US6649978B2 - Semiconductor module having multiple semiconductor chips - Google Patents
Semiconductor module having multiple semiconductor chips Download PDFInfo
- Publication number
- US6649978B2 US6649978B2 US09/884,223 US88422301A US6649978B2 US 6649978 B2 US6649978 B2 US 6649978B2 US 88422301 A US88422301 A US 88422301A US 6649978 B2 US6649978 B2 US 6649978B2
- Authority
- US
- United States
- Prior art keywords
- chip
- semiconductor chip
- heat sink
- module
- output
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
Claims (11)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/884,223 US6649978B2 (en) | 2001-06-19 | 2001-06-19 | Semiconductor module having multiple semiconductor chips |
KR1020037002361A KR100861863B1 (en) | 2001-06-19 | 2002-06-11 | Semiconductor module having multiple semiconductor chips |
CNA028122658A CN1539168A (en) | 2001-06-19 | 2002-06-11 | Semiconductor assembly with multiple semiconductor chips |
EP02735846A EP1435113A2 (en) | 2001-06-19 | 2002-06-11 | Semiconductor module having multiple semiconductor chips |
PCT/IB2002/002253 WO2002103795A2 (en) | 2001-06-19 | 2002-06-11 | Semiconductor module having multiple semiconductor chips |
JP2003506006A JP2004533124A (en) | 2001-06-19 | 2002-06-11 | Semiconductor module with multiple semiconductor chips |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/884,223 US6649978B2 (en) | 2001-06-19 | 2001-06-19 | Semiconductor module having multiple semiconductor chips |
Publications (2)
Publication Number | Publication Date |
---|---|
US20020190317A1 US20020190317A1 (en) | 2002-12-19 |
US6649978B2 true US6649978B2 (en) | 2003-11-18 |
Family
ID=25384210
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/884,223 Expired - Lifetime US6649978B2 (en) | 2001-06-19 | 2001-06-19 | Semiconductor module having multiple semiconductor chips |
Country Status (6)
Country | Link |
---|---|
US (1) | US6649978B2 (en) |
EP (1) | EP1435113A2 (en) |
JP (1) | JP2004533124A (en) |
KR (1) | KR100861863B1 (en) |
CN (1) | CN1539168A (en) |
WO (1) | WO2002103795A2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9031104B2 (en) | 2011-05-10 | 2015-05-12 | Obzerv Technologies Inc. | Low inductance laser diode bar mount |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10149774A1 (en) * | 2001-10-09 | 2003-04-24 | Bosch Gmbh Robert | Process for packing electronic modules comprises applying a power semiconductor chip on a base plate, applying a logic chip on the base plate, connecting the logic chip with the semiconductor chip, and packing the module |
JP4957183B2 (en) * | 2006-10-30 | 2012-06-20 | 三菱電機株式会社 | Semiconductor device using backside high voltage integrated circuit |
DE102014115882B3 (en) * | 2014-10-31 | 2016-02-25 | Infineon Technologies Ag | An electronic device and a method of manufacturing an electronic device and a method of attaching a semiconductor die to a carrier |
Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63292681A (en) * | 1987-05-26 | 1988-11-29 | Fujitsu Ltd | Semiconductor device and manufacture thereof |
US4947234A (en) | 1986-09-23 | 1990-08-07 | Siemens Aktiengesellschaft | Semiconductor component with power MOSFET and control circuit |
EP0471938A1 (en) * | 1990-07-23 | 1992-02-26 | International Business Machines Corporation | High circuit density thermal carrier |
US5305186A (en) * | 1993-01-27 | 1994-04-19 | International Business Machines Corporation | Power carrier with selective thermal performance |
JPH06169057A (en) | 1993-07-28 | 1994-06-14 | Fuji Electric Co Ltd | Semiconductor device |
JPH06310633A (en) * | 1993-04-21 | 1994-11-04 | Hitachi Ltd | Semiconductor device |
US5814885A (en) * | 1997-04-28 | 1998-09-29 | International Business Machines Corporation | Very dense integrated circuit package |
US6028348A (en) * | 1993-11-30 | 2000-02-22 | Texas Instruments Incorporated | Low thermal impedance integrated circuit |
US6130458A (en) * | 1996-03-28 | 2000-10-10 | Kabushiki Kaisha Toshiba | Power IC having SOI structure |
US6140690A (en) * | 1996-11-18 | 2000-10-31 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device |
US6153912A (en) * | 1999-10-25 | 2000-11-28 | Advanced Micro Devices, Inc. | SOI with conductive metal substrate used as VSS connection |
US6191451B1 (en) * | 1998-01-30 | 2001-02-20 | International Business Machines Corporation | Semiconductor device with decoupling capacitance |
US6214653B1 (en) * | 1999-06-04 | 2001-04-10 | International Business Machines Corporation | Method for fabricating complementary metal oxide semiconductor (CMOS) devices on a mixed bulk and silicon-on-insulator (SOI) substrate |
US6252179B1 (en) * | 1995-04-27 | 2001-06-26 | International Business Machines Corporation | Electronic package on metal carrier |
US6269011B1 (en) * | 1999-02-14 | 2001-07-31 | Yazaki Corporation | Power supply system having semiconductor active fuse |
