KR100975528B1 - Led light - Google Patents

Led light Download PDF

Info

Publication number
KR100975528B1
KR100975528B1 KR1020090115151A KR20090115151A KR100975528B1 KR 100975528 B1 KR100975528 B1 KR 100975528B1 KR 1020090115151 A KR1020090115151 A KR 1020090115151A KR 20090115151 A KR20090115151 A KR 20090115151A KR 100975528 B1 KR100975528 B1 KR 100975528B1
Authority
KR
South Korea
Prior art keywords
flexible substrate
heat dissipation
outer circumferential
circumferential surface
dissipation unit
Prior art date
Application number
KR1020090115151A
Other languages
Korean (ko)
Inventor
정준호
Original Assignee
정준호
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 정준호 filed Critical 정준호
Priority to KR1020090115151A priority Critical patent/KR100975528B1/en
Application granted granted Critical
Publication of KR100975528B1 publication Critical patent/KR100975528B1/en

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

PURPOSE: An LED(Light Emitting Diode) lighting device improves cooling efficiency by storing the water in the curved groove of a heat dissipation part. CONSTITUTION: A heat dissipation part(5) includes a spherical surface housing, a cover housing, and a watertight packing. The inner peripheral surface of the spherical surface housing is formed into a curved surface in order to store the water. The watertight packing is interposed between the spherical surface housing and the cover housing. A flexible substrate(51) is arranged along the outer circumference of the heat dissipation part. A plurality of LEDs(53) are installed in the outer circumference of the flexible substrate. A diffusion part(7) is arranged under the heat dissipation part in order to diffuse light which is emitted from a plurality of LEDs.

Description

ＬＥＤ 등기구{LED light}LED luminaires {LED light}

본 발명은 LED 등기구에 관한 것으로, 더욱 상세하게는 구면상에 설치된 LED 들로부터 다양한 방향으로 LED 빛이 출사되도록 하고, 구면 내부에 물이 충진되도록 하여 냉각효율을 높이도록 한 LED 등기구에 관한 것이다.The present invention relates to an LED luminaire, and more particularly, to an LED luminaire which emits LED light in various directions from LEDs installed on a spherical surface, and fills the spherical surface with water to increase cooling efficiency.

LED는 전력소비가 낮고, 고휘도의 제품들이 개발됨에 따라서 기존의 백열등, 형광등 등을 대체하는 등기구로 각광받고 있다.LED has been spotlighted as a luminaire to replace the existing incandescent lamps, fluorescent lamps, etc. with the low power consumption and high-brightness products are developed.

특허출원 10-2007-0033659(발명의 명칭: 경사각을 이용한 엘이디 가로등)는 LED 등기구로서 다양한 방면으로 LED 빛을 출사하기 위한 구성을 구비하고 있으나, LED가 특정한 경사각을 이루는 평면으로 이루어진 경사면에 설치되어 있기 때문에 다양한 방향으로 빛이 출사되지 못하고 특정한 방향으로만 빛 출사되는 문제점이 있다.Patent application 10-2007-0033659 (name of the invention: LED street light using an inclination angle) is an LED luminaire having a configuration for emitting LED light in various directions, but the LED is installed on an inclined surface formed of a plane having a specific inclination angle There is a problem in that light is not emitted in various directions, but only light in a specific direction.

또한 특허출원 10-2005-0011445(발명의 명칭: 수냉식 냉각구조를 채용한 조명유니트)에는 LED로부터 발생되는 열을 냉각시키기 위하여 수냉식 구조를 채용하고 있으나 물의 수용공간이 작고, 물과 냉각판의 접촉면적이 작아 큰 효과를 거둘 수 없는 문제점이 존재한다.In addition, the patent application 10-2005-0011445 (name of the lighting unit employing the water-cooled cooling structure) employs a water-cooled structure to cool the heat generated from the LED, but the water receiving space is small, the contact between the water and the cooling plate There is a problem that the area is small and can not achieve a large effect.

