KR101142580B1 - Heat sink and lighting device comprising a heat sink - Google Patents

Abstract

The heat sink 1, which can be operated by the forced air flow generator 21, includes a light source region for mounting the light source 16, and an external device of the heat sink 1 including a bottom region and a side region. At least one air flow channel 26 extending from any one of the side region, the air flow channel 26 comprises a side exhaust (27).

Description

Lighting device with heat sink and heat sink {HEAT SINK AND LIGHTING DEVICE COMPRISING A HEAT SINK}

TECHNICAL FIELD The present invention relates to a heat sink, and more particularly, to a heat sink operated by a forced air flow generator and an illumination device including such a heat sink.

In general, cooling of high power light sources, for example high power light sources including light emitting diodes (LEDs) assembled in a small area and having a high power density is desirable, but such cooling is difficult to achieve. Moreover, when the effective area is small, it is necessary to efficiently use the effective space between other functional parts of the lighting apparatus, for example, other functional parts such as a housing, an optical element, a driver substrate, and the like. In addition, user-friendly thermal management is required with respect to noise or the flow of hot air.

To achieve these contradictory goals, well-known lighting devices, such as LED lamps, operate at low power and can divide brightness and material loss by arranging the LEDs in a relatively large area, mostly using passive heat sinks. Passive heatsinks typically provide relatively wide spaced cooling fins, typically arranged around or under the light source and forming an airflow channel extending from the bottom to the top to allow for natural convection. The exhaust port is placed around the fins such that the tail of the hot air being exhausted faces away from the direction of gravity. However, some lighting devices employ an active cooling scheme that forces airflow through the submount substrate to the heat sink that is thermally connected to the hot light source. The heat sink is an element which is manufactured separately and regularly fixed by a supporting structure such as a housing. Conventional heat sinks employing active cooling are attached to the underside of the heat source facing the fan. Especially in the case of compact structures, the assembly and adjustment of the various parts is complicated and expensive.

It is an object of the present invention to provide a high power lighting system that is compact, reliable, user friendly and easy to assemble.

This object is achieved by a heat sink according to claim 1 and a lighting device according to claim 37.

The heat sink includes a light source region for attaching a light source, and a heat diffusion and dissipation structure covering at least a portion of an exterior of the heat sink including a bottom region and a side region, wherein the heat diffusion and dissipation structure extend from the bottom region to the side region. At least one airflow channel, the airflow channel comprising a side vent.

By combining the light source function and the efficient heat dissipation function in the heat sink, the complexity and cost of manufacturing and assembly are greatly reduced compared to an active cooling type lighting system employing a conventional simple heat sink. By directing the air flow to the side region side, firstly, hot air can be avoided from flowing in the light emitting direction, and secondly, the size of the light emitting region can be increased, and thirdly, the entire grid region at the limited maximum diameter is turned to the front. Rather, from the fact that the air flows through each grid opening from the side larger and thus less noise, noise can be mitigated in spite of active cooling, thus providing a compact and user-friendly lighting device. Can be. These advantages can be emphasized and achieved by using an active cooling generator (steel donor flow generator) to allow air flow through the dispersion structure. However, heat sinks can also be used for natural convection.

Advantageously, the heat diffusion and dissipation structure is covered at the top to prevent air flow in the direction of illumination.

Advantageously, the light source comprises an LED submount / LED module for effective illumination and easy assembly. The submount (or module) utilizes a substrate comprising a cluster of one or more single LEDs or LED-chips, for example, multiple colored LEDs (red, blue, green LEDs, or white LEDs).

Advantageously,

The light source region comprises an open cavity formed as a cavity wall, the cavity comprising a light source mounting region into which at least one light source is inserted.

The heat sink comprises a monolithic heat sink base extending outward from the light source mounting area and protruding from the cavity wall.

Thermal diffusion and dissipation structures are thermally connected to the heatsink base.

With this configuration, particularly effective heat conduction and dispersion are achieved. The monolithic heatsink base includes enough space to quickly guide heat from the heat source. The heat dissipation and dissipation structure thermally connected to the heat sink base and the heat sink base of the protruding monolith form a strong heat conduction to the heat diffusion and dissipation structure side in a wide area.

Advantageously, the thermal diffusion and dissipation structure includes a plurality of vertically aligned fins that allow easy assembly and strong airflow.

