US9080761B2 - LED illumination lamp with heat dissipation unit - Google Patents

LED illumination lamp with heat dissipation unit Download PDF

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Publication number
US9080761B2
US9080761B2 US14/234,150 US201214234150A US9080761B2 US 9080761 B2 US9080761 B2 US 9080761B2 US 201214234150 A US201214234150 A US 201214234150A US 9080761 B2 US9080761 B2 US 9080761B2
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Prior art keywords
heat transfer
heat dissipation
led illumination
lamp
lampshade
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US14/234,150
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US20140167593A1 (en
Inventor
Fuwen Li
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Leeleds Lighting Xiamen Co Ltd
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Leeleds Lighting Xiamen Co Ltd
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Assigned to LEELEDS LIGHTING (XIAMEN) CO., LTD. reassignment LEELEDS LIGHTING (XIAMEN) CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LI, Fuwen
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    • F21V29/2275—
    • F21K9/135—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F21V29/004—
    • F21V29/20—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/506—Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/68—Details of reflectors forming part of the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F21Y2101/02—
    • F21Y2105/001—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Definitions

  • the present invention relates to LED lamps, particularly to an LED illumination lamp.
  • LED light sources have advantages of high luminous efficiency, low heat generating, energy saving and long span-life, and thus are widely used.
  • Light generated by single LED light source is low, and thus needs a plurality of LED light source to be packaged together to improve optical flux for lighting.
  • the LED light sources mounted together generate a lot of heat. The heat concentrates in small spaces and is difficult to dissipate. If temperature of the LED is too high, illumination of the LED will decay rapidly, finally life-span of the LED lamp is greatly shortened.
  • COB-type LED lamp For reducing working temperature of the LED lamp, COB-type LED lamp is disclosed in the art with LED light sources directly fixed on an end surface of a heat transfer substrate of the LED lamp, and the heat transfer substrate is thermally connected to a heat sink of the LED lamp.
  • COB-type LED lamp reduces overheating just by improving heat conductivity, and heat dissipation thereof depends only on the heat sink under the heat transfer substrate, ways for heat dissipation is single, heat dissipation efficiency is limited, and thus may still unable to reduce the working temperature of the LED lamp.
  • An LED illumination lamp includes a lamp shell, a light emitting unit, a heat transfer substrate, and a heat dissipation unit.
  • the light emitting unit is mounted on the heat transfer substrate.
  • the lamp shell covers the light emitting unit.
  • the heat dissipation unit includes a heat transfer rod. One end of the heat transfer rod is connected to the heat transfer substrate, and the other end of the rod is connected to the lamp shell for transferring heat from the heat transfer substrate to the lamp shell.
  • the LED illumination lamp of the present invention includes a heat transfer rod which thermally interconnects the heat transfer substrate and the lamp shell to transfer heat from the heat transfer substrate to the lamp shell, thus has enlarged heat dissipation area and increased heat dissipation ways, such that the present illumination LED lamp has the advantages of high heat dissipation efficiency.
  • FIG. 1 is a schematic view of an LED illumination lamp in accordance with a first embodiment of the present invention.
  • FIG. 2 is an exploded view of the LED illumination lamp of FIG. 1 .
  • FIG. 3 is a cross section of FIG. 1 taken along line A-A.
  • FIG. 4 shows light distribution curve of the LED illumination lamp of FIG. 1 .
  • FIG. 5 is a schematic view of an LED illumination lamp in accordance with a second embodiment of the present invention.
  • FIG. 6 is a schematic view of an LED illumination lamp in accordance with a third embodiment of the present invention.
  • FIG. 1 to FIG. 3 An LED illumination lamp 100 according to a first embodiment of the present invention is shown in FIG. 1 to FIG. 3 .
  • the LED illumination lamp 100 includes a lamp holder 10 , a heat dissipation unit 20 , a heat transfer substrate 30 , a light emitting unit 40 , a lamp shell 50 and a reflecting unit 60 .
  • the light emitting unit 40 is mounted on the heat transfer substrate 30 .
  • the lamp shell 50 covers the light emitting unit 40 and the heat transfer substrate 30 , separating the light generating unit and the heat transfer substrate 30 from the environment, ensuring that the LED illumination lamp 100 operates safely and stably.
  • the heat dissipation unit 20 includes a heat sink 22 and a heat transfer rod 24 .
  • the heat sink 22 is a conventional fin-type heat sink. A bottom of the heat sink 22 is fixed on the lamp holder 10 . An annular recess 222 is defined in a top of the heat sink 22 .
  • the heat transfer rod 24 is made of metal which can conduct heat, such as aluminum.
  • the heat transfer substrate 30 is substantially disk-shaped. A mounting hole 32 is defined in a central portion of the heat transfer substrate 30 . Threads are formed in the mounting hole 32 .
  • the light emitting unit 40 includes a plurality of LED light sources 42 .
  • the LED light sources 42 are arranged around the mounting hole 32 of the heat transfer substrate 30 , and are evenly arranged on a top surface of the heat transfer substrate 30 .
  • the heat transfer substrate 30 is fixed in the annular recess 222 and thermally connected to the heat sink 22 .
  • the lamp shell 50 is generally spherical sector shaped with a bottom thereof being open.
  • the lamp shell 50 includes a lampshade 52 and a heat dissipation cover 54 .
  • the lampshade 52 forms an opening 522 at a top thereof.
  • the heat dissipation cover 54 is generally circular. In assembly, the heat dissipation cover 54 is received in the opening 522 , and is connected to the lampshade 52 to form the lamp shell 50 .
  • a bottom of the lampshade 52 i.e., the bottom of the lamp shell 50 , is inserted in the annular recess 222 of the heat sink 22 , and receives the heat transfer substrate 30 therein.
  • the heat dissipation cover 54 is made of materials with high thermal conductivity, such as aluminum alloy. An outer diameter of the heat dissipation cover 54 is less than the maximum diameter of the lampshade 52 , thus to avoid blocking all light of the light emitting unit 40 along an upward direction (as shown in FIG. 3 ). Light scattering material is evenly provided on the lampshade 54 , for scattering light of the light emitting unit 40 .
