EP0607929A3 - Flexible printed circuit board and ink jet recording head using the same. - Google Patents
Flexible printed circuit board and ink jet recording head using the same. Download PDFInfo
- Publication number
- EP0607929A3 EP0607929A3 EP94100667A EP94100667A EP0607929A3 EP 0607929 A3 EP0607929 A3 EP 0607929A3 EP 94100667 A EP94100667 A EP 94100667A EP 94100667 A EP94100667 A EP 94100667A EP 0607929 A3 EP0607929 A3 EP 0607929A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- circuit board
- printed circuit
- same
- ink jet
- recording head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14024—Assembling head parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Ink Jet (AREA)
- Accessory Devices And Overall Control Thereof (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP698093 | 1993-01-19 | ||
JP698093 | 1993-01-19 | ||
JP6980/93 | 1993-01-19 | ||
JP33110493A JP3253203B2 (en) | 1993-01-19 | 1993-12-27 | Flexible wiring board, inkjet recording head using the same, and method of manufacturing inkjet recording head |
JP33110493 | 1993-12-27 | ||
JP331104/93 | 1993-12-27 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0607929A2 EP0607929A2 (en) | 1994-07-27 |
EP0607929A3 true EP0607929A3 (en) | 1996-03-13 |
EP0607929B1 EP0607929B1 (en) | 2000-04-26 |
Family
ID=26341199
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP94100667A Expired - Lifetime EP0607929B1 (en) | 1993-01-19 | 1994-01-18 | Flexible printed circuit board and ink jet recording head using the same |
Country Status (4)
Country | Link |
---|---|
US (1) | US6328427B1 (en) |
EP (1) | EP0607929B1 (en) |
JP (1) | JP3253203B2 (en) |
DE (1) | DE69424073T2 (en) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2292003A (en) * | 1994-07-29 | 1996-02-07 | Ibm Uk | Direct chip attach |
JPH09109394A (en) * | 1995-10-18 | 1997-04-28 | Canon Inc | Recording head |
JPH10329349A (en) * | 1997-05-30 | 1998-12-15 | Seiko Instr Inc | Thermal head and its manufacture |
DE10018415C1 (en) | 2000-04-03 | 2001-09-27 | Schott Glas | Connection between sensor terminal and conductor path applied to glass plate uses conductive connection element ultrasonically welded to conductor path |
GB2362515B (en) * | 2000-04-13 | 2003-09-24 | Zeiss Stiftung | Connection of a junction to an electrical conductor track on a plate |
JP2001347672A (en) * | 2000-06-07 | 2001-12-18 | Fuji Photo Film Co Ltd | Ink jet recording head and its manufacturing method and ink jet printer |
US7564125B2 (en) * | 2002-12-06 | 2009-07-21 | General Electric Company | Electronic array and methods for fabricating same |
US6905342B2 (en) * | 2003-04-01 | 2005-06-14 | Hewlett-Packard Development Company, L.P. | Protected electrical interconnect assemblies |
US6913343B2 (en) * | 2003-04-30 | 2005-07-05 | Hewlett-Packard Development Company, L.P. | Methods for forming and protecting electrical interconnects and resultant assemblies |
US7083267B2 (en) * | 2003-04-30 | 2006-08-01 | Hewlett-Packard Development Company, L.P. | Slotted substrates and methods and systems for forming same |
US9861346B2 (en) | 2003-07-14 | 2018-01-09 | W. L. Gore & Associates, Inc. | Patent foramen ovale (PFO) closure device with linearly elongating petals |
ATE353539T1 (en) * | 2004-04-16 | 2007-02-15 | Delphi Tech Inc | METHOD FOR CONTACTING AN ELECTRICAL COMPONENT ON A FLEXIBLE CIRCUIT MOUNT AND FLEXIBLE CIRCUIT MOUNT WITH AN ELECTRICAL COMPONENT CONTACTED ON IT |
US7736458B2 (en) | 2005-01-10 | 2010-06-15 | Silverbrook Research Pty Ltd | Method of attaching fluidic MST devices to a support member |
US20060290744A1 (en) * | 2005-06-25 | 2006-12-28 | Lee Jao-Cheol | Wire bonding structure to electrically connect a printhead chip to a flexible printed circuit of an ink cartridge and method thereof |
US7766455B2 (en) * | 2006-03-29 | 2010-08-03 | Lexmark International, Inc. | Flexible adhesive materials for micro-fluid ejection heads and methods relating thereto |
JP4967467B2 (en) | 2006-06-12 | 2012-07-04 | 富士通株式会社 | Flexible wiring board bonding method and wiring board |
WO2008124603A1 (en) | 2007-04-05 | 2008-10-16 | Nmt Medical, Inc. | Septal closure device with centering mechanism |
US20130165967A1 (en) | 2008-03-07 | 2013-06-27 | W.L. Gore & Associates, Inc. | Heart occlusion devices |
DE102008052244A1 (en) * | 2008-10-18 | 2010-04-22 | Carl Freudenberg Kg | Flexible circuit board |
US9636094B2 (en) | 2009-06-22 | 2017-05-02 | W. L. Gore & Associates, Inc. | Sealing device and delivery system |