본 발명은 이러한 문제점을 해결하기 위하여 안출된 것으로, 본 발명의 해결과제는 물의 수용공간을 형성하는 일면을 구면으로 형성하고, 구면의 외측에 플렉시블 기판을 설치하고, 플렉시블 기판에 LED를 설치함으로써 LED가 구면의 외측으로 빛을 출사하도록 함으로써 다양한 방향으로 LED 빛이 출사되도록 하고, 기판의 열이 물로 전달되는 표면적을 넓게 형성하고, 물을 동일체적 대비 많이 저장할 수 있도록 함으로써 냉각효율을 높이도록 하기 위한 것이다. The present invention has been made to solve such a problem, the problem of the present invention is to form a surface forming a receiving space of water into a spherical surface, to install a flexible substrate on the outside of the sphere, LED by installing the LED on the flexible substrate By emitting light to the outside of the sphere to emit LED light in various directions, to form a large surface area to transfer the heat of the substrate to the water, and to increase the cooling efficiency by storing a lot of water compared to the same volume will be.

상기 과제를 해결하기 위한 본 발명의 해결수단은 외주면이 볼록한 곡면을 갖는 방열부; 상기 방열부의 외주면을 따라서 설치되는 판재 형상의 플렉시블 기판; 상기 플렉시블 기판의 외주면에 설치되는 복수의 LED들을 포함하는 것이다.Solution to Problem The present invention for solving the above problems is a heat dissipation unit having a curved surface of the outer peripheral surface convex; A plate-shaped flexible substrate disposed along an outer circumferential surface of the heat dissipation unit; It includes a plurality of LEDs installed on the outer peripheral surface of the flexible substrate.

또한 본 발명에서 상기 방열부의 내부에는 상기 외주면과 동일형상의 곡면 홈이 형성되고 상기 곡면홈의 내부에 물이 수용되는 것이 바람직하다.In addition, in the present invention, it is preferable that a curved groove having the same shape as the outer circumferential surface is formed inside the heat dissipating unit, and water is accommodated in the curved groove.

또한 본 발명에서 상기 방열부의 외주면에는 일자형상의 플렉시블 기판 고정부가 돌출 형성되고, 상기 플렉시블 기판 고정부들이 대향하는 면에는 상기 플렉시블 기판이 삽입될 수 있도록 슬롯이 형성되며, 상기 슬롯에 상기 플렉시블 기판이 삽입 설치되는 것이 바람직하다.In addition, in the present invention, the outer peripheral surface of the heat dissipation portion is formed with a straight flexible substrate fixing part protruding, the slot is formed on the surface facing the flexible substrate fixing portion so that the flexible substrate can be inserted, the flexible substrate in the slot It is preferable to be inserted.

또한 본 발명에서 상기 플렉시블 기판은 탄성을 갖는 재질로 이루어지며, 직사각형의 판형으로 형성되는 것이 바람직하다.In addition, in the present invention, the flexible substrate is made of a material having elasticity, and preferably formed in a rectangular plate shape.

또한 본 발명에서 상기 LED들의 외측으로 확산판이 설치되되 상기 확산판은 상기 플렉시블 기판을 따라서 볼록부가 형성되는 것이 바람직하다.In addition, in the present invention, the diffusion plate is installed to the outside of the LED, the diffusion plate is preferably formed with a convex portion along the flexible substrate.

또한 본 발명에서 상기 방열부는 상기 볼록한 곡면이 형성되는 구면 하우징과 상기 구면 하우징에 결합되는 덮개 하우징을 포함하며, 상기 구면 하우징의 내부 중심에는 상기 덮개 하우징을 관통하는 전선관이 형성되는 것이 바람직하다. In addition, in the present invention, the heat dissipation part includes a spherical housing in which the convex curved surface is formed and a cover housing coupled to the spherical housing, and an inner conduit of the spherical housing is preferably formed with a conduit penetrating the cover housing.

상기 과제와 해결수단을 갖는 본 발명에 따르면, LED가 곡면으로 휘어진 플렉시블 기판에 설치되기 때문에 특정 경사각도를 갖는 경사면에 설치된 LED 들로부터 출사되는 LED 등기구보다 넓은 확산각도를 가지므로 최소조도에 대한 평균조도의 비인 균제도(uniformity ratio of illuminance)를 개선하는 효과가 있다.According to the present invention having the above problems and solving means, since the LED is installed on a flexible substrate bent in a curved surface has a wider diffusion angle than the LED luminaire emitted from the LEDs installed on the inclined surface having a specific inclination angle, the average for the minimum illumination It has the effect of improving the uniformity ratio of illuminance.

