US3748236A - Additive for nickel plating baths - Google Patents

Additive for nickel plating baths Download PDF

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US3748236A
US3748236A US00273574A US3748236DA US3748236A US 3748236 A US3748236 A US 3748236A US 00273574 A US00273574 A US 00273574A US 3748236D A US3748236D A US 3748236DA US 3748236 A US3748236 A US 3748236A
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nickel
brightener
bath
bright
tamol
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W Schevey
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Henley Group Inc
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Allied Chemical Corp
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Assigned to HENLEY GROUP, INC., THE, 11255 NORTH TORREY PINES RD, LA JOLLA, CA A CORP. OF DE reassignment HENLEY GROUP, INC., THE, 11255 NORTH TORREY PINES RD, LA JOLLA, CA A CORP. OF DE ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: ALLIED CORPORATION
Assigned to WELLS FARGO BANK NATIONAL ASSOCIATION reassignment WELLS FARGO BANK NATIONAL ASSOCIATION SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: GENERAL CHEMICAL CORPORATION, HENLEY MANUFACTURING HOLDING COMPANY, INC., PRESTOLITE WIRE CORPORATION, PRINTING DEVELOPMENTS, INC., SEMI-ALLOYS, INC., TOLEDO STAMPING & MANUFACTURING COMPANY
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/12Electroplating: Baths therefor from solutions of nickel or cobalt
    • C25D3/14Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
    • C25D3/18Heterocyclic compounds

Definitions

  • Acid nickel plating bath for obtaining bright nickel deposits, said bath being of the chloride, sulfate, fluoborate or su'lfamate type and containing a brightener mix ture comprising the disodium salt of methylene bis naphthalene sulfonic acid and a second component selected from coumarin, piperonal bisulfite complex, sodium betastyrene sulfonate, benzimidazole and mixtures thereof, With the proviso that benzimidazole is used only when greater than 50 mole percent of nickel salt used in the bath is nickel fluoborate.
  • Acid nickel plating baths normally yield dull electrodeposits, but bright deposits can be obtained by the addition of effective amounts of certain organic compounds, known as brighteners.
  • the plating bath comprises an aqueous acid solution of nickel salt selected from the group consisting of nickel sulfate, nickel chloride, nickel fluoborate, nickel sulfamate or mixtures thereof.
  • Brightener A is the disodium salt of methylene bis naphthalene sulfonic acid and has the structural formula:
  • each SO Na group can replace any one hydrogen atom in each naphthalene group.
  • Brightener B is selected from the group consisting of:
  • Brightener A and Brightener B are each added to the plating both in amounts suflicient to obtain a bright nickel electrodeposit.
  • concentration of Brightener A and of Brightener B dissolved in the nickel plating bath independently range from about 0.1 to about 10 grams per liter of plating bath, but not exceeding the saturation concentration thereof. Although some of the brightener compounds have saturation concentrations greater than 10 grams per liter, no advantage is seen from the use of such higher concentration.
  • concentrations of Brightener A and Brightener B independently range from about 0.12 to about 2.0 grams per liter but not exceeding the saturation concentration thereof.
  • Brightener A and Brightener B can each be added to the nickel plating bath separately, it is preferred that they first be premixed, so that they can be added to the bath in one step.
  • This mixture called the brightener mixture, should contain sufiicient amounts of Brightener A and Brightener B so that when the mixture is added to the plating bath, the above-indicated bath concentrations Will be satisfied.
  • a convenient method of adding the brightener mixture to the plating bath is to first prepare a solution of the brightener mixture, and then add said solution to the plating bath.
  • the solvent used in preparing the solution of brightener mixture should be soluble in the plating bath.
  • the solvent is selected from the group consisting of water, aliphatic monohydric alcohols having from 1 to 3 carbon atoms and mixtures thereof.
  • the aliphatic monohydric alcohols are methanol, ethanol, npropanol and isopropanol, with isopropanol being preferred.
  • the solvent contain at least 25 volume percent alcohol.
  • the ratio of Brightener A to Brightener B in the brightener mixture or dissolved in the bath is not critical, but generally the weight ratio varies from about 0.1:1 to about 10:1, preferably from about 0.5:1 to about 2:1.
