US5789998A - Duplex dielectric filter - Google Patents

Duplex dielectric filter Download PDF

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Publication number
US5789998A
US5789998A US08/739,014 US73901496A US5789998A US 5789998 A US5789998 A US 5789998A US 73901496 A US73901496 A US 73901496A US 5789998 A US5789998 A US 5789998A
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United States
Prior art keywords
shunt
capacitors
substrate
load
capacitor
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Expired - Fee Related
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US08/739,014
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English (en)
Inventor
Nam Chul Kim
Young Jeong
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Samsung Electro Mechanics Co Ltd
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Samsung Electro Mechanics Co Ltd
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Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD. reassignment SAMSUNG ELECTRO-MECHANICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: JEONG, YOUNG, KIM, NAM CHUL
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/213—Frequency-selective devices, e.g. filters combining or separating two or more different frequencies
    • H01P1/2136—Frequency-selective devices, e.g. filters combining or separating two or more different frequencies using comb or interdigital filters; using cascaded coaxial cavities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/203—Strip line filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/207—Hollow waveguide filters
    • H01P1/208—Cascaded cavities; Cascaded resonators inside a hollow waveguide structure
    • H01P1/2084—Cascaded cavities; Cascaded resonators inside a hollow waveguide structure with dielectric resonators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P7/00—Resonators of the waveguide type
    • H01P7/10—Dielectric resonators

