EP0607929A3 - Flexible printed circuit board and ink jet recording head using the same. - Google Patents

Flexible printed circuit board and ink jet recording head using the same. Download PDF

Info

Publication number
EP0607929A3
EP0607929A3 EP94100667A EP94100667A EP0607929A3 EP 0607929 A3 EP0607929 A3 EP 0607929A3 EP 94100667 A EP94100667 A EP 94100667A EP 94100667 A EP94100667 A EP 94100667A EP 0607929 A3 EP0607929 A3 EP 0607929A3
Authority
EP
European Patent Office
Prior art keywords
circuit board
same
printed circuit
ink jet
recording head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP94100667A
Other versions
EP0607929A2 (en
EP0607929B1 (en
Inventor
Kenjiro Watanabe
Koji Yamakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP698093 priority Critical
Priority to JP6980/93 priority
Priority to JP698093 priority
Priority to JP33110493A priority patent/JP3253203B2/en
Priority to JP33110493 priority
Priority to JP331104/93 priority
Application filed by Canon Inc filed Critical Canon Inc
Publication of EP0607929A2 publication Critical patent/EP0607929A2/en
Publication of EP0607929A3 publication Critical patent/EP0607929A3/en
Application granted granted Critical
Publication of EP0607929B1 publication Critical patent/EP0607929B1/en
Anticipated expiration legal-status Critical
Application status is Expired - Lifetime legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/244Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2/14016Structure of bubble jet print heads
    • B41J2/14024Assembling head parts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2/14016Structure of bubble jet print heads
    • B41J2/14072Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1601Production of bubble jet print heads
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Production of nozzles manufacturing processes
    • B41J2/1623Production of nozzles manufacturing processes bonding and adhesion
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Production of nozzles manufacturing processes
    • B41J2/164Production of nozzles manufacturing processes thin film formation
    • B41J2/1643Production of nozzles manufacturing processes thin film formation thin film formation by plating
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCBs], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/59Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/4847Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191Disposition
    • H01L2924/19101Disposition of discrete passive components
    • H01L2924/19107Disposition of discrete passive components off-chip wires
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/0154Polyimide
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04Soldering or other types of metallurgic bonding
    • H05K2203/049Wire bonding
EP19940100667 1993-01-19 1994-01-18 Flexible printed circuit board and ink jet recording head using the same Expired - Lifetime EP0607929B1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP698093 1993-01-19
JP6980/93 1993-01-19
JP698093 1993-01-19
JP331104/93 1993-12-27
JP33110493A JP3253203B2 (en) 1993-01-19 1993-12-27 Flexible wiring board, and a manufacturing method of the ink jet recording head and an ink jet recording head using the same
JP33110493 1993-12-27

Publications (3)

Publication Number Publication Date
EP0607929A2 EP0607929A2 (en) 1994-07-27
EP0607929A3 true EP0607929A3 (en) 1996-03-13
EP0607929B1 EP0607929B1 (en) 2000-04-26

Family

ID=26341199

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19940100667 Expired - Lifetime EP0607929B1 (en) 1993-01-19 1994-01-18 Flexible printed circuit board and ink jet recording head using the same

Country Status (4)

Country Link
US (1) US6328427B1 (en)
EP (1) EP0607929B1 (en)
JP (1) JP3253203B2 (en)
DE (2) DE69424073D1 (en)

