US2994648A - Nickel plating additives - Google Patents

Nickel plating additives Download PDF

Info

Publication number
US2994648A
US2994648A US23900A US2390060A US2994648A US 2994648 A US2994648 A US 2994648A US 23900 A US23900 A US 23900A US 2390060 A US2390060 A US 2390060A US 2994648 A US2994648 A US 2994648A
Authority
US
United States
Prior art keywords
nickel
solution
brightening
per liter
agents
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US23900A
Other languages
English (en)
Inventor
Rose Arthur H Du
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harshaw Chemical Co
Original Assignee
Harshaw Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to NL263657D priority Critical patent/NL263657A/xx
Priority to NL126849D priority patent/NL126849C/xx
Application filed by Harshaw Chemical Co filed Critical Harshaw Chemical Co
Priority to US23900A priority patent/US2994648A/en
Priority to GB12042/61A priority patent/GB898774A/en
Priority to DEH42365A priority patent/DE1190287B/de
Priority to FR859455A priority patent/FR1287149A/fr
Application granted granted Critical
Publication of US2994648A publication Critical patent/US2994648A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/12Electroplating: Baths therefor from solutions of nickel or cobalt

Definitions

  • This invention relates to the electrodeposition of nickel and more specifically to a process of electrodepositing nickel, and to a solution for use in a process for electrodepositing nickel.
  • the invention has to do with the discovery of cooperating brightening agents suitable for use in aqueous acid nickel plating solutions where the solution contains a nickel electrolyte selected from nickel sulfate and nickel chloride and mixtures thereof.
  • nickel electrolyte of the class consisting of nickel sulfate, nickel chloride and mixtures of nickel sulfate and nickel chloride if the solution also contains an effective amount of each of two cooperating addition agents.
  • One of the cooperating addition agents has an internal sulfur atom in the organic molecule and is characterized by a solubility in the plating solution of at least 0.00.05 gram per liter and the following characteristic structure:
  • X is a member selected from the group consisting of and n and m are integers from 1 to 4, and A is a member selected from the group consisting of H, CN--, CN-(CH O-, where p is an integer from 1 to 4, CN-(CH X-, where p is an integer from 1 to 4 and Where X is a member selected from the group consisting of and B is a member selected from the group consisting of --CN, CN(CH -O, where p is an integer from 1 to 4 and CN(CH -X, where p is an integer from 1 to 4 and X is a member selected from the group consisting of
  • the preferred types are the symmetrical forms NC-(OH --X-(CH ),,CN
  • X is a member selected from the group consisting of O, and S-- and n is an integer from 1 to 4, which may be called sulfonylalkylene uitriles and sulfinylalkyleue nitriles.
  • brighteners The addition agents falling within this classification will hereafter be referred to as brighteners.
  • Typical brighteners according to the invention are indicated in Table I.
  • the optimum range of each brightener which should be dissolved in the plating solution is also indicated in Table I in grams of brightener per liter of plating solution. They may be used in the plating solution in concentration from 0.0005 to 0.10 gram per liter.
  • NCCH2CHzS-CH2CH2CN NCCH2CHzS-CH2CH2CN (4) B-cyanoethyl propyl sulioxide 0. 008-0. 05
  • NC--CH1CHz-OCH1CH2fiCHzCHzO-CH:CH2CN carrier is dissolved in the plating solution in amounts from about 2 to about 5 grams per liter.
  • the organic sulfonates, sulfimides and sulfonamides comprise aromatic and unsaturated aliphatic sulfonates, sulfonamides, and sulfimides.
  • aromatic and unsaturated aliphatic sulfonates, sulfonamides and sulfimides are included the acids and their salts such as the sodium, potassium, nickel, cobalt, and iron salts thereof.
  • the class includes aryl and unsaturated alkyl sulfonates, sulfimides and sulfonarnides, and the foregoing salts thereof wherein the number of carbon atoms in any aryl nucleus is from 6 to 10 and in any unsaturated alkyl group is from 1 to 10, and substitution products of the foregoing wherein the substituents are chosen fromthe class of alkyl groups having 1 to 4 carbon atoms, chlorine, CH0 and phenyl.
