KR20110005131U - LED lamp improved assembly and maintenance properties - Google Patents

LED lamp improved assembly and maintenance properties Download PDF

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Publication number
KR20110005131U
KR20110005131U KR2020090014925U KR20090014925U KR20110005131U KR 20110005131 U KR20110005131 U KR 20110005131U KR 2020090014925 U KR2020090014925 U KR 2020090014925U KR 20090014925 U KR20090014925 U KR 20090014925U KR 20110005131 U KR20110005131 U KR 20110005131U
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main body
led
led lamp
substrate
led substrate
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KR2020090014925U
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Korean (ko)
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오창민
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(주) 코콤
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • F21V5/045—Refractors for light sources of lens shape the lens having discontinuous faces, e.g. Fresnel lenses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/007—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing
    • F21V23/009—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing the casing being inside the housing of the lighting device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

본 고안은 백열전구용 전원공급소켓에 그대로 꽂아서 쓸 수 있고, 또한 부품 간 분해조립도 용이하게 실시될 수 있는, 조립 및 메인터넌스 특성이 향상된 엘이디 램프에 관한 것이다.The present invention relates to an LED lamp with improved assembly and maintenance characteristics, which can be plugged into a power supply socket for an incandescent bulb and can be easily disassembled and assembled between components.

본 고안에 따른 조립 및 메인터넌스 특성이 향상된 엘이디 램프는, 복수의 냉각핀(11)이 둘레벽에 형성되고, 둘레벽에 의해 경계가 정해지는 내부공간을 가로질러 횡단판(14)이 설치되며, 둘레벽의 상단측에 테두리부(12)가 형성되고, 테두리부의 적어도 두 곳 이상에 고정홈부(13)가 형성된 본체(10) ; 복수의 엘이디(21)가 배치된 형태로, 본체의 횡단판 위에 얹혀져 고정되는 엘이디 기판(20) ; 엘이디 기판과의 전기접속(電氣接續)을 위해 엘이디 기판 밑에 배치되는 ＳＭＰＳ 기판(30) ; 본체 내에 삽입되는 지지벽(41)과 베이스 체결용 나사부(42)가 구비된 접속구(40) ; 접속구의 나사부에 결합되는 베이스(50) ; 및 본체의 고정홈부에 나사고정되는 아이릿(61)이 고정홈부와 동일 개수만큼 가장자리면(面)으로부터 돌출된 투광렌즈(60) 를 포함하여 구성된 것을 특징으로 한다.In the LED lamp having improved assembly and maintenance characteristics according to the present invention, a plurality of cooling fins 11 are formed in the circumferential wall, and a cross plate 14 is installed across the inner space defined by the circumferential wall. A main body 10 having an edge portion 12 formed on an upper end side of the circumferential wall, and a fixing groove 13 formed on at least two places of the edge portion; An LED substrate 20 in which a plurality of LEDs 21 are arranged, mounted on and fixed on a cross plate of a main body; An SSM substrate 30 disposed below the LED substrate for electrical connection with the LED substrate; A connector 40 having a support wall 41 and a base fastening screw portion 42 inserted into the main body; A base 50 coupled to the threaded portion of the connector; And a transmissive lens 60 protruding from an edge surface by the same number of fixing eyelets as the fixing grooves of the main body.

엘이디 램프, 조립성, 유지보수성, 비용절감 LED lamp, assembly, maintenance, cost reduction

Description

조립 및 메인터넌스 특성이 향상된 엘이디 램프{LED lamp improved assembly and maintenance properties}LED lamp improved assembly and maintenance properties

본 고안은 발광다이오드(Light-emitting diode)를 광원으로 하는 백열전구형 엘이디 램프에 관한 것으로서, 백열전구용 전원공급소켓에 그대로 꽂아서 쓸 수 있고, 부품 간 분해조립도 용이하게 실시될 수 있는, 조립 및 메인터넌스 특성이 향상된 엘이디 램프에 관한 것이다.The present invention relates to an incandescent lamp type LED lamp using a light-emitting diode as a light source, and can be plugged into a power supply socket for an incandescent lamp as it is, and can be easily disassembled and assembled between parts, and can be easily assembled and maintained. The present invention relates to an LED lamp having improved characteristics.

