TWI717248B - Lamp structure - Google Patents

Lamp structure Download PDF

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Publication number
TWI717248B
TWI717248B TW109110865A TW109110865A TWI717248B TW I717248 B TWI717248 B TW I717248B TW 109110865 A TW109110865 A TW 109110865A TW 109110865 A TW109110865 A TW 109110865A TW I717248 B TWI717248 B TW I717248B
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Taiwan
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conductive
conductive sleeve
circuit substrate
lamp holder
ground pin
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TW109110865A
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Chinese (zh)
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TW202136678A (en
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劉國輝
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正裕起動有限公司
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Abstract

A lamp structure is provided, including a circuit board, a light unit, a conductive sleeve and an anti-electromagnetic interference member. The light unit is positioned on the circuit board. The conductive sleeve penetrates through the circuit board. The conductive sleeve has a channel. The anti-electromagnetic interference member is positioned on the circuit board. The anti-electromagnetic interference member has a ground connection pin. The ground connection pin penetrates through the channel and is electrical connected with the conductive sleeve.

Description

燈泡結構Bulb structure

本發明係與燈泡結構有關,特別是有關於一種燈泡結構。The present invention relates to a bulb structure, and particularly relates to a bulb structure.

電子干擾(Electromagnetic Interference, EMI)較簡易的解釋為電子設備在運作過程中,對環境中其他設備產生電磁干擾。舉例來說,手機電磁波造成喇叭發出異音、或是燈泡(如LED燈)干擾無線電之訊號發送、收音機收訊不佳或電視螢幕顯示時產生雪花等等。Electronic interference (Electromagnetic Interference, EMI) is relatively simple to explain as electronic equipment in the operation process, produce electromagnetic interference to other equipment in the environment. For example, the electromagnetic waves of the mobile phone cause abnormal noise from the speaker, or the light bulb (such as LED light) interferes with the signal transmission of the radio, the radio reception is poor, or the snow is generated when the TV screen is displayed.

上述舉例中,又以燈泡之電子干擾最需要被防範,其原因在於人們習慣於光亮環境中生活,故燈泡於日常生活中隨處可見,由此可知,一旦燈泡產生電子干擾,將會對同一環境中大多數設備產品造成嚴重之干擾,導致其他產品無法順利運作。In the above example, the electronic interference of light bulbs needs to be prevented most. The reason is that people are accustomed to living in a bright environment, so light bulbs can be seen everywhere in daily life. It can be seen that once the light bulb produces electronic interference, it will affect the same environment. Most of the equipment products cause serious interference, causing other products to fail to operate smoothly.

因此,有必要提供一種新穎且具有進步性之燈泡結構,以解決上述之問題。Therefore, it is necessary to provide a novel and progressive bulb structure to solve the above-mentioned problems.

本發明之主要目的在於提供一種燈泡結構,透過加裝抗電磁干擾元件來防範燈泡於運作中產生電子干擾,並且透過裝設導電套件於電路基板上來大幅提升抗電磁干擾元件電性接地之可靠度。The main purpose of the present invention is to provide a bulb structure that prevents electronic interference during operation of the bulb by adding anti-electromagnetic interference components, and greatly improves the reliability of electrical grounding of the anti-electromagnetic interference components by installing a conductive kit on the circuit board .

為達成上述目的,本發明提供一種燈泡結構,包括:一電路基板、一發光單元、一導電套件及一抗電磁干擾元件。該電路基板包含有依序相連接之一絕緣層、一中間層及一導電層;該發光單元定位於該電路基板;該導電套件穿設定位於該電路基板,該導電套件與該導電層保持電性接觸,該導電套件圍構有一通道;該抗電磁干擾元件定位於該電路基板,該抗電磁干擾元件包含有一接地接腳,該接地接腳穿設該通道地電性連接該導電套件。To achieve the above objective, the present invention provides a light bulb structure, which includes: a circuit substrate, a light-emitting unit, a conductive sleeve, and an anti-electromagnetic interference element. The circuit substrate includes an insulating layer, an intermediate layer, and a conductive layer connected in sequence; the light-emitting unit is positioned on the circuit substrate; the conductive sleeve is placed on the circuit substrate, and the conductive sleeve and the conductive layer are electrically connected For sexual contact, the conductive sleeve surrounds a channel; the anti-electromagnetic interference element is positioned on the circuit substrate, and the anti-electromagnetic interference element includes a ground pin, and the ground pin penetrates the channel to electrically connect the conductive sleeve.

