US9202729B2 - Hybrid chuck - Google Patents

Hybrid chuck Download PDF

Info

Publication number
US9202729B2
US9202729B2 US11/991,028 US99102806A US9202729B2 US 9202729 B2 US9202729 B2 US 9202729B2 US 99102806 A US99102806 A US 99102806A US 9202729 B2 US9202729 B2 US 9202729B2
Authority
US
United States
Prior art keywords
temperature
regulating
fluid
main body
range
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active, expires
Application number
US11/991,028
Other languages
English (en)
Other versions
US20090250202A1 (en
Inventor
Markus Eibl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ATT Systems GmbH
Original Assignee
ATT Systems GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ATT Systems GmbH filed Critical ATT Systems GmbH
Assigned to ATT SYSTEMS GMBH reassignment ATT SYSTEMS GMBH ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: EIBL, MARKUS
Publication of US20090250202A1 publication Critical patent/US20090250202A1/en
Assigned to BAYERISCHE HYPO- UND VEREINSBANK AKTIENGESELLSCHAFT reassignment BAYERISCHE HYPO- UND VEREINSBANK AKTIENGESELLSCHAFT SECURITY AGREEMENT Assignors: ATT ADVANCED TEMPERATURE TEST SYSTEMS GMBH
Assigned to ATT ADVANCED TEMPERATURE TEST SYSTEMS GMBH reassignment ATT ADVANCED TEMPERATURE TEST SYSTEMS GMBH RELEASE OF SECURITY INTEREST Assignors: BAYERISCHE HYPO-UND VEREINSBANK AKTIENGESELLSCHAFT
Application granted granted Critical
Publication of US9202729B2 publication Critical patent/US9202729B2/en
Active legal-status Critical Current
Adjusted expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies

