US6760297B2 - Substrate unit for optical head and method for manufacturing the same - Google Patents

Substrate unit for optical head and method for manufacturing the same Download PDF

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Publication number
US6760297B2
US6760297B2 US09/959,512 US95951201A US6760297B2 US 6760297 B2 US6760297 B2 US 6760297B2 US 95951201 A US95951201 A US 95951201A US 6760297 B2 US6760297 B2 US 6760297B2
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Prior art keywords
light
emitting element
light emitting
attachment surface
substrate unit
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US09/959,512
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US20020159379A1 (en
Inventor
Yoshiharu Fujioka
Kyoya Matsuda
Akio Onuki
Kunio Omi
Futoshi Ishii
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Toshiba Corp
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Toshiba Corp
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Assigned to KABUSHIKI KAISHA TOSHIBA reassignment KABUSHIKI KAISHA TOSHIBA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FUJIOKA, YOSHIHARU, ISHII, FUTOSHI, MATSUDA, KYOYA, OMI, KUNIO, ONUKI, AKIO
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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
    • G11B7/22—Apparatus or processes for the manufacture of optical heads, e.g. assembly
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
    • G11B7/123—Integrated head arrangements, e.g. with source and detectors mounted on the same substrate

Definitions

  • the present invention relates to an optical head apparatus for recording or reproducing information in a disc drive for driving optical discs such as a digital video disc (DVD) and a compact disc (CD), particularly to a substrate unit for an optical head preferably applied to a so-called integrated optical unit (hereinafter referred to as IOU) in which a laser diode (hereinafter referred to as LD), a photodiode (hereinafter referred to as PD), a holographic optical element (hereinafter referred to as HOE), and the like are integrated, and to a manufacturing method of the substrate unit.
  • IOU integrated optical unit
  • LD laser diode
  • PD photodiode
  • HOE holographic optical element
  • an LD or PD for use in an optical head apparatus has heretofore been prepared by a manufacturing method similar to a method of forming an element pattern of a semiconductor on a silicon (Si) substrate or a gallium arsenic (GaAs) substrate.
  • an LD is constituted to be irradiated with a laser light substantially in parallel to the surface of the substrate with the LD to be formed thereon.
  • the PD is constituted so as to receive light vertically incident upon the surface of the substrate with the PD to be formed thereon.
  • an optical disc is irradiated with the laser light from the LD, and the reflected light is received by the PD.
  • This constitution needs to have a three-dimensional structure in which the LD and PD are disposed adjacent to each other, and the substrate surface with the PD formed thereon is disposed substantially at right angles to the substrate surface with the LD formed thereon.
  • the substrate with the LD formed thereon is electrically connected to the substrate with the PD formed thereon by wire bonding.
  • wire bonding In this case, three-dimensional wire bonding needs to be performed.
  • the present invention has been developed in consideration with the circumstances, and an object thereof is to provide a substrate unit for an optical head apparatus, in which the LD and PD can be disposed on the same two-dimensional plane, thereby an operation for positioning the LD and PD is facilitated, and an operation efficiency of wire bonding can also be enhanced.
  • an object of the present invention is to provide a manufacturing method of the substrate unit for the optical head apparatus, in which the substrate unit for the optical head apparatus can be manufactured with high precision and satisfactory mass productivity.
  • a substrate unit for an optical head apparatus comprising:
  • a light emitting element attachment surface for attaching a light emitting element which emits a laser light substantially in parallel to the surface with the element to be attached thereto;
  • a light reflecting surface for changing a direction of a light axis of the laser light emitted from the light emitting element attached to the light emitting element attachment surface by a predetermined angle by reflection
  • a light detecting element attachment surface formed on the same two-dimensional plane as a plane of the light emitting element attachment surface, for attaching a light detecting element which receives a light incident from the outside.
  • the light emitting element and light detecting element can be disposed on the same two-dimensional plane, an operation for positioning the light emitting element and light detecting element can be facilitated, and an operation efficiency of wire bonding can also be enhanced.
  • a manufacturing method of a substrate unit for an optical head apparatus comprising:
  • a step of disposing a cut surface of the block obtained in the forming step as a reference surface of a processing, and forming the substrate unit from the block comprising a light emitting element attachment surface for attaching a light emitting element which emits a laser light to the light reflecting surface, and a light detecting element attachment surface for attaching a light detecting element, formed on the same two-dimensional plane as the light emitting element attachment surface, for receiving light incident from the outside.
  • the bonded block formed by connecting the second member to be processed to the first member to be processed with the plurality of light reflecting surfaces formed thereon is cut at the predetermined angle with respect to the light reflecting surface and divided into the plurality of blocks.
