CN202165892U

CN202165892U - Light-emitting diode (LED) bulb

Info

Publication number: CN202165892U
Application number: CN2011202964272U
Authority: CN
Inventors: 彭雯
Original assignee: Individual
Current assignee: Individual
Priority date: 2011-08-16
Filing date: 2011-08-16
Publication date: 2012-03-14
Anticipated expiration: 2021-08-16

Abstract

The utility model discloses a light-emitting diode (LED) bulb, which comprises a power supply part, an LED chip and a substrate for bearing the LED chip. A heat dissipation component is installed on the back of the substrate. The LED bulb is characterized in that the heat dissipation component is a hollow cylindrical body with both ends open, a heat dissipation fin is disposed on the inner side wall face of the cylindrical body, and the substrate is arranged on the outer wall of the cylindrical body. The LED bulb has the advantages of being good in heat dissipation effect and long in service life.

Description

LED ball bubble

Technical field

The utility model relates to LED lighting and manufacturing approach thereof, and especially a kind of LED makes the great power LED ball bubble of illuminator.

Background technology

The high-power ball of existing LED bubble, the lamp pearl of adopting high-power LED chip to process are made illuminator and are attached on the wiring board that pcb board processes with heat-conducting glue more, it are bonded on the heat radiation heat transfer aluminum hull radiator with heat-conducting glue again; Again itself and PC are covered seamless fastening making, because the heat flow density of high-power LED chip substrate attaching face is very big, and the thermal barrier on the heat transfer pathway (stickup glue-line) is more; And it is higher that the thermal insulation of PC cover and lower light transmission make that LED makes the hood-shaped enclosure space temperature that becomes of illuminator and PC; And the propagation loss of light is bigger, and when using 8W usually, the sealing cavity temperature can reach 75 ℃ when 25 ℃ of environment temperatures; This makes the node temperature of led chip reach 100 ℃; As far as the LED illuminator, higher temperature can have a strong impact on the service life of the high-power ball bubble of LED, causes optical attenuation big especially to fluorescent material simultaneously; For overcoming the technical measures that this restriction takes difficulty of processing is increased, simultaneously cost is significantly risen.Another kind of adopt LED area source with the C0B packaged type as illuminator; Promptly, copper clad plate earlier chip is being attached on accomplishing MCPCB (metal inner core PCB) plate of circuit fabrication after the making sheet etching after the MCPCB plate applies the chip installation position on the copper wire; Again the electrode of chip and the deposited copper film patchboard on the etched circuit on the MCPCB plate are connected into the illuminator group; Realize that with the continuous mode of uninterrupted gluing the lead fixed between the golden finger on chip and the MCPCB plate processes illuminator with the colloid that infiltrates fluorescent material to the covering fully of illuminator again; A kind of scheme heat dissipation problem has had bigger improvement, but along with the raising of chip lumen per watt number, current density constantly increases; Heat dissipation problem still becomes the LED illuminator as difficult problem in the integrated utilization of lighting source; When using 12W usually, the sealing cavity temperature can reach 75 ℃ when 25 ℃ of environment temperatures, and this makes the node temperature of led chip reach 100 ℃; As far as the LED illuminator, higher temperature can have a strong impact on the service life of the high-power ball bubble of LED.Usually adopt in order to solve heat dissipation problem: one, add the surface area of the metal fin at the large chip binding face back side, two, the pressure ventilating fan is set, three, between illuminator and lamp casing, fill cooling fluid at seal head end.For the high-power ball bubble of LED, all can't effectively realize.Therefore all there is defective in the high-power ball foam method of above-mentioned LED case, need improve.

The utility model content

The purpose of the utility model provides the LED ball bubble and the manufacturing approach of a kind of good heat dissipation, long service life.

The technical scheme of the utility model is following:

A kind of LED ball bubble comprises power pack, led chip; With the substrate that carries led chip, substrate is equipped with thermal component behind, it is characterized in that: said thermal component is the hollow cylinder of both ends open; On the interior sidewall surface of cylindrical shell, be provided with radiating fin, substrate arranged is on the outer wall of cylindrical shell.

