US3748236A - Additive for nickel plating baths - Google Patents
Additive for nickel plating baths Download PDFInfo
- Publication number
- US3748236A US3748236A US00273574A US3748236DA US3748236A US 3748236 A US3748236 A US 3748236A US 00273574 A US00273574 A US 00273574A US 3748236D A US3748236D A US 3748236DA US 3748236 A US3748236 A US 3748236A
- Authority
- US
- United States
- Prior art keywords
- nickel
- brightener
- bath
- bright
- tamol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title abstract description 63
- 229910052759 nickel Inorganic materials 0.000 title abstract description 30
- 238000007747 plating Methods 0.000 title abstract description 30
- 239000000654 additive Substances 0.000 title description 2
- 230000000996 additive effect Effects 0.000 title description 2
- 239000000203 mixture Substances 0.000 abstract description 33
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 abstract description 8
- GOLORTLGFDVFDW-UHFFFAOYSA-N 3-(1h-benzimidazol-2-yl)-7-(diethylamino)chromen-2-one Chemical compound C1=CC=C2NC(C3=CC4=CC=C(C=C4OC3=O)N(CC)CC)=NC2=C1 GOLORTLGFDVFDW-UHFFFAOYSA-N 0.000 abstract description 8
- SATCULPHIDQDRE-UHFFFAOYSA-N piperonal Chemical compound O=CC1=CC=C2OCOC2=C1 SATCULPHIDQDRE-UHFFFAOYSA-N 0.000 abstract description 8
- 239000002253 acid Substances 0.000 abstract description 6
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 abstract description 5
- 239000011734 sodium Substances 0.000 abstract description 5
- 229910052708 sodium Inorganic materials 0.000 abstract description 5
- LVAOBEYIJJPYNL-UHFFFAOYSA-N 2-[(1-sulfonaphthalen-2-yl)methyl]naphthalene-1-sulfonic acid Chemical compound C1=CC2=CC=CC=C2C(S(=O)(=O)O)=C1CC1=CC=C(C=CC=C2)C2=C1S(O)(=O)=O LVAOBEYIJJPYNL-UHFFFAOYSA-N 0.000 abstract description 4
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 abstract description 4
- QXNVGIXVLWOKEQ-UHFFFAOYSA-N Disodium Chemical class [Na][Na] QXNVGIXVLWOKEQ-UHFFFAOYSA-N 0.000 abstract description 4
- 229940081310 piperonal Drugs 0.000 abstract description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 abstract description 3
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 abstract description 3
- IIACRCGMVDHOTQ-UHFFFAOYSA-M sulfamate Chemical compound NS([O-])(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-M 0.000 abstract description 2
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 abstract 1
- 238000013019 agitation Methods 0.000 description 17
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 12
- 229940081974 saccharin Drugs 0.000 description 12
- 235000019204 saccharin Nutrition 0.000 description 12
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 description 12
- 150000002815 nickel Chemical class 0.000 description 5
- AGBXYHCHUYARJY-UHFFFAOYSA-N 2-phenylethenesulfonic acid Chemical compound OS(=O)(=O)C=CC1=CC=CC=C1 AGBXYHCHUYARJY-UHFFFAOYSA-N 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 150000001298 alcohols Chemical class 0.000 description 4
- 125000001931 aliphatic group Chemical group 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000002659 electrodeposit Substances 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 2
- 239000004327 boric acid Substances 0.000 description 2
- ZYGHJZDHTFUPRJ-UHFFFAOYSA-N coumarin Chemical compound C1=CC=C2OC(=O)C=CC2=C1 ZYGHJZDHTFUPRJ-UHFFFAOYSA-N 0.000 description 2
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 2
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 2
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 2
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 2
- MNCGMVDMOKPCSQ-UHDJGPCESA-M sodium;(e)-2-phenylethenesulfonate Chemical compound [Na+].[O-]S(=O)(=O)\C=C\C1=CC=CC=C1 MNCGMVDMOKPCSQ-UHDJGPCESA-M 0.000 description 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 241000080590 Niso Species 0.000 description 1
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 1
- 241000933336 Ziziphus rignonii Species 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000011260 aqueous acid Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229960000956 coumarin Drugs 0.000 description 1
- 235000001671 coumarin Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 238000010907 mechanical stirring Methods 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 235000019333 sodium laurylsulphate Nutrition 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
- C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
- C25D3/18—Heterocyclic compounds
Definitions
- Acid nickel plating bath for obtaining bright nickel deposits, said bath being of the chloride, sulfate, fluoborate or su'lfamate type and containing a brightener mix ture comprising the disodium salt of methylene bis naphthalene sulfonic acid and a second component selected from coumarin, piperonal bisulfite complex, sodium betastyrene sulfonate, benzimidazole and mixtures thereof, With the proviso that benzimidazole is used only when greater than 50 mole percent of nickel salt used in the bath is nickel fluoborate.