Advantageously, each airflow channel comprises at least partly two adjacent fins and a portion of the cavity wall bounded by these two adjacent fins. If desired, this leaves lateral openings covered or uncovered.

Advantageously, the fins are arranged rotationally symmetrically so that a uniform heat distribution can be achieved.

In particular, for effective cooling by forced air flow it was found that it is advantageous that the fin has the following size.

The circumferential distance (width of the airflow channel) between two adjacent pins is in the range of 0.4 mm ≦ C1 ≦ 8 mm.

The thickness is in the range of 0.1 mm ≦ F1 ≦ 3 mm.

The lateral length is in the range 5 mm ≦ F2 ≦ 40 mm.

Although the shape of the pin is not limited to any particular shape, it may be advantageous if the pin at least partially shows a cross section having a rectangular, curved and / or tip portion, for example a triangular cross section.

Advantageously, at the bottom of the cavity wall a base fin extends in the radial direction of the straight pattern.

Also advantageously, at the bottom of the cavity wall a base pin extends in the radial direction of a squirl pattern.

In order to achieve good heat distribution to the fin side and to enable smooth air flow guidance, the heat sink base advantageously has a tapered shape in which the base is disposed in the light source mounting region.

Advantageously, the tapered shape of the heat sink base is the tapered shape of the cone. In general, the base of the cone can have a variety of shapes, the vertices of which can also be placed in various positions, but preferably in the center is preferred. However, it can be assumed that the base is limited and has a non-zero area and its vertices lie outside the plane of the base. The circular cone and the elliptical cone have a circular base and an elliptical base, respectively. If the axis of the cone is perpendicular to its base, it is called a staff cone and otherwise it is called a rain cone. A pyramid is a special form of polygonal pyramid with a polygonal base.

Advantageously the cone shape of the heat sink base is the shape of the truncated cone.

A particularly advantageous heat sink is that the cavity wall comprises a reflecting area for reflecting light rays from the light source outside the cavity. It is advantageous that at least the side wall of the cavity comprises a reflecting area, with most of the reflecting area being covered by most or all of the side cavity wall.

In particular, in order to be able to show good lighting characteristics while achieving effective cooling, it has been found that the cavity has the following size.

The height h of the cavity is in the range from 30 mm to 80 mm, in particular about 60 mm.

The width L1 of the bottom of the cavity ranges from 20 mm to 60 mm, in particular about 40 mm.

The width L2 of the upper part of the cavity ranges from 80 mm to 120 mm, in particular about 100 mm.

The ratio Rt between the width L2 and the width L1 is 1.25 ≦ Rt ≦ 5.

The thickness Dw of the side cavity walls is 0.5 mm ≦ Dw ≦ 10 mm.

In particular, in order to achieve a smooth air guidance while effective heat distribution is made, it was found that the heat sink base has the following size advantageously.

The base width Lt of the heat sink base is in the range of L1? Lt? 1.5? L1.

The vertex width Lc of the heat sink base is in the range of 0 ≦ Lc <L1.

The height Hb of the heat sink base is in the range of 0.05 to L1 < Hb &lt; 0.5 to L1.

In order to achieve particularly effective cooling, it has been found that the airflow structure of the heatsink has the following size.

The height He of the side exhaust port is in the range of 0.1? Hc? He? 0.6? Hc.

The overall height Hc of the fin is in the range Hb &lt; Hc &lt; h + Hb.

Advantageously, the heatsink consists of a material having a thermal conductivity in the range of 150-240 W / (m? K).

Advantageously such materials consist of Cu, Al, Mg, or alloys thereof.

The thermal diffusion and dissipation structures are at least partially covered by an air baffle in order to prevent leakage of the air so that strong air flow can be achieved through the air flow channel.

Advantageously, the heat sink also comprises at least one inserting means for mounting at least one optical element, for example one or more lenses or a transparent protective cover.

At least one airflow channel advantageously comprises an airflow cross-section extending in the vicinity of the side vents.

Advantageously, the heat sink comprises a mounting column for mounting this heat sink to the lighting device. This also lowers the assembly and manufacturing cost and makes it easier to adjust.

Advantageously, the at least one mounting column is adapted to fix at least one printed circuit board. This also lowers the assembly and manufacturing cost and facilitates adjustment.