US6333532B1 (en) * | 1999-07-16 | 2001-12-25 | International Business Machines Corporation | Patterned SOI regions in semiconductor chips |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3679627D1 (en) * | 1985-09-24 | 1991-07-11 | Contraves Ag | MULTILAYER PRINTED CIRCUIT BOARD. |
FR2785087B1 (en) | 1998-10-23 | 2003-01-03 | St Microelectronics Sa | METHOD OF FORMING A SILICON WAFER FROM AN INSULATED HOUSING |
US6798061B2 (en) * | 1999-11-15 | 2004-09-28 | Koninklijke Philips Electronics N.V. | Multiple semiconductor chip (multi-chip) module for use in power applications |
-
2001
- 2001-06-19 US US09/884,223 patent/US6649978B2/en not_active Expired - Lifetime
-
2002
- 2002-06-11 EP EP02735846A patent/EP1435113A2/en not_active Withdrawn
- 2002-06-11 KR KR1020037002361A patent/KR100861863B1/en active IP Right Grant
- 2002-06-11 JP JP2003506006A patent/JP2004533124A/en active Pending
- 2002-06-11 WO PCT/IB2002/002253 patent/WO2002103795A2/en active Application Filing
- 2002-06-11 CN CNA028122658A patent/CN1539168A/en active Pending
Patent Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4947234A (en) | 1986-09-23 | 1990-08-07 | Siemens Aktiengesellschaft | Semiconductor component with power MOSFET and control circuit |
JPS63292681A (en) * | 1987-05-26 | 1988-11-29 | Fujitsu Ltd | Semiconductor device and manufacture thereof |
EP0471938A1 (en) * | 1990-07-23 | 1992-02-26 | International Business Machines Corporation | High circuit density thermal carrier |
US5305186A (en) * | 1993-01-27 | 1994-04-19 | International Business Machines Corporation | Power carrier with selective thermal performance |
JPH06310633A (en) * | 1993-04-21 | 1994-11-04 | Hitachi Ltd | Semiconductor device |
JPH06169057A (en) | 1993-07-28 | 1994-06-14 | Fuji Electric Co Ltd | Semiconductor device |
US6028348A (en) * | 1993-11-30 | 2000-02-22 | Texas Instruments Incorporated | Low thermal impedance integrated circuit |
US6252179B1 (en) * | 1995-04-27 | 2001-06-26 | International Business Machines Corporation | Electronic package on metal carrier |
US6130458A (en) * | 1996-03-28 | 2000-10-10 | Kabushiki Kaisha Toshiba | Power IC having SOI structure |
US6140690A (en) * | 1996-11-18 | 2000-10-31 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device |
US5814885A (en) * | 1997-04-28 | 1998-09-29 | International Business Machines Corporation | Very dense integrated circuit package |
US6191451B1 (en) * | 1998-01-30 | 2001-02-20 | International Business Machines Corporation | Semiconductor device with decoupling capacitance |
US6269011B1 (en) * | 1999-02-14 | 2001-07-31 | Yazaki Corporation | Power supply system having semiconductor active fuse |
US6214653B1 (en) * | 1999-06-04 | 2001-04-10 | International Business Machines Corporation | Method for fabricating complementary metal oxide semiconductor (CMOS) devices on a mixed bulk and silicon-on-insulator (SOI) substrate |
US6333532B1 (en) * | 1999-07-16 | 2001-12-25 | International Business Machines Corporation | Patterned SOI regions in semiconductor chips |
US6153912A (en) * | 1999-10-25 | 2000-11-28 | Advanced Micro Devices, Inc. | SOI with conductive metal substrate used as VSS connection |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9031104B2 (en) | 2011-05-10 | 2015-05-12 | Obzerv Technologies Inc. | Low inductance laser diode bar mount |
Also Published As
Publication number | Publication date |
---|---|
US20020190317A1 (en) | 2002-12-19 |
CN1539168A (en) | 2004-10-20 |
WO2002103795A2 (en) | 2002-12-27 |
EP1435113A2 (en) | 2004-07-07 |
KR20030060877A (en) | 2003-07-16 |
WO2002103795A3 (en) | 2004-04-29 |
JP2004533124A (en) | 2004-10-28 |
KR100861863B1 (en) | 2008-10-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: KONINKLIJKE PHILIPS ELECTRONICS N.V., NETHERLANDS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MUKHERJEE, SATYEN;MOBERS, TON;REEL/FRAME:011925/0904;SIGNING DATES FROM 20010423 TO 20010508 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
AS | Assignment |
Owner name: NXP B.V., NETHERLANDS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:KONINKLIJKE PHILIPS ELECTRONICS N.V.;REEL/FRAME:018635/0787 Effective date: 20061117 |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
FPAY | Fee payment |
Year of fee payment: 8 |
|
FEPP | Fee payment procedure |
Free format text: PAYER NUMBER DE-ASSIGNED (ORIGINAL EVENT CODE: RMPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
AS | Assignment |
Owner name: NXP B.V., NETHERLANDS Free format text: CONFIRMATORY ASSIGNMENT;ASSIGNOR:KONINKLIJKE PHILIPS ELECTRONICS N.V.;REEL/FRAME:027931/0525 Effective date: 20120326 |
|
AS | Assignment |
Owner name: SEONG CAPITAL LTD. LIMITED LIABILITY COMPANY, DELA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:NXP B.V.;REEL/FRAME:028049/0649 Effective date: 20120327 |
|
FPAY | Fee payment |
Year of fee payment: 12 |
|
AS | Assignment |
Owner name: XENOGENIC DEVELOPMENT LIMITED LIABILITY COMPANY, D Free format text: MERGER;ASSIGNOR:SEONG CAPITAL LTD. LIMITED LIABILITY COMPANY;REEL/FRAME:037421/0685 Effective date: 20150826 |