Definitions

  • the invention relates to an apparatus and a method for regulating the temperature of a substrate and in particular for regulating the temperature of a wafer.
  • Holding apparatuses and in particular wafer chucks which mostly have a planar bearing surface for the wafer-type substrates, are customarily used for testing circuit arrangements on wafer-type substrates, such as semiconductor wafers, for example. It is necessary for a large number of electrical measurements for testing a substrate to adjust the temperature of the substrate to a constant predetermined value and/or to maintain it at a constant predetermined value.
  • heating and/or cooling elements are formed in a substrate holding apparatus or the holding apparatus is combined with a conventional thermochuck.
  • the substrate In order to transfer the regulated temperature of the apparatus also to the substrate, the substrate must be in good thermal contact with the bearing surface of the holding apparatus.
  • vacuum openings for example, are formed in the contact surface in order to enable the substrate to be sucked up.
  • Conventional substrate holding apparatuses are provided with a closed cooling circuit in which a cooling fluid circulates through ducts in the substrate holding apparatus to a heat exchanger and back again to the substrate holding apparatus.
  • a closed circuit only comprises a fixed, non-expandable volume, it may be possible depending on the cooling fluid at relatively high operating temperatures that high pressures occur in the circuit such that the substrate holding apparatus and/or parts of the cooling circuit are subjected to high stresses. Consequently, the risk of failure increases and, for example, the seals in the circuit must in conventional appliances be designed to be particularly resistant to pressures, which incurs corresponding expenses. Moreover, appliances of this type regularly need to be serviced which involves a high degree of complexity.
  • the object is achieved according to the invention by virtue of an apparatus for regulating the temperature of a substrate, in particular of a wafer, wherein the apparatus has a base or main body whose temperature is regulated by a first temperature-regulating apparatus and a second temperature-regulating device, wherein the first temperature-regulating device is used to regulate the temperature of the main body in a first temperature range between a first temperature and a second temperature, with the first temperature being lower than the second temperature, and is temperature-regulated using a first temperature-regulating fluid, and the second temperature-regulating device is used to regulate the temperature of the main body in a second temperature range between a third temperature and a fourth temperature, with the third temperature being lower than the fourth temperature, and the second temperature-regulating device is temperature-regulated using a second temperature-regulating fluid, wherein the second temperature is lower than the fourth temperature and the first temperature-regulating fluid is different from the second temperature-regulating fluid.
  • first and second temperature-regulating fluids can be chosen appropriately, in each case for a specific operating range, according to the desired physical characteristics, such as the pressure- and temperature-dependent aggregate states (solid, fluid, gaseous), the desired flow characteristics (viscosity, tendency to change into turbulent flows etc.), heat capacity, thermal conductivity, heat transition at specific solid surfaces and/or dew points of gases with condensable proportions and so on.
  • Each of the two temperature-regulating devices can be operated in a range in which the other temperature-regulating device with the other temperature-regulating fluid would be less suitable.
  • the overall temperature range within which the apparatus is operated is preferably between a first temperature of approximately ⁇ 75° C. (198.15 Kelvin) and a fourth temperature of approximately 400° C. (673.15 Kelvin).
  • the second temperature is preferably 300° C. (573.15 Kelvin), better yet approximately 200° C. (473.15 Kelvin) and most advantageously approximately 100° C. (373.15 Kelvin).
  • the third temperature preferably lies within the range of the first temperature, but may also be higher up to within the range of the second temperature. Operation of the second temperature-regulating apparatus up to a temperature of within the range of the first temperature has the advantage that then the first and the second temperature-regulating devices can operate at the same time up to said range and thus contribute to quicker temperature changes. Operating the second temperature-regulating device up to a lower third temperature (just) below the second temperature can be advantageous, for example, if parameters such as the dew point of a gaseous temperature-regulating fluid need to be taken into consideration. At a higher third temperature is not necessary in such a case to dry the used gas as strongly as would be necessary at lower temperatures.
  • the first temperature-regulating fluid is preferably a liquid alcohol.
  • the first temperature-regulating fluid is even more preferably a thermal oil on silicone-oil basis. It is most preferable to use a temperature-regulating fluid which contains perfluorinated polyether, poly(oxyperfluoro-n-alkylene) and/or a mixture of triethoxyalkylsilanes.
  • An apparatus in which the second temperature-regulating fluid is air or nitrogen is also advantageous.
  • the first temperature-regulating device has a first temperature-regulating means circuit, which is advantageously substantially closed, through which a first temperature-regulating fluid flows in order to regulate the temperature, wherein the first temperature-regulating means circuit is designed such that the first temperature-regulating fluid, once it has flowed through the region of the temperature-regulated main body, remains in the temperature-regulating means circuit at least partially at least in the operating range between the first temperature and the second temperature.
