US5954262A - Soldering apparatus for providing a fixed quantity of solder piece onto target plate and method of soldering circuit component - Google Patents

Soldering apparatus for providing a fixed quantity of solder piece onto target plate and method of soldering circuit component Download PDF

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Publication number
US5954262A
US5954262A US08/795,891 US79589197A US5954262A US 5954262 A US5954262 A US 5954262A US 79589197 A US79589197 A US 79589197A US 5954262 A US5954262 A US 5954262A
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US
United States
Prior art keywords
solder
solder piece
pin
hole
piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
US08/795,891
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English (en)
Inventor
Akifumi Inoue
Koshiro Takeda
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Yamaha Corp
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Yamaha Corp
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Filing date
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Assigned to YAMAHA CORPORATION, A CORPORATION OF JAPAN reassignment YAMAHA CORPORATION, A CORPORATION OF JAPAN ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: INOUE, AKIFUMI, TAKEDA, KOSHIRO
Priority to US09/339,339 priority Critical patent/US6279814B1/en
Application granted granted Critical
Publication of US5954262A publication Critical patent/US5954262A/en
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Expired - Fee Related legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/033—Punching metal foil, e.g. solder foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0405—Solder foil, tape or wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Definitions

  • This invention relates to a semiconductor assembly technology and, more particularly, to a soldering apparatus for providing a fixed quantity of solder piece to a printed circuit board and a method of soldering a circuit component to the printed circuit board.
  • a module is a basic component unit of an electric system, and electric circuit components are assembled on a rigid or flexible board during a fabrication of the module. Bare chips are, by way of example, mounted on a printed circuit board, and a flexible board may be assembled with a rigid board. Thus, a micro-connecting technology is important factor of the fabrication of the module.
  • FIGS. 2A to 2G are cross sectional views showing a sequence of a micro-connecting method according to the present invention.
  • the feeding mechanism 1c includes a frame 1o, a rod 1p. an actuator 1q, a feeder pin 1r and a chuck 1s.
  • the frame 1o is fixed to the front surface of the lower portion 1f, and the rod member 1p is slidably supported by the frame 1o.
  • the actuator 1q is mounted on the frame 1o, and is connected to the rod member 1p.
  • the rod member 1p is directed in the up-and-down direction, and the actuator 1q reciprocally drives the rod member 1p.
  • the chuck 1s is attached to the upper end of the rod member 1p, and the feeder pin 1r is fixed to the rod member 1p by means of the chuck 1s in such a manner that the feeder pin 1r is aligned with the punching pin 1m.
  • the feeder pin 1r is also reciprocally driven in the up-and-down direction. However, the feeder pin 1r is moved slower than the punching pin 1m. However, the feeder pin 1r presses a solder piece against a rigid board, and large thrust is exerted on the feeder pin 1r in the direction of the center line thereof. For this reason, the feeder pin 1r is formed of material well withstood against the large thrust.
  • the diameter of the punching pin 1m also ranges from 50 microns to 100 microns, and the manufacturer replaces the feeder pin 1r with a new feeder pin different in diameter depending upon the amount of solder piece to be requested.
  • the die holder 1t maintains the die 1u to have the through-hole 1v exactly perpendicular to the trajectories of the punching/feeder pins 1m/1r, and the diameter of the through-hole 1v is slightly larger than the diameter of the punching pin 1m and the diameter of the feeder pin 1r.
  • the manufacturer stores a plurality of die units 1u different in the diameter of the through-hole 1v, and replaces the die unit 1u depending upon the punching pin 1m and the feeder pin 1r.
  • a heater 1w is incorporated in the conveying mechanism 1e, and the heater 1w heats the printed circuit board to a certain temperature at which a solder piece is fusion bonded thereto.
  • the manufacturer prepares the soldering apparatus described hereinbefore and an electric circuit component 4e (see FIG. 2G) to be mounted on the printed circuit board 4b.
  • the manufacturer provides the printed circuit board 4b and the solder plate 4a to the conveying mechanism 1e.
  • the conveying mechanism 1e firstly conveys the solder plate 4a to the die unit 1u, and the solder plate 4a is placed over the die unit 1u as shown in FIG. 2A. If a solder piece has been already cut out from the solder plate 4a, the conveying mechanism 1e places a different portion of the solder plate 4a on the die unit 1u.
  • the feeding mechanism 1c maintains the feeder pin 1r at the lower dead point, and the leading end of the feeder pin 1r is retracted into the through-hole 1v.
  • the actuator 1k downwardly moves the rod member 1j and, accordingly, the punching pin 1m at high speed.
  • the punching pin 1m is brought into collision with the solder plate 4a, and cuts out a solder piece 4f as shown in FIG. 2B.
  • the solder piece is fallen onto the feeder pin 1r as shown in FIG. 2C, and the actuator 1k pulls up the rod member 1j and, accordingly, the punching pin 1m. As a result, the punching pin 1m is moved outof the die unit 1u.
