US3686139A - Resistive coating compositions and resistor elements produced therefrom - Google Patents
Resistive coating compositions and resistor elements produced therefrom Download PDFInfo
- Publication number
- US3686139A US3686139A US18343A US3686139DA US3686139A US 3686139 A US3686139 A US 3686139A US 18343 A US18343 A US 18343A US 3686139D A US3686139D A US 3686139DA US 3686139 A US3686139 A US 3686139A
- Authority
- US
- United States
- Prior art keywords
- epoxy
- phenolic resin
- coating
- resin
- resistive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000008199 coating composition Substances 0.000 title description 51
- 239000002245 particle Substances 0.000 abstract description 64
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 59
- 239000000203 mixture Substances 0.000 abstract description 59
- 239000000463 material Substances 0.000 abstract description 56
- 229920001568 phenolic resin Polymers 0.000 abstract description 50
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 39
- 239000005011 phenolic resin Substances 0.000 abstract description 39
- 229910052799 carbon Inorganic materials 0.000 abstract description 37
- 239000003822 epoxy resin Substances 0.000 abstract description 33
- 229920000647 polyepoxide Polymers 0.000 abstract description 33
- 229920005989 resin Polymers 0.000 abstract description 24
- 239000011347 resin Substances 0.000 abstract description 24
- 229920000877 Melamine resin Polymers 0.000 abstract description 23
- 239000004640 Melamine resin Substances 0.000 abstract description 10
- 239000002243 precursor Substances 0.000 abstract description 7
- 239000005007 epoxy-phenolic resin Substances 0.000 abstract description 5
- 230000001747 exhibiting effect Effects 0.000 abstract description 4
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 description 82
- 239000011248 coating agent Substances 0.000 description 47
- 239000000758 substrate Substances 0.000 description 27
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 20
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 18
- 239000000047 product Substances 0.000 description 18
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 15
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 15
- 239000007787 solid Substances 0.000 description 15
- 239000002904 solvent Substances 0.000 description 15
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 13
- 239000002923 metal particle Substances 0.000 description 13
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 12
- 239000000314 lubricant Substances 0.000 description 12
- 239000004033 plastic Substances 0.000 description 12
- 229920003023 plastic Polymers 0.000 description 12
- -1 e.g. Substances 0.000 description 11
- 229910052709 silver Inorganic materials 0.000 description 11
- 239000004332 silver Substances 0.000 description 11
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 10
- 238000012360 testing method Methods 0.000 description 10
- 230000009969 flowable effect Effects 0.000 description 9
- 239000004615 ingredient Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 238000005299 abrasion Methods 0.000 description 8
- 238000001723 curing Methods 0.000 description 8
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 8
- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 8
- 229920001342 Bakelite® Polymers 0.000 description 7
- 239000004637 bakelite Substances 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 6
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 6
- 229920003986 novolac Polymers 0.000 description 6
- 239000000126 substance Substances 0.000 description 5
- 150000001299 aldehydes Chemical class 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- IVJISJACKSSFGE-UHFFFAOYSA-N formaldehyde;1,3,5-triazine-2,4,6-triamine Chemical compound O=C.NC1=NC(N)=NC(N)=N1 IVJISJACKSSFGE-UHFFFAOYSA-N 0.000 description 4
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- BNCADMBVWNPPIZ-UHFFFAOYSA-N 2-n,2-n,4-n,4-n,6-n,6-n-hexakis(methoxymethyl)-1,3,5-triazine-2,4,6-triamine Chemical compound COCN(COC)C1=NC(N(COC)COC)=NC(N(COC)COC)=N1 BNCADMBVWNPPIZ-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 239000004312 hexamethylene tetramine Substances 0.000 description 3
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- 239000006223 plastic coating Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- ODGAOXROABLFNM-UHFFFAOYSA-N polynoxylin Chemical compound O=C.NC(N)=O ODGAOXROABLFNM-UHFFFAOYSA-N 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 239000002562 thickening agent Substances 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 2
- 229920003265 Resimene® Polymers 0.000 description 2
- 229920001807 Urea-formaldehyde Polymers 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 150000003944 halohydrins Chemical class 0.000 description 2
- 239000000543 intermediate Substances 0.000 description 2
- 229940035429 isobutyl alcohol Drugs 0.000 description 2
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000004848 polyfunctional curative Substances 0.000 description 2
- 238000007761 roller coating Methods 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- ROLAGNYPWIVYTG-UHFFFAOYSA-N 1,2-bis(4-methoxyphenyl)ethanamine;hydrochloride Chemical compound Cl.C1=CC(OC)=CC=C1CC(N)C1=CC=C(OC)C=C1 ROLAGNYPWIVYTG-UHFFFAOYSA-N 0.000 description 1
- BGJSXRVXTHVRSN-UHFFFAOYSA-N 1,3,5-trioxane Chemical compound C1OCOCO1 BGJSXRVXTHVRSN-UHFFFAOYSA-N 0.000 description 1
- DEWLEGDTCGBNGU-UHFFFAOYSA-N 1,3-dichloropropan-2-ol Chemical compound ClCC(O)CCl DEWLEGDTCGBNGU-UHFFFAOYSA-N 0.000 description 1
- 150000005207 1,3-dihydroxybenzenes Chemical class 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical group CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- GRWFFFOEIHGUBG-UHFFFAOYSA-N 3,4-Epoxy-6-methylcyclohexylmethyl-3,4-epoxy-6-methylcyclo-hexanecarboxylate Chemical compound C1C2OC2CC(C)C1C(=O)OCC1CC2OC2CC1C GRWFFFOEIHGUBG-UHFFFAOYSA-N 0.000 description 1
