US3604694A - Device for heat treatment of silicon discs - Google Patents

Device for heat treatment of silicon discs Download PDF

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Publication number
US3604694A
US3604694A US862242A US3604694DA US3604694A US 3604694 A US3604694 A US 3604694A US 862242 A US862242 A US 862242A US 3604694D A US3604694D A US 3604694DA US 3604694 A US3604694 A US 3604694A
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US
United States
Prior art keywords
silicon
quartz tube
discs
silicon discs
heat treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US862242A
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English (en)
Inventor
Adolf Muller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens Corp
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Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Application granted granted Critical
Publication of US3604694A publication Critical patent/US3604694A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B31/00—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
    • C30B31/06—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor by contacting with diffusion material in the gaseous state
    • C30B31/14—Substrate holders or susceptors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S118/00—Coating apparatus
    • Y10S118/90—Semiconductor vapor doping

Definitions

  • the above device can to a large extent prevent the silicon discs to be treated from suffering mechanical damage.
  • the silicon discs treated in the quartz tube frequently show accumulations of dislocations, following heat processing, which had not been present prior to said processing. These accumulations of dislocations start from the edge of the semiconductor body and extend more or less into the interior of the semiconductor body. Hence, these accumulations of dislocations can be traced back to pressure tensions which are caused by the fact that one part of the periphery of the silicon discs bears directly against the quartz vessel, which causes the silicon to melt or alloy with the quartz at these contact places. Due to the different expansion coefficients of the quartz tube and of the silicon discs which are to be plastically deformed, stresses occur during the cooling process that lead to dislocations in the silicon discs.
  • the invention makes it possible for silicon discs which are free of or poor in dislocations, to remain the same following the heat treatment. The aforedescribed formation of nests of dislocations is to be particularly avoided.
  • the invention relates, therefore, to a device for the heat treatment of silicon discs in a horizontal quartz tube which can be evacuated, wherein the silicon discs are arranged in stacks.
  • the invention is characterized by the fact that a plurality of thin silicon rods, positioned in mutually parallel relationship, are installed into the quartz tube where they serve as a support for the silicon discs.
  • the silicon rods prevent the silicon discs from contacting the quartz vessel with their lower edge portions.
  • a quartz tube whose vessel is large relative to the diameter of the silicon discs, can also prevent the upper wall portion of the vessel from contacting, due to deformations, the unprotected edge portions of the silicon disc. Cylindrical end pieces can be provided for guiding the silicon rods in the quartz tube.
  • the outer diameter of the end pieces and the inner diameter of the quartz tube are so dimensioned that the silicon rods can freely move in peripheral direction of the quartz tube.
  • the rolling positioning of the silicon rods, in the quartz tube also ensures that the silicon discs always bear against the silicon rods, even if the quartz tube is turned around its middle axis by an arbitrary angle.
  • the inner diameter of the quartz tube can be limited to a diameter only a few millimeters larger than the diameter of the silicon discs, provided that, according to a further development of the invention, support discs having a larger diameter than the silicon discs are arranged at least between the end pieces and the outermost silicon discs of the stack. When or more silicon discs are treated, it is recommended to subdivide the stack one or several more times, by means of additional support discs.
  • FIG. 1 shows, in lateral view, partly in section, a device for heat treating silicon discs comprised for example of silicon, according to the invention
  • FIG. 2 shows a section through the device according to FIG. 1.
  • FIG. 1 shows a doping vessel 1, which for example is a quartz tube.
  • the quartz tube 1, which is evacuable, is sealed hermetically at its open end by a sealing cap 2 which can also be made of quartz,
  • the interior of the quartz tube contains two cylindrical end pieces 3 and 4 which are protected against axial displacement, firstly by the sealing cap 2 and, secondly, by an additional quartz cylinder 5.
  • the quartz cylinder is adjacent the curved portion 6 of the quartz tube 1.
  • the end pieces 3 and 4 have a cylindrical thread which is used to guide thin silicon rods 7.
  • the silicon rods 7 have a degree of purity which corresponds at least to that of the silicon discs 8 to be treated, that are stacked side by side. Their length is such that they are reliably guided by the cylindrical thread of the end pieces 3, 4.
  • the end pieces 3 and 4 are respectively concentrically surrounded by an additional hollow cylinder 9 and 10.
  • the latter serve as bearings for the silicon rods 7.
  • the silicon rods 7 are of such thickness that they can freely move in the annular space, between the end pieces 3 and 4 and the inner wall of the quartz tube 8, in peripheral direction of the latter.
  • support discs 11 and 12 are situated, which are also comprised of silicon, which are at least as pure as the silicon discs 8 to be processed.
  • the diameter of the support discs ll, 12 is a few millimeters larger than that of the silicon discs 8.
  • the support discs 11, 12 are also thicker than the silicon discs 8.
  • a dopant source such as an aluminum sheet 16, arranged in a carrier body 17, that can also comprise silicon, is at the end 6 of the quartz tube.
  • the device according to the invention is characterized by the fact that, with the exception of the quartz cylinder 1, all remaining parts of the device can be actually used for any desired number of heat treatments.
  • the charging process is extremely simple.
  • the device according to the invention is also suitable for other heat treatment processes, for example for gettering impurities.
  • a device for heat treatment of silicon discs in an evacuable horizontal quartz tube which comprises a quartz tube and a plurality of thin silicon rods inside said quartz tube, in mutually parallel relationship, to support the silicon discs arranged in stacks, cylindrical end pieces are provided in the quartz tube for guiding the silicon rods, and support plates, whose diameter is larger than that of the silicon discs, are ar ranged at least between the end pieces and the outer silicon discs of the stack,
  • the device of claim 1 wherein the outer diameter of the 3.
  • the number and thickness end pieces and the inner diameter of the quartz tube are such of the silicon rods are such that they cover at least the lower that the silicon rods can freely move, in peripheral direction of half of the inner diameter ofthe quartz tube.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
US862242A 1968-10-04 1969-09-30 Device for heat treatment of silicon discs Expired - Lifetime US3604694A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19681801187 DE1801187B1 (de) 1968-10-04 1968-10-04 Vorrichtung zur Waermebehandlung von Siliziumscheiben

