US5723976A - Method for detecting minute defects in an encapsulated electronic component - Google Patents

Method for detecting minute defects in an encapsulated electronic component Download PDF

Info

Publication number
US5723976A
US5723976A US08/529,387 US52938795A US5723976A US 5723976 A US5723976 A US 5723976A US 52938795 A US52938795 A US 52938795A US 5723976 A US5723976 A US 5723976A
Authority
US
United States
Prior art keywords
component
solution
fluorescent
fluorescing
water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
US08/529,387
Other languages
English (en)
Inventor
Toshiaki Yoshida
Tetsuo Norimatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Assigned to INTERNATIONAL BUSINESS MACHINES CORPORATION reassignment INTERNATIONAL BUSINESS MACHINES CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: NORIMATSU, TETSUO, YOSHIDA, TOSHIAKI
Application granted granted Critical
Publication of US5723976A publication Critical patent/US5723976A/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/91—Investigating the presence of flaws or contamination using penetration of dyes, e.g. fluorescent ink

Definitions

  • the present invention relates to a method for detecting minute defects in an encapsulated electronic component, for example electronic components encapsulated with resins or ceramics.
  • electronic components include, for example, integrated circuit chips containing resistors, microswitches or logic circuits, or electronic components used as contacts in relay circuits and the like.
  • an electronic component such as an IC package is immersed in an oil-based fluorescent solution for a certain time to allow the oil-based fluorescent solution to permeate into minute defects, for example, locations where the resin is separated from the component, after which the encapsulating resin is opened and the electronic component is irradiated with ultraviolet rays to observe visually the fluorescing portions and their intensity to determine the adhesion of the encapsulation to the component.
  • the encapsulating material is an organic substance such as a resin
  • the organic material itself often fluoresces by the irradiation of ultraviolet rays, and it is difficult to distinguish the fluorescence of the fluorescent solution which has permeated into minute defects.
  • the electronic component must be immersed in the solution overnight or even longer; thus the method cannot be used for urgent evaluation.
  • the intensity of fluorescence is too small to evaluate minute portions of 100 microns or less. Also, since the fluorescent solution is oil-based, care must be taken for handling the solution for safety and for environment protection.
  • the object of the invention has been achieved by providing a method for detecting minute defects in an encapsulated electronic component comprising the steps of immersing the component in an aqueous fluorescent solution of a water-soluble fluorescent substance having the property of fluorescing when moistened and stopping fluorescing when dry, allowing the solution to permeate into minute defects of the component, opening the component, and observing an image of the component while moistening and drying the component at least once to detect fluorescing and stopping fluorescing.
  • FIGS. 1 and 2 show the chemical formulae of fluorescent substances which may be used in performing the invention.
  • FIG. 3 is a schematic diagram illustrating an example of a humidifying and dehumidifying apparatus which may be used in performing the invention.
  • a component to be tested is immersed in an aqueous fluorescent solution.
  • the aqueous fluorescent solution contains a water-soluble fluorescent compound which fluoresces when moistened and stops fluorescing when dried.
  • the water-soluble fluorescent compound may be an organic fluorescent compound having a benzene, pyridine, ⁇ pyrroline, pyrazine, oxazine or thiazine ring.
  • fluorescein sodium is a reddish orange-coloured crystalline compound whose chemical formula is shown in FIG. 1. This does not fluoresce when it is dry (FIG. 1a) but emits yellowish green fluorescence when it is dissolved in water (FIG. 1b).
  • Umbelliferone is a colourless crystalline compound which does not fluoresce when it is dry (FIG. 2a) but emits blue fluorescence when it is dissolved in water (FIG. 2b).
  • fluorescein sodium emits yellowish green fluorescence when moistened and stops fluorescing when dried
  • umbelliferone emits blue fluorescence when moistened and stops fluorescing when dried. Since fluorescein sodium is easily dissolved in cold water, and is stable and difficult to decompose, it is especially suitable for the use in the aqueous fluorescent solution of the present invention.
  • the water-soluble fluorescent compound can be used in concentrations from trace (0.0001% by weight in the solution) to saturation.
  • concentration of the water-soluble fluorescent compound in the aqueous fluorescent solution is 0.0001 to 3% by weight, preferably about 1% by weight.
  • the aqueous fluorescent solution comprises a water-soluble fluorescent compound, a surface active agent and a solvent.
  • a solvent organic solvents may be used for this purpose. When organic solvents are used, such solvents should not affect the water-soluble fluorescent compound and the encapsulating resin for electronic components. For this reason, alcohols such as ethyl alcohol are preferred.
  • the surface tension of the solution is lowered, and the solution permeates more easily into minute defective portions of the component to be tested when the component is immersed in the solution.
  • Any anionic, cationic, amphoteric or nonionic surface active agent may be used for this purpose.
  • Anionic surface active agents include carboxylates, sulphonates, sulfuric esters, and phosphoric esters; and cationic surface active agents include amine salts, quaternary ammonium salts, phosphonium salts, and sulfonium salts.