  • the brightener mixtures of this invention are generally compatible with addition agents conventionally employed in plating baths, for example, wetting agents, such as sodium lauryl sulfate and castile soap, antifoam agents, stress relief agents and the like.
  • wetting agents such as sodium lauryl sulfate and castile soap, antifoam agents, stress relief agents and the like.
  • the brightener mixtures be used in conjunction with saccharin.
  • Saccharin has the effect of reducing the stress and brittleness of the nickel deposit and also somewhat increases the brightness of the deposit.
  • concentration of saccharin ranges from about 0.1 gram per liter of 3 plating bath to its saturation concentration, preferably from about 0.5 to about 2.0 grams per liter of plating bath.
  • Saccharin may be added to the bath separately or it may first be incorporated as part of the brightener mixture.
  • the amount of saccharin in the brightener mixture is not critical as long as the amount is sufiicient to supply the above indicated concentrations of saccharin in the bath.
  • the weight ratio of saccharin to brightener mixture varies from about 0.1:1 to about :1, preferably from about 1:1 to about 8:1.
  • the bright nickel deposit is obtained in conventional manner by passing a current through a nickel plating bath containing Brightener A and Brightener B, between the anode, which is typically nickel, and the cathode, which is the article to be plated.
  • plating bath temperatures may vary from about 40 to about 170 F., preferably from about 90 to about 140 F.
  • Current density generally ranges from about 1 to about 300 amps per square foot, preferably from about 10 to about 150 amps per square foot.
  • current densities as high as 600 amps per square foot can be employed.
  • lower current densities are generally employed, usually up to about 80 amps per square foot, with up to about 100 amps per square foot for wires.
  • bath pH generally range from about 2.5 to about 5.0, preferably from about 3.5 to about 4.5.
  • a bath pH between about 5.0 and about 7.0 can also be employed, but at these pH values, the bath usually requires the addition of nickel complexing agents, e.g. citric acid, malic acid or ammonium hydroxide.
  • any conventional means for agitating the bath or for moving the object being plated may be employed.
  • Illustrative of such means are mechanical stirring of the bath, passage of compressed air through the bath, cathode rod agitation, and the like.
  • the baths listed in the following table illustrate, but do not limit, the types of electroplating baths in which the brightener mixtures of this invention may be incorporated as addition agents in the above indicated proportions.
  • the composition ranges generally employed in the art are stated for each of the baths in grams per liter of bath.
  • the above nickel baths generally may contain minor amounts of other nickel salts.
  • the above fluoborate bath may additionally contain nickel chloride or nickel sulfate, usually in such amounts that at least about mole percent of the nickel salt is nickel fluoborate.
  • the preferred bath is a nickel fiuoborate bath wherein the nickel fluoborate concentration ranges from about 220 to 440 grams per liter, especially wherein at least about 80 mole percent of the nickel salt is nickel fluoborate.
  • EXAMPLE 1 Tests were carried out in a heated 267 ml. Hull Cell, plating onto brass Hull Cell panels. All samples were compared at one to two amps.
  • the plating solution was a nickel fluoborate solution having the following characteristics:
  • the various brighteners used and descriptions of the resultant plates are listed in Table 11 'below.
  • the units g./1. refer to grams of brightener per liter of plating bath.
  • Tamol N is a trademark for a mixture of disodium salts of methylene bis naphthalene sulfonic acid.
  • Heloplex is a trademark for piperonal bisulfite complex.
  • styrene sulionate plus agitation. 12-..; .15g./l. Tamol N, .15g./l. sodium beta- Do. styrene sulfonate, 1.0 g./1. saccharin. 12A .15 g./l. Tamol N, .15 g./1. sodium beta- Do. styrene sulfonate, 1.0 g./l. saceharin, plus agitation. 13-..: .15 g./l. Heloplex Dull, bright streak at 12 amps/sq. ft. 13A... .15 g./l. Heloplex, plus agitation- Dull with bright streak. 14. .15 g./l. Tamol N, .15 g./l. Heloplex Bright, but pitted. 1 .15 g./l. Tamol N, .15 g./1. Heloplex, Bright.
