CN102235610A

CN102235610A - LED (light emitting diode) ball bulb

Info

Publication number: CN102235610A
Application number: CN2011102335538A
Authority: CN
Inventors: 彭雯
Original assignee: Individual
Current assignee: Individual
Priority date: 2011-08-16
Filing date: 2011-08-16
Publication date: 2011-11-09

Abstract

The invention discloses an LED (light emitting diode) ball bulb which comprises a power supply part, an LED chip and a base plate which bears the LED chip, and a heat radiation component is installed at the back of the base plate. The ball bulb is characterized in that the heat radiation component is a hollow cylinder body with two open ends; the inner side surface of the cylinder body is provided with heat radiation fins; and the base plate is arranged on the outer wall of the cylinder body. The LED ball bulb has the advantages of good heat radiation and long service life.

Description

LED ball bubble

Technical field

The present invention relates to LED lighting and manufacture method thereof, especially a kind of LED makes the great power LED ball bubble of illuminator.

Background technology

The high-power ball bubble of existing LED, the lamp pearls of adopting high-power LED chips to make make illuminator and are attached on the wiring board that pcb board makes with heat-conducting glue more, again it is bonded on the heat radiation heat transfer aluminum hull radiator with heat-conducting glue, again itself and PC are covered seamless fastening making, because the heat flow density of high-power LED chip substrate attaching face is very big, and the thermal barrier on the heat transfer pathway (stickup glue-line) is more, and it is higher that the thermal insulation of PC cover and lower light transmission make that LED makes the hood-shaped enclosure space temperature that becomes of illuminator and PC, and the propagation loss of light is bigger, when using 8W usually, the sealing cavity temperature can reach 75 ℃ when 25 ℃ of environment temperatures, this makes the node temperature of led chip reach 100 ℃, for the LED illuminator, higher temperature can have a strong impact on the service life of the high-power ball bubble of LED, cause optical attenuation big especially to fluorescent material simultaneously, difficulty of processing is increased, simultaneously cost is significantly risen for overcoming the technical measures that this restriction takes.Another kind of adopt LED area source with the C0B packaged type as illuminator, promptly at the MCPCB(metal inner core PCB that finishes circuit fabrication after the making sheet etching at copper clad plate) earlier chip is attached on the plate after the MCPCB plate applies chip installation position on the copper wire, again the electrode of chip and the deposited copper film patchboard on the etched circuit on the MCPCB plate are connected into the illuminator group, the colloid of realizing the lead fixed between golden finger on chip and the MCPCB plate with the continuous mode of uninterrupted gluing again and infiltrating fluorescent material is made illuminator to the covering fully of illuminator, more preceding a kind of scheme heat dissipation problem has had bigger improvement, but raising along with chip lumen per watt number, current density constantly increases, heat dissipation problem still becomes the LED illuminator as difficult problem in the integrated utilization of lighting source, when using 12W usually, the sealing cavity temperature can reach 75 ℃ when 25 ℃ of environment temperatures, this makes the node temperature of led chip reach 100 ℃, for the LED illuminator, higher temperature can have a strong impact on the service life of the high-power ball bubble of LED.Usually adopt in order to solve heat dissipation problem: one, add the surface area of the metal fin at the large chip binding face back side, two, the pressure ventilating fan is set, three, between illuminator and lamp casing, fill cooling fluid at seal head end.For the high-power ball bubble of LED, all can't effectively realize.Therefore all there is defective in the high-power ball foam method of above-mentioned LED case, need improve.

Summary of the invention

The LED ball bubble and the manufacture method that the purpose of this invention is to provide a kind of good heat dissipation, long service life.

Technical scheme of the present invention is as follows:

A kind of LED ball bubble comprises power pack, led chip, with the substrate of carrying led chip, substrate is equipped with thermal component behind, it is characterized in that: described thermal component is the hollow cylinder of both ends open, be provided with radiating fin on the interior sidewall surface of cylindrical shell, substrate arranged is on the outer wall of cylindrical shell.

