US20230145335A1 - Rotational devices including coated surfaces - Google Patents

Rotational devices including coated surfaces Download PDF

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Publication number
US20230145335A1
US20230145335A1 US17/844,406 US202217844406A US2023145335A1 US 20230145335 A1 US20230145335 A1 US 20230145335A1 US 202217844406 A US202217844406 A US 202217844406A US 2023145335 A1 US2023145335 A1 US 2023145335A1
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United States
Prior art keywords
layer
nickel
alloy
molybdenum
coating
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Pending
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US17/844,406
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English (en)
Inventor
Atieh Haghdoost
Mehdi Kargar
Ersan Ilgar
Daniel Church
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Maxterial Inc
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Maxterial Inc
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Publication date
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Priority to US17/844,406 priority Critical patent/US20230145335A1/en
Publication of US20230145335A1 publication Critical patent/US20230145335A1/en
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B27/00—Rolls, roll alloys or roll fabrication; Lubricating, cooling or heating rolls while in use
    • B21B27/005—Rolls with a roughened or textured surface; Methods for making same
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B27/00—Rolls, roll alloys or roll fabrication; Lubricating, cooling or heating rolls while in use
    • B21B27/02—Shape or construction of rolls
    • B21B27/03—Sleeved rolls
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/013—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/03—Alloys based on nickel or cobalt based on nickel
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
    • C22C27/04—Alloys based on tungsten or molybdenum
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4414—Electrochemical vapour deposition [EVD]
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
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    • C—CHEMISTRY; METALLURGY
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    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
    • C23C28/321—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer with at least one metal alloy layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
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    • C—CHEMISTRY; METALLURGY
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    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
    • Y10T428/12826—Group VIB metal-base component