  • Example 2 The tests of Example 1 are repeated using a Watts Nickel type bath having the following characteristics:
  • Example 3 The tests of Example 1 are repeated using a nickel sulfamate bath having the following characteristics:

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

ACID NICKEL PLATING BATH FOR OBTAINING BRIGHT NICKEL DEPOSITS, SAID BATH BEING OF THE CHLORIDE, SULFATE, FLUOBORATE OR SULFAMATE TYPE AND CONTAINING A BRIGHTENER MIXTURE COMPRISING THE DISODIUM SALT OF METHYLENE BIS NAPHTHALENE SULFONIC ACID AND A SECOND COMPONENT SELECTED FROM COUMARIN, PIPERONAL BISULFITE COMPLEX, SODIUM BETASTSYRENE SULFONATE, BENZIMIDAZOLE AND MIXTURES THEREOF, WITH THE PROVISO THAT BENZIMIDAZOLE IS USED ONLY WHEN GREATER THAN 50 MOLE PERCENT OF NICKEL SALT USED IN THE BATH IS NICKEL FLUOBORATE.

Description

United States Patent 3,748,236 ADDITIVE FOR NICKEL PLATING BATHS William R. Schevey, Hawley, Pa, assignor to Allied Chemical Corporation, New York, N.Y. No Drawing. Filed July 20, 1972, Ser. No. 273,574 Int. Cl. C23b 5/08, 5/46 U.S. Cl. 204-49 6 Claims ABSTRACT OF THE DISCLOSURE Acid nickel plating bath for obtaining bright nickel deposits, said bath being of the chloride, sulfate, fluoborate or su'lfamate type and containing a brightener mix ture comprising the disodium salt of methylene bis naphthalene sulfonic acid and a second component selected from coumarin, piperonal bisulfite complex, sodium betastyrene sulfonate, benzimidazole and mixtures thereof, With the proviso that benzimidazole is used only when greater than 50 mole percent of nickel salt used in the bath is nickel fluoborate.
BACKGROUND OF THE INVENTION Acid nickel plating baths normally yield dull electrodeposits, but bright deposits can be obtained by the addition of effective amounts of certain organic compounds, known as brighteners.
It is the object of this invention to provide a novel mixture of brighteners for use in acid nickel plating baths.
It is a further object to provide improved acid nickel bath compositions for bright nickel plating.
It is still another object to provide an improved method for obtaining bright nickel electrodeposits.
SUMMARY OF THE INVENTION It has been discovered that when both Brightener A and Brightener B, defined below, are added in sufiicient amounts to a conventional acid nickel plating bath of the sulfate, chloride, fluoborate or sulfamate type, a bright nickel electrodeposit is obtained which is superior to the deposit obtained when only one of Brightener A or Brightener B is added to the bath.
The plating bath comprises an aqueous acid solution of nickel salt selected from the group consisting of nickel sulfate, nickel chloride, nickel fluoborate, nickel sulfamate or mixtures thereof.
Brightener A is the disodium salt of methylene bis naphthalene sulfonic acid and has the structural formula:
Q oH,-@ j NaOaS SOaNa wherein each SO Na group can replace any one hydrogen atom in each naphthalene group.
Brightener B is selected from the group consisting of:
(l) Coumarin, having the structural formula:
(2) Piperonal bisulfite complex, having the structural formula:
OaNa Patented July 24, 1973 (3) Sodium beta-styrene sulfonate, having the structural formula:
HC=OSOaNa (4) Benzimidazole, having the structural formula:
DETAILED DESCRIPTION Brightener A and Brightener B are each added to the plating both in amounts suflicient to obtain a bright nickel electrodeposit. Generally, the concentration of Brightener A and of Brightener B dissolved in the nickel plating bath independently range from about 0.1 to about 10 grams per liter of plating bath, but not exceeding the saturation concentration thereof. Although some of the brightener compounds have saturation concentrations greater than 10 grams per liter, no advantage is seen from the use of such higher concentration. Preferably the concentrations of Brightener A and Brightener B independently range from about 0.12 to about 2.0 grams per liter but not exceeding the saturation concentration thereof.