The preferred technical solution of the present invention is as follows:

Preferably, the substrate of described led chip is the specular aluminium section bar, and led chip is attached on the reflective surface of minute surface aluminium sheet, and the specular aluminium section bar is connected with thermal component.

Preferably, described power pack power supply is installed in the cylindrical shell cavity along its length.

Preferably, described LED ball bubble also comprises cloche and shell of lamp base, and cloche is outside the LED luminescence chip, and cloche and hollow cylinder are installed on the shell of lamp base.

Preferably, also have cold air to enter the hole and hot-air portals at shell of lamp base, described cylinder body outer wall surface forms the cold air inlet channel along the circumferential direction and between the cloche, and this cold air inlet channel enters the hole with cold air on the shell of lamp base and is communicated with, and the inner passage of hollow cylinder and the hot-air on the shell of lamp base portal and form the hot-air outlet passageway.

Beneficial effect of the present invention: the thermal component of cylindrical shell has effectively increased area of dissipation under the situation of extended volume not, and in the hollow cylinder inner passage, air can cause convection current by temperature contrast, strengthens radiating effect, and then the heat radiation of better optimize LED ball bubble.Further, when adopting the minute surface aluminium, heat on the substrate can pass on the built-in thermal component rapidly, transfer heat on the housing base by built-in thermal component again, form good heat dissipation channel, the heat on the fin can be taken away rapidly by cross-ventilation in the built-in thermal component simultaneously, thereby has further reduced the temperature of led chip PN junction.In 22W, the sealing cavity temperature can reach below 65 ℃ when 25 ℃ of environment temperatures in the set power of LED ball bubble in a large amount of evidences, and this makes the node temperature of led chip reach below 80 ℃, thereby prolongs the service life of the high-power ball bubble of LED.

Further, in the cavity of the length direction of built-in radiator and in the combination chamber of aluminum hull headkerchief, power supply is set, the aluminium section bar and the built-in heat transmission gas that contain power supply united two into one, thereby saved the manufacturing cost that power pack aluminium consumption has reduced whole lamp, improved system reliability simultaneously.

The exiting surface of great power LED ball bubble of the present invention becomes three-dimensional bright dipping by present face bright dipping, in a specific embodiment, because it is more that the conductivity of heat of cloche and light transmission all exceed the PC cover, further improve when light effect, the cold air inlet channel is along the circumferential direction formed with outer printing opacity cloche and shell of lamp base in the cylinder body outer wall surface, the enclosure space that makes LED do illuminator and cloche formation does not have the abrupt temp field, thereby thermal equilibrium temperature is lower, makes that the junction temperature in the led chip is lower.And, adopting built-in thermal component is the cylindrical shell of hollow, hollow cylinder and shell of lamp base are formed the hot-air outlet passageway, heat on the minute surface aluminium sheet can pass on the built-in thermal component rapidly, fin in the built-in thermal component has increased the convective surface area in the passage simultaneously, hot-air in the passage forms convection current by hollow joint on the aluminum hull and air, and the effect of convection current is just strong more when air in the tube and the extraneous air temperature difference are big more, so the lamp body heat dissipating state further improves.

Description of drawings

The present invention will illustrate by example and with reference to the mode of accompanying drawing, wherein:

Fig. 1 is the structure chart of the high-power globular bulb embodiment of LED of the present invention.

The view in transverse section of the high-power globular bulb of Fig. 2 LED shown in Figure 1.