- SDDGNMXIOGQCCH-UHFFFAOYSA-N 3-fluoro-n,n-dimethylaniline Chemical compound CN(C)C1=CC=CC(F)=C1 SDDGNMXIOGQCCH-UHFFFAOYSA-N 0.000 description 1
- 229920003319 Araldite® Polymers 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XZMCDFZZKTWFGF-UHFFFAOYSA-N Cyanamide Chemical compound NC#N XZMCDFZZKTWFGF-UHFFFAOYSA-N 0.000 description 1
- 229920003270 Cymel® Polymers 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- AWMVMTVKBNGEAK-UHFFFAOYSA-N Styrene oxide Chemical compound C1OC1C1=CC=CC=C1 AWMVMTVKBNGEAK-UHFFFAOYSA-N 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000000498 ball milling Methods 0.000 description 1
- CXRFFSKFQFGBOT-UHFFFAOYSA-N bis(selanylidene)niobium Chemical compound [Se]=[Nb]=[Se] CXRFFSKFQFGBOT-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N butyric aldehyde Natural products CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 150000003997 cyclic ketones Chemical class 0.000 description 1
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- IAOQICOCWPKKMH-UHFFFAOYSA-N dithieno[3,2-a:3',2'-d]thiophene Chemical compound C1=CSC2=C1C(C=CS1)=C1S2 IAOQICOCWPKKMH-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 125000004464 hydroxyphenyl group Chemical group 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000013528 metallic particle Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000011877 solvent mixture Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- VGZTVHRJEVWFIA-UHFFFAOYSA-N synthane Chemical compound FC(F)OC(F)C(F)(F)C(F)F VGZTVHRJEVWFIA-UHFFFAOYSA-N 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- ITRNXVSDJBHYNJ-UHFFFAOYSA-N tungsten disulfide Chemical compound S=[W]=S ITRNXVSDJBHYNJ-UHFFFAOYSA-N 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 150000003738 xylenes Chemical class 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06573—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the permanent binder
- H01C17/06586—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the permanent binder composed of organic material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/36—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes condensation products of phenols with aldehydes or ketones
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
Definitions
- These selected polymeric materials include mixtures of trifunctional epoxy resin and phenolic resin; mixtures of epoxy-modified phenolic resin and phenolic resin; mixtures of phenolic resin, melamine resin, or precursors thereof, and epoxy-modified phenolic resin; mixtures of epoxy-modified phenolic resin, phenolic resin, and epoxy resin; and melamine resins.
- This invention relates to electrically resistive coating compositions especially suitable for the production of resistors and the like electrical elements. More particularly, this invention relates to electrically resistive plastic coating compositions capable of adhering to dielectric substrates and of providing wear resistance coatings on the substrates and to the resistor elements manufactured from the coated substrates.
- resistive coatings from flowable conductive plastic materials containing electrically conductive particles dispersed within a solvent solution of a heat-curable polymeric material. Also, many attempts have been made to use such conductive plastic materials to produce resistive coatings suitable for the manufacturing resistor elements used in potentiometers and like electrical devices where the resistance of the coating is resolved by a wiper element or similar contact means when moved over the coating.
- one of the resistive coatings may contain metal particles, e.g., silver, to provide a termination zone of low resistivity; the adjacent coating may contain substantially less conductive particles such as carbon to provide a resistor zone of high resistivity and the next adjacent coating may contain metal particles, e.g., silver, to provide another termination zone.
- the adjacent coatings which are of substantially difierent resistivity should have an electrical junction between them that provides a continuous electrical path with an even or smooth transition in resistance from one coating to the other.
- This requirement for a smooth electrical transition zone between coatings of different resistivity is particularly manifest in the production of resistor elements for potentiometers wherein a wiper element is moved across the resistor element, i.e., from one coating to another.
- Various methods have been used for applying such resistive coatings including spraying, freeflow film extrusion, brushing, roller coating and the like.
- One particularly effective method for producing coated substrates having especially smooth electrical junctions between the adjacent coating is disclosed in the commonly assigned application of Ralph E. Mishler filed concurrently herewith and entitled Production of Resistive Coatings.
- the conductive plastic materials heretofore used for producing resistive coatings for manufacture of resistor elements often do not exhibit the wearresistance required to insure a long service life in a potentiometer. These coatings rarely have sufficient wear resistance to last more than about 5,000 cycles of the wiper element.
- the term cycle refers to the amount of contact required for the wiper element to traverse a resistor element of a given size from one end to the other and then to return to the one end.
- this invention provides resistive coating compositions which form resistor elements having substantially greater wear resistances than those heretofore known.