- Acid nickel plating baths normally yield dull electrodeposits, but bright deposits can be obtained by the addition of effective amounts of certain organic compounds, known as brighteners.
- the plating bath comprises an aqueous acid solution of nickel salt selected from the group consisting of nickel sulfate, nickel chloride, nickel fluoborate, nickel sulfamate or mixtures thereof.
- Brightener A is the disodium salt of methylene bis naphthalene sulfonic acid and has the structural formula:
- each SO Na group can replace any one hydrogen atom in each naphthalene group.
- Brightener B is selected from the group consisting of:
- Brightener A and Brightener B are each added to the plating both in amounts suflicient to obtain a bright nickel electrodeposit.
- concentration of Brightener A and of Brightener B dissolved in the nickel plating bath independently range from about 0.1 to about 10 grams per liter of plating bath, but not exceeding the saturation concentration thereof. Although some of the brightener compounds have saturation concentrations greater than 10 grams per liter, no advantage is seen from the use of such higher concentration.
- concentrations of Brightener A and Brightener B independently range from about 0.12 to about 2.0 grams per liter but not exceeding the saturation concentration thereof.
- Brightener A and Brightener B can each be added to the nickel plating bath separately, it is preferred that they first be premixed, so that they can be added to the bath in one step.
- This mixture called the brightener mixture, should contain sufiicient amounts of Brightener A and Brightener B so that when the mixture is added to the plating bath, the above-indicated bath concentrations Will be satisfied.
- a convenient method of adding the brightener mixture to the plating bath is to first prepare a solution of the brightener mixture, and then add said solution to the plating bath.
- the solvent used in preparing the solution of brightener mixture should be soluble in the plating bath.
- the solvent is selected from the group consisting of water, aliphatic monohydric alcohols having from 1 to 3 carbon atoms and mixtures thereof.
- the aliphatic monohydric alcohols are methanol, ethanol, npropanol and isopropanol, with isopropanol being preferred.
- the solvent contain at least 25 volume percent alcohol.
- the ratio of Brightener A to Brightener B in the brightener mixture or dissolved in the bath is not critical, but generally the weight ratio varies from about 0.1:1 to about 10:1, preferably from about 0.5:1 to about 2:1.
- the brightener mixtures of this invention are generally compatible with addition agents conventionally employed in plating baths, for example, wetting agents, such as sodium lauryl sulfate and castile soap, antifoam agents, stress relief agents and the like.
- wetting agents such as sodium lauryl sulfate and castile soap, antifoam agents, stress relief agents and the like.
- the brightener mixtures be used in conjunction with saccharin.
- Saccharin has the effect of reducing the stress and brittleness of the nickel deposit and also somewhat increases the brightness of the deposit.
- concentration of saccharin ranges from about 0.1 gram per liter of 3 plating bath to its saturation concentration, preferably from about 0.5 to about 2.0 grams per liter of plating bath.
- Saccharin may be added to the bath separately or it may first be incorporated as part of the brightener mixture.
- the amount of saccharin in the brightener mixture is not critical as long as the amount is sufiicient to supply the above indicated concentrations of saccharin in the bath.
- the weight ratio of saccharin to brightener mixture varies from about 0.1:1 to about :1, preferably from about 1:1 to about 8:1.
- the bright nickel deposit is obtained in conventional manner by passing a current through a nickel plating bath containing Brightener A and Brightener B, between the anode, which is typically nickel, and the cathode, which is the article to be plated.
- plating bath temperatures may vary from about 40 to about 170 F., preferably from about 90 to about 140 F.
- Current density generally ranges from about 1 to about 300 amps per square foot, preferably from about 10 to about 150 amps per square foot.
- current densities as high as 600 amps per square foot can be employed.
- lower current densities are generally employed, usually up to about 80 amps per square foot, with up to about 100 amps per square foot for wires.
- bath pH generally range from about 2.5 to about 5.0, preferably from about 3.5 to about 4.5.
- a bath pH between about 5.0 and about 7.0 can also be employed, but at these pH values, the bath usually requires the addition of nickel complexing agents, e.g. citric acid, malic acid or ammonium hydroxide.
- any conventional means for agitating the bath or for moving the object being plated may be employed.
- Illustrative of such means are mechanical stirring of the bath, passage of compressed air through the bath, cathode rod agitation, and the like.
- the baths listed in the following table illustrate, but do not limit, the types of electroplating baths in which the brightener mixtures of this invention may be incorporated as addition agents in the above indicated proportions.
- the composition ranges generally employed in the art are stated for each of the baths in grams per liter of bath.
- the above nickel baths generally may contain minor amounts of other nickel salts.
- the above fluoborate bath may additionally contain nickel chloride or nickel sulfate, usually in such amounts that at least about mole percent of the nickel salt is nickel fluoborate.