以下僅以實施例說明本發明可能之實施態樣,然並非用以限制本發明所欲保護之範疇,合先敘明。The following examples are only used to illustrate the possible implementation aspects of the present invention, but they are not intended to limit the scope of protection of the present invention, and are described first.

請參考圖1至圖5,其顯示本發明之第一實施例,本發明之燈泡結構包括:一電路基板1、一發光單元2、一導電套件3及一抗電磁干擾元件4。Please refer to FIGS. 1 to 5, which show the first embodiment of the present invention. The bulb structure of the present invention includes: a circuit substrate 1, a light-emitting unit 2, a conductive sleeve 3, and an anti-electromagnetic interference component 4.

該電路基板1包含有依序相連接之一絕緣層11、一中間層12及一導電層13,該中間層12為線路板層,該導電層13供與地迴路保持電性連接,該發光單元2定位於該電路基板1用以接收電源及訊號後進行發光,於第一實施例中,該發光單元2包含有環狀排列的複數LED21。而該導電套件3穿設定位於該電路基板1,該導電套件3與該導電層13保持電性接觸以形成延伸性的線路接點,其中,該導電套件3圍構有一通道31。The circuit substrate 1 includes an insulating layer 11, an intermediate layer 12, and a conductive layer 13 connected in sequence. The intermediate layer 12 is a circuit board layer. The conductive layer 13 is used to maintain electrical connection with the ground circuit. The unit 2 is positioned on the circuit substrate 1 for receiving power and signals to emit light. In the first embodiment, the light-emitting unit 2 includes a plurality of LEDs 21 arranged in a ring shape. The conductive sleeve 3 is placed on the circuit substrate 1 through and is in electrical contact with the conductive layer 13 to form an extensible circuit contact. The conductive sleeve 3 defines a channel 31.

該抗電磁干擾元件4定位於該電路基板1,該抗電磁干擾元件4包含有一接地接腳41,該接地接腳41係穿設該通道31地電性連接該導電套件3,進而該抗電磁干擾元件4透過該接地接腳41、該導電套件3與該導電層13而接地,以提供宣洩途徑來將運作時所產生的中高頻雜訊(如共模雜訊)、雜訊能量(如電流)藉此洩流至接地點,藉此分攤掉干擾量進而達到該燈泡結構抗電磁干擾之目的;其中,該導電套件3之用途在於大幅增加與該接地接腳41之間的接觸面積,以確保該接地接腳41能夠百分之百地與該導電層13電性連通。The anti-electromagnetic interference element 4 is positioned on the circuit substrate 1, and the anti-electromagnetic interference element 4 includes a ground pin 41 that is electrically connected to the conductive sleeve 3 through the channel 31, and the anti-electromagnetic interference element 4 The interference element 4 is grounded through the ground pin 41, the conductive package 3, and the conductive layer 13, so as to provide a catharsis way to remove the mid-high frequency noise (such as common mode noise) and noise energy (such as The current) leaks to the grounding point, thereby apportioning the amount of interference to achieve the purpose of anti-electromagnetic interference of the bulb structure; wherein, the purpose of the conductive set 3 is to greatly increase the contact area with the grounding pin 41, To ensure that the ground pin 41 can be 100% electrically connected with the conductive layer 13.

於第一實施例中,該導電層13之材質為鋁,除了具有導電之功效外更兼具有極佳導熱性,能快速地輔助電子元件散熱;該導電套件3之材質為銅,而具有導電性佳、取得便利、及易加工等優點;而該抗電磁干擾元件4則選用電容,除了有上述洩放雜訊電流之能力外,更可保護其他精密電子元件免受雜訊衝擊而損毀。In the first embodiment, the material of the conductive layer 13 is aluminum, which not only has the function of conducting electricity, but also has excellent thermal conductivity, which can quickly assist the heat dissipation of electronic components; the material of the conductive set 3 is copper, which has Good electrical conductivity, convenience, and easy processing. The anti-electromagnetic interference component 4 uses a capacitor, which not only has the ability to discharge noise current, but also protects other precision electronic components from noise impact and damage .