Definitions

  • Certain configurations described herein are directed to coatings that can be used on components intended to rotate. More particularly, certain embodiments are directed to coatings that can be placed on substrates that rotate during use.
  • Rotation can expose the devices to the environment, stresses or other harsh conditions. This exposure can lead to reduce lifetimes and increased wear.
  • a rotational device comprises a substrate configured to rotate about an axis. At least one surface of the substrate comprises a coated surface, and wherein the coated surface comprises a surface coating.
  • the surface coating comprises an alloy layer comprising (i) molybdenum or tungsten and (ii) at least one element selected from the group consisting of nickel, cobalt, chromium, tin, phosphorous, iron, magnesium and boron or at least one compound comprising one or more of nickel, cobalt, chromium, tin, phosphorous, iron, magnesium or boron.
  • a rotational shaft comprises a substrate that rotates about a longitudinal axis. At least one surface of the substrate comprises a coated surface.
  • the coated surface comprises a surface coating, wherein the surface coating comprises an alloy layer comprising (i) molybdenum or tungsten and (ii) at least one element selected from the group consisting of nickel, cobalt, chromium, tin, phosphorous, iron, magnesium and boron or at least one compound comprising one or more of nickel, cobalt, chromium, tin, phosphorous, iron, magnesium or boron.
  • a rotor configured to rotate about a longitudinal axis. At least one surface of the rotor comprises a coated surface, and wherein the coated surface comprises a surface coating, wherein the surface coating comprises an alloy layer comprising (i) molybdenum or tungsten and (ii) at least one element selected from the group consisting of nickel cobalt, chromium, tin, phosphorous, iron, magnesium and boron or at least one compound comprising one or more of nickel, cobalt, chromium, tin, phosphorous, iron, magnesium or boron.
  • a device comprises a blade configured to rotate during operation of the device.
  • the blade comprises a coated surface, and wherein the coated surface comprises a surface coating.
  • the surface coating comprises an alloy layer comprising (i) molybdenum or tungsten and (ii) at least one element selected from the group consisting of nickel, cobalt, chromium, tin, phosphorous, iron, magnesium and boron or at least one compound comprising one or more of nickel, cobalt, chromium, tin, phosphorous, iron, magnesium or boron.
  • FIG. 1 is an illustration of a device including a surface coating on a substrate
  • FIG. 2 is an illustration of a device including two layers in a coating on a substrate
  • FIG. 3 is another illustration of a device including two layers in a coating on a substrate
  • FIG. 4 A and FIG. 4 B are illustrations of a device including a textured surface
  • FIG. 5 A and FIG. 5 B are illustrations of a device including two or more layers
  • FIG. 6 , FIG. 7 , and FIG. 8 are illustration of coating layers
  • FIG. 9 , FIG. 10 and FIG. 11 are illustrations of non-flat surfaces
  • FIG. 12 is an illustration of a device with multiple coating layers
  • FIG. 13 A is an illustration showing a perspective view of rotational device
  • FIG. 13 B is an illustration showing a cross-section of a rotational device
  • FIG. 14 is an illustration showing a rod or shaft shaped rotational device
  • FIG. 15 is an illustration showing a rotor
  • FIG. 16 is an illustration showing a helicopter
  • FIG. 17 is an illustration showing a turbine blade
  • FIG. 18 is an illustration showing an impeller blade
  • FIG. 19 , FIG. 20 and FIG. 21 show various rotational devices that include a rotational substrate
  • FIG. 22 is a photograph showing two coatings on different articles
  • FIG. 23 A and FIG. 23 B are photograph showing a hard chrome coating and an electroless nickel coating
  • FIG. 24 A , FIG. 24 B , FIG. 24 C , FIG. 24 D and FIG. 24 E are photographs showing the results of a salt spray test on tested coatings
  • FIG. 25 is a graph comparing the salt spray tests
  • FIG. 26 A , FIG. 26 B , FIG. 26 C , FIG. 26 D and FIG. 26 E are photographs showing salt spray tests and coating appearance after 5000 hours;
  • FIG. 27 is a photograph showing images of notched bars before and after applying a coating
  • FIG. 28 A and FIG. 28 B are images of MaxShield-V1 ( FIG. 28 B ) and MaxShield-V2 ( FIG. 28 A ) coatings after 6 percent elongation;
  • FIG. 29 is a microscopic image of MaxShield-V1 coating'
  • FIG. 30 is an illustration of an apparatus to measure coefficient of friction
  • FIG. 31 is an illustration showing cracks
  • FIG. 32 A and FIG. 32 B are images of two carbon steel bars coated with MaxShield-V1 after ( FIG. 32 B ) and before ( FIG. 32 A ) a test;
  • FIG. 33 is a microscope image of the steel bar of FIG. 32 B ;
  • FIG. 34 is an illustration of an apparatus used to abrade the surface of the coating by applying a one (1) kg load on each abrasive wheel;
  • FIG. 35 is a graph comparing the wear index of different coatings
  • FIG. 36 is a graph showing coefficient of friction versus cycle
  • FIG. 37 is a graph showing corrosion rate for different coatings
  • FIG. 38 A and FIG. 38 B are images showing magnified as plated and heat treated coatings.
  • FIG. 39 , FIG. 40 , FIG. 41 and FIG. 42 are images showing surface coating.
  • the devices generally include a component that rotates and has a surface that contacts another material, e.g., air, a metal or a functional fluid, during rotation of the component.
  • the term “functional fluid” refers to a fluid that is designed to provide a motive force, to lubricate one or more components during movement of the rotatable component, e.g., to provide a film of oil on the surface of a rotational device.
  • the surface may contact a functional fluid such as, for example, a lubricant, a grease, an oil or other fluids.
  • the functional fluid may also provide a resistive force in some instances.
  • One or more surfaces of the rotational device can include a surface coating, e.g., an alloy layer. The surface coating can provide wear resistance or protect underling surfaces of the rotational device.
  • the materials and methods described herein can be used to provide a surface coating layer on a surface of a rotatable component of a device.
  • the exact composition and arrangement of the surface coating can vary.
  • the moveable component can include one or more layers as described below in connection with FIGS. 1 - 12 . Specific articles or devices including the substrate and/or other layers are also described.
  • the exact material or materials in the surface coating may vary.
  • the surface coating comprises one or more metals.
  • the surface coating may include a metal alloy, e.g., an alloy comprising two or more metals.
  • the surface coating comprises a metal alloy including only two metals or a metal and another material.
  • the surface coating comprises a metal alloy including only three metals or a metal and two other materials.
  • the surface coating may contain only a single layer formed on the substrate. For example, the single layer can be exposed to the environment to protect the underlying substrate from degradation.
  • the surface coating may contain only a first layer formed on the substrate and a second layer formed on the first layer.
  • the alloy layer may “consist essentially of” two or more materials.
  • the phrase “consists essentially of” or “consisting essentially of” is intended to refer to the specified materials and only minor impurities and those materials that do not materially affect the basic characteristic(s) of the configuration.
  • the term “consists of” refers to only those materials and any impurities that cannot be removed through conventional purification techniques.
  • the alloy layers described herein can include one, two or more Group IV transition metals which include scandium, titanium, vanadium, chromium, manganese, iron, cobalt, nickel, copper and zinc.
  • the alloy layers described herein can include one, two or more Group V metals, which include yttrium, zirconium, niobium, ruthenium, rhodium, palladium, silver and cadmium.
  • the alloy layers described herein can include one, two or more Group VI metals, which include the non-radioactive lanthanides (La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu), hafnium, tantalum, tungsten, rhenium, osmium, iridium, platinum, gold and mercury.
  • Group VI metals include the non-radioactive lanthanides (La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu), hafnium, tantalum, tungsten, rhenium, osmium, iridium, platinum, gold and mercury.
  • the alloy layers described herein can include one, two or more Group VII metals, which include the non-radioactive actinides (Th, Pa, U).
  • the alloy layers described herein can include one or more metals from the Group IV metals and one or more metals from the Group V metals or the Group VI metals or the Group VII metals.
  • the alloy layers described herein can include one or more metals from the Group V metals and one or more metals from the Group VI metals or the Group VII metals.
  • the alloy layers described herein can include one or more metals from the Group VI metals and one or more metals from the Group VII metals.
  • the alloy layers described herein includes only two metals with one metal from the Group IV metals and the other metal from the Group V metals, the Group VI metals or Group VII metals.
  • the alloy layers described herein includes only two metals with one metal from the Group V metals and the other metal from the Group VI metals or Group VII metals.
  • the alloy layers described herein includes only two metals with