US5764126A - Chip coil - Google Patents

Chip coil Download PDF

Info

Publication number
US5764126A
US5764126A US08/776,061 US77606197A US5764126A US 5764126 A US5764126 A US 5764126A US 77606197 A US77606197 A US 77606197A US 5764126 A US5764126 A US 5764126A
Authority
US
United States
Prior art keywords
main body
coil
terminals
insulation resin
circumferential surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
US08/776,061
Other languages
English (en)
Inventor
Toyonori Kanetaka
Mikio Taoka
Toshihiro Yoshizawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. reassignment MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KANETAKA, TOYONORI, TAOKA, MIKIO, YOSHIZAWA, TOSHIHIRO
Application granted granted Critical
Publication of US5764126A publication Critical patent/US5764126A/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors

Definitions

  • the present invention relates to a chip coil for use in the electronic appliance, communication apparatus, etc.
  • FIG. 6 Shown in FIG. 6 is a perspective view of a conventional chip coil having spiral groove.
  • numeral 11 denotes a main body of square pillar shape around which a conductive member is provided on an insulating surface.
  • Numeral 12 is a coil formed by spirally grooving the conductive surface layer of main body 11, 14 an insulation resin coated over the surface of coil 12, and 15 terminals of coil 12.
  • the main body 11 is provided with recesses 16 in the front, rear, top and bottom faces, it is not easy to take the main body 11 out of mould when manufacturing the main body through a moulding process; which is an adverse factor against the productivity. Furthermore, the recesses 16 provided in the front, rear, top and bottom faces of main body 11 reduce the cross sectional area of main body 11; accordingly the inductance which is subject to the cross sectional area of main body 11 also becomes smaller.
  • the present invention is intended to solve the above described problems, and presents a chip coil with which the mounting defects are reduced, a high productivity is preserved, at the same time the decrement in inductance is minimized.
  • a chip coil according to the present invention comprises a main body of an insulation material having a shape of square pillar, terminals provided at both ends of the main body, a coil connected with the terminals and disposed around the circumferential surface of the main body in an area between the terminals, and an insulation resin covering the coil; wherein the coil is formed by grooving off the insulation layer covering the surface of the main body, recesses are provided only at the top and bottom faces of the circumferential surface of the main body, and at the bottom surface of the main body the insulation resin is provided within the recess.
  • FIG. 1(a) is a perspective view showing a chip coil, before coating of insulation resin, according to a first embodiment of the present invention.
  • FIG. 1(b) is a perspective view showing the chip coil FIG. 1(a), after coating of insulation resin.
  • FIG. 2 is a partially cutaway perspective view of a chip coil according to a second embodiment of the present invention.
  • FIG. 3 is an electrical equivalent circuit diagram of the chip coil of FIG. 2.
  • FIG. 4 is a partially cutaway perspective view of a chip coil according to a third embodiment of the present invention.
  • FIG. 5 is an electrical equivalent circuit diagram of the chip coil of FIG. 4.
  • FIG. 6 is a partially cutaway perspective view of a prior art chip coil.
  • FIG. 7 is a partially cutaway perspective view of other prior art chip coil.
  • numeral 1 denotes a main body made of a material having insulating property shaped in a square pillar lying horizontal and provided with a conductive layer over the surface, 2 a coil formed by spirally grooving off the conductive layer around the circumferential surface of main body 1, 3 eliminations formed by eliminating a part of the front face of terminals 5 disposed at both ends of main body 1, and 6 recesses provided only in the top and bottom faces of the circumferential surface of main body 1.
