd. Chip electronic component and method of manufacturing the same
WO2003100971A1 (fr) * 2002-05-29 2003-12-04 Ajinomoto Co.,Inc. Circuit resonnant lc parallele, carte multicouches incorporant un circuit resonnant parallele lc, et leur procedes de production
US6946945B2 (en) * 2001-10-03 2005-09-20 Matsushita Electric Industrial Co., Ltd. Electronic component and method of manufacturing the same
DE102007009100A1 (de) 2007-02-24 2008-08-28 Hella Kgaa Hueck & Co. Funkantennenanordnung für Kraftfahrzeuge
EP1995439A2 (en) 2007-05-24 2008-11-26 Hitachi Ltd. Engine control unit
EP2043416A2 (en) 2007-09-28 2009-04-01 Hitachi Ltd. Electronic control device using LC module structure
US7972123B2 (en) 2006-03-29 2011-07-05 Kabushiki Kaisha Toyota Jidoshokki Electric compressor
US8184438B2 (en) 2008-03-31 2012-05-22 Hitachi, Ltd. Control device

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Publication number Priority date Publication date Assignee Title
ATE452052T1 (de) * 2007-05-21 2010-01-15 Magneti Marelli Spa Elektronische steuereinheit mit erweiterten blöcken
JP4841592B2 (ja) * 2008-06-24 2011-12-21 日立オートモティブシステムズ株式会社 制御装置
JP4998747B2 (ja) * 2008-06-27 2012-08-15 国産電機株式会社 車載用電力制御装置
DE102009002993B4 (de) * 2009-05-11 2012-10-04 Infineon Technologies Ag Leistungshalbleitermodul mit beabstandeten Schaltungsträgern
DE102010036910A1 (de) * 2010-08-08 2012-02-09 Ssb Wind Systems Gmbh & Co. Kg Elektrische Vorrichtung

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3219884A (en) * 1961-09-11 1965-11-23 Gen Electric Resin encased electrical apparatus
FR2347851A1 (fr) 1976-04-08 1977-11-04 Rifa Ab Procede et monture pour enrober un composant electrique
US4453144A (en) * 1980-06-04 1984-06-05 Matsushita Electric Industrial Co., Ltd. LC Composite component
US4777461A (en) * 1986-07-01 1988-10-11 Murata Manufacturing Co., Ltd. LC composite component
US6445593B1 (en) * 1999-08-19 2002-09-03 Murata Manufacturing Co., Ltd. Chip electronic component and method of manufacturing the same
US6946945B2 (en) * 2001-10-03 2005-09-20 Matsushita Electric Industrial Co., Ltd. Electronic component and method of manufacturing the same
WO2003100971A1 (fr) * 2002-05-29 2003-12-04 Ajinomoto Co.,Inc. Circuit resonnant lc parallele, carte multicouches incorporant un circuit resonnant parallele lc, et leur procedes de production
US7972123B2 (en) 2006-03-29 2011-07-05 Kabushiki Kaisha Toyota Jidoshokki Electric compressor
DE102007009100A1 (de) 2007-02-24 2008-08-28 Hella Kgaa Hueck & Co. Funkantennenanordnung für Kraftfahrzeuge
EP1995439A2 (en) 2007-05-24 2008-11-26 Hitachi Ltd. Engine control unit
US7899602B2 (en) * 2007-05-24 2011-03-01 Hitachi, Ltd. Engine control unit
EP2043416A2 (en) 2007-09-28 2009-04-01 Hitachi Ltd. Electronic control device using LC module structure
US20090086437A1 (en) 2007-09-28 2009-04-02 Hitachi, Ltd. Electronic control device using lc module structure
US8050037B2 (en) * 2007-09-28 2011-11-01 Hitachi, Ltd. Electronic control device using LC module structure
US8184438B2 (en) 2008-03-31 2012-05-22 Hitachi, Ltd. Control device

Also Published As

Publication number Publication date
DE112013005328A5 (de) 2015-09-10
CN104956783B (zh) 2018-04-24
US20150305214A1 (en) 2015-10-22
MX340812B (es) 2016-07-27
WO2014071941A2 (de) 2014-05-15
WO2014071941A3 (de) 2014-08-07
EP2918148A2 (de) 2015-09-16
MX2015005830A (es) 2015-09-24
JP2016505433A (ja) 2016-02-25
JP6125029B2 (ja) 2017-05-10
CN104956783A (zh) 2015-09-30
EP2918148B1 (de) 2016-08-03
DE102012110683A1 (de) 2014-05-08
ES2600468T3 (es) 2017-02-09

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