US6328427B1 - Method of producing a wiring substrate - Google Patents

Method of producing a wiring substrate Download PDF

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Publication number
US6328427B1
US6328427B1 US08/897,550 US89755097A US6328427B1 US 6328427 B1 US6328427 B1 US 6328427B1 US 89755097 A US89755097 A US 89755097A US 6328427 B1 US6328427 B1 US 6328427B1
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United States
Prior art keywords
bonding
layer
wiring substrate
metal layer
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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US08/897,550
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English (en)
Inventor
Kenjiro Watanabe
Koji Yamakawa
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Canon Inc
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Canon Inc
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Priority to US08/897,550 priority Critical patent/US6328427B1/en
Application granted granted Critical
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Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14024—Assembling head parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding

Definitions

  • the present invention relates to a flexible printed circuit board, and more particularly to a flexible printed circuit board for electrical connection by wire bonding and an ink jet recording head using the same.
  • a flexible printed circuit board As the size of an electronic equipment is reduced, a flexible printed circuit board (FPC) is widely used in view of the freedom of packaging form and the space saving.
  • FPC flexible printed circuit board
  • WB wire bonding
  • An ink jet recording head is explained as an example of using the WB for the connection of the FPC.
  • FIG. 8 shows a sectional view of a packaging unit of an ink jet recording head previously proposed by the inventors of the present invention, as an example of the use of the WB for the connection of the FPC.
  • FIGS. 4A and 4B show perspective views of the ink jet recording head of FIG. 8 .
  • FIGS. 4A, 4 B and FIG. 8 An overall construction of the ink jet recording head is explained with reference to FIGS. 4A, 4 B and FIG. 8 .
  • a heater board 4 having an Si substrate on which a heater for applying a thermal energy to ink is formed and one end of an FPC 1 for transmitting an electrical signal sent from a main unit of a recording apparatus to the heater board 4 are electrically connected by a wire bonding 12 .
  • the FPC 1 is bent toward a rear surface (lower surface) of the support plate 5 and the other end of the FPC 1 is connected to the support plate 5 .
  • Contact pads 111 which are electrically connected to a contact pad of the main unit of the recording apparatus are formed on the FPC 1 .
  • the ink jet recording head is supplied with the electrical signal from the main unit of the recording apparatus through the contact pads 111 on the FPC 1 .
  • the support plate 5 is covered with a packaging cover 9 and ink is supplied from the main unit of the recording apparatus to a grooved top plate 8 having a common liquid chamber and discharge ports 10 forming nozzles through an ink supply member 11 provided in the packaging cover 9 , and it is heated by the heater on the heater board 4 and discharged from the discharge ports 10 .
  • Sealing agent 10 such as silicone rubber is applied to the connecting area of the wires 12 to protect the bonding part from an external force.
  • a layer structure of the WB connecting part of the FPC 1 is now explained with reference to FIG. 7 .
  • the layer structure in the connecting part of the FPC 1 usually comprises, starting from a bottom layer, reinforcing plate 101 made of glass epoxy and provided only on the support member, a bonding layer 108 made of a acryl resin, a base film 103 made of polymide, a bonding layer 104 made of epoxy resin, a conductive layer 105 (10-35 ⁇ m) made of a copper foil, a nickel plating layer 109 (2-3 ⁇ m), a gold plating layer 107 (1 ⁇ m) serving as a contact member, in this order. Since the nickel plating layer is provided to enhance the contact of the copper of the conductive layer and the gold of the contact member, a thickness of 2-3 ⁇ m is sufficient.
