US4684671A - Energy beam curable composition - Google Patents
Energy beam curable composition Download PDFInfo
- Publication number
- US4684671A US4684671A US06/855,310 US85531086A US4684671A US 4684671 A US4684671 A US 4684671A US 85531086 A US85531086 A US 85531086A US 4684671 A US4684671 A US 4684671A
- Authority
- US
- United States
- Prior art keywords
- group
- compound
- energy beam
- aliphatic
- represented
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000203 mixture Substances 0.000 title description 32
- -1 sulfonio group Chemical group 0.000 claims abstract description 24
- 125000001931 aliphatic group Chemical group 0.000 claims abstract description 17
- 239000000126 substance Substances 0.000 claims abstract description 10
- 239000002841 Lewis acid Substances 0.000 claims abstract description 9
- 150000007517 lewis acids Chemical class 0.000 claims abstract description 9
- 150000003839 salts Chemical class 0.000 claims abstract description 9
- 239000011342 resin composition Substances 0.000 claims abstract description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 5
- 125000005843 halogen group Chemical group 0.000 claims description 9
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 7
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 7
- 125000003545 alkoxy group Chemical group 0.000 claims description 6
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 claims description 6
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 claims description 6
- 229910052785 arsenic Inorganic materials 0.000 claims description 3
- 229910052796 boron Inorganic materials 0.000 claims description 3
- 239000000470 constituent Substances 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 101100386054 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) CYS3 gene Proteins 0.000 abstract 1
- 101150035983 str1 gene Proteins 0.000 abstract 1
- 238000000576 coating method Methods 0.000 description 21
- 239000011248 coating agent Substances 0.000 description 20
- 239000003822 epoxy resin Substances 0.000 description 20
- 229920000647 polyepoxide Polymers 0.000 description 20
- 150000001875 compounds Chemical class 0.000 description 15
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 11
- 238000009472 formulation Methods 0.000 description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 9
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 8
- 239000012954 diazonium Substances 0.000 description 7
- 125000001424 substituent group Chemical group 0.000 description 7
- 125000002947 alkylene group Chemical group 0.000 description 6
- 125000003118 aryl group Chemical group 0.000 description 6
- 229940125904 compound 1 Drugs 0.000 description 6
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 6
- 150000003384 small molecules Chemical class 0.000 description 6
- 125000002723 alicyclic group Chemical group 0.000 description 5
- 150000001989 diazonium salts Chemical class 0.000 description 5
- 239000003999 initiator Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- 229940125898 compound 5 Drugs 0.000 description 4
- 238000000354 decomposition reaction Methods 0.000 description 4
- 150000005846 sugar alcohols Polymers 0.000 description 4
- YXALYBMHAYZKAP-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000004844 aliphatic epoxy resin Substances 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 238000010538 cationic polymerization reaction Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- DOHVUQIYUWSVFX-UHFFFAOYSA-N 2-[4-[4-(2-hydroxyethoxy)phenyl]sulfanylphenoxy]ethanol Chemical compound C1=CC(OCCO)=CC=C1SC1=CC=C(OCCO)C=C1 DOHVUQIYUWSVFX-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-WFGJKAKNSA-N Dimethyl sulfoxide Chemical compound [2H]C([2H])([2H])S(=O)C([2H])([2H])[2H] IAZDPXIOMUYVGZ-WFGJKAKNSA-N 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- 125000006267 biphenyl group Chemical group 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 229940125782 compound 2 Drugs 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- LTYMSROWYAPPGB-UHFFFAOYSA-N diphenyl sulfide Chemical compound C=1C=CC=CC=1SC1=CC=CC=C1 LTYMSROWYAPPGB-UHFFFAOYSA-N 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 150000003077 polyols Chemical class 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- MFYSUUPKMDJYPF-UHFFFAOYSA-N 2-[(4-methyl-2-nitrophenyl)diazenyl]-3-oxo-n-phenylbutanamide Chemical compound C=1C=CC=CC=1NC(=O)C(C(=O)C)N=NC1=CC=C(C)C=C1[N+]([O-])=O MFYSUUPKMDJYPF-UHFFFAOYSA-N 0.000 description 1