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GB2292003A (en) * 1994-07-29 1996-02-07 Ibm Uk Direct chip attach
JPH09109394A (en) * 1995-10-18 1997-04-28 Canon Inc Recording head
JPH10329349A (en) * 1997-05-30 1998-12-15 Seiko Instr Inc Thermal head and its manufacture
GB2362515B (en) * 2000-04-13 2003-09-24 Zeiss Stiftung Connection of a junction to an electrical conductor track on a plate
DE10018415C1 (en) 2000-04-03 2001-09-27 Schott Glas Connection between sensor terminal and conductor path applied to glass plate uses conductive connection element ultrasonically welded to conductor path
JP2001347672A (en) * 2000-06-07 2001-12-18 Fuji Photo Film Co Ltd Ink jet recording head and its manufacturing method and ink jet printer
US7564125B2 (en) * 2002-12-06 2009-07-21 General Electric Company Electronic array and methods for fabricating same
US6905342B2 (en) * 2003-04-01 2005-06-14 Hewlett-Packard Development Company, L.P. Protected electrical interconnect assemblies
US7083267B2 (en) * 2003-04-30 2006-08-01 Hewlett-Packard Development Company, L.P. Slotted substrates and methods and systems for forming same
US6913343B2 (en) * 2003-04-30 2005-07-05 Hewlett-Packard Development Company, L.P. Methods for forming and protecting electrical interconnects and resultant assemblies
EP1587350B1 (en) * 2004-04-16 2007-02-07 Delphi Technologies, Inc. Method for metallizing an electric component on a flexible circuit support and flexible circuit support with an electric component metallized thereon
US7416629B2 (en) 2005-01-10 2008-08-26 Silverbrook Research Pty Ltd Method of aligning fluidic MST devices to a support member
US20060290744A1 (en) * 2005-06-25 2006-12-28 Lee Jao-Cheol Wire bonding structure to electrically connect a printhead chip to a flexible printed circuit of an ink cartridge and method thereof
US7766455B2 (en) * 2006-03-29 2010-08-03 Lexmark International, Inc. Flexible adhesive materials for micro-fluid ejection heads and methods relating thereto
JP4967467B2 (en) 2006-06-12 2012-07-04 富士通株式会社 Flexible wiring board bonding method and wiring board
WO2008124603A1 (en) 2007-04-05 2008-10-16 Nmt Medical, Inc. Septal closure device with centering mechanism
US20130165967A1 (en) 2008-03-07 2013-06-27 W.L. Gore & Associates, Inc. Heart occlusion devices
JP2011059149A (en) * 2009-09-07 2011-03-24 Hitachi Displays Ltd Electronic device
US9808230B2 (en) 2014-06-06 2017-11-07 W. L. Gore & Associates, Inc. Sealing device and delivery system
JP2018122528A (en) * 2017-02-01 2018-08-09 キヤノン株式会社 Liquid discharge head substrate, liquid discharge head and liquid discharge device

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Publication number Priority date Publication date Assignee Title
US4503131A (en) * 1982-01-18 1985-03-05 Richardson Chemical Company Electrical contact materials
JPS60107845A (en) * 1983-11-17 1985-06-13 Toshiba Corp Circuit substrate for semiconductor
JPS60255995A (en) * 1984-05-31 1985-12-17 Mitsui Mining & Smelting Co Ltd Method for plating flexible printed wiring board
JPS6486525A (en) * 1987-09-29 1989-03-31 Toshiba Corp Electronic circuit component
EP0402811A2 (en) * 1989-06-16 1990-12-19 Hewlett-Packard GmbH Method of manufacturing printed circuit boards
JPH0451582A (en) * 1990-06-20 1992-02-20 Nec Corp Hybrid integrated circuit device
JPH04116837A (en) * 1990-09-06 1992-04-17 Matsushita Electric Ind Co Ltd Method for surface mounting electronic circuit

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US3927841A (en) * 1974-05-09 1975-12-23 Flight Connector Corp Contact
US4032929A (en) * 1975-10-28 1977-06-28 Xerox Corporation High density linear array ink jet assembly
US4327247A (en) * 1978-10-02 1982-04-27 Shin-Kobe Electric Machinery Co., Ltd. Printed wiring board
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US4881318A (en) * 1984-06-11 1989-11-21 Canon Kabushiki Kaisha Method of manufacturing a liquid jet recording head
US4801067A (en) * 1986-08-29 1989-01-31 Ngk Spark Plug Co., Ltd. Method of connecting metal conductor to ceramic substrate
EP0444579B1 (en) 1990-02-26 1999-06-23 Canon Kabushiki Kaisha Ink jet recording apparatus

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Publication number Priority date Publication date Assignee Title
US4503131A (en) * 1982-01-18 1985-03-05 Richardson Chemical Company Electrical contact materials
JPS60107845A (en) * 1983-11-17 1985-06-13 Toshiba Corp Circuit substrate for semiconductor
JPS60255995A (en) * 1984-05-31 1985-12-17 Mitsui Mining & Smelting Co Ltd Method for plating flexible printed wiring board
JPS6486525A (en) * 1987-09-29 1989-03-31 Toshiba Corp Electronic circuit component
EP0402811A2 (en) * 1989-06-16 1990-12-19 Hewlett-Packard GmbH Method of manufacturing printed circuit boards
JPH0451582A (en) * 1990-06-20 1992-02-20 Nec Corp Hybrid integrated circuit device
JPH04116837A (en) * 1990-09-06 1992-04-17 Matsushita Electric Ind Co Ltd Method for surface mounting electronic circuit

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PATENT ABSTRACTS OF JAPAN vol. 9, no. 258 (E - 350) 16 October 1985 (1985-10-16) *

Also Published As

Publication number Publication date
US6328427B1 (en) 2001-12-11
JP3253203B2 (en) 2002-02-04
DE69424073T2 (en) 2000-12-21
EP0607929B1 (en) 2000-04-26
JPH06275931A (en) 1994-09-30
EP0607929A2 (en) 1994-07-27
DE69424073D1 (en) 2000-05-31

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