  • numeral 4 denotes an insulation resin applied on the outer surface of coil 2.
  • H represents the height, and W the width of main body 1; where, H is 0.7 mm, W is 0.5 mm.
  • the chip coil comprises main body 1 of insulating material having a square pillar shape, terminals 5 disposed at both ends of main body 1 in the top, bottom, front, rear and sectional faces, coil 2 disposed around the circumferential surface of main body 1 and connected with the terminals 5, and insulation resin 4 covering the coil 2.
  • the coil 2 is formed by grooving off the conductive layer covering the circumferential surface of main body 1.
  • the insulation resin 4 covers coil 2 within the space of recesses 6.
  • the main body 1 is given with an orientation with respect to the top and bottom faces in a state prior to application of insulation resin 4 as shown in FIG. 1(a). Namely, in the state as shown in FIG. 1(a), the recesses 6 are exposed at the top and bottom faces of main body 1 as the insulation resin 4 is not yet applied to; therefore the main body 1 is orientated through detection of recesses 6, so as the recesses 6 are positioned at the top and bottom faces, and then, in this state, the coil 2 is covered with insulation resin 4, and taped. During the above described procedure, the accuracy in directional orientation is improved because the positioning of main body 1 is correctable by the recesses 6.
  • terminals 5 are disposed at both ends of main body 1 having recesses 6, the flatness between the surfaces of terminals 5 and insulation resin 4 is assured because the insulation resin 4 is provided only within the recess 6 provided in the bottom face between the terminals 5. This contributes in preventing mounting defects when mounting a chip on a printed circuit board or the like.
  • main body 1 is not much reduced because no recess 6 is provided at the front and rear faces of the circumferential surface of main body 1; and the main body 1 can easily be taken out of mould during the moulding process because there is no recess 6 at the front and rear faces, which results in an improved productivity.
  • the chip coil of FIG. 2 is a chip coil of FIG. 1, in which an intermediate terminal 7 is provided in the middle of coil 2 and made to be exposing out of the insulation resin 4.
  • FIG. 3 shows an electrical equivalent circuit diagram of the above chip. With the above described constitution, the main body 1 contains two of the coil 2, and the mounting density is raised.
  • the chip coil of FIG. 4 is a chip coil of FIG. 1, in which the insulation resin 4 covering the surface of coil 2 is replaced with a dielectric resin 8, and a conductive terminal 9 is provided on the surface in a belt form.
  • An electrical equivalent circuit diagram of the above chip is as shown in FIG. 5.
  • a capacitor is formed between coil 2 and conductive terminal 9, as a result one chip coil additionally provides a filter function based on two of the coil 2 and capacitor 10.
  • recesses are provided only in the top and bottom faces of the circumferential surface of a main body, and insulation resin is provided at the bottom surface within the recess, as a result the flatness of the bottom surface of the main body is improved, and the occurrence of mounting defects is prevented.
  • the cross sectional area of the main body is not much diminished and the inductance is not reduced; furthermore, as there is no recess in the front and rear faces of the main body the main body can easily be taken out of mould while processing with moulds, so the productivity is improved.
  • the main body can contain two of the coil to an increased mounting density.
  • one chip coil can additionally have a filter function based on two of the coil and the capacitor.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
US08/776,061 1995-06-08 1996-05-31 Chip coil Expired - Fee Related US5764126A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP14154695 1995-06-08
JP7-141546 1995-06-08
PCT/JP1996/001476 WO1996042094A1 (fr) 1995-06-08 1996-05-31 Bobine sous forme de puce