  • the FPC 1 is bonded to the substrate 5 by the bonding material 2 a applied to the reinforcement plate 101 .
  • Other printed circuit board 7 is also bonded to the substrate 5 by the bonding material 2 b.
  • the gold plating layer 107 of the FPC 1 and the WB pad 701 of the other printed circuit board 7 are electrically connected by a gold wire 12 .
  • the gold wire, the gold plating layer 107 and the WB pad 701 are ball-bonded.
  • FIG. 1 shows a sectional view of a WB art of a first embodiment of an ink jet recording head of the present invention
  • FIG. 2 shows a graph of a relation between a nickel plating thickness and a WB strength
  • FIG. 3 shows a graph of a relation between a reinforcement plate bonding material and the WB strength
  • FIGS. 4A and 4B show top, bottom and perspective views of the first embodiment of the ink jet recording head of the present invention
  • FIG. 5 shows a sectional view of a WB part of a second embodiment of the ink jet recording head of the present invention
  • FIG. 6 shows a sectional view of a WB part of a third embodiment of the ink jet recording head of the present invention
  • FIG. 7 shows a sectional view of a WB part of a prior art ink jet recording head
  • FIG. 8 shows a sectional view of a prior art ink jet recording head
  • FIG. 9 shows a relation between a thickness of a nickel layer and a maximum wire bonding strength at that thickness.
  • FIG. 2 shows a relation between an ultrasonic wave strength and a pull strength (bonding strength) after the wire bonding for three nickel layers having thicknesses of 5, 10 and 15 ⁇ m, respectively.
  • the pull strength is measured by pulling the wire until it is broken while the wire at the connection part of the FPC is pulled by a needle with a weight.
  • FIG. 9 shows a relation between the thickness of the nickel layer and a maximum WB strength at that thickness.
  • the layer having the thickness of 10 ⁇ m or 15 ⁇ m can be bonded with a much lower ultrasonic wave strength than that of the layer having the thickness of 5 ⁇ m and the bonding strength is higher.
  • the bonding at a low ultrasonic wave strength means that the wire may be bonded without substantial collapse and a sufficient margin may be assured at the neck of the wire.
  • the inventors have found that there is no significant difference between 10 ⁇ m and 15 ⁇ m and a sufficient bonding condition is attained when the thickness is no less than 10 ⁇ m.
  • the thickness of the nickel plating is unduly large, the plating process takes a long time and a production efficiency is lowered, the flatness of the plating surface is damaged, the bonding area is reduced and the bonding strength is reduced. Accordingly, the thickness bewteen 10 ⁇ m and 20 ⁇ m is most preferable in view of the precision of the plating process.
  • FIG. 3 shows a test result of a bonding strength for FPC's which use an acryl bonding film and an epoxy bonding film to bond a reinforcement plate and a polyimide base film. No difference is observed between the bonding strengths but the epoxy bonding film can be bonded at a lower ultrasonic wave strength than that of the acryl bonding film and a better WB condition is attained. When it is used together with the condition of the nickel plating thickness, the reliability and margin of the WB are further increased.
  • the epoxy bonding material is used to bond the conductive layer made of the copper foil and the polyimide base film.
  • an FPC without a bonding layer between the conductive layer and the polymide layer (which may be prepared by coating a polymide on a copper foil) may be used to further increase the hardness of the conductive layer underlying layer and enhance the WB condition.
  • the reinforcement plate may not be used and the base film 103 may be directly bonded to the support plate 5 by an epoxy bonding film or an epoxy bonding material 102 to attain the same effect.