The specific embodiment

As shown in Figure 1, 2, a kind of great power LED ball bubble, comprise: be used to finish great power LED ball bubble is connected and introduces civil power with lamp socket external lamp holder 1, aluminum hull enclosing cover 2, be installed in the barrel radiation parts 11 in the LED ball bubble, barrel radiation parts 11 are fixedlyed connected by holding screw 7 with conduction heat transfer aluminium section bar 6, and conduction heat transfer aluminium section bar 6 is installed on the link 4 in the aluminum hull enclosing cover 2 with hot-air export mouth 3; The holding screw 8 that has the cold air introducing port is finished the fixedly connected of cloche 12; The wiring board of circuit is installed in the cavity of link 4, be covered with cloche 12 at barrel radiation parts 11, cloche 12 is installed on the conduction heat transfer aluminium section bar 6, and elastic sealing element is installed between the two, is used to realize the elastic packing of fluorescent tube inner chamber and Elastic Contact, damping; The connection in series-parallel circuit that barrel radiation parts 11 are used to that chimeric minute surface aluminium sheet 13 is installed and carry led chip, the heat that is given out by led chip on the minute surface aluminium sheet 13 conducts on the fin in the barrel radiation parts 11 by barrel radiation parts 11, and to be discharged into LED ball bubble outside for the cross-ventilation by barrel radiation parts 11 inside again.Minute surface aluminium sheet 13 is used to carry led chip, and reaches the effect of first and second luminous optics moulding of led chip.

In the above-described embodiments, make the light source of the high-power ball bubble of illuminator at LED, if the small-power integrated optical source that adopts the pcb board printed circuit to make, can draw the manufacturing process complexity of pcb board, make its manufacturing cost higher, the manufacture process environmental pollution is bigger, and bigger heat flow density makes the heat transfer radiating treatment all than difficult problem.Therefore adopt the specular aluminium section bar basic as the carrying of led chip in this embodiment, led chip is attached to the integrated encapsulated LED area source of chip on the reflective surface of minute surface aluminium sheet, and the specular aluminium section bar can more effective conduction heat.

In the above-described embodiments, barrel radiation parts 11 outer wall surface are along the circumferential direction formed cold air inlet channel 5 with outer diffuser and shell of lamp base, the enclosure space that makes LED do illuminator and cloche 12 formation does not have the abrupt temp field, thereby thermal equilibrium temperature is lower, thereby makes that the junction temperature in the led chip is lower.For some application, also can uneasy glaze cover 12, barrel radiation parts 11 and minute surface aluminium sheet 13 be exposed in the surrounding air has cold air to enter from barrel radiation parts 11 bottoms to reach, and forms the purpose of effective heat convection.

Disclosed all features in this specification, or the step in disclosed all methods or the process except mutually exclusive feature and/or step, all can make up by any way.

Disclosed arbitrary feature in this specification (comprising any accessory claim, summary and accompanying drawing) is unless special narration all can be replaced by other equivalences or the alternative features with similar purpose.That is, unless special narration, each feature is an example in a series of equivalences or the similar characteristics.

The present invention is not limited to the aforesaid specific embodiment.The present invention expands to any new feature or any new combination that discloses in this manual, and the arbitrary new method that discloses or step or any new combination of process.

Claims

1. a LED ball bubble comprises power pack, led chip, with the substrate of carrying led chip, substrate is equipped with thermal component behind, it is characterized in that: described thermal component is the hollow cylinder of both ends open, be provided with radiating fin on the interior sidewall surface of cylindrical shell, substrate arranged is on the outer wall of cylindrical shell.

2. LED ball bubble according to claim 1, it is characterized in that: the substrate of described led chip is the specular aluminium section bar, and led chip is attached on the reflective surface of minute surface aluminium sheet, and the specular aluminium section bar is connected with thermal component.

3. LED ball bubble according to claim 1, it is characterized in that: described power pack power supply is installed in the cylindrical shell cavity along its length.

4. according to claim 1 or 2 or 3 described LED ball bubbles, it is characterized in that: described LED ball bubble also comprises cloche and shell of lamp base, and cloche is outside the LED luminescence chip, and cloche and hollow cylinder are installed on the shell of lamp base.

5. LED ball bubble according to claim 4, it is characterized in that: also have cold air to enter the hole and hot-air portals at shell of lamp base, described cylinder body outer wall surface forms the cold air inlet channel along the circumferential direction and between the cloche, and this cold air inlet channel enters the hole with cold air on the shell of lamp base and is communicated with, and the inner passage of hollow cylinder and the hot-air on the shell of lamp base portal and form the hot-air outlet passageway.