Classifications

• • H—ELECTRICITY
  • H04—ELECTRIC COMMUNICATION TECHNIQUE
  • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
  • H04R7/00—Diaphragms for electromechanical transducers; Cones
  • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
  • C23C14/0005—Separation of the coating from the substrate

Definitions

• a diaphragm used with a loudspeaker, particularly a high-pitched sound loudspeaker is desired to consist of such material as has a large Youngs modulus of elasticity and a small mass.
• a prior art alloy mainly consisting of aluminum or titanium which has hitherto been used to this end has a small Youngs'modulus of elasticity E and a high density (Al:E 7.05 X 10 N/m and p 2.7X l kg/m and Ti:E 11.9 X N/m and p 4.54 X 10 kg/m failing to meet the above-mentioned requirements.
• beryllium'(Be) or an alloy thereof is adapted for the abovementioned application.
• beryllium is conveniently provided with properties meeting the aforesaid requisites because of E 30.8 X 10 N/m and p 1.85 X 10 kg/m.
• a sheet of beryllium or an alloy thereof has also been found suitable for various applications including not only a loudspeaker diaphragm, but also, for example, a tone arm cantilever by being rolled up into a cylindrical form.
• the latter process has the drawbacks that rolled thickness is difficult to control and the work piece of beryllium has to be rolled in a state wrapped in a thin sheet of stainless steel in order to save beryllium from oxidation. Further disadvantage of said process is that the pressing or drawing step should be carried out inconveniently at high temperature to prevent the cracking of beryllium.
• the above object of this invention is attained by preparing a substrate bearing a prescribed shape, depositing a thin sheet of beryllium or an alloy thereof on the substrate in vacuum, and finally separating the deposited thin sheet from the substrate.
• the method of the invention is entirely different from the conventional concept of machining a lump of beryllium into a desired form, namely, utilizes the deposition of fine particles of raw beryllium in vacuum. Accordingly, the present method enables a good quality thin sheet of beryllium or an alloy thereof to be easily manufactured with a uniform thickness in a desired shape, and very efficiently utilizes raw beryllium. because little waste arises during manufacture.
• a substrate is prepared to match the desired shape of an article to be produced, for example, a loudspeaker diaphragm.
• the substrate consists of such material as has different chemical or physical properties from those of beryllium or an alloy thereof to facilitate the later described separating step.
• a first type of substrate is made of material easily soluble in nitric acid, preferably copper or magnesium.
• a second type of substrate is prepared from material having a very low thermal expansion coefficient, preferably quartz glass.
• a third type of substrate is formed of metal, particularly a fusible alloy having a lower melting point than beryllium or an alloy thereof. Copper and magnesium can be easily pressed into a desired form and the fusible alloy can also be readily forged into a proper shape.
• the quartz glass is worked by ultrasonic wave machining.
• a source of vacuum evaporation is, for example, beryllium itself or a beryllium alloy such as Be-Cu alloy (Cu 0.5 to 5.0%), Be-Al alloy (Al 20 to 40%) or Be-Ti alloy (Ti 0.5 to 5.0%) which has already been melted, for example, by high frequency induction heating in vacuum.
• the source of vacuum evaporation is melted again by electron beams in the vacuum evaporator in order to prevent the oxidation of beryllium or an alloy thereof.
• the degree of vacuum is chosen to be 6 X 10 to 2 X 10' Torr, and the substrate is heated to such a temperature as facilitates the deposition of a thin sheet of beryllium or an alloy thereof, for example, 350 to 650C when the substrate consists of copper, 350 to 400C when the substrate is formed of magnesium and 350 to 700C or preferably 600C when the substrate is prepared from quartz glass.
• the substrate is made of a fusiblealloy, the substrate is heated to a lower temperature than the melting point of the alloy.
• the degree of vacuum is set at 10 to 10 Torr.
• the atmosphere in which this plating is carried out may consist of inert gas, such as argon.
• the substrate is heated to a temperature ranging between the atmospheric and 200C, regardless of the kind of raw material of which the substrate is formed.
• High DC. voltage is impressed across the substrate (negative electrode) and the source of evaporation for the growth of glow discharge.
• a separate electrode is placed just behind the substrate with respect to the source of evaporation.
• Other conditions than described above under which a thin sheet of beryllium or an alloy thereof is deposited on the substrate may be defined according to the customary practice of vacuum evaporation or ion plating.