- HPILSDOMLLYBQF-UHFFFAOYSA-N 2-[1-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical compound C1OC1COC(CCC)OCC1CO1 HPILSDOMLLYBQF-UHFFFAOYSA-N 0.000 description 1
- ZUSGBXODRRVFMS-UHFFFAOYSA-N 2-[4-[4-(2-hydroxyethoxy)phenyl]sulfinylphenoxy]ethanol Chemical compound C1=CC(OCCO)=CC=C1S(=O)C1=CC=C(OCCO)C=C1 ZUSGBXODRRVFMS-UHFFFAOYSA-N 0.000 description 1
- TWADJGWUKGOPFG-UHFFFAOYSA-N 2-methoxy-5-methyl-1,3-diphenylbenzene Chemical compound COC1=C(C=2C=CC=CC=2)C=C(C)C=C1C1=CC=CC=C1 TWADJGWUKGOPFG-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- GJEZBVHHZQAEDB-UHFFFAOYSA-N 6-oxabicyclo[3.1.0]hexane Chemical compound C1CCC2OC21 GJEZBVHHZQAEDB-UHFFFAOYSA-N 0.000 description 1
- 229910021630 Antimony pentafluoride Inorganic materials 0.000 description 1
- 241001120493 Arene Species 0.000 description 1
- 229910017048 AsF6 Inorganic materials 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 101150108015 STR6 gene Proteins 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- ZEEBGORNQSEQBE-UHFFFAOYSA-N [2-(3-phenylphenoxy)-6-(trifluoromethyl)pyridin-4-yl]methanamine Chemical compound C1(=CC(=CC=C1)OC1=NC(=CC(=C1)CN)C(F)(F)F)C1=CC=CC=C1 ZEEBGORNQSEQBE-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- VBVBHWZYQGJZLR-UHFFFAOYSA-I antimony pentafluoride Chemical compound F[Sb](F)(F)(F)F VBVBHWZYQGJZLR-UHFFFAOYSA-I 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229940126214 compound 3 Drugs 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 150000004292 cyclic ethers Chemical class 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- ZWAJLVLEBYIOTI-UHFFFAOYSA-N cyclohexene oxide Chemical compound C1CCCC2OC21 ZWAJLVLEBYIOTI-UHFFFAOYSA-N 0.000 description 1
- FWFSEYBSWVRWGL-UHFFFAOYSA-N cyclohexene oxide Natural products O=C1CCCC=C1 FWFSEYBSWVRWGL-UHFFFAOYSA-N 0.000 description 1
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000002433 cyclopentenyl group Chemical group C1(=CCCC1)* 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- LDLDYFCCDKENPD-UHFFFAOYSA-N ethenylcyclohexane Chemical compound C=CC1CCCCC1 LDLDYFCCDKENPD-UHFFFAOYSA-N 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000004817 gas chromatography Methods 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- GBMDVOWEEQVZKZ-UHFFFAOYSA-N methanol;hydrate Chemical compound O.OC GBMDVOWEEQVZKZ-UHFFFAOYSA-N 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 230000009965 odorless effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- AICOOMRHRUFYCM-ZRRPKQBOSA-N oxazine, 1 Chemical compound C([C@@H]1[C@H](C(C[C@]2(C)[C@@H]([C@H](C)N(C)C)[C@H](O)C[C@]21C)=O)CC1=CC2)C[C@H]1[C@@]1(C)[C@H]2N=C(C(C)C)OC1 AICOOMRHRUFYCM-ZRRPKQBOSA-N 0.000 description 1
- 150000002921 oxetanes Chemical class 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- HDBWAWNLGGMZRQ-UHFFFAOYSA-N p-Vinylbiphenyl Chemical group C1=CC(C=C)=CC=C1C1=CC=CC=C1 HDBWAWNLGGMZRQ-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 150000004965 peroxy acids Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000001782 photodegradation Methods 0.000 description 1
- 238000006303 photolysis reaction Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000010898 silica gel chromatography Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 150000003462 sulfoxides Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 229940124543 ultraviolet light absorber Drugs 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G85/00—General processes for preparing compounds provided for in this subclass
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/687—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing sulfur
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
- Y10S430/122—Sulfur compound containing
Definitions
- the present invention relates to a composition capable of curing upon irradiation with an energy beam. More particularly, it relates to a resin composition which, when used as a coating material, readily cures and affords a cured coating film which gives off very little odor and bleeds very little decomposition products induced by irradiation.