  • organic sulfonamides, sulfimides, and sulfonates are frequently referred to as carriers or control agents in the art of nickel plating, and accordingly, are sometimes so-called herein. These carriers produce a degree of brightness without a cooperating brightener. Nevertheless, they do not produce suflicient brightness when uti-' lized as the sole brightening additive in acid nickel plating solutions to be considered as producing a full, bright plate.
  • the carriers or control agents constituting this second class of addition agents have a minimum solubility in the plating solution (for example, in a solution consisting of 240 grams of NiSO .6H O, 37.5 grams of NiCl .6H 0, 37.5 grams of H BO and water to make a liter) to the extent of at least 0.05 gram per liter.
  • Typical compounds illustrating the aryl and unsaturated alkyl sulfonamides, sulfimides and sulfonates are set forth in Table II. With respect to the aromatic sulfonic acids and sulfonamides and sulfimides various substituents in the ring structure are evident in the formulas in-' dicated.
  • the brightening addition agent should be dissolved in.
  • the constituents of the plating bath are (1) water, (2) nickel sulfate, nickel chloride, or a mixture of nickel sulfate and nickel chloride, (3) the brightener, (4) a sulfonate, a sulfonamide, a sulfimide, or one or more sulfonates, sulfonamides, sulfimides or mixtures thereof of the type previously indicated, and (5) and a wetting agent (optional).
  • An additional ingredient of the solution which is desirable is a buffering agent such as boric acid, formic acid, or the like.
  • the essential novel feature of the invention is the use of an acid nickel plating solution having one or more nickel electrolytes selected from nickel sulfate and nickel chloride and additionally containing cooperating brightening agents, one of which is at least one carrier selected from the group consisting of unsaturated aliphatic sulfonamides, unsaturated aliphatic sulfimides, unsaturated aliphatic sulfonates, aromatic sulfonamides, aromatic sulfimides and aromatic sulfonates, and the other of which is a small amount of a brightener of the type heretofore indicated.
  • Wetting agent e.g. sodium lauryl sulfate
  • Wetting agent 0 to 0.5 grams, preferably 0.05 to 0.2 H20 to make 1000 cc.
  • ALL CHLORIDE Wetting agent e.g. sodium lauryl sulfate
  • Wetting agent 0 to 0.5 grams, preferably 0.05 t 0.2 120 to make 1000 cc.
  • Wetting agent e.g. sodium sulfate derivative of 'I-ethyl- 2-methyl-undecanol-4) 0 to 0.5 gram, preferably 0.025 to 0.2 gram. H20 to make 1000 cc.
  • the plating solutions above identified may be operated under conditions of pH, temperature, and cathode current density which are customarily employed therewith.
  • the cooperating brightening agents of the invention are dissolved in the plating solutions in the amount previously indicated, bright, ductile deposits Will be obtained upon electrolysis of the solution.
  • Typical operating conditions for the basic solutions are as follows:
  • electroplating solutions containing different cooperating brighteners and carriers are illustrated in. Table III.
  • the operating conditions for obtaining bright ductile nickel deposits are also set forth in the table.
  • a bright nickel deposit of from .05 to about 1 mil thick or thicker may be secured by electrolyzing the electroplating solution between an anode and a buffed brass cathode. Similar results may be secured on other types of cathodes conventionally employed in acid nickel plating processes utilizing solutions of the type indicated herein.
  • substituents are alkylv or acyl groupsnot exceeding 4' carbon atoms, halogen, hydroxy or carboxy groups maybe employed.
  • Typical examples of substituted coumarins are 4-methyl coumarin, 6-chloro coumarin, 3- acetyl coumarin, coumarin-3-carboxylic acid, 4,8-dimethyl coumarin, 7-hydroxy coumarin, 6-carboxy coumarin, 3- chloro coumarin, 3-bromo coumarin, and 3-methyl coumarin.
  • coumarin or its said derivatives may be dissolved .in the nickel plating solutions containing the cooperating brightening agents and found to exert a leveling or smoothing action such that bright, ductile, nickel deposits of excellent smoothness are obtained.
  • Nickel Chloride g./l Boric Acid, g./l Allyl Sulfonic Acid, g./l
  • Dibenzenesulfonamide ether g./1 Sacoharin (sodium salt), g./l Toluene sulfonamide, g./l -t Bis(B-cyanoethyl)sulione, g./l 1,4-Bis(B-cyanoethylsulfonyl) butane, a ll Bis(B-cyanoethy1) sulfoxide, g./l
