US7874710B2 - Light-emitting diode lamp - Google Patents

Light-emitting diode lamp Download PDF

Info

Publication number
US7874710B2
US7874710B2 US11/876,778 US87677807A US7874710B2 US 7874710 B2 US7874710 B2 US 7874710B2 US 87677807 A US87677807 A US 87677807A US 7874710 B2 US7874710 B2 US 7874710B2
Authority
US
United States
Prior art keywords
cap
led lamp
air
heat sink
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related, expires
Application number
US11/876,778
Other versions
US20090046473A1 (en
Inventor
Wen-Kuei Tsai
Chia-Chi Liu
Chun-Chien Wang
Ching-Hua Wu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LUSTROUS INTERNATIONAL Tech Ltd
Chang Wah Electromaterials Inc
Original Assignee
Top Energy Saving System Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Top Energy Saving System Corp filed Critical Top Energy Saving System Corp
Assigned to LUSTROUS INTERNATIONAL TECHNOLOGY LTD., TOPCO TECHNOLOGIES CORP. reassignment LUSTROUS INTERNATIONAL TECHNOLOGY LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LIU, CHIA-CHI, TSAI, WEN-KUEI, WANG, CHUN-CHIEN, WU, CHING-HUA
Publication of US20090046473A1 publication Critical patent/US20090046473A1/en
Assigned to LUSTROUS INTERNATIONAL TECHNOLOGY LTD., GE INVESTMENT CO., LTD. reassignment LUSTROUS INTERNATIONAL TECHNOLOGY LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TOPCO TECHNOLOGIES CORP.
Assigned to TOP ENERGY SAVING SYSTEM CORP. reassignment TOP ENERGY SAVING SYSTEM CORP. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: GE INVESTMENT CO., LTD.
Application granted granted Critical
Publication of US7874710B2 publication Critical patent/US7874710B2/en
Assigned to CHANG WAH ELECTROMATERIALS, INC. reassignment CHANG WAH ELECTROMATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TOP ENERGY SAVING SYSTEM CORP.
Expired - Fee Related legal-status Critical Current
Adjusted expiration legal-status Critical

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F21V29/677—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans the fans being used for discharging
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2111/00—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/22—Illumination; Arrangements for improving the visibility of characters on dials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Definitions

  • the present invention relates to a light-emitting diode lamp (LED lamp), more particularly, relates to an LED lamp with good heat dissipation performance.
  • LED lamp light-emitting diode lamp
  • the LEDs are semiconductor devices.
  • the light emitting chips are mainly made of a compound semiconductor material containing III-V group chemical elements, for example, GaP, GaAs, and the like, and function on the principle of converting electric energy to light. That is to say, the compound semiconductor is powered to release excessive energy through the combination of electrons and holes, so as to emit photon (light).
  • the LED can emit light without being heated or does not discharge to emit light. Therefore, the lifespan of the LED is up to 100,000 hours, and an idling time is not required.
  • the LED has advantages of quick response speed (approximately 10 ⁇ 9 seconds), small volume, power-saving, low pollution, high reliability, and ease mass production.
  • the LEDs have been intensively used in many fields, for example, light source and illumination device in large-scale bulletin boards, traffic lights, cellular phones, scanners, fax machines, etc.
  • the light emitting brightness and efficiency of the LEDs are continuously improved, and meanwhile the white LEDs with high brightness are successfully put into mass production, so the white LEDs have been gradually used in illumination devices such as indoor illumination and outdoor street lamp.
  • heat dissipation performance is important to high power LEDs. If LEDs operates under high temperature, the brightness that the LED light can provide may be reduced and the life span thereof is reduced. Therefore, how to enhance heat dissipation performance of LEDs is an important topic for research and development people.
  • the present invention provided an LED with good heat dissipation performance and long life span.
  • the present invention provides an LED including a lamp housing, an LED light source, a heat sink and a control circuit.
  • the lamp housing has an accommodating space, a plurality of air inlets and a plurality of air outlets, and the accommodating space joins an environment through the air inlets and air outlets.
  • the LED light source and the heat sink are disposed in the accommodating space, and the heat sink is connected to the LED light source, wherein the heat sink includes a pedestal and a plurality of heat dissipation fins connected to the pedestal. There is an air convection channel between any two adjacent heat dissipation fins.
  • An air convection channel is located between any two adjacent heat dissipation fins, wherein air from the environment is suitable for flowing into the accommodating space via the air inlets, passing through the air convection channels, and leaving the accommodating space via the air outlets.
  • the control circuit is disposed in the lamp housing and is electrically connected to the LED light source.
  • the lamp housing includes a first cap, a lampshade, a second cap and a conductive plug for accommodating the heat sink.
  • the lampshade is connected to the first cap, and the LED light source is disposed in the lampshade.
  • the second cap is connected to the first cap, so that the first cap is disposed between the lampshade and the second cap.
  • the plug is connected to the second cap, so that the second cap is disposed between the conductive plug and the first cap.
  • the material of the first cap includes insulation material, such as insulation material with doped zinc oxide.
  • the material of the second cap includes insulation material, such as insulation material with doped zinc oxide.
  • the first cap has air inlets
  • the second cap has air outlets, wherein each of the air inlets may be an opening with or without barricade, while each of the air outlets may be an opening with or without barricade.
  • each of the air inlets is a slot-shaped air inlet, and the slot-shaped air inlets are arranged in grating.
  • each of the slot-shaped air inlets is corresponding to one of the air convection channels of the heat sink, respectively.
  • the first cap has air outlets
  • the second cap has air inlets, wherein each of the air inlets may be an opening with or without barricade, while each of the air outlets may be an opening with or without barricade.
  • each of the air outlets is a slot-shaped air inlet, and the slot-shaped air outlets are arranged in grating.
  • each of the slot-shaped air outlets is corresponding to one of the air convection channels of the heat sink, respectively.
  • the LED light source is an LED package or other types of LED light sources.
  • the materials of the pedestal and heat dissipation fins are same or different from each other.
  • control circuit is a circuit board.
  • the above circuit board has at least a through hole allowing air to flow within the accommodating space.
  • the LED lamp may further includes a fan disposed in the accommodating space, wherein the air from the environment is driven by the fan to flow into the accommodating space via the air inlets, pass through the air convection channels, and leave the accommodating space via the air outlets in sequence.
  • the fan is disposed on the pedestal, and the fan is surrounded by the heat dissipation fins.
  • the fan and the LED light source are disposed on two opposite sides of the pedestal, respectively.
  • heat generated from the LED lamp of the present invention is capable of removing by the built-in heat sink and the air convection such that the operation temperature of the LED lamp can be maintained within an acceptable range. In other words, the LED lamp of the present invention is not damaged due to over-heating.
  • FIG. 1 is a diagram of an LED lamp of the first embodiment of the present invention.
  • FIG. 2A is a diagram of the first cap body having air inlets without barricade or air outlets without barricade.
  • FIG. 2B is a diagram of the first cap body having air inlets with barricade or air outlets with barricade.
  • FIG. 3A is a diagram of the second cap body having air inlets without barricade or air outlets without barricade.
  • FIG. 3B is a diagram of the second cap body having air inlets with barricade or air outlets with barricade.
  • FIG. 4 is a diagram of an LED lamp of the second embodiment of the present invention.
  • FIG. 5A ?? FIG. 5 B are diagrams of relative locations of the fan, the control circuit, the heat sink and the LED light source of the third embodiment of the present invention.
  • FIG. 1 is a diagram of an LED lamp of the first embodiment of the present invention.
  • the LED lamp 100 of the present embodiment includes a lamp housing 110 , an LED light source 120 , a heat sink 130 and a control circuit 140 .
  • the lamp housing 110 has an accommodating space 110 a , a plurality of air inlets 110 b and a plurality of air outlets 110 c , and the accommodating space 110 a joins the environment through the air inlets 110 b and air outlets 110 c .
  • the LED light source 120 and the heat sink 130 are both disposed in the accommodating space 110 a , and the heat sink 130 is connected to the LED light source 120 , wherein the heat sink 130 has a pedestal 132 and a plurality of heat dissipation fins 134 connected to the pedestal 132 .
  • an air convection channel 136 is formed between any two adjacent heat dissipation fins 134 , and air from the environment is suitable for flowing into the accommodating space 110 a via the air inlets 110 b , passing through the air convection channel 136 , and leaving the accommodating space 110 a via the air outlets 110 c sequentially.
  • the control circuit 140 is disposed in the accommodating space 110 a of the lamp housing 110 and is electrically connected to the LED light source 120 .
  • the structure of the lamp housing 110 , the LED light source 120 , the heat sink 130 and the control circuit 140 may have many varieties, and the structural design schematically shown in FIG. 1 is only illustrated as an example for one skilled in the art to implement the present invention, rather than limiting the scope of the present invention.
  • the LED lamp 100 of the present embodiment is an LED light bulb, and the LED lamp may be a light bulb with E27 plug, a light bulb with E26 plug, a light bulb with E14 plug, or light bulbs of other specifications.
  • the lamp housing 110 of the present embodiment includes a first cap 112 , a lampshade 114 , a second cap 116 and a conductive plug 118 .
  • the lampshade 114 is connected to the first cap 112
  • the LED light source 120 is disposed in the lampshade 114 .
  • the second cap 116 is connected to the first cap 112 , so that the first cap 112 is disposed between the lampshade 114 and the second cap 116 .
  • the conductive plug 118 is connected to the second cap 116 , so that the second cap 116 is disposed between the conductive plug 118 and the first cap 112 .
  • the conductive plug 118 of the present embodiment is an E27 plug, an E26 plug, an E14 plug, or plugs of other specifications, for example.
  • the first cap 112 and the second cap 116 are usually fabricated with insulation material (such as plastic) to ensure safety of users.
  • insulation material such as plastic
  • the present invention does not limit that the first cap 112 and the second cap 116 have to be fabricated with the same insulation material.
  • the first cap 112 and the second cap 116 may also be fabricated with conductive material according to different design requirements.
  • the material of the first cap 112 and the second cap 116 may be insulation material with doped zinc oxide. Since the insulation material with doped zinc oxide has function of Electro-Magnetic Interference shielding (EMI shielding), the first cap 112 and the second cap 116 with doped zinc oxide are capable of shielding the electromagnetic wave generated from the LED lamp 100 , such that harm resulted from the electromagnetic wave can be reduced.
  • the first cap 112 and the second cap 116 may be fabricated by injection molding, and deformation of the first cap 112 and the second cap 116 made by the insulation material with doped zinc oxide can be effectively controlled after the first cap 112 and the second cap 116 are released from mold. Therefore, the yield rate of the first cap 112 and the second cap 116 can be increased.
  • the LED light source 120 is an LED package fabricated by packaging process, and the package may be a SMD type package or other type of package.
  • the LED light source 120 may be bonded with the heat sink 130 with solder material, so that the heat generated by the LED light source 120 can be effectively conducted to the heat sink 130 .
  • the present embodiment may also use thermal paste together with screw to perform the bonding between the LED light source 120 and the heat sink 130 .
  • the heat sink 130 may be fabricated with single material or a plurality of materials.
  • the pedestal 132 and the heat dissipation fins 134 of the heat sink 130 may be fabricate with the same or different materials.
  • the material of the heat sink 130 may be copper, aluminum, alloy, or other material with high thermal conductivity.
  • the control circuit 140 is a circuit board independent from the LED light source 120 .
  • the circuit board may be a circuit board with single circuit layer or a circuit board with a plurality of circuit layers.
  • at least one through hole 142 may be fabricated on the circuit board.
  • the control circuit 140 may be a chip.
  • the control circuit 140 may be integrated into the LED light source 120 to reduce the overall volume occupied by the LED lamp.
  • the control circuit 140 may also be integrated into the circuit board in the LED light source 120 .
  • the air inlets 110 b and the air outlets 110 c formed on the lamp housing 110 are defined according to the convection direction of the air in the accommodating space 110 a .
  • the openings on the first cap 112 are defined as the air inlets 110 b (as shown in FIG. 2A and FIG. 2B ), and the openings on the second cap 120 are defined as the air outlets 110 c (as shown in FIG. 3A and FIG. 3B ).
  • the openings on the first cap 112 are defined as the air outlets 110 c (as shown in FIG. 2A and FIG. 2B )
  • the openings on the second cap 120 are defined as the air inlets 110 b (as shown in FIG. 3A and FIG. 3B ).
  • the openings on the first cap 112 may be slot-shaped openings (slot-shaped air inlets or slot-shaped air outlets).
  • the slot-shaped openings may be arranged in grating. Additionally, each of the slot-shaped openings is corresponding to one of the air convection channels 136 of the heat sink. Such design facilitates heat dissipation performance of the LED lamp 100 .
  • FIG. 2A is a diagram of the first cap body having air inlets without barricade or air outlets without barricade
  • FIG. 2B is a diagram of the first cap body having air inlets with barricade or air outlets with barricade.
  • the air inlets 110 b or the air outlets 110 c are so-called open type air inlets 110 b or open type air outlets 110 c (as shown in FIG.
  • the air inlets 110 b or the air outlets 110 c are so-called semi-open type air inlets 110 b or semi-open type air outlets 110 c (as shown in FIG. 2B ).
  • FIG. 3A is a diagram of the second cap body having air inlets without barricade or air outlets without barricade
  • FIG. 3B is a diagram of the second cap body having air inlets with barricade or air outlets with barricade
  • the air inlets 110 b or air outlets 110 c are so-called open type air inlets 110 b or open type air outlets 110 c (as shown in FIG.
  • the air inlets 110 b or air outlets 110 c are so-called semi-open type air inlets 110 b or semi-open type air outlets 110 c (as shown in FIG. 3B ).
  • FIG. 4 is a diagram of an LED lamp of the second embodiment of the present invention.
  • the LED lamp 100 ′ of the present embodiment is similar to the LED lamp 100 illustrated in the first embodiment except that the LED lamp 100 ′ of the present embodiment further includes a fan 150 disposed in the accommodating space 110 a , wherein the air from the environment is driven by the fan 150 to flow into the accommodating space 110 a via the air inlets 110 b , pass through the air convection channels 136 , and leave the accommodating space 110 a via the air outlets 110 c in sequence.
  • the fan 150 is disposed on the pedestal 132 , and the fan 150 is surrounded by the heat dissipation fins 134 .
  • the fan 150 When the fan 150 is turned on, the air convection in the accommodating space 110 a is boosted, so that the LED lamp 100 ′ can operate under a lower temperature. It is noted that, in the present embodiment, the fan 150 and the LED light source 120 are disposed on two opposite sides of the pedestal 132 , respectively.
  • FIG. 5A ?? FIG. 5B are diagrams of relative locations of the fan, the control circuit, the heat sink and the LED light source of the third embodiment of the present invention.
  • the present embodiment is similar to the second embodiment.
  • the heat sink 130 has a first trench 130 a on one side to accommodate the LED light source 120 .
  • the control circuit 140 e.g. circuit board
  • the control circuit 140 is disposed between the fan 150 and the heat sink 130 .
  • the LED light source 120 may be bonded on the heat sink 130 with solder material, so that the heat generated by the LED light source 120 can be effectively conducted to the heat sink 130 . Additionally, the present embodiment may also use thermal paste together with screw to perform the bonding between the LED light source 120 and the heat sink 130 .
  • the heat sink 130 used in the present embodiment may have an second trench 130 b (as shown in FIG. 5B ) to accommodate the control circuit 140 .
  • the second trench 130 b can not only reduce the overall volume, but also allows the fan 150 to be closer to the heat sink 130 , so as to have a better heat dissipation performance.
  • the arrangement of the components of the LED lamp in the present invention may change in accordance with different design requirements.
  • the above embodiment of the present invention is not used to limit the arrangement of components.
  • the present invention uses the heat sink built in the LED lamp to dissipate heat generated therefrom, such that the operation temperature of LED lamp can be effectively maintained within an acceptable range. Therefore, the life span of LED lamp is prolonged.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Abstract