- this invention contemplates an electrically resistive coating composition capable of exhibiting outstanding abrasion resistance, and of adhering to many different dielectric substrates which comprises an admixture of from about 30 to by weight of selected heat-curable polymeric materials and from about 5 to 70% by weight of finely divided conductive particles dispersed therein. Because the polymeric materials used as a binder and dispersant for the conductive particles are heat curable and also because the conductive particles should be uniformly dispersed throughout the admixture, it had been found particularly advantageous that the compositions of this invention should be prepared as solvent solutions. Thus, it will be understood that these coating compositions, which are applied as flowable materials to a dielectric substrate, dried and then cured by heating, will normally contain minor amounts of solvent after the curing step.
- the above-mentioned polymeric materials are especially suitable for preparing coating compositions containing highly electrically resistive particles such as carbon particles.
- the conductive particles in the coating composition are metallic particles, e.g., silver, and the like, it is more difiicult to obtain the desired abrasion-resistant properties of the compositions of this invention.
- the addition of certain solid-type lubricants to the coating composition will increase the wear resistance of these and other coating compositions sufficiently that the desired abrasion resistance can be obtained.
- Suitable solid lubricants for use in the coating compositions of this invention include molybdenum disulfide, tungsten disulfide, boron nitride, niobium selenide, tungsten selenide, titanium telluride, and mixtures thereof, and the like, which are unreactive with the polymeric material or the conductive particles at the conditions required for cur ing the coatings onto the substrate. Also, the lubricant must not substantially affect the electrical characteritsics of the coatings. Generally, at least, about by weight of the solid lubricant based on the total solid content is needed to produce a noticeable improvement in the abrasion resistance of the coating composition.
- the coating composition containing from about to about 90% of a lubricant such as molybdenum disulfide, which is essentially dielectric in character, will produce particularly effective resistive coatings suitable for the purposes of this invention.
- a lubricant such as molybdenum disulfide, which is essentially dielectric in character
- the amount of molybdenum disulfide should be about equal to the amount of metal particles employed in the coating composition.
- the resistive coating compositions of this invention contain finely divided electrically conductive particles dispersed uniformly throughout a substantially non-conductive heat-curable polymeric vehicle.
- the polymeric vehicle must adhere to the dielectric substrate during the application operation and provide a hard solid matrix in which the conductive particles will remain dispersed after curing at elevated temperatures.
- suitable polymeric materials include heat curable melamine resins or precursors thereof, such as melamine-formaldehyde condensates, methylated melamine-formaldehyde condensates, butylated melamine-formaldehyde condensates, butylated urea-formaldehyde condensates; phenolic resins, such as phenol-formaldehyde condensates; epoxy resins and epoxy-modified phenolic resins and mixtures thereof. It will be appreciated that several of these heat curable polymeric materials may require hardeners or catalysts to accelerate the curing reaction. As heretofore noted, with the exception of selected melamine resins, such as Resimene 876, it has been found that particular combinations or mixtures of these polymers must be employed to obtain the unique coating compositions of this invention.
- Epoxy resins will cross-link with phenol-formaldehyde condensates and also with melamine formaldehyde condensates.
- the phenolic resins employed by this invention are those phenol-formaldehyde condensates which include heat fusible, phenolic novolak resins and the heat-curable, one-step phenolic resins.
- the novolaks usually are prepared by using a molar ratio of formaldehyde to phenol of less than about 1 to 1 in the presence of a catalyst that is preferably acidic under appropriate reaction conditions. Novolaks are permanently fusible and soluble and do not themselves pass into a cross-linked state.
- methylene bridges may be provided by compounds which generate formaldehyde which in turn subssequently provides additional methylene bridges between adjacent phenolic nuclei.
- the one-step phenolic resins are prepared with a larger mole ratio of formaldehyde to phenol than is employed to prepare the novolaks. Under the influence of alkaline catalysts, phenol reacts with aqueous formaldehyde to attach hydroxymethyl (methylol) groups to form one to all three of the phenolic ortho and para positions with or without the establishment or methylene linkages between phenolic nuclei.
- Suitable phenolic resins which are commercially available include Bakelite BKS 2710, Varcum 1281 B 65, and BRPA 5570. These resins may be cured to the thermoset (cross-linked) condition by the application of heat alone, but this cure often does not proceed rapidly enough. Consequently, hardner compounds may be used to accelerate the rate of cure.
- the hardner compounds capable of being aldehyde donors include hexamethylenetetramine, paraformaldehyde, sym-trioxane and the like.
- the hardner is hexamethylenetetramine which is a product of ammonia and formaldehyde.
- These hardner compounds are considered aldehyde donors in that they effect rapid crosslinking of heat fusible novolak resins and the one step phenolic resins with methylene or equivalent linkages by the application of heat.
- Suitable epoxy-modified phenolic resins are exemplified by those made commercially available by Reichhold Chemicals, Inc. and sold as Plyophen 23-983.
- the epoxy resins suitable for this invention include polymeric reaction products of polyfunctional halohydrins with polyhydric phenols. Such resins are known in the art as epoxy, epoxides, glycidyl ethers, or ether-epoxides. Among the polyfunctional halohydrins that may be employed to produce the epoxy resins are epichlorohydrin, glycerol dichlorohydrin and the like.
