US5321227A - Method and apparatus using a laser beam to deeply cut a material covering a substrate - Google Patents

Method and apparatus using a laser beam to deeply cut a material covering a substrate Download PDF

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Publication number
US5321227A
US5321227A US07/917,326 US91732692A US5321227A US 5321227 A US5321227 A US 5321227A US 91732692 A US91732692 A US 91732692A US 5321227 A US5321227 A US 5321227A
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Prior art keywords
focussing
focussing field
cable
field
laser radiation
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Expired - Fee Related
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US07/917,326
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English (en)
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Gilles Fuchs
Patrick Baraer
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Airbus Group SAS
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Airbus Group SAS
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Assigned to SOCIETE ANONYME AEROSPATIALE SOCIETE NATIONALE INDUSTRIELLE reassignment SOCIETE ANONYME AEROSPATIALE SOCIETE NATIONALE INDUSTRIELLE ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: BARAER, PATRICK, FUCHS, GILLES
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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G1/00—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines
    • H02G1/12—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines for removing insulation or armouring from cables, e.g. from the end thereof
    • H02G1/1275—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines for removing insulation or armouring from cables, e.g. from the end thereof by applying heat
    • H02G1/128—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines for removing insulation or armouring from cables, e.g. from the end thereof by applying heat using radiant energy, e.g. a laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0738—Shaping the laser spot into a linear shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Definitions