- the composition containing an aromatic onium salt mentioned above is inferior in curability to the one containing a diazonium salt.
- the aromatic onium salt is an aromatic sulfonium salt
- the composition containing it gives off an ill-smelling low-molecular weight compound when irradiated with an energy beam, with the result that the coating film has a foul smell.
- a high-molecular weight aromatic sulfonium salt having a specific group in Japanese Patent Laid-open No. 55420/1981. However, it still is not satisfactory although it eliminates the disadvantage to some extent. Upon irradiation, it forms a low-molecular weight compound such as bisphenyl sulfide, which remains in the coating film, causing the film to smell.
- R 1 -R 10 are each a hydrogen atom, halogen atom, nitro group, alkoxy group, C 1 -C 18 aliphatic group, or C 6 -C 18 substituted or unsubstituted phenyl, phenoxy, or thiophenoxy group, with at least one of R 1 -R 10 being (A) a C 1 -C 18 aliphatic group having at least one hydroxyl group or (B) a C 3 -C 19 aliphatic group having a group of --OCH 2 CH 2 O--.);
- Z is a group represented by the formula MQ l (III) or the formula MQ l-1 OH (IV). (where M denotes B, P, As, or Sb; Q denotes a halogen atom; and l is an integer of 4 to 6.)]
- a cationically polymerizable substance to use in the invention includes epoxy resins, vinyl ethers, cyclic ethers and ketones, lactones, oxetanes, styrenes, acroleins, vinyl arenes (e.g., 4-vinylbiphenyl), alicyclic vinyl compounds (e.g., vinylcyclohexane), spiro-orthoesters, spiro-orthocarbonates, bicyclo-orthoesters, isobutylene, dienes (e.g., butadiene and isoprene), and phenol-formaldehyde resins. They are in the form of monomer or prepolymer. Preferable among them is epoxy resins.
- the epoxy resins used in this invention are known aromatic epoxy resins, alicyclic epoxy resins, and aliphatic epoxy resins.
- Preferred aromatic epoxy resins are a polyglycidyl ether derived from polyhydric phenol having at least one aromatic nucleus or alkylene oxide adduct thereof.
- Their examples include glycidyl ether resins produced by the reaction between bisphenol A or alkylene oxide adduct thereof and epichlorohydrin, and they also include epoxy-novolac resins.
- aromatic epoxy resins may be used individually as the cationically polymerizable substance in the the curable composition of this invention. However, they may be properly combined with one another according to the desired performance.
- the onium salt of a Lewis acid which is the other essential constituent in this invention, is represented by the following formula. ##STR5## [where X is a sulfonio group represented by the following formula (II)]. ##STR6## R 1 -R 10 are independently selected from various kinds of groups excluding basic groups such as amino groups.
- they are a hydrogen atom, halogen atom (e.g., F, Cl, Br, and I), nitro group, alkoxy group (e.g., CH 3 O-- and C 2 H 5 O--), C 1 -C 18 aliphatic group (e.g., hydrocarbon group such as CH 3 --, C 2 H 5 --, and (CH 3 ) 2 CH--; cyclic hydrocarbon group such as cyclohexyl group; and those which contain a hetero atom in the main chain or substituent group (e.g., ##STR7## --S--CH 3 , --O--CH 2 --CH 2 --OH, --O--CH 2 Ph, and or substituted or unsubstituted phenyl group, phenoxy group, or thiophenoxy group.
- halogen atom e.g., F, Cl, Br, and I
- alkoxy group e.g., CH 3 O-- and C 2 H 5 O--
- At least one of R 1 -R 10 is (A) a C 1 -C 18 aliphatic group having at least one hydroxyl group or (B) a C 3 -C 19 aliphatic group having a group of --OCH 2 CH 2 O--.