백열전구와 같은 재래식 조명기구 대신 사용되고 있는 엘이디 램프는, 재래식 조명기구에 비해 크기가 작고, 사용수명이 길며, 에너지효율이 높아 전력소모가 적고, 스위치 응답특성이 빠르다는 장점이 있다.LED lamps, which are used instead of conventional luminaires such as incandescent lamps, have advantages in that they are smaller in size, longer in service life, high in energy efficiency, low in power consumption, and fast in switch response.

첨부된 도 3은 종래 엘이디 램프의 일 실시예를 나타낸 것으로서, 공개특허 제10-2009-0082998호에 개시되어 있는 백열전구형 엘이디 램프를 나타낸 분해 사시도이다. 도면에 도시된 바와 같이, 종래 구성의 백열전구형 엘이디 램프는, 백열전구용 전원공급소켓에 결합되는 베이스(100)와, 복수의 엘이디가 배치된 엘이디 기판(200)과, 엘이디 기판에 전원을 공급하는 전원공급수단(300)과, 엘이디 기판에서 발생한 열을 외부로 방열하기 위해 복수의 냉각핀이 형성된 본체(400)와, 엘이디 기판으로부터 열을 흡수하여 본체에 전달하는 전열판(500)과, 엘이디에서 방출된 광(光)을 광조사방향으로 확대하여 투사하는 투광렌즈(600)로 구성되어 있다.3 is an exploded perspective view illustrating an incandescent lamp type LED lamp disclosed in Korean Patent Laid-Open Publication No. 10-2009-0082998 as one embodiment of a conventional LED lamp. As shown in the figure, the conventional incandescent lamp-type LED lamp, the base 100 coupled to the power supply socket for incandescent lamps, the LED substrate 200 is arranged a plurality of LEDs, and supplies power to the LED substrate Power supply means 300, the main body 400 is formed with a plurality of cooling fins to radiate heat generated from the LED substrate to the outside, the heat transfer plate 500 for absorbing heat from the LED substrate to transfer to the main body, It consists of a transmissive lens 600 for projecting the emitted light is enlarged in the light irradiation direction.

그러나 상기 구성의 엘이디 램프는, 전열판(500)의 양측 가장자리에 형성된 관통구멍(510)과 엘이디 기판의 양측 가장자리에 형성된 관통구멍(210)(220)과 투광렌즈(600)의 가장자리 양측에 천공된 체결구멍(610)(620) 모두가 본체(400) 전면측에 형성되어 있는 횡단판 양측의 돌출부(410)의 나사구멍에 일렬로 맞춰진 상태에서 나사고정되므로 부품 간 조립속도가 떨어지는 단점이 있다. 또한, 체결구멍의 중심에서부터 투광렌즈의 가장자리면(端面)까지 거리가 가까운 경우, 나사체결과정에서 생기는 체결구멍 속의 긁힘이 주변으로 전파되어 투광렌즈의 가장자리가 부분적으로 떨어져 나갈 수 있다. 그에 반해, 체결구멍과 투광렌즈의 단면 사이 거리가 먼 경우, 엘이디 기판에 형성되는 관통구멍(210)(220)의 위치가 기판 중심에 가깝게 되므로, 엘이디 기판상에 배치할 수 있는 엘이디의 개수는 줄어들 수밖에 없어 엘이디 램프의 조도나 휘도가 낮아지게 된다.However, the LED lamp of the above configuration is perforated on both sides of the through holes 510 formed at both edges of the heat transfer plate 500 and through holes 210 and 220 formed at both edges of the LED substrate and the transmissive lens 600. All of the fastening holes 610 and 620 are screwed in a state in which the fastening holes 610 and 620 are aligned in line with the screw holes of the protrusions 410 on both sides of the transverse plate formed on the front side of the main body 400. In addition, when the distance from the center of the fastening hole to the edge surface of the light transmitting lens is close, the scratches in the fastening hole generated by the screw body result in propagation to the surroundings, so that the edge of the light transmitting lens may partially fall off. On the other hand, when the distance between the fastening hole and the end face of the light transmitting lens is far, the position of the through holes 210 and 220 formed in the LED substrate is close to the center of the substrate, so that the number of LEDs that can be placed on the LED substrate is Inevitably, the brightness and brightness of the LED lamp will be reduced.