While Brightener A and Brightener B can each be added to the nickel plating bath separately, it is preferred that they first be premixed, so that they can be added to the bath in one step. This mixture, called the brightener mixture, should contain sufiicient amounts of Brightener A and Brightener B so that when the mixture is added to the plating bath, the above-indicated bath concentrations Will be satisfied.
A convenient method of adding the brightener mixture to the plating bath is to first prepare a solution of the brightener mixture, and then add said solution to the plating bath. The solvent used in preparing the solution of brightener mixture should be soluble in the plating bath. Preferably the solvent is selected from the group consisting of water, aliphatic monohydric alcohols having from 1 to 3 carbon atoms and mixtures thereof. The aliphatic monohydric alcohols are methanol, ethanol, npropanol and isopropanol, with isopropanol being preferred. When the brightener mixture includes coumarin, it is preferred that the solvent contain at least 25 volume percent alcohol.
The ratio of Brightener A to Brightener B in the brightener mixture or dissolved in the bath is not critical, but generally the weight ratio varies from about 0.1:1 to about 10:1, preferably from about 0.5:1 to about 2:1.
The brightener mixtures of this invention are generally compatible with addition agents conventionally employed in plating baths, for example, wetting agents, such as sodium lauryl sulfate and castile soap, antifoam agents, stress relief agents and the like.
It is a preferred embodiment of this invention that the brightener mixtures be used in conjunction with saccharin. Saccharin has the effect of reducing the stress and brittleness of the nickel deposit and also somewhat increases the brightness of the deposit. Generally, the concentration of saccharin ranges from about 0.1 gram per liter of 3 plating bath to its saturation concentration, preferably from about 0.5 to about 2.0 grams per liter of plating bath.
Saccharin may be added to the bath separately or it may first be incorporated as part of the brightener mixture. In the latter case, the amount of saccharin in the brightener mixture is not critical as long as the amount is sufiicient to supply the above indicated concentrations of saccharin in the bath. Generally, the weight ratio of saccharin to brightener mixture varies from about 0.1:1 to about :1, preferably from about 1:1 to about 8:1.
The bright nickel deposit is obtained in conventional manner by passing a current through a nickel plating bath containing Brightener A and Brightener B, between the anode, which is typically nickel, and the cathode, which is the article to be plated.
Temperature, current density, pH, and other operating conditions are relevant only as far as they influence the basic characteristics of the plating bath in known manner. Thus operating conditions commonly employed with the conventional nickel plating solutions may be employed when those solutions contain the brightener mixtures.
Generally, plating bath temperatures may vary from about 40 to about 170 F., preferably from about 90 to about 140 F.
Current density generally ranges from about 1 to about 300 amps per square foot, preferably from about 10 to about 150 amps per square foot. For plating of wires, current densities as high as 600 amps per square foot can be employed. With Watts nickel type baths,'however, lower current densities are generally employed, usually up to about 80 amps per square foot, with up to about 100 amps per square foot for wires.
Values for bath pH generally range from about 2.5 to about 5.0, preferably from about 3.5 to about 4.5. A bath pH between about 5.0 and about 7.0 can also be employed, but at these pH values, the bath usually requires the addition of nickel complexing agents, e.g. citric acid, malic acid or ammonium hydroxide.
It is preferred that during the plating process relative movement be provided between the plating bath and the object being plated. Any conventional means for agitating the bath or for moving the object being plated may be employed. Illustrative of such means are mechanical stirring of the bath, passage of compressed air through the bath, cathode rod agitation, and the like.
The baths listed in the following table illustrate, but do not limit, the types of electroplating baths in which the brightener mixtures of this invention may be incorporated as addition agents in the above indicated proportions. The composition ranges generally employed in the art are stated for each of the baths in grams per liter of bath.
The above nickel baths generally may contain minor amounts of other nickel salts. For example, the above fluoborate bath may additionally contain nickel chloride or nickel sulfate, usually in such amounts that at least about mole percent of the nickel salt is nickel fluoborate.
The preferred bath is a nickel fiuoborate bath wherein the nickel fluoborate concentration ranges from about 220 to 440 grams per liter, especially wherein at least about 80 mole percent of the nickel salt is nickel fluoborate.