An LED lamp including a lamp housing, an LED light source, a heat sink and a control circuit. The lamp housing has an accommodating space, a plurality of air inlets and a plurality of air outlets, wherein the accommodating space joins an environment through the air inlets and the air outlets. The LED light source and the heat sink are disposed in the accommodating space and the heat sink is connected with the LED light source. The heat sink includes a pedestal and a plurality of heat dissipation fins connected to the pedestal. An air convection channel is located between any two adjacent heat dissipation fins. Air from the environment flows into the accommodating space, passes through the air convection channel, and leaves the accommodating space via the air outlets sequentially. The control circuit is disposed in the accommodating space and connected to the LED light source.

Description

CROSS-REFERENCE TO RELATED APPLICATION
This application claims the priority benefit of Chinese application serial no. 2007101411631, filed on Aug. 13, 2007. All disclosure of the Chinese application is incorporated herein by reference.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a light-emitting diode lamp (LED lamp), more particularly, relates to an LED lamp with good heat dissipation performance.
2. Description of the Related Art
LEDs are semiconductor devices. The light emitting chips are mainly made of a compound semiconductor material containing III-V group chemical elements, for example, GaP, GaAs, and the like, and function on the principle of converting electric energy to light. That is to say, the compound semiconductor is powered to release excessive energy through the combination of electrons and holes, so as to emit photon (light). The LED can emit light without being heated or does not discharge to emit light. Therefore, the lifespan of the LED is up to 100,000 hours, and an idling time is not required. In addition, the LED has advantages of quick response speed (approximately 10−9 seconds), small volume, power-saving, low pollution, high reliability, and ease mass production. Thus, the LEDs have been intensively used in many fields, for example, light source and illumination device in large-scale bulletin boards, traffic lights, cellular phones, scanners, fax machines, etc.
Currently, the light emitting brightness and efficiency of the LEDs are continuously improved, and meanwhile the white LEDs with high brightness are successfully put into mass production, so the white LEDs have been gradually used in illumination devices such as indoor illumination and outdoor street lamp. Generally, heat dissipation performance is important to high power LEDs. If LEDs operates under high temperature, the brightness that the LED light can provide may be reduced and the life span thereof is reduced. Therefore, how to enhance heat dissipation performance of LEDs is an important topic for research and development people.
SUMMARY OF THE INVENTION
The present invention provided an LED with good heat dissipation performance and long life span.
The present invention provides an LED including a lamp housing, an LED light source, a heat sink and a control circuit. The lamp housing has an accommodating space, a plurality of air inlets and a plurality of air outlets, and the accommodating space joins an environment through the air inlets and air outlets. The LED light source and the heat sink are disposed in the accommodating space, and the heat sink is connected to the LED light source, wherein the heat sink includes a pedestal and a plurality of heat dissipation fins connected to the pedestal. There is an air convection channel between any two adjacent heat dissipation fins. An air convection channel is located between any two adjacent heat dissipation fins, wherein air from the environment is suitable for flowing into the accommodating space via the air inlets, passing through the air convection channels, and leaving the accommodating space via the air outlets. The control circuit is disposed in the lamp housing and is electrically connected to the LED light source.
In an embodiment of the present invention, the lamp housing includes a first cap, a lampshade, a second cap and a conductive plug for accommodating the heat sink. The lampshade is connected to the first cap, and the LED light source is disposed in the lampshade. The second cap is connected to the first cap, so that the first cap is disposed between the lampshade and the second cap. The plug is connected to the second cap, so that the second cap is disposed between the conductive plug and the first cap.
In an embodiment of the present invention, the material of the first cap includes insulation material, such as insulation material with doped zinc oxide.
In an embodiment of the present invention, the material of the second cap includes insulation material, such as insulation material with doped zinc oxide.
In an embodiment of the present invention, the first cap has air inlets, and the second cap has air outlets, wherein each of the air inlets may be an opening with or without barricade, while each of the air outlets may be an opening with or without barricade.
In an embodiment of the present invention, each of the air inlets is a slot-shaped air inlet, and the slot-shaped air inlets are arranged in grating. In addition, each of the slot-shaped air inlets is corresponding to one of the air convection channels of the heat sink, respectively.
In an embodiment of the present invention, the first cap has air outlets, and the second cap has air inlets, wherein each of the air inlets may be an opening with or without barricade, while each of the air outlets may be an opening with or without barricade.
In an embodiment of the present invention, each of the air outlets is a slot-shaped air inlet, and the slot-shaped air outlets are arranged in grating. In addition, each of the slot-shaped air outlets is corresponding to one of the air convection channels of the heat sink, respectively.
In an embodiment of the present invention, the LED light source is an LED package or other types of LED light sources.
In an embodiment of the present invention, the materials of the pedestal and heat dissipation fins are same or different from each other.
In an embodiment of the present invention, the control circuit is a circuit board.
In an embodiment of the present invention, the above circuit board has at least a through hole allowing air to flow within the accommodating space.
In an embodiment of the present invention, the LED lamp may further includes a fan disposed in the accommodating space, wherein the air from the environment is driven by the fan to flow into the accommodating space via the air inlets, pass through the air convection channels, and leave the accommodating space via the air outlets in sequence.
In an embodiment of the present invention, the fan is disposed on the pedestal, and the fan is surrounded by the heat dissipation fins.
In an embodiment of the present invention, the fan and the LED light source are disposed on two opposite sides of the pedestal, respectively.
Since heat generated from the LED lamp of the present invention is capable of removing by the built-in heat sink and the air convection such that the operation temperature of the LED lamp can be maintained within an acceptable range. In other words, the LED lamp of the present invention is not damaged due to over-heating.
In order to the make the aforementioned and other objects, features and advantages of the present invention comprehensible, a preferred embodiment accompanied with figures is described in detail below.
BRIEF DESCRIPTIONS OF DRAWINGS
FIG. 1 is a diagram of an LED lamp of the first embodiment of the present invention.
FIG. 2A is a diagram of the first cap body having air inlets without barricade or air outlets without barricade.
FIG. 2B is a diagram of the first cap body having air inlets with barricade or air outlets with barricade.
FIG. 3A is a diagram of the second cap body having air inlets without barricade or air outlets without barricade.
FIG. 3B is a diagram of the second cap body having air inlets with barricade or air outlets with barricade.
FIG. 4 is a diagram of an LED lamp of the second embodiment of the present invention.
FIG. 5A˜FIG. 5B are diagrams of relative locations of the fan, the control circuit, the heat sink and the LED light source of the third embodiment of the present invention.
 DESCRIPTION OF EMBODIMENTS The First Embodiment
FIG. 1 is a diagram of an LED lamp of the first embodiment of the present invention. With reference to FIG. 1, the LED lamp 100 of the present embodiment includes a lamp housing 110, an LED light source 120, a heat sink 130 and a control circuit 140. The lamp housing 110 has an accommodating space 110 a, a plurality of air inlets 110 b and a plurality of air outlets 110 c, and the accommodating space 110 a joins the environment through the air inlets 110 b and air outlets 110 c. The LED light source 120 and the heat sink 130 are both disposed in the accommodating space 110 a, and the heat sink 130 is connected to the LED light source 120, wherein the heat sink 130 has a pedestal 132 and a plurality of heat dissipation fins 134 connected to the pedestal 132. As shown in FIG. 1, an air convection channel 136 is formed between any two adjacent heat dissipation fins 134, and air from the environment is suitable for flowing into the accommodating space 110 a via the air inlets 110 b, passing through the air convection channel 136, and leaving the accommodating space 110 a via the air outlets 110 c sequentially. In addition, the control circuit 140 is disposed in the accommodating space 110 a of the lamp housing 110 and is electrically connected to the LED light source 120.
The structure of the lamp housing 110, the LED light source 120, the heat sink 130 and the control circuit 140 may have many varieties, and the structural design schematically shown in FIG. 1 is only illustrated as an example for one skilled in the art to implement the present invention, rather than limiting the scope of the present invention.
As shown in FIG. 1, the LED lamp 100 of the present embodiment is an LED light bulb, and the LED lamp may be a light bulb with E27 plug, a light bulb with E26 plug, a light bulb with E14 plug, or light bulbs of other specifications. Specifically, the lamp housing 110 of the present embodiment includes a first cap 112, a lampshade 114, a second cap 116 and a conductive plug 118. The lampshade 114 is connected to the first cap 112, and the LED light source 120 is disposed in the lampshade 114. The second cap 116 is connected to the first cap 112, so that the first cap 112 is disposed between the lampshade 114 and the second cap 116. In addition, the conductive plug 118 is connected to the second cap 116, so that the second cap 116 is disposed between the conductive plug 118 and the first cap 112. The conductive plug 118 of the present embodiment is an E27 plug, an E26 plug, an E14 plug, or plugs of other specifications, for example.
Generally, the first cap 112 and the second cap 116 are usually fabricated with insulation material (such as plastic) to ensure safety of users. However, the present invention does not limit that the first cap 112 and the second cap 116 have to be fabricated with the same insulation material. The first cap 112 and the second cap 116 may also be fabricated with conductive material according to different design requirements.
In an embodiment of the present invention, the material of the first cap 112 and the second cap 116 may be insulation material with doped zinc oxide. Since the insulation material with doped zinc oxide has function of Electro-Magnetic Interference shielding (EMI shielding), the first cap 112 and the second cap 116 with doped zinc oxide are capable of shielding the electromagnetic wave generated from the LED lamp 100, such that harm resulted from the electromagnetic wave can be reduced. In addition, the first cap 112 and the second cap 116 may be fabricated by injection molding, and deformation of the first cap 112 and the second cap 116 made by the insulation material with doped zinc oxide can be effectively controlled after the first cap 112 and the second cap 116 are released from mold. Therefore, the yield rate of the first cap 112 and the second cap 116 can be increased.
As shown in FIG. 1, the LED light source 120 is an LED package fabricated by packaging process, and the package may be a SMD type package or other type of package. In the present embodiment, the LED light source 120 may be bonded with the heat sink 130 with solder material, so that the heat generated by the LED light source 120 can be effectively conducted to the heat sink 130. Additionally, the present embodiment may also use thermal paste together with screw to perform the bonding between the LED light source 120 and the heat sink 130.
In the present embodiment, the heat sink 130 may be fabricated with single material or a plurality of materials. In other words, the pedestal 132 and the heat dissipation fins 134 of the heat sink 130 may be fabricate with the same or different materials. Generally, the material of the heat sink 130 may be copper, aluminum, alloy, or other material with high thermal conductivity.
In the present embodiment, the control circuit 140 is a circuit board independent from the LED light source 120. The circuit board may be a circuit board with single circuit layer or a circuit board with a plurality of circuit layers. In order to facilitate the air convection in the accommodating space 110 a, at least one through hole 142 may be fabricated on the circuit board. In an alternative embodiment of the present invention, the control circuit 140 may be a chip. When the control circuit 140 is a chip, the control circuit 140 may be integrated into the LED light source 120 to reduce the overall volume occupied by the LED lamp. Moreover, when the control circuit 140 is a chip, the control circuit 140 may also be integrated into the circuit board in the LED light source 120.
The air inlets 110 b and the air outlets 110 c formed on the lamp housing 110 are defined according to the convection direction of the air in the accommodating space 110 a. When the air in the accommodating space 110 a flows towards the second cap 120 from the first cap 110, the openings on the first cap 112 are defined as the air inlets 110 b (as shown in FIG. 2A and FIG. 2B), and the openings on the second cap 120 are defined as the air outlets 110 c (as shown in FIG. 3A and FIG. 3B). On the contrary, when the air in the accommodating space 110 a flows towards the first cap 110 from the second cap 120, the openings on the first cap 112 are defined as the air outlets 110 c (as shown in FIG. 2A and FIG. 2B), and the openings on the second cap 120 are defined as the air inlets 110 b (as shown in FIG. 3A and FIG. 3B).
With reference to FIG. 1, FIG. 2A and FIG. 2B, the openings on the first cap 112 (the air inlets 110 b or the air outlets 110 c) may be slot-shaped openings (slot-shaped air inlets or slot-shaped air outlets). In the present embodiment, the slot-shaped openings may be arranged in grating. Additionally, each of the slot-shaped openings is corresponding to one of the air convection channels 136 of the heat sink. Such design facilitates heat dissipation performance of the LED lamp 100.
FIG. 2A is a diagram of the first cap body having air inlets without barricade or air outlets without barricade, and FIG. 2B is a diagram of the first cap body having air inlets with barricade or air outlets with barricade. With reference to FIG. 2A and FIG. 2B, if user can directly observe the situations in the first cap 112 through the air inlets 110 b or the air outlets 110 c, the air inlets 110 b or the air outlets 110 c are so-called open type air inlets 110 b or open type air outlets 110 c (as shown in FIG. 2A); if user can't directly observe the inside of the first cap 112 through the air inlets 110 b or the air outlets 110 c, the air inlets 110 b or the air outlets 110 c are so-called semi-open type air inlets 110 b or semi-open type air outlets 110 c (as shown in FIG. 2B).
FIG. 3A is a diagram of the second cap body having air inlets without barricade or air outlets without barricade, and FIG. 3B is a diagram of the second cap body having air inlets with barricade or air outlets with barricade With reference to FIG. 3A and FIG. 3B, similarly, if user can directly observe the inside of the second cap 116 through the air inlets 110 b or the air outlets 110 c, the air inlets 110 b or air outlets 110 c are so-called open type air inlets 110 b or open type air outlets 110 c (as shown in FIG. 3A); if user can't directly observe the inside of the second cap 116 through the air inlets 110 b or the air outlets 110 c, the air inlets 110 b or air outlets 110 c are so-called semi-open type air inlets 110 b or semi-open type air outlets 110 c (as shown in FIG. 3B).
The Second Embodiment
FIG. 4 is a diagram of an LED lamp of the second embodiment of the present invention. With reference to FIG. 2, the LED lamp 100′ of the present embodiment is similar to the LED lamp 100 illustrated in the first embodiment except that the LED lamp 100′ of the present embodiment further includes a fan 150 disposed in the accommodating space 110 a, wherein the air from the environment is driven by the fan 150 to flow into the accommodating space 110 a via the air inlets 110 b, pass through the air convection channels 136, and leave the accommodating space 110 a via the air outlets 110 c in sequence. As shown in FIG. 4, the fan 150 is disposed on the pedestal 132, and the fan 150 is surrounded by the heat dissipation fins 134. When the fan 150 is turned on, the air convection in the accommodating space 110 a is boosted, so that the LED lamp 100′ can operate under a lower temperature. It is noted that, in the present embodiment, the fan 150 and the LED light source 120 are disposed on two opposite sides of the pedestal 132, respectively.
The Third Embodiment
FIG. 5A˜FIG. 5B are diagrams of relative locations of the fan, the control circuit, the heat sink and the LED light source of the third embodiment of the present invention. With reference to FIG. 5A and FIG. 5B, the present embodiment is similar to the second embodiment. In the present embodiment, the heat sink 130 has a first trench 130 a on one side to accommodate the LED light source 120. The control circuit 140 (e.g. circuit board) is disposed on another side of the heat sink 130. In addition, As shown in FIG. 5A and FIG. 5B, the control circuit 140 is disposed between the fan 150 and the heat sink 130. In the present embodiment, the LED light source 120 may be bonded on the heat sink 130 with solder material, so that the heat generated by the LED light source 120 can be effectively conducted to the heat sink 130. Additionally, the present embodiment may also use thermal paste together with screw to perform the bonding between the LED light source 120 and the heat sink 130.
It is noted that the heat sink 130 used in the present embodiment may have an second trench 130 b (as shown in FIG. 5B) to accommodate the control circuit 140. As shown in FIG. 5B, the second trench 130 b can not only reduce the overall volume, but also allows the fan 150 to be closer to the heat sink 130, so as to have a better heat dissipation performance.
As described above, the arrangement of the components of the LED lamp in the present invention may change in accordance with different design requirements. The above embodiment of the present invention is not used to limit the arrangement of components.
To sum up, the present invention uses the heat sink built in the LED lamp to dissipate heat generated therefrom, such that the operation temperature of LED lamp can be effectively maintained within an acceptable range. Therefore, the life span of LED lamp is prolonged.
It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.