  • the substrate unit including the light emitting element attachment surface and light detecting element attachment surface is formed from the block. Therefore, the substrate unit for the optical head apparatus can be manufactured with the high precision and satisfactory mass productivity.
  • FIGS. 1A to 1 C are a front view, top plan view, and side view showing a first embodiment of a substrate unit for an optical head apparatus according to the present invention, and a manufacturing method of the unit;
  • FIG. 2 is a top plan view showing that the substrate unit in the first embodiment is fixed on a wiring substrate;
  • FIG. 3 is a perspective view showing one process of the manufacturing method of the substrate unit in the first embodiment
  • FIG. 4 is a perspective view showing another process of the manufacturing method of the substrate unit in the first embodiment
  • FIG. 5 is a perspective view showing still another process of the manufacturing method of the substrate unit in the first embodiment
  • FIG. 6 is an explanatory view of still another process of the manufacturing method of the substrate unit in the first embodiment
  • FIG. 7 is a perspective view showing a modification example in the first embodiment
  • FIGS. 8A to 8 C are a front view, top plan view, and side view showing a second embodiment of the substrate unit for the optical head apparatus according to the present invention, and the manufacturing method of the unit;
  • FIG. 9 is a perspective view showing one process of the manufacturing method of the substrate unit in the second embodiment.
  • FIG. 10 is a perspective view showing another process of the manufacturing method of the substrate unit in the second embodiment.
  • FIG. 11 is a perspective view showing still another process of the manufacturing method of the substrate unit in the second embodiment.
  • FIG. 12 is a perspective view showing still another process of the manufacturing method of the substrate unit in the second embodiment.
  • FIG. 13 is a perspective view showing one process of the modification example in the first and second embodiments.
  • FIG. 14 is a perspective view showing another process of the modification example in the first and second embodiments.
  • FIG. 15 is a side view showing the modification example in the first and second embodiments.
  • FIG. 16 is a front view showing a third embodiment of the substrate unit for the optical head apparatus according to the present invention, and the manufacturing method of the unit.
  • FIGS. 1A to 1 C show a substrate unit 12 of an optical head apparatus 11 described in the first embodiment.
  • FIG. 1A shows a state of the substrate unit 12 seen from a front direction together with an HOE 13 , objective lens 14 and optical disc 15 .
  • FIG. 1B shows a state of the substrate unit 12 seen from a top direction, that is, a direction in which a laser light goes out/in with respect to the optical disc 15 .
  • FIG. 1C shows a state of the substrate unit 12 seen from a side direction.
  • the optical head apparatus 11 has the substrate unit 12 as an attachment base, and an LD 16 as a light emitting element and a PD 17 as a light detecting element are attached to the substrate unit 12 .
  • the substrate unit 12 is constituted of a first member 18 and second member 19 formed of insulating materials high in conductivity, such as ceramic, glass and sapphire.
  • the first member 18 has a section formed substantially in a right-angled triangle shape, and a reflective film plane 20 formed by a thin film of metal or metal oxide is extended to one tip end portion from a middle portion of a slope 18 a of the member.
  • the reflective film plane 20 is constituted by mirror-surface processing the surface of the first member 18 for forming the plane thereon by means such as lapping and polishing, and forming a thin film of metal or metal oxide on the mirror-processed surface, and has a function of totally reflecting a light emitting wavelength of the LD 16 .
  • a slope 19 a having inclination corresponding to that of the slope 18 a of the first member 18 is formed on an end of the second member 19 .
  • adhesive mediums 21 such as glass, silver wax, solder, and organic adhesive
  • the first member 18 is bonded to the second member 19 .
  • the first member 18 is bonded to the second member 19 by diffusion bonding by heating or pressing.
  • the first member 18 is bonded to the second member 19 so that bottom surfaces 18 b , 19 b constitute the same plane.
  • the members are bonded, subjected to processing such as cutting, and formed in the same plane.
  • a groove 22 is formed along a bonded end of the slope 18 a of the first member 18 with the second member 19 , and a groove 23 is further formed in an edge of the reflective film plane 20 opposite to the groove 22 .
  • the groove 22 has a function of inhibiting the adhesive medium 21 from permeating onto the reflective film plane 20 .
  • An LD attachment surface 24 is formed on the second member 19 , and a conductive film 25 of materials such as gold (Au) is formed on the surface of the LD attachment surface 24 by means such as sputtering, vapor deposition, and plating.
  • the LD 16 is soldered or attached otherwise onto the conductive film 25 .