  • Amphoteric surface active agents include betaine and sulfobetaine; and nonionic surface active agents include aliphatic monoglycerine esters, aliphatic polyglycol esters, aliphatic sorbitan esters, and polyethylene glycol type surface active agents.
  • the surface active agent may be used in any concentration higher than the critical micell concentration.
  • the critical micell concentration of an anionic surface active agent, sodium alkylbenzene sulphonate (ABS) is about 0.0001% by weight.
  • An anionic surface active agent especially sodium alkylbenzene sulphonate (ABS) is advantageously used in the method of the present invention because it is stable, difficult to decompose, inexpensive, and does not affect organic materials such as encapsulating resins.
  • ABS sodium alkylbenzene sulphonate
  • the component to be tested is immersed in the aqueous fluorescent solution comprising the water-soluble fluorescent compound, surface active agent and solvent.
  • the conditions for immersing differ depending on the shape, size and material of the component, and the object of the evaluation. It may be desirable to accelerate the permeation of the solution into the component, and if so it is not always required to add a surface active agent to the aqueous fluorescent solution.
  • the operation for accelerating the permeation of the aqueous fluorescent solution may include (1) boiling the aqueous fluorescent solution when the component is immersed in the solution, (2) immersing the component in the solution under a reduced pressure, or (3) immersing the component in the solution at a high temperature and under a high pressure.
  • the solution when the solution is boiled, it is preferred to boil the solution under normal pressure for about 30 minutes; when a reduced pressure is used, it is preferred to perform the operation at room temperature at a pressure of 23 hPa or below for about 30 minutes; and when a high temperature and high pressure are used, it is preferred to perform the operation, for example, in an autoclave at a pressure of about 1500 hPa at a temperature of about 112° C. or above for about 10 minutes.
  • the temperature should be the same as the test temperature for the component to be tested, such as a semiconductor device, but may be elevated up to about 200° C.
  • the time for immersion must be decided depending on the particular component under test, since if the immersion time is unnecessarily prolonged an excessive amount of the fluorescent solution permeates into the component and it can be difficult to determine precisely where the defects are located.
  • ABS sodium alkylbenzene sulphonate
  • the component to be tested may be immersed in an ultrasonic cleaner for 1-2 minutes prior to the immersion of the component in the aqueous fluorescent solution.
  • the component After immersing the component to be tested in the aqueous fluorescent solution to allow the solution to permeate into minute defects of the component, the component is opened. This may be done using a vice with a cutter for opening packages, or using cutting pliers or a grinder. Other means for opening may be used, provided it is a dry system without using water or oil.
  • FIG. 3 An example of an apparatus for moistening and drying the component is shown in FIG. 3.
  • air is supplied from an air pump 1, and the path of the air may be switched by a change-over valve 2 either through a humidifier 3 or through a dehumidifier 4. Dry air or humid air is blown out of a nozzle 5 according to the setting of the valve 2.
  • the humidifier 3 generates humid air from a constant temperature vessel at a temperature from room temperature to 60° C. by the use of bubbling or ultrasonic waves, and the dehumidifier 4 is filled with a drying agent such as silica gel.
  • the opened component to be tested is fixed on a sample table installed near the nozzle 5.
  • the component to be tested is repeatedly moistened and dried with this apparatus.
  • the component should be moistened such that the fluorescent solution permeating into the component does not diffuse into the water drops produced by moistening. To achieve this, the component is normally moistened for about 2 minutes and thereafter dried for about 10 minutes for complete drying.
  • step of moistening and drying may be performed once if fluorescing and stopping fluorescing caused by the single step can be adequately seen, it is preferred to perform the step repeatedly.
  • An enlarged image of the component is observed while moistening and drying the component to detect the location and degree of minute defects of the component.
  • the observation may be carried out, for example, by irradiating the component with ultraviolet rays and observing the defect through a fluorescent microscope, or by inspecting the fluorescence using image processing.
  • the opened electronic component was placed near the nozzle 5 shown in FIG. 1, subjected to cycles of 2 minutes of moistening and 10 minutes of drying, and the state of fluorescing and stopping fluorescing was observed using a fluorescence microscope (Olympus).
  • the result showed that the location of fluorescing (the location in which the fluorescent solution permeated) was the side of the lead pin, and that the location extended in a width of about 0.1 micron to the wire connecting the chip with the lead pin in the package.
  • the opened electronic component was placed near the nozzle shown in FIG. 1, subjected to cycles of 2 minutes of moistening and 10 minutes of drying, and the state of fluorescing and stopping fluorescing was observed using a fluorescence microscope (Olympus).
  • the result showed that the location of fluorescing (the location in which the fluorescent solution permeated) was the entire surface of the lead pin, and that the location extended in a width of about 1 mm to the organic resistor in the package.