Claims (21)

1. A light-emitting diode (LED) lamp, comprising:
a lamp housing having a first cap defining an accommodating space with a first cap sidewall, a plurality of through slots passing through said first cap sidewall, wherein the accommodating space joins an environment through the first cap through slots;
an LED light source disposed in the accommodating space;
a heat sink disposed in the accommodating space and connected to the LED light source, the heat sink comprising a pedestal and a plurality of heat dissipation fins connected to the pedestal, an air convection channel being located between each respective two adjacent heat dissipation fins, wherein the heat dissipation fins are surrounded by the through slots;
a fan disposed in the accommodating space; and
a control circuit disposed in the lamp housing and electrically connected to the LED light source;
wherein the lamp housing further comprises:
a second cap having a plurality of openings passing through a second cap sidewall;
wherein said heat dissipating fins are displaced each from the other and positioned between said through slots of said first cap, each of said through slots being in radial alignment with a respective air convection channel;
wherein the fan and the LED light source are disposed on two opposite sides of the pedestal of the heat sink respectively, and the fan is surrounded by the heat dissipation fins of the heat sink;
wherein the air from the environment is driven by the fan to flow into the accommodating space via the first cap through slots, pass through the air convection channels, the control circuit, and leave the accommodating space via the openings of the second cap sidewall.
2. The LED lamp of claim 1, wherein the lamp housing comprises:
a lampshade connected to the first cap, wherein the LED light source is disposed in the lampshade;
and
a conductive plug connected to the second cap, wherein the second cap is disposed between the conductive plug and the first cap.
3. The LED lamp of claim 2, wherein a material of the first cap comprises insulation material.
4. The LED lamp of claim 3, wherein a material of the first cap comprises zinc oxide doped insulation material.
5. The LED lamp of claim 2, wherein a material of the second cap comprises insulation material.
6. The LED lamp of claim 5, wherein a material of the second cap comprises doped zinc oxide insulation material.
7. The LED lamp of claim 2, wherein the first cap has air inlets, and the second cap has air outlets.
8. The LED lamp of claim 7 wherein each of the air inlets is an opening with or without barricade.
9. The LED lamp of claim 7, wherein each of the air outlets is an opening with or without barricade.
10. The LED lamp of claim 2, wherein the first cap has air outlets, and the second cap has air inlets.
11. The LED lamp of claim 10, wherein each of the air inlets is an opening with or without barricade.
12. The LED lamp of claim 10, wherein each of the air outlets is an opening with or without barricade.
13. The LED lamp of claim 10, wherein each of the air outlets is a slot-shaped air outlet, and the slot-shaped air inlets are arranged in grating.
14. The LED lamp of claim 13, wherein each of the slot-shaped air outlets respectively corresponds to one of the air convection channels of the heat sink.
15. The LED lamp of claim 1, wherein the LED light source comprises an LED package.
16. The LED lamp of claim 1, wherein a material of the pedestal is the same as a material of the heat dissipation fins.
17. The LED lamp of claim 1, wherein a material of the pedestal and a material of the heat dissipation fins are different.
18. The LED lamp of claim 1, wherein the control circuit comprises a circuit board.
19. The LED lamp of claim 18, wherein the circuit board comprises at least a through hole.
20. The LED lamp of claim 1, wherein the heat sink further comprises a first trench, the LED light source is disposed inside the first trench, and the control circuit is located between the fan and the heat sink.
21. The LED lamp of claim 20, wherein the heat sink further comprises a second trench, the first trench and the second trench are disposed on two opposite sides of the pedestal, respectively, and the control circuit is disposed inside the second trench.
US11/876,778 2007-08-13 2007-10-23 Light-emitting diode lamp Expired - Fee Related US7874710B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN200710141163 2007-08-13
CN2007101411631A CN101368719B (en) 2007-08-13 2007-08-13 LED lamp
CN2007101411631 2007-08-13

Publications (2)

Publication Number Publication Date
US20090046473A1 US20090046473A1 (en) 2009-02-19
US7874710B2 true US7874710B2 (en) 2011-01-25

Family

ID=39735497

Family Applications (1)

Application Number Title Priority Date Filing Date
US11/876,778 Expired - Fee Related US7874710B2 (en) 2007-08-13 2007-10-23 Light-emitting diode lamp

Country Status (4)

Country Link
US (1) US7874710B2 (en)
EP (1) EP2025992B1 (en)
JP (1) JP4673389B2 (en)
CN (1) CN101368719B (en)

Cited By (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090284155A1 (en) * 2008-05-13 2009-11-19 Reed William G Gas-discharge lamp replacement
US20100090577A1 (en) * 2008-08-13 2010-04-15 Reed William G Turbulent flow cooling for electronic ballast
US20100195331A1 (en) * 2009-01-30 2010-08-05 Masakazu Kondo Light-emitting diode lamp with radiation mechanism
US20100232168A1 (en) * 2009-03-13 2010-09-16 Alex Horng Lamp device
US20100246166A1 (en) * 2009-03-24 2010-09-30 Nien-Hui Hsu Illumination apparatus
US20100264799A1 (en) * 2009-04-20 2010-10-21 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Led lamp
US20100277082A1 (en) * 2009-05-01 2010-11-04 Reed William G Gas-discharge lamp replacement with passive cooling
US20100328952A1 (en) * 2009-06-24 2010-12-30 Chen Kai-Po Lighting device with sensor
US20100328956A1 (en) * 2009-06-25 2010-12-30 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Led lamp
US20110026264A1 (en) * 2009-07-29 2011-02-03 Reed William G Electrically isolated heat sink for solid-state light
US20110037387A1 (en) * 2007-09-25 2011-02-17 Enertron, Inc. Dimmable LED Bulb With Convection Cooling
US8157422B2 (en) * 2010-06-24 2012-04-17 Lg Electronics Inc. Lighting apparatus
US20120161628A1 (en) * 2010-12-28 2012-06-28 Hon Hai Precision Industry Co., Ltd. Led illuminating device
US20120236575A1 (en) * 2011-03-14 2012-09-20 Artled Technology Corp. Heat-dissipating downlight lamp holder
CN102691948A (en) * 2011-03-23 2012-09-26 欧司朗股份有限公司 Down lamp capable of adjusting irradiation angle multi-directionally
US20130082595A1 (en) * 2010-05-31 2013-04-04 Sharp Kabushiki Kaisha Lighting apparatus
US8480262B2 (en) * 2011-03-09 2013-07-09 Amtran Technology Co., Ltd. Light profile controllable light emitting device
US8622591B1 (en) * 2012-08-31 2014-01-07 Shenzhen Jiawei Photovoltaic Lighting Co., Ltd. LED lamp scattering heat by exchanging currents
US20140029268A1 (en) * 2012-07-27 2014-01-30 Byeongguk MIN Lighting device
US20140029255A1 (en) * 2012-07-26 2014-01-30 GE Lighting Solutions, LLC Cooling system and lighting device comprised thereof
US8911117B2 (en) 2011-07-26 2014-12-16 Mike Hulsman LED lighting apparatus with a high efficiency convective heat sink
US8994273B2 (en) 2012-07-09 2015-03-31 Mp Design Inc. Light-emitting diode fixture with an improved thermal control system
US20150211723A1 (en) * 2014-01-30 2015-07-30 Cree, Inc. Led lamp and heat sink
US20160010841A1 (en) * 2013-03-04 2016-01-14 Biao Qin Solid-State Light Source Heat-Radiating Metal Shell and Light Source Engine, and Method and Mould for Manufacturing Same
US9241401B2 (en) 2010-06-22 2016-01-19 Express Imaging Systems, Llc Solid state lighting device and method employing heat exchanger thermally coupled circuit board
US9445485B2 (en) 2014-10-24 2016-09-13 Express Imaging Systems, Llc Detection and correction of faulty photo controls in outdoor luminaires
US9572230B2 (en) 2014-09-30 2017-02-14 Express Imaging Systems, Llc Centralized control of area lighting hours of illumination
US20180073713A1 (en) * 2012-11-07 2018-03-15 Palo Alto Research Center Incorporated Led bulb with integrated thermal and optical diffuser
US10164374B1 (en) 2017-10-31 2018-12-25 Express Imaging Systems, Llc Receptacle sockets for twist-lock connectors
US10260729B2 (en) 2017-01-16 2019-04-16 Lumca Inc. LED lighting fixture
WO2020169969A1 (en) * 2019-02-19 2020-08-27 Sunderland Thomas Richard Smart light bulb with integral digital assistant
US11375599B2 (en) 2017-04-03 2022-06-28 Express Imaging Systems, Llc Systems and methods for outdoor luminaire wireless control
US11653436B2 (en) 2017-04-03 2023-05-16 Express Imaging Systems, Llc Systems and methods for outdoor luminaire wireless control