進一步說明的是,該導電套件3較佳係穿設過該電路基板1,且該導電套件3之二端係分別抵靠於該絕緣層11與該導電層13,以期該導電套件3能穩定地結合於該電路基板1,且有接觸面積極大化之優點。於第一實施例中,該導電套件3係透過鉚接手法穿設定位於該電路基板1,具有易加工組裝及可交由專門鉚接裝置進行自動化作業之優點,既便利又快速。It is further explained that the conductive sleeve 3 preferably passes through the circuit substrate 1, and the two ends of the conductive sleeve 3 abut against the insulating layer 11 and the conductive layer 13, respectively, so that the conductive sleeve 3 can be stabilized Ground is combined with the circuit substrate 1 and has the advantage of maximizing the contact area. In the first embodiment, the conductive sleeve 3 is set on the circuit substrate 1 through the riveting method, which has the advantages of easy processing and assembly and can be automated by a special riveting device, which is convenient and fast.

更進一步來說,該電路基板1設有該絕緣層11之一側定義為一第一側面14,該電路基板1設有該導電層13之一側定義為一第二側面15,該發光單元2位於該第一側面14,該抗電磁干擾元件4位於該第二側面15,採用分側之結構配置,能讓該發光單元2所發出的光線不會被遮蔽住,且該發光單元2所產生的熱量不會堆積影響到其他電子元件。於第一實施例中,該接地接腳41係由該第二側面15穿設過該通道31而凸伸至該第一側面14,一焊料5於該第一側面14焊接該接地接腳41與該導電套件3,該接地接腳41、該焊料5、該導電套件3與該導電層13成電性連接形成接地途徑,且該焊料5同時能有固定該接地接腳41與該導電套件3之功效,為一舉二得之作法;其中,焊接作業亦可由專門之焊接裝置進行焊接自動化作業,以加快生產效率。Furthermore, the side of the circuit substrate 1 provided with the insulating layer 11 is defined as a first side surface 14, and the side of the circuit substrate 1 provided with the conductive layer 13 is defined as a second side surface 15. The light emitting unit 2 is located on the first side surface 14, the anti-electromagnetic interference element 4 is located on the second side surface 15, adopting a side-by-side structure configuration, so that the light emitted by the light emitting unit 2 will not be shielded, and the light emitting unit 2 The heat generated will not accumulate and affect other electronic components. In the first embodiment, the ground pin 41 passes through the channel 31 from the second side surface 15 and protrudes to the first side surface 14, and a solder 5 solders the ground pin 41 on the first side surface 14. With the conductive sleeve 3, the ground pin 41, the solder 5, the conductive sleeve 3 and the conductive layer 13 are electrically connected to form a ground path, and the solder 5 can simultaneously fix the ground pin 41 and the conductive sleeve The effect of 3 is a method of doing two things with one stone; among them, the welding operation can also be automated by a special welding device to speed up production efficiency.

值得一提的是,該接地接腳41由該第二側面15穿設過該通道31時,該接地接腳41即會於該通道31內側向抵靠於該導電套件3,達成電性接觸之目的。較佳地,該通道31之徑向尺寸與該接地接腳41之徑向尺寸二者相近時,以該導電套件3之縱切面觀之,該接地接腳41之相對二側於該通道31內皆與該導電套件3抵靠,如同緊配合般,而可同時達成定位與電性碰觸之目的,而該焊料5之焊接則是可提升可靠度及穩定度。It is worth mentioning that when the ground pin 41 passes through the channel 31 from the second side surface 15, the ground pin 41 will abut the conductive sleeve 3 inside the channel 31 to achieve electrical contact. The purpose. Preferably, when the radial dimension of the channel 31 and the radial dimension of the ground pin 41 are similar, when viewed from the longitudinal section of the conductive sleeve 3, the opposite sides of the ground pin 41 are on the channel 31 The inside is abutted against the conductive sleeve 3, like a tight fit, and can achieve the purpose of positioning and electrical contact at the same time, and the soldering of the solder 5 can improve the reliability and stability.