The object of the present invention is also achieved by an illumination device comprising the above-mentioned heat sink. These lighting devices are of high power, effective cooling, compact and low noise.

Particularly advantageously, the lighting device comprises a forced air flow generator which is able to supply air to the air flow channel side. This forced air flow generator allows the air flow to be efficiently cooled through the exhaust port arranged in the side.

Advantageously, the airflow generator is capable of supplying air to the bottom side of the airflow channel.

Advantageously, the airflow generator is disposed below the heat sink.

Advantageously, the airflow generator is spaced from the heatsink by an air guide structure to prevent turbulence and splitting of the air, which can degrade cooling performance and increase noise.

Advantageously, such air guide structures include open spaces.

Advantageously, the open space may have a straight basic shape or may have the shape of an hourglass.

Advantageously, the height of the air guide structure is in the range between half the height of the forced air flow generator and twice the height of the forced air flow generator.

The invention is explained in detail in the following exemplary embodiments based on the accompanying drawings. It should be understood that the present invention is not limited to these embodiments.

1 is a perspective view of a heat sink.
FIG. 2 is a perspective view of the heat sink of FIG. 1 seen in the opposite direction. FIG.
3 is a side view of the heat sink of FIG.
4 is a plan view of the heat sink of FIG.
5 is a cross-sectional view showing a first embodiment of a lighting device including the heat sink of FIG.
6 is another cross-sectional view of the first embodiment of the lighting apparatus of FIG. 5.
FIG. 7 is another cross-sectional view of the first embodiment of the lighting apparatus of FIG. 5. FIG.
8 is a horizontal cross-sectional view of the lighting apparatus of FIG.
9 is a partially enlarged view of FIG. 8;
10 is a cross-sectional view showing a second embodiment of the lighting apparatus including the heat sink of FIG.
Figure 11 is a bottom view showing the shape of the cooling fins.
Figure 12 is a bottom view showing another shape of the cooling fins seen from the bottom.
13 is a sectional view of a third embodiment of a lighting apparatus.
14 is an explanatory view showing a dimensional relationship relating to the lighting apparatus of FIG.
15 is a partially enlarged cross-sectional view of the lighting apparatus of FIG.

1 to 4 show a heat sink 1 having cooling characteristics, lighting characteristics, mechanical fixing characteristics, and air guiding characteristics. This heat sink comprises a cup cavity 2 composed of each cavity wall (heat sink body) 3, namely a bottom wall 13 and a circumferential side wall 6.

For effective cooling characteristics, the heat sink 1 is connected to the outside of the cavity wall 3, i.e., to the outside of the bottom wall 13 and the side wall 6 and vertically aligned with a plurality of fins (wings) ( 4). These fins 4 are connected to the wall in a rotationally symmetrical fashion with respect to the longitudinal axis A of the heat sink 1. Each gap between adjacent fins 4 forms a respective airflow channel 26. The upper portion (relative to the longitudinal axis A) of the pin 4 is covered with a circumferential protrusion (outer edge) 5. The pin 4 fills the cup-like space which makes good use of the effective space. The thickness of the fins 4 and the gaps / distances / channel widths between the fins 4 are compromised between the heat spreading capacity and the useful cooling surface as will be described in detail later.

Under the bottom of the cavity wall 3 at the bottom, a common heatsink base having a bottom area (heatsink center) 12 which does not touch and the fins 4 protrude downward from the bottom of the cavity 2 and are not extinguished. Are all connected to (11). The base 11 has a pyramid cross-sectional shape that enables rapid diffusion of heat to the active fin region side and smooth flow of air forced to the channel side, thereby preventing unnecessary generation of turbulence and reducing noise. . The width, thickness and center area are compromised between the diffusion of heat and the rapid transfer of heat to the cooling surface (pin 4).

From the heatsink base 11, the fins 4 and the airflow channel 26 therebetween allow efficient air cooling for active cooling and smooth air guidance to minimize noise. It extends continuously along the cavity side wall 6 (heat sink body) to the air outlet 27 of the side part. In other words, the air flow channel 26 is a smoothly curved channel for directing air toward the side outlet 27 so that lateral radial discharge of hot air can be made to prevent hot air from flowing in the light emitting direction. It is configured in the form of Therefore, the rotationally symmetric air outlet 27 minimizes the flow of hot air by recognizing the flow rate with respect to the solid angle, and noise is alleviated despite active cooling. For the same effect, the expansion of the airflow channel 26 made by the step 9 at the outer edge of the fin 4 is provided for the transfer of low pressure through the optional case grid. The material of the fin 4 is chosen such that a rapid spread of heat towards this fin 4 can be achieved.