  • the present invention concerns the deep cutting of a material covering a substrate to be effected by a laser beam and more specifically said material absorbing the laser radiation and coating a substrate possibly able to reflect this radiation and more particularly, although not exclusively, concerns the stripping of cables.
  • Cables in this document are understood to be all electric, single-wire, multi-wire, shielded or non-shielded conductors.
  • the aerospatial industry uses large quantities of cables for controls and electric linkings and in particular for supersheathed shielded cables constituted by a plurality of electric conductors insulated by a lateral sheathing. These conductors, placed beside each other in a bundle, are surrounded by a shielding covered with a nonconductive protective sheath.
  • This stripping operation mainly consists of removing over a certain length the outer protective sheath of the cable so as to reveal the extremity of the shielding without damaging it.
  • the risk of cable damage may be reduced by the use of thermic strippers which are particularly effective for fine round conductors.
  • the laser is also used for attacking by means of ablation the outer sheath of a cable, that is by heating and then vaporizing the absorbant material.
  • the absence of any contact between the cutting device and the cable makes it possible, should the operating ranges permit it, to envisage good reproducibility of the stripping operation, the result being completely dissociated from the skill or knowhow of operators.
  • This method functions for a single circular cable with a constant thickness.
  • the principle is based on the focussing of the beam by acting on the reflection indices of the existing materials, as well as on the wavelengths they are able to absorb.
  • the action of the laser beam is limited to the focussing zone whose dimensions are too restricting for taking into account coating profile variations so that, in the case of cables or conductors having no symmetry of revolution, the stripping of the outer sheath is unhomogeneous.
  • the object of the invention concerns a new laser stripping technique satisfying the above-mentioned aims.
  • the invention concerns a new cutting method by using a laser beam able to slit via ablation or local fusion, a material absorbing the laser radiation and coating a substrate possibly able to reflect this radiation cleanly and clearly for a slitting depth much greater than the penetration depth of known laser cutting devices without damaging the substrate.
  • the invention concerns a method for the deep cutting by means of a laser beam of a material covering a substrate, the material absorbing the laser radiation and appearing in the form of a sheet, coating, sheath or similar shape with the substrate being made of a material to possibly reflect this radiation, wherein it consists of:
  • the focussing field acts like a heating blade penetrating via evaporation or fusion into the entire thickness of the material to be cut so as to embody a clear clean cutting without damaging the substrate.
  • the invention is applicable to the cutting of a material with the shape of a sheet or coating with a thickness of several tenths of millimeters. As well as a few millimeters, covering a substrate with a flat, concave or convex surface.
  • the invention is of course applicable to the stripping of cables and in this application the cable to be stripped is driven in rotation by at least one revolution around an axis merged with its general axis or parallel to this axis and orthogonal to the plane of the fictive thin blade constituting or delimiting the focussing field so as to have run off the entire section of the material to be cut inside the focussing field.
  • the invention also concerns a device to implement the method mentioned above and including a laser source generating a beam of parallel rays with radiant energy extending along a particular axis, wherein it further comprises an optical cylindrical lens with an axis perpendicular to the axis of the incident laser beam with a suitable focal length and transforming the laser beam into the thin pencil of rays, the general plane of the fictive thin blade delimiting the focussing field being merged with the general plane of the beam in the shape of a pencil of rays and means to drive the cable to be stripped in rotation at least once around an axis orthogonal to the plane of the focussing field, and so as to have the entire section of the outer sheath of the cable run off into the focussing field.
  • the cylindrical lens has a preferably large focal length so as to obtain a high focussing depth in the focussing field and able to reach several millimeters.
  • an optical system is provided upstream of the cylindrical lens, the optical system being intended to widen the incident beam and constituted for example, by one divergent optical lens and one convergent optical lens for rectifying the beam enlarged by the divergent lens and provide it with a diameter equal to the width, in the sense defined above, of the cylindrical lens.
  • the laser source may be a carbon dioxide source with a power of 10 watts and sufficient for the stripping of cables of those types used in the aeronautical and spatial industries.
  • This device is able to be used for the stripping of any cable and, in particular, for twisted shielded cables or other similar cables with an external profile not having any symmetry of revolution to the extent that the sheath or external casing is able to be removed by ablation or fusion under the action of a laser beam.
  • This device is able to be used for the stripping of a cable whose coating subjacent to the external sheath is made o: a material reflecting the laser radiation and also for the stripping of cables with a non-reflecting subjacent coating, either fully or locally with regard to the radiation due to the fact that the ablative or fusion power of the laser radiation is concentrated on the external sheath and insufficient to attack the subjacent coating.
  • a stripping device which is able to generate a beam with the shape of a thin pencil of rays having a roughly rectangular section 14 mm long and 0.2 mm wide and creating an active or effective zone known as the focussing field where ablation or fusion by the laser radiation of the material of the sheath to be removed is clean and clear, the focussing field having the shape of a thin blade whose general plane is merged with that of the thin pencil of rays, the general plane of the field being perpendicular to the axis of the cable and extended by several millimeters and inside which the variations of the energy density of the laser radiation do not exceed 30%.
  • This device is able to cut sheaths possibly having a thickness of several millimeters, irrespective of the diameter of the cable, to the extent that it is possible to have the cable rotate around an axis, possibly that of the cable, perpendicular to the plane of the thin blade delimiting the focussing beam and so that the entire thickness of the sheath runs off into the field, that is with this condition that, during one complete rotation around the axis of rotation, those portions of the sheath nearest to and most distant from the axis of rotation pass into the focussing field.
  • FIG. 1 is a diagram showing one embodiment of the method of the invention
  • FIG. 2 is a diagram illustrating the means for the positioning and movement of a cable to be stripped concerning the embodiment of FIG. 1,
  • FIG. 3 diagrammatically shows the focussing field inside the plane XOZ of the device of FIG. 1,
  • FIG. 4 is a curve illustrating the spatial distribution of the focussing spot of the beam of the device
  • FIG. 5 shows the theoretical degree of freedom of the cable to be stripped in the plane XOZ
  • FIG. 6 is a diagram showing the practical conditions of use of the stripping device.
  • FIG. 1 diagramatically shows at 1 a carbon dioxide laser source generating a beam 2 with parallel rays with radiant energy extending along a particular axis.
  • the laser may emit a wavelength of 10.6 micrometers, the ejected beam 2 being cylindrical and having a diameter of 4 mm.
  • the ejected beam 2 is enlarged with the aid of a divergent lens 3 with a focal length of -23 mm and then the enlarged beam 4 is rectified and rendered cylindrical with the aid of a convergent lens 5 with a focal length of +150 mm and finally the rectified beam 6 is flattened with the aid of a cylindrical lens 7 with a focal length of +100 mm along a thin pencil of rays 8 with a roughly rectangular section.
  • the cylindrical lens 7 is disposed with its flat face perpendicular to the incident beam 6 and the thin pencil of rays 8 is focussed inside the focussing field 9 of the optical system 3-5-7 according to a focussing spot 10 with the general shape of a rectangle and having one major axis of length L parallel to a generating line of the cylindrical lens 7, for example equal to 14 mm, and one small axis of width 1 equal, for example, to 0.2 mm.
  • the characteristics (dimensions and focal lengths) of the lens 3-5-7 are determined so as to form a thin pencil of rays 8 with a section measuring 14 mm ⁇ 0.2 mm whose dimensions have been deemed sufficient so as to deal with various diameters of the cable to be stripped which are likely to be encountered.
  • the lenses 3 and 5 are only necessary if the diameter of the ejected beam 2 of the laser source 1 is insufficient. If sufficient, the cylindrical lens 7 is placed directly in the beam ejected from the laser source and the thin pencil of rays 8 shall have a major axis L equal to the diameter of the ejected laser beam.