US20120029556A1 (en) | 2009-06-22 | 2012-02-02 | Masters Steven J | Sealing device and delivery system |
JP2011059149A (en) * | 2009-09-07 | 2011-03-24 | Hitachi Displays Ltd | Electronic device |
US10828019B2 (en) | 2013-01-18 | 2020-11-10 | W.L. Gore & Associates, Inc. | Sealing device and delivery system |
US9808230B2 (en) | 2014-06-06 | 2017-11-07 | W. L. Gore & Associates, Inc. | Sealing device and delivery system |
JP6827825B2 (en) * | 2017-02-01 | 2021-02-10 | キヤノン株式会社 | Liquid discharge head substrate, liquid discharge head and liquid discharge device |
TWI814839B (en) | 2018-07-30 | 2023-09-11 | 瑞士商西克帕控股有限公司 | A multi-chip module (mcm) assembly and a printing bar |
US11404372B2 (en) | 2019-05-02 | 2022-08-02 | KYOCERA AVX Components Corporation | Surface-mount thin-film fuse having compliant terminals |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4503131A (en) * | 1982-01-18 | 1985-03-05 | Richardson Chemical Company | Electrical contact materials |
JPS60107845A (en) * | 1983-11-17 | 1985-06-13 | Toshiba Corp | Circuit substrate for semiconductor |
JPS60255995A (en) * | 1984-05-31 | 1985-12-17 | Mitsui Mining & Smelting Co Ltd | Method for plating flexible printed wiring board |
JPS6486525A (en) * | 1987-09-29 | 1989-03-31 | Toshiba Corp | Electronic circuit component |
EP0402811A2 (en) * | 1989-06-16 | 1990-12-19 | Hewlett-Packard GmbH | Method of manufacturing printed circuit boards |
JPH0451582A (en) * | 1990-06-20 | 1992-02-20 | Nec Corp | Hybrid integrated circuit device |
JPH04116837A (en) * | 1990-09-06 | 1992-04-17 | Matsushita Electric Ind Co Ltd | Method for surface mounting electronic circuit |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3927841A (en) * | 1974-05-09 | 1975-12-23 | Flight Connector Corp | Contact |
US4032929A (en) * | 1975-10-28 | 1977-06-28 | Xerox Corporation | High density linear array ink jet assembly |
US4327247A (en) * | 1978-10-02 | 1982-04-27 | Shin-Kobe Electric Machinery Co., Ltd. | Printed wiring board |
US4635080A (en) | 1984-03-30 | 1987-01-06 | Canon Kabushiki Kaisha | Liquid injection recording apparatus |
US4881318A (en) * | 1984-06-11 | 1989-11-21 | Canon Kabushiki Kaisha | Method of manufacturing a liquid jet recording head |
US4801067A (en) * | 1986-08-29 | 1989-01-31 | Ngk Spark Plug Co., Ltd. | Method of connecting metal conductor to ceramic substrate |
ATE181531T1 (en) | 1990-02-26 | 1999-07-15 | Canon Kk | INKJET RECORDING DEVICE |
-
1993
- 1993-12-27 JP JP33110493A patent/JP3253203B2/en not_active Expired - Fee Related
-
1994
- 1994-01-18 EP EP94100667A patent/EP0607929B1/en not_active Expired - Lifetime
- 1994-01-18 DE DE69424073T patent/DE69424073T2/en not_active Expired - Lifetime
-
1997
- 1997-07-21 US US08/897,550 patent/US6328427B1/en not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4503131A (en) * | 1982-01-18 | 1985-03-05 | Richardson Chemical Company | Electrical contact materials |
JPS60107845A (en) * | 1983-11-17 | 1985-06-13 | Toshiba Corp | Circuit substrate for semiconductor |
JPS60255995A (en) * | 1984-05-31 | 1985-12-17 | Mitsui Mining & Smelting Co Ltd | Method for plating flexible printed wiring board |
JPS6486525A (en) * | 1987-09-29 | 1989-03-31 | Toshiba Corp | Electronic circuit component |
EP0402811A2 (en) * | 1989-06-16 | 1990-12-19 | Hewlett-Packard GmbH | Method of manufacturing printed circuit boards |
JPH0451582A (en) * | 1990-06-20 | 1992-02-20 | Nec Corp | Hybrid integrated circuit device |
JPH04116837A (en) * | 1990-09-06 | 1992-04-17 | Matsushita Electric Ind Co Ltd | Method for surface mounting electronic circuit |
Non-Patent Citations (5)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 10, no. 131 (C - 346) 15 May 1986 (1986-05-15) * |
PATENT ABSTRACTS OF JAPAN vol. 13, no. 317 (E - 789) 19 July 1989 (1989-07-19) * |
PATENT ABSTRACTS OF JAPAN vol. 16, no. 246 (E - 1212) 5 June 1992 (1992-06-05) * |
PATENT ABSTRACTS OF JAPAN vol. 16, no. 367 (E - 1245) 7 August 1992 (1992-08-07) * |
PATENT ABSTRACTS OF JAPAN vol. 9, no. 258 (E - 350) 16 October 1985 (1985-10-16) * |
Also Published As
Publication number | Publication date |
---|---|
DE69424073D1 (en) | 2000-05-31 |
US6328427B1 (en) | 2001-12-11 |
EP0607929A2 (en) | 1994-07-27 |
DE69424073T2 (en) | 2000-12-21 |
EP0607929B1 (en) | 2000-04-26 |
JP3253203B2 (en) | 2002-02-04 |
JPH06275931A (en) | 1994-09-30 |
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