본 고안은 상술한 종래 문제점을 해결하기 위해 안출된 것으로서, 엘이디 기판과 ＳＭＰＳ 기판이 내장되는 본체 및 상기 본체의 전면측에 장착하는 투광렌즈의 구조를 둘 다 개량함으로써, 투광렌즈와 본체 사이의 분해조립이 용이하게 실시됨은 물론, 백열전구용 전원공급소켓에 그대로 장착해도 사용 가능한, 조립 및 메인터넌스 특성이 향상된 엘이디 램프를 제공함에 목적이 있다.The present invention has been made to solve the above-mentioned conventional problems, by improving both the structure of the LED substrate and the SMPS substrate is built-in and the light transmitting lens mounted on the front side of the main body, the separation between the light transmitting lens and the main body It is an object of the present invention to provide an LED lamp having improved assembly and maintenance characteristics, which can be easily assembled, and can be used as it is when mounted on a power supply socket for an incandescent lamp.

본 고안에 따른 조립 및 메인터넌스 특성이 향상된 엘이디 램프는, 복수의 냉각핀이 둘레벽에 형성되고, 둘레벽에 의해 경계가 정해지는 내부공간을 가로질러 횡단판이 설치되며, 둘레벽의 상단측에 테두리부가 형성되고, 테두리부의 적어도 두 곳 이상에 고정홈부가 형성된 본체 와; 복수의 엘이디가 배치된 형태로, 본체의 횡단판 위에 얹혀져 고정되는 엘이디 기판 과; 엘이디 기판과의 전기접속을 위해 엘이디 기판 밑에 배치되는 ＳＭＰＳ 기판 과; 본체 내에 삽입되는 지지벽 및 베이스 체결용 나사부가 구비된 접속구 와; 접속구의 나사부에 결합되는 베이스 ; 및 본체의 고정홈부에 나사고정되는 아이릿이 고정홈부와 동일 개수만큼 가장자리면으로부터 돌출되어 있는 투광렌즈 를 포함하여 구성된 것을 특징으로 한다.In the LED lamp having improved assembly and maintenance characteristics according to the present invention, a plurality of cooling fins are formed in the circumferential wall, and a transverse plate is installed across the inner space defined by the circumferential wall. A main body having an additional portion formed therein and having a fixing groove portion formed in at least two places of the edge portion; An LED substrate on which a plurality of LEDs are arranged, mounted and fixed on a cross plate of the main body; SMPS substrate disposed under the LED substrate for electrical connection between the LED substrate; A connection port provided with a supporting wall and a base fastening screw inserted into the main body; A base coupled to the threaded portion of the connector; And a light transmitting lens protruding from the edge surface by the same number of fixing eyelets as the fixing grooves of the main body.

여기서, 상기 투광렌즈는, 엘이디에서 방출되는 광(光)을 광조사방향으로 확대하여 투사할 수 있도록, 엘이디 기판과의 대향면에, 복수의 광확산부가 더 형성되어 있는 것이 바람직하다.Here, it is preferable that the light-transmitting lens further includes a plurality of light diffusing parts formed on the opposite surface to the LED substrate so that the light emitted from the LED can be enlarged and projected in the light irradiation direction.

