US2903403A - Method of copper-plating metal surfaces - Google Patents

Method of copper-plating metal surfaces Download PDF

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Publication number
US2903403A
US2903403A US458983A US45898354A US2903403A US 2903403 A US2903403 A US 2903403A US 458983 A US458983 A US 458983A US 45898354 A US45898354 A US 45898354A US 2903403 A US2903403 A US 2903403A
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United States
Prior art keywords
objects
copper
acid
metal
pickling
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Expired - Lifetime
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US458983A
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English (en)
Inventor
Strauss Wennemar
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Dehydag Deutsche Hydrierwerke GmbH
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Dehydag Gmbh
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • C23G1/04—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors
    • C23G1/06—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors organic inhibitors
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • C23G1/04—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors
    • C23G1/06—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors organic inhibitors
    • C23G1/065—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors organic inhibitors sulfur-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated

Definitions

  • This invention relates to a method of copper-plating metal surfaces, and more particularly to a: method of copper-plating the surfaces of objects made of nonprecious metals.
  • the prior art discloses a great number of processes for depositing copper plates uponthe surfaces of metal objects.
  • these processes comprise first depositing a thin base coating of copper on the metal surface by immersing the object in a solution of a suitable copper salt containing a cyanide compound and finally depositing the desired ultimate copper plate upon the pre-treated surface either by the well-known dipping process or by electrolysis.
  • the preliminary step of providing the metal surface with a base coating of copper prior toapplying the final copper plate is considered by the art to be indispensable to the production of good copper plates by electrolytic as well as other means.
  • Another object of this invention is to provide a method of depositing a copper plate upon the surface of objects made of non-precious metals whereby the final copper deposit can be applied directly to the clean metal surface of such objects.
  • objects made of non-precious metals such as iron, electrochemicallyactive steel, zinc, alumi num, and the like, can be copper-plated in an acid plating bath directly and without providing them with a preliminary'thin copper deposit by contacting such objects prior to the plating step, preferably immediately prior thereto, with an acid pickling bath which contains an inhibitor having a strong inhibiting effect.
  • the inhibiting effect of a compound suitable for use as an inhibitor in conjunction with the surface treatment of metal objects in acid pickling or plating baths can be defined as its capability of reducing the amount of hydrogen liberated by the attack of the acid bath upon the metal surface.
  • the inhibiting elfect of an inhibitor for pickling and electroplating baths is to a certain degree equivalent to its corrosion-preventing effect and can be expressed in terms of the fractional amount of the maximum amount of hydrogen liberated by an acid bath which does not contain a corrosion-preventing additive.
  • the largest amount of hydrogen liberated by the attack of an acid pickling or plating bath-when no inhibitor is added corresponds to a corrosion-preventing effect of By adding inhibitors to such baths the amount of hydrogen ice .
  • inhibiting compounds are characterized in that they retard the electrochemical exchange on the metal surface and prevent the combination of the metal with oxygen, both by adsorption.
  • the adsorptive action of inhibiting compounds added to the acid pickling bath results in minimizing the attack of the pickling solution on the virgin metal surface without appreciably retarding the rate of dissolution ofsurface scale, rust or dirt on the metal surface.
  • Compounds which are suitable for use as inhibitors in the acid pickling bath and obviate the deposition of thin base coatings of copper on the metal objects prior to the application of the final copper plate thereon include organic acyclic or cyclic oxygen-, sulfuror nitrogen-containing compounds such as, for example, phenols, alcohols, aldehydes, ketones, sulfonic acids, sulfides, disulfides, sulfoxides or sulfones, aliphatic, cycloaliphatic, aromatic or heterocyclic bases, as Well as quaternary ammonium salts and other onium compounds, alkanolamines, especially triethanolamine andits salts, thiourea and its derivatives, and derivatives of guanidine and the like.
  • organic acyclic or cyclic oxygen-, sulfuror nitrogen-containing compounds such as, for example, phenols, alcohols, aldehydes, ketones, sulfonic acids, sulfides, disulfides