  • the fluid at least in stationary operation, that is to say if a set temperature is intended to be maintained—has, if it leaves the range to be temperature-regulated, a temperature which is negligibly above or below the entry temperature with the result that in an external temperature-regulating apparatus, in which the fluid is meant to be brought to entry temperature, only a small temperature difference needs to be equalized, which can save energy.
  • a pressure-relief valve In order to equalize pressure peaks it is advantageously possible to provide a pressure-relief valve.
  • An apparatus of the type in which the first temperature-regulating fluid in the temperature range between the first temperature and the second temperature up to a prespecified first maximum pressure has a liquid aggregate state is furthermore preferred.
  • This has the advantage that the heat transfer coefficient of liquids on solid walls is generally higher than the heat transfer coefficient of gases on solid walls. It is possible, for example, in the case of a prespecified area, for more heat to be transferred per unit time when using liquid fluids so that a specific temperature can be adjusted more quickly than when using gaseous fluids.
  • an apparatus is designed such that that part of the first temperature-regulating means circuit which is situated in the region of the temperature-regulated main body preferably can, via a shut-off valve, be shut off from the remaining region of the first temperature-regulating circuit and/or be connected to a pressure-relief region.
  • the second temperature-regulating device for regulating the temperature of the main body has a second closed temperature-regulating means circuit, through which a second temperature-regulating fluid flows in order to regulate the temperature, is preferred.
  • the second temperature-regulating fluid advantageously has, in the temperature range between the third temperature and the fourth temperature, a liquid aggregate state up to a prespecified second maximum pressure.
  • An apparatus in which the second temperature-regulating fluid has, in the temperature range between the third temperature and the fourth temperature, a liquid or a gaseous aggregate state is also advantageous. This has the advantage that pressure peaks in the circuit can be avoided more easily than is the case in a liquid fluid. Furthermore, a gaseous fluid can be used to realize higher flow rates, so that it is also possible in heat transfer coefficients for “gases on walls” for large flows of heat to be realized.
  • the second temperature-regulating device for regulating the temperature of the main body has a temperature-regulating body and an incident-flow apparatus, wherein the incident-flow apparatus is designed such that it can cause the flow of a second temperature-regulating fluid to be incident on the temperature-regulating body, wherein the second temperature-regulating apparatus is designed such that the second temperature-regulating fluid is not returned again into a temperature-regulating fluid circuit after it was incident on the temperature-regulating body.
  • Maintenance costs could also be reduced in this embodiment if for example technical gases, which can be produced on an industrial scale, or compressed ambient air are used as cooling fluid.
  • a simple cooling effect can be achieved in both cases by way of the sudden pressure drop when the gas flows out of the pressure vessel, in particular if rapid cooling of the main body is necessary without adjustment of the temperature to a specific value.
  • An apparatus of this type particularly preferably further has an electric temperature-regulating apparatus.
  • Advantages of such an apparatus are, for example, simple handling, freedom from maintenance, control rate and costs of electric temperature-regulating apparatuses, in particular of electrical heating elements.
  • the electric temperature-regulating apparatus has a Peltier element which is designed as an areal separating layer between the first and the second temperature-regulating devices.
  • a Peltier element has the advantage that it can be used, depending on the polarity of a connected power supply or circuit arrangement, both for heating and for cooling the main body or for measuring the temperature.
  • the Peltier element can preferably also be used in conjunction with one or more other electric temperature-regulating apparatuses.
  • the object is also achieved according to the invention by way of a method for regulating the temperature of a substrate, in particular of a wafer, comprising the following steps:
  • FIG. 1 shows a cross section of a preferred embodiment of an apparatus of the invention for regulating the temperature of a substrate according to a first embodiment.
  • FIG. 2 shows a cross section of a preferred embodiment of an apparatus of the invention for regulating the temperature of a substrate according to a second embodiment.
  • FIG. 1 shows a cross section of a preferred embodiment of the apparatus of the invention for regulating the temperature of a substrate 100 (thermochuck) and in particular of a wafer.
  • a main body 110 has a substantially planar contact surface 130 with an attachment device which has, in the illustrated embodiment, a large number of suction grooves 120 or suction ducts.
  • Said suction grooves 120 are connected via vacuum ducts (not illustrated) which are formed inside the main body 110 to at least one vacuum connector (likewise not illustrated).
  • These vacuum grooves 120 can be used to suck a substrate 100 , which is to be arranged on the contact surface, in the direction of the contact surface and to keep it on the contact surface. Due to the suction, the substrate 100 is pressed against the contact surface 130 of the main body or of the bearing table 110 or arranged thereon, as a result of which a good heat transfer coefficient between the main body 110 and the substrate 100 is ensured.