- Typical polyhydric phenols are the resorcinols and the 2,2-bis (hydroxyphenyl) alkanes, i.e., compounds resulting from the condensation of phenols with aldehydes and ketones including formaldehyde, acetaldehyde, propionaldehyde, acetone, and the like.
- the epoxy resins often contain terminal epoxy groups but also may contain both terminal epoxy groups and terminal hydroxyl groups.
- Trifunctional epoxy resins such as Bakelite ERL 0510, sold by Union Carbide, are particularly effective when admixed with phenolic resins.
- epoxy-type resins may be employed to prepare the resistive coating compositions of this invention.
- resins include the epoxy resins marketed by the Bakelite Company under the trade names ERL 2774, ERL 4221, and ERL 3794, and BXKS 4466; the Epon resins sold by the Shell Chemical Corporation, i.e., Epon 1001, Epon 1004, Epon 1007, Epon 1009, and Epon 828; those sold by Ciba Company, Inc., designated as Araldite 6010 and 6020; and the GenEpoxy Resins sold by General Mills Chemical Division, i.e., Gen- Epoxy 175, 190, and 525.
- Unox Epoxide 201 a product of Union Carbide Chemicals Company, is representative of the new cycloaliphatic epoxy resins that are useful.
- the modified epoxy resins often contain reactive diluent such as styrene oxide, octylene oxides, allyl glycidyl ether, butyl-glycidyl ether, phenyl glycidyl ether, and the like reactive compounds in amounts varying up to about 20 to 30 parts of diluent per parts of the epoxy resin.
- modified epoxy resins examples include Bakelite ERL 2795, ERL 4289, ERL 2774, Araldite 502, Gen- Epoxy M-180, and Epon 815. It will be appreciated that the term epoxy resin as herein employed is meant to include the conventional epoxy resins hereinabove described and also those modified epoxy resins and intermediate epoxy resins.
- the weight ratio of the amount of the phenolic resin to the amount of epoxy resin may range from about 3:1 to about 5:1; preferably a ratio of about 4:1 is employed.
- the mixtures containing epoxy-modified phenolic resin (such as Plyophen 23-983) and phenolic resin (such as Bakelite BKS 2710) usually have these resins, respectively, in a weight ratio of from about 1:2 to 1:1 and preferably in a ratio of about 1:15 If an epoxy resin is added to this mixture it is generally added in the same Weight proportion as the epoxy-modified phenolic resin.
- a particularly effective combination of phenolic resin, epoxy-modified phenolic resin and epoxy resin is one in which these resins are respectively in a weight ratio of 1.5 1 1. Lesser amounts of epoxy resins may also be used.
- these melamine resins or melamine resin precursors such as hexamethoxymethylmelamine are added to these phenolic resin mixtures
- the melamine resin is usually employed as a curing or cross-linking aid. Consequently, it is utilized in relatively small amounts.
- these mixtures may contain about 50 to 65% phenolic resin, 30 to 50% of the epoxy-modified phenolic resin, and about 5 to of the melamine resin, based on the total weight of the mixture.
- the melamine resins may range from about 30 to about 60% by weight of the total weight of the solids content of the coating composition.
- the melamine resins may range from about 30 to about 60% by weight of the total weight of the solids content of the coating composition.
- the amount, type and size of the conductive particles used in the flowable conductive plastic materials determines the resistivity of the material. Because of their varied conductivity, carbon particles have been found to be particularly effective for producing resistive coatings.
- the carbon particles will comprise from about 4 to about 60% by weight of the flowable solventcontaining coating composition. Preferably, from about 7 to about 30% by weight of the carbon particles are employed to produce flowable compositions of suitable viscosity. When the carbon particle content is above 60% by weight, the viscosity of the flowable coating composition is often too high for effective application, e.g., by doctoring.
- the polymeric voids formed between the carbon particles after curing or cross-linking of the polymeric vehicle have an adverse effect on the electrical characteristics of the coating. For example, it has been found that the noise level of the resistive coating will be excessively high and therefore not commercially acceptable at this low carbon content.
- metal particles such as those of silver, platinum, other noble metals, copper, stainless steel and the like, may also be used as conductive particles in the coating material of this invention.
- Such metal-containing materials are especially useful for forming the terminations of a resistor element.
- the metal particle content may vary considerably.
- silver particles in amounts from about 30% up to about 50% by weight of the solvent-containing composition are especially suitable for producing a termination zone having a resistance that is 1% of the total resistance of the resistor element.
- lower amounts of the metal particles e.g., 10% by weight, or higher amounts of the metal particles, e.g., 65 may be also used for producing different resistive coatings.
- Metal particles have a less pronounced affect on the viscosity of the resistive plastic materials.
- the primary consideration which determines the maximum amount of metal particles used is capability of the polymeric vehicle in the plastic material to adhesively bond the particles to the substrate to be coated.
- the resinous vehicle In general, from 0.25 to 1 part by weight of the resinous vehicle is required to 1 part of metal by weight, and from about 0.5 to 2 parts of the resin per 1 part of carbon by weight.