- the substituent group belonging to (A) includes monoalcohol and polyalcohol represented by, for example, --CH 2 OH, --CH 2 CH 2 OH, --O--CH 2 --CH 2 --CH 2 --CH 2 --OH, --SCH 2 CH 2 OH, ##STR8##
- substituent groups belonging to (B) include --CH 2 O--CH 2 --CH 2 --O--CH 3 , ##STR9## --O--CH 2 CH 2 -- 2 OH, --O--CH 2 CH 2 -- 2 OCH 3 , and --OCH 2 CH 2 -- 3 OH.
- R 1 to R 10 may be any of the substituent groups defined by (A) and (B). Where eight or nine of R 1 to R 10 are hydrogen atoms, R 3 and/or R 8 should be the substituent groups defined by (A) and (B), for the ease of synthesis.
- Y in the above formula (I) is a group represented by the formula (II), or a hydrogen atom, halogen atom, nitro group, alkoxy group, C 1 -C 18 aliphatic group, C 6 -C 18 substituted or unsubstituted phenyl group, phenoxy group, or thiophenoxy group (which are all defined as above).
- n is an integer of 1 to 3
- m is an integer of 1 to 2.
- Y is a sulfonio group represented by the formula (II)
- m is 2.
- Z is a group represented by the formula MQ l (III) or the formula MQ l-1 OH (IV).
- M denotes B, P, As, or Sb
- Q denotes a halogen atom (preferably Cl or F); and
- l is an integer of 4 to 6.
- Examples of Z include BF 4 , PF 6 , AsF 6 , SbF 6 , and SbF 5 OH.
- the onium salt of a Lewis acid used in this invention may be synthesized by (i) the reaction to form a sulfonium salt from a starting material having the desired substituent group, or by (ii) synthesizing an adequate substituted or unsubstituted group sulfonium salt and subsequently converting or introducing the substituent group.
- the curable composition of this invention is composed essentially of 100 wt. parts of a cationically polymerizable substance and 0.1 to 15 parts by weight, preferably 0.4 to 8 parts by weight, of the onium salt of Lewis acid represented by the formula (I).
- the adequate ratio is determined according to the type and dosage of energy beam and other many factors such as desired cure time, temperature, humidity, and coating thickness.
- the curable composition of this invention is a liquid having a viscosity of 1 to 100,000 centipoise at 25° C. or a solid soluble in a solvent. Upon irradiation of energy beam such as ultraviolet light, it becomes dry to touch or solvent-insoluble within a tenth of minute to several minutes.
- energy beam such as ultraviolet light
- the energy beam is not specifically limited so long as it has sufficient energy to induce the decomposition of an initiator.
- the preferred energy beam is an electromagnetic wave energy beam having a wavelength of 2000 ⁇ to 7000 ⁇ produced by a high- or low-pressure mercury-vapor lamp, xenon lamp, bacteriocidal lamp, and laser; electron beam and X rays.
- composition of this invention may be incorporated with a solvent for dilution and an inert resin or prepolymer for modification, so long as they do not adversely affect the cationic polymerization.
- the composition may be incorporated with an organic carboxylic acid or acid anhydride for the improvement of electrical properties, or blended with a polyol or flexible prepolymer to impart rubbery resilience.
- composition of this invention is usually a transparent liquid; and it may be incorporated with an inert pigment, dye, filler, antistatic agent, flame retardant, gelation inhibitor, flow regulator, surface active agent, adhesion improver, processing aid, viscosity adjustor, sensitizer, ultraviolet light absorber, and the like, according to the intended use.
- the amount of these additives depends on the performance required and the curing characteristics.
- composition of this invention can be applied to metal, wood, rubber, plastics, glass, and ceramics.
- composition of this invention cures in a short time upon irradiation with an energy beam, and it passes into a cured product having good physical properties, forming very little amount of low molecular weight compound that causes an offensive odor and adversely affects the properties of the coating film.