본 고안에 따른 조립 및 메인터넌스 특성이 향상된 엘이디 램프는, 투광렌즈에서 흠집이나 결함이 발견된 경우라든지, 엘이디 기판이나 ＳＭＰＳ 기판이 제대로 작동하지 않는 경우라든지, 또는 그 외 부품들에서 하자가 발견된 경우에, 끼워 맞추기나 나사체결 방식으로 조립되어 부품들을 손쉽게 분해하여 새 부품으로 교체할 수 있다. 그 결과, 종래 구성의 엘이디 램프보다 부품 간 분해조립이 신속하게 이루어질 수 있으므로, 제품의 생산효율이 향상되며, 제조원가가 절감될 수 있다.The LED lamp with improved assembly and maintenance characteristics according to the present invention is a case where scratches or defects are found in the transmissive lens, an LED substrate or an SSM substrate is not functioning properly, or a defect is found in other components. Assembled, fitted or screwed in, the parts can be easily disassembled and replaced with new parts. As a result, since the disassembly and assembly between parts can be made faster than the LED lamp of the conventional configuration, the production efficiency of the product can be improved, and the manufacturing cost can be reduced.

또한, 본 고안에 따른 엘이디 램프는, 투광렌즈의 가장자리면에 돌출되어 있는 복수의 아이릿이 각(各) 고정홈부에 얹혀져 나사고정되는 형태이므로, 투광렌즈의 제조시, 필요에 따라, 아이릿의 두께(예컨대, 체결나사가 끼워지는 구멍 주위의 소재 두께)를 적절히 조절할 수 있다. 아이릿의 두께 조절로 인해 투광렌즈의 성능이나 특성에 해가 가해지지는 않으므로, 종래 구성의 투광렌즈(600)가 갖고 있던 문제점들이 방지될 수 있다. 그 결과, 본 고안에 따른 엘이디 램프는, 종래 구성의 엘이디 램프에 비해 성능과 품질이 우수하다.In addition, since the LED lamp according to the present invention is a form in which a plurality of eyelets protruding from the edge surface of the light transmitting lens is mounted on the angular fixing groove and screwed, the eyelets may be necessary when manufacturing the light transmitting lens. Can be appropriately adjusted (for example, the thickness of the material around the hole where the fastening screw is fitted). Due to the thickness adjustment of the eyelet, the performance or characteristics of the light transmitting lens are not harmed, and thus problems of the light transmitting lens 600 of the conventional configuration can be prevented. As a result, the LED lamp according to the present invention is superior in performance and quality compared to the LED lamp of the conventional configuration.

이하, 본 고안에 따른 조립 및 메인터넌스 특성이 향상된 엘이디 램프의 특징과 이점은, 첨부도면에 의거한 다음과 같은 상세한 설명에 의해서 더욱 명백해질 것이다. 여기서 본 고안의 기술 내용과 청구범위에 사용된 용어는, 본 고안의 기술사상에 부합하는 의미와 개념으로 해석되어야 한다. 따라서 본 고안이 후술하는 실시예로 한정되지는 않는다.Hereinafter, the features and advantages of the LED lamp with improved assembly and maintenance characteristics according to the present invention will be more apparent by the following detailed description based on the accompanying drawings. Herein, terms used in the technical contents and claims of the present invention should be interpreted as meanings and concepts corresponding to the technical idea of the present invention. Therefore, the present invention is not limited to the embodiments described below.

먼저, 도면과 관련하여, 첨부된 도 1은 본 고안의 일 실시예에 따른 백열전구형 엘이디 램프가 분해된 상태에서의 개략 사시도를 나타낸 것이고, 도 2는 도 1에 나타낸 엘이디 램프가 조립된 상태에서의 개략 단면도를 도시한 것이다.First, with reference to the accompanying drawings, Figure 1 is a schematic perspective view showing a disassembled incandescent lamp type LED lamp according to an embodiment of the present invention, Figure 2 is a state in which the LED lamp shown in Figure 1 assembled A schematic cross section of the is shown.