또한 일렬 배치되는 LED와 플렉시블 기판을 따라서 볼록부가 형성된 확산판을 이용하여 LED 확산각도를 더욱 높일 수 있다.In addition, the diffusion angle of the LED may be further increased by using a diffusion plate in which convex portions are formed along the LEDs arranged in a line and the flexible substrate.

또한 구면 하우징에 의하여 내부에 물을 많이 수용할 수 있을 뿐만 아니라 방열면적을 넓힐 수 있어 방열 효과를 더욱 높힐 수 있다. In addition, the spherical housing can not only accommodate a lot of water therein but also widen the heat dissipation area, thereby further increasing the heat dissipation effect.

이하, 첨부된 도면에 따라서 본 발명의 일실시예를 설명하기로 한다.Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings.

도 1은 본 발명의 전체적인 외관의 사시도이고, 도 2는 도 1의 분해사시도이다.1 is a perspective view of the overall appearance of the present invention, Figure 2 is an exploded perspective view of FIG.

도 1, 2에 도시된 실시예의 LED 등기구(100)는 상부에 전원 소켓에 결합될 수 있도록 통상의 나선부가 형성된 소켓 결합부(1)와 소켓 결합부(1)의 하부에 형성되는 공냉 방열부(3)와, 공냉 방열부(3)의 하부에 설치되되 외주면인 하면으로 볼록부가 형성된 곡면으로 이루어져 하면의 외측에 플렉시블 기판(51)이 설치되는 수냉 방열부(5)와, 수냉 방열부(5)의 하부에 설치되어 플렉시블 기판(51)을 중심으로 바람직하기로는 플렉시블 기판(51)을 따라서 일렬배치되는 LED들에 정점이 형성되는 볼록부들이 교대로 형성되어 LED(53)들의 빛을 확산시키는 확산부(7)와, 확산부(7)의 하부에 설치되는 투명 또는 반 투명재질의 커버(9)로 이루어진다.The LED luminaire 100 of the embodiment shown in Figs. 1 and 2 is an air cooling radiator formed at a lower portion of the socket coupling portion 1 and the socket coupling portion 1 and the socket coupling portion 1 in which a conventional spiral portion is formed so as to be coupled to a power socket on the top. (3) and a water-cooled heat-dissipating portion (5) and a water-cooled heat-dissipating portion (5) provided with a flexible substrate (51) on the outer side of the lower surface, which is formed at the lower portion of the air-cooled heat-dissipating portion (3) and has a curved surface with a convex portion formed on its outer peripheral surface. 5, the convex portions of which vertices are formed in LEDs arranged in a row along the flexible substrate 51 are preferably formed around the flexible substrate 51 to alternately diffuse light of the LEDs 53. It consists of a diffuser 7 and a cover 9 of a transparent or semi-transparent material which is provided below the diffuser 7.

도 3은 본 발명의 공냉 방열부의 내부를 도시하기 위한 사시도이다.3 is a perspective view for showing the inside of the air-cooled heat dissipation unit of the present invention.

공냉 방열부(3)의 상부는 소켓 결합부(1)에 미도시된 나사에 의하여 결합되고, 하부는 수냉 방열부(5)에 미도시된 나사에 의하여 결합된다.The upper portion of the air-cooled heat dissipation part 3 is coupled to the socket coupling part 1 by screws not shown, and the lower part is coupled to the water-cooled heat dissipation part 5 by screws not shown.

또한 공냉 방열부(3)는 상부와 하부가 평면으로 절개되고, 내부가 비어 있는 곡면으로 이루어지되 곡면의 외주면에는 방열 날개들이 상하방향으로 형성된다. In addition, the air-cooled heat dissipation unit 3 is cut in the upper and lower planes, the inside is made of a curved surface, the heat dissipation wings are formed in the vertical direction on the outer peripheral surface of the curved surface.