Definitions

  • the present invention relates to a duplex dielectric filter which commonly shares one antenna in transmitting and receiving the data in a mobile communication system and the like.
  • a duplexer is used so that one antenna can be used for transmission and receiving.
  • the duplexer is a filter for separating transmitting and receiving radio waves, and includes a transmitting filter, a receiving filter and a matching circuit.
  • FIG. 1 illustrates the basic constitution of the duplexer.
  • the duplexer basically includes two band pass filters. In its function, radio waves (frequency F R ) which are absorbed into an antenna are received into a receiver, while transmission waves (frequency F T ) are transferred from a transmitter to the antenna.
  • frequency F R radio waves
  • F T transmission waves
  • the duplexer including a ceramic dielectric resonator is classified based on the used dielectric resonator into: a monoblock type consisting of a single ceramic dielectric resonator; and a coaxial resonator consisting of a plurality of unit dielectric resonators.
  • FIG. 2 illustrates a transmitting circuit of the antenna duplex.
  • the transmitting circuit includes: three shunt capacitors C1-C3 disposed between an input terminal and an antenna; load capacitors CS1 and CS2; inductors L1-L3; and three dielectric coaxial resonators R1-R3. Further, to an antenna terminals not only an antenna but also a receiving section are connected as shown in FIG. 1.
  • FIG. 3 illustrates the construction of an actual duplex dielectric filter as an equivalent circuit for the above described circuit.
  • This conventional duplex dielectric filter includes: a transmitting section 10 and a receiving section 12.
  • the transmitting section includes: a PCB 17 printed with a certain metal pattern 18; load capacitors CS1 and CS2 formed on a dielectric substrate 16 shunt capacitors C1-C3; lead lines 14 extending from resonators R1-R3 connected to the shunt capacitors C1-C3; inductors L1-L3 connected respectively between a brass shim 15 and the chip capacitor CS1, between the chip capacitor CS1 and the chip capacitor CS2, and between the chip capacitor CS2 and the antenna, thereby constituting a transmitting section.
  • the receiving section 12 includes: four resonators R4-R7, a dielectric substrate 19, and a chip capacitor.
  • Japanese Patent Application Laid-open No. Hei-6-45804 proposes as follows. That is, on the PCB on which dielectric coaxial resonators are installed, the L components and the C components are formed into electrode layer patterns, thereby replacing the conventional capacitors and inductors.
  • this Japanese invention forms an electrode layer phase pattern, and therefore, the manufacturing process is not precise. Consequently, the values are not accurate, and the products are not uniform.
  • the present invention is intended to overcome the above described disadvantages of the conventional techniques.
  • the present invention is characterized in that: the conventional three separate shunt capacitors are simplified into a single dielectric substrate; the brass shim which was conventionally inserted between the shunt capacitors and the dielectric substrate in order to adjust the height of the shunt capacitors is eliminated; a dielectric substrate having load capacitors is extended so as to substitute the brass shim; and a through hole is formed through electrode patterns formed on both sides of the dielectric substrate so as to connect an input terminal to the shunt capacitors.
  • FIG. 1 illustrates the basic constitution of a duplexer
  • FIG. 2 illustrates the circuit of the transmitting section of an antenna duplexer
  • FIG. 3 illustrates the constitution of the conventional duplex dielectric filter
  • FIG. 4 illustrates an embodiment of the duplex dielectric filter according to the present invention
  • FIG. 5 illustrates an embodiment of the shunt capacitor substrate adopted in the present invention
  • FIG. 6 illustrates an embodiment of the load capacitor substrate adopted in the present invention
  • FIG. 7 is a plan view of the transmitting section in which a shunt capacitor substrate, a load capacitor substrate, and inductors are assembled.
  • FIG. 8 is a sectional view taken along a line 8--8 of FIG. 7.
  • FIG. 4 illustrates an embodiment of the duplex dielectric filter according to the present invention
  • a duplex dielectric filter 20 includes: a PCB (printed circuit board) substrate 27 with a metallic conductive circuit pattern 28 formed on the upper face thereof; a receiving section 22 including a plurality of receiving section resonators R4-R7 and a transmitting section 21 including a plurality of transmitting section resonators R1-R3 attached on the circuit pattern 28 of the PCB substrate 27 by means of a conductive adhesive (e.g., soldering), and arranged side by side; a shunt capacitor substrate 25 with shunt capacitors C1-C3 formed integrally therewith, the shunt capacitors being connected through connecting rods 24 to internal conductors of the transmitting section resonators R1-R3; a load capacitor substrate 26 formed under the shunt capacitor substrate 25, with load capacitors CS1 and CS2 formed thereon, and with a pattern 261 (connected to an input terminal) formed thereon; inductors L1, L2 and L3 respectively connected between the input terminal pattern 261 and the load capacitor
  • FIG. 5 illustrates an embodiment of the shunt capacitor substrate adopted in the present invention.
  • the shunt capacitor C1 includes: electrodes 251 and 252 constituting conductive patterns on the upper and lower faces of the substrate 25; and the substrate 25 made of a dielectric material. That is, the conductive patterns 251 and 252 form the electrodes of a planar capacitor.
  • the substrate 25 becomes a dielectric medium between the electrodes.
  • the conductive pattern 251 is connected through connecting rod 24 (FIG. 4) to an internal conductor of the resonator R1, and therefore, it becomes a lower electrode of the capacitor C1 of the equivalent circuit of FIG. 2.
  • the shunt capacitors C2 and C3 are planar capacitors which are formed in the above described manner.
  • the shunt capacitor C2 consists of: electrodes 253 and 254 forming conductive patterns on the substrate 25; and the substrate 25 made of a dielectric material.
  • the shunt capacitor C3 consists of: electrodes 255 and 256 forming conductive patterns on the substrate 25; and the substrate 25 made of a dielectric material.
  • FIG. 6 illustrates an embodiment of the load capacitor substrate adopted in the present invention.
  • the load capacitor CS1 consists of: an electrode 263 forming a conductive pattern on the upper face of the substrate 26; the substrate 26 made of a dielectric material; and another electrode pattern 264 formed on the bottom of the load capacitor substrate 26. That is, the conductive patterns 263 and 264 are electrode plates of planar capacitors.
  • the substrate 26 becomes a dielectric medium inserted between the electrodes.
  • the load capacitor CS2 consists of: an electrode 265 forming a conductive pattern on the upper face of the substrate 26; the substrate 26 made of a dielectric material; and another electrode pattern 266 formed on the bottom of the load capacitor substrate 26.
  • the conductive patterns 261 and 262 which are formed on the left part of the substrate 26 are connected together through a through hole, and therefore, they do not have any capacitance. That is, these conductive patterns 261 and 262 serve as conductive lines connecting an input terminal of the duplex dielectric filter and the electrode pattern 252 of the shunt capacitor C1 together.
  • FIG. 7 is a plan view of the transmitting section in which a shunt capacitor substrate, a load capacitor substrate, and inductors are assembled.
  • FIG. 8 is a sectional view taken along a line 8--8 of FIG. 7.
  • the shunt capacitor substrate 25 is attached to the load capacitor substrate 26 by means of a conductive adhesive (e.g., soldering).
  • a conductive adhesive e.g., soldering
  • the conductive patterns 251 and 252 are positioned within the region of the conductive pattern 261 which is connected to the input terminal.
  • the conductive patterns 253 and 254 are positioned within the region of the conductive pattern 263 forming the load capacitor CS1.
  • the conductive patterns 255 and 256 are positioned within the region of the conductive pattern 265 forming the load capacitor CS2.
  • the input terminal pattern 262 which is formed on the upper face of the PCB 27 is connected through the through hole 267 to the terminal 252 of the shunt capacitor C1, so that signals inputted from the external can be supplied to the shunt capacitor C1.
  • the signals which have passed through the shunt capacitor C1 are supplied through the connecting rod 24 to the internal conductor of the resonator R1.
  • the signals are resonated with the inherent frequency of the resonator R1, and then, are supplied through the inductor L1 to a filter circuit of the next stage.
  • the filter circuit of the next stage includes the inductor L1, the resonator R2, the shunt capacitor C2 and the load capacitor CS1.
  • the signals which have passed through the inductor L1 are supplied through the shunt capacitor C2 and the connecting rod 24 to the internal conductor of the resonator R2 so as to be resonated with the inherent frequency of the resonator R2, and so as to be filtered by the load capacitor CS1. Then the signals are supplied through the inductor L2 to a filter circuit of the next stage.
  • the filter circuit of the next stage includes the inductor L2, the resonator R3, the shunt capacitor C3 and the load capacitor CS2.
  • the signals which have passed through the inductor L2 are supplied through the shunt capacitor C3 and the connecting rod 24 to the resonator R3 so as to be resonated, and so as to be filtered by the load capacitor CS2. Then the signals are supplied through the inductor L3 to the antenna so as to be radiated into the air.
  • the shunt capacitors C1-C3 which have been conventionally assembled as three separate elements are formed on a single substrate so as to form a single element.
  • the brass shim 15 which has been conventionally used to adjust the height of the shunt capacitor C1 is eliminated. Instead, an extension of the load capacitor substrate 16 on which the load capacitors CS1 and CS2 are formed replaces the brass shim.
  • the conductive patterns 261 and 262 of the shunt capacitor C1 are connected together by a through hole, so that a capacitance would not be formed on the substrate 16 (which replaces the brass shim 15).
  • the number of the elements of the duplex dielectric filter is reduced. Consequently, an assembling automation becomes possible, and the assembling and material handling processes are simplified, with the result that the productivity is improved. Further, the errors are reduced, thereby making it possible to improve the product quality.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
US08/739,014 1995-12-27 1996-10-28 Duplex dielectric filter Expired - Fee Related US5789998A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1995-58510 1995-12-27
KR1019950058510A KR970054817A (ko) 1995-12-27 1995-12-27 듀플렉스 유전체 필터