  • the first temperature-regulating device 200 Situated in an adjoining manner on the main body 110 is the first temperature-regulating device 200 .
  • the first temperature-regulating device 200 is integrally connected in the region of the temperature-regulated main body 220 to the main body 110 .
  • the region of the temperature-regulated main body 220 has one or more first temperature-regulating means ducts 225 inside the main body 110 .
  • a first temperature-regulating fluid 230 circulates or flows in a first temperature-regulating means circuit 210 , which is part of the temperature-regulating device 110 , to be more precise through said first temperature-regulating means ducts 225 , from there at least into one first recirculation line 240 , from there into at least one first heat exchanger 260 , from there into at least one first supply line 235 and from there back into the first temperature-regulating means ducts 225 in the region of the temperature-regulated main body 220 .
  • a first fluid pump (not illustrated) preferably ensures the desired circulation of the first temperature-regulating fluid 230 .
  • an electric temperature-regulating apparatus with a power supply 410 which can for example be made of heating wires or the like, with the electric temperature-regulating apparatus being designed in the illustrated embodiment in a substantial areal manner, is located below the region of the temperature-regulated main body 220 .
  • the electric temperature-regulating apparatus 400 has a Peltier element and the power supply has a DC supply 410 .
  • the DC supply 410 heat can be transported through the Peltier element from the upper surface to the lower surface or vice versa.
  • the Peltier element can be used as a temperature sensor because in a Peltier element, at different temperatures, a measurable current flows on both sides of the element.
  • a temperature-regulating body 360 Located below the electric temperature-regulating apparatus 400 in the illustrated embodiment is a temperature-regulating body 360 which substantially corresponds in the illustrated embodiment to the region of the temperature-regulated main body 220 .
  • the temperature-regulating body 360 also has one or more second temperature-regulating means ducts 365 inside it.
  • the temperature-regulating means ducts 365 are connected to at least one second supply line 345 while they are connected, on the downstream side) to at least one discharge line which is illustrated in the illustrated embodiment by dashed lines as second recirculation line 350 .
  • the second temperature-regulating device is likewise illustrated as a second temperature-regulating means circuit 310 in which a second temperature-regulating fluid 320 circulates from the second heat exchanger 340 into the second supply line 345 , through the second temperature-regulating means ducts 365 into the second recirculation line 350 and back into the second heat exchanger 340 .
  • the second temperature-regulating means device can also have an open design, so that the second temperature-regulating fluid 320 in the temperature source is brought to a desired temperature, flows past the temperature-regulating body 360 or through it and is subsequently discharged without being recirculated again into the temperature source.
  • the second temperature-regulating fluid 320 can either be removed completely from the apparatus or can be used to condition the space around the apparatus.
  • the fluids for the first temperature-regulating fluid and/or the second temperature-regulating fluid can be any conventional fluids which are liquid and/or gaseous in the respective temperature ranges within which they are used. Since the thermochuck, however, is meant for use in a very large temperature range of from approximately ⁇ 75° C. to 400° C., the first and second temperature-regulating apparatuses are operated in the illustrated embodiment in different, preferably overlapping temperature ranges.
  • the aim is here that the operating pressures within the temperature-regulating means circuits do not exceed 10 bar when water is used as the temperature-regulating means fluid.
  • the aim is that 4-5 bar is not exceeded; in the case of gaseous fluids, the value should not lie above 6-7 bar. Higher maximum operating pressures can likewise be realized, but require relevant structural measures in order to counteract the increased load.
  • the first temperature-regulating device 200 to be designed for use in the first temperature range between a first temperature of, for example, ⁇ 75° C. and a second temperature of, for example, 100° C. using the first temperature-regulating fluid 230
  • the second temperature-regulating device 300 to be designed for use in the second temperature range, which spans from a third temperature of approximately 50° C. to a fourth temperature of approximately 200° C., preferably using another (the second) temperature-regulating fluid 320 .
  • the temperatures can, of course, deviate from those mentioned, depending on the embodiment.
  • the fourth temperature can be, for example, up to approximately 400° C.
  • the first temperature-regulating fluid 230 used is a fluid which is in the liquid form in said first temperature range and has a viscosity which is low enough that it can circulate through the apparatus with low flow resistance.
  • suitable fluids are, for example, various alcohols such as amyl alcohol (pentanol) and methanol, but also heptane. Particularly suited is a thermal oil on silicone-oil basis.
  • a temperature-regulating fluid is used which contains perfluorinated polyether (e.g. available under the trademark Galden HT from Solvay Solexis S.p.A.), poly(oxyperfluoro-n-alkylene) (for e.g.