  • the adhering qualities of copper deposits applied to metal surfaces treated in pickling baths containing the above inhibitors can be further improved by adding to the pickling bath inorganic or organic reducing agents suchas, for example, bivalent tin chloride, sodium sulfite, sodium bisulfate, hydrazine sulfate and the like.
  • inorganic or organic reducing agents suchas, for example, bivalent tin chloride, sodium sulfite, sodium bisulfate, hydrazine sulfate and the like.
  • brightening agents which not only enhance the brightness of the copper deposit, but also act as inhibitors by retarding the electrochemical exchange on the metal surface by adsorption.
  • brightening agents which have such dual characteristics are organic sulfonic acidsor their salts having the general structural formula aniline, lactic acid, as well as molasses, syrup, starch,
  • Betaine salts of isothiourea-S-butane-w-sulfonic acid Betaine salts of N-phenyl-isothiourea-S-butane-w-sulfonic acid 2-mercaptobenzothiazole-S-propane-w-potassium sulfonate Thiocyanic acid-S-n-propylester-w-sodium sulfonate 2-thiobenzooxazole-Spropane-w-sodium sulfonate 2-thiometoxazine-s-butane-w-potassium sulfonate N,N-dimethyl-dithiocarbamic acid-n-propylester-w-sodium sulfonate N,N-pentamethylene-dithiocarbamic acid-n-propylester-wsodium sulfonate N-butyl-dithiocarbamic acid-n-butylester-w
  • the final copper deposit may be applied directly to the pickled metal surface with the aid of the well-known dipping process or also by the usual electroplating process employing an electric current.
  • the methods usually ernployed in copper-plating metal objects need not be changed.
  • the basic pickling bath consists of the usual inorganic or organic acids or acid salts, particularly sulfuric acid, and the pickling and plating baths may also contain the usual wetting agents.
  • the plating bath may also contain any of the well-known agents which promote the formation of smooth copper plates as well as other brightening agents and porosity reducing agents.
  • the basic plating baths may consist of any of the well-known and usually employed copper salt solutions.
  • the method in accordance with my invention may be employed in copper-plating any non-precious metal such as iron, electrochemically active steel, zinc, aluminum, magnesium, and alloys thereof.
  • Sheet iron was first pickled in a pickling bath consisting of a 2 N-sulfuric acid solution and containing 0.1% to 0.5% dibenzylsulfide as an inhibitor. Thereafter the pickled sheet iron was electroplated in a copper sulfate solution containing 0.5 -gm./liter dibenzylsulfoxide and 0.1 gm./liter thiourea, at room temperature and with a current density of 3 amps./dm. The copper deposit 4 produced thereby adhered well to the surface of the sheet 11011.
  • Example II Objects made of iron were pickled in a pickling bath of 2 n-sulfuric acid containing 0.1% to 0.5% dibenzylsulfoxide as an inhibitor. Subsequently the pickled metal objects were electroplated in a copper sulfate bath which contained 0.5 gm./liter N,N-dimethyl-dithiocarbamic acid-n-butylester-w-sodium sulfonate, at room temperature and with a current density of 4 amp./dm. The copper deposits produced thereby had excellent adhering properties.
  • Example Ill Objects made of sheet iron were pickled for 1 to 10 minutes in a pickling bath containing 1 gm./liter N,N- diethyl-dithiocarbamic acid-n-propylester-w-sodium sulfonate as an inhibitor.
  • the pickled sheet iron objects were then copper plated at room temperature and with a current density of 5 amp./dm. in a copper sulfate solution which contained 1 gm./liter of N,N-diethyl-dithiocarbamic acid-n-propylester-w-sodium sulfonate as a brightening agent and inhibitor.
  • the copper deposits produced thereby adhered very well to the metal surface and were bright and lustrous.
  • Example IV Sheet iron was pickled in a 2 N-sulfuric acid solution which also contained 1 gm./liter of the betaine salt of isothiourea-S-propane-w-sulfonic acid as an inhibitor. Subsequently the pickled sheet iron was immersed for 2 minutes in a copper sulfate solution which also contained 1 gm./liter of the above betaine salt as a brightening agent and inhibitor. A bright and well-adhering copper deposit was produced thereby on the surface of the sheet iron, which was sufiicient for a variety of uses and further treatment.
  • dip-plated sheets were then further copper-plated by electrolysis in a copper sulfate bath containing 1 gm./liter of the betaine salt of isothiourea-S- propane-w-sulfonic acid.
  • the copper deposits obtained Objects made of sheet iron were pickled in a 2 N-sulfuric acid solution containing 5 gm./liter bivalent tin chloride and 1 gm./liter N,N-pentamethylene-dithiocarbamic acid-n-propylester-w-sodium sulfonate as an inhibitor.
  • the pickled sheet iron objects were then dipped in a copper sulfate bath containing 1 gm./liter of N,N- pentamethylene dithiocarbamic acid-n-propylester-w-sodium sulfonate as a brightening agent and inhibitor.
  • the copper deposits produced thereby had excellent brightness properties and adhered to the metal surfaces even more completely than those obtained in Example IV.
  • a few of these dip-plated objects were then electroplated in a copper sulfate bath as in Example IV. The copper deposits obtained were bright and lustrous and adhered very well to the surface of the objects.