當然,並不侷限於上述態樣。亦可如圖6之第二實施例所示,通道31A之徑向尺寸大於接地接腳41A之徑向尺寸,該接地接腳41A係僅單側抵靠於該通道31A,並輔以焊料5A滲入該通道31A內連結定位該接地接腳41A與導電套件3A。或是,如圖7之第三實施例所示,接地接腳41B之一端穿設過通道31B後呈轉折狀地於第一側面14B抵靠導電套件3B,以增加該接地接腳41B與該導電套件3B相互接觸面積,同樣地,輔以焊料5B滲入該通道31B內強化連結關係。Of course, it is not limited to the above aspect. As shown in the second embodiment of FIG. 6, the radial dimension of the channel 31A is larger than the radial dimension of the ground pin 41A, and the ground pin 41A only abuts the channel 31A on one side, and is supplemented by solder 5A Penetrate into the channel 31A to connect and position the ground pin 41A and the conductive sleeve 3A. Or, as shown in the third embodiment of FIG. 7, one end of the ground pin 41B passes through the channel 31B and then abuts against the conductive sleeve 3B on the first side surface 14B in a turning shape to increase the ground pin 41B and the The contact area of the conductive sleeve 3B is similarly, supplemented by the solder 5B penetrating into the channel 31B to strengthen the connection relationship.

請再進一步參考圖1至圖5之第一實施例,該燈泡結構另包含有一殼體組件6,包含有一燈座61及一燈罩62,該燈罩62蓋設於該燈座61,該電路基板1定位於該燈座61,該絕緣層11朝向該燈罩62,該導電層13壓抵於該燈座61。其中,該燈座61之內面設有一鋁質層611,該導電層13側向抵靠於該鋁質層611,以同時達到電性接觸及導熱之雙重目的。Please further refer to the first embodiment of FIGS. 1 to 5, the bulb structure further includes a housing assembly 6, including a lamp holder 61 and a lamp shade 62, the lamp shade 62 covers the lamp holder 61, and the circuit board 1 is positioned on the lamp holder 61, the insulating layer 11 faces the lamp shade 62, and the conductive layer 13 is pressed against the lamp holder 61. Wherein, the inner surface of the lamp holder 61 is provided with an aluminum layer 611, and the conductive layer 13 laterally abuts the aluminum layer 611 to achieve the dual purpose of electrical contact and heat conduction at the same time.

具體地說,該燈座61另包含有一定位凹槽612及複數擋止部613,該複數擋止部613橫向地凸伸於該定位凹槽612,該電路基板1容設於該定位凹槽612,該燈罩62之一卡部621伸入該定位凹槽612地壓抵住該電路基板1且與該複數擋止部613相互擋止,進而使得該電路基板1能夠穩定地被定位住。Specifically, the lamp holder 61 further includes a positioning groove 612 and a plurality of stopping portions 613. The plurality of stopping portions 613 protrude laterally from the positioning groove 612, and the circuit board 1 is accommodated in the positioning groove. 612, a clamping portion 621 of the lampshade 62 extends into the positioning groove 612 to press against the circuit substrate 1 and block the plurality of blocking portions 613, thereby enabling the circuit substrate 1 to be stably positioned.

綜上,本發明燈泡結構考量到電磁干擾之問題,進而增設電容作為抗電磁干擾元件來解決,同時,透過導電套件貫穿定位於電路基板,以讓電容之接腳能夠電性接觸而接地。並且,導電套件採用鉚接之方式能夠提升結合定位可靠度,而輔以焊料能確保電容之接腳與導電套件能百分之百地接觸而接地,以確實形成宣洩途徑達到抗電磁干擾之目的。此外,鉚接結合與焊接過程二者皆可交由專門機台負責,進而有自動化快速生產之功效。In summary, the lamp structure of the present invention takes into account the problem of electromagnetic interference, and then adds a capacitor as an anti-electromagnetic interference component to solve it. At the same time, the conductive sleeve is positioned through the circuit substrate to allow the pins of the capacitor to electrically contact and be grounded. In addition, the use of riveting of the conductive kit can improve the reliability of the combination and positioning, and the supplementary solder can ensure that the pins of the capacitor and the conductive kit can be 100% contacted and grounded, so as to form a leak path to achieve the purpose of anti-electromagnetic interference. In addition, both the riveting and welding process can be handled by a special machine, which has the effect of automatic and rapid production.