  • first temperature-regulating means circuit 210 Since above the second temperature the substances mentioned can only be kept in the liquid state under significant pressure, in the illustrated embodiment operation of the first temperature-regulating means circuit 210 is stopped above the second temperature. Since the first temperature-regulating fluid 230 , which remains in the region of the temperature-regulated main body 220 , would transition into the gaseous state with increasing temperature, suitable precautions can be taken in order to prevent an impermissible increase in pressure in the first temperature-regulating means circuit.
  • the region of the temperature-regulated main body 220 can be separated from the rest of the first temperature-regulating means circuit 210 for example via a shut-off valve 270 and a three-way valve 280 . Since the first temperature-regulating fluid 230 which remains in the first temperature-regulating means ducts 225 in the region of the temperature-regulated main body 220 would nevertheless be heated as well and would lead to a corresponding increase in pressure, it is possible in order to relieve the pressure for the first temperature-regulating means ducts 225 to also be connected, via the three-way valve 280 , to a pressure-relief region 250 which in the illustrated preferred embodiment is in the form of a reservoir or an expansion container. In the same way, it is possible to open the region to the surrounding area, to pump out the first temperature-regulating fluid and/or to replace it with another fluid.
  • the temperature of the apparatus is regulated substantially via the second temperature-regulating device 300 and/or via the electric temperature-regulating apparatus.
  • this can likewise be carried out via a suitable liquid second temperature-regulating fluid 320 ; due to the associated structural and economic advantages, a gaseous fluid, in particular air, has proven particularly advantageous.
  • a gaseous fluid in particular air
  • the temperature of air can also be regulated easily, air can be heated in virtually any way, compressed, is available everywhere and without additional costs and is non-toxic.
  • air can, for example, quickly be let out of a possibly pre-cooled pressure vessel 600 so that the rapid pressure drop causes cooling without the need to cool the air in a heat exchanger or another temperature-regulating apparatus, as is shown in the embodiment in FIG. 2 on the right-hand side.
  • FIG. 2 comparable features are denoted by identical reference symbols, as in FIG. 1 .
  • the achievable fluid temperatures are generally completely adequate for cooling the apparatus in a high temperature range, in particular in a range above the second temperature, due to the large difference in temperatures.
  • Other gases, such as nitrogen, can of course also be used besides air.
  • the second temperature-regulating device 300 is used as an open system, which sucks in surrounding air from the space around the apparatus, for example, via an air-treatment system 500 , dries it to a desired value, if desired compresses it and regulates its temperature and is allowed to flow back into the space past the temperature-regulating body 360 , then is it additionally possible to condition the area surrounding the apparatus via the second temperature-regulating apparatus 300 .
  • the temperature-regulating body can also be designed without closed second temperature-regulating means ducts 365 , for example with cooling ribs on which an incident-flow apparatus, such as a pressure vessel 600 with a connected air nozzle, a fan etc., blows air, as is shown in FIG. 2 on the right-hand side.
  • an incident-flow apparatus such as a pressure vessel 600 with a connected air nozzle, a fan etc.
  • blows air as is shown in FIG. 2 on the right-hand side.
  • a number of ducts are formed in the temperature-regulating body centrally starting from one or a few entry openings, which ducts issue in a large number of fluid exit openings, as is shown in FIG. 2 on the left-hand side. This can effect a particularly efficient distribution of the fluid flow over the entire region of the temperature-regulated main body.
  • the two temperature-regulating devices can also be used at the same time in the overlapping temperature range so that, if used together, they can lead to even quicker changes in temperatures.
  • operation in which, in addition to the first and/or the second temperature-regulating apparatus 200 , 300 , the electric temperature-regulating apparatus 400 is used is conceivable. It is further conceivable to use the second temperature-regulating apparatus 300 merely as a cooling apparatus if rapid cooling processes are required.
  • the materials of the main body, of the first and second temperature-regulating devices and/or of individual parts comprise in a non-limiting manner steel, other metals and ceramic. Particularly preferred design options of these parts, also with respect to the path of the flow ducts, are described in detail for example in DE 20 2005 005 052.
  • the ducts can additionally, as is likewise described for example in DE 20 2005 005 052, also have coatings which shield the substrate for example from electromagnetic fields. Therefore, reference is expressly made to said document. It is furthermore advantageous if the described apparatus has a housing, for example to protect against ingress of dirt and/or mechanical influences or against the exit of fluids from the inside of the apparatus.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Control Of Temperature (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
US11/991,028 2005-10-17 2006-10-17 Hybrid chuck Active 2031-03-09 US9202729B2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102005049598 2005-10-17
DE102005049598.2 2005-10-17
DE102005049598.2A DE102005049598B4 (de) 2005-10-17 2005-10-17 Hybrid Chuck
PCT/EP2006/010019 WO2007045444A1 (de) 2005-10-17 2006-10-17 Hybrid chuck