또한 공냉 방열부(3)의 곡면 들의 내측으로는 LED(53)들을 점등시키기에 적합한 전원으로 입력전원을 변환시키기 위한 전기회로가 설치되는 회로기판(37)을 삽입하기에 적합한 슬롯들이 형성된 지지판(33), (35)들이 구면 내측으로 돌출 형성된다.In addition, the inside of the curved surface of the air-cooled heat dissipation unit 3 is provided with a supporting plate formed with slots suitable for inserting a circuit board 37 in which an electric circuit for converting an input power source into a power source suitable for turning on the LEDs 53 ( 33), 35 are formed to protrude into the spherical surface.

도 4는 본 발명의 수냉 방열부의 구성을 설명하는 분해사시도이고, 도 5는 본 발명의 구면판에 플렉시블 기판이 설치된 상태의 단면도이다.4 is an exploded perspective view for explaining the configuration of the water-cooled heat dissipation unit of the present invention, Figure 5 is a cross-sectional view of a state in which a flexible substrate is installed on the spherical plate of the present invention.

수냉 방열부(5)는 하부에 설치되는 구면 하우징(57)과, 구면 하우징(57)의 상부에 설치되는 덮개 하우징(55)과, 덮개 하우징(55)과 구면판 하우징(57) 사이에 설치되는 수밀 패킹(59)로 이루어진다.The water-cooled heat dissipation unit 5 is installed between the spherical housing 57 installed at the lower portion, the cover housing 55 installed at the upper portion of the spherical housing 57, and the cover housing 55 and the spherical plate housing 57. Consisting of a watertight packing 59.

구면 하우징(57)은 내부에 물을 수용할 수 있도록 외주면이 곡면으로 이루어지며, 내주면 또한 내부에 물을 수용할 수 있도록 곡면으로 형성되어 있으며, 내주면의 중앙에는 전선관(571)이 상향으로 설치되고, 전선관(571)에는 플렉시블 기판(51)과 회로기판(37)을 연결하는 전선이 통과한다.The spherical housing 57 has an outer circumferential surface formed of a curved surface to accommodate water therein, and an inner circumferential surface is formed of a curved surface to accommodate water therein, and a conduit tube 571 is installed upward in the center of the inner circumferential surface thereof. The electric wire connecting the flexible board 51 and the circuit board 37 passes through the conduit tube 571.

구면 하우징(57)의 외주면에는 일자형상의 플렉시블 기판 고정부(573)가 돌출 형성된다. 이때 플렉시블 기판 고정부(573)들이 대향하는 면에는 플렉시블 기판(51)이 삽입될 수 있도록 슬롯이 형성되어 있어 슬롯에 플렉시블 기판(51)을 삽입 고정시킴으로써 플렉시블 기판(51)은 구면 하우징(57)의 외주면에 밀착된다.A straight flexible substrate fixing portion 573 protrudes from the outer circumferential surface of the spherical housing 57. In this case, the flexible substrate 51 is inserted into and fixed to the surface on which the flexible substrate fixing parts 573 are opposite to each other so that the flexible substrate 51 can be inserted into and fixed to the spherical housing 57. It is in close contact with the outer peripheral surface.

또한, 플렉시블 기판(51)은 탄성을 갖는 재질로 이루어지며, 수지나 금속판으로 제작되며 일자 형상의 플렉시블 기판 고정부(573)들의 슬롯에 들어가도록 직사각형으로 형성되며, 외주면에 설치되는 LED(53)에 전원이 공급되도록 배선이 형성되어 있다.In addition, the flexible substrate 51 is made of a material having elasticity, is made of a resin or metal plate and is formed in a rectangular shape to enter the slot of the flexible substrate fixing portion 573 of the linear shape, LED 53 is installed on the outer peripheral surface Wiring is formed so that power is supplied to the.

이와 같이 플렉시블 기판(51)이 구면 하우징(57)의 외주면에 다수 개 설치되는 것은 구면 하우징(57)의 외주면 전체에 하나의 플렉시블 기판이 설치되는 경우에는 플레시블 기판이 주름 등 균일하게 부착되지 않게 되기 때문에 복수개의 플렉시블 기판으로 분할 설치하여야 한다. In this way, the plurality of flexible substrates 51 are provided on the outer circumferential surface of the spherical housing 57 so that when one flexible substrate is installed on the entire outer circumferential surface of the spherical housing 57, the flexible substrate is not uniformly attached to the wrinkles. Therefore, it should be divided into a plurality of flexible substrates.