  • the volume of the solder piece 4f is determined by the thickness of the solder plate 4a and the diameter of the punching pin 1m. If the manufacturer wants to increase the volume of the solder piece 4f, he changes the set of punching pin 1m, feeder pin 1r and die unit 1u and/or the solder plate 4a different in thickness. In this way, the manufacturer can exactly control the amount of solder piece 4f.
  • the conveying mechanism 1e removes the solder plate 4a from the die unit 1u, and conveys the printed circuit board 4b to the die unit 1u.
  • the conveying mechanism 1e aligns the junction 4c of the conductive wiring pattern 4d of the printed circuit board 4b with the through-hole 1v of the die unit 1u as shown in FIG. 2D.
  • the heater 1w heats the printed circuit board 4b to the certain temperature.
  • the actuator 1q upwardly moves the rod member 1p and, accordingly, the feeder pin 1r.
  • the feeder pin 1r projects over the die unit 1u, and presses the solder piece 4f against the junction 4c as shown in FIG. 2E.
  • the solder piece 4f is bonded to the junction 4d of the conductive wiring pattern 4c.
  • the actuator 1q downwardly moves the rod member 1p and the feeder pin 1r, and the feeder pin 1r is retracted into the through-hole 1v.
  • the solder piece 4f is left on the junction 4c as shown in FIG. 2F.
  • the solder piece provider 1 repeats the above described steps, and a plurality of solder pieces 4f are bonded to the junctions 4d of the conductive wiring pattern 4c.
  • the solder pieces 4f are exactly regulated to the predetermined volume.
  • the printed circuit board 4a is conveyed to the mounter 2, and the electric circuit component 4e such as, for example, a bare chip is mounted on the printed circuit board 4a in such a manner that conductive pins 4g of the electric circuit component 4e are aligned through the solder pieces 4f with the junctions 4d of the conductive wiring pattern 4c.
  • the mounter 2 applies heat to the solder pieces 4f, and the conductive pins 4g are connected to the conductive wiring pattern 4c as shown in FIG. 2G.
  • the solder piece provider 2 supplies a fixed amount of solder pieces onto the conductive wiring pattern 4c or the target layer, and the solder pieces 4f strongly fix the electric circuit component 4e to the conductive wiring pattern 4c. Even if the electric circuit serves for long time period, the electric circuit component 4e is never disconnected from the conductive wiring pattern 4c due to shortage of solder.
  • FIGS. 3A to 3G of the drawings another sequence of a micro-connecting method starts with preparation of a solder plate 11a and a printed circuit board 11b in a solder piece provider 10 according to the present invention.
  • the solder piece provider 10 is different from the solder piece provider 1 in the location of the punching mechanism and the feeding mechanism and a through-hole 12a of a die unit 12b.
  • the feeding mechanism is provided over the punching mechanism, and the through-hole 12a upwardly decreases the cross section.
  • the other components of the solder piece provider 10 are similar to those of the solder piece provider 1, and are labeled with the references designating corresponding components of the solder piece provider 1 without detailed description.
  • solder plate 1a is placed under the die unit 12b as shown in FIG. 3A. Then, the punching pin 1m is upwardly moved, and the leading end of the punching pin 1m is inserted into the through-hole 12a. A solder piece 1c is cut out from the solder plate 11a (see FIG. 3B), and the through-hole 12a is clogged with the solder piece, because the through-hole 12a narrows toward the upper end.
  • the punching pin 1m is downwardly moved, and the solder piece 11c is left in the through-hole 12a as shown in FIG. 3C.
  • the conveying mechanism 1e removes the solder plate 11a from under the die unit 12b, and the printed circuit board 11b is placed under the die unit 12b as shown in FIG. 3D.
  • the feeder pin 1r is upwardly moved, and is retracted into the die unit 12b as shown in FIG. 3F.
  • the printed circuit board 11b is conveyed to the mounter 2, and an electric circuit component 13a is mounted on the printed circuit board 11b, and the solder pieces 11c are overlapped with pins 13b of the electric circuit components 13a. Heat is applied to the solder pieces 11c, and the solder pieces 11c bond the pins 13b to the junctions 11d.
  • the second embodiment achieves all the advantages of the first embodiment.
  • a plurality of punching pins and a plurality of feeder pins may be incorporated in the punching mechanism and the feeding mechanism so as to concurrently supply solder pieces to a printed circuit board.
  • the die unit 1u is stationary, and the conveying mechanism 1e two-dimensionally moves the solder plate 4a and the printed circuit board 4b so as to locate them at a target position.
  • another solder piece provider according to the present invention may move the die unit 1u, the punching mechanism 1b and the feeding mechanism 1c with respect to the solder plate 4a and the printed circuit board 4b.
  • solder piece provider according to the present invention may be used for a die bonding between a lead frame and a semiconductor chip or any kind of soldering for micro-components.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Wire Bonding (AREA)
US08/795,891 1996-02-09 1997-02-05 Soldering apparatus for providing a fixed quantity of solder piece onto target plate and method of soldering circuit component Expired - Fee Related US5954262A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US09/339,339 US6279814B1 (en) 1996-02-09 1999-06-23 Soldering apparatus for providing a fixed quantity of solder piece onto target plate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2438396A JPH09219416A (ja) 1996-02-09 1996-02-09 半導体装置の製造方法及び製造装置
JP8-024383 1996-02-09