Publications (2)

Publication Number Publication Date
US20090250202A1 US20090250202A1 (en) 2009-10-08
US9202729B2 true US9202729B2 (en) 2015-12-01

Family

ID=37679513

Family Applications (1)

Application Number Title Priority Date Filing Date
US11/991,028 Active 2031-03-09 US9202729B2 (en) 2005-10-17 2006-10-17 Hybrid chuck

Country Status (5)

Country Link
US (1) US9202729B2 (ja)
EP (1) EP1943665B1 (ja)
JP (1) JP2009512224A (ja)
DE (1) DE102005049598B4 (ja)
WO (1) WO2007045444A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210351061A1 (en) * 2020-05-11 2021-11-11 Entegris, Inc. Electrostatic chuck having a gas flow feature, and related methods

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2007321185A1 (en) * 2006-11-17 2008-05-22 Centrotherm Thermal Solutions Gmbh + Co. Kg Method and arrangement for heat treatment of substrates
TWI459851B (zh) * 2007-09-10 2014-11-01 Ngk Insulators Ltd heating equipment
KR101088105B1 (ko) * 2008-04-28 2011-11-30 포항공과대학교 산학협력단 나선형 구조물이 구비된 생물막 반응기 및 이를 이용한수처리장치
JP5980147B2 (ja) * 2013-03-08 2016-08-31 日本発條株式会社 基板支持装置
KR101736363B1 (ko) * 2016-04-18 2017-05-18 (주)티티에스 기판 지지 장치 및 이를 포함하는 기판 처리 장치
DE102017200588A1 (de) 2017-01-16 2018-07-19 Ers Electronic Gmbh Vorrichtung zum Temperieren eines Substrats und entsprechendes Herstellungsverfahren
JP6832804B2 (ja) 2017-07-20 2021-02-24 東京エレクトロン株式会社 基板載置台及び基板検査装置
JP7066479B2 (ja) * 2018-03-29 2022-05-13 東京エレクトロン株式会社 プラズマ処理装置
KR102646904B1 (ko) * 2018-12-04 2024-03-12 삼성전자주식회사 플라즈마 처리 장치
JP7254542B2 (ja) * 2019-02-01 2023-04-10 東京エレクトロン株式会社 載置台及び基板処理装置
DE102019005093A1 (de) 2019-07-22 2021-01-28 Att Advanced Temperature Test Systems Gmbh Verfahren zur temperatursteuerung bzw. -regelung eines chucks für einen wafer, eine temperiereinrichtung zum temperieren eines chucks sowie ein wafertestsystem zum testen eines wafers
GB2592022A (en) * 2020-02-12 2021-08-18 Edwards Vacuum Llc A pressure regulated semiconductor wafer cooling apparatus and method and a pressure regulating apparatus
DE102020002962A1 (de) * 2020-05-18 2021-11-18 Att Advanced Temperature Test Systems Gmbh Temperiervorrichtung, System und Verfahren zum Temperieren eines Probertisches für Halbleiterwafer und/oder Hybride
DE102020007791A1 (de) 2020-12-18 2022-06-23 Att Advanced Temperature Test Systems Gmbh Modulares Wafer-Chuck-System
WO2023163472A1 (ko) * 2022-02-28 2023-08-31 주식회사 이에스티 저온 정전척