1:電路基板 11:絕緣層 12:中間層 13:導電層 14,14B:第一側面 15:第二側面 2:發光單元 21:LED 3,3A,3B:導電套件 31,31A,31B:通道 4:抗電磁干擾元件 41,41A,41B:接地接腳 5,5A,5B:焊料 6:殼體組件 61:燈座 611:鋁質層 612:定位凹槽 613:擋止部 62:燈罩 621:卡部1: Circuit board 11: Insulation layer 12: Middle layer 13: conductive layer 14,14B: First side 15: second side 2: Light-emitting unit 21: LED 3, 3A, 3B: conductive kit 31, 31A, 31B: channel 4: Anti-electromagnetic interference components 41, 41A, 41B: ground pin 5, 5A, 5B: solder 6: Shell components 61: Lamp holder 611: Aluminum layer 612: positioning groove 613: Stop 62: Lampshade 621: Card Department

圖1為本發明之第一實施例之立體圖。 圖2為圖1之分解圖。 圖3為本發明一實施例之電路基板另一視角圖。 圖4為圖1之剖面圖。 圖5為圖4之局部放大圖。 圖6為本發明之第二實施例之局部放大剖視圖。 圖7為本發明之第三實施例之局部放大剖視圖。 Fig. 1 is a perspective view of the first embodiment of the present invention. Figure 2 is an exploded view of Figure 1. 3 is another perspective view of the circuit substrate according to an embodiment of the invention. Figure 4 is a cross-sectional view of Figure 1. Figure 5 is a partial enlarged view of Figure 4. Fig. 6 is a partial enlarged cross-sectional view of the second embodiment of the present invention. Fig. 7 is a partial enlarged cross-sectional view of the third embodiment of the present invention.

1:電路基板 1: Circuit board

13:導電層 13: conductive layer

3:導電套件 3: Conductive kit

4:抗電磁干擾元件 4: Anti-electromagnetic interference components

41:接地接腳 41: Ground pin

Claims (10)

