EP0607929A3 - Flexible printed circuit board and ink jet recording head using the same. - Google Patents

Flexible printed circuit board and ink jet recording head using the same. Download PDF

Info

Publication number
EP0607929A3
EP0607929A3 EP94100667A EP94100667A EP0607929A3 EP 0607929 A3 EP0607929 A3 EP 0607929A3 EP 94100667 A EP94100667 A EP 94100667A EP 94100667 A EP94100667 A EP 94100667A EP 0607929 A3 EP0607929 A3 EP 0607929A3
Authority
EP
European Patent Office
Prior art keywords
circuit board
printed circuit
same
ink jet
recording head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP94100667A
Other versions
EP0607929A2 (en
EP0607929B1 (en
Inventor
Kenjiro Watanabe
Koji Yamakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of EP0607929A2 publication Critical patent/EP0607929A2/en
Publication of EP0607929A3 publication Critical patent/EP0607929A3/en
Application granted granted Critical
Publication of EP0607929B1 publication Critical patent/EP0607929B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14024—Assembling head parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Ink Jet (AREA)
  • Accessory Devices And Overall Control Thereof (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
EP94100667A 1993-01-19 1994-01-18 Flexible printed circuit board and ink jet recording head using the same Expired - Lifetime EP0607929B1 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP6980/93 1993-01-19
JP698093 1993-01-19
JP698093 1993-01-19
JP33110493A JP3253203B2 (en) 1993-01-19 1993-12-27 Flexible wiring board, inkjet recording head using the same, and method of manufacturing inkjet recording head
JP33110493 1993-12-27
JP331104/93 1993-12-27

Publications (3)

Publication Number Publication Date
EP0607929A2 EP0607929A2 (en) 1994-07-27
EP0607929A3 true EP0607929A3 (en) 1996-03-13
EP0607929B1 EP0607929B1 (en) 2000-04-26

Family

ID=26341199

Family Applications (1)

Application Number Title Priority Date Filing Date
EP94100667A Expired - Lifetime EP0607929B1 (en) 1993-01-19 1994-01-18 Flexible printed circuit board and ink jet recording head using the same

Country Status (4)

Country Link
US (1) US6328427B1 (en)
EP (1) EP0607929B1 (en)
JP (1) JP3253203B2 (en)
DE (1) DE69424073T2 (en)

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GB2292003A (en) * 1994-07-29 1996-02-07 Ibm Uk Direct chip attach
JPH09109394A (en) * 1995-10-18 1997-04-28 Canon Inc Recording head
JPH10329349A (en) * 1997-05-30 1998-12-15 Seiko Instr Inc Thermal head and its manufacture
DE10018415C1 (en) 2000-04-03 2001-09-27 Schott Glas Connection between sensor terminal and conductor path applied to glass plate uses conductive connection element ultrasonically welded to conductor path
GB2362515B (en) * 2000-04-13 2003-09-24 Zeiss Stiftung Connection of a junction to an electrical conductor track on a plate
JP2001347672A (en) * 2000-06-07 2001-12-18 Fuji Photo Film Co Ltd Ink jet recording head and its manufacturing method and ink jet printer
US7564125B2 (en) * 2002-12-06 2009-07-21 General Electric Company Electronic array and methods for fabricating same
US6905342B2 (en) * 2003-04-01 2005-06-14 Hewlett-Packard Development Company, L.P. Protected electrical interconnect assemblies
US7083267B2 (en) * 2003-04-30 2006-08-01 Hewlett-Packard Development Company, L.P. Slotted substrates and methods and systems for forming same
US6913343B2 (en) * 2003-04-30 2005-07-05 Hewlett-Packard Development Company, L.P. Methods for forming and protecting electrical interconnects and resultant assemblies
US9861346B2 (en) 2003-07-14 2018-01-09 W. L. Gore & Associates, Inc. Patent foramen ovale (PFO) closure device with linearly elongating petals
EP1587350B1 (en) * 2004-04-16 2007-02-07 Delphi Technologies, Inc. Method for metallizing an electric component on a flexible circuit support and flexible circuit support with an electric component metallized thereon
EP1841598B1 (en) 2005-01-10 2010-08-18 Silverbrook Research Pty. Ltd Inkjet printhead production method
US20060290744A1 (en) * 2005-06-25 2006-12-28 Lee Jao-Cheol Wire bonding structure to electrically connect a printhead chip to a flexible printed circuit of an ink cartridge and method thereof
US7766455B2 (en) * 2006-03-29 2010-08-03 Lexmark International, Inc. Flexible adhesive materials for micro-fluid ejection heads and methods relating thereto
JP4967467B2 (en) 2006-06-12 2012-07-04 富士通株式会社 Flexible wiring board bonding method and wiring board
US9005242B2 (en) 2007-04-05 2015-04-14 W.L. Gore & Associates, Inc. Septal closure device with centering mechanism
US20130165967A1 (en) 2008-03-07 2013-06-27 W.L. Gore & Associates, Inc. Heart occlusion devices
DE102008052244A1 (en) * 2008-10-18 2010-04-22 Carl Freudenberg Kg Flexible circuit board
US8956389B2 (en) 2009-06-22 2015-02-17 W. L. Gore & Associates, Inc. Sealing device and delivery system
US20120029556A1 (en) 2009-06-22 2012-02-02 Masters Steven J Sealing device and delivery system
JP2011059149A (en) * 2009-09-07 2011-03-24 Hitachi Displays Ltd Electronic device
US10828019B2 (en) 2013-01-18 2020-11-10 W.L. Gore & Associates, Inc. Sealing device and delivery system
US9808230B2 (en) 2014-06-06 2017-11-07 W. L. Gore & Associates, Inc. Sealing device and delivery system
JP6827825B2 (en) * 2017-02-01 2021-02-10 キヤノン株式会社 Liquid discharge head substrate, liquid discharge head and liquid discharge device
TWI814839B (en) * 2018-07-30 2023-09-11 瑞士商西克帕控股有限公司 A multi-chip module (mcm) assembly and a printing bar
US11404372B2 (en) 2019-05-02 2022-08-02 KYOCERA AVX Components Corporation Surface-mount thin-film fuse having compliant terminals