• the deposition step included in the method of this invention causes fine particles of beryllium or an alloy thereof to settle on'the substrate at the rate at which a compact, uniform layer is deposited on the substrate with a thickness of 1.5 microns per minute.
• a thin sheet thus formed has a thickness of 25 to 35 microns for use with a tweeter type loudspeaker and a thickness of 50 to 80 microns for use with a squawker type loudspeaker.
• Beryllium or an alloy thereof does not substantially react with nitric acid, whereas copper or magnesium is readily dissolved in the acid.
• a copper or magnesium substrate coated with a thin sheet of beryllium or an alloy thereof is dipped in an aqueous solution of nitric acid, the substrate dissolves itself, leaving said thin sheet.
• the substrate consists of quartz glass, a thin sheet of beryllium or an alloy thereof is removed therefrom due to the different thermal expansion coefficients between beryllium and quartz glass.
• beryllium has a relatively large thermal expansion coefficient of 12.3 X deg, while quartz glass has as small a thermal expansion coefficient as 5.5 to 5.8 X 10 deg.
• quartz glass substrate bearing a thin sheet of beryllium or an alloy thereof is heated to a temperature ranging between 500 and l200C, the thin sheet very easily comes off the quartz glass substrate ln this case, the
• quartz glass substrate has the advantageof being repeatedly used.
• the substrate isformed of a fusible alloy, at thin-sheet of beryllium or alloy thereof is removed from the substrate due to different melting points between beryllium and the fusible alloy (beryl- EXAMPLE 2
• a substrate was formed over 96% pure magnesium in the same manner as in Example 1. In this case, annealing was carried out at 200C.
• the magnesium substrate thus prepared was placed in an ion plating device evacuated to an extent of 5 X 10 Torr. Also placed in the ion plating device was an already melted berylliumaluminum alloy (A1 30%) in a state received in a crucible at a point 15 cm apart from the substrate.
• EXAMPLE 3 A piece of transparent quartz glass was machined by ultrasonic waves into a prescribed form, followed by the grinding of the machined surface of the glass The substrate thus prepared was washed in the same mannet as in Example l.- A beryllium-copper alloy (Cu 7 sheet of beryllium-copper alloy about 30 microns thick wasdeposited on the substrate in about 20 minutes. when heated to 650C, the
• lium has a melting point of l'28-5C and the fusiblealloy generally has a lower melting point'than"230 C).
• Athin sheet-of beryllium or an alloy thereof removed from the substrate maybe subjected to aging or sintering at a temperature of 200 to 1200C, or preferably 800C. Where, however; the thin sheet has a considerably small thickness, this heating should advisably be avoided to prevent the deformation of the thin sheet.
• a thin thin sheet peeled off the i -l .'A method for manufacturing a thin sheet of metal selected from a group consisting'of beryllium and beryllium alloy which comprises the steps of fabricating a substrate of a' predetermined shape .made' of material selected from a group consisting of-copper and ma gne-- siumfdepositing the thin sheet of said metal on said substrate, and removing the thin sheet from the. substrate by dissolving the latter in nitric acid.
• nitric acid is employed in the form of an aqueous solution consisting of one part of water and three parts of 60% nitric acid.
• nitric acid is employed in the form of an aqueous solution consisting of one part of water and three parts of 60% nitric acid.
• a method for manufacturing a thin sheet of metal selected from the group consisting of beryllium and beryllium alloy which comprises the steps of fabricating a substrate of quartz glass into a prescribed form, depositing a thin sheet of the metal on the substrate, and heating the combination to separate the thin sheet from the substrate due to different thermal expansion coefficients between the metal and the quartz glass.

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• Chemical & Material Sciences (AREA)
• Engineering & Computer Science (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Acoustics & Sound (AREA)
• Signal Processing (AREA)
• Physics & Mathematics (AREA)
• Multimedia (AREA)
• Materials Engineering (AREA)
• Mechanical Engineering (AREA)
• Metallurgy (AREA)
• Organic Chemistry (AREA)
• Physical Vapour Deposition (AREA)
• Diaphragms For Electromechanical Transducers (AREA)

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Cited By (6)

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Citations (3)

• 1973
  • 1973-11-13 US US415417A patent/US3895671A/en not_active Expired - Lifetime
  • 1973-11-14 NL NL7315559A patent/NL7315559A/xx not_active Application Discontinuation
  • 1973-11-14 DE DE2357425A patent/DE2357425B2/de not_active Ceased

Patent Citations (3)

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