  • B-cyanoethyl propyl sulfoxide g./l
  • B-cyanoethyl B-cyanoethoxyethyl sulfone, g./l
  • Nickel Sulfate g./l Nickel Fluoborate, g./l
  • Dibenzenesulfonamide ether g./l 3 Saccharin (sodium salt), g./l 2 Toluene sulfonamide, g./l Bis(B-cyanoethyl)sulfone, ll
  • X is a member selected from the group consisting of and n and m are integers from 1 to 4, and A is a member selected from the group consisting of H, CN, CN(CH O-, where p is an integer from 1 to 4, CN(CH -X, where p is an integer from 1 to 4 and where X is a member selected from the group consisting of and B is a member selected from the group consisting of --CN, CN-(C z) Where p is an integer from 1 to 4, and CN(CH Where p is an integer from 1 to 4 and X is a member selected from the group consisting of i -s 0 II ll 0 and -S the first said brightening addition agent being present in said solution to the extent of from .05 to 20 grams perliter and the second said brightening addition agent being present in said solution to the extent of from 0.0005 to 0.10 gram per liter. l
  • a nickel electroplating bath comprising an aqueous solution of a nickel electrolyte selected from the group] j consisting of nickel sulfate, nickel chloride, and mixtures thereof, said solution'also containing cooperatingbright: H
  • one of said brightening addition agents being at least one organic compound selected from the group consisting of aromatic and unsaturated aliphatic sulfonates, sulfonamides and sulfimides and the second of" said agents being a compound of the formula 8.. of said brightening addition agents being a compound of the formula wherein n is an integer from 1 to 4, the first said brightening addition agent being present in said solution to the extent of from .05 to 20 grams per liter and the second said brightening addition agent being present in said solution to the extent of from 0.0005 to 0.10 gram per liter.
  • a nickel electroplating bath comprising an aqueous solution of a nickel electrolyte selected from the group consisting of nickel sulfate, nickel chloride, and mixtures thereof, said solution also containing cooperating brightening addition agents, one of said brightening addition agents being at least one organic compound selected from the group consisting of aromatic and unsaturated aliphatic sulfonates, sulfonamides and sulfimides and the second of said brightening addition agents being a compound of the formula wherein n is an integer from 1 to 4, the first said brightening addition agent being present in said solution to the extent of from .05 to 20 grams per liter and the second said brightening addition agent being present in said solution to the extent of from 0.0005 to 0.10 gram per liter.
  • An acid nickel electroplating solution comprising in addition to Water, nickel sulfate equivalent to from 100 to 400 grams per liter of NiSO -7H O, nickel C1110? ride equivalent to from 10 to 60 grams per liter of NiCl -6H O, a buffering agent and cooperating, brighten ing addition agents, one of said brightening addition agents being a compound selected from the group consisting of aromatic and unsaturated aliphatic sulfonates, sulfonamides and sulfimides and the second of said brightening addition agents being Bis(B-cyanoethyl) sulfone, the first said brightening addition agent being present in said solution to the extent of from 0.05 to 20 grams per liter and the second said brightening addition agent being present in said solution to the extent of from 0.005 to 0.03 gram per liter.
  • An acid nickel electroplating solution comprising in addition to water, nickel sulfate equivalent to from 100 to 400 grams per liter of NiSO -7H O, nickel chlo- Q ride equivalent to from 10 to 60 grams per liter of NiCl -6H O, a buffering agent and cooperating, brightening addition agents, one of said brightening addition and n is an integer from 1 to 4, the first said brightening addition agent being present in said solution to the extent of from .05 to 20 grams per liter and the second said brightening addition agent being present in said solution a to the extent of from 0.0005 to 0.10 gram per liter.