- Triphenylsulofonium-hexafluorophosphate compound 3
- diphenyl-4-thiophenoxyphenylsulfonium-hexafluorophosphate compound 4
- bis[4-(diphenylsulfonio)phenyl]sulfide-bishexafluorophosphate compound 5
- the above-mentioned five compounds were examined for photodegradation in the following manner. Each compound was dissolved in a methanol-water mixture (1:9) to give a 2000 ppm solution. The solution was exposed to ultraviolet light emitted by four fluorescent lamps FL6E (6 W) (made by Sankyo Denki Co., Ltd.) placed 10 cm away, for 30 minutes. The low-molecular weight compounds formed by exposure were identified by gas chromatography. The column was Tenax GC (1 m), and the temperature was raised from 150° C. to 270° C. at a rate of 15° C./min. The results are shown in Table 1.
- the decomposition products of Compound 1 were identified as bis(p-2-hydroxyethoxyphenyl)sulfide (about 20%) and bis(p-2-hydroxyethoxyphenyl)sulfoxide (about 5%). These compounds are all odorless solids.
- the resulting mixture was applied to an aluminum test panel (in coating thickness of 10 ⁇ m), and the coating was irradiated with a high-pressure mercury-vapor lamp, whereby a cured coating was obtained.
- the coating film was examined for elusion according to the method stipulated in the Food Sanitation Law (Notification No. 20 of the Ministry of Public Welfare, February 1982). The amount of residues on evaporation was measured. The results are shown in Table 2.
- ERL-4221 alicyclic epoxy resin, made by Union Carbide Corp.
- ERL-4221 alicyclic epoxy resin, made by Union Carbide Corp.
- the resulting solution was applied to an aluminum test panel (in coating thickness of 5 ⁇ m), and the coating film was irradiated with a high-pressure mercury-vapor lamp (80 W/cm) placed 10 cm away.
- the tack-free time time for the coating film to dry to touch was measured.
- Table 3 The results are shown in Table 3.
- the compositions were good in storage stability, with no increase in viscosity after storage at 40° C. for 3 months.
- epoxy resin formulations 1 and 2 were prepared.
- Formulation 1 80 parts of ERL-4221 and 20 parts of DY-022
- Formulation 2 20 parts of ERL-4221, 60 parts of Ep-4100 (bisphenol A epoxy resin, made by Asahi Denka Co., Ltd.), and 20 parts of DY-022.
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- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Inorganic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
- Polymerization Catalysts (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60012241A JPS61190524A (ja) | 1985-01-25 | 1985-01-25 | エネルギ−線硬化性組成物 |
Publications (1)
Publication Number | Publication Date |
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US4684671A true US4684671A (en) | 1987-08-04 |
Family
ID=11799872
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US06/855,310 Expired - Lifetime US4684671A (en) | 1985-01-25 | 1986-03-18 | Energy beam curable composition |
Country Status (4)
Country | Link |
---|---|
US (1) | US4684671A (enrdf_load_stackoverflow) |
EP (1) | EP0240582B1 (enrdf_load_stackoverflow) |
JP (1) | JPS61190524A (enrdf_load_stackoverflow) |
WO (1) | WO1993013139A1 (enrdf_load_stackoverflow) |
Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4931337A (en) * | 1987-02-12 | 1990-06-05 | Canon Kabushiki Kaisha | Information recording medium |
US4940651A (en) * | 1988-12-30 | 1990-07-10 | International Business Machines Corporation | Method for patterning cationic curable photoresist |
US4954416A (en) * | 1988-12-21 | 1990-09-04 | Minnesota Mining And Manufacturing Company | Tethered sulfonium salt photoinitiators for free radical polymerization |
US5026624A (en) * | 1989-03-03 | 1991-06-25 | International Business Machines Corporation | Composition for photo imaging |
US5047568A (en) * | 1988-11-18 | 1991-09-10 | International Business Machines Corporation | Sulfonium salts and use and preparation thereof |