- the preferred bath is a nickel fiuoborate bath wherein the nickel fluoborate concentration ranges from about 220 to 440 grams per liter, especially wherein at least about 80 mole percent of the nickel salt is nickel fluoborate.
- EXAMPLE 1 Tests were carried out in a heated 267 ml. Hull Cell, plating onto brass Hull Cell panels. All samples were compared at one to two amps.
- the plating solution was a nickel fluoborate solution having the following characteristics:
- the various brighteners used and descriptions of the resultant plates are listed in Table 11 'below.
- the units g./1. refer to grams of brightener per liter of plating bath.
- Tamol N is a trademark for a mixture of disodium salts of methylene bis naphthalene sulfonic acid.
- Heloplex is a trademark for piperonal bisulfite complex.
- styrene sulionate plus agitation. 12-..; .15g./l. Tamol N, .15g./l. sodium beta- Do. styrene sulfonate, 1.0 g./1. saccharin. 12A .15 g./l. Tamol N, .15 g./1. sodium beta- Do. styrene sulfonate, 1.0 g./l. saceharin, plus agitation. 13-..: .15 g./l. Heloplex Dull, bright streak at 12 amps/sq. ft. 13A... .15 g./l. Heloplex, plus agitation- Dull with bright streak. 14. .15 g./l. Tamol N, .15 g./l. Heloplex Bright, but pitted. 1 .15 g./l. Tamol N, .15 g./1. Heloplex, Bright.
- Example 2 The tests of Example 1 are repeated using a Watts Nickel type bath having the following characteristics:
- Example 3 The tests of Example 1 are repeated using a nickel sulfamate bath having the following characteristics:
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Description
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US27357472A | 1972-07-20 | 1972-07-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
US3748236A true US3748236A (en) | 1973-07-24 |
Family
ID=23044511
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US00273574A Expired - Lifetime US3748236A (en) | 1972-07-20 | 1972-07-20 | Additive for nickel plating baths |
Country Status (1)
Country | Link |
---|---|
US (1) | US3748236A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110143220A1 (en) * | 2009-12-15 | 2011-06-16 | Basf Se | Thiazole compounds as additives in electrolyte solutions in electrochemical cells and batteries |
CN102888628A (en) * | 2012-10-11 | 2013-01-23 | 合肥奥福表面处理科技有限公司 | Electro-nickelling working solution for PET (polyethylene glycol terephthalate) substrate based FPC (flexible printed circuit) board |
EP3431634A1 (en) * | 2017-06-15 | 2019-01-23 | Rohm and Haas Electronic Materials LLC | Environmentally friendly nickel electroplating compositions and methods |
-
1972
- 1972-07-20 US US00273574A patent/US3748236A/en not_active Expired - Lifetime
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110143220A1 (en) * | 2009-12-15 | 2011-06-16 | Basf Se | Thiazole compounds as additives in electrolyte solutions in electrochemical cells and batteries |
US8940433B2 (en) * | 2009-12-15 | 2015-01-27 | Basf Se | Thiazole compounds as additives in electrolyte solutions in electrochemical cells and batteries |
US9234290B2 (en) | 2009-12-15 | 2016-01-12 | Basf Se | Thiazole compounds as additives in electrolyte solutions in electrochemical cells and batteries |
CN102888628A (en) * | 2012-10-11 | 2013-01-23 | 合肥奥福表面处理科技有限公司 | Electro-nickelling working solution for PET (polyethylene glycol terephthalate) substrate based FPC (flexible printed circuit) board |
CN102888628B (en) * | 2012-10-11 | 2015-04-01 | 合肥奥福表面处理科技有限公司 | Electro-nickelling working solution for PET (polyethylene glycol terephthalate) substrate based FPC (flexible printed circuit) board |
EP3431634A1 (en) * | 2017-06-15 | 2019-01-23 | Rohm and Haas Electronic Materials LLC | Environmentally friendly nickel electroplating compositions and methods |
US10508348B2 (en) | 2017-06-15 | 2019-12-17 | Rohm And Haas Electronic Materials Llc | Environmentally friendly nickel electroplating compositions and methods |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: HENLEY GROUP, INC., THE, 11255 NORTH TORREY PINES Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:ALLIED CORPORATION;REEL/FRAME:004950/0929 Effective date: 19871106 Owner name: HENLEY GROUP, INC., THE, 11255 NORTH TORREY PINES Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:ALLIED CORPORATION;REEL/FRAME:004950/0929 Effective date: 19871106 |
|
AS | Assignment |
Owner name: WELLS FARGO BANK NATIONAL ASSOCIATION Free format text: SECURITY INTEREST;ASSIGNORS:HENLEY MANUFACTURING HOLDING COMPANY, INC.;GENERAL CHEMICAL CORPORATION;PRESTOLITE WIRE CORPORATION;AND OTHERS;REEL/FRAME:005133/0534 Effective date: 19890703 |