The invention can be more fully understood by reference to the following examples.
EXAMPLE 1 Tests were carried out in a heated 267 ml. Hull Cell, plating onto brass Hull Cell panels. All samples were compared at one to two amps. The plating solution was a nickel fluoborate solution having the following characteristics:
Ni(B F 440 grams/liter. pH 4.
Temperature F.
Runs were made both with and without air agitation of the solutions.
The various brighteners used and descriptions of the resultant plates are listed in Table 11 'below. In Table II the units g./1. refer to grams of brightener per liter of plating bath. The term Tamol N is a trademark for a mixture of disodium salts of methylene bis naphthalene sulfonic acid. The term Heloplex is a trademark for piperonal bisulfite complex.
TABLE II Brightener Plate description 1 Blank Dull. 1A Blank, plus agitation Do. 2 .15 g./1. Tamol N. Brighgtbelow 20 amps] S 2A .15 g./l. Tamol N, plus agitation Do. 3- .15 g./l. Tamol N, 1.0 g./l. saccharin. Semi-bright. 3A.... .15 g./l. Tamol N, 1.0 gJl. saceharin, 0.
plus agitation. 4 .15 g./l. coumarin Dull. 411."- .15 g./l. cournarin, plus agitation. Dull with bright spots. 5 .15 g./l. coumarin, .15 g./l. Tamol N Brimght liiwith gas bubble S rea 5. 5A .15 gJi. coumarin, .15 g./l. Tamol N, Bright.
plus agitation. 6-.. .15 g./i. coumarin, .15 g./l. Taanol N, Bright, but pitted.
1.0 g./l. saccharin. 6A.-.. .15 g./l. coumarin, .15 g./l. Ta-mol N, Bright.
1.0 gjl. saceharin, plus agitation. 7 c .15 g.ll. benzimidazole Dull with bright spots. 7A..-. .15 g./l. benzimidazole, plus agitation Do. 8-.." .15g1./l. Tamol N, .15 g./l. benzimida- Bright.
Z0 8. 8A.... .15 gJl. Tamol N, .15 g./l. benzimida- Do.
2016, plus agitation. 9..-.. 15 g./l. Tamol N, .15 gJl. benzim1da- Bright, put pitted.
zole, 1.0 g./l. saceharin. 9A--.. .15 g./l. Tamol N, .15 gJl. benzimida- Bright. zgle, 1.0 g./l. saccharin, plus agitaion. 10. .15 g./l. sodium beta-styrene sulionate. Semi-bright. 10A... .15 g./l. sodium beta-styrene sulfonate, Do.
plus agitation. 11 .15 g./l. Tamol N, .15 g./l. sodium beta- Semi-bright (but styrene sulfonate. brighter than run 10). 11A... .15 g./l. Tamol N, .15 g./l. sodium beta Bright.
styrene sulionate, plus agitation. 12-..; .15g./l. Tamol N, .15g./l. sodium beta- Do. styrene sulfonate, 1.0 g./1. saccharin. 12A .15 g./l. Tamol N, .15 g./1. sodium beta- Do. styrene sulfonate, 1.0 g./l. saceharin, plus agitation. 13-..: .15 g./l. Heloplex Dull, bright streak at 12 amps/sq. ft. 13A... .15 g./l. Heloplex, plus agitation- Dull with bright streak. 14. .15 g./l. Tamol N, .15 g./l. Heloplex Bright, but pitted. 1 .15 g./l. Tamol N, .15 g./1. Heloplex, Bright.
plus agitation. 15...; .15 g./l. Tarnol N, .15 gJl. Heloplex, Do.
1.0 g./1. saceharin. 15A... .15 g.ll. Tamol N, .15 g./l. Heloplex, Do.
1.0 g./l. saceharin,1p1us agitation. 16 .15 g./l. eonmarin, .15 g./l Isodium beta- Dull.
styrene sulfonate. 16A .15 g./l. eoumarin, .15g.ll.1s0dium betar Dull with brights spots.
styrene sulionate, plus agitation. 17-..: :15 g./l. Heloplex, .15 g./l. coumarin- Do. 18---- .15 g./l. Heloplex, .15 g./l.1eoumarin, Do.