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3071185A (en) * 1955-12-09 1963-01-01 English Electric Co Ltd Temperature control systems for aircraft
JPH04167516A (ja) * 1990-10-31 1992-06-15 Fujitsu Ltd 半導体製造装置
US5441104A (en) * 1992-01-14 1995-08-15 Fotodyne Incorporated Fluid circulator and temperature regulator
US5660047A (en) 1995-09-15 1997-08-26 American Air Liquide, Inc. Refrigeration system and method for cooling a susceptor using a refrigeration system
US5665166A (en) * 1993-01-29 1997-09-09 Tokyo Electron Limited Plasma processing apparatus
JPH1041376A (ja) * 1996-07-26 1998-02-13 Nikon Corp 基板保持装置、基板保持方法及び露光装置
US5950723A (en) 1995-11-17 1999-09-14 Cvc Products, Inc. Method of regulating substrate temperature in a low pressure environment
US6434955B1 (en) * 2001-08-07 2002-08-20 The National University Of Singapore Electro-adsorption chiller: a miniaturized cooling cycle with applications from microelectronics to conventional air-conditioning
US20050016467A1 (en) 2003-07-24 2005-01-27 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for dry chamber temperature control
US20050133157A1 (en) * 2003-12-22 2005-06-23 Samsung Electronics Co., Ltd. Temperature controller system for controlling temperature of an object and an apparatus including same
US20060027169A1 (en) 2004-08-06 2006-02-09 Tokyo Electron Limited Method and system for substrate temperature profile control
US7108471B2 (en) 2001-09-06 2006-09-19 Tokyo Electron Limited Transporting tool for object to be tested, and object-to-be-tested transporting system
US7235137B2 (en) 2001-01-23 2007-06-26 Tokyo Electron Limited Conductor treating single-wafer type treating device and method for semi-conductor treating
US7604042B2 (en) 2001-05-18 2009-10-20 Tokyo Electron Limited Cooling mechanism with coolant, and treatment device with cooling mechanism

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5977785A (en) * 1996-05-28 1999-11-02 Burward-Hoy; Trevor Method and apparatus for rapidly varying the operating temperature of a semiconductor device in a testing environment
JPH1041375A (ja) * 1996-07-25 1998-02-13 Sony Corp ホットチャック温度制御装置
JPH11111823A (ja) * 1997-10-06 1999-04-23 Dainippon Screen Mfg Co Ltd 基板熱処理装置
US6415858B1 (en) * 1997-12-31 2002-07-09 Temptronic Corporation Temperature control system for a workpiece chuck
US6717115B1 (en) * 2000-04-25 2004-04-06 Teradyne, Inc. Semiconductor handler for rapid testing
WO2004095531A2 (en) * 2003-03-28 2004-11-04 Tokyo Electron Ltd Method and system for temperature control of a substrate
DE202005005052U1 (de) * 2005-03-30 2006-08-10 Att Systems Gmbh Vorrichtung zum Temperieren eines Substrats

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3071185A (en) * 1955-12-09 1963-01-01 English Electric Co Ltd Temperature control systems for aircraft
JPH04167516A (ja) * 1990-10-31 1992-06-15 Fujitsu Ltd 半導体製造装置
US5441104A (en) * 1992-01-14 1995-08-15 Fotodyne Incorporated Fluid circulator and temperature regulator
US5665166A (en) * 1993-01-29 1997-09-09 Tokyo Electron Limited Plasma processing apparatus
US5660047A (en) 1995-09-15 1997-08-26 American Air Liquide, Inc. Refrigeration system and method for cooling a susceptor using a refrigeration system
US5950723A (en) 1995-11-17 1999-09-14 Cvc Products, Inc. Method of regulating substrate temperature in a low pressure environment
JPH1041376A (ja) * 1996-07-26 1998-02-13 Nikon Corp 基板保持装置、基板保持方法及び露光装置
US7235137B2 (en) 2001-01-23 2007-06-26 Tokyo Electron Limited Conductor treating single-wafer type treating device and method for semi-conductor treating
US7604042B2 (en) 2001-05-18 2009-10-20 Tokyo Electron Limited Cooling mechanism with coolant, and treatment device with cooling mechanism
US6434955B1 (en) * 2001-08-07 2002-08-20 The National University Of Singapore Electro-adsorption chiller: a miniaturized cooling cycle with applications from microelectronics to conventional air-conditioning
US7108471B2 (en) 2001-09-06 2006-09-19 Tokyo Electron Limited Transporting tool for object to be tested, and object-to-be-tested transporting system
US20050016467A1 (en) 2003-07-24 2005-01-27 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for dry chamber temperature control
US20050133157A1 (en) * 2003-12-22 2005-06-23 Samsung Electronics Co., Ltd. Temperature controller system for controlling temperature of an object and an apparatus including same
US20060027169A1 (en) 2004-08-06 2006-02-09 Tokyo Electron Limited Method and system for substrate temperature profile control