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JP (1) JPH09186504A (ko)
KR (1) KR970054817A (ko)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0989625A2 (en) * 1998-09-28 2000-03-29 Murata Manufacturing Co., Ltd. Dielectric filter unit, duplexer and communication apparatus
US6057746A (en) * 1997-05-07 2000-05-02 Ngk Spark Plug Co., Ltd. Dielectric duplexer unit with LC coupling circuit laminate
DE19903855A1 (de) * 1999-02-01 2000-10-19 Epcos Ag Duplexer/Diplexer aus zwei modular aufgebauten Filtern
US6308051B1 (en) * 1997-10-17 2001-10-23 Murata Manufacturing Co., Ltd. Antenna duplexer
US6734764B2 (en) * 2001-03-29 2004-05-11 Tdk Corporation Shield for dielectric filter and dielectric filter equipped with the same
DE10322136A1 (de) * 2003-05-16 2004-12-09 Epcos Ag Frontend-Modul mit geringer Einfügedämpfung
US6958663B2 (en) * 2002-03-07 2005-10-25 Murata Manufacturing Co., Ltd. In-band group delay equalizer and distortion compensation amplifier
US20120222290A1 (en) * 2002-04-24 2012-09-06 Mineral Lassen Llc Method and system for preparing wireless communication chips for later processing

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100352454B1 (ko) * 2000-05-03 2002-09-11 신화인터텍 주식회사 광자띠 간격 이론에 의한 마이크로웨이브용 소자

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5081435A (en) * 1989-06-08 1992-01-14 Murata Mfg. Co., Ltd. Dielectric filter
JPH05259706A (ja) * 1992-03-09 1993-10-08 Murata Mfg Co Ltd 電子部品の入出力端子接続構造
JPH05291803A (ja) * 1992-04-13 1993-11-05 Ube Ind Ltd 誘電体フィルタ
JPH0645804A (ja) * 1992-05-25 1994-02-18 Murata Mfg Co Ltd 誘電体フィルタ
JPH06196903A (ja) * 1992-12-25 1994-07-15 Fuji Elelctrochem Co Ltd 誘電体フィルタ
JPH06232605A (ja) * 1993-02-05 1994-08-19 Murata Mfg Co Ltd 誘電体フィルタ
JPH06276006A (ja) * 1993-03-24 1994-09-30 Matsushita Electric Ind Co Ltd 誘電体フィルタ
US5379012A (en) * 1992-04-30 1995-01-03 Ngk Spark Plug Co., Ltd. Dielectric filter device
US5486799A (en) * 1992-05-08 1996-01-23 Oki Electric Industry Co., Ltd. Strip line filter and duplexer filter using the same
US5563560A (en) * 1993-12-27 1996-10-08 Murata Manufacturing Co., Ltd. Coupling capacitance dielectric board for coaxial resonators