The cavity sidewall 6 also acts as a thermal diffusion layer to overcome the disconnection of channels by mounting structures such as the two connector cutouts 10 and the mounting column 8 shown. At least the thickness of the cavity side wall 6 is a compromise between the thermal diffusion capacity and the width of the air flow channel, ie the cooling surface.

With regard to the illumination characteristics, at least one light source, for example one or more LED submounts or LED modules, can be inserted into the bottom portion 13 of the cavity 2. The choice of thickness and material of the submount trades off between cost and performance. In order to allow good heat diffusion from the LED submount, the thermal conductivity of the substrate 15 is at least as high as the thermal conductivity of the material of the heat sink 1.

It is preferable that the coefficient? Of the thermal conductivity of the substrate of the submount / LED module be higher than 250 W / (m? K), for example, by using Cu or a Cu alloy as the material. The coefficient? Of the thermal conductivity of the heat sink wall 3 is preferably between 150 W / (m? K) and 240 W / (m? K), for example, by using Al or Mg or an alloy thereof as the material. This combination is also relatively inexpensive with limited use of copper. Of course, other materials, in particular other metals or thermally conductive ceramics such as AlN with typical λ between 180 W / (m? K) and 190 W / (m? K), can be used. Among them, depending on the environment, the effective space and the amount of heat to be dispersed, at least the cavity wall 3 (or at the other side of the through hole of the heat sink 1) may preferably be a good conductive material such as a metal and the coefficient λ is stainless Like steel, at least about 15 W / (m? K), especially about 100 W / (m? K), preferably between 150 W / (m? K) and 450 W / (m? K) Is between 150 W / (m? K) and 250 W / (m? K).

In addition, if the LED die is to be placed directly on top of only one submount, the submount must be electrically isolated and a material of thermal conductivity less than 240 W / (m? K) is preferred for this purpose. In addition, the electrical isolation of the LED die must be ensured for independent operation. To this end, an LED package or LED die acting as an electrical insulator is placed on an electrically isolated first submount of a material, such as AlN, in the range of 180 W / (m? K) as high as possible. It must be deployed. This LED assembly is then placed in the second submount. Integrating the second submount between the LED assembly and the heatsink 1 trades off between cooling performance and material cost.

Power lines and signal lines of the LED submount are guided through the connector cutout 10. The cavity sidewall 6 corresponding to the inner side at least partially acts as a reflector and the reflecting region is a material comprising, for example, polished or painted or polished or painted according to mirror reflection or scattering reflectivity or the like. This can be deposited. In addition, the cavity side wall 6 includes a receiving means for fixing the optical element as will be described in detail later. The cavity side wall 6 has a cup-shaped shape for the best use of the effective space.

With regard to the mechanical fixing characteristics, the heat sink 1 also has three mounting columns 8 for fixing it to the lighting device, as will be explained in detail later. These mounting columns 8 are not arranged symmetrically about the axis A.

Regarding the air guiding characteristic, the heat sink 1 also includes air guiding means for directing the flow of air to another component, for example, the driver substrate.

In general, it is advantageous, but not necessary, that the heat sink 1 be constructed in one piece, for example in one piece.

FIG. 5 shows an illumination device 14 comprising the heat sink 1 of FIGS. 1 to 4 in a housing 28.

With regard to the lighting characteristics, the lighting device 14 also comprises luminaires consisting of one LED submount comprising a substrate 15 supporting a plurality of light emitting diode LEDs 16 in the cavity 2. , The LED submounts 15, 16 are mounted on the bottom portion 13 of the cavity 2. The luminaire also comprises a top cover of the cavity 2 consisting of a Fresnel lens 17 and a micro lens array 18 thereon. The cavity sidewall 6, i.e., the inner surface of the side of the cavity wall 3, acts as a reflector for reflecting the light rays emitted from the LED-chip 16 and thereby the light rays passing through the lenses 17, 18. Enhances the amount. The reflector is not self-supporting or a separate structure but part of the multifunction heat sink 1.