이들 도면에 나타낸 바와 같이, 본 실시예에 따른 백열전구형의 엘이디 램프는, 알루미늄 재질의 본체(10)와, 복수의 엘이디(21)가 배치된 엘이디 기판(20)과, 합성수지제의 투광렌즈(60)와, 각종 전기소자가 배치된 ＳＭＰＳ 기판(30)과, 합성수지제의 접속구(40)와, 금속제의 베이스(50)로 구성되어 있다.As shown in these drawings, the incandescent lamp type LED lamp according to the present embodiment includes an aluminum main body 10, an LED substrate 20 on which a plurality of LEDs 21 are disposed, and a transparent lens made of synthetic resin. 60, an SPM substrate 30 on which various electric elements are arranged, a connector 40 made of synthetic resin, and a metal base 50.

도 1에서 명백히 알 수 있는 것처럼, 상술한 부품들은 끼워 맞추기나 나사고정 방식에 의해 서로 조립되어 있으므로, 하자 있는 부품은 즉시 새것으로 교체할 수 있다. 여기서, 각(各) 부품에 대해, 더 자세히 살펴보면, 다음과 같다.As can be clearly seen in Fig. 1, the above-mentioned parts are assembled with each other by fitting or screwing, so that defective parts can be immediately replaced with new ones. Here, each component will be described in more detail as follows.

우선, 본 실시예에 따른 본체(10)는, 공기와 접촉하여 열을 방출하는 방열면적이 넓어지도록 복수의 냉각핀(11)이 둘레벽에 일체로 형성되어 있으며, 소재로는 열전도성이 우수한 알루미늄이 사용되었다. 둘레벽에 의해 경계가 정해지는 내부공간에는, 도 2에 도시된 것처럼, 내부공간을 가로막는 형태로 횡단판(14)이 설치되어 있으며, 이 횡단판(14)의 중앙에 배선구멍(15)이 천공되어 있다. 또한, 둘레벽의 상단에 테두리부(12)가 형성되어 있고, 이 테두리부(12)의 적어도 두 곳 이상에 고정홈부(13)가 형성되어 있다. 본 실시예의 경우, 상기 테두리부(12)는 링 형태로 성형되어 있으며, 테두리부(12)의 세 곳에 고정홈부(13)가 형성되어 있다. 이 고정홈부는 테두리부(12)의 상단면으로부터 일정 깊이만큼 들어가 있는 형태로 형성되어 있으며, 나사결합용 체결구멍이 가공되어 있다.First, in the main body 10 according to the present embodiment, a plurality of cooling fins 11 are integrally formed on the circumferential wall so that the heat dissipation area for dissipating heat in contact with air is widened, and the material has excellent thermal conductivity. Aluminum was used. In the inner space defined by the circumferential wall, as shown in FIG. 2, a cross plate 14 is provided in a form that obstructs the inner space, and a wiring hole 15 is formed at the center of the cross plate 14. Perforated Moreover, the edge part 12 is formed in the upper end of the circumferential wall, and the fixing groove part 13 is formed in at least two places of this edge part 12. As shown in FIG. In the present embodiment, the edge portion 12 is formed in a ring shape, the fixing groove 13 is formed in three places of the edge portion 12. The fixing groove portion is formed in a shape that enters a predetermined depth from the upper end surface of the edge portion 12, and a screwing fastening hole is machined.

다음으로, 횡단판 위에 얹혀지는 엘이디 기판(20)은, 횡단판(14)과 분해조립이 가능하도록 나사로 고정되어 있거나, 전기절연성의 양면테이프를 끼워 접착되어 있으며, 중앙부분에 배선구멍(22)이 천공되어 있다.Next, the LED substrate 20 mounted on the cross plate is fixed with screws so as to be disassembled and assembled with the cross plate 14, or is bonded with an electrically insulating double-sided tape, and the wiring hole 22 is formed at the center portion thereof. It is perforated.

