US3786660A - Wafer interlocking transport system - Google Patents

Wafer interlocking transport system Download PDF

Info

Publication number
US3786660A
US3786660A US00309408A US3786660DA US3786660A US 3786660 A US3786660 A US 3786660A US 00309408 A US00309408 A US 00309408A US 3786660D A US3786660D A US 3786660DA US 3786660 A US3786660 A US 3786660A
Authority
US
United States
Prior art keywords
collet
wafer
pedestals
pallet
accordance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US00309408A
Other languages
English (en)
Inventor
H Appenzeller
J Miller
V Shea
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of US3786660A publication Critical patent/US3786660A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D43/00Feeding, positioning or storing devices combined with, or arranged in, or specially adapted for use in connection with, apparatus for working or processing sheet metal, metal tubes or metal profiles; Associations therewith of cutting devices
    • B21D43/003Positioning devices

Definitions

  • Still another object of the present invention is to provide a novel wafer pallet which permits proper gripping and holding of the wafer, manipulation of the wafer to achieve a desired wafer contour in a wafer contouring machine, and removal of the pallet without effecting the contoured shape of the wafer.
  • FIG. 2 is a fragmentary sectional view taken along line-22 of FIG. 1;
  • FIG. 3 is a fragmentary view in side elevation of the apparatus illustrated in FIG. 2;
  • FIG. 4 is a fragmentary sectional view illustrating an alternate embodiment of the means for locking a pedestal.
  • apparatus 10 for contouring a surface of a thin element such as a semiconductor wafer II is illustrated therein.
  • wafer is meant a thin element of any geometrical configuration having a surface which is to be contoured.
  • Each of the manipulating means to which the comparing means 14 is connected comprises actuator means I6 which includes a stepping motor USA, a step down gear 168 and screw 16C which effects reciprocation of a cam for elevating and retracting a biased post 16E.
  • actuator means I6 which includes a stepping motor USA, a step down gear 168 and screw 16C which effects reciprocation of a cam for elevating and retracting a biased post 16E.
  • each of the comparing means 14 is connected to an individual actuator means 16 for elevating and retracting individual wafer retaining means when the comparing means 14 indicates a difference between the desired contour and the actual contour of the wafer surface 11B.
  • each of the pedestals 22 includes a collet 37 which circumscribes the pedestal and includes a plurality of axially extending slots 38 in the wall thereof.
  • An enlarged cylindrical base portion 39 which fits into a recess 40, in the body of the pallet 20, against which the biasing spring 30 presses, restrains axial movement of the collet.
  • the section of the collet 37 having the slots therein is preferably relatively long and thin relative to the base portion 39 so as to permit the collet to act like the jaws of a chuck when radial pressure is exerted thereon.
  • the collets 38 are fabricated of a relatively thin material and are dimensioned so to closely fit the exterior of the pedestal to permit sliding or axial reciprocation of the pedestal relative to the collets without excessive binding or excessive friction.
  • fluid pressure is applied to the manifold 45 as through the hose 46 causing expansion of the tubing 44 and 44A causing the tubing to expand in the radial direction effecting a collapsing or camming of the walls of the collet by radial against the pedestal tending to lock the pedestal in position.
  • a wafer contouring machine including a frame, said machine having sensing means for sensing the upper surface of a wafer, and manipulating means for adjusting the lower surface of said wafer in accordance with the topography sensed; a removable pallet having a plurality of individually reciprocatable pedestals therein, said pedestals including gripping means at one end thereof to grip said lower surface of a wafer, means on said pedestals to engage said manipulating means; clamp means for releasably coupling said pallet to the frame of said machine, and means for locking said pedestals in said pallet whereby said pallet may be removed from said machine after said pedestals are locked,

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Jigs For Machine Tools (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
US00309408A 1972-11-24 1972-11-24 Wafer interlocking transport system Expired - Lifetime US3786660A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US30940872A 1972-11-24 1972-11-24

Publications (1)

Publication Number Publication Date
US3786660A true US3786660A (en) 1974-01-22

Family

ID=23198112

Family Applications (1)

Application Number Title Priority Date Filing Date
US00309408A Expired - Lifetime US3786660A (en) 1972-11-24 1972-11-24 Wafer interlocking transport system

Country Status (7)

Country Link
US (1) US3786660A (enrdf_load_stackoverflow)
JP (1) JPS5314425B2 (enrdf_load_stackoverflow)
CA (1) CA996144A (enrdf_load_stackoverflow)
DE (1) DE2356954C2 (enrdf_load_stackoverflow)
FR (1) FR2207783B1 (enrdf_load_stackoverflow)
GB (1) GB1446564A (enrdf_load_stackoverflow)
IT (1) IT993601B (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110355294A (zh) * 2019-07-17 2019-10-22 江西理工大学 一种冲孔加工机械用工装夹具
CN113356559B (zh) * 2021-06-13 2024-05-14 湖南金峰金属构件有限公司 冷挤压脚手架定位装填座模