  • a protrusion 26 projecting from the LD attachment surface 24 is disposed on the second member 19 , and an end surface of the protrusion 26 rising from the LD attachment surface 24 constitutes a reference surface 27 for attaching the LD 16 . Furthermore, a groove 28 is formed in a direction of the bottom surface 19 b along the reference surface 27 .
  • a PD attachment surface 29 extending in the second member 19 is formed adjacent to the reflective film plane 20 of the first member 18 .
  • the PD attachment surface 29 is disposed in a position lower than the LD attachment surface 24 in the direction of the bottom surface 19 b and substantially in parallel to the LD attachment surface 24 .
  • a case in which two surfaces 24 , 29 exist in the same two-dimensional plane includes a case in which the surfaces 24 , 29 exist in parallel to each other but at different heights, and a case in which the surfaces 24 , 29 exist in the same plane at the same height.
  • a wall 30 is formed in a boundary with the LD attachment surface 24 by the PD attachment surface 29 , and this wall 30 is also a reference surface for attaching the PD 17 to the PD attachment surface 29 . Furthermore, a groove 31 is formed in the PD attachment surface 29 along the wall 30 in the direction of the bottom surface 19 b.
  • the PD 17 has not only a reproducing function but also a function of reading a so-called servo signal for accurately tracing a recording pattern of the optical disc 15 , and therefore has a plurality of (four in the shown example) light receiving portions 17 a to 17 d.
  • terminals 17 e to 17 h for electrically connecting the respective light receiving portions 17 a to 17 d to an external circuit are formed in the PD 17 .
  • the substrate unit 12 with the LD 16 and PD 17 attached thereto is fixed onto a wiring substrate 32 .
  • Terminals 32 a to 32 d to be connected to the respective terminals 17 e to 17 h of the PD 17 , and terminals 32 e , 32 f to be connected to the LD 16 and conductive film 25 are disposed in the wiring substrate 32 .
  • the respective terminals 17 e to 17 h of the PD 17 are connected to the terminals 32 a to 32 d via respective wire bondings 32 g
  • the LD 16 is connected to the terminal 32 e by a wire bonding 32 h
  • the conductive film 25 is connected to the terminal 32 f by a wire bonding 32 i.
  • the laser light emitted from the LD 16 is totally reflected by the reflective film plane 20 , and the light axis is changed substantially at a right angle. Thereafter, the light is incident upon the objective lens 14 through the HOE 13 , and focused on the recording pattern of the optical disc 15 . Subsequently, the laser light reflected by the recording pattern is reversed through the objective lens 14 , polarized by the HOE 13 and received by the PD 17 .
  • the LD attachment surface 24 and PD attachment surface 29 are formed together with the reference surfaces 27 , 30 for attachment on the first member 18 and second member 19 integrally connected to each other in the same two-dimensional plane, the LD 16 and PD 17 can precisely and easily be attached.
  • a first member to be processed 33 is formed of ceramic materials excellent in thermal conductivity such as aluminum nitride (AlN) in a rectangular parallelepiped shape, and the reflective film plane is formed on the whole one plane area of the member.
  • AlN aluminum nitride
  • the reflective film plane is disposed by subjecting the whole one plane area of the first member to be processed 33 to mirror-surface processings such as lapping and polishing, and forming a thin film of metal or metal oxide by a so-called optical film forming means such as vapor deposition, sputtering, and plating.
  • the reflective film plane formed on the whole one plane area of the first member to be processed 33 in this manner is removed at predetermined intervals in such a manner that a predetermined width is left in a direction crossing at right angles to a longitudinal direction of the first member to be processed 33 .
  • a plurality of reflective film planes 20 are thereby left.
  • grooves 22 , 23 are formed along the reflective film plane 20 on opposite sides of each reflective film plane 20 in the surface of the first member to be processed 33 with each reflective film plane 20 formed thereon.
  • a groove 34 is formed along the reflective film plane 20 and opposite to each reflective film plane 20 in a plane of the first member to be processed 33 opposite to the plane with each reflective film plane 20 formed thereon.
  • a second member to be processed 35 is formed of ceramic materials excellent in thermal conductivity such as aluminum nitride (AlN) in the rectangular parallelepiped shape, and the grooves 34 are formed in one plane of the member at intervals similar to those of the first member to be processed 33 .
  • AlN aluminum nitride
  • a third member to be processed 36 is molded of the same material as the materials of the first and second members to be processed 33 , 35 , and the reflective film plane 20 and grooves 22 , 23 are formed on one plane of the third member similarly as the first member to be processed 33 .