Families Citing this family (170)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9412926B2 (en) 2005-06-10 2016-08-09 Cree, Inc. High power solid-state lamp
JP2011505702A (en) * 2007-12-07 2011-02-24 オスラム ゲゼルシャフト ミット ベシュレンクテル ハフツング Heat sink and lighting device including heat sink
US8118447B2 (en) 2007-12-20 2012-02-21 Altair Engineering, Inc. LED lighting apparatus with swivel connection
US7712918B2 (en) 2007-12-21 2010-05-11 Altair Engineering , Inc. Light distribution using a light emitting diode assembly
US8360599B2 (en) 2008-05-23 2013-01-29 Ilumisys, Inc. Electric shock resistant L.E.D. based light
US20090303736A1 (en) * 2008-06-06 2009-12-10 Hsu-Li Yen Heat-dissipation gain structure of matrix LED light
CN101619822B (en) * 2008-06-30 2012-12-19 鸿富锦精密工业（深圳）有限公司 Lighting device
US7976196B2 (en) 2008-07-09 2011-07-12 Altair Engineering, Inc. Method of forming LED-based light and resulting LED-based light
US7575346B1 (en) * 2008-07-22 2009-08-18 Sunonwealth Electric Machine Industry Co., Ltd. Lamp
US7946729B2 (en) 2008-07-31 2011-05-24 Altair Engineering, Inc. Fluorescent tube replacement having longitudinally oriented LEDs
US8674626B2 (en) 2008-09-02 2014-03-18 Ilumisys, Inc. LED lamp failure alerting system
TWI349085B (en) * 2008-09-09 2011-09-21 Sunonwealth Electr Mach Ind Co Lamp
US8256924B2 (en) 2008-09-15 2012-09-04 Ilumisys, Inc. LED-based light having rapidly oscillating LEDs
KR100901180B1 (en) * 2008-10-13 2009-06-04 현대통신 주식회사 Heat emittimg member having variable heat emitting path and led lighting flood lamp using said it
US8444292B2 (en) 2008-10-24 2013-05-21 Ilumisys, Inc. End cap substitute for LED-based tube replacement light
US8901823B2 (en) 2008-10-24 2014-12-02 Ilumisys, Inc. Light and light sensor
US8653984B2 (en) 2008-10-24 2014-02-18 Ilumisys, Inc. Integration of LED lighting control with emergency notification systems
US7938562B2 (en) 2008-10-24 2011-05-10 Altair Engineering, Inc. Lighting including integral communication apparatus
US8324817B2 (en) 2008-10-24 2012-12-04 Ilumisys, Inc. Light and light sensor
US8214084B2 (en) 2008-10-24 2012-07-03 Ilumisys, Inc. Integration of LED lighting with building controls
US20100226139A1 (en) * 2008-12-05 2010-09-09 Permlight Products, Inc. Led-based light engine
TW201024611A (en) * 2008-12-26 2010-07-01 Everlight Electronics Co Ltd Heat dissipation device and light emitting device comprising the same
US8556452B2 (en) 2009-01-15 2013-10-15 Ilumisys, Inc. LED lens
US8362710B2 (en) 2009-01-21 2013-01-29 Ilumisys, Inc. Direct AC-to-DC converter for passive component minimization and universal operation of LED arrays
US8664880B2 (en) 2009-01-21 2014-03-04 Ilumisys, Inc. Ballast/line detection circuit for fluorescent replacement lamps
TW201031859A (en) * 2009-02-23 2010-09-01 Taiwan Green Point Entpr Co High efficiency luminous body
JP2010203509A (en) 2009-03-03 2010-09-16 Ishikawa Gasket Co Ltd Metal laminate type cylinder head gasket
CN101509653B (en) * 2009-03-09 2015-01-14 张春涛 High power LED lamp structure with fan
KR100961840B1 (en) * 2009-10-30 2010-06-08 화우테크놀러지 주식회사 Led lamp
CN101858505B (en) * 2009-04-13 2013-04-24 富准精密工业(深圳)有限公司 Light-emitting diode (LED) lamp
CN101858499B (en) * 2009-04-13 2012-02-22 扬光绿能股份有限公司 Illumination device
BRPI1007605A2 (en) * 2009-05-04 2016-02-16 Konink Philipis Electronic N V light source
US8330381B2 (en) * 2009-05-14 2012-12-11 Ilumisys, Inc. Electronic circuit for DC conversion of fluorescent lighting ballast
WO2010133021A1 (en) * 2009-05-19 2010-11-25 Tung Kuo-Feng Led lamp assembly
US8299695B2 (en) * 2009-06-02 2012-10-30 Ilumisys, Inc. Screw-in LED bulb comprising a base having outwardly projecting nodes
DE102009024907A1 (en) * 2009-06-15 2010-12-16 Osram Gesellschaft mit beschränkter Haftung Heat sink for semiconductor light elements
CA2765200A1 (en) 2009-06-23 2011-01-13 Altair Engineering, Inc. Illumination device including leds and a switching power control system
TWI411142B (en) * 2009-06-23 2013-10-01 Delta Electronics Inc Illuminating device and packaging method thereof
RU2573424C2 (en) 2009-06-25 2016-01-20 Конинклейке Филипс Электроникс Н.В. Heat-regulation device
US20120212960A1 (en) * 2009-07-06 2012-08-23 Rodriguez Edward T Cooling solid state high-brightness white-light illumination sources
US20110037367A1 (en) * 2009-08-11 2011-02-17 Ventiva, Inc. Solid-state light bulb having ion wind fan and internal heat sinks
TWM374022U (en) * 2009-08-19 2010-02-11 Paragon Sc Lighting Tech Co Structure of LED lamp with integrally-formed shape
TW201109578A (en) * 2009-09-09 2011-03-16 Elements Performance Materials Ltd Heat dissipation structure of lamp
TW201109579A (en) * 2009-09-15 2011-03-16 Advanced Connectek Inc Structure of LED lamp
CN102032473A (en) * 2009-09-29 2011-04-27 富士迈半导体精密工业（上海）有限公司 Light-emitting diode (LED) illumination device
TWI373592B (en) * 2009-09-30 2012-10-01 Everlight Electronics Co Ltd Light source module
TWI384167B (en) 2009-10-02 2013-02-01 Everlight Electronics Co Ltd Illumination device
US9243758B2 (en) * 2009-10-20 2016-01-26 Cree, Inc. Compact heat sinks and solid state lamp incorporating same
TWI385344B (en) * 2009-10-20 2013-02-11 Foxsemicon Integrated Tech Inc Led illumination device
US9030120B2 (en) * 2009-10-20 2015-05-12 Cree, Inc. Heat sinks and lamp incorporating same
US9217542B2 (en) 2009-10-20 2015-12-22 Cree, Inc. Heat sinks and lamp incorporating same
CN102042498B (en) * 2009-10-22 2013-09-04 建准电机工业股份有限公司 Lamp
KR100975528B1 (en) 2009-11-26 2010-08-12 정준호 Led light
CN102109105B (en) * 2009-12-30 2012-07-04 广州南科集成电子有限公司 Multi-aspect luminous high-power LED (light emitting diode) lamp bulb
US9068733B2 (en) * 2010-01-09 2015-06-30 David M. Medinis LED lamp with actively cooled heat sink
JP5354209B2 (en) * 2010-01-14 2013-11-27 東芝ライテック株式会社 Light bulb shaped lamp and lighting equipment
US20110181165A1 (en) * 2010-01-22 2011-07-28 Shun-Tian Lin Light emitting diode lamp
CN101761812B (en) * 2010-02-10 2011-08-03 周成凤 Lamp tube type LED lamp
TW201128116A (en) * 2010-02-11 2011-08-16 Jia-Ye Wu LED lamp set
CN102155636A (en) * 2010-02-11 2011-08-17 亿光电子工业股份有限公司 Light source module and heat dissipation block
US9625105B2 (en) 2010-03-03 2017-04-18 Cree, Inc. LED lamp with active cooling element
US8931933B2 (en) * 2010-03-03 2015-01-13 Cree, Inc. LED lamp with active cooling element
US9057511B2 (en) 2010-03-03 2015-06-16 Cree, Inc. High efficiency solid state lamp and bulb
US8882284B2 (en) 2010-03-03 2014-11-11 Cree, Inc. LED lamp or bulb with remote phosphor and diffuser configuration with enhanced scattering properties
US9275979B2 (en) 2010-03-03 2016-03-01 Cree, Inc. Enhanced color rendering index emitter through phosphor separation
US9310030B2 (en) 2010-03-03 2016-04-12 Cree, Inc. Non-uniform diffuser to scatter light into uniform emission pattern
US10359151B2 (en) 2010-03-03 2019-07-23 Ideal Industries Lighting Llc Solid state lamp with thermal spreading elements and light directing optics
US9316361B2 (en) 2010-03-03 2016-04-19 Cree, Inc. LED lamp with remote phosphor and diffuser configuration
US9024517B2 (en) 2010-03-03 2015-05-05 Cree, Inc. LED lamp with remote phosphor and diffuser configuration utilizing red emitters
US8632196B2 (en) 2010-03-03 2014-01-21 Cree, Inc. LED lamp incorporating remote phosphor and diffuser with heat dissipation features
US8562161B2 (en) 2010-03-03 2013-10-22 Cree, Inc. LED based pedestal-type lighting structure
US9500325B2 (en) 2010-03-03 2016-11-22 Cree, Inc. LED lamp incorporating remote phosphor with heat dissipation features
US20110227102A1 (en) * 2010-03-03 2011-09-22 Cree, Inc. High efficacy led lamp with remote phosphor and diffuser configuration
US9062830B2 (en) * 2010-03-03 2015-06-23 Cree, Inc. High efficiency solid state lamp and bulb
CN102192489A (en) * 2010-03-11 2011-09-21 骆俊光 Efficient heat radiation device
CN101761813A (en) * 2010-03-22 2010-06-30 白建国 LYD lamp with turbulent air radiation
EP2553316B8 (en) 2010-03-26 2015-07-08 iLumisys, Inc. Led light tube with dual sided light distribution
WO2011119921A2 (en) 2010-03-26 2011-09-29 Altair Engineering, Inc. Led light with thermoelectric generator
US8540401B2 (en) 2010-03-26 2013-09-24 Ilumisys, Inc. LED bulb with internal heat dissipating structures
USD671257S1 (en) * 2010-04-10 2012-11-20 Lg Innotek Co., Ltd. LED lamp
TWM391052U (en) * 2010-04-27 2010-10-21 Advanced Connectek Inc Heat dissipation auxiliary device for lamp
DE102010028481A1 (en) * 2010-05-03 2011-11-03 Osram Gesellschaft mit beschränkter Haftung Electronic housing for a lamp, semiconductor lamp and method for casting an electronics housing for a lamp
US8540402B2 (en) 2010-05-23 2013-09-24 RAB Lighting Inc. LED housing with heat transfer sink
KR101053633B1 (en) 2010-06-23 2011-08-03 엘지전자 주식회사 Module type lighting device