  • a nickel electroplating bath comprising an aqueous '7 solution of a nickel electrolyte selected from the group consisting of nickel sulfate, nickel chloride, and mixtures thereof, said solution also containing cooperating'brightening addition agents, one of said brightening addition agents being at least one organic compound selected from the group consisting of aromatic and unsaturated aliphatic sulfonates, sulfonamides and sulfimides and t e second agents being a compound selected from the group consisting of aromatic and unsaturated aliphatic sulfonates, sulfonamides and sulfimides and the second of said brightening addition agents being a 1,4-Bis(B-cyanoethy1- sulfonyl) butane, the first said brightening addition agent being present in said solution to the extent of from 0.05 to 20 grams per liter and the second said brightening addition agent being present in said solution to the extent of from 0.005 to 0.03
  • An acid nickel electroplating solution comprising in addition to Water, nickel sulfate equivalent to from to 400 grams per liter of NiSO -7H O, nickel chlo ride equivalent to from 10 to 60 grams per liter of NiCl -6H O, a buffering agent and cooperating, brightening addition agents, one of said brightening addition agents being a compound selected from the group consisting of aromatic and unsaturated aliphatic sulfonates, sulfonamides and sulfimides and the second of said brightening addition agents being a Bis(B-cyanoethyl) sulfoxide, the first said brightening addition agent being present in said solution to the extent of from 0.05 to 20 grams per liter and the second said brightening addition agent being prment in said solution to the extent Of from 0.0005 to 0.006 gram per liter.
  • An acid nickel electroplating solution comprising in addition to water, nickel sulfate equivalent to from 100 to 400 grams per liter of NiSO -7H O, nickel chloride equivalent to from to 60 grams per liter of NiCl -6H O, a buffering agent and cooperating, brightening addition agents, one of said brightening addition agents being a compound selected from the group consisting of aromatic and unsaturated aliphatic sulfonates, sulfonamides and sulfimides and the second of said brightening addition agents being a B-cyanoethyl propyl sulfoxide, the first said brightening addition agent being present in said solution to the extent of from 0.05 to 20 grams per liter and the second said brightening addition agent being present in said solution to the extent of from 0.0005 to 0.006 gram per liter.
  • An acid nickel electroplating solution comprising in addition to water, nickel sulfate equivalent to from 100 to 400 grams per liter of NiSO -7H O, nickel chloride equivalent to from 10 to 60 grams per liter of NiCl -6H O, a bufiering agent and cooperating, brightening addition agents, one of said brightening addition agents being a compound selected from the group consisting of aromatic and unsaturated aliphatic sulfonates, sulfonamides and sulfimides and the second of said brightening addition agents being a B-cyanoethyl B-cyanoethoxyethyl sulfone, the first said brightening addition 10 agent being present in said solution to the extent of from 0.05 to 20 grams per liter and the second said brightening addition agent being present in said solution to the extent of from 0.0005 to 0.006 gram per liter.
  • An acid nickel electroplating solution comprising in addition to water, nickel sulfate equivalent to from 100 to 400 grams per liter of NiSO -7H O, nickel chloride equivalent to from 10 to grams per liter of NiCl -6H O, a buffering agent and cooperating, brightening addition agents, one of said brightening addition agents being a compound selected from the group consisting of aromatic and unsaturated aliphatic sulfonates, sulfonamides and sulfimides and the second of said brightening addition agents being a Bis(B-cyanoethoxyethyl) sulfone, the first said brightening addition agent being present in said solution to the extent of firom 0.05 to 20 grams per liter and the second said brightening addition agent being present in said solution to the extent of from 0.0005 to 0.006 gram per liter.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
US23900A 1960-04-22 1960-04-22 Nickel plating additives Expired - Lifetime US2994648A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
NL263657D NL263657A (es) 1960-04-22
NL126849D NL126849C (es) 1960-04-22
US23900A US2994648A (en) 1960-04-22 1960-04-22 Nickel plating additives
GB12042/61A GB898774A (en) 1960-04-22 1961-04-04 Nickel electroplating
DEH42365A DE1190287B (de) 1960-04-22 1961-04-20 Waessriges Bad fuer die galvanische Vernickelung
FR859455A FR1287149A (fr) 1960-04-22 1961-04-21 Procédé d'électrodéposition de nickel et solution utilisée dans ce procédé