  • glass materials 21 as respective adhesive mediums are charged into the respective grooves 34 formed in the first and second members to be processed 33 , 35 .
  • first to third members to be processed 33 , 35 , 36 are attached to one another in a relation in which the grooves 34 are positioned in middle portions between the respective reflective film planes 20 disposed adjacent to each other in the same plane. Thereafter, the entirety is heated and the glass material 21 is molten.
  • gaps are generated between the first member to be processed 33 and the second member to be processed 35 , and between the first member to be processed 33 and the third member to be processed 36 by the reflective film plane 20 .
  • the heated and molten glass material 21 is diffused in the gap by the capillary phenomenon. Thereafter, when the entirety is cooled, the first to third members to be processed 33 , 35 , 36 are bonded to one another via the glass material 21 , and here a bonded block is formed.
  • the glass material 21 is inhibited from being diffused by the grooves 22 , 23 on opposite sides of the reflective film plane 20 . Therefore, the glass material 21 is prevented from permeating into the surface of the reflective film plane 20 , and the glass material 21 is prevented from adhering to the surface of the reflective film plane 20 .
  • FIG. 3 shows an example in which the second and third members to be processed 35 , 36 are attached to opposite surfaces of the first member to be processed 33 , respectively.
  • one or a plurality of members to be processed constituted similarly as the first member to be processed 33 may be disposed between the first member to be processed 33 and the third member to be processed 36 in order to form the bonded block.
  • the bonded block formed as described above is cut along a longitudinal direction of the reflective film plane 20 at a predetermined angle from a side surface so that one reflective film plane 20 of the first member to be processed 33 and one reflective film plane 20 of the third member to be processed 36 are included.
  • a block 37 is thus obtained.
  • a cut angle for example, of 45° is selected with respect to the reflective film plane 20 .
  • FIG. 4 shows that the block 37 cut/divided as described above is subjected to a processing for obtaining the LD attachment surface 24 for attaching the LD 16 .
  • two first members to be processed 33 are disposed between the second member to be processed 35 and the third member to be processed 36 .
  • a bottom surface 37 a and top surface 37 b of the block 37 are cut surfaces cut along the dashed line A shown in FIG. 3 .
  • a cutout portion 37 c is formed in a vertical direction to the bottom surface 37 a from the top surface 37 b by a grindstone processing, and the LD attachment surface 24 is formed on the bottom surface of the cutout portion 37 c .
  • a groove 28 is additionally formed along an end of the LD attachment surface 24 .
  • the conductive film 25 is formed of gold (Au) on the surface of the LD attachment surface 24 by methods such as sputtering, vapor deposition, and plating.
  • a cutout portion directed to the bottom surface 37 a from the top surface 37 b of the block 37 is formed by the grindstone processing in the direction crossing at right angles to the cutout portion 37 c in a position at a predetermined distance from one side surface of the block.
  • the PD attachment surface 29 is formed on the bottom surface of the cutout portion.
  • the groove 31 is additionally formed along the end of the PD attachment surface 29 (see FIG. 6 ).
  • the cutout portion is formed in the direction crossing at right angles to the cutout portion 37 c in a position at a predetermined distance from the position in which the PD attachment surface 29 is formed, and the PD attachment surface 29 is formed. That is, the PD attachment surface 29 is successively formed at a predetermined interval in the depth direction (arrow direction) of the block 37 shown in FIG. 4 .
  • the conductive film 25 shown in FIG. 4 may be formed after the PD attachment surface 29 is formed.
  • FIG. 5 shows a step of further subjecting the block 37 disposed in the position shown in FIG. 4 to the grindstone processing, and exposing the reflective film plane 20 .
  • a rotating grindstone 38 is attached to a position between the cutout portion 37 c of the second member to be processed 35 , and the bonded/connected portion of the first and second members to be processed 33 , 35 , and moved to the bottom surface 37 a in a vertical direction, until a corner of the grindstone reaches the vicinity of the groove 22 .
  • a rotating grindstone 39 is attached to the position between the cutout portion 37 c of the first member to be processed 33 , and the bonded/connected portion of the first and second members to be processed 33 , 35 , and moved to the bottom surface 37 a in the vertical direction, until the corner of the grindstone reaches the vicinity of the groove 23 .
  • the second member to be processed 35 covering the reflective film plane 20 is removed by the processing by the grindstones 38 , 39 , and the reflective film plane 20 is exposed.
  • a portion including the plane cut by the grindstone 38 forms the protrusion 26 , and a wall continued from the groove 28 constitutes the reference surface 27 for attachment of the LD 16 .