Publications (1)

Publication Number Publication Date
US5764126A true US5764126A (en) 1998-06-09

Family

ID=15294489

Family Applications (1)

Application Number Title Priority Date Filing Date
US08/776,061 Expired - Fee Related US5764126A (en) 1995-06-08 1996-05-31 Chip coil

Country Status (5)

Country Link
US (1) US5764126A (de)
EP (1) EP0785559B1 (de)
CN (1) CN1075661C (de)
DE (1) DE69622983T2 (de)
WO (1) WO1996042094A1 (de)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5963119A (en) * 1996-10-11 1999-10-05 Matsushita Electric Industrial Co., Ltd. Electric component having conductor film formed on insulative base
US6084500A (en) * 1997-03-28 2000-07-04 Matsushita Electric Industrial Co., Ltd. Chip inductor and method for manufacturing the same
US6087921A (en) * 1998-10-06 2000-07-11 Pulse Engineering, Inc. Placement insensitive monolithic inductor and method of manufacturing same
US6094123A (en) * 1998-09-25 2000-07-25 Lucent Technologies Inc. Low profile surface mount chip inductor
US6154112A (en) * 1998-07-13 2000-11-28 Taiyo Yuden Co., Ltd. Chip inductor
US6157283A (en) * 1998-11-24 2000-12-05 Taiyo Yuden Co., Ltd. Surface-mounting-type coil component
US6194248B1 (en) * 1997-09-02 2001-02-27 Murata Manufacturing Co., Ltd. Chip electronic part
US6249203B1 (en) * 1997-10-06 2001-06-19 Murata Manufacturing, Co., Ltd Wire-wound chip inductor
US6298544B1 (en) * 1999-03-24 2001-10-09 Inpaq Technology Co., Ltd. Method of fabricating a high frequency thin film coil element
US6393691B1 (en) * 1999-01-28 2002-05-28 Taiyo Yuden Co., Ltd. Electronic chip component and manufacturing method thereof
US6492885B1 (en) * 1999-06-30 2002-12-10 Murata Manufacturing Co., Ltd. LC component with grooves cut in the capacitor electrode
KR100381361B1 (ko) * 2000-11-08 2003-04-26 주식회사 쎄라텍 표면 실장형 칩 인덕터 제조방법
US20030079904A1 (en) * 2001-10-03 2003-05-01 Satoshi Sato Electronic component and method of manufacturing the same
US6609009B1 (en) 1999-04-26 2003-08-19 Matsushita Electric Industrial Co., Ltd. Electronic component and radio terminal using the same
US20050046517A1 (en) * 2003-08-29 2005-03-03 Matsushita Electric Industrial Co., Ltd. Electronic component
US20150187487A1 (en) * 2014-01-02 2015-07-02 Samsung Electro-Mechanics Co., Ltd. Ceramic electronic component
US20160172097A1 (en) * 2014-12-12 2016-06-16 Samsung Electro-Mechanics Co., Ltd. Electronic component and method of manufacturing the same

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5510709B2 (ja) * 2010-01-22 2014-06-04 株式会社デンソー 回転電機の固定子
JP5755414B2 (ja) * 2010-06-08 2015-07-29 日本電産サンキョー株式会社 振れ補正機能付き光学ユニット
KR102171676B1 (ko) * 2015-05-26 2020-10-29 삼성전기주식회사 칩 전자 부품

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54140164A (en) * 1978-04-21 1979-10-31 Tdk Electronics Co Ltd Inductance element and method of producing same
JPS5748216A (en) * 1980-09-05 1982-03-19 Murata Mfg Co Ltd Manufacture of chip type inductance element
JPH0252408A (ja) * 1988-08-17 1990-02-22 Murata Mfg Co Ltd Ｌｃ複合部品
JPH04101404A (ja) * 1990-08-21 1992-04-02 Tdk Corp 電子部品及びその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5879706A (ja) * 1981-11-06 1983-05-13 Matsushita Electric Ind Co Ltd チツプインダクタ
FR2548821B1 (fr) * 1983-07-04 1986-01-24 Europ Composants Electron Composant electronique inductif pour le report a plat

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54140164A (en) * 1978-04-21 1979-10-31 Tdk Electronics Co Ltd Inductance element and method of producing same
JPS5748216A (en) * 1980-09-05 1982-03-19 Murata Mfg Co Ltd Manufacture of chip type inductance element
JPH0252408A (ja) * 1988-08-17 1990-02-22 Murata Mfg Co Ltd Ｌｃ複合部品
JPH04101404A (ja) * 1990-08-21 1992-04-02 Tdk Corp 電子部品及びその製造方法