Regarding the cooling characteristic, the housing 28 includes a side exhaust 19 near the upper region (outlet region) of the fin 4 in the circumferential direction. In the illustrated embodiment, the housing 28 does not have a great influence on the air flow in the heat sink 1 and likewise does not have a great influence on the lighting device 14.

Under the heat sink 1 is arranged a hydrodynamic zone or an air guide structure 20 for separating a forced air flow generator, for example a fan, from the heat sink 1. In the case of the present invention, the air guide structure 20 is composed of an open space. The air guide structure 20 between the air flow generator and the heat sink base provides a space for allowing forced flow of air to ensure continuous air flow and the use of a sufficient output of the fan, as well as turbulence of air. The noise of the fan can be avoided. The side walls may have different shapes, for example straight tube or hourglass shapes for guiding cooling air to the heat sink channel side.

A printed circuit board (PCB) is disposed on the side with respect to the air guide structure 20 and the air flow generator 21. The printed circuit board controls the operation of the lighting device 14 such as, for example, an LED driver and a fan driver. Electrical and mechanical components are arranged. The PCB 23 is disposed vertically on a circular / ring shaped support 24 supported by the housing 26. With regard to the mechanical fixation properties, the heat sink 1 (heat sink structure) secures and / or attaches the ring-shaped support 24 to the housing as described in detail below.

An air baffle 25 (optional) is disposed on the inclined outer circumference of the heat sink 1, that is, the inclined outer edge of the fin 4. With regard to the air guidance characteristics, this air baffle 25 forces the entire cooling air towards the air flow channel 26 for the best efficient light source cooling.

The housing 28 includes a circular inlet 22 under the fan 21, and only a part of the inlet is numbered in the drawings for the sake of simplicity.

FIG. 6 shows the illuminating device of FIG. 5, in which the air flow is indicated by arrow C, the heat sink base 11 is indicated by a thick hatched line, the fins 4 are outlined in dotted lines, and the cavity side wall 6 is shown. It was highlighted with a thick line.

During operation of the lighting device 14, the fan 21 sucks air through the lower inlet 22 so that air flows through the hydrodynamic zone / air guiding structure 20 within the housing 28. do. The air guide structure 20 causes most of the laminar flow of air to reach the bottom area of the heat sink 1. Here, air flows into the air flow channel side formed by each gap between the adjacent fins 4. At the bottom of the heat sink 1, air is laterally diverted due to the projected tapered cross-sectional shape of the heat sink base 11 which acts as an air guide element. And the air flows upward through the air flow channel until it is released to the outside through the exhaust port 19 and the outlet port 27 of the side, respectively. The upper end of the fin 4 is integrally formed with the rim 5 of the heat sink protruding laterally. The rotationally symmetric side outlets 27 and exhaust 19 have a compact structure, minimize the flow of significantly hot air in the luminous direction, and reduce the flow rate for solid angles to mitigate noise despite active cooling. To be possible. The air baffles 25 around the heatsink fins are simply optional, but they force the entire cooling air to flow through the heatsink channel for the best efficient light source cooling.

Without the air baffle 25, the proper cooling of the PCB is advantageously caused by the air leaking out of the airflow channel of the heat sink because of the air guidance characteristics.

The illustrated cooling structure is very efficient because the fins 4 are in good thermal contact with the LED submounts 15, 16. This is achieved by first connecting the fins 4 to the heatsink base 11 over a relatively long length while at the same time the base 11 efficiently transfers heat from the LED submounts 15 and 16 due to the relatively large volume. do. In addition, the cavity wall 3 exhibits good thermal diffusion characteristics as the fins 4 additionally bring significant heat load from this cavity wall 3. This is particularly useful in the case of the pin 94 in the region of the cutout 10, the depth of each fin and the resulting heat spreading ability is greatly reduced, but the fin 4 still contributes to heat transfer. In general, the size of the volume of the heat sink base 11 (e.g., its height, width and size) is balanced between the strong thermal diffusion characteristics made by the large thermal diffusion volume and the construction requirements of the low cost and light weight lighting device.

FIG. 7 shows the lighting device 14 of FIGS. 5 and 6 indicative of various sizes of exemplary structures. In particular, such a lighting device 14 is designed to use a light source having a power of 40 W + /-30% for the device 14 of 10-40 mm in diameter.