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US4503131A (en) * 1982-01-18 1985-03-05 Richardson Chemical Company Electrical contact materials
JPS60107845A (en) * 1983-11-17 1985-06-13 Toshiba Corp Circuit substrate for semiconductor
JPS60255995A (en) * 1984-05-31 1985-12-17 Mitsui Mining & Smelting Co Ltd Method for plating flexible printed wiring board
JPS6486525A (en) * 1987-09-29 1989-03-31 Toshiba Corp Electronic circuit component
EP0402811A2 (en) * 1989-06-16 1990-12-19 Hewlett-Packard GmbH Method of manufacturing printed circuit boards
JPH0451582A (en) * 1990-06-20 1992-02-20 Nec Corp Hybrid integrated circuit device
JPH04116837A (en) * 1990-09-06 1992-04-17 Matsushita Electric Ind Co Ltd Method for surface mounting electronic circuit

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US4503131A (en) * 1982-01-18 1985-03-05 Richardson Chemical Company Electrical contact materials
JPS60107845A (en) * 1983-11-17 1985-06-13 Toshiba Corp Circuit substrate for semiconductor
JPS60255995A (en) * 1984-05-31 1985-12-17 Mitsui Mining & Smelting Co Ltd Method for plating flexible printed wiring board
JPS6486525A (en) * 1987-09-29 1989-03-31 Toshiba Corp Electronic circuit component
EP0402811A2 (en) * 1989-06-16 1990-12-19 Hewlett-Packard GmbH Method of manufacturing printed circuit boards
JPH0451582A (en) * 1990-06-20 1992-02-20 Nec Corp Hybrid integrated circuit device
JPH04116837A (en) * 1990-09-06 1992-04-17 Matsushita Electric Ind Co Ltd Method for surface mounting electronic circuit

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Title
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PATENT ABSTRACTS OF JAPAN vol. 13, no. 317 (E - 789) 19 July 1989 (1989-07-19) *
PATENT ABSTRACTS OF JAPAN vol. 16, no. 246 (E - 1212) 5 June 1992 (1992-06-05) *
PATENT ABSTRACTS OF JAPAN vol. 16, no. 367 (E - 1245) 7 August 1992 (1992-08-07) *
PATENT ABSTRACTS OF JAPAN vol. 9, no. 258 (E - 350) 16 October 1985 (1985-10-16) *

Also Published As

Publication number Publication date
JP3253203B2 (en) 2002-02-04
DE69424073D1 (en) 2000-05-31
DE69424073T2 (en) 2000-12-21
EP0607929A2 (en) 1994-07-27
EP0607929B1 (en) 2000-04-26
JPH06275931A (en) 1994-09-30
US6328427B1 (en) 2001-12-11

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