- Resistive plastic coating materials containing either all carbon or all metal particles are normally used, but mixtures of each or both may be employed.
- the carbon particles used may be in the various forms, i.e., crystalline or amorphorous, found in commercially available carbons such as acetylene blacks or furnace blacks. Often the carbon particles are calcined in air at elevated temperatures on the order of 2,000 to 3,000 F. for several hours prior to use in the preparation of the conductive plastic materials.
- the carbon particles may range in size from about 10 to about 400 millimicrons and mixtures of larger and smaller particles may be used.
- Metal particles are usually considerably larger than carbon particles and may have particle sizes ranging from about 10 'to about 400 microns.
- the resistivity of the conductive, particle-containing plastic material is determined by the amount of conductive particles used; the resistivity varying inversely to the amount of particles.
- thermosetting polymers or mixtures thereof used as the vehicle or binder for the conductive particles may have viscosities which are higher than desired for the purposes of the invention, it is often necessary to use an organic compound, which is a solvent for the polymer, to regulate the viscosity of the conductive plastic material.
- organic compound which is a solvent for the polymer
- Suitable solvent materials are aliphatic alcohols such as ethanol, and isobutyl alcohol, and the like; aliphatic ketones such as methyl ethyl ketone, methyl isobutyl ketone, and the like; cyclic ketones such as isophorone; glycol ethers such as ethylene glycol n-butyl ether, ethylene glycol ethyl ether, and the like; as well as aromatic hydrocarbons such as benzene, toluene, the xylenes, and the like.
- aliphatic alcohols such as ethanol, and isobutyl alcohol, and the like
- aliphatic ketones such as methyl ethyl ketone, methyl isobutyl ketone, and the like
- cyclic ketones such as isophorone
- glycol ethers such as ethylene glycol n-butyl ether, ethylene glycol ethyl ether, and the like
- the solvents are primarily used to regulate the viscosity of the resistive plastic materials, the amount of solvent may vary considerably, i.e., from about 5 to about 70% by weight of the flowable resistive coating material to be applied to the substrate.
- additives and other compounding aids may be used in preparation of the resistive coating materials in order to facilitate their application on to a dielectric substrate.
- silicone oils and other similar surfactants may be employed to prevent the occurrence of surface imperfections in the coating.
- polymeric thickening agents, metal cross-linking inhibitors such as catechol, and the like may be used.
- additives will comprise a relatively small amount, i.e., about 1 to 5 parts by weight of the coating composition.
- catalysts and hardeners for the polymeric vehicle as heretofore described will be added during compounding of the coating materials.
- the viscosity of the resistive coating materials will be sufficiently high to insure formation of uniform edges on each coating and must be in the range that allows the material to flow on to the dielectric substrate.
- Resistive plastic materials having viscosities of from about centipoises to as high as 80,000 centipoises can be used (these viscosities are obtained at a spindle speed of 10 r.p.m. on a Brookfield Viscosimeter). It will be understood that the manner in which the coatings are applied, i.e., by spraying, roller coating, doctoring, brushing, silk-screening, etc., determines the minimum viscosity of the plastic material that can be used. In general, viscosities of at least about 200 cps. (at a Brookfield spindle speed of 10 r.p.m.) are needed for doctoring applications. Preferably, these viscosities range from about 3,000 to about 20,000 cps.
- resistive coating materials which exhibit thixotropic properties. These materials are more readily applied by a doctoring edge. Also they insure that the edges between adjacent coatings will provide the even electrical transition from one resistive coating to another.
- the index of thixotropy of these materials may vary from about 1.5 to about 40 and preferably from about 2 to about 20. It will be understood that as used herein the term index of thixotropy refers to the ratio of the viscosity of a material at one level of agitation to the viscosity at another level. Many of the polymeric materials suitable for this invention may show -viscosities of from about 200,000 up to about 800,000 or more when measured at a spindle speed of 0.5 r.p.m. on a Brookfield Viscosimeter.
- the substrate or base to be coated in accordance with this invention is a dielectric, insulating material which must be stable under the conditions required for fixing the coatings to the surface of the substrate.
- these materials are sheets, strips, films, and the like, formed from polymers, e.g., phonelic resins, polyvinyl chloride, polyethylene, epoxy resin, and the like; glass, ceramics, treated papers, and the like.
- the substrate may be stationary Or advanced under a doctoring edge or roller or other applicator as successive sheets or strips in end-to-end abutment or as a continuously flexible film which may be withdrawn on a take-up roll.
- the coating compositions of this invention may be applied to the dielectric substrate to produce micro-thin coatings having thicknesses of from about 0.5 to about 20 mils. Because of the solvent usually present in the fiowable coating composition, the coatings will be thinner after removal of the solvent, e.g., by drying. The wet coatings may shrink as much as about 60% or more after being dried and fixed to the substrate. Consequently, the solvent-free coatings may have thicknesses varying from about 0.25 to about mils.
- the coating compositions of this invention must be heat-cured to fix the coating to the dielectric substrate.
- the coated substrate is initially heated to dry, or precure, the coating at temperaures of from 200 to 300 F. for a few minutes and then heated to temperatures of from 250 to 350 F. or higher for periods of /2 hour to 4 hours to cure the polymeric vehicle.