1.0 g.[l. sacoharin. 19.-.- .15 g./l. Heloplex, .15 g./l. benzimida- Bright streaks.
zole. 20- .15 g.ll. Heloplex, .15 g./1. benzimida- Dull with bright spots.
zole, 1.0 g./l. saecharin. 20A-.. :15 g./l. Heloplex, .15 g./l. benzunidw Do.
min, 1.0 g./l saccharin, plus agitation.
Example 2 The tests of Example 1 are repeated using a Watts Nickel type bath having the following characteristics:
NiSO 6H O grams/liter 300 NiCl 6H O do 45 Boric acid do 30 P 4 Temperature F 110 Results substantially similar to those of Example 1 are obtained, except that no brightening is observed when brightener mixtures containing benzimidazole are used.
Example 3 The tests of Example 1 are repeated using a nickel sulfamate bath having the following characteristics:
Ni(NH SO grams/liter 300 Boric acid do 30 pH 4 Temperature F 110 2. The brightener mixture of claim 1 wherein the weight ratio of Brightener A to Brightener B varies from about 0.121 to about 10:1.
3. The brightener mixture of claim 1 wherein the weight ratio of Brightener A to Brightener B various from about 0.5:1 to about 2:1.
4. The brightener mixture of claim 3 which additionally contains saccharin.
5. A solution of the brightener mixture of claim 2 in water, aliphatic monohydric alcohols having from 1 to 3 carbon atoms, or mixtures thereof.
6. A solution of the brightener mixture of claim 1 in water, aliphatic monohydric alcohols having from 1 to 3 carbon atoms, or mixtures thereof.
References Cited UNITED STATES PATENTS 2,774,728 12/ 1956 .Wernlund 20452 Y 2,841,542 7/1958 Manquen 20452 Y 2,854,389 9/1958 Boelter, Jr. 20452 Y 2,885,331 5/1959 McLeod et a1 20452 Y 2,970,951 2/ 1961 Manquen et a1. 20452 Y 3,296,101 1/19'67 Crain 20452 Y 3,661,731 5/ 1972 Schevey 20449 GERALD L. KAPLAN, Primary Examiner US. Cl. X.R. 204-DIG 2
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110143220A1 (en) * 2009-12-15 2011-06-16 Basf Se Thiazole compounds as additives in electrolyte solutions in electrochemical cells and batteries
CN102888628A (en) * 2012-10-11 2013-01-23 合肥奥福表面处理科技有限公司 Electro-nickelling working solution for PET (polyethylene glycol terephthalate) substrate based FPC (flexible printed circuit) board
EP3431634A1 (en) * 2017-06-15 2019-01-23 Rohm and Haas Electronic Materials LLC Environmentally friendly nickel electroplating compositions and methods

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110143220A1 (en) * 2009-12-15 2011-06-16 Basf Se Thiazole compounds as additives in electrolyte solutions in electrochemical cells and batteries
US8940433B2 (en) * 2009-12-15 2015-01-27 Basf Se Thiazole compounds as additives in electrolyte solutions in electrochemical cells and batteries
US9234290B2 (en) 2009-12-15 2016-01-12 Basf Se Thiazole compounds as additives in electrolyte solutions in electrochemical cells and batteries
CN102888628A (en) * 2012-10-11 2013-01-23 合肥奥福表面处理科技有限公司 Electro-nickelling working solution for PET (polyethylene glycol terephthalate) substrate based FPC (flexible printed circuit) board
CN102888628B (en) * 2012-10-11 2015-04-01 合肥奥福表面处理科技有限公司 Electro-nickelling working solution for PET (polyethylene glycol terephthalate) substrate based FPC (flexible printed circuit) board
EP3431634A1 (en) * 2017-06-15 2019-01-23 Rohm and Haas Electronic Materials LLC Environmentally friendly nickel electroplating compositions and methods
US10508348B2 (en) 2017-06-15 2019-12-17 Rohm And Haas Electronic Materials Llc Environmentally friendly nickel electroplating compositions and methods

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