  • the heat dissipation cover 54 and the heat transfer rod 24 are integrally formed as a whole, and cooperatively form a profile like an umbrella. An end of the heat transfer rod 24 is fixed in the mounting hole 32 of the heat transfer substrate 30 , and thermally connected to the heat transfer substrate 30 .
  • the reflecting unit 60 includes a reflecting board 62 adhered to a bottom surface of the heat dissipation cover 54 .
  • the reflecting board 62 faces the light emitting unit 40 , for reflecting upwards light of the light emitting unit 40 downwardly.
  • the reflecting unit 60 further includes a reflecting sleeve 64 .
  • the reflecting sleeve 64 is mounted around the heat transfer rod 24 , thereby overcoming defects of the heat transfer rob which is metal and light-proof.
  • Heat dissipation of the LED illumination lamp 100 of the first embodiment of the present invention is: heat generated by the light emitting unit 40 during operation is transferred to the heat sink 22 through the heat transfer substrate 30 , and then dissipated to environment by the heat sink 22 .
  • the heat transfer rod 24 transfers the heat from the heat transfer substrate 30 to the heat dissipation cover 54 , and then dissipates to the environment through convection or radiation.
  • the LED illumination lamp 100 of the present invention has enlarged heat dissipation area and increased heat dissipation ways without substantially change in lamp structure, which results in improved heat dissipation efficiency, and extended life-span of the LED illumination lamp 100 .
  • the light emitting unit 40 emits light upwards to the reflecting board 62 , and then the reflecting board 62 reflects the light downwards to a position under the heat transfer substrate 30 .
  • the reflecting sleeve 64 reflects the light thereon to different directions, and then is further scattered by the lamp shell 50 , thus lighting environment around the LED illumination lamp 100 .
  • the lamp shell 50 has light scattering material thereon, and the outer diameter of the heat dissipation cover 54 is less than the maximum diameter of the lamp shell 50 , which makes a portion of the lamp shell 50 near the heat dissipation cover 54 scatter light of the light emitting unit 40 upwards to supplement light blocked by the heat dissipation cover 54 .
  • the light distribution curve of the present LED illumination lamp 100 shown in FIG. 4 in a direction of 0 degree, light intensity at an area blocked by the heat dissipation cover 54 is also strong, thus makes the LED illumination lamp 100 have an uniform light intensity.
  • the reflecting board 62 reflects light of the light emitting unit 40 downwards, which enlarges lighting angle of the LED illumination lamp 100 to be about 320 degrees, and makes the LED illumination lamp 100 obtain omnidirectional lighting angle.
  • the first embodiment of the present invention can be further modified as follows: omitting the reflecting unit 60 , forming reflecting layer on surfaces of the heat transfer rod 24 directly to replace the reflecting sleeve 64 , and forming reflecting layer on the bottom surface of the heat dissipation cover 54 to replace the reflecting board 62 , which can also reflect light to obtain omnidirectional lighting of the LED illumination lamp 100 .
  • the LED illumination lamp 100 of the present invention includes heat transfer rod 24 which thermally connects the heat transfer substrate 30 and the lamp shell 50 to transfer heat from the heat transfer substrate 30 to the lamp shell 50 , compared with the prior art, heat dissipation area is enlarged, such that the present illumination LED lamp has the advantages of high heat dissipation efficiency.
  • lighting angle of the present LED illumination lamp 100 is about 320 degrees, such that the present LED illumination lamp 100 is generally omnidirectional lighting.
  • FIG. 5 illustrates an LED illumination lamp 100 a in accordance with a second embodiment of the present invention.
  • the LED illumination lamp 100 a is different from the first embodiment in that: the lamp shell 50 a is made of transparent ceramic and integrally formed as a whole. One end of the heat transfer rod 24 a is connected to the heat transfer substrate 30 , and the other end is connected to the lamp shell 50 a .
  • the heat conductivity coefficient of ceramic is about 180 ⁇ 220 W/M*K
  • the lamp shell 50 a can efficiently dissipate the heat from the heat transfer rod 24 a . In such situation, the lamp shell 50 a does not need to be formed separately as the first embodiment, which simplifies the structure.
  • the lamp shell 50 a can be made of other transparent materials with high thermal conductivity.
  • FIG. 6 shows an LED illumination lamp 100 b according to a third embodiment of the present invention, which is different from the first embodiment in that: the lamp shell 50 b is generally spherical sector shaped with a bottom thereof being open, and includes a lampshade 52 b at the top and a heat dissipation cover 54 b at the bottom.
  • the lampshade 52 b is semisphere, and the heat dissipation cover 54 b is circular corresponding to the lampshade 52 b .
  • the heat dissipation cover 54 b is made of transparent ceramic.
  • the heat transfer rod 24 b is L-shaped.
  • the heat transfer rod 24 b is connected to the heat transfer substrate 30 , and the other end is connected to the heat dissipation cover 54 b .
  • the heat transfer rod 24 b transfers heat from the heat transfer substrate 30 to the heat dissipation cover 54 b .
  • the heat dissipation cover 54 b with high thermal conductivity improves the heat dissipation efficiency of the whole LED illumination lamp 100 b .
  • the heat dissipation cover 54 b can be made of light-proof metal when the maximum outer diameter of the heat dissipation cover 54 b is less than the maximum outer diameter of the lampshade 52 b and light scattering material is formed on the lampshade 52 b .
  • lighting angle does not reduce by blocking of the light-proof heat dissipation cover 54 b for scattering of the lampshade 52 b which is not covered by the heat dissipation cover 54 b .
  • more light should be emitted to the lampshade 52 b which is connected to the heat dissipation cover 54 b , making the light distribution curve of the LED illumination lamp 100 b be more uniform.
US14/234,150 2011-07-28 2012-03-19 LED illumination lamp with heat dissipation unit Active US9080761B2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN201110217294XA CN102261589B (zh) 2011-07-28 2011-07-28 照明led灯
CN201110217294 2011-07-28
CN201110217294.X 2011-07-28
PCT/CN2012/072538 WO2013013514A1 (fr) 2011-07-28 2012-03-19 Lampe d'éclairage à diodes électroluminescentes