  • each reflective film plane 20 can be exposed.
  • FIG. 6 shows the block 40 formed as described above. It is understood that a portion with the PD attachment surface 29 formed therein is clearly divided from a portion constituted of the reflective film plane 20 , protrusion 26 , LD attachment surface 24 , conductive film 25 , respective grooves 22 , 23 , 28 , and the like.
  • the groove 31 is formed in the boundary between the portion with the PD attachment surface 29 formed therein and the portion with the LD attachment surface 24 formed therein, and the vertical wall 30 of the portion with the LD attachment surface 24 formed therein, continued to the groove 31 , is the reference surface for attaching the PD 17 .
  • the substrate unit 12 is obtained.
  • the substrate unit 12 which can easily be manufactured and which is superior in mass productivity and high in precision can be formed.
  • FIG. 7 shows a modification example of the aforementioned substrate unit.
  • the LD attachment surface and PD attachment surface are formed on the same plane 42 , and a conductive film 43 is formed on the plane 42 .
  • a method of constituting the optical head apparatus by this substrate unit 41 comprises, for example, attaching LD to the plane 42 , subsequently allowing the LD to emit light, and positioning PD on the plane 42 based on this light emitting point.
  • the reflective film plane 20 is disposed on one side of the groove 31 formed in the substrate unit 12 in the first embodiment, but may be formed in a middle portion of the substrate unit 12 over the groove 31 , on a side opposite to the LD via the groove 31 , and on the whole substrate unit 12 in a width direction in accordance with an arrangement design of an optical system, LD 16 and PD 17 .
  • an insulating ceramic high in thermal conductivity is used as the member forming the substrate unit 12
  • a conductive metal high in thermal conductivity such as copper (Cu)
  • earth designs of the LD 16 , PD 17 and wiring substrate 32 it is also possible to form the unit of a conductive metal high in thermal conductivity, such as copper (Cu), depending on earth designs of the LD 16 , PD 17 and wiring substrate 32 .
  • the LD 16 can directly be bonded to the substrate unit 12 without requiring the conductive film 25 .
  • the number of first members to be processed 33 laminated between the second member to be processed 35 and the third member to be processed 36 can appropriately be selected as the occasion demands.
  • the number of reflective film planes 20 and grooves 22 , 23 , 34 formed on the first to third members to be processed 33 , 35 , 36 can appropriately be increased/decreased as the occasion demands.
  • a bonding connection by silver wax, solder, organic adhesive, and the like, or diffusion bonding by heating/pressing can be used to connect the first to third members to be processed 33 , 35 , 36 .
  • the manufacturing method of the substrate unit 12 described with reference to FIGS. 3 to 7 is efficient, but the manufacturing method of the substrate unit 12 according to the present invention is not necessarily limited to this procedure.
  • the method may comprise: first cutting the block 37 shown in FIG. 4 in a direction crossing the reflective film plane 20 ; subjecting the cut block to the processing for forming the LD attachment surface 24 , exposing the reflective film plane 20 , and forming the protrusion 26 ; and subsequently cutting the block into a size of the substrate unit 12 .
  • the method may comprise: subjecting the portion in which the reflective film plane 20 is to be formed to the mirror-surface processing without forming the reflective film plane 20 beforehand; exposing the portion with the reflective film plane 20 to be formed therein by the grindstone processing; and simultaneously forming the reflective film plane 20 and conductive films 25 , 43 .
  • the block may be constituted by processing a single member, not a connected member of the first to third members to be processed 33 , 35 , 36 .
  • the substrate unit 12 it is possible to form the reflective film plane 20 , LD attachment surface 24 and PD attachment surface 29 on the integrally connected member, and attachment position precision of the LD 16 and PD 17 during assembling can easily be enhanced.
  • the LD attachment surface 24 and PD attachment surface 29 are disposed in the same two-dimensional plane, wire bonding for wiring can easily be performed.
  • the manufacturing method of the substrate unit 12 comprises: laminating and bonding the third member to be processed 36 with the reflective film plane 20 formed on one surface thereof, the second member to be processed 35 with the groove 34 for the adhesive medium 21 disposed in one surface thereof, and the first member to be processed 33 with the reflective film plane 20 and groove 34 formed on the respective surfaces thereof; and subjecting the bonded block to the grinding processing, cutting processing, and the like in order to manufacture the substrate unit 12 . Therefore, the reflective film plane 20 is not damaged in a middle step, and a large amount of high-quality substrate units 12 can be manufactured.
  • FIGS. 8A to 8 C the same parts as those of FIGS. 1A to 1 C are denoted by the same reference numerals.