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6131041A (en) * 1996-10-11 2000-10-10 Matsushita Electric Industrial Co., Ltd. Wireless terminal equipment including electric component having conductor film formed on insulative base
US5963119A (en) * 1996-10-11 1999-10-05 Matsushita Electric Industrial Co., Ltd. Electric component having conductor film formed on insulative base
US6084500A (en) * 1997-03-28 2000-07-04 Matsushita Electric Industrial Co., Ltd. Chip inductor and method for manufacturing the same
US6388550B1 (en) 1997-03-28 2002-05-14 Matsushita Electric Industrial Co., Ltd. Chip inductor and its manufacturing method
US6194248B1 (en) * 1997-09-02 2001-02-27 Murata Manufacturing Co., Ltd. Chip electronic part
US6249203B1 (en) * 1997-10-06 2001-06-19 Murata Manufacturing, Co., Ltd Wire-wound chip inductor
US6154112A (en) * 1998-07-13 2000-11-28 Taiyo Yuden Co., Ltd. Chip inductor
US6094123A (en) * 1998-09-25 2000-07-25 Lucent Technologies Inc. Low profile surface mount chip inductor
US6087921A (en) * 1998-10-06 2000-07-11 Pulse Engineering, Inc. Placement insensitive monolithic inductor and method of manufacturing same
US6157283A (en) * 1998-11-24 2000-12-05 Taiyo Yuden Co., Ltd. Surface-mounting-type coil component
US6393691B1 (en) * 1999-01-28 2002-05-28 Taiyo Yuden Co., Ltd. Electronic chip component and manufacturing method thereof
US6298544B1 (en) * 1999-03-24 2001-10-09 Inpaq Technology Co., Ltd. Method of fabricating a high frequency thin film coil element
US6609009B1 (en) 1999-04-26 2003-08-19 Matsushita Electric Industrial Co., Ltd. Electronic component and radio terminal using the same
US6492885B1 (en) * 1999-06-30 2002-12-10 Murata Manufacturing Co., Ltd. LC component with grooves cut in the capacitor electrode
KR100381361B1 (ko) * 2000-11-08 2003-04-26 주식회사 쎄라텍 표면 실장형 칩 인덕터 제조방법
US20030079904A1 (en) * 2001-10-03 2003-05-01 Satoshi Sato Electronic component and method of manufacturing the same
US6946945B2 (en) * 2001-10-03 2005-09-20 Matsushita Electric Industrial Co., Ltd. Electronic component and method of manufacturing the same
US20050046517A1 (en) * 2003-08-29 2005-03-03 Matsushita Electric Industrial Co., Ltd. Electronic component
US7119635B2 (en) * 2003-08-29 2006-10-10 Matsushita Electric Industrial Co., Ltd. Electronic component
US20150187487A1 (en) * 2014-01-02 2015-07-02 Samsung Electro-Mechanics Co., Ltd. Ceramic electronic component
US20160172097A1 (en) * 2014-12-12 2016-06-16 Samsung Electro-Mechanics Co., Ltd. Electronic component and method of manufacturing the same

Also Published As

Publication number Publication date
EP0785559A1 (de) 1997-07-23
DE69622983D1 (de) 2002-09-19
EP0785559A4 (de) 1999-08-11
CN1159248A (zh) 1997-09-10
EP0785559B1 (de) 2002-08-14
WO1996042094A1 (fr) 1996-12-27
DE69622983T2 (de) 2003-03-06
CN1075661C (zh) 2001-11-28

Similar Documents

Publication Publication Date Title
US5764126A (en) Chip coil
EP0593020B1 (de) Verfahren zur Herstellung eines elektronischen Bauelementes
US4521828A (en) Component module for piggyback mounting on a circuit package having dual-in-line leads
US6535095B2 (en) Wound type common mode choke coil
US6154112A (en) Chip inductor
EP0888040B1 (de) Anordnung zur Abschirmung einer elektronischen Leiterplatte gegen die Funkwellwen
JPH0479507A (ja) フィルタ及びフィルタ付電気コネクタ
JP3554209B2 (ja) 面実装型コイル部品
EP2040328B1 (de) Antenneneinrichtung
JPH07135053A (ja) 同軸コネクタ及び同軸コネクタの実装構造
US5159294A (en) Non-reciprocal circuit element
JPH08148872A (ja) プラスチックシールド筐体
US5532656A (en) Planar T-type LC filter with recesses between terminal electrodes
US20050001772A1 (en) Heat shrinking polyester film roll
JPS6053005A (ja) フラツトトランスフア用誘導性電子部品
US8112872B2 (en) Method of manufacturing a coil component
JP3241996B2 (ja) チップコイル
JPH0513236A (ja) コイル実装電子部品基板とその製造方法
JPS6210056B2 (de)
JP2002313629A (ja) チップ型インダクタ
JPH088629A (ja) 小型無線機の内蔵アンテナ
JP2553577B2 (ja) 固体電解コンデンサ
JPH0555087A (ja) モールドチツプタンタル固体電解コンデンサ
JPH03261114A (ja) チップインダクタ
JP2598341Y2 (ja) 積層型誘電体ストリップライン共振器

Legal Events

Date Code Title Description
AS Assignment

Owner name: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD., JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KANETAKA, TOYONORI;TAOKA, MIKIO;YOSHIZAWA, TOSHIHIRO;REEL/FRAME:008459/0093

Effective date: 19970328

FEPP Fee payment procedure

Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

FPAY Fee payment

Year of fee payment: 4

REMI Maintenance fee reminder mailed
LAPS Lapse for failure to pay maintenance fees
STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362

FP Lapsed due to failure to pay maintenance fee

Effective date: 20060609