  • the method of producing copper deposits on surfaces of metal objects comprising pickling said objects in an acid pickling bath containing dibenzylsulfide as an inhibitor, and thereafter applying the final copper plate directly to the pickled objects on which a layer of inhibitor from said pickling bath solution remains adherent by electroplating said objects in an acid solution of copper sulfate, said solution containing small amounts of dibenzylsulfoxide and thiourea.
  • the method of producing copper deposits on surfaces of metal objects comprising pickling said objects in an acid pickling bath containing dibenzylsulfoxide as an inhibitor, and thereafter applying the final copper plate directly to the pickled objects on which a layer of inhibitor from said pickling bath solution remains adherent by electroplating said objects in an acid solution of copper sulfate, said solution containing small amounts of N,N-dimethyl-dithiocarbamic acid n-butylester-w-sodium sulfonate.
  • the method of producing copper deposits on surfaces of metal objects comprising pickling said objects in an acid pickling bath containing an inhibitor compound having an inhibiting effect of at least 50% and thereafter applying the final copper plate directly to the pickled surface of said objects to which a quantity of pickling bath solution remains adherent by electro plating said objects in an acid solution of a copper salt.
  • the method of producing copper deposits on surfaces of metal objects said metal being selected from the group consisting or iron, zinc, aluminum and electrochemically active steels, which comprises pickling said objects in an acid pickling bath containing an inhibitor having an inhibiting effect of at least 50% and thereafter applying the final copper plate directly to the pickled surface of said objects to which a quantity of pickling bath solution remains adherent by electroplating said objects in an acid solution of a copper salt, said solution containing a brightening agent.
  • the method of producing copper deposits on surfaces of metal objects comprising pickling said objects in an acid pickling bath containing an inhibitor having an inhibiting effect of at least 50% and thereafter applying the final copper plate directly to the pickled surface of said objects to which a quantity of pickling bath solution remains adherent, by electroplating said objects in an acid solution of a copper salt, said solution containing an inhibitor.
  • the method of producing copper deposits on surfaces of metal objects said metal being selected from the group consisting or iron, zinc, aluminum and electrochemically active steels, which comprises pickling said objects in an acid pickling bath containing an inhibitor having an inhibiting effect of at least 50%, and thereafter applying the final copper plate directly to the pickled surface of said objects to which a quantity of pickling bath solution remains adherent by electroplating said objects in an acid solution of a copper salt, said solution containing a brightening agent and an inhibitor.
  • the method of producing copper deposits on surfaces of metal objects said metal being selected from the group consisting or iron, zinc, aluminum and electrochemically active steels, which comprises pickling said objects in an acid pickling bath containing N,Ndiethyldithiocanbamic acid-n-propylester-w-sodium sulfonate, and thereafter applying the final copper plate directly to the pickled surface of said objects on which a layer of inhibitor from said pickling bath solution remains adherent by electroplating said objects in an acid solution of copper sulfate, said solution containing small amounts of N,N-diethyl-dithiocanbamic acid-n-propylester-w-sodiurn sulfonate.
  • the method of producing copper deposits on surfaces of objects said metal being selected from the group consisting of iron, zinc, aluminum and electrochemically active steels which comprises pickling said objects in an acid pickling bath containing a small amount of the betaine salt of isothiourea-S-propane-w-sulfonic acid, and thereafter applying the final copper plate directly to the pickled objects on which a layer of inhibitor from said pickling bath solution remains adherent by contacting said objects with an acid solution of copper sulfate, said solution containing the betaine salt of isothiourea-S-propane-w-sulfonic acid.
  • the method of producing copper deposits on surfaces of metal objects comprising pickling said objects in an acid pickling bath containing bivalent tin chloride and N,N-pentamethylene-dithiocarbamic acidn-propylester-w-sodium sulfonate, and thereafter applying the final copper plate directly to the pickled objects on which a layer of inhibitor from said pickling bath solution remains adherent by contacting said objects with an acid solution of copper sulfate, said solution containing N,N-pentamethylene-dithiocarbamic acid-n-propyb ester-w-sodium sulfonate.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
US458983A 1954-02-10 1954-09-28 Method of copper-plating metal surfaces Expired - Lifetime US2903403A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DED16985A DE962489C (de) 1954-02-10 1954-02-10 Sparbeizmittel zum Schutze von Metallen bei der Behandlung mit sauren Mitteln
DED18909D DE969855C (de) 1954-02-10 1954-10-19 Verfahren zur Herstellung von Kupferueberzuegen auf unedlen Metallen