Publications (2)

Publication Number Publication Date
US20140167593A1 US20140167593A1 (en) 2014-06-19
US9080761B2 true US9080761B2 (en) 2015-07-14

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US (1) US9080761B2 (fr)
EP (1) EP2738457A4 (fr)
CN (1) CN102261589B (fr)
WO (1) WO2013013514A1 (fr)

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CN102518960A (zh) * 2011-12-01 2012-06-27 厦门立明光电有限公司 立面式大角度led灯
CN102913792A (zh) * 2012-10-25 2013-02-06 厦门立明光电有限公司 照明led灯
CN103388764B (zh) * 2013-01-09 2016-11-09 厦门立达信照明有限公司 Led照明灯
TW201430283A (zh) * 2013-01-31 2014-08-01 鴻海精密工業股份有限公司 Led照明裝置
JP2014165082A (ja) * 2013-02-26 2014-09-08 Toshiba Lighting & Technology Corp 照明装置
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JP6343812B2 (ja) * 2014-01-27 2018-06-20 上海三思▲電▼子工程有限公司Ｓｈａｎｇｈａｉ Ｓａｎｓｉ Ｅｌｅｃｔｒｏｎｉｃ Ｅｎｇｉｎｅｅｒｉｎｇ Ｃｏ．，Ｌｔｄ． コーティング式立体構造回路の製造方法、回路パネルを有しないｌｅｄ電球ランプおよび電子部品、ｌｅｄ照明装置
CN103791439B (zh) * 2014-01-27 2015-05-06 上海三思电子工程有限公司 新型led照明装置
KR20160132824A (ko) * 2014-01-27 2016-11-21 상하이 산시 일렉트로닉 엔지니어링 씨오., 엘티디 Led 조명기구
TWI572825B (zh) 2014-03-31 2017-03-01 瑞儀光電股份有限公司 燈具
CN107091462A (zh) * 2014-03-31 2017-08-25 瑞仪光电股份有限公司 灯具
CN104033771A (zh) * 2014-06-23 2014-09-10 立达信绿色照明股份有限公司 Led照明灯
CN105371134A (zh) * 2015-11-23 2016-03-02 宁波皓升半导体照明有限公司 防电涌的led灯具

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WO2013013514A1 (fr) 2013-01-31
CN102261589A (zh) 2011-11-30
CN102261589B (zh) 2013-07-17

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