US5061605A (en) * | 1990-04-17 | 1991-10-29 | Fuji Photo Film Co., Ltd. | Photopolymerizable composition containing photoinitiators having at least two sulfur atoms |
US5158989A (en) * | 1989-11-18 | 1992-10-27 | Somar Corporation | Electroless plating-resisting ink composition |
US5166125A (en) * | 1992-02-19 | 1992-11-24 | Eastman Kodak Company | Method of forming color filter array element with patternable overcoat layer |
US5166126A (en) * | 1992-02-19 | 1992-11-24 | Eastman Kodak Company | Color filter array element with protective overcoat layer and method of forming same |
US5264325A (en) * | 1988-12-30 | 1993-11-23 | International Business Machines Corporation | Composition for photo imaging |
US5278010A (en) * | 1989-03-03 | 1994-01-11 | International Business Machines Corporation | Composition for photo imaging |
US5304457A (en) * | 1989-03-03 | 1994-04-19 | International Business Machines Corporation | Composition for photo imaging |
US5439779A (en) * | 1993-02-22 | 1995-08-08 | International Business Machines Corporation | Aqueous soldermask |
US5439766A (en) * | 1988-12-30 | 1995-08-08 | International Business Machines Corporation | Composition for photo imaging |
US5502083A (en) * | 1993-06-18 | 1996-03-26 | Nippon Kayaku Kabushiki Kaisha | Onium salt, photopolymerization initiator, energy ray-curing composition containing the initiator, and cured product |
US5550171A (en) * | 1995-05-31 | 1996-08-27 | International Business Machines Corporation | Polymeric sulfonium salt photoinitiators |
US5747223A (en) * | 1988-12-30 | 1998-05-05 | International Business Machines Corporation | Composition for photoimaging |
US5877229A (en) * | 1995-07-26 | 1999-03-02 | Lockheed Martin Energy Systems, Inc. | High energy electron beam curing of epoxy resin systems incorporating cationic photoinitiators |
US6051370A (en) * | 1990-03-13 | 2000-04-18 | Basf Aktiengesellschaft | Radiation-sensitive mixture |
US6180317B1 (en) | 1988-12-30 | 2001-01-30 | International Business Machines Corporation | Composition for photoimaging |
US20040242901A1 (en) * | 2001-07-19 | 2004-12-02 | Gabriele Norcini | Sulfoniun salts, methods for their preparation and use thereof as phtoinitiators for radiation curable systems |
US20050148679A1 (en) * | 2003-12-29 | 2005-07-07 | Chingfan Chiu | Aryl sulfonium salt, polymerizable composition and polymerization method of the same |
US20110300482A1 (en) * | 2009-02-20 | 2011-12-08 | San-Apro, Ltd | Sulfonium salt, photo-acid generator, and photosensitive resin composition |
US20160238767A1 (en) * | 2013-09-30 | 2016-08-18 | Lg Chem, Ltd. | Polarizing plate, method for manufacturing same, and image display device comprising same |
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JPH08239623A (ja) * | 1995-02-28 | 1996-09-17 | Toagosei Co Ltd | 木材用活性エネルギー線硬化型塗料組成物 |
JP2019137727A (ja) * | 2018-02-06 | 2019-08-22 | 株式会社Adeka | コーティング組成物 |
KR102792755B1 (ko) | 2020-08-05 | 2025-04-07 | 산아프로 가부시키가이샤 | 광산 발생제 |
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- 1985-01-25 JP JP60012241A patent/JPS61190524A/ja active Granted
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- 1986-03-18 US US06/855,310 patent/US4684671A/en not_active Expired - Lifetime
- 1986-04-07 EP EP86104743A patent/EP0240582B1/en not_active Expired
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Cited By (29)
Publication number | Priority date | Publication date | Assignee | Title |
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US4931337A (en) * | 1987-02-12 | 1990-06-05 | Canon Kabushiki Kaisha | Information recording medium |
US5047568A (en) * | 1988-11-18 | 1991-09-10 | International Business Machines Corporation | Sulfonium salts and use and preparation thereof |
US4954416A (en) * | 1988-12-21 | 1990-09-04 | Minnesota Mining And Manufacturing Company | Tethered sulfonium salt photoinitiators for free radical polymerization |
US6180317B1 (en) | 1988-12-30 | 2001-01-30 | International Business Machines Corporation | Composition for photoimaging |