  • FIG. 1 shows a sectional view of a layer structure of a WB packaging part of an ink jet recording head having an FPC of the present invention.
  • a reinforcement plate 101 made of glass epoxy is bonded by a bonding material 2 a , and a base film 103 made of polymide is bonded to the reinforcement plate 101 through a bonding layer 102 made of an epoxy heat setting bonding film.
  • a conductive layer 105 , a nickel plating layer 106 and a gold plate layer 107 having thicknesses of 18 ⁇ m, 10 ⁇ m and 1 ⁇ m, respectively, are sequentially stacked by plating on the base film 103 through a bonding layer 104 made of epoxy resin to form an FPC.
  • a heater board 4 is bonded by a bonding material 2 b adjacent to the reinforcement plate 101 on the substrate 5 .
  • An aluminum wire 3 is wedge bonded to the gold plating layer 107 of the FPC 1 and the aluminum WB pad of the heater board 4 to electrically connect the FPC 1 and the heater board 4 .
  • Sealing agent 6 of silicone rubber is applied to the bonding part to complete the ink jet recording head shown in FIGS. 4A and 4B.
  • An ink jet recording head was formed with the same condition as that of the Embodiment 1 except that the thickness of the nickel plating layer was 20 ⁇ m.
  • An ink jet recording head was formed with the same condition as that of the Embodiment 1 except that the thickness of the nickel plating layer was 30 ⁇ m.
  • An ink jet recording head was formed with the same condition as that of the Embodiment 1 except that the reinforcement plate and the base film were bonded by an acryl bonding film instead of the thermal setting film and the thickness of the nickel plating layer was 3 ⁇ m.
  • the ink jet recording heads of the embodiments and the comparative examples were tested for durability.
  • the ink jet recording head has 48 nozzles and the same number of wire bondings as the number of nozzles are provided.
  • the test was made by leaving the ink jet recording head in an environment of a temperature of 60° C. and a humidity of 90% for one month and a current was conducted through each wire to test the conductivity.
  • the ink jet recording heads of the embodiments exhibited good results without break of wire.
  • the comparative example 1 exhibited the break of wire. It is considered that this is due to the poor flatness of the surface of the pad area which reduces the bonding area resulting in the breakdown by a stress due to a temperature change of the sealing agent.
  • the comparative example 2 not only the break at the conduction of the current is observed but also more than half of the bonding were not formed from the beginning. It is considered that this is because the strength at the bonding area is insufficient and the vibration is attenuated to cause the defects in the connection of the bonding.
  • an ink jet recording head which forms bubbles of the ink by using a thermal energy to discharge ink droplets has been shown although other recording head such as one which discharges ink droplets by using a piezoelectric element may be used in the present invention.
  • the present invention is not limited to the illustrated embodiments but the wire bonding of the FPC by using the aluminum wire falls in the scope of the present invention.
  • nickel and gold are plated in this order on the conductive pattern of the copper foil at the wire bonding area of the FPC, the thickness of the nickel plating layer is selected to 10 ⁇ m to 20 ⁇ m and the FPC is bonded to the reinforcement plate by the epoxy bonding film.
  • the high reliability wire bonding on the FPC is attained with the stable condition and the high reliability and inexpensive ink jet recording head is provided by using the FPC.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Accessory Devices And Overall Control Thereof (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Ink Jet (AREA)
US08/897,550 1993-01-19 1997-07-21 Method of producing a wiring substrate Expired - Fee Related US6328427B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US08/897,550 US6328427B1 (en) 1993-01-19 1997-07-21 Method of producing a wiring substrate