  • the first member 18 holds a metal member 44 , having a high thermal conductivity and formed of iron (Fe) or copper (Cu), in a direction substantially crossing at right angles to the slope 18 a from the portion of the slope 18 a with the reflective film plane 20 formed thereon.
  • the surface of the metal member 44 exposed on a slope 18 a side is mirror-surface processed beforehand by means such as lapping and polishing, and the thin film of metal or metal oxide is formed as the reflective film plane 20 on the mirror-surface processed surface.
  • a high-reflectance mirror can be formed.
  • the thermal conductivity of the metal member 44 is high, a larger heat radiation effect is expected, a function as a heat sink can also be fulfilled, and the shape of the substrate unit 12 can therefore be reduced and thinned.
  • a first member to be processed 45 is molded into a rectangular parallelepiped shape in which a plurality of ceramic members having a high thermal conductivity such as aluminum nitride (AlN), and a plurality of iron or copper metal members 44 are alternately superposed upon one another, integrally connected to one another by adhesion or heating/pressing, and the metal members 44 are exposed in band forms at predetermined intervals on the surface.
  • AlN aluminum nitride
  • the respective reflective film planes 20 are formed on the surfaces of the respective metal members 44 exposed on one plane of the first member to be processed 45 .
  • the reflective film plane 20 is disposed by forming the thin film of metal or metal oxide on the surface of the metal member 44 subjected to the mirror-surface processing, such as lapping and polishing, by a so-called optical film forming means such as vapor deposition, sputtering, and plating.
  • the grooves 22 , 23 are formed along the reflective film plane 20 on opposite sides of each reflective film plane 20 .
  • a second member to be processed 46 is disposed opposite to the surface of the first member to be processed 45 with each reflective film plane 20 formed thereon.
  • This second member to be processed 46 is also formed of the ceramic material having a high thermal conductivity such as aluminum nitride (AlN) in the rectangular parallelepiped shape.
  • the glass material which functions as the adhesive member 21 is disposed between the first member to be processed 45 and the second member to be processed 46 excluding the portion of each reflective film plane 20 of the first member to be processed 45 .
  • a third member to be processed 47 having the same constitution as that of the first member to be processed 45 is disposed on the surface of the first member to be processed 45 opposite to the surface thereof with the reflective film plane 20 formed thereon.
  • the third member to be processed 47 is disposed in such a manner that the metal member 44 of the third member is disposed in the middle portion between the metal members 44 of the first member to be processed 45 disposed adjacent to each other.
  • the glass material which functions as the adhesive member 21 is also disposed between the first member to be processed 45 and the third member to be processed 47 excluding the portion of each reflective film plane 20 of the third member to be processed 47 .
  • further members to be processed having the same constitution as that of the first member to be processed 45 may also be disposed on the surface of the third member to be processed 47 opposite to the surface thereof with the reflective film plane 20 formed thereon.
  • the first to third members to be processed 45 , 46 , 47 disposed as described above are all heated, and the glass material 21 is molten.
  • the gaps are generated between the first member to be processed 45 and the second member to be processed 46 , and between the first member to be processed 45 and the third member to be processed 47 by the reflective film plane 20 .
  • the heated and molten glass material 21 is diffused in the gap by the capillary phenomenon. Thereafter, when the entirety is cooled, the first to third members to be processed 45 , 46 , 47 are bonded to one another via the glass material 21 , and here a bonded block is formed.
  • the glass material 21 is inhibited from being diffused by the grooves 22 , 23 on opposite sides of the reflective film plane 20 . Therefore, the glass material 21 is prevented from permeating into the surface of the reflective film plane 20 , and the glass material 21 is prevented from adhering to the surface of the reflective film plane 20 .
  • the bonded block formed as described above is cut along the longitudinal direction of the reflective film plane 20 at the predetermined angle from the side surface so that one reflective film plane 20 of the first member to be processed 45 and one reflective film plane 20 of the third member to be processed 47 are included.
  • a block 48 is thus obtained.
  • the cut angle for example, of 45° is selected with respect to the reflective film plane 20 .
  • FIG. 10 shows that the block 48 cut/divided as described above is subjected to the processing for obtaining the LD attachment surface 24 for attaching the LD 16 .
  • two first members to be processed 45 and two third members to be processed 47 are included.
  • a bottom surface 48 a and top surface 48 b of the block 48 are cut surfaces cut along the dashed line A shown in FIG. 9 .