US4940651A (en) * | 1988-12-30 | 1990-07-10 | International Business Machines Corporation | Method for patterning cationic curable photoresist |
US5747223A (en) * | 1988-12-30 | 1998-05-05 | International Business Machines Corporation | Composition for photoimaging |
US5439766A (en) * | 1988-12-30 | 1995-08-08 | International Business Machines Corporation | Composition for photo imaging |
US5264325A (en) * | 1988-12-30 | 1993-11-23 | International Business Machines Corporation | Composition for photo imaging |
US5026624A (en) * | 1989-03-03 | 1991-06-25 | International Business Machines Corporation | Composition for photo imaging |
US5278010A (en) * | 1989-03-03 | 1994-01-11 | International Business Machines Corporation | Composition for photo imaging |
US5304457A (en) * | 1989-03-03 | 1994-04-19 | International Business Machines Corporation | Composition for photo imaging |
US5158989A (en) * | 1989-11-18 | 1992-10-27 | Somar Corporation | Electroless plating-resisting ink composition |
US6051370A (en) * | 1990-03-13 | 2000-04-18 | Basf Aktiengesellschaft | Radiation-sensitive mixture |
US5061605A (en) * | 1990-04-17 | 1991-10-29 | Fuji Photo Film Co., Ltd. | Photopolymerizable composition containing photoinitiators having at least two sulfur atoms |
US5166125A (en) * | 1992-02-19 | 1992-11-24 | Eastman Kodak Company | Method of forming color filter array element with patternable overcoat layer |
US5166126A (en) * | 1992-02-19 | 1992-11-24 | Eastman Kodak Company | Color filter array element with protective overcoat layer and method of forming same |
US5439779A (en) * | 1993-02-22 | 1995-08-08 | International Business Machines Corporation | Aqueous soldermask |
US5502083A (en) * | 1993-06-18 | 1996-03-26 | Nippon Kayaku Kabushiki Kaisha | Onium salt, photopolymerization initiator, energy ray-curing composition containing the initiator, and cured product |
US5534557A (en) * | 1993-06-18 | 1996-07-09 | Nippon Kayaku Kabushiki Kaisha | Onium salt, photopolymerization initiator, energy ray-curing composition containing the initiator, and cured product |
US5629355A (en) * | 1995-05-31 | 1997-05-13 | International Business Machines Corporation | Polymeric sulfonium salt photoinitiators |
US5550171A (en) * | 1995-05-31 | 1996-08-27 | International Business Machines Corporation | Polymeric sulfonium salt photoinitiators |
US5877229A (en) * | 1995-07-26 | 1999-03-02 | Lockheed Martin Energy Systems, Inc. | High energy electron beam curing of epoxy resin systems incorporating cationic photoinitiators |
US20040242901A1 (en) * | 2001-07-19 | 2004-12-02 | Gabriele Norcini | Sulfoniun salts, methods for their preparation and use thereof as phtoinitiators for radiation curable systems |
US7230121B2 (en) | 2001-07-19 | 2007-06-12 | Lamberti Spa | Sulfoniun salts, methods for their preparation and use thereof as photoinitiators for radiation curable systems |
US20050148679A1 (en) * | 2003-12-29 | 2005-07-07 | Chingfan Chiu | Aryl sulfonium salt, polymerizable composition and polymerization method of the same |
US20110300482A1 (en) * | 2009-02-20 | 2011-12-08 | San-Apro, Ltd | Sulfonium salt, photo-acid generator, and photosensitive resin composition |
US8617787B2 (en) * | 2009-02-20 | 2013-12-31 | San-Apro, Ltd. | Sulfonium salt, photo-acid generator, and photosensitive resin composition |
US20160238767A1 (en) * | 2013-09-30 | 2016-08-18 | Lg Chem, Ltd. | Polarizing plate, method for manufacturing same, and image display device comprising same |
US10132976B2 (en) * | 2013-09-30 | 2018-11-20 | Lg Chem, Ltd. | Polarizing plate, method for manufacturing same, and image display device comprising same |
Also Published As
Publication number | Publication date |
---|---|
JPH0456850B2 (enrdf_load_stackoverflow) | 1992-09-09 |
EP0240582A1 (en) | 1987-10-14 |
EP0240582B1 (en) | 1990-07-04 |
WO1993013139A1 (en) | 1993-07-08 |
JPS61190524A (ja) | 1986-08-25 |
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