Publications (1)

Publication Number Publication Date
US3604694A true US3604694A (en) 1971-09-14

Family

ID=5709643

Family Applications (1)

Application Number Title Priority Date Filing Date
US862242A Expired - Lifetime US3604694A (en) 1968-10-04 1969-09-30 Device for heat treatment of silicon discs

Country Status (7)

Country Link
US (1) US3604694A (Direct)
BE (1) BE739815A (Direct)
DE (1) DE1801187B1 (Direct)
FR (1) FR2019940A1 (Direct)
GB (1) GB1244069A (Direct)
NL (1) NL6913337A (Direct)
SE (1) SE341035B (Direct)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3669431A (en) * 1971-01-25 1972-06-13 Signetics Corp Boat pulling apparatus for diffusion furnace and method
US3705714A (en) * 1971-05-20 1972-12-12 Norton Co Silicon nitride kiln furniture
US3735965A (en) * 1972-02-29 1973-05-29 Schoger & Associates Inc Santa Furnace carrier and handling system
US3939017A (en) * 1973-04-02 1976-02-17 Hitachi, Ltd. Process for depositing the deposition agent on the surface of a number of semiconductor substrates
US4278422A (en) * 1979-12-31 1981-07-14 David M. Volz Diffusion tube support collar
US4382776A (en) * 1980-08-18 1983-05-10 Fujitsu Limited Quartz tube for thermal processing of semiconductor substrates
US4518349A (en) * 1983-12-01 1985-05-21 Better Semiconductor Processes (Bsp) Cantilevered boat-free semiconductor wafer handling system
US4525224A (en) * 1981-03-02 1985-06-25 Bbc Brown, Boveri & Cie Method for the doping of supporting silicon plates for the manufacture of semiconductors
US4624638A (en) * 1984-11-29 1986-11-25 Btu Engineering Corporation CVD boat loading mechanism having a separable, low profile cantilevered paddle assembly
USD326273S (en) 1988-07-25 1992-05-19 Tel Sagami Limited Heat insulating cylinder for thermal treatment of semiconductor wafers
USD326272S (en) 1988-07-25 1992-05-19 Tel Sagami Limited Heat insulating cylinder for thermal treatment of semiconductor wafers
USD327078S (en) 1988-07-25 1992-06-16 Tel Sagami Limited Instrument for transferring boats for thermal treatment of semiconductor wafers
EP1655530A3 (de) * 2004-11-05 2007-02-07 Forschungszentrum Jülich Gmbh Thermische Isolierung zur Reduzierung von Wärmeverlusten und Energieverbrauch bei Hochtemperaturanlagen