다음으로, 횡단판(14)의 아래에 배치되는 ＳＭＰＳ 기판(30)은, 상기 배선구멍(15)(22) 안으로 끼워넣은 전선(도면에 나타내지 않음)에 의해, 엘이디 기판(20)과 전기접속된다.Next, the SML substrate 30 disposed below the cross plate 14 is electrically connected to the LED substrate 20 by wires (not shown) inserted into the wiring holes 15 and 22. do.

다음으로, ＳＭＰＳ 기판의 하부가 수용될 수 있는 중공형 접속구(40)는, 본체(10)의 하부 내측으로 끼워지는 지지벽(41)과, 베이스 체결용 나사부(42)를 각각 구비하고 있는데, 본 실시예의 경우에는 상기 지지벽(41)이 2부분으로 나뉘어져 있다. 이 구조에 의하면, 지지벽(41)이 본체(10) 안으로 쉽게 끼워질 수 있다.Next, the hollow connector 40, which can accommodate the lower portion of the SMP substrate, includes a support wall 41 and a base fastening screw portion 42 fitted into the lower inner portion of the main body 10, respectively. In the present embodiment, the support wall 41 is divided into two parts. According to this structure, the support wall 41 can be easily fitted into the main body 10.

다음으로, 상기 접속구의 나사부(42)에 결합되는 금속제 베이스(50)는, 종래 백열전구용 전원공급소켓에 그대로 장착될 수 있도록, 기존의 백열전구용 베이스와 동일한 규격으로 제작되어 있다.Next, the metal base 50 coupled to the threaded portion 42 of the connector is manufactured to the same standard as the conventional incandescent lamp base so that it can be mounted as it is in the conventional incandescent lamp power supply socket.

다음으로, 본체(10) 전면측에 장착되는 투광렌즈(60)는, 상기 본체의 고정홈부에 나사고정되는 복수의 아이릿(61)이 상기 고정홈부(13)의 개수만큼 투광렌즈의 가장자리면(面)으로부터 돌출되어 있다. 또한, 엘이디 기판(20)상에 배치되어 있는 복수의 엘이디(21)로부터 방출된 광(光)이 광조사방향으로 확대되어 투사될 수 있도록, 엘이디 기판(20)과 마주하는 대향면에, 내부가 비어 있는 반구형(半球形) 형태나 반타원형 형태의 광확산부(62)가 여러 개 형성되어 있다.Next, the transmissive lens 60 mounted on the front side of the main body 10 includes a plurality of eyelets 61 screwed to the fixed groove of the main body by the number of the fixing groove 13 to the edge surface of the transmissive lens. It protrudes from a surface. In addition, the light emitted from the plurality of LEDs 21 disposed on the LED substrate 20 can be enlarged and projected in the light irradiation direction so as to face the LED substrate 20 on the opposite surface. Several light-diffusion portions 62 are formed in the shape of a hollow hemispherical shape or a semi-elliptic shape.

도 1은 본 고안의 일 실시예에 따른 백열전구 타입 엘이디 램프가 분해된 상태의 개략 사시도.Figure 1 is a schematic perspective view of the disassembled incandescent lamp type LED lamp according to an embodiment of the present invention.

도 2는 도 1에 나타낸 엘이디 램프가 조립된 상태의 개략 단면도.FIG. 2 is a schematic cross-sectional view of the assembled state of the LED lamp shown in FIG.

도 3은 종래 엘이디 램프의 일 예를 나타낸 분해 사시도.Figure 3 is an exploded perspective view showing an example of a conventional LED lamp.