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210351061A1 (en) * 2020-05-11 2021-11-11 Entegris, Inc. Electrostatic chuck having a gas flow feature, and related methods
US11837492B2 (en) * 2020-05-11 2023-12-05 Entegris, Inc. Electrostatic chuck having a gas flow feature, and related methods

Also Published As

Publication number Publication date
US20090250202A1 (en) 2009-10-08
DE102005049598A1 (de) 2007-04-26
JP2009512224A (ja) 2009-03-19
WO2007045444A1 (de) 2007-04-26
EP1943665B1 (de) 2013-01-16
EP1943665A1 (de) 2008-07-16
DE102005049598B4 (de) 2017-10-19

Similar Documents

Publication Publication Date Title
US9202729B2 (en) Hybrid chuck
KR102299767B1 (ko) 전자기기 테스트 장치용 통합 냉각 시스템
US5996353A (en) Semiconductor processing system with a thermoelectric cooling/heating device
US7355428B2 (en) Active thermal control system with miniature liquid-cooled temperature control device for electronic device testing
CN100524141C (zh) 电子部件的温度控制装置以及处理装置
JP5999665B2 (ja) 熱移動ユニットおよび温度調節装置
JP5377915B2 (ja) 検査装置及び検査方法
JP6014513B2 (ja) プラズマエッチング装置及び制御方法
US20050227503A1 (en) Method and device for conditioning semiconductor wafers and/or hybrids
US20210112686A1 (en) Combined liquid and air cooling system for fail-safe operation of high power density asic devices
US7641453B2 (en) Pulsation reducing apparatus and inspection apparatus
JP2008275512A (ja) エージング装置
JP2014163780A (ja) 耐環境試験方法
WO2010074917A1 (en) Microscope-slide dryer
US20030030430A1 (en) Methods and apparatus for testing a semiconductor structure using improved temperature desoak techniques
US20080047688A1 (en) Cooling System And Cooling Method For Cooling Components Of A Power Electronics
KR100938363B1 (ko) 메모리 모듈의 신뢰성 검사용 온도조절장치
KR102476087B1 (ko) 온도 조정 장치
WO2004053920A2 (en) Humidified imaging with an environmental scanning electron microscope
JPH07111994B2 (ja) 試料載置台
KR20200124321A (ko) 정밀 유체 전달을 위한 열적으로 안정적인 유량계들
US20140367081A1 (en) Cooling system
JP2015095614A (ja) 冷却装置およびこれを搭載した電子機器
WO2024018536A1 (ja) 熱交換器、電子部品ハンドリング装置、及び、電子部品試験装置
US20240068753A1 (en) Temperature control apparatus for a gaseous medium

Legal Events

Date Code Title Description
AS Assignment

Owner name: ATT SYSTEMS GMBH, GERMANY

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:EIBL, MARKUS;REEL/FRAME:020855/0023

Effective date: 20080403

AS Assignment

Owner name: BAYERISCHE HYPO- UND VEREINSBANK AKTIENGESELLSCHAF

Free format text: SECURITY AGREEMENT;ASSIGNOR:ATT ADVANCED TEMPERATURE TEST SYSTEMS GMBH;REEL/FRAME:023970/0890

Effective date: 20070802

AS Assignment

Owner name: ATT ADVANCED TEMPERATURE TEST SYSTEMS GMBH, GERMAN

Free format text: RELEASE OF SECURITY INTEREST;ASSIGNOR:BAYERISCHE HYPO-UND VEREINSBANK AKTIENGESELLSCHAFT;REEL/FRAME:033135/0644

Effective date: 20130913

STCF Information on status: patent grant

Free format text: PATENTED CASE

FEPP Fee payment procedure

Free format text: SURCHARGE FOR LATE PAYMENT, LARGE ENTITY (ORIGINAL EVENT CODE: M1554); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Year of fee payment: 4

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 8TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1552); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Year of fee payment: 8