구면 하우징(57), 패킹(59), 덮개 하우징(55)은 볼트(551)와 너트(553)에 의하여 결합되어 수냉 방열부(5)를 형성하며, 수냉 방열부(5)의 내부에는 물(600)이 수용되게 되어 플렉시블 기판(51)으로부터 구면 하우징(57)에 전달되는 열을 냉각시킨다.The spherical housing 57, the packing 59, and the cover housing 55 are joined by the bolt 551 and the nut 553 to form a water-cooled heat dissipation part 5, and the water inside the water-cooled heat dissipation part 5. The 600 is accommodated to cool the heat transferred from the flexible substrate 51 to the spherical housing 57.

수냉 방열부(5)의 구면 하우징(57)은 하향으로 볼록진 곡면으로 이루어져 있기 때문에 내부에 물을 직사격형으로 이루어진 하우징에 비하여 많은 물을 수용할 수 있으며, 평면에 비하여 곡면으로 플렉시블 기판(53)에 접촉되기 때문에 접촉 표면적이 넓어져 열전달이 빠르게 일어나게 되어 방열 효과를 높힐 수 있다.Since the spherical housing 57 of the water-cooled heat dissipation unit 5 is formed with a curved surface that is convex downward, it can accommodate more water than a housing having a direct firing shape therein, and the flexible substrate ( 53), the contact surface area is increased, so that heat transfer occurs quickly, thereby improving heat dissipation effect.

또한 수냉 방열부(5)의 덮개 하우징(55)에는 물 주입구(555)가 형성되어 있어 물이 증발되어 보충하는 경우에 공냉 방열부(3)와 수냉 방열부(5)를 분리시킨 상태에서 물을 주입할 수 있도록 구성된다. 또한 덮개 하우징(55)의 중앙에는 나사공 또는 관통공(557)이 형성되어 있어 전선관(571)이 관통되도록 하여 전선관(571)의 상부에 형성된 나사산에 너트(559)를 결합시킴으로써 덮개 하우징(55)과 구면 하우징(57)이 고정되도록 하고, 전선관(571)의 단부가 덮개 하우징(55)의 상부로 돌출되도록 하여 전선관(571)의 내부를 회로기판(37)에 연결되는 전선이 통과하도록 한다.In addition, the water inlet 555 is formed in the cover housing 55 of the water-cooled heat dissipation unit 5, and when the water is evaporated to supplement, the air-cooled heat dissipation unit 3 and the water-cooled heat dissipation unit 5 are separated from each other. It is configured to be injected. In addition, a screw hole or a through hole 557 is formed at the center of the cover housing 55 to allow the conduit 571 to pass therethrough so that the nut 559 is coupled to a screw thread formed on the upper part of the conduit 571. ) And the spherical housing 57 is fixed, and the end of the conduit tube 571 protrudes to the upper portion of the cover housing 55 so that the wire connected to the circuit board 37 passes through the inside of the conduit tube 571. .

또한 구면 하우징(57)의 하부에 설치되는 확산판(7)은 내부에 곡면으로 설치되는 LED(53)들이 수용될 수 있도록 곡면으로 형성되되 외주면에 일자 형상의 오목부와 볼록부가 교번적으로 형성되도록 하여 LED(53)들의 빛을 확산시킨다. 이때 볼록부의 정점은 하나의 플렉시블 기판(51)에 설치되는 LED(53)들을 따라서 형성되는 것이 바람직하다.In addition, the diffusion plate 7 installed at the lower portion of the spherical housing 57 is formed to be curved to accommodate the LEDs 53 installed in the curved surface therein, but the concave and convex portions having a straight shape are alternately formed on the outer circumferential surface thereof. To diffuse the light of the LEDs 53. In this case, the apex of the convex portion is preferably formed along the LEDs 53 installed on one flexible substrate 51.

도 1은 본 발명의 전체적인 외관의 사시도이다.1 is a perspective view of the overall appearance of the present invention.

도 2는 도 1의 분해사시도이다.2 is an exploded perspective view of FIG. 1.

도 3은 본 발명의 공냉 방열부의 내부를 도시하기 위한 사시도이다.3 is a perspective view for showing the inside of the air-cooled heat dissipation unit of the present invention.