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
US08/529,387 1994-09-22 1995-09-18 Method for detecting minute defects in an encapsulated electronic component Expired - Fee Related US5723976A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6227865A JP2628288B2 (ja) 1994-09-22 1994-09-22 微小欠陥の検出方法
JP6-227865 1994-09-22

Publications (1)

Publication Number Publication Date
US5723976A true US5723976A (en) 1998-03-03

Family

ID=16867572

Family Applications (1)

Application Number Title Priority Date Filing Date
US08/529,387 Expired - Fee Related US5723976A (en) 1994-09-22 1995-09-18 Method for detecting minute defects in an encapsulated electronic component

Country Status (4)

Country Link
US (1) US5723976A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (1) EP0703446A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JP2628288B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW (1) TW283259B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100291685A1 (en) * 2007-12-17 2010-11-18 Life Technologies Corporation Methods for detecting defects in inorganic-coated polymer surfaces
US9297768B2 (en) 2013-04-18 2016-03-29 Empire Technology Development Llc Methods and systems for labeling and detecting defects in a graphene layer
US9310315B2 (en) 2007-12-17 2016-04-12 Life Technologies Corporation Methods for detecting defects in inorganic-coated polymer surfaces

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4899313B2 (ja) * 2004-12-22 2012-03-21 トヨタ自動車株式会社 電池、電池の製造方法、及び電解液漏れ検査方法
JP2006332550A (ja) * 2005-05-30 2006-12-07 Asahi Sunac Corp 研磨パッドのドレッシング性評価方法及び研磨パッドのドレッシング方法
CN113311000B (zh) * 2021-07-29 2021-09-24 徐州诺派激光技术有限公司 激光器输出跳线镜片检测工装

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3543570A (en) * 1967-11-21 1970-12-01 Magnaflux Corp Aqueous base penetrant composition and method
US3981185A (en) * 1974-02-21 1976-09-21 Rockwell International Corporation Postemulsifiable dye penetrant system and method for using same
US4400618A (en) * 1981-08-06 1983-08-23 International Business Machines Corporation Method of detecting and analyzing damage in printed circuit boards
US4436999A (en) * 1982-06-08 1984-03-13 Rca Corporation Structural defect detection
US4909806A (en) * 1987-12-31 1990-03-20 Minnesota Mining And Manufacturing Company Fluorine- and chromophore-containing polymer
US5030701A (en) * 1987-12-31 1991-07-09 Minnesota Mining And Manufacturing Company Fluorine- and chromophore-containing polymer
US5369983A (en) * 1992-04-17 1994-12-06 Minnesota Mining And Manufacturing Company Detection medium and method for use in hermetic seal testing

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5222266B2 (ja) 2009-10-07 2013-06-26 株式会社ホンダアクセス フロアマット連結構造

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3543570A (en) * 1967-11-21 1970-12-01 Magnaflux Corp Aqueous base penetrant composition and method
US3981185A (en) * 1974-02-21 1976-09-21 Rockwell International Corporation Postemulsifiable dye penetrant system and method for using same
US4400618A (en) * 1981-08-06 1983-08-23 International Business Machines Corporation Method of detecting and analyzing damage in printed circuit boards
US4436999A (en) * 1982-06-08 1984-03-13 Rca Corporation Structural defect detection
US4909806A (en) * 1987-12-31 1990-03-20 Minnesota Mining And Manufacturing Company Fluorine- and chromophore-containing polymer
US5030701A (en) * 1987-12-31 1991-07-09 Minnesota Mining And Manufacturing Company Fluorine- and chromophore-containing polymer
US5369983A (en) * 1992-04-17 1994-12-06 Minnesota Mining And Manufacturing Company Detection medium and method for use in hermetic seal testing

Non-Patent Citations (6)