KR101216084B1 (en) 2010-06-23 2012-12-26 엘지전자 주식회사 Lighting device and module type lighting device
JPWO2011162048A1 (en) * 2010-06-23 2013-08-19 シーシーエス株式会社 LED light source device
JP4679669B1 (en) * 2010-06-23 2011-04-27 シーシーエス株式会社 LED light source device
KR101057064B1 (en) 2010-06-30 2011-08-16 엘지전자 주식회사 Led based lamp and method for manufacturing the same
TW201200794A (en) * 2010-06-30 2012-01-01 Foxsemicon Integrated Tech Inc LED lamp
KR101053634B1 (en) 2010-07-02 2011-08-03 엘지전자 주식회사 Led based lamp and method for manufacturing the same
US8454193B2 (en) 2010-07-08 2013-06-04 Ilumisys, Inc. Independent modules for LED fluorescent light tube replacement
US8360622B2 (en) * 2010-07-09 2013-01-29 GE Lighting Solutions, LLC LED light source in incandescent shaped light bulb
EP2593714A2 (en) 2010-07-12 2013-05-22 iLumisys, Inc. Circuit board mount for led light tube
WO2012012935A1 (en) * 2010-07-27 2012-02-02 Feng Lin Heat dissipating device for led light source and led light source
US10451251B2 (en) 2010-08-02 2019-10-22 Ideal Industries Lighting, LLC Solid state lamp with light directing optics and diffuser
TW201207310A (en) * 2010-08-13 2012-02-16 Foxsemicon Integrated Tech Inc LED lamp and method for manufacturing a heat sink of the LED lamp
TWI408312B (en) * 2010-10-05 2013-09-11 Sunonwealth Electr Mach Ind Co Lamp
CN101949504A (en) * 2010-10-20 2011-01-19 江苏森隆机电有限公司 Light-emitting diode lamp bulb capable of performing forced convection and cooling
WO2012058556A2 (en) 2010-10-29 2012-05-03 Altair Engineering, Inc. Mechanisms for reducing risk of shock during installation of light tube
CN102003684B (en) * 2010-11-26 2012-05-23 北京化工大学 Heat dissipation structure of high-power light-emitting diode (LED) illuminating lamp
US8870415B2 (en) 2010-12-09 2014-10-28 Ilumisys, Inc. LED fluorescent tube replacement light with reduced shock hazard
CN102563394A (en) * 2010-12-27 2012-07-11 富准精密工业(深圳)有限公司 Light emitting diode (LED) lamp bulb
US8905589B2 (en) 2011-01-12 2014-12-09 Kenall Manufacturing Company LED luminaire thermal management system
US9752769B2 (en) 2011-01-12 2017-09-05 Kenall Manufacturing Company LED luminaire tertiary optic system
DE102011008613B4 (en) * 2011-01-14 2016-10-20 Osram Gmbh lighting device
US9234655B2 (en) 2011-02-07 2016-01-12 Cree, Inc. Lamp with remote LED light source and heat dissipating elements
US9068701B2 (en) 2012-01-26 2015-06-30 Cree, Inc. Lamp structure with remote LED light source
US11251164B2 (en) 2011-02-16 2022-02-15 Creeled, Inc. Multi-layer conversion material for down conversion in solid state lighting
JP5296122B2 (en) * 2011-02-28 2013-09-25 株式会社東芝 Lighting device
CN102679188B (en) * 2011-03-15 2014-01-29 瑞轩科技股份有限公司 Light-emitting device
TWI426214B (en) * 2011-03-15 2014-02-11 Sunonwealth Electr Mach Ind Co Lamp
TWM441089U (en) * 2011-04-11 2012-11-11 Molex Inc LED Lamp
US10030863B2 (en) 2011-04-19 2018-07-24 Cree, Inc. Heat sink structures, lighting elements and lamps incorporating same, and methods of making same
KR101215779B1 (en) 2011-05-18 2013-01-09 정현종 Replective led light apparatus equipped with fan
TWI408313B (en) * 2011-05-23 2013-09-11 Sunonwealth Electr Mach Ind Co Led lamp
KR101131502B1 (en) 2011-05-26 2012-04-04 남경훈 Device for radiate
EP2538133A1 (en) * 2011-06-23 2012-12-26 Koninklijke Philips Electronics N.V. Remote heat sink
WO2012168845A1 (en) * 2011-06-06 2012-12-13 Koninklijke Philips Electronics N.V. Remote heat sink
TWM415248U (en) * 2011-06-08 2011-11-01 Wellypower Optronics Corp Structure of bubble lamp
US8740415B2 (en) * 2011-07-08 2014-06-03 Switch Bulb Company, Inc. Partitioned heatsink for improved cooling of an LED bulb
US8926140B2 (en) 2011-07-08 2015-01-06 Switch Bulb Company, Inc. Partitioned heatsink for improved cooling of an LED bulb
KR101075189B1 (en) 2011-07-14 2011-10-19 (주)링크옵틱스 Bulb type led lamp for light culture
KR101129524B1 (en) * 2011-07-22 2012-03-29 마레티 홀딩 비브이 Led lamp module have function of radiating heat and led lighting apparatus with led lamp
CN102235610A (en) * 2011-08-16 2011-11-09 彭雯 LED (light emitting diode) ball bulb
US9072171B2 (en) 2011-08-24 2015-06-30 Ilumisys, Inc. Circuit board mount for LED light
KR101876948B1 (en) 2011-08-24 2018-07-10 엘지이노텍 주식회사 Illuminating lamp
CN102374427A (en) * 2011-09-20 2012-03-14 浙江捷莱照明有限公司 LED (light-emitting diode) bulb lamp
CN102313179B (en) * 2011-09-30 2013-03-13 邓旭恒 Super-miniature high-power light emitting diode (LED) energy-saving quartz lamp
TWM423207U (en) * 2011-10-13 2012-02-21 Yi-Ming Chen Heat-dissipation structure for light bulb
US10378749B2 (en) 2012-02-10 2019-08-13 Ideal Industries Lighting Llc Lighting device comprising shield element, and shield element
US9184518B2 (en) 2012-03-02 2015-11-10 Ilumisys, Inc. Electrical connector header for an LED-based light
JP2013201082A (en) * 2012-03-26 2013-10-03 Toshiba Lighting & Technology Corp Lighting device
US9488359B2 (en) 2012-03-26 2016-11-08 Cree, Inc. Passive phase change radiators for LED lamps and fixtures
KR101414650B1 (en) * 2012-05-09 2014-07-03 엘지전자 주식회사 Lighting apparatus
CN102679222B (en) * 2012-05-19 2014-08-06 广州欧科廷光电照明股份有限公司 LED (light-emitting diode) lamp for radiating heat by using ultrasonic waves
CN102721023B (en) * 2012-06-05 2015-04-15 余姚天超通风设备有限公司 LED lamp radiator
US9163794B2 (en) 2012-07-06 2015-10-20 Ilumisys, Inc. Power supply assembly for LED-based light tube
US9271367B2 (en) 2012-07-09 2016-02-23 Ilumisys, Inc. System and method for controlling operation of an LED-based light
CN102818199B (en) * 2012-07-23 2014-12-10 贵州光浦森光电有限公司 LED (Light-Emitting Diode) ceiling lamp
CN203023858U (en) * 2012-08-02 2013-06-26 福建新文行灯饰有限公司 Heat dissipation type light-emitting diode (LED) lamp
CN103629644A (en) * 2012-08-27 2014-03-12 欧司朗股份有限公司 Heat transfer block used for LED device, LED device and LED lamp
CN102818160B (en) * 2012-08-31 2015-08-19 深圳珈伟光伏照明股份有限公司 Can air-guiding exchange, heat radiation LED lamp
TWI509196B (en) * 2012-09-27 2015-11-21 Sunonwealth Electr Mach Ind Co Lamp
CN102900982B (en) * 2012-10-09 2014-08-13 佛山市顺德区保利达电器有限公司 Light emitting diode (LED) lamp bulb
US9285084B2 (en) 2013-03-14 2016-03-15 Ilumisys, Inc. Diffusers for LED-based lights
US8967837B2 (en) 2013-08-01 2015-03-03 3M Innovative Properties Company Solid state light with features for controlling light distribution and air cooling channels
US9267650B2 (en) 2013-10-09 2016-02-23 Ilumisys, Inc. Lens for an LED-based light
US9267674B2 (en) 2013-10-18 2016-02-23 3M Innovative Properties Company Solid state light with enclosed light guide and integrated thermal guide
US9354386B2 (en) 2013-10-25 2016-05-31 3M Innovative Properties Company Solid state area light and spotlight with light guide and integrated thermal guide
USD735368S1 (en) 2013-12-04 2015-07-28 3M Innovative Properties Company Solid state light assembly
KR20160111975A (en) 2014-01-22 2016-09-27 일루미시스, 인크. Led-based light with addressed leds
CN103775878A (en) * 2014-01-25 2014-05-07 江苏雷立博光电有限公司 LED (Light Emitting Diode) lamp capable of easily radiating
US9360188B2 (en) 2014-02-20 2016-06-07 Cree, Inc. Remote phosphor element filled with transparent material and method for forming multisection optical elements
USD736966S1 (en) 2014-03-28 2015-08-18 3M Innovative Properties Company Solid state light assembly
US9510400B2 (en) 2014-05-13 2016-11-29 Ilumisys, Inc. User input systems for an LED-based light
CN104359036B (en) * 2014-12-01 2016-09-14 东莞市闻誉实业有限公司 LED with pipeline
CN104613348B (en) * 2015-02-03 2016-08-24 东莞市闻誉实业有限公司 LED with helical wind-guiding road
CN104613443B (en) * 2015-02-03 2018-01-30 东莞市闻誉实业有限公司 Radiator with guide vane
CN104835810B (en) * 2015-02-14 2017-05-24 吴鼎鼎 Long-life LED lamp light-emitting unit and long-life LED lamp
USD768316S1 (en) 2015-04-03 2016-10-04 3M Innovative Properties Company Solid state luminaire with dome reflector
CN104851956B (en) * 2015-04-20 2017-07-18 绍兴文理学院 A kind of near ultraviolet excited white light LED light source
USD780348S1 (en) 2015-06-01 2017-02-28 Ilumisys, Inc. LED-based light tube
US10161568B2 (en) 2015-06-01 2018-12-25 Ilumisys, Inc. LED-based light with canted outer walls
USD815763S1 (en) 2015-07-07 2018-04-17 Ilumisys, Inc. LED-based light tube
USD781469S1 (en) 2015-07-07 2017-03-14 Ilumisys, Inc. LED light tube
KR20170084502A (en) * 2016-01-12 2017-07-20 주식회사 비케이테크놀로지 Lighting apparatus and heating value controlling method thereof
CN105650498A (en) * 2016-02-29 2016-06-08 柳州格瑞斯光电科技有限公司 LED mining lamp
US10871282B2 (en) * 2016-06-23 2020-12-22 Oppie Lighting Co., Ltd. Illuminator device
CN108105676A (en) * 2017-12-19 2018-06-01 广西玉林市汉龙环保科技有限公司 A kind of lampshade rotating device of LED illumination lamp
TWI717248B (en) * 2020-03-30 2021-01-21 正裕起動有限公司 Lamp structure