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US458983A Expired - Lifetime US2903403A (en) 1954-02-10 1954-09-28 Method of copper-plating metal surfaces
US487224A Expired - Lifetime US2956956A (en) 1954-02-10 1955-02-09 Inhibitors for acid solutions employed in the surface treatment of metals

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US487224A Expired - Lifetime US2956956A (en) 1954-02-10 1955-02-09 Inhibitors for acid solutions employed in the surface treatment of metals

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US (2) US2903403A (en:Method)
BE (1) BE535282A (en:Method)
CH (1) CH363211A (en:Method)
DE (3) DE962489C (en:Method)
FR (2) FR1127418A (en:Method)
GB (2) GB784091A (en:Method)
NL (1) NL108797C (en:Method)

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US3219557A (en) * 1962-04-12 1965-11-23 Pacific Scientific Co Method of producing a rotary coupling
US3649350A (en) * 1970-06-29 1972-03-14 Gen Electric Electroless copper plating
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US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
US4532014A (en) * 1984-11-13 1985-07-30 Olin Corporation Laser alignment system
US4549941A (en) * 1984-11-13 1985-10-29 Olin Corporation Electrochemical surface preparation for improving the adhesive properties of metallic surfaces
US4549950A (en) * 1984-11-13 1985-10-29 Olin Corporation Systems for producing electroplated and/or treated metal foil
US4568431A (en) * 1984-11-13 1986-02-04 Olin Corporation Process for producing electroplated and/or treated metal foil
US5421985A (en) * 1990-05-30 1995-06-06 Gould Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations
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US20040074778A1 (en) * 2001-10-02 2004-04-22 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
FR2899600A1 (fr) * 2006-04-06 2007-10-12 Technologies Moleculaires Tecm Inhibiteurs conditionnels tensioactifs pour le depot electrolytique du cuivre sur une surface
US20150144019A1 (en) * 2012-05-18 2015-05-28 Nammo Vanasverken Ab Lead-free ammunition for small-bore weapons
CN111910222A (zh) * 2020-08-21 2020-11-10 九江德福科技股份有限公司 一种兼具光亮及整平作用的电解铜箔添加剂及应用

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US3948851A (en) * 1973-12-28 1976-04-06 General Electric Company Flame retardant polycarbonate composition
US3978024A (en) * 1973-12-28 1976-08-31 General Electric Company Flame retardant polycarbonate composition
US3940366A (en) * 1973-12-28 1976-02-24 General Electric Company Flame retardant polycarbonate composition
US4370256A (en) * 1977-01-17 1983-01-25 The Dow Chemical Company Corrosion inhibitor for aluminum in aqueous acids
US4141750A (en) * 1977-07-01 1979-02-27 The Plasmine Corporation Ammonia containing rosin sizes
DE2965334D1 (en) * 1979-01-03 1983-06-16 Amchem Prod Dithiocarbamate/sulfonium salt corrosion inhibitor composition and its use in acidic cleaning solutions
US4304681A (en) * 1980-09-15 1981-12-08 Shipley Company, Inc. Novel stripping composition for positive photoresists and method of using same
IT1144797B (it) * 1981-10-14 1986-10-29 Alfachimici Spa Soluzione per l asportazione di stagno o lega stagno piombo da un substrato mediante operazione a spruzzo
GB8608797D0 (en) * 1986-04-11 1986-05-14 Pyrene Chemical Services Ltd Compositions for abrasive blast cleaning
DE102005055768A1 (de) * 2005-11-21 2007-05-24 Ralf Waldmann Verfahren und Mittel zur elektrolytischen Reinigung und Entzunderung eines metallischen Werkstücks
CN103602999A (zh) * 2013-11-18 2014-02-26 中国神华能源股份有限公司 酸洗剂组合物和海水淡化装置的酸洗方法