  • the conductor to be stripped 11 is, for example, placed with its axis 12 inside the focussing plane 9 and perpendicular to the major axis L of the focussing spot.
  • the major axis L, the axis Z and the axis of the cable 11 define an orthostandardized referential system XYZ, as shown on FIG. 2.
  • the cable 11 to be stripped is kept coaxial to the axis Y and in addition is driven in rotation around this axis.
  • FIG. 2 diagrammatically shows by the reference 13 means able to support the cable, for example, a conventional self-adaptable clamping nozzle, associated with means, such as an electric step motor, for driving the cable 11 around its axis.
  • means such as an electric step motor
  • These means 13 are mounted on a displacement system at XYZ (not shown) making it possible to have the axis of the cable 11 coincide with the axis Y of the referential system XYZ, the portion of the outer sheath of the cable to be removed being located inside the central portion of the beam 6.
  • This evaporation requires an energy quantity per large surface unit (energy density).
  • the method of the invention makes it possible to apply to the entire entire thickness of the sheath to be cut, whether the cable has a regular section or not, the energy required to remove, fuse or ablate the constitutive materials of the cable to be stripped in accordance with the invention.
  • FIG. 3 shows at 14 a zone situated inside the plane XOZ and centered at 0, the intersection of the axis Z of the beam 8 and the axis of the cable to be stripped.
  • the maximum power of the beam is available at 0 and the zone 14, known as the focussing field, corresponds to the points of the space where the energy locally provided by the beam does not undergo any significant variation.
  • the field 14 is characterized by a field depth along the axis Z which depends directly on the focal lengths of the optical elements 3, 5 and 7. This field depth symbolized at 15 in FIG. 3 may attain about 3 mm.
  • the field 14 also offers one degree of freedom along the axis X and symbolized at 16 and may attain 3 mm.
  • the field 14 has a certain thickness along the axis Y and corresponds to the width 1 of the beam 8.
  • the degree of freedom 16 corresponds to the central portion of the focussing spot 10.
  • the energy variation limit has been fixed at 30%.
  • the energy provided by the laser can result in a cutting that lacks quality.
  • FIG. 4 shows the spatial distribution of the focussing spot and the variations of the power of the beam 8 along the major axis L of the spot 10.
  • the method of the invention therefore consists of creating this focussing field 14 inside which the energy density does not vary by more than 30% and of having run off inside the field 14 the entire section of the cable to be stripped by driving the cable in rotation around the axis 0 at least by one full revolution by using the means 13.
  • the number of rotations and the speed of rotation controlling the exposure time of the coating to the beam 8 are determined according to the characteristics (materials and configuration) of the cable.
  • FIG. 5 shows the theoretical degree of freedom of the cable to be stripped in the plane XOZ for a stripping quality satisfying the criteria mentioned above.
  • This figure shows at 18 the beam 8 with the axis Z, the nominal position of the cable (cylindrical) at 11, and at 19 the halo surrounding the cable symbolizing the positional deviations able to be tolerated for the cable with respect to the center 0 along the axes X and Z.
  • the contour of the halo 19 has been determined by calculations indicating that a variation of ⁇ 1 mm only results in a reduction of 10% of the effective power of the laser beam and that a variation of ⁇ 2.5 mm (corresponding to the diameter of the cable 11 of FIG. 5) only results in a reduction of 30% of the effective power.
  • FIG. 5 demonstrates that the position of the cable inside the focal plane 9 is not critical, a variation of ⁇ 1.5 mm being acceptable with the optical mounting of FIG. 1.
  • the device of the invention is able to suitably be applied to cables with a circular or complex section and having a diameter of more than 3 mm, provided the cable is preferably made to pivot around its axis whilst keeping this axis of rotation parallel to the axis OY of the stripping device and at a certain distance from the latter so that the entire section of the sheath to be removed runs off into the focussing field 14 during one complete rotation.
  • the device such as the one shown in FIG. 1, could cut sheaths with a thickness possibly ranging up to about 3 mm.
  • the cable 20 includes one external sheath 21 with a constant thickness which covers, for example, a set of conductors 22 surrounded with a shielding.
  • the axis of rotation of the cable at the time the latter is stripped is indicated at 0' and is parallel to the axis OY.
  • This axis 0' defines a maximum radius R distanced from the sheath 21 and a minimum radius r close to the coating.
  • the two circles with the radii R and r delimit between them an annular area which, along with the area of the field 14, shall have one common portion extending from one circle to the other.
  • FIG. 6 shows the maximum thickness of the sheath 21 having regard to the particular profile where it is possible to clearly and cleanly cut the sheath with the stripping device of the invention, the field 14 being inscribed between the two circles with radii R and r.
  • the method of the invention is able to be used for the stripping of nearly all conductors currently existing on the market, namely, monofilar, bifilar, and trifilar conductors, whether they be twisted or shielded or not twisted or shielded, and with a profile possibly having a symmetry of revolution, as well as for the stripping of elementary wires.
  • the dimensions of the field 14 may of course, vary according to the power of the laser source 1 and the focal lengths of the optical system and in particular that of the cylindrical lens 7. The shorter the focal length of the lens 7 is, the less shall the field 14 be dilated in the direction OZ.
  • the presence of the cylindrical lens makes it possible to obtain a focussing field 14 with a depth (15) much larger than that of the fields of known laser cutting systems which are unable, as mentioned earlier, to cut clearly and cleanly in suitable conditions, without damaging the subjacent substrate, the sheaths of cables, not merely with sections having no symmetry of revolution but even with single cables a regular cirular section.
  • the method of the invention is applicable to the stripping of cables whose substrate subjacent to the external sheath is made of a material reflecting the laser radiation, as well as to the stripping of cables with the subjacent substrate made of a full or local non-reflecting material with regard to the radiation owing to the ablative or fusion energy of the laser radiation able to be concentrated on the thickness of the sheath to be removed, this energy being insufficient beyond the sheath so as to attack the subjacent film.
  • the invention is applicable to the window cutting on cables, that is to stripping outside the extremities.
  • the device of the invention may advantageously be automated, the stripping operations being reliable and able to be reproduced. It merely suffices to provide the device with a programmable microprocessor enabling various parameters relating to a given type of cable to be stripped to be introduced (nature, thickness, homogeneity of the sheath to be cut, surface of the focussing spot 10 on impact, speed of rotation of the cable and number of rotations, power of the emitted beam 8).
  • the method of the invention may generally be applied for cutting by ablation or the local fusion of a sheet, coating or similarly shaped element covering a substrate possibly able to reflect this radiation.
  • This material to be cut could be a sheet with a thickness of between several tens of millimeters and several millimeters and could be flat, concave, convex or have a complex shape.
  • the method of the invention makes it possible to cut this sheet with the aid of a device, such as the one formed by the laser source 7 and the optical system 3, 5,7 which would be moved above and at a specific distance from the surface of the sheet in the manner of a lancet, the general plane of the thin blade fictively delimited by the focussing field 14 being kept approximately perpendicular to the plane of the surface or to a generating line of the latter.
  • the invention is not merely limited to the embodiment described above, but covers all possible variants, especially as regards the structure of the optical system to the extent that the same enlarged focussing field effects are embodied, as illustrated in FIG. 3.
  • types of laser sources may also be used.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Removal Of Insulation Or Armoring From Wires Or Cables (AREA)
  • Laser Beam Processing (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
US07/917,326 1991-07-26 1992-07-23 Method and apparatus using a laser beam to deeply cut a material covering a substrate Expired - Fee Related US5321227A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9109834A FR2679477B1 (fr) 1991-07-26 1991-07-26 Procede de decoupe par faisceau laser d'un materiau recouvrant un substrat et dispositifs pour sa mise en óoeuvre.
FR9109834 1991-07-26