The optimal technical scheme of the utility model is following:

Preferably, the substrate of said led chip is the specular aluminium section bar, and led chip is attached on the reflective surface of minute surface aluminium sheet, and the specular aluminium section bar is connected with thermal component.

Preferably, described power pack power supply is installed in the cylindrical shell cavity along its length.

Preferably, said LED ball bubble also comprises cloche and shell of lamp base, and cloche is outside the LED luminescence chip, and cloche and hollow cylinder are installed on the shell of lamp base.

Preferably; Also have cold air to enter the hole and hot-air portals at shell of lamp base; Said cylinder body outer wall surface forms the cold air inlet channel along the circumferential direction and between the cloche; And this cold air inlet channel enters the hole with cold air on the shell of lamp base and is communicated with, and the inner passage of hollow cylinder and the hot-air on the shell of lamp base portal and form the hot-air outlet passageway.

The beneficial effect of the utility model: the thermal component of cylindrical shell has effectively increased area of dissipation under the situation of extended volume not; And in the hollow cylinder inner passage; Air can cause convection current by temperature contrast, strengthens radiating effect, and then the heat radiation of better optimize LED ball bubble.Further; When adopting the minute surface aluminium; Heat on the substrate can pass to rapidly on the built-in thermal component, transfers heat on the housing base through built-in thermal component again, forms good heat dissipation channel; The heat on the fin can be taken away rapidly by cross-ventilation in the built-in thermal component simultaneously, thereby has further reduced the temperature of led chip PN junction.In 22W, the sealing cavity temperature can reach below 65 ℃ when 25 ℃ of environment temperatures in the set power of LED ball bubble for lot of test proof, and this makes the node temperature of led chip reach below 80 ℃, thereby prolongs the service life of the high-power ball bubble of LED.

Further; In the cavity of the length direction of built-in radiator with in the combination chamber of aluminum hull headkerchief, power supply is set; The aluminium section bar and the built-in heat transmission gas that contain power supply united two into one, thereby practiced thrift the manufacturing cost that power pack aluminium consumption has reduced whole lamp, improved system reliability simultaneously.

The exiting surface of the utility model great power LED ball bubble becomes three-dimensional bright dipping by present face bright dipping; In a specific embodiment; Because it is more that the conductivity of heat of cloche and light transmission all exceed the PC cover; Further improve when light effect, the cold air inlet channel is along the circumferential direction formed with outer printing opacity cloche and shell of lamp base in the cylinder body outer wall surface, and the enclosure space that makes LED do illuminator and cloche formation does not have the abrupt temp field; Thereby thermal equilibrium temperature is lower, makes that the junction temperature in the led chip is lower.And; Adopting built-in thermal component is the cylindrical shell of hollow, and hollow cylinder and shell of lamp base are formed the hot-air outlet passageway, and the heat on the minute surface aluminium sheet can pass on the built-in thermal component rapidly; Fin in the built-in thermal component has increased the convective surface area in the passage simultaneously; Hot-air in the passage forms convection current through hollow joint on the aluminum hull and air, and the effect of convection current is just strong more when air in the tube and the extraneous air temperature difference are big more, so the lamp body heat dissipating state further improves.

Description of drawings

The utility model will explain through example and with reference to the mode of accompanying drawing, wherein:

Fig. 1 is the structure chart of the high-power globular bulb embodiment of the utility model LED.

The view in transverse section of the high-power globular bulb of Fig. 2 LED shown in Figure 1.