In the area of the optical element, the diameter L1 is about 40 mm at the bottom 13 of the cavity 2, the diameter L2 is about 100 mm at the top of the cavity 2, and the height h of the cavity wall 3 is about When it was 60 mm, it was confirmed to show very good lighting characteristics.

Further, when used for thermal reasons and not for other reasons, it was confirmed that the material of the submount / substrate 15 exhibited better thermal performance than the material used for the heat sink 1. It is advantageous that the width is at most L1, while its thickness (thickness along the longitudinal axis) is preferably in the range of 0.5 mm to 3 mm. An advantageous material for the thermal diffusion core is copper.

In the truncated conical heatsink base 11, the base upper width Lt is in the range of L1 < Lt &lt; 1.5 x L1, and the width Lc of the base center 12 is in the range of vertex &lt; Lc &lt; L1, and the base 11 The height Hb of was found to be advantageous in the range of 0.05 × L1 ≦ Hb ≦ 0.5 × L1.

FIG. 9, which is shown in detail with FIG. 8, shows a horizontal section between the bottom portion 13 of the cavity 2 and the exhaust port 19. In the fin 4 and the airflow channel 26 formed therebetween, the thickness F1 of the fin 4 is in the range of 0.1 mm ≦ F1 ≦ 3 mm, and the length F2 of the fin 4 is 5 mm ≦ F2 ≦ 40. It was found that it is in the range of mm, and the thickness C1 of the air flow channel 26 is advantageously in the range of 0.4 mm ≦ C1 ≦ 8 mm.

7 again, the total height Hc of the airflow channel 26 is in the range of Hb ≦ Hc ≦ h + Hb. The height He of the lateral air outlet 27 was found to be advantageously in the range of 0.1 x Hc &lt; He &lt; 0.6 x Hc.

The thickness Dw of the cavity wall 3 is preferably in the range of 0.5 mm ≦ Dw ≦ 10 mm.

The height Hg of the air guide structure is preferably in the range between half the height of the forced air flow generator, ie, the fan 21, and twice the height of the forced air flow generator.

The exact size depends on the effective space, the space requirements for the optical elements, the driver and the required contour, the total power, and the power density from the light source can vary accordingly.

FIG. 8 also shows the position of the LED submounts mounted on the substrate 15 on which five PCBs 23 and the LEDs 16 arranged symmetrically are arranged in the bottom portion 13. Power lines and signal lines connecting the submounts 15 and 16 through the connector cutout 10 are not shown.

As enlarged in FIG. 9, the pins may have different shapes. For example, the pin 4 may have a rectangular cross section, the pin 29 may be curved and tapered, or the pin 30 may be triangular in shape. It may also have other forms within the scope of the present invention.

FIG. 10 shows a lighting device 31 similar to that of FIG. 5 wherein the inner contour of the hydrodynamic zone / air guiding structure 32 is in the form of an hourglass, with the side wall 41 in the center (vertical z-direction). It is getting narrower.

11 and 12 show several basic curvatures of the fins as seen from the bottom, with the fins 4 extending laterally in a straight line from the heatsink base center 12 and the fins 33 being fractional. Extends. Of course, the size of the area of the heatsink base center 12 may vary and may be pointed and may not extend at all toward the bottom side of the fins 4, 33.

FIG. 13 shows a lighting device 34 similar to the cross section of FIG. 5 with only one mounting column 8. The illuminating device 34 of FIG. 13 has an air baffle and in that the reflective area of the heat sink 1 comprises a reflective layer 35 covering the cavity wall 3 except for the area containing the LED 16. It is slightly different from the lighting device 14 of 5. The form or function of the other components is the same.

The lighting device 34 is described through four zones divided by function from zone A to zone D which are introduced as structures and functions for other components of the lighting device 34, for example the fan 21. The concept of this zone is that the optical zone (zone A), the heat [conduction and convection] zone (zone B), the driver substrate 23 have other components [eg fan 21] and forced air development zones, ie initial Heat sinks containing many interrelated functions, such as air guidance zones (zone C) and areas containing mechanically external fixed areas (zone D) which contain other essential components for lighting devices such as driver boards (zone D) It is especially useful to explain the multifunction of 1). The heat sink 1 can be easily changed in size and integrated into the compact LED lighting system 34.