- the wear-resistant coatings of this invention have different micro-hardness when tested, for example, by a Knoop indenter.
- the composition-containing phenolic resins usually produce cured coatings having hardness readings in the range of about 60 to about 70; whereas the melamine-type compositions produce coatings having hardness readings of from about to about 30. (These readings were obtained with a gram load and with polished samples of the coatings.)
- resistor elements for the manufacture of potentiometers and other variable resistors may be produced by stamping, cutting or otherwise blanking out a plurality of resistive elements from the coated substrate.
- These elements may be in various shapes, e.g., sector-shaped, circular segments, crescent-shaped, rectangular, and the like. The manner in which these resistive elements are formed will be hereinafter described in greater detail. Also, the specific shape of certain sector-shaped elements is illustrated in the heretofore noted application of Ralph E. Mishler.
- EXAMPLE I This example illustrates preparation of a resistive coating composition containing a mixture of phenolic resin, epoxy and epoxy-modified phenolic resin for manufacturing carbon-containing resistive elements of a potentiometer.
- This coating composition contained the following ingredients in weight percentage:
- a dielectric substrate i.e., a phenolic strip, produced by the Synthane Corporation, having a dielectric strength greater than 1,000 megohms, a thickness of 0.020 inch, and a length of approximately 28 inches was coated by doctoring the coating composition to a thickness of 3 mils wet.
- the coated phenolic strip was then dried for 10 minutes at 200 F. and cured for 1 hour at 325 F. to secure the coating to the strip.
- a plurality of identical sector-shaped resistor elements each having a resistance of about 500 ohms, was then cut out of the coated substrate by a blanking die. These elements each had an outer diameter of approximately 0.550 of an inch and a radial width of about 0.117 of an inch and included angle of about 62 between the centers of the terminal openings. This element is of the size and type used in a Centralab Model 3 potentiometer (Centralab is a trademark of Globe-Union, Inc.). In order to evaluate the wear or abrasion resistance of the resistive coating on the resistor element, a contact resistance variation test method designated by Centralab Specification No. 04BB1 was conducted.
- the resistor element is placed in a Model 3 potentiometer assembly having a silver-clad Phosphor bronze wiper element which contacts the resistor element at a pressure of approximately 100,000 p.s.i.
- the assembly is then mounted on a testing apparatus which rotates the wiper element back and forth across the resistor element at a rate of 50 cycles per minute, the total number of cycles being recorded by a counter.
- the potentiometer assembly is also connected electrically to an electronic resistance measuring apparatus including an X-Y plotter which plots the noise level i.e. the variation in resistance across the element at a constant current of 1 milliamp.
- EXAMPLE II This example illustrates the wear resistance and improvedcycle life obtained by the coating compositions containing selected melamine resins as a polymeric vehicle for carbon particles.
- the following coating composition was used to prepare a ilowable resistive coating:
- the coating composition obtained was applied to a phenolic strip (as used in Example I) to a wet thickness of 3 mils and the strip was dried for 4 minutes at 300 F. and cured for 2 hours at 250 F.
- Example I sector-shaped resistive elements were then cut out of a coated phenolic substrate and tested for their cycle life in the Model 3 potentiometer assembly. From these tests it was found that the instant coating composition produced a resistive coating having a cycle life greater than 5 0,000 cycles.
- EXAMPLE HI The use of a resistive coating containing a mixture of phenolic resin and trifunctional epoxy resin as a polymetric vehicle for carbon particles is illustrated by this example.
- a resistive coating material having the following composition was prepared:
- This coating composition was admixed by first dissolving the phenolic resin and the epoxy resin in the solvent mixture and by then ball milling for 16 hours.
- the resulting flowable coating material was applied at a thickness of 3 mils wet to a phenolic strip (of the type in Example I) by spraying through a nozzle at 30 psi. atomizing pressure.
- the strip was then dried at 200 F. for minutes and cured for V2 hour at 325 F.
- EXAMPLE IV This example illustrates the use of a coating composition capable of forming a resistive coating having exceptional extended cycle life in which the polymeric vehicle is a mixture of phenolic resin and epoxy-modified phenolic resin.
- This coating composition contained the following ingredients by weight percent:
- this coating composition a 1000 gram batch was made by mixing the phenolic resin and the epoxy-modified phenolic resin, methyl ethyl ketone, and isophorone in a one-gallon can for 5 minutes. Then the carbon particles were added and blended for /2 hour and the resulting admixture was ball milled for 19 /2 hours. This coating was then doctored onto a phenolic strip at a thickness of 3 mils wet and then dried for 4 minutes at 300 F. and cured for 2 hours at 325 F.
- Example I sector-shaped resistive elements suitable for a Model 3 potentiometer assembly were blanked out from the coated phenolic strip and then mounted in assembly. Tests of these sectors showed that the coating composition gave a cycle life in excess of 400,000 cycles without causing any appreciable wear to the surface of the coating or damage to the wiper element.
- EXAMPLE V This example illustrates the use of solid lubricants, such as molybdenum disulfide, for preparing the unique resistive coating compositions of this invention.