The specific embodiment

Like Fig. 1, shown in 2; A kind of great power LED ball bubble; Comprise: be used to accomplish great power LED ball bubble is connected and introduces civil power with lamp socket external lamp holder 1, aluminum hull enclosing cover 2 is installed in the barrel radiation parts 11 in the LED ball bubble; Barrel radiation parts 11 are fixedly connected through holding screw 7 with conduction heat transfer aluminium section bar 6, and conduction heat transfer aluminium section bar 6 is installed on the link 4 in the aluminum hull enclosing cover 2 with hot-air export mouth 3; The holding screw 8 that has the cold air introducing port is accomplished the fixed connection of cloche 12; The wiring board of circuit is installed in the cavity of link 4; Be covered with cloche 12 at barrel radiation parts 11; Cloche 12 is installed on the conduction heat transfer aluminium section bar 6, and elastic sealing element is installed between the two, is used to realize elastic packing and Elastic Contact, the damping of fluorescent tube inner chamber; The connection in series-parallel circuit that barrel radiation parts 11 are used to that chimeric minute surface aluminium sheet 13 is installed and carry led chip; The heat that is given out by led chip on the minute surface aluminium sheet 13 conducts on the fin in the barrel radiation parts 11 through barrel radiation parts 11, and it is outside to be discharged into LED ball bubble through barrel radiation parts 11 inner cross-ventilations again.Minute surface aluminium sheet 13 is used to carry led chip, and reaches the effect of first and second luminous optics moulding of led chip.

In the above-described embodiments; Make the light source of the high-power ball bubble of illuminator to LED; If the small-power integrated optical source that adopts the pcb board printed circuit to process, the manufacturing process that can draw pcb board is complicated, makes its manufacturing cost higher; The manufacture process environmental pollution is bigger, and bigger heat flow density makes the heat transfer radiating treatment all than difficult problem.Therefore in this embodiment, adopt the specular aluminium section bar basic as the carrying of led chip, led chip is attached to the integrated encapsulated LED area source of chip on the reflective surface of minute surface aluminium sheet, and the specular aluminium section bar can more effective conduction heat.

In the above-described embodiments; Barrel radiation parts 11 outer wall surface are along the circumferential direction formed cold air inlet channel 5 with outer diffuser and shell of lamp base; The enclosure space that makes LED do illuminator and cloche 12 formation does not have the abrupt temp field; Thereby thermal equilibrium temperature is lower, thereby makes that the junction temperature in the led chip is lower.For some application, also can uneasy glaze cover 12, barrel radiation parts 11 and minute surface aluminium sheet 13 be exposed in the surrounding air has cold air to get into from barrel radiation parts 11 bottoms to reach, and forms the purpose of effective heat convection.

Disclosed all characteristics in this specification, or the step in disclosed all methods or the process except mutually exclusive characteristic and/or the step, all can make up by any way.

Disclosed arbitrary characteristic in this specification (comprising any accessory claim, summary and accompanying drawing) is only if special narration all can be replaced by other equivalences or the alternative features with similar purpose.That is, only if special narration, each characteristic is an example in a series of equivalences or the similar characteristics.

The utility model is not limited to the aforesaid specific embodiment.The utility model expands to any new feature or any new combination that discloses in this manual, and the arbitrary new method that discloses or step or any new combination of process.

Claims

1. a LED ball bubble comprises power pack, led chip; With the substrate that carries led chip, substrate is equipped with thermal component behind, it is characterized in that: said thermal component is the hollow cylinder of both ends open; On the interior sidewall surface of cylindrical shell, be provided with radiating fin, substrate arranged is on the outer wall of cylindrical shell.

2. LED ball bubble according to claim 1, it is characterized in that: the substrate of said led chip is the specular aluminium section bar, and led chip is attached on the reflective surface of minute surface aluminium sheet, and the specular aluminium section bar is connected with thermal component.

3. LED ball bubble according to claim 1, it is characterized in that: described power pack power supply is installed in the cylindrical shell cavity along its length.

4. according to claim 1 or 2 or 3 described LED ball bubbles, it is characterized in that: said LED ball bubble also comprises cloche and shell of lamp base, and cloche is outside the LED luminescence chip, and cloche and hollow cylinder are installed on the shell of lamp base.

5. LED ball bubble according to claim 4; It is characterized in that: also have cold air to enter the hole and hot-air portals at shell of lamp base; Said cylinder body outer wall surface forms the cold air inlet channel along the circumferential direction and between the cloche; And this cold air inlet channel enters the hole with cold air on the shell of lamp base and is communicated with, and the inner passage of hollow cylinder and the hot-air on the shell of lamp base portal and form the hot-air outlet passageway.