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2608177B2 (ja) * 1990-11-05 1997-05-07 富士電気化学株式会社 帯域阻止フィルタ
JPH04170680A (ja) * 1990-11-05 1992-06-18 Mitsubishi Electric Corp 対話型配線径路修正装置及びその修正方法
JPH07176913A (ja) * 1993-12-20 1995-07-14 Murata Mfg Co Ltd 誘電体共振器装置
JPH0897606A (ja) * 1994-09-21 1996-04-12 Murata Mfg Co Ltd 誘電体フィルタの特性調整方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5081435A (en) * 1989-06-08 1992-01-14 Murata Mfg. Co., Ltd. Dielectric filter
JPH05259706A (ja) * 1992-03-09 1993-10-08 Murata Mfg Co Ltd 電子部品の入出力端子接続構造
JPH05291803A (ja) * 1992-04-13 1993-11-05 Ube Ind Ltd 誘電体フィルタ
US5379012A (en) * 1992-04-30 1995-01-03 Ngk Spark Plug Co., Ltd. Dielectric filter device
US5486799A (en) * 1992-05-08 1996-01-23 Oki Electric Industry Co., Ltd. Strip line filter and duplexer filter using the same
JPH0645804A (ja) * 1992-05-25 1994-02-18 Murata Mfg Co Ltd 誘電体フィルタ
JPH06196903A (ja) * 1992-12-25 1994-07-15 Fuji Elelctrochem Co Ltd 誘電体フィルタ
JPH06232605A (ja) * 1993-02-05 1994-08-19 Murata Mfg Co Ltd 誘電体フィルタ
JPH06276006A (ja) * 1993-03-24 1994-09-30 Matsushita Electric Ind Co Ltd 誘電体フィルタ
US5563560A (en) * 1993-12-27 1996-10-08 Murata Manufacturing Co., Ltd. Coupling capacitance dielectric board for coaxial resonators

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6057746A (en) * 1997-05-07 2000-05-02 Ngk Spark Plug Co., Ltd. Dielectric duplexer unit with LC coupling circuit laminate
US6308051B1 (en) * 1997-10-17 2001-10-23 Murata Manufacturing Co., Ltd. Antenna duplexer
EP0989625A2 (en) * 1998-09-28 2000-03-29 Murata Manufacturing Co., Ltd. Dielectric filter unit, duplexer and communication apparatus
CN100590932C (zh) * 1998-09-28 2010-02-17 株式会社村田制作所 介质滤波器装置、双工器和通信设备
EP0989625A3 (en) * 1998-09-28 2001-08-08 Murata Manufacturing Co., Ltd. Dielectric filter unit, duplexer and communication apparatus
US6362705B1 (en) 1998-09-28 2002-03-26 Murata Manufacturing Co., Ltd. Dielectric filter unit, duplexer, and communication apparatus
US6696904B1 (en) 1999-02-01 2004-02-24 Epcos Ag Duplex/diplexer having two modularly constructed filters
DE19903855A1 (de) * 1999-02-01 2000-10-19 Epcos Ag Duplexer/Diplexer aus zwei modular aufgebauten Filtern
DE19903855B4 (de) * 1999-02-01 2010-04-15 Epcos Ag Antennenweiche
US6734764B2 (en) * 2001-03-29 2004-05-11 Tdk Corporation Shield for dielectric filter and dielectric filter equipped with the same
US6958663B2 (en) * 2002-03-07 2005-10-25 Murata Manufacturing Co., Ltd. In-band group delay equalizer and distortion compensation amplifier
US20120222290A1 (en) * 2002-04-24 2012-09-06 Mineral Lassen Llc Method and system for preparing wireless communication chips for later processing
DE10322136A1 (de) * 2003-05-16 2004-12-09 Epcos Ag Frontend-Modul mit geringer Einfügedämpfung
DE10322136B4 (de) * 2003-05-16 2011-05-19 Epcos Ag Frontend-Modul mit geringer Einfügedämpfung

Also Published As

Publication number Publication date
JPH09186504A (ja) 1997-07-15
KR970054817A (ko) 1997-07-31

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Owner name: SAMSUNG ELECTRO-MECHANICS CO., LTD., KOREA, REPUBL

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