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW300864B (en) 1995-06-23 1997-03-21 Hitachi Koki Kk
US6511209B1 (en) * 2001-10-02 2003-01-28 Albert C. L. Chiang Lighting fixture
US6746885B2 (en) * 2001-08-24 2004-06-08 Densen Cao Method for making a semiconductor light source
US6864513B2 (en) * 2003-05-07 2005-03-08 Kaylu Industrial Corporation Light emitting diode bulb having high heat dissipating efficiency
US20050111234A1 (en) * 2003-11-26 2005-05-26 Lumileds Lighting U.S., Llc LED lamp heat sink
US20060120080A1 (en) * 2004-02-03 2006-06-08 Gene Sipinski Control and an integrated circuit for a multisensory apparatus
TWM297444U (en) 2006-03-20 2006-09-11 Jungli Shing Jr Lamp
TWM300864U (en) 2006-05-26 2006-11-11 Jaffe Ltd Heat-dissipating structure for lamp
US7165866B2 (en) * 2004-11-01 2007-01-23 Chia Mao Li Light enhanced and heat dissipating bulb
CN2881340Y (en) 2006-03-03 2007-03-21 超众科技股份有限公司 LED lamp and its radiating structure
CN2903668Y (en) 2006-04-12 2007-05-23 深圳市红绿蓝光电科技有限公司 Wide angle lamp bulb
CN2906327Y (en) 2006-04-30 2007-05-30 赵永学 Heat radiation structure for LED illumination
US20070195527A1 (en) * 2004-08-18 2007-08-23 Remco Solid State Lighting Inc. System and method for power control in a led luminaire
US7497596B2 (en) * 2001-12-29 2009-03-03 Mane Lou LED and LED lamp
US7524089B2 (en) * 2004-02-06 2009-04-28 Daejin Dmp Co., Ltd. LED light