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US09/339,339 Division US6279814B1 (en) 1996-02-09 1999-06-23 Soldering apparatus for providing a fixed quantity of solder piece onto target plate

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US09/339,339 Expired - Fee Related US6279814B1 (en) 1996-02-09 1999-06-23 Soldering apparatus for providing a fixed quantity of solder piece onto target plate

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6657137B2 (en) * 2000-07-27 2003-12-02 Denso Corporation Connection structure and connection method of for connecting two circuit boards
US20050067470A1 (en) * 2003-09-30 2005-03-31 Ted Ju Solder deposition method
US20050184129A1 (en) * 2004-02-20 2005-08-25 Fry's Metals, Inc. Solder preforms for use in electronic assembly
US20130134210A1 (en) * 2011-11-25 2013-05-30 Aya Muto Joining method and semiconductor device manufacturing method
WO2017102213A1 (de) * 2015-12-16 2017-06-22 Endress+Hauser Gmbh+Co. Kg Pipette zum bestücken einer leiterkarte

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5314405B2 (ja) * 2008-04-21 2013-10-16 マルゴ工業株式会社 供給装置

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JPH04101425A (ja) * 1990-08-21 1992-04-02 Nec Corp 金属突起物の形成方法及び金属突起物の形成治具
JPH04101426A (ja) * 1990-08-21 1992-04-02 Nec Corp 金属突起物の形成方法
JPH06246479A (ja) * 1993-02-25 1994-09-06 Nec Corp 接合金属シート
US5372295A (en) * 1991-10-04 1994-12-13 Ryoden Semiconductor System Engineering Corporation Solder material, junctioning method, junction material, and semiconductor device
JPH0883800A (ja) * 1994-09-12 1996-03-26 Hitachi Ltd バンプ形成方法
US5508561A (en) * 1993-11-15 1996-04-16 Nec Corporation Apparatus for forming a double-bump structure used for flip-chip mounting

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5433368A (en) * 1992-11-10 1995-07-18 Spigarelli; Donald J. Soldering system
JP2616558B2 (ja) * 1993-12-14 1997-06-04 日本電気株式会社 バンプ形成装置およびバンプ形成方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04101425A (ja) * 1990-08-21 1992-04-02 Nec Corp 金属突起物の形成方法及び金属突起物の形成治具
JPH04101426A (ja) * 1990-08-21 1992-04-02 Nec Corp 金属突起物の形成方法
US5372295A (en) * 1991-10-04 1994-12-13 Ryoden Semiconductor System Engineering Corporation Solder material, junctioning method, junction material, and semiconductor device
JPH06246479A (ja) * 1993-02-25 1994-09-06 Nec Corp 接合金属シート
US5508561A (en) * 1993-11-15 1996-04-16 Nec Corporation Apparatus for forming a double-bump structure used for flip-chip mounting
JPH0883800A (ja) * 1994-09-12 1996-03-26 Hitachi Ltd バンプ形成方法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6657137B2 (en) * 2000-07-27 2003-12-02 Denso Corporation Connection structure and connection method of for connecting two circuit boards
US20050067470A1 (en) * 2003-09-30 2005-03-31 Ted Ju Solder deposition method
US6929170B2 (en) * 2003-09-30 2005-08-16 Ted Ju Solder deposition method
US20050184129A1 (en) * 2004-02-20 2005-08-25 Fry's Metals, Inc. Solder preforms for use in electronic assembly
US7533793B2 (en) * 2004-02-20 2009-05-19 Fry's Metals, Inc. Solder preforms for use in electronic assembly
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US8746538B2 (en) * 2011-11-25 2014-06-10 Mitsubishi Electric Corporation Joining method and semiconductor device manufacturing method
US9087778B2 (en) 2011-11-25 2015-07-21 Mitsubishi Electric Corporation Joining method and semiconductor device manufacturing method
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JPH09219416A (ja) 1997-08-19

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