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EP (1) EP0526371A1 (fr)
JP (1) JPH05227627A (fr)
CA (1) CA2074635A1 (fr)
FR (1) FR2679477B1 (fr)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5744776A (en) * 1989-07-14 1998-04-28 Tip Engineering Group, Inc. Apparatus and for laser preweakening an automotive trim cover for an air bag deployment opening
US6285001B1 (en) 1995-04-26 2001-09-04 3M Innovative Properties Company Method and apparatus for step and repeat exposures
US20010029976A1 (en) * 1997-12-26 2001-10-18 Yoshifumi Takeyama Non-contact treatment method
US6355322B1 (en) 1998-12-08 2002-03-12 3M Innovative Properties Company Release liner incorporating a metal layer
US6374488B1 (en) * 1999-02-18 2002-04-23 Intermedics Inc. Method of laser stripping coated cables for endocardial defibrillation leads
US6653592B2 (en) * 2001-01-30 2003-11-25 Svein Andersen Appliance for the surface treatment of coated elements
US20050211025A1 (en) * 2002-05-27 2005-09-29 Roger Steuri Insulation stripping machine and method for stripping insulation from cables
US20050218126A1 (en) * 2002-06-19 2005-10-06 Frewitt Printing Sa Method and a device for depositing a wipe-proof and rub-proof marking onto transparent glass
US7061246B2 (en) 2001-12-06 2006-06-13 Johnson Controls Technology Company Battery monitoring system and method
US20170136575A1 (en) * 2014-07-03 2017-05-18 Nippon Steel & Sumitomo Metal Corporation Laser processing apparatus
US20170340518A1 (en) * 2016-05-31 2017-11-30 Corning Incorporated Anti-counterfeiting measures for glass articles