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2815721B2 (en) * 1991-03-20 1998-10-27 株式会社小糸製作所 Automotive headlamp
US5882108A (en) * 1995-10-12 1999-03-16 Valeo Sylvania L.L.C. Lighting with EMI shielding
JP2002110093A (en) * 2000-07-28 2002-04-12 Toshiba Lighting & Technology Corp Fluorescent lamp
US20020122309A1 (en) * 2001-02-16 2002-09-05 Abdelhafez Mohamed M. Led beacon lamp
GB0424892D0 (en) * 2004-11-11 2004-12-15 Fowler James A Lighting device
US7144140B2 (en) * 2005-02-25 2006-12-05 Tsung-Ting Sun Heat dissipating apparatus for lighting utility
US7255460B2 (en) * 2005-03-23 2007-08-14 Nuriplan Co., Ltd. LED illumination lamp
JP2006310057A (en) * 2005-04-27 2006-11-09 Arumo Technos Kk Led illumination lamp and led lighting control circuit
CN2869562Y (en) * 2006-01-18 2007-02-14 吴敏 Lighting, decorative LED projection lamp

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW300864B (en) 1995-06-23 1997-03-21 Hitachi Koki Kk
US6746885B2 (en) * 2001-08-24 2004-06-08 Densen Cao Method for making a semiconductor light source
US6511209B1 (en) * 2001-10-02 2003-01-28 Albert C. L. Chiang Lighting fixture
US7497596B2 (en) * 2001-12-29 2009-03-03 Mane Lou LED and LED lamp
US6864513B2 (en) * 2003-05-07 2005-03-08 Kaylu Industrial Corporation Light emitting diode bulb having high heat dissipating efficiency
US20050111234A1 (en) * 2003-11-26 2005-05-26 Lumileds Lighting U.S., Llc LED lamp heat sink
US20060120080A1 (en) * 2004-02-03 2006-06-08 Gene Sipinski Control and an integrated circuit for a multisensory apparatus
US7524089B2 (en) * 2004-02-06 2009-04-28 Daejin Dmp Co., Ltd. LED light
US20070195527A1 (en) * 2004-08-18 2007-08-23 Remco Solid State Lighting Inc. System and method for power control in a led luminaire
US7165866B2 (en) * 2004-11-01 2007-01-23 Chia Mao Li Light enhanced and heat dissipating bulb
CN2881340Y (en) 2006-03-03 2007-03-21 超众科技股份有限公司 LED lamp and its radiating structure
TWM297444U (en) 2006-03-20 2006-09-11 Jungli Shing Jr Lamp
CN2903668Y (en) 2006-04-12 2007-05-23 深圳市红绿蓝光电科技有限公司 Wide angle lamp bulb
CN2906327Y (en) 2006-04-30 2007-05-30 赵永学 Heat radiation structure for LED illumination
TWM300864U (en) 2006-05-26 2006-11-11 Jaffe Ltd Heat-dissipating structure for lamp

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
"1st Office Action of counterpart China application", issued on Jun. 19, 2009, p. 1-p. 5.
"Office Action of counterpart Taiwan application", issued on Oct. 12, 2009, p. 1-p. 5.