  • a cutout portion 48 c is formed by the grindstone processing in a vertical direction to the bottom surface 48 a from the top surface 48 b , and the LD attachment surface 24 is formed on the bottom surface of the cutout portion 48 c .
  • the groove 28 is additionally formed along the end of the LD attachment surface 24 .
  • the conductive film 25 is formed of gold (Au) by methods such as sputtering, vapor deposition, and plating on the surface of the LD attachment surface 24 .
  • a cutout portion 48 d directed to the bottom surface 48 a from the top surface 48 b of the block 48 is formed by the grindstone processing in the direction crossing at right angles to the cutout portion 48 c in the position at the predetermined distance from one side surface of the block.
  • the PD attachment surface 29 is formed on the bottom surface of the cutout portion 48 d .
  • the groove 31 is additionally formed along the end of the PD attachment surface 29 (see FIG. 12 ).
  • the cutout portion 48 d is formed in the direction crossing at right angles to the cutout portion 48 c in a position at a predetermined distance from the position in which the PD attachment surface 29 is formed, and the PD attachment surface 29 is formed. That is, the PD attachment surface 29 is successively formed at the predetermined interval in the depth direction (arrow direction) of the block 48 shown in FIG. 10 .
  • the conductive film 25 shown in FIG. 10 may be formed after the PD attachment surface 29 is formed.
  • FIG. 11 shows a step of further subjecting the block 48 disposed in the position shown in FIG. 10 to the grindstone processing, and exposing the reflective film plane 20 .
  • a rotating grindstone 49 is attached to a position between the cutout portion 48 c of the second member to be processed 46 , and the bonded/connected portion of the first and second members to be processed 45 , 46 , and moved to the bottom surface 48 a in the vertical direction, until the corner of the grindstone reaches the vicinity of the groove 22 .
  • a rotating grindstone 50 is attached to the position between the cutout portion 48 c of the first member to be processed 45 , and the bonded/connected portion of the first and second members to be processed 45 , 46 , and moved to the bottom surface 48 a in the vertical direction, until the corner of the grindstone reaches the vicinity of the groove 23 .
  • the second member to be processed 46 covering the reflective film plane 20 is removed by the processing by the grindstones 49 , 50 , and the reflective film plane 20 is exposed.
  • the portion including the plane cut by the grindstone 49 forms the protrusion 26 , and the wall continued from the groove 28 constitutes the reference surface 27 for attachment of the LD 16 .
  • each reflective film plane 20 can be exposed.
  • FIG. 12 shows the block 51 formed as described above. It is understood that the portion with the PD attachment surface 29 formed therein is clearly divided from the portion constituted of the reflective film plane 20 , protrusion 26 , LD attachment surface 24 , conductive film 25 , respective grooves 22 , 23 , 28 , and the like.
  • the groove 31 is formed in the boundary between the portion with the PD attachment surface 29 formed therein and the portion with the LD attachment surface 24 formed therein, and the vertical wall 30 of the portion with the LD attachment surface 24 formed therein, continued to the groove 31 , is the reference surface for attaching the PD 17 .
  • the substrate unit 12 is obtained.
  • the substrate unit 12 which can easily be manufactured and which is superior in mass productivity and high in precision can be formed.
  • the thermal conductivity of the metal member 44 is high, a larger heat radiation effect can be expected, and the function as the heat sink can also be fulfilled. This can contribute to miniaturization and thinning of the shape of the substrate unit 12 , that is, the shape of the optical head apparatus 11 .
  • each reflective film plane 20 is not formed in the first and third members to be processed 33 , 36 with a plurality of reflective film planes 20 formed therein.
  • a groove 52 having substantially the same width as that of the reflective film plane 20 is formed in a portion disposed opposite to each reflective film plane 20 of the first and third members to be processed 33 , 36 while the first to third members to be processed 33 , 35 , 36 are laminated. While the first to third members to be processed 33 , 35 , 36 are laminated, the groove 52 is formed in such a depth that the bottom surface of the groove does not contact the reflective film plane 20 .
  • the glass material which functions as the adhesive member 21 is disposed between the first and second members to be processed 33 , 35 and between the first and third members to be processed 33 , 36 excluding the portions of the reflective film planes 20 , the entirety is heated, and the glass material 21 is molten.
  • the gaps are generated between the first member to be processed 33 and the second member to be processed 35 , and between the first member to be processed 33 and the third member to be processed 36 by the reflective film plane 20 .
  • the heated and molten glass material 21 is diffused in the gap by capillary phenomenon. Thereafter, when the entirety is cooled, the first to third members to be processed 35 , 35 , 36 are bonded to one another via the glass material 21 , and here the bonded block is formed.