- a silver-containing coating composition, suitable for producing a metal termination zone on a resistor element was prepared using the following ingredients:
- Example I In accordance with the procedure outlined in Example I this termination material was applied to a phenolic strip and sector-shaped resistor elements were blanked out and then tested for their rotational life. It was found these coatings also exhibit a cycle life greater than 50,000 cycles.
- Phenolic resin 26.8 Epoxy-modified phenolic resin 3 15.7 Hexamethoxy-methylmelamine 4 1.8 Catechol 0.5
- This coating material was then applied by doctoring to a 3 mil wet thickness to the phenolic substrate, dried at 4 /2 minutes at 300 F. and cured for 2 hours at 325 F.
- Sector-shaped resistor elements suitable for testing in Model 3 potentiometer were then prepared, and then evaluated for their rotational life as described in Example I. It was found from these tests that this coating gave a cycle life less than 5,000 cycles.
- the second coating material (which is a composition identical to the first except molybdenum disulfide is substituted for the silver flake) was then mixed in a 1:1 weight ratio with the previously prepared silver-containing composition and applied by doctoring to a thickness of 3 mils wet to the phenolic strips. The strips were then cured at the conditions used for the first silver-containing composition. Evaluation of wear resistance on the coating by the above-noted rotation test showed that the coating gave a cycle life in excess of 50,000.
- coating compositions of this invention provide resistive micro-thin coatings having a cycle life of 50,000 or more cycles.
- EXAMPLE VII By following the procedures and conditions described in Examle I, many other resistive coatings were produced in which polymeric materials including phenolic resins, mixtures of phenolic and difunctional epoxy resins, polybutadiene, diallyl isophthalate and others were substituted 12 for the selected polymeric materials of this invention. In each case, the resulting resistive coating on the resistor element was found to have a substantially shorter cycle life, i.e. from about 2,000 cycles to 10,000 cycles.
- a heat-curable fiowable electrically resistive coating composition capable of adhering to a dielectric substrate and of producing a microthin coating exhibiting outstanding abrasion resistance after curing when contacted with an electrical wiper, which comprises an admixture of a polymeric vehicle dispersed in a solvent for the vehicle, said solvent comprising from about 5 to about percent by weight of the total weight of the composition and said vehicle being selected from the group consisting of mixtures of trifunctional epoxy resin and phenolic resin; mixtures of epoxy-modified phenolic resin and phenolic resin; mixtures of phenolic resin, melamine resin, or precursors thereof, and epoxy-modified phenolic resin; mixtures of epoxy-modified phenolic resin, phenolic resin, and epoxy resin; and melamine resins; said admixture containing about at least 30 percent by weight of a solid lubricant that does not substantially affect the electrical characteristics of the coating and is based on the total solid content of the admixture; and having finely divided conductive particles homogene
- An electrical resistor element having a greatly extended service life by resistance to abrasion from wiper contact during use which comprises a smooth dielectric base covered with a heat cured coating composition formed from an admixture of a polymeric material selected from the group consisting of mixtures of trifunctional epoxy resin and phenolic resin; mixtures of epoxymodified phenolic resin and phenolic resin; mixtures of phenolic resin, melamine resin, or precursors thereof, and epoxy-modified phenolic resin; mixtures of epoxy-modified phenolic resin, phenolic resin, and epoxy resin; and melamine resin; said admixture containing about at least 30 percent by weight of a solid lubricant that does not substantially affect the electrical characteristics of the coating and is based on the total solid content of the admixture; conductive particles dispersed homogeneously therethrough; and a solvent comprising from about 5 to about 70 percent by weight of the total weight of the composition before curing; said polymeric material being present in a greater amount by weight than said conductive particles and
- the resistor element of claim 5 in which the metal particles are silver particles and the solid lubricant is molybdenum disulfide.
- the electrical resistor element of claim 5 in which the thickness of the cured microthin coating is from about 0.25 to about 10 mils.