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US2217921A (en) * 1938-03-23 1940-10-15 American Chem Paint Co Art of drawing ferrous metal
US2363973A (en) * 1939-07-08 1944-11-28 Revere Copper & Brass Inc Method of copper plating stainless steel cooking vessels
US2389181A (en) * 1941-05-15 1945-11-20 Udylite Corp Electrodeposition of metals
US2366737A (en) * 1941-05-27 1945-01-09 Du Pont 1,3-dioxolane modified organic products
US2424887A (en) * 1941-10-11 1947-07-29 Houdaille Hershey Corp Method and electrolyte for the electrodeposition of metals
US2410844A (en) * 1942-01-14 1946-11-12 Du Pont Metal plating process
GB602591A (en) * 1945-02-12 1948-05-31 Du Pont Improvements in or relating to the electro-deposition of metals
US2511988A (en) * 1945-05-09 1950-06-20 Columbia Steel Company Pickling process
GB637453A (en) * 1946-02-02 1950-05-17 Pennsylvania Salt Mfg Co Improvements in or relating to metal pickling
US2563229A (en) * 1948-06-25 1951-08-07 Battelle Development Corp Method of producing bright electroplate on electropolished surfaces
US2560979A (en) * 1948-07-30 1951-07-17 Padio Corp Of America Chemical deposition of metallic films
DE888493C (de) * 1951-11-03 1953-09-03 Hydrierwerke A G Deutsche Verfahren zur Herstellung festhaftender und glaenzender galvanischer Kupferueberzuege
US2700020A (en) * 1952-06-02 1955-01-18 Houdaille Hershey Corp Plating copper
US2742412A (en) * 1952-07-05 1956-04-17 Metallic Industry Nv Electrolytic deposition of copper

Cited By (22)

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US3075899A (en) * 1958-04-26 1963-01-29 Dehydag Gmbh Baths for the production of metal electroplates
US3219557A (en) * 1962-04-12 1965-11-23 Pacific Scientific Co Method of producing a rotary coupling
US3664933A (en) * 1969-06-19 1972-05-23 Udylite Corp Process for acid copper plating of zinc
US3649350A (en) * 1970-06-29 1972-03-14 Gen Electric Electroless copper plating
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
US4532014A (en) * 1984-11-13 1985-07-30 Olin Corporation Laser alignment system
US4549941A (en) * 1984-11-13 1985-10-29 Olin Corporation Electrochemical surface preparation for improving the adhesive properties of metallic surfaces
US4549950A (en) * 1984-11-13 1985-10-29 Olin Corporation Systems for producing electroplated and/or treated metal foil
US4568431A (en) * 1984-11-13 1986-02-04 Olin Corporation Process for producing electroplated and/or treated metal foil
US5454926A (en) * 1990-05-30 1995-10-03 Gould Electronics Inc. Electrodeposited copper foil
US5421985A (en) * 1990-05-30 1995-06-06 Gould Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations
EP1026286A3 (en) * 1999-01-26 2000-12-27 Ebara Corporation Method and apparatus for plating substrate with copper
US6638411B1 (en) 1999-01-26 2003-10-28 Ebara Corporation Method and apparatus for plating substrate with copper
US20040050711A1 (en) * 1999-01-26 2004-03-18 Koji Mishima Method and apparatus for plating substrate with copper
EP1152071A1 (en) * 1999-01-28 2001-11-07 Electroplating Engineers of Japan Limited Copper plating method
US20040074778A1 (en) * 2001-10-02 2004-04-22 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
FR2899600A1 (fr) * 2006-04-06 2007-10-12 Technologies Moleculaires Tecm Inhibiteurs conditionnels tensioactifs pour le depot electrolytique du cuivre sur une surface
WO2007118985A1 (fr) * 2006-04-06 2007-10-25 Technologies Moleculaires (Tecmo) Inhibiteurs conditionnels tensioactifs pour le dépot electrolytique du cuivre sur une surface
US20100243467A1 (en) * 2006-04-06 2010-09-30 Daniel Michelet Surface-active conditional inhibitors for the electroplating of copper on a surface
US20150144019A1 (en) * 2012-05-18 2015-05-28 Nammo Vanasverken Ab Lead-free ammunition for small-bore weapons
CN111910222A (zh) * 2020-08-21 2020-11-10 九江德福科技股份有限公司 一种兼具光亮及整平作用的电解铜箔添加剂及应用
CN111910222B (zh) * 2020-08-21 2022-08-23 九江德福科技股份有限公司 一种兼具光亮及整平作用的电解铜箔添加剂及应用

Also Published As

Publication number Publication date
GB811773A (en) 1959-04-15
US2956956A (en) 1960-10-18
GB784091A (en) 1957-10-02
DE969855C (de) 1958-07-24
NL108797C (en:Method) 1964-07-15
DE969005C (de) 1958-04-17
DE962489C (de) 1957-04-25
FR1127418A (fr) 1956-12-17
CH363211A (de) 1962-07-15
BE535282A (en:Method) 1958-12-05
FR68296E (fr) 1958-04-28

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