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1502754A (en) * 1975-12-22 1978-03-01 Siemens Ag Heat-treatment of semi-conductor wafers
US5709227A (en) * 1995-12-05 1998-01-20 R. J. Reynolds Tobacco Company Degradable smoking article

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3183130A (en) * 1962-01-22 1965-05-11 Motorola Inc Diffusion process and apparatus

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1085299A (en) * 1964-11-23 1967-09-27 Btu Eng Corp Improvements in or relating to diffusion furnaces
DE1521481B1 (de) * 1965-10-22 1969-12-04 Siemens Ag Anordnung zur Waermebehandlung von scheibenfoermigen Halbleiterkoerpern

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3183130A (en) * 1962-01-22 1965-05-11 Motorola Inc Diffusion process and apparatus

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3669431A (en) * 1971-01-25 1972-06-13 Signetics Corp Boat pulling apparatus for diffusion furnace and method
US3705714A (en) * 1971-05-20 1972-12-12 Norton Co Silicon nitride kiln furniture
US3735965A (en) * 1972-02-29 1973-05-29 Schoger & Associates Inc Santa Furnace carrier and handling system
US3939017A (en) * 1973-04-02 1976-02-17 Hitachi, Ltd. Process for depositing the deposition agent on the surface of a number of semiconductor substrates
US4278422A (en) * 1979-12-31 1981-07-14 David M. Volz Diffusion tube support collar
US4382776A (en) * 1980-08-18 1983-05-10 Fujitsu Limited Quartz tube for thermal processing of semiconductor substrates
US4525224A (en) * 1981-03-02 1985-06-25 Bbc Brown, Boveri & Cie Method for the doping of supporting silicon plates for the manufacture of semiconductors
US4518349A (en) * 1983-12-01 1985-05-21 Better Semiconductor Processes (Bsp) Cantilevered boat-free semiconductor wafer handling system
US4624638A (en) * 1984-11-29 1986-11-25 Btu Engineering Corporation CVD boat loading mechanism having a separable, low profile cantilevered paddle assembly
USD326273S (en) 1988-07-25 1992-05-19 Tel Sagami Limited Heat insulating cylinder for thermal treatment of semiconductor wafers
USD326272S (en) 1988-07-25 1992-05-19 Tel Sagami Limited Heat insulating cylinder for thermal treatment of semiconductor wafers
USD327078S (en) 1988-07-25 1992-06-16 Tel Sagami Limited Instrument for transferring boats for thermal treatment of semiconductor wafers
EP1655530A3 (de) * 2004-11-05 2007-02-07 Forschungszentrum Jülich Gmbh Thermische Isolierung zur Reduzierung von Wärmeverlusten und Energieverbrauch bei Hochtemperaturanlagen

Also Published As

Publication number Publication date
FR2019940A1 (Direct) 1970-07-10
SE341035B (Direct) 1971-12-13
DE1801187B1 (de) 1970-04-16
GB1244069A (en) 1971-08-25
BE739815A (Direct) 1970-04-03
NL6913337A (Direct) 1970-04-07

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