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Applications Claiming Priority (1)
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US1834370A | 1970-03-10 | 1970-03-10 |
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US18343A Expired - Lifetime US3686139A (en) | 1970-03-10 | 1970-03-10 | Resistive coating compositions and resistor elements produced therefrom |
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CA1141528A (en) * | 1978-08-04 | 1983-02-22 | Western Electric Company, Incorporated | Conductive adhesive system including a conductivity enhancer |
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CH672857A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1986-07-26 | 1989-12-29 | Kurasawa Optical Ind | |
DE102004044115B4 (de) * | 2004-09-06 | 2010-04-08 | Ab Elektronik Sachsen Gmbh | Schleifkontaktsystem für einen verstellbaren elektrischen Widerstand und Verfahren zu dessen Herstellung |
CN113948236B (zh) * | 2021-12-21 | 2022-03-29 | 西安宏星电子浆料科技股份有限公司 | 一种耐磨损高精度油位传感器用厚膜银钯导体浆料 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2825702A (en) * | 1953-09-03 | 1958-03-04 | Electrofilm Inc | Heating elements in film form |
GB1108967A (en) * | 1965-08-23 | 1968-04-10 | Matsushita Electric Ind Co Ltd | Carbon film resistor composition |
-
1970
- 1970-03-10 US US18343A patent/US3686139A/en not_active Expired - Lifetime
-
1971
- 1971-01-12 CA CA102,563A patent/CA970956A/en not_active Expired
- 1971-02-12 JP JP46006448A patent/JPS5120537B1/ja active Pending
- 1971-02-15 DE DE2107162A patent/DE2107162C3/de not_active Expired
- 1971-02-23 CH CH261671A patent/CH585253A5/xx not_active IP Right Cessation
- 1971-02-23 FR FR7106169A patent/FR2081812B1/fr not_active Expired
- 1971-03-05 NL NL7102993A patent/NL7102993A/xx unknown
- 1971-04-19 GB GB2363271*A patent/GB1351636A/en not_active Expired
Cited By (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4298516A (en) * | 1971-08-23 | 1981-11-03 | Owens-Illinois, Inc. | Composition of matter |
US4107092A (en) * | 1973-02-26 | 1978-08-15 | Uop Inc. | Novel compositions of matter |
DE2413475A1 (de) * | 1973-03-20 | 1975-01-02 | Raychem Ltd | Polymerenmassen fuer elektrische verwendungszwecke |
US4470898A (en) * | 1973-03-20 | 1984-09-11 | Raychem Limited | Polymer compositions for electrical use |
US3908040A (en) * | 1974-01-07 | 1975-09-23 | Us Air Force | Method of encapsulation |
US3983075A (en) * | 1974-06-21 | 1976-09-28 | Kennecott Copper Corporation | Copper filled conductive epoxy |
US4071737A (en) * | 1974-06-21 | 1978-01-31 | Kennecott Copper Corporation | Heating panel |
US4238528A (en) * | 1978-06-26 | 1980-12-09 | International Business Machines Corporation | Polyimide coating process and material |
US4331970A (en) * | 1978-09-18 | 1982-05-25 | General Electric Company | Use of dispersed solids as fillers in polymeric materials to provide material for semiconductor junction passivation |
US4545926A (en) * | 1980-04-21 | 1985-10-08 | Raychem Corporation | Conductive polymer compositions and devices |
US4418118A (en) * | 1981-04-22 | 1983-11-29 | Oy Lohja Ab | Electroluminescence structure |
US4396666A (en) * | 1981-11-02 | 1983-08-02 | Cts Corporation | Solderable conductive employing an organic binder |
US4547310A (en) * | 1983-03-30 | 1985-10-15 | Murata Manufacturing Co., Ltd. | Carbon resistive paste |
EP0143660A3 (en) * | 1983-12-01 | 1986-01-29 | Electro Materials Corp. Of America | Resistors, methods of forming said resistors, and articles comprising said resistors |
AU576208B2 (en) * | 1983-12-01 | 1988-08-18 | Electro Materials Corp. Of America | Resistor composition |
EP0170468A1 (en) * | 1984-07-18 | 1986-02-05 | Electro Materials Corp. Of America | Resistor compositions, methods of making them and articles comprising them |
US4600602A (en) * | 1984-07-18 | 1986-07-15 | Rohm And Haas Company | Low resistance resistor compositions |
AU573865B2 (en) * | 1984-07-18 | 1988-06-23 | Electro Materials Corp. Of America | Resistor composition |
EP0399295A3 (de) * | 1989-05-24 | 1991-03-20 | Preh-Werke GmbH & Co. KG | Zur Erzeugung elektrischer Widerstandsschichten geeignete Widerstandspaste und aus ihr hergestellte Widerstandsschicht |
DE3916921C1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1989-05-24 | 1990-10-11 | Preh-Werke Gmbh & Co Kg, 8740 Bad Neustadt, De | |
US5219494A (en) * | 1989-05-24 | 1993-06-15 | Preh-Werke Gmbh & Co. Kg | Resistor paste composition and resistor layers produced therefrom |
WO1991010240A1 (de) * | 1989-12-23 | 1991-07-11 | Robert Bosch Gmbh | Verfahren zum herstellen einer abriebfesten schicht |
US5378407A (en) * | 1992-06-05 | 1995-01-03 | Raychem Corporation | Conductive polymer composition |
WO1995025603A1 (en) * | 1994-03-23 | 1995-09-28 | Board Of Regents, The University Of Texas System | Boiling enhancement coating |
US5814392A (en) * | 1994-03-23 | 1998-09-29 | Board Of Regents, The University Of Texas System | Boiling enhancement coating |
US8829769B1 (en) | 2012-11-09 | 2014-09-09 | Dantam K. Rao | Coated keybar to protect electric machines |
Also Published As
Publication number | Publication date |
---|---|
FR2081812B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1975-07-04 |
GB1351636A (en) | 1974-05-01 |
DE2107162C3 (de) | 1975-09-04 |
NL7102993A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1971-09-14 |
DE2107162A1 (de) | 1971-09-23 |
JPS5120537B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1976-06-25 |
FR2081812A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1971-12-10 |
DE2107162B2 (de) | 1975-01-23 |
CA970956A (en) | 1975-07-15 |
CH585253A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1977-02-28 |
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