Cited By (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8444299B2 (en) * 2007-09-25 2013-05-21 Enertron, Inc. Dimmable LED bulb with heatsink having perforated ridges
US20110037387A1 (en) * 2007-09-25 2011-02-17 Enertron, Inc. Dimmable LED Bulb With Convection Cooling
US20120212129A9 (en) * 2007-09-25 2012-08-23 Enertron, Inc. Dimmable LED Bulb With Convection Cooling
US8926138B2 (en) * 2008-05-13 2015-01-06 Express Imaging Systems, Llc Gas-discharge lamp replacement
US20090284155A1 (en) * 2008-05-13 2009-11-19 Reed William G Gas-discharge lamp replacement
US8334640B2 (en) 2008-08-13 2012-12-18 Express Imaging Systems, Llc Turbulent flow cooling for electronic ballast
US20100090577A1 (en) * 2008-08-13 2010-04-15 Reed William G Turbulent flow cooling for electronic ballast
US20100195331A1 (en) * 2009-01-30 2010-08-05 Masakazu Kondo Light-emitting diode lamp with radiation mechanism
US8256928B2 (en) * 2009-01-30 2012-09-04 Kondo Kogei Co., Ltd. Light-emitting diode lamp with radiation mechanism
US20100232168A1 (en) * 2009-03-13 2010-09-16 Alex Horng Lamp device
US8057075B2 (en) * 2009-03-13 2011-11-15 Sunonwealth Electric Machine Industry Co., Ltd. Lamp device
US20100246166A1 (en) * 2009-03-24 2010-09-30 Nien-Hui Hsu Illumination apparatus
US20100264799A1 (en) * 2009-04-20 2010-10-21 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Led lamp
US20100277082A1 (en) * 2009-05-01 2010-11-04 Reed William G Gas-discharge lamp replacement with passive cooling
US8926139B2 (en) * 2009-05-01 2015-01-06 Express Imaging Systems, Llc Gas-discharge lamp replacement with passive cooling
US8123379B2 (en) * 2009-06-24 2012-02-28 Chen Kai-Po Lighting device with sensor
US20100328952A1 (en) * 2009-06-24 2010-12-30 Chen Kai-Po Lighting device with sensor
US20100328956A1 (en) * 2009-06-25 2010-12-30 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Led lamp
US20110026264A1 (en) * 2009-07-29 2011-02-03 Reed William G Electrically isolated heat sink for solid-state light
US20130082595A1 (en) * 2010-05-31 2013-04-04 Sharp Kabushiki Kaisha Lighting apparatus
US9241401B2 (en) 2010-06-22 2016-01-19 Express Imaging Systems, Llc Solid state lighting device and method employing heat exchanger thermally coupled circuit board
US8157422B2 (en) * 2010-06-24 2012-04-17 Lg Electronics Inc. Lighting apparatus
US8303137B2 (en) 2010-06-24 2012-11-06 Lg Electronics Inc. Lighting apparatus
US20120161628A1 (en) * 2010-12-28 2012-06-28 Hon Hai Precision Industry Co., Ltd. Led illuminating device
US8408750B2 (en) * 2010-12-28 2013-04-02 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. LED illuminating device
US8480262B2 (en) * 2011-03-09 2013-07-09 Amtran Technology Co., Ltd. Light profile controllable light emitting device
US8459846B2 (en) * 2011-03-14 2013-06-11 Artled Technology Corp. Heat-dissipating downlight lamp holder
US20120236575A1 (en) * 2011-03-14 2012-09-20 Artled Technology Corp. Heat-dissipating downlight lamp holder
CN102691948B (en) * 2011-03-23 2016-04-20 欧司朗股份有限公司 Can the Down lamp of multi-direction regulating irradiation angle
CN102691948A (en) * 2011-03-23 2012-09-26 欧司朗股份有限公司 Down lamp capable of adjusting irradiation angle multi-directionally
US20140003061A1 (en) * 2011-03-23 2014-01-02 Osram Gmbh Downlight with illumination angle adjustable polydirectionally
US9523493B2 (en) * 2011-03-23 2016-12-20 Osram Gmbh Downlight with illumination angle adjustable polydirectionally
US8911117B2 (en) 2011-07-26 2014-12-16 Mike Hulsman LED lighting apparatus with a high efficiency convective heat sink
US8994273B2 (en) 2012-07-09 2015-03-31 Mp Design Inc. Light-emitting diode fixture with an improved thermal control system
US20140029255A1 (en) * 2012-07-26 2014-01-30 GE Lighting Solutions, LLC Cooling system and lighting device comprised thereof
US8967836B2 (en) * 2012-07-27 2015-03-03 Lg Innotek Co., Ltd. Light having a lens and body with a threaded connection and a groove and a protrusion connection therebetween
US20140029268A1 (en) * 2012-07-27 2014-01-30 Byeongguk MIN Lighting device
US8622591B1 (en) * 2012-08-31 2014-01-07 Shenzhen Jiawei Photovoltaic Lighting Co., Ltd. LED lamp scattering heat by exchanging currents
US20180073713A1 (en) * 2012-11-07 2018-03-15 Palo Alto Research Center Incorporated Led bulb with integrated thermal and optical diffuser
US10006617B2 (en) * 2012-11-07 2018-06-26 Palo Alto Research Center Incorporated LED bulb with integrated thermal and optical diffuser
US10139097B2 (en) * 2013-03-04 2018-11-27 Shenzhen Qin Bo Core Technology Development Co., Ltd. Solid-state light source heat dissipation metal shell and light source engine, the manufacturing methods thereof, and mold
US20160010841A1 (en) * 2013-03-04 2016-01-14 Biao Qin Solid-State Light Source Heat-Radiating Metal Shell and Light Source Engine, and Method and Mould for Manufacturing Same
US10030819B2 (en) * 2014-01-30 2018-07-24 Cree, Inc. LED lamp and heat sink
US20150211723A1 (en) * 2014-01-30 2015-07-30 Cree, Inc. Led lamp and heat sink
US9572230B2 (en) 2014-09-30 2017-02-14 Express Imaging Systems, Llc Centralized control of area lighting hours of illumination
US9445485B2 (en) 2014-10-24 2016-09-13 Express Imaging Systems, Llc Detection and correction of faulty photo controls in outdoor luminaires
US10260729B2 (en) 2017-01-16 2019-04-16 Lumca Inc. LED lighting fixture
US11653436B2 (en) 2017-04-03 2023-05-16 Express Imaging Systems, Llc Systems and methods for outdoor luminaire wireless control
US11375599B2 (en) 2017-04-03 2022-06-28 Express Imaging Systems, Llc Systems and methods for outdoor luminaire wireless control
US10164374B1 (en) 2017-10-31 2018-12-25 Express Imaging Systems, Llc Receptacle sockets for twist-lock connectors
WO2020169969A1 (en) * 2019-02-19 2020-08-27 Sunderland Thomas Richard Smart light bulb with integral digital assistant

Also Published As

Publication number Publication date
JP4673389B2 (en) 2011-04-20
JP2009048994A (en) 2009-03-05
EP2025992A2 (en) 2009-02-18
CN101368719A (en) 2009-02-18
CN101368719B (en) 2011-07-06
EP2025992A3 (en) 2013-01-30
EP2025992B1 (en) 2014-02-26
US20090046473A1 (en) 2009-02-19

Similar Documents

Publication Publication Date Title
US7874710B2 (en) Light-emitting diode lamp
US7965029B2 (en) Light-emitting diode illumination apparatus
US10107487B2 (en) LED light bulbs
US7837363B2 (en) LED illuminating device and light engine thereof
US8092054B2 (en) LED illuminating device and light engine thereof
TW201024611A (en) Heat dissipation device and light emitting device comprising the same
KR101284261B1 (en) Multifunctional led lamp module
US20100270904A1 (en) Led bulb with modules having side-emitting diodes
CN102829346A (en) LED lamp and method of making the same
US8684565B2 (en) LED light with active thermal management
CN202140858U (en) Light-emitting diode (LED) lamp with radiating structure
US8376587B2 (en) LED illuminating device and light engine thereof
KR101876948B1 (en) Illuminating lamp
US8419237B2 (en) Heat sink and light emitting diode lamp
KR101981716B1 (en) Lighting device
KR101080827B1 (en) Heat sink structure for led illuminator and led illuminator using the same
KR101890186B1 (en) Lighting device
KR101833223B1 (en) Lighting device
TWI417480B (en) Led lamp
KR101883323B1 (en) Lighting device
KR101868470B1 (en) Lighting device
TW201038875A (en) Light emitting diode lamp

Legal Events

Date Code Title Description
AS Assignment

Owner name: LUSTROUS INTERNATIONAL TECHNOLOGY LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:TSAI, WEN-KUEI;LIU, CHIA-CHI;WANG, CHUN-CHIEN;AND OTHERS;REEL/FRAME:020106/0296

Effective date: 20071009

Owner name: TOPCO TECHNOLOGIES CORP., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:TSAI, WEN-KUEI;LIU, CHIA-CHI;WANG, CHUN-CHIEN;AND OTHERS;REEL/FRAME:020106/0296

Effective date: 20071009

AS Assignment

Owner name: LUSTROUS INTERNATIONAL TECHNOLOGY LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:TOPCO TECHNOLOGIES CORP.;REEL/FRAME:022790/0567

Effective date: 20090519

Owner name: GE INVESTMENT CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:TOPCO TECHNOLOGIES CORP.;REEL/FRAME:022790/0567

Effective date: 20090519

AS Assignment

Owner name: TOP ENERGY SAVING SYSTEM CORP., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:GE INVESTMENT CO., LTD.;REEL/FRAME:025353/0916

Effective date: 20101111

AS Assignment

Owner name: CHANG WAH ELECTROMATERIALS, INC., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:TOP ENERGY SAVING SYSTEM CORP.;REEL/FRAME:031346/0280

Effective date: 20130925

FPAY Fee payment

Year of fee payment: 4

FEPP Fee payment procedure

Free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY

LAPS Lapse for failure to pay maintenance fees

Free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY

STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362

FP Lapsed due to failure to pay maintenance fee

Effective date: 20190125