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US23900A US2994648A (en) 1960-04-22 1960-04-22 Nickel plating additives

Publications (1)

Publication Number Publication Date
US2994648A true US2994648A (en) 1961-08-01

Family

ID=21817827

Family Applications (1)

Application Number Title Priority Date Filing Date
US23900A Expired - Lifetime US2994648A (en) 1960-04-22 1960-04-22 Nickel plating additives

Country Status (4)

Country Link
US (1) US2994648A (es)
DE (1) DE1190287B (es)
GB (1) GB898774A (es)
NL (2) NL126849C (es)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3254007A (en) * 1963-02-05 1966-05-31 Hanson Van Winkle Munning Co Electrodeposition of nickel
US3417005A (en) * 1965-12-27 1968-12-17 Gen Motors Corp Neutral nickel-plating process and bath therefor
US4046647A (en) * 1976-06-17 1977-09-06 M&T Chemicals Inc. Additive for improved electroplating process
US4053373A (en) * 1975-07-09 1977-10-11 M & T Chemicals Inc. Electroplating of nickel, cobalt, nickel-cobalt, nickel-iron, cobalt-iron and nickel-iron-cobalt deposits
EP2650986A1 (en) * 2010-12-07 2013-10-16 Ngk Spark Plug Co., Ltd. Spark plug

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2467580A (en) * 1943-08-21 1949-04-19 Udylite Corp Electrodeposition of nickel
US2882208A (en) * 1957-09-23 1959-04-14 Udylite Res Corp Electrodeposition of nickel

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE505242A (es) * 1950-08-16

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2467580A (en) * 1943-08-21 1949-04-19 Udylite Corp Electrodeposition of nickel
US2882208A (en) * 1957-09-23 1959-04-14 Udylite Res Corp Electrodeposition of nickel

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3254007A (en) * 1963-02-05 1966-05-31 Hanson Van Winkle Munning Co Electrodeposition of nickel
US3417005A (en) * 1965-12-27 1968-12-17 Gen Motors Corp Neutral nickel-plating process and bath therefor
US4053373A (en) * 1975-07-09 1977-10-11 M & T Chemicals Inc. Electroplating of nickel, cobalt, nickel-cobalt, nickel-iron, cobalt-iron and nickel-iron-cobalt deposits
US4046647A (en) * 1976-06-17 1977-09-06 M&T Chemicals Inc. Additive for improved electroplating process
FR2355095A1 (fr) * 1976-06-17 1978-01-13 M & T Chemicals Inc Procede et composition pour le depot electrolytique de nickel, cobalt et alliages de ceux-ci avec le fer
EP2650986A1 (en) * 2010-12-07 2013-10-16 Ngk Spark Plug Co., Ltd. Spark plug
EP2650986A4 (en) * 2010-12-07 2014-12-24 Ngk Spark Plug Co SPARK PLUG

Also Published As

Publication number Publication date
GB898774A (en) 1962-06-14
DE1190287B (de) 1965-04-01
NL263657A (es)
NL126849C (es)

Similar Documents

Publication Publication Date Title
US2837472A (en) Brighteners for electroplating baths
US3770598A (en) Electrodeposition of copper from acid baths
US2910413A (en) Brighteners for electroplating baths
US2644789A (en) Electrodeposition of nickel
US2662853A (en) Electrodeposition of nickel
US2978391A (en) Nickel plating process and solution
US2994648A (en) Nickel plating additives
US4014759A (en) Electroplating iron alloys containing nickel, cobalt or nickel and cobalt
US3876513A (en) Electrodeposition of bright cobalt plate
US3220940A (en) Electrodeposition of nickel
US3506548A (en) Electrodeposition of nickel
US3152975A (en) Electrodeposition of nickel
US2684327A (en) Bright nickel plating
US2291590A (en) Electrodeposition of metals
US3860638A (en) Bright nickel plating bath addition agents
US3008883A (en) Electrodeposition of bright nickel
US2972571A (en) Nickel plating solutions
US2881120A (en) Electroplating nickel
US2648628A (en) Electroplating of nickel
US3000799A (en) Nickel plating solutions
US3139393A (en) Electrodeposition
US2294311A (en) Nickel plating
US3367854A (en) Nickel plating
US3748236A (en) Additive for nickel plating baths
US2839460A (en) Electrolating