As schematically shown in FIG. 14, Zone A basically comprises a heat sink cavity 2 of trapezoidal cross-section, where L1 is centered on the light source 36 (eg, LED submount). L2 is the size of the final light emitting surface after the various optical layers 17 and 18 are aimed, and L3 is the length of the inner side heatsink sidewall 6 configured to be used as a light reflector. to be. Rt is a ratio of L2 / L1, typically in the range of 1.25 to 5, depending on the size of the light source 36 and the required heat sink dispersion area (in FIG. 14, Rt depends on the required radiation pattern and the maximum size of each lamp specification About 2).

Zone B has a structure of a thin metal plate heat sink 1 which allows the LED light source 36 to be disposed therein in Zone A and enables efficient heat dissipation (passive or active heat dissipation). Include. The thickness DL = F2 + Dw of the cavity sidewall 3 which is the side of the heat sink is designed according to the maximum area available for the fixed contour size and is structurally related to the size of the light source 36. Typically DL = L1 / n is maintained, where n is proportional to the wattage and size of the light source and typically lies in the range of 0.5, ..., 10. In the case of the high wattage LED light source 36, n should be in the low range. For example, as shown in FIG. 14, a power source (high output power source) of 40 W, L1 = 40 mm, and n = 2.7 is lower than the side of the side region of the heat sink 1 at the lower side of the step 9. Suitable DL is at least about 10 mm.

Zone C (see FIG. 13) is used as the air guide structures 20, 32 for the heat sink 1. The height of these air guide structures 20, 32 can be adjusted to set the laminarity (Reynolds number) of the air flow from the fan 21 toward the heat sink 1 side.

In Zone D, as shown in Fig. 15, the heat sink 1 is arranged with an additional coaxial plastic insulation member 37 at the free end (head portion) for external fixation, so that the PCB support 24 has little tolerance. It provides a mounting column (8) to achieve a stable installation of the driver substrate 23 by fixing so that mechanical absorption and electrical insulation can be made. This mounting column 8 can also be used to fix additional components (eg fan 21) for active heat dissipation. For this purpose, the fan 21, the plastic insulating member 37 and the mounting column 8 are all aligned with one another as shown and through holes 38 through which fixing elements such as bolts or screws can be inserted. , 39, 40). And it is preferable that the spiral is formed in the through-hole 40 of the mounting column (8).

Of course, the invention is not limited to the illustrated embodiment.

For example, light sources other than LEDs can be used. One or more submounts may be used. The base may have a different shape, for example a rectangular cross-sectional shape, for example depending on the airflow generator. In addition, the forced air flow generator may not be a fan, for example, may be composed of a vibration thin film. In addition, the air guide structure 20 may be composed of a structured air flow channel.

1: heatsink, 2: cavity, 3: cavity wall, 4: fins, 5; Rim, 6: cavity side wall, 8: mounting column, 9: step, 10: connector cutout, 11: heat sink base, 12: heat sink base center, 13: cavity bottom, 14: lighting device, 15: substrate, 16: LED, 17: Fresnel lens, 18: Micro lens array, 19: Exhaust port, 20: Air guide structure, 21: Forced air flow generator, 22: Intake port, 23: Printed circuit board, 24: Support body, 25: Air Baffle, 26: air flow channel, 27: air outlet, 28: housing, 29, 30: fin, 31: lighting device, 32: air guiding structure, 33: pin, 34: lighting device, 35: reflective layer, 36: light source , 37, plastic insulation member, 38, 39, 40: through hole, 41: side wall, L1: diameter of the bottom of the cavity, L2: diameter of the upper part of the cavity, h: height of the cavity wall, Lt: upper width of the heat sink, Lc: heat Sink base center width (top width), Hb: heat sink base height, F1: fin thickness, F2: fin length, C1: thickness of air flow channel, Hc: total height of air flow channel, He: air outletThis, Dw: the thickness of the cavity wall, Hg: height of the air guide structure.