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0737435A (ja) * 1993-07-26 1995-02-07 Mitsubishi Electric Corp 絶縁電線
FR2740714B1 (fr) * 1995-11-02 1998-01-23 Heidelberg Harris Sa Dispositif de coupe de matiere

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3597579A (en) * 1970-06-25 1971-08-03 Western Electric Co Method of trimming capacitors
LU66978A1 (fr) * 1972-08-04 1973-04-19
US4356375A (en) * 1980-07-10 1982-10-26 Avery International Corporation Process for producing lines of weakness in the protective backing of an adhesive laminate
US4456812A (en) * 1982-07-30 1984-06-26 Armco Inc. Laser treatment of electrical steel
JPS6245487A (ja) * 1985-08-21 1987-02-27 Nec Corp レ−ザ捺印装置
EP0233091A1 (fr) * 1986-01-09 1987-08-19 Loic Rivoallan Dispositif de focalisation d'un faisceau de lumière et machine à souder les fibres optiques utilisant ce dispositif
US4861964A (en) * 1986-09-26 1989-08-29 Semiconductor Energy Laboratory Co., Ltd. Laser scribing system and method
GB2214360A (en) * 1988-01-25 1989-08-31 Mitsubishi Electric Corp Wire stripping using a laser
JPH01309794A (ja) * 1988-06-07 1989-12-14 Matsushita Electric Ind Co Ltd フィルムコンデンサーの製造方法
US4970366A (en) * 1988-03-27 1990-11-13 Semiconductor Energy Laboratory Co., Ltd. Laser patterning apparatus and method
US5103074A (en) * 1988-06-01 1992-04-07 Nippei Toyama Corporation Laser processing method and apparatus

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3597579A (en) * 1970-06-25 1971-08-03 Western Electric Co Method of trimming capacitors
LU66978A1 (fr) * 1972-08-04 1973-04-19
GB1440022A (en) * 1972-08-04 1976-06-23 Siemens Ag Methods of manufacturing electric resistance elements
US4356375A (en) * 1980-07-10 1982-10-26 Avery International Corporation Process for producing lines of weakness in the protective backing of an adhesive laminate
US4456812A (en) * 1982-07-30 1984-06-26 Armco Inc. Laser treatment of electrical steel
JPS6245487A (ja) * 1985-08-21 1987-02-27 Nec Corp レ−ザ捺印装置
EP0233091A1 (fr) * 1986-01-09 1987-08-19 Loic Rivoallan Dispositif de focalisation d'un faisceau de lumière et machine à souder les fibres optiques utilisant ce dispositif
US4802729A (en) * 1986-01-09 1989-02-07 Loic Rivoallan Device for focusing a light beam and machine for welding optical fibres using this device
US4861964A (en) * 1986-09-26 1989-08-29 Semiconductor Energy Laboratory Co., Ltd. Laser scribing system and method
US4865686A (en) * 1986-09-26 1989-09-12 Semiconductor Energy Laboratory Co., Ltd. Laser scribing method
GB2214360A (en) * 1988-01-25 1989-08-31 Mitsubishi Electric Corp Wire stripping using a laser
US4931616A (en) * 1988-01-25 1990-06-05 Mitsubishi Denki Kabushiki Kaisha Method for removing insulating coating of electric cable and apparatus therefor
US4970366A (en) * 1988-03-27 1990-11-13 Semiconductor Energy Laboratory Co., Ltd. Laser patterning apparatus and method
US5103074A (en) * 1988-06-01 1992-04-07 Nippei Toyama Corporation Laser processing method and apparatus
JPH01309794A (ja) * 1988-06-07 1989-12-14 Matsushita Electric Ind Co Ltd フィルムコンデンサーの製造方法