도 4는 본 발명의 수냉 방열부의 구성을 설명하는 분해사시도이다.4 is an exploded perspective view illustrating the configuration of the water-cooled heat dissipation unit of the present invention.

도 5는 본 발명의 구면판에 플렉시블 기판이 설치된 상태의 단면도이다.5 is a cross-sectional view of a flexible substrate installed on a spherical plate of the present invention.

Claims (6)

외주면이 볼록한 곡면을 갖는 방열부;A heat dissipation unit having a curved surface having an outer circumferential surface; 상기 방열부의 외주면을 따라서 설치되는 판재 형상의 플렉시블 기판;
상기 플렉시블 기판의 외주면에 설치되는 복수의 LED들을 포함하고, A plate-shaped flexible substrate disposed along an outer circumferential surface of the heat dissipation unit;
It includes a plurality of LEDs installed on the outer peripheral surface of the flexible substrate, 상기 방열부의 내부에는 상기 외주면과 동일형상의 곡면 홈이 형성되고 상기 곡면홈의 내부에 물이 수용되는 것을 특징으로 하는 LED 등기구. The inside of the heat dissipation is a LED luminaire, characterized in that the curved groove is formed in the same shape as the outer circumferential surface and water is received in the curved groove. 삭제delete 청구항 1에서, 상기 방열부의 외주면에는 일자형상의 플렉시블 기판 고정부가 돌출 형성되고, 상기 플렉시블 기판 고정부들이 대향하는 면에는 상기 플렉시블 기판이 삽입될 수 있도록 슬롯이 형성되며, 상기 슬롯에 상기 플렉시블 기판이 삽입 설치되는 것을 특징으로 하는 LED 등기구.The method of claim 1, wherein the outer circumferential surface of the heat dissipation portion of the linear flexible substrate fixing portion is formed protruding, the surface facing the flexible substrate fixing portion is formed with a slot so that the flexible substrate can be inserted, the flexible substrate in the slot LED luminaires, characterized in that the installation. 청구항 3에서, 상기 플렉시블 기판은 탄성을 갖는 재질로 이루어지며, 직사각형의 판형으로 형성되는 것을 특징으로 하는 LED 등기구.The LED lamp of claim 3, wherein the flexible substrate is made of a material having elasticity and is formed in a rectangular plate shape. 외주면이 볼록한 곡면을 갖는 방열부;A heat dissipation unit having a curved surface having an outer circumferential surface; 상기 방열부의 외주면을 따라서 설치되는 판재 형상의 플렉시블 기판;
상기 플렉시블 기판의 외주면에 설치되는 복수의 LED들을 포함하고,A plate-shaped flexible substrate disposed along an outer circumferential surface of the heat dissipation unit;
It includes a plurality of LEDs installed on the outer peripheral surface of the flexible substrate, 상기 LED들의 외측으로 확산판이 설치되되 상기 확산판은 상기 플렉시블 기판을 따라서 볼록부가 형성되는 것을 특징으로 하는 LED 등기구.Diffusion plate is provided to the outside of the LED, the diffuser is LED luminaire, characterized in that the convex portion is formed along the flexible substrate. 외주면이 볼록한 곡면을 갖는 방열부;A heat dissipation unit having a curved surface having an outer circumferential surface; 상기 방열부의 외주면을 따라서 설치되는 판재 형상의 플렉시블 기판;
상기 플렉시블 기판의 외주면에 설치되는 복수의 LED들을 포함하고,A plate-shaped flexible substrate disposed along an outer circumferential surface of the heat dissipation unit;
It includes a plurality of LEDs installed on the outer peripheral surface of the flexible substrate, 상기 방열부는 상기 볼록한 곡면이 형성되는 구면 하우징과 상기 구면 하우징에 결합되는 덮개 하우징을 포함하며, 상기 구면 하우징의 내부 중심에는 상기 덮개 하우징을 관통하는 전선관이 형성되는 것을 특징으로 하는 LED 등기구. The heat dissipation unit includes a spherical housing in which the convex curved surface is formed and a cover housing coupled to the spherical housing, wherein an inner conduit of the spherical housing is formed with a conduit penetrating the cover housing.
KR1020090115151A 2009-11-26 2009-11-26 Led light KR100975528B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020090115151A KR100975528B1 (en) 2009-11-26 2009-11-26 Led light