* Cited by examiner, † Cited by third party
Title
Aaron Dermarderosian and Vincent Gionet, Water Vapor Penetration Rate into Enclosures with Known Air Leak Rates, Jan. 1979, vol. ED 26 No. 1, pp. 83 90. *
Aaron Dermarderosian and Vincent Gionet, Water Vapor Penetration Rate into Enclosures with Known Air Leak Rates, Jan. 1979, vol. ED-26 No. 1, pp. 83-90.
J. McCormick, Liquid Penetrant Testing For Microelectronic Package Hermeticity, Mar. Apr. 1982, Institute of Electrical and Electronics Engineers, Inc. pp. 207 213. *
J. McCormick, Liquid Penetrant Testing For Microelectronic Package Hermeticity, Mar.-Apr. 1982, Institute of Electrical and Electronics Engineers, Inc. pp. 207-213.
W. Sander, Testing of components with perfluorinated liquids, Elektronik Journal, Apr. 1977, vol. 26, No. 4 pp. 93 94. *
W. Sander, Testing of components with perfluorinated liquids, Elektronik Journal, Apr. 1977, vol. 26, No. 4 pp. 93-94.

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100291685A1 (en) * 2007-12-17 2010-11-18 Life Technologies Corporation Methods for detecting defects in inorganic-coated polymer surfaces
US8304242B2 (en) 2007-12-17 2012-11-06 Life Technologies Corporation Methods for detecting defects in inorganic-coated polymer surfaces
EP2554975A1 (en) 2007-12-17 2013-02-06 Life Technologies Corporation Method and substrate for detecting defects in inorganic-coated polymer surfaces
US9310315B2 (en) 2007-12-17 2016-04-12 Life Technologies Corporation Methods for detecting defects in inorganic-coated polymer surfaces
US9297768B2 (en) 2013-04-18 2016-03-29 Empire Technology Development Llc Methods and systems for labeling and detecting defects in a graphene layer

Also Published As

Publication number Publication date
JP2628288B2 (ja) 1997-07-09
JPH0894543A (ja) 1996-04-12
TW283259B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1996-08-11
EP0703446A1 (en) 1996-03-27

Similar Documents

Publication Publication Date Title
US5922606A (en) Fluorometric method for increasing the efficiency of the rinsing and water recovery process in the manufacture of semiconductor chips
EP0756704B1 (en) Method of detecting the permeability of an object to oxygen
US5723976A (en) Method for detecting minute defects in an encapsulated electronic component
KR0163526B1 (ko) 자외선/오존을 조사하여 접속패드에 보호막을 형성하는 단계를 포함하는 반도체소자 제조방법
JP5595258B2 (ja) ハロゲン及び重金属フリーの湿度表示用組成物、並びにそれから成る湿度インジケータカード
CN109211930A (zh) 电子显示屏封装材料的缺陷检测方法
US5316949A (en) Method of detecting the permeability of an object to oxygen
CN109211928A (zh) 芯片表面膜层缺陷的检测方法
US7444012B2 (en) Method and apparatus for performing failure analysis with fluorescence inks
US4237379A (en) Method for inspecting electrical devices
JPS60124834A (ja) 半導体装置の検査方法
JP2869703B2 (ja) 浸透探傷試験方法に用いる高感度浸透液
JP5093574B2 (ja) 浸透探傷試験方法
EP1160568A1 (de) Verfahren und Testflüssigkeit zum Nachweisen von sauren Flussmittelrückständen an elektronischen Baugruppen
KR100994737B1 (ko) 피에이치 반응성 코팅제와 그 제조방법 및 이를 이용한 누설 검사방법
JP3824949B2 (ja) 部品の欠陥を検査するための方法およびシステム
JP2530194B2 (ja) 表面あらさのあらい試験品の浸透探傷試験方法及び該試験方法に使用する洗浄剤
CN108899276A (zh) 用于半导体封装元件解封的腐蚀液组合物
JPH0755792A (ja) ホルマリン検知テープ
JPS63151806A (ja) 半導体装置の間隙検出方法
JP2006300739A (ja) 試験紙及びその製造方法
Mathew et al. Copper Wirebond Compatibility with Organic and Inorganic Ions Present in Mold Compounds
US3222292A (en) Composition for the detection of moisture in polar organic liquids
JPH0611462A (ja) 材料表面の微細欠陥探査法
JPS5915842A (ja) 浸透探傷用浸透液及び浸透探傷法

Legal Events

Date Code Title Description
AS Assignment

Owner name: INTERNATIONAL BUSINESS MACHINES CORPORATION, NEW Y

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YOSHIDA, TOSHIAKI;NORIMATSU, TETSUO;REEL/FRAME:007689/0149

Effective date: 19950825

FPAY Fee payment

Year of fee payment: 4

REMI Maintenance fee reminder mailed
LAPS Lapse for failure to pay maintenance fees
STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362

FP Lapsed due to failure to pay maintenance fee

Effective date: 20060303