  • the diffused glass material 21 enters the corresponding groove 52 formed in the reflective film plane 20 . Therefore, the glass material 21 is prevented from permeating into the surface of the reflective film plane 20 , and the glass material 21 is prevented from adhering to the surface of the reflective film plane 20 .
  • the manufacturing operation can be facilitated as compared with the means for forming the grooves 22 , 23 on opposite sides of each reflective film plane 20 .
  • FIG. 16 the same parts as those of FIG. 8A are denoted by the same reference numerals.
  • a transmission member 53 for passing light such as glass
  • the reflective film plane 20 is formed in a half mirror.
  • a monitor PD attachment surface 55 for disposing a monitor PD 54 is formed in a portion disposed opposite to a back side of the reflective film plane 20 of the substrate unit 12 .
  • some of the laser light emitted from the LD 16 is transmitted through the half mirror (reflective film plane 20 ) and transmission member 53 and guided to the monitor PD 54 .
  • An output light amount of the LD 16 is monitored by the monitor PD 54 , and an LD driving circuit (not shown) is controlled so that a light emitting output of the LD 16 is constant.
  • the half mirror (reflective film plane 20 ) can be formed by a known technique. That is, the half mirror is obtained by forming the thin film of metal or metal oxide on the mirror-surface processed surface by so-called optical film forming means such as vapor deposition, sputtering, and plating.
  • monitoring and controlling of an operation state of the LD 16 by the monitor PD 54 are broadly performed.
  • a position precision of the monitor PD 54 to the LD 16 can be enhanced, and the LD 16 can securely and efficiently be controlled.
  • the substrate unit 12 can be manufactured with satisfactory mass productivity. Additionally, the reflected light from the optical disc 15 is received by the PD 17 disposed as in FIG. 8 B.
  • a substrate unit for an optical head apparatus in which LD and PD can be disposed on the same two-dimensional plane, a positioning operation of the LD and PD is facilitated, and an operation efficiency of wire bonding can also be enhanced.
  • the substrate unit for the optical head apparatus in which the substrate unit for the optical head apparatus can be manufactured with high precision and satisfactory productivity.
  • the present invention can broadly be utilized in a disc recording/reproducing apparatus for recording or reproducing information with respect to optical discs such as a digital video disc (DVD) and compact disc (CD).
  • DVD digital video disc
  • CD compact disc

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Head (AREA)
  • Semiconductor Lasers (AREA)
US09/959,512 2000-03-15 2001-03-13 Substrate unit for optical head and method for manufacturing the same Expired - Fee Related US6760297B2 (en)

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JP2000-071920 2000-03-15
JP2000071920 2000-03-15
JP2000390020 2000-12-22
JP2000-390020 2000-12-22
PCT/JP2001/001977 WO2001069597A1 (fr) 2000-03-15 2001-03-13 Substrat pour tete optique et son procede de fabrication

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EP (1) EP1235211A4 (ja)
JP (1) JP3866572B2 (ja)
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CN (1) CN1168078C (ja)
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WO (1) WO2001069597A1 (ja)

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US20040105377A1 (en) * 2002-02-08 2004-06-03 Tadashi Taniguchi Optical pickup and disk drive unit
US20040161002A1 (en) * 2003-01-10 2004-08-19 Naoki Kohara Semiconductor laser apparatus and production method thereof

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US6687272B2 (en) * 2001-09-18 2004-02-03 Kabushiki Kaisha Toshiba Semiconductor laser device
JP2004207638A (ja) * 2002-12-26 2004-07-22 Sony Corp 半導体集積装置及びその製造方法
JP4251107B2 (ja) * 2003-05-30 2009-04-08 ソニー株式会社 光学ヘッド及びこれを用いた記録及び／又は再生装置
DE102010026312B4 (de) * 2010-07-06 2022-10-20 Phoenix Contact Gmbh & Co. Kg Anschlusskontakt und Verfahren zur Herstellung von Anschlusskontakten

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US20040105377A1 (en) * 2002-02-08 2004-06-03 Tadashi Taniguchi Optical pickup and disk drive unit
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KR20010114265A (ko) 2001-12-31
EP1235211A1 (en) 2002-08-28
KR100421269B1 (ko) 2004-03-09
EP1235211A4 (en) 2006-08-30
CN1364293A (zh) 2002-08-14
JP3866572B2 (ja) 2007-01-10
TW579513B (en) 2004-03-11
US20020159379A1 (en) 2002-10-31
WO2001069597A1 (fr) 2001-09-20
CN1168078C (zh) 2004-09-22

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