[도면의 주요 부분에 대한 부호의 설명][Description of Symbols for Main Parts of Drawing]

10...본체10 ... body

11...냉각핀11 ... cooling fin

12...테두리부12 ... Border

13...고정홈부13. Fixed groove

14...횡단판14 ... crossing board

15...배선구멍15.wiring hole

20...엘이디 기판20 ... LED board

21...엘이디21 ... LED

22...배선구멍22.Wire hole

30...ＳＭＰＳ 기판30 ... SMPS substrate

40...접속구40 ... Connection

41...지지벽41.Support Wall

42...나사부42.Thread

50...베이스50 ... Bass

60...투광렌즈60 ... Transmission Lens

61...아이릿61 Eyelets

62...광확산부62 ... light diffusion unit

Claims (2)

복수의 냉각핀(11)이 둘레벽에 형성되고, 둘레벽에 의해 경계가 정해지는 내부공간을 가로질러 횡단판(14)이 설치되며, 둘레벽의 상단측에 테두리부(12)가 형성되고, 테두리부(12)의 적어도 두 곳 이상에 고정홈부(13)가 형성된 본체(10)와;A plurality of cooling fins 11 are formed on the circumferential wall, the transverse plate 14 is installed across the inner space defined by the circumferential wall, and the edge portion 12 is formed on the upper side of the circumferential wall. A main body 10 having a fixing groove 13 formed in at least two places of the edge portion 12; 복수의 엘이디(21)가 배치된 형태로, 본체의 횡단판(14) 위에 얹혀져 고정되는 엘이디 기판(20)과;A plurality of LEDs 21 are arranged, the LED substrate 20 is fixed on the cross plate 14 of the main body; 상기 엘이디 기판(20)과의 전기접속을 위해 상기 엘이디 기판(20) 밑에 배치되는 ＳＭＰＳ 기판(30)과;An SSM substrate (30) disposed under the LED substrate (20) for electrical connection with the LED substrate (20); 상기 본체(10) 내에 삽입되는 지지벽(41) 및 베이스 체결용 나사부(42)가 구비된 접속구(40)와;A connector 40 having a support wall 41 and a base fastening screw portion 42 inserted into the main body 10; 상기 접속구의 나사부(42)에 결합되는 베이스(50); 및A base 50 coupled to the threaded portion 42 of the connector; And 상기 본체(10)의 고정홈부(13)에 나사고정되는 아이릿(61)이 상기 고정홈부와 동일 개수만큼 가장자리면으로부터 돌출되어 있는 투광렌즈(60);A light transmitting lens 60 in which eyelets 61 screwed into the fixing groove 13 of the main body 10 protrude from the edge surface by the same number as the fixing groove; 를 포함하여 구성된 것을 특징으로 하는 조립 및 메인터넌스 특성이 향상된 엘이디 램프.LED lamp with improved assembly and maintenance characteristics, characterized in that configured to include. 제1항에 있어서,The method of claim 1, 상기 투광렌즈(60)는,The light transmitting lens 60, 상기 엘이디 기판(20)과의 대향면에, 상기 엘이디(21)에서 방출되는 광을 광 조사방향으로 확대하여 투사하는 복수의 광확산부(62)가 더 형성된 것을 특징으로 하는 조립 및 메인터넌스 특성이 향상된 엘이디 램프.The assembly and maintenance characteristics of the LED substrate 20 are further provided with a plurality of light diffusing parts 62 which enlarge and project the light emitted from the LED 21 in the light irradiation direction. Improved LED lamps.
KR2020090014925U 2009-11-18 2009-11-18 LED lamp improved assembly and maintenance properties KR20110005131U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8979325B2 (en) 2012-03-14 2015-03-17 Samsung Electronics Co., Ltd. Lens and bulb-type light emitting device lamp employing the lens

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8979325B2 (en) 2012-03-14 2015-03-17 Samsung Electronics Co., Ltd. Lens and bulb-type light emitting device lamp employing the lens

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