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP698093 1993-01-19
JP5-006980 1993-01-19
JP5-331104 1993-12-27
JP33110493A JP3253203B2 (ja) 1993-01-19 1993-12-27 フレキシブル配線基板、及びこれを使用したインクジェット記録ヘッドおよびインクジェット記録ヘッドの製造方法
US18341994A 1994-01-19 1994-01-19
US08/897,550 US6328427B1 (en) 1993-01-19 1997-07-21 Method of producing a wiring substrate

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US18341994A Continuation 1993-01-19 1994-01-19

Publications (1)

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US6328427B1 true US6328427B1 (en) 2001-12-11

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US08/897,550 Expired - Fee Related US6328427B1 (en) 1993-01-19 1997-07-21 Method of producing a wiring substrate

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US (1) US6328427B1 (fr)
EP (1) EP0607929B1 (fr)
JP (1) JP3253203B2 (fr)
DE (1) DE69424073T2 (fr)

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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US20040218009A1 (en) * 2003-04-30 2004-11-04 Mohammad Akhavain Methods for forming and protecting electrical interconnects and resultant assemblies
US7043837B2 (en) * 2000-06-07 2006-05-16 Fuji Photo Film Co., Ltd. Method of manufacture of inkjet printer head
US20060131263A1 (en) * 2003-04-30 2006-06-22 Kawamura Naoto A Slotted substrates and methods and systems for forming same
US20060290744A1 (en) * 2005-06-25 2006-12-28 Lee Jao-Cheol Wire bonding structure to electrically connect a printhead chip to a flexible printed circuit of an ink cartridge and method thereof
US20070229594A1 (en) * 2006-03-29 2007-10-04 Lexmark International, Inc. Flexible Adhesive Materials for Micro-Fluid Ejection Heads and Methods Relating Thereto
US20070284135A1 (en) * 2006-06-12 2007-12-13 Fujitsu Limited Flexible printed-circuit boards bonding method and printed circuit board
EP2345314A1 (fr) * 2008-10-18 2011-07-20 Conti Temic Microelectronic GmbH Carte de circuit imprimé flexible
US9949728B2 (en) 2007-04-05 2018-04-24 W.L. Gore & Associates, Inc. Septal closure device with centering mechanism
US10278705B2 (en) 2008-03-07 2019-05-07 W. L. Gore & Associates, Inc. Heart occlusion devices
US10315422B2 (en) * 2017-02-01 2019-06-11 Canon Kabushiki Kaisha Liquid discharging head substrate, liquid discharging head, and liquid discharging apparatus
US10368853B2 (en) 2014-06-06 2019-08-06 W. L. Gore & Associates, Inc. Sealing device and delivery system
US10792025B2 (en) 2009-06-22 2020-10-06 W. L. Gore & Associates, Inc. Sealing device and delivery system
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US10828019B2 (en) 2013-01-18 2020-11-10 W.L. Gore & Associates, Inc. Sealing device and delivery system
CN112543703A (zh) * 2018-07-30 2021-03-23 锡克拜控股有限公司 多芯片模块(mcm)组件和打印条
US11375988B2 (en) 2003-07-14 2022-07-05 W. L. Gore & Associates, Inc. Patent foramen ovale (PFO) closure device with linearly elongating petals
US11404372B2 (en) * 2019-05-02 2022-08-02 KYOCERA AVX Components Corporation Surface-mount thin-film fuse having compliant terminals