Claims (15)

And a heat diffusion and dissipation structure (4) covering at least a portion of the exterior of the heat sink (1) including a light source region for mounting the light sources (15, 16) and a bottom region and a side region. A plurality of vertically aligned fins (4; 29; 30), the heat spreading and dissipating structure (4) comprising at least one airflow channel (26) extending from the bottom region to the side region, wherein the air An open cavity 2 in which a flow channel 26 is formed by a gap between adjacent fins 4; 29; 30 and includes side vents 19; 27, and the light source region is formed by the cavity wall 3. The cavity wall 3 includes a light source mounting region 13 capable of receiving at least one light source 15, 16, and the cavity wall 3 including the bottom wall 13. It is integrally connected to the outside of the (3), the heat sink 1 extends outward from the light source mounting region 13 and the cavity wall (3) The solid (solid) heat sink includes a base 11, the thermal diffusion and dissipation structure (4) is a heat sink, characterized by thermally fixed to the heat sink base 11 (1) projecting from the. The heat sink (1) according to claim 1, characterized in that the upper end of the heat diffusion and dissipation structure (4) is integrally formed with the edge (5) of the heat sink. The heat sink (1) according to claim 1, wherein the light source comprises an LED submount (15, 16). The method of claim 1, wherein
The circumferential distance C1 between two adjacent pins 4; 29; 30 is in the range of 0.4 mm ≦ C1 ≦ 8 mm,
The condition that the thickness F1 of the fins 4; 29; 30 is in the range of 0.1 mm ≦ F1 ≦ 3 mm, and
Heat sink (1), characterized in that at least one of the conditions is maintained such that the lateral length (F2) of the fins (4; 29; 30) is within the range of 5 mm &lt; = F2 &lt; Heat sink (1) according to claim 1, characterized in that the fin (4) has at least partially at least one of a rectangular cross section, a pointed cross-section having a pointed end, and a triangular cross section. . Heat sink (1) according to claim 1, characterized in that the fins (4; 29; 30) extend radially in a straight or conical pattern at the bottom (13) of the cavity wall (3). 2. The heat sink base (11) according to claim 1, wherein the heat sink base (11) has a tapered shape, the heat sink base is disposed in the light source mounting region (13), and the taper shape of the heat sink base (11) is a tapered shape of the cone. Heatsink (1). The method of claim 1, wherein
The height h of the cavity 2 ranges from 30 mm to 80 mm,
The width L1 of the bottom surface of the cavity 2 is in a range of 20 mm to 60 mm,
The width L2 of the upper part of the cavity 2 is in the range of 80 mm to 120 mm,
The ratio Rt between the width L2 of the upper part of the cavity and the width L1 of the bottom surface of the cavity 2 is 1.25 ≦ Rt ≦ 5,
The base width Lt of the heat sink base 11 is a condition in which L1 ≦ Lt ≦ 1.5 to L1,
The peak width Lc of the heat sink base 11 is a condition in which 0 ≦ Lc <L1,
The height Hb of the heat sink base 11 is in a range of 0.05 L1 < Hb &lt; 0.5 L1,
The height He of the side exhaust ports 19; 27 is in a range of 0.1? Hc? He? 0.6? Hc,
The overall height Hc of the fin 4 is in the range Hb ≤ Hc ≤ h + Hb, and
The thickness Dw of the cavity side wall 6 is characterized in that at least one of the conditions 0.5 mm ≦ Dw ≦ 10 mm is satisfied. The heat sink (1) according to claim 1, characterized in that the at least one air flow channel (26) has an air flow cross section extending at or near the side vents (19; 27). The apparatus of claim 1, further comprising at least one mounting column (8) for attaching the heat sink (1) to the lighting device, wherein the at least one mounting column (8) is adapted to secure at least one printed circuit board. Heat sink 1, characterized in that it is possible to. Lighting device (14; 34), characterized in that it comprises a heat sink (1) according to claim 1. 12. The air flow generator (21) according to claim 11, further comprising an air flow generator (21) capable of supplying air flow to the air flow channel (26), wherein the air flow generator (21) is capable of supplying air flow to the air flow channel (26). Lighting device 14, characterized in that the. 13. The air flow generator (21) of claim 12, wherein the air flow generator (21) is spaced from the heat sink (1) by the air guide structures (20; 32), and the air guide structures (20; 32) comprise an open space. Lighting device (14; 34) to be. The lighting device (14; 34) according to claim 13, characterized in that the open space has a straight tube-shaped basic shape or an hourglass shape. 15. The method according to any one of claims 11 to 14, wherein the height (Hg) of the air guide structures (20; 32) is between half the height of the air flow generator (21) and twice the height of the air flow generator (21). Lighting device (14; 34) characterized in that the range.

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