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090115151A KR100975528B1 (en) 2009-11-26 2009-11-26 Led light

Publications (1)

Publication Number Publication Date
KR100975528B1 true KR100975528B1 (en) 2010-08-12

Family

ID=42759559

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090115151A KR100975528B1 (en) 2009-11-26 2009-11-26 Led light

Country Status (1)

Country Link
KR (1) KR100975528B1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102767700A (en) * 2011-05-03 2012-11-07 深圳市裕富照明有限公司 External LED (light-emitting diode) bulb lamp
KR101318038B1 (en) * 2013-06-17 2013-10-14 김대수 Light emitting diode lamp
CN106016090A (en) * 2016-05-26 2016-10-12 佛山燊业光电有限公司 LED ceiling lamp

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100496522B1 (en) 2005-03-23 2005-06-27 주식회사 누리플랜 Led illumination lamp
KR100715039B1 (en) 2005-05-30 2007-05-09 남도금형(주) lamp assembly using light emitting diode
KR20070097679A (en) * 2006-03-28 2007-10-05 박동홍 A diode using lighting apparatus using
JP2009048994A (en) 2007-08-13 2009-03-05 Topco Innovation Co Ltd Light emitting diode lamp

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100496522B1 (en) 2005-03-23 2005-06-27 주식회사 누리플랜 Led illumination lamp
KR100715039B1 (en) 2005-05-30 2007-05-09 남도금형(주) lamp assembly using light emitting diode
KR20070097679A (en) * 2006-03-28 2007-10-05 박동홍 A diode using lighting apparatus using
JP2009048994A (en) 2007-08-13 2009-03-05 Topco Innovation Co Ltd Light emitting diode lamp

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102767700A (en) * 2011-05-03 2012-11-07 深圳市裕富照明有限公司 External LED (light-emitting diode) bulb lamp
KR101318038B1 (en) * 2013-06-17 2013-10-14 김대수 Light emitting diode lamp
CN106016090A (en) * 2016-05-26 2016-10-12 佛山燊业光电有限公司 LED ceiling lamp

Similar Documents

Publication Publication Date Title
KR100996703B1 (en) Illumination apparatus
US8888330B2 (en) Omnidirectional LED lighting apparatus
JP5333758B2 (en) Lighting device and lighting fixture
US8833977B2 (en) Lighting apparatus
KR101195745B1 (en) Led lamp
JP5804588B2 (en) lighting equipment
JP2010262781A (en) Lamp device and luminaire
US20140204572A1 (en) System for Adapting an Existing Florescent Light Fixture with an LED Luminaire
TW201348646A (en) Light emitting diode lamp
KR101072584B1 (en) Led lighting lamp
KR20080093793A (en) Led module for illumination of electric train and led lighting for electric train thereby
US20130039070A1 (en) Lamp with front facing heat sink
US8237339B2 (en) LED illuminating device
KR20110087012A (en) Led lamp
US8807790B2 (en) Lighting apparatus
KR100975528B1 (en) Led light
KR101123790B1 (en) LED light for curved surface lighting
US20160025277A1 (en) System for adapting an existing fluorescent light fixture with an LED luminaire
US8789976B2 (en) Integrated multi-layered illuminating unit and integrated multi-layered illuminating assembling unit
US20170328554A1 (en) Led light source apparatus
TW201441527A (en) Lamp
KR101012308B1 (en) Radiator and Bulb Type LED Lighting Apparatus Using the Same
JP2012174552A (en) Lighting fixture
JP2010262780A (en) Lamp device, and lighting fixture
RU167546U1 (en) LED LAMP

Legal Events

Date Code Title Description
A201 Request for examination
A302 Request for accelerated examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20130807

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20140805

Year of fee payment: 5

FPAY Annual fee payment

Payment date: 20150806

Year of fee payment: 6

FPAY Annual fee payment

Payment date: 20160805

Year of fee payment: 7

FPAY Annual fee payment

Payment date: 20170807

Year of fee payment: 8

LAPS Lapse due to unpaid annual fee