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1384278A (en) * 1918-09-26 1921-07-12 Pilkington Brothers Ltd Apparatus for grinding and polishing plate-glass
US3180011A (en) * 1960-09-01 1965-04-27 Olin Mathieson Hollow article manufacture by fluid pressure
US3244779A (en) * 1962-06-29 1966-04-05 Levey John Selective heating and drawing of plastics
US3487133A (en) * 1967-02-20 1969-12-30 John Lindsay Method for making relief maps
US3496744A (en) * 1966-02-05 1970-02-24 Sumitomo Light Metal Ind Method and apparatus for controlling the contours of rolling mill rolls to obtain metal sheet or strip of superior flatness
US3564568A (en) * 1968-08-22 1971-02-16 Mallory & Co Inc P R Method of locating and holding semiconductor wafer
US3599288A (en) * 1969-01-23 1971-08-17 Lab For Electronics Inc Scan average memory control system
US3640660A (en) * 1967-10-10 1972-02-08 Albert De Mets Press, particularly for forming fiber plates
US3693301A (en) * 1970-05-27 1972-09-26 Anvar Method for producing optical elements with aspherical surfaces
US3729966A (en) * 1972-02-02 1973-05-01 Ibm Apparatus for contouring the surface of thin elements

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2338603A (en) * 1937-12-04 1944-01-04 Paul I Schultz Pressure supporting mechanism
US2729040A (en) * 1954-02-10 1956-01-03 Boeing Co Vacuum chuck jigs
DE1161519B (de) * 1961-05-24 1964-01-16 Erwin Lothar Holland Merten Vakuum-Montagegeraet
CH416495A (de) * 1964-10-29 1966-06-30 Schoenauer Paul Werkbank mit Spannvorrichtung
GB1200213A (en) * 1966-08-19 1970-07-29 Yawata Iron & Steel Co Fluid gauges
US3542354A (en) * 1968-06-12 1970-11-24 Micromatic Hone Corp Nondistortive work holding fixture

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1384278A (en) * 1918-09-26 1921-07-12 Pilkington Brothers Ltd Apparatus for grinding and polishing plate-glass
US3180011A (en) * 1960-09-01 1965-04-27 Olin Mathieson Hollow article manufacture by fluid pressure
US3244779A (en) * 1962-06-29 1966-04-05 Levey John Selective heating and drawing of plastics
US3496744A (en) * 1966-02-05 1970-02-24 Sumitomo Light Metal Ind Method and apparatus for controlling the contours of rolling mill rolls to obtain metal sheet or strip of superior flatness
US3487133A (en) * 1967-02-20 1969-12-30 John Lindsay Method for making relief maps
US3640660A (en) * 1967-10-10 1972-02-08 Albert De Mets Press, particularly for forming fiber plates
US3564568A (en) * 1968-08-22 1971-02-16 Mallory & Co Inc P R Method of locating and holding semiconductor wafer
US3599288A (en) * 1969-01-23 1971-08-17 Lab For Electronics Inc Scan average memory control system
US3693301A (en) * 1970-05-27 1972-09-26 Anvar Method for producing optical elements with aspherical surfaces
US3729966A (en) * 1972-02-02 1973-05-01 Ibm Apparatus for contouring the surface of thin elements

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
J. of Optical Soc. of Am.; Vol. 45, No. 12; December 1955; pp. 1009,1010; Control and Interferometric Measurement of Plate Flatness by Carman. *

Also Published As

Publication number Publication date
IT993601B (it) 1975-09-30
DE2356954C2 (de) 1984-04-05
GB1446564A (en) 1976-08-18
JPS4984374A (enrdf_load_stackoverflow) 1974-08-13
JPS5314425B2 (enrdf_load_stackoverflow) 1978-05-17
FR2207783B1 (enrdf_load_stackoverflow) 1978-08-04
FR2207783A1 (enrdf_load_stackoverflow) 1974-06-21
DE2356954A1 (de) 1974-05-30
CA996144A (en) 1976-08-31

Similar Documents

Publication Publication Date Title
US3853313A (en) Wafer interlocking transport system
US3711081A (en) Semiconductor wafer chuck
KR100278027B1 (ko) 반도체웨이퍼의연마방법및그장치
US5882248A (en) Apparatus for separating wafers from polishing pads used in chemical-mechanical planarization of semiconductor wafers
US6241592B1 (en) Polishing apparatus
EP0129108B1 (en) Wafer transferring chuck assembly
JP5437437B2 (ja) ウエハ受渡装置、ウエハ受渡装置のウエハ着座検出方法及びポリッシング装置
US6379230B1 (en) Automatic polishing apparatus capable of polishing a substrate with a high planarization
TWI742023B (zh) 基板處理裝置、從基板處理裝置之真空吸附台脫附基板之方法、以及將基板載置於基板處理裝置之真空吸附台之方法
KR100335485B1 (ko) 화학적-기계적 폴리싱 장치 및 방법
JPH09181153A (ja) 半導体ウェーハ固定装置
US6358126B1 (en) Polishing apparatus
US3786660A (en) Wafer interlocking transport system
US10468290B2 (en) Wafer chuck apparatus with micro-channel regions
KR102292286B1 (ko) 기판 연마 방법, 톱링 및 기판 연마 장치
US4820930A (en) Photomask positioning device
EP0911114A2 (en) Polishing apparatus
JP3010434B2 (ja) 平坦な基板から半導体ウェハを除去する方法及び装置
US20020195058A1 (en) Apparatus for holding a wafer for use in a process chamber for fabricating a semiconductor device
US3162941A (en) Method of making ball point writing instrument
WO2003028951A1 (en) Apparatus and process for producing polished semiconductor wafers
JP3768352B2 (ja) ポリッシング装置
JP2001319905A (ja) バキュームチャック
JP4195161B2 (ja) タイヤ製造用コアの分解組付け方法および装置
KR20240032401A (ko) 반도체 웨이퍼 트레이 지그장치