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
French Search Report and Annex. *
Patent Abstracts of Japan, vol. 14, No. 107 (M 942) (4050), Feb. 27, 1990. *
Patent Abstracts of Japan, vol. 14, No. 107 (M-942) (4050), Feb. 27, 1990.
William Iceland, Rockwell International Corp. "Laser Wire Stripping: Equipment and Operation Notes," Insulation/Circuits, Apr. 1980, pp. 47-50.
William Iceland, Rockwell International Corp. Laser Wire Stripping: Equipment and Operation Notes, Insulation/Circuits, Apr. 1980, pp. 47 50. *

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5744776A (en) * 1989-07-14 1998-04-28 Tip Engineering Group, Inc. Apparatus and for laser preweakening an automotive trim cover for an air bag deployment opening
US6285001B1 (en) 1995-04-26 2001-09-04 3M Innovative Properties Company Method and apparatus for step and repeat exposures
US20010029976A1 (en) * 1997-12-26 2001-10-18 Yoshifumi Takeyama Non-contact treatment method
US6984804B2 (en) * 1997-12-26 2006-01-10 Canon Kabushiki Kaisha Non-contact treatment method
US6355322B1 (en) 1998-12-08 2002-03-12 3M Innovative Properties Company Release liner incorporating a metal layer
US6374488B1 (en) * 1999-02-18 2002-04-23 Intermedics Inc. Method of laser stripping coated cables for endocardial defibrillation leads
US6401334B1 (en) 1999-02-18 2002-06-11 Intermedics Ind. Apparatus for laser stripping coated cables for endocardial defibrillation leads and method of manufacture of such leads
US6653592B2 (en) * 2001-01-30 2003-11-25 Svein Andersen Appliance for the surface treatment of coated elements
US7061246B2 (en) 2001-12-06 2006-06-13 Johnson Controls Technology Company Battery monitoring system and method
US20050211025A1 (en) * 2002-05-27 2005-09-29 Roger Steuri Insulation stripping machine and method for stripping insulation from cables
US20050218126A1 (en) * 2002-06-19 2005-10-06 Frewitt Printing Sa Method and a device for depositing a wipe-proof and rub-proof marking onto transparent glass
US7675001B2 (en) * 2002-06-19 2010-03-09 Frewitt Printing Sa Method and a device for depositing a wipe-proof and rub-proof marking onto transparent glass
US20170136575A1 (en) * 2014-07-03 2017-05-18 Nippon Steel & Sumitomo Metal Corporation Laser processing apparatus
US11498156B2 (en) * 2014-07-03 2022-11-15 Nippon Steel Corporation Laser processing apparatus
US20170340518A1 (en) * 2016-05-31 2017-11-30 Corning Incorporated Anti-counterfeiting measures for glass articles
US10676240B2 (en) * 2016-05-31 2020-06-09 Corning Incorporated Anti-counterfeiting measures for glass articles
US11667434B2 (en) 2016-05-31 2023-06-06 Corning Incorporated Anti-counterfeiting measures for glass articles
US11932445B2 (en) 2016-05-31 2024-03-19 Corning Incorporated Anti-counterfeiting measures for glass articles

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FR2679477B1 (fr) 1995-11-17
FR2679477A1 (fr) 1993-01-29
JPH05227627A (ja) 1993-09-03
EP0526371A1 (fr) 1993-02-03
CA2074635A1 (fr) 1993-01-27

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