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US7043837B2 (en) * 2000-06-07 2006-05-16 Fuji Photo Film Co., Ltd. Method of manufacture of inkjet printer head
US7564125B2 (en) 2002-12-06 2009-07-21 General Electric Company Electronic array and methods for fabricating same
US20040109299A1 (en) * 2002-12-06 2004-06-10 Burdick William E. Electronic array and methods for fabricating same
US20040198074A1 (en) * 2003-04-01 2004-10-07 Swier Wayne K. Electrical interconnect assemblies and methods of forming same
US6905342B2 (en) 2003-04-01 2005-06-14 Hewlett-Packard Development Company, L.P. Protected electrical interconnect assemblies
US6913343B2 (en) 2003-04-30 2005-07-05 Hewlett-Packard Development Company, L.P. Methods for forming and protecting electrical interconnects and resultant assemblies
US20050248617A1 (en) * 2003-04-30 2005-11-10 Mohammad Akhavain Methods for forming and protecting electrical interconnects and resultant assemblies
US20060131263A1 (en) * 2003-04-30 2006-06-22 Kawamura Naoto A Slotted substrates and methods and systems for forming same
US7338149B2 (en) 2003-04-30 2008-03-04 Hewlett-Packard Development Company, L.P. Methods for forming and protecting electrical interconnects and resultant assemblies
US20040218009A1 (en) * 2003-04-30 2004-11-04 Mohammad Akhavain Methods for forming and protecting electrical interconnects and resultant assemblies
US11375988B2 (en) 2003-07-14 2022-07-05 W. L. Gore & Associates, Inc. Patent foramen ovale (PFO) closure device with linearly elongating petals
US20060290744A1 (en) * 2005-06-25 2006-12-28 Lee Jao-Cheol Wire bonding structure to electrically connect a printhead chip to a flexible printed circuit of an ink cartridge and method thereof
US20070229594A1 (en) * 2006-03-29 2007-10-04 Lexmark International, Inc. Flexible Adhesive Materials for Micro-Fluid Ejection Heads and Methods Relating Thereto
US7766455B2 (en) * 2006-03-29 2010-08-03 Lexmark International, Inc. Flexible adhesive materials for micro-fluid ejection heads and methods relating thereto
US20070284135A1 (en) * 2006-06-12 2007-12-13 Fujitsu Limited Flexible printed-circuit boards bonding method and printed circuit board
US7958632B2 (en) 2006-06-12 2011-06-14 Fujitsu Limited Flexible printed-circuit boards bonding method and printed circuit board
US9949728B2 (en) 2007-04-05 2018-04-24 W.L. Gore & Associates, Inc. Septal closure device with centering mechanism
US10485525B2 (en) 2007-04-05 2019-11-26 W.L. Gore & Associates, Inc. Septal closure device with centering mechanism
US10278705B2 (en) 2008-03-07 2019-05-07 W. L. Gore & Associates, Inc. Heart occlusion devices
EP2345314A1 (fr) * 2008-10-18 2011-07-20 Conti Temic Microelectronic GmbH Carte de circuit imprimé flexible
US11564672B2 (en) 2009-06-22 2023-01-31 W. L. Gore & Associates, Inc. Sealing device and delivery system
US11589853B2 (en) 2009-06-22 2023-02-28 W. L. Gore & Associates, Inc. Sealing device and delivery system
US10806437B2 (en) 2009-06-22 2020-10-20 W. L. Gore & Associates, Inc. Sealing device and delivery system
US10792025B2 (en) 2009-06-22 2020-10-06 W. L. Gore & Associates, Inc. Sealing device and delivery system
US11596391B2 (en) 2009-06-22 2023-03-07 W. L. Gore & Associates, Inc. Sealing device and delivery system
US10828019B2 (en) 2013-01-18 2020-11-10 W.L. Gore & Associates, Inc. Sealing device and delivery system
US11771408B2 (en) 2013-01-18 2023-10-03 W. L. Gore & Associates, Inc. Sealing device and delivery system
US11298116B2 (en) 2014-06-06 2022-04-12 W. L. Gore & Associates, Inc. Sealing device and delivery system
US10368853B2 (en) 2014-06-06 2019-08-06 W. L. Gore & Associates, Inc. Sealing device and delivery system
US10315422B2 (en) * 2017-02-01 2019-06-11 Canon Kabushiki Kaisha Liquid discharging head substrate, liquid discharging head, and liquid discharging apparatus
CN112543703A (zh) * 2018-07-30 2021-03-23 锡克拜控股有限公司 多芯片模块(mcm)组件和打印条
US11571894B2 (en) 2018-07-30 2023-02-07 Sicpa Holding Sa Multi-chip module (MCM) assembly and a printing bar
CN112543703B (zh) * 2018-07-30 2022-07-01 锡克拜控股有限公司 多芯片模块(mcm)组件和打印条
US11404372B2 (en) * 2019-05-02 2022-08-02 KYOCERA AVX Components Corporation Surface-mount thin-film fuse having compliant terminals
US11837540B2 (en) 2019-05-02 2023-12-05 KYOCERA AVX Components Corporation Surface-mount thin-film fuse having compliant terminals

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DE69424073T2 (de) 2000-12-21
DE69424073D1 (de) 2000-05-31
JPH06275931A (ja) 1994-09-30
JP3253203B2 (ja) 2002-02-04
EP0607929A3 (en) 1996-03-13
EP0607929A2 (fr) 1994-07-27
EP0607929B1 (fr) 2000-04-26

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