一種燈泡結構,包括: 一電路基板,包含有依序相連接之一絕緣層、一中間層及一導電層; 一發光單元,定位於該電路基板; 一導電套件,穿設定位於該電路基板,與該導電層保持電性接觸,圍構有一通道;及 一抗電磁干擾元件,定位於該電路基板,包含有一接地接腳,該接地接腳穿設該通道地電性連接該導電套件。 A light bulb structure, including: A circuit substrate including an insulating layer, an intermediate layer and a conductive layer connected in sequence; A light-emitting unit positioned on the circuit substrate; A conductive sleeve is placed on the circuit substrate and is in electrical contact with the conductive layer, and a channel is enclosed; and An anti-electromagnetic interference component is positioned on the circuit substrate and includes a ground pin, and the ground pin passes through the channel and is electrically connected to the conductive sleeve. 如請求項1所述的燈泡結構,其中該導電套件係穿設過該電路基板,該導電套件之二端分別抵靠於該絕緣層與該導電層。The light bulb structure according to claim 1, wherein the conductive sleeve passes through the circuit substrate, and two ends of the conductive sleeve abut the insulating layer and the conductive layer, respectively. 如請求項2所述的燈泡結構,其中該電路基板設有該絕緣層之一側定義為一第一側面,該電路基板設有該導電層之一側定義為一第二側面,該發光單元位於該第一側面,該抗電磁干擾元件位於該第二側面,該接地接腳係由該第二側面穿設過該通道而凸伸至該第一側面,一焊料於該第一側面焊接該接地接腳與該導電套件,進而該接地接腳、該焊料、該導電套件與該導電層成電性連接。The light bulb structure according to claim 2, wherein the side of the circuit substrate provided with the insulating layer is defined as a first side surface, the side of the circuit substrate provided with the conductive layer is defined as a second side surface, and the light emitting unit Located on the first side surface, the anti-electromagnetic interference component is located on the second side surface, the ground pin passes through the channel from the second side surface and protrudes to the first side surface, and a solder is soldered to the first side surface The ground pin is electrically connected with the conductive sleeve, and then the ground pin, the solder, the conductive sleeve and the conductive layer are electrically connected. 如請求項3所述的燈泡結構,其中該接地接腳於該通道內側向抵靠於該導電套件。The light bulb structure according to claim 3, wherein the ground pin abuts against the conductive sleeve inside the channel. 如請求項3所述的燈泡結構,其中該接地接腳之一端穿設過該通道後呈轉折狀地於該第一側面抵靠該導電套件。The light bulb structure according to claim 3, wherein one end of the ground pin passes through the channel and abuts against the conductive sleeve on the first side in a turning shape. 如請求項1所述的燈泡結構,另包含有一殼體組件,包含有一燈座及一燈罩,該燈罩蓋設於該燈座,該電路基板定位於該燈座,該絕緣層朝向該燈罩,該導電層壓抵於該燈座。The light bulb structure according to claim 1, further comprising a housing assembly including a lamp holder and a lamp shade, the lamp shade is disposed on the lamp holder, the circuit board is positioned on the lamp holder, and the insulating layer faces the lamp shade, The conductive laminate is pressed against the lamp holder. 如請求項6所述的燈泡結構,其中該燈座之內面設有一鋁質層,該導電層側向抵靠於該鋁質層。The light bulb structure according to claim 6, wherein an aluminum layer is provided on the inner surface of the lamp holder, and the conductive layer laterally abuts against the aluminum layer. 如請求項1至7其中任一項所述的燈泡結構,其中該導電套件係透過鉚接手法穿設定位於該電路基板。The light bulb structure according to any one of claims 1 to 7, wherein the conductive sleeve is set on the circuit substrate through a riveting method. 如請求項1至7其中任一項所述的燈泡結構,其中該抗電磁干擾元件選用電容。The light bulb structure according to any one of claims 1 to 7, wherein the anti-electromagnetic interference component is a capacitor. 如請求項4所述的燈泡結構,另包含有一殼體組件,包含有一燈座及一燈罩,該燈罩蓋設於該燈座,該電路基板定位於該燈座,該絕緣層朝向該燈罩,該導電層壓抵於該燈座;該燈座之內面設有一鋁質層,該導電層側向抵靠於該鋁質層;該導電套件係透過鉚接手法穿設定位於該電路基板;該抗電磁干擾元件選用電容;該燈座另包含有一定位凹槽及複數擋止部,該複數擋止部橫向地凸伸於該定位凹槽,該電路基板容設於該定位凹槽,該燈罩之一卡部伸入該定位凹槽地壓抵住該電路基板且與該複數擋止部相互擋止;該發光單元包含有環狀排列的複數LED;以該導電套件之縱切面觀之,該接地接腳之相對二側於該通道內皆與該導電套件抵靠;該導電層之材質為鋁;該導電套件之材質為銅。The light bulb structure according to claim 4, further comprising a housing assembly including a lamp holder and a lamp shade, the lamp shade is arranged on the lamp holder, the circuit board is positioned on the lamp holder, and the insulating layer faces the lamp shade, The conductive laminate is pressed against the lamp holder; the inner surface of the lamp holder is provided with an aluminum layer, and the conductive layer laterally abuts against the aluminum layer; the conductive sleeve is set on the circuit substrate through a riveting method; the The anti-electromagnetic interference component selects a capacitor; the lamp holder further includes a positioning groove and a plurality of stop portions, the plurality of stop portions protrude laterally from the positioning groove, the circuit board is accommodated in the positioning groove, and the lampshade A card portion extends into the positioning groove to press against the circuit substrate and block the plurality of blocking portions; the light emitting unit includes a plurality of LEDs arranged in a ring shape; viewed from the longitudinal section of the conductive sleeve, The two opposite sides of the ground pin abut against the conductive sleeve in the channel; the material of the conductive layer is aluminum; the material of the conductive sleeve is copper.
TW109110865A 2020-03-30 2020-03-30 Lamp structure TWI717248B (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090046473A1 (en) * 2007-08-13 2009-02-19 Topco Technologies Corp. Light-emitting diode lamp
US20150023023A1 (en) * 2011-08-11 2015-01-22 Goldeneye, Inc. Lighting systems with heat extracting light emitting elements
TW201542961A (en) * 2014-04-09 2015-11-16 Cree Inc LED lamp
CN205232022U (en) * 2015-11-16 2016-05-11 飞利浦(中国)投资有限公司 Power drive circuit arrangement and lighting apparatus
US20190195437A1 (en) * 2016-08-31 2019-06-27 Sengled Optoelectronics Co., Ltd Led lamp base and led bulb

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090046473A1 (en) * 2007-08-13 2009-02-19 Topco Technologies Corp. Light-emitting diode lamp
US20150023023A1 (en) * 2011-08-11 2015-01-22 Goldeneye, Inc. Lighting systems with heat extracting light emitting elements
TW201542961A (en) * 2014-04-09 2015-11-16 Cree Inc LED lamp
CN205232022U (en) * 2015-11-16 2016-05-11 飞利浦(中国)投资有限公司 Power drive circuit arrangement and lighting apparatus
US20190195437A1 (en) * 2016-08-31 2019-06-27 Sengled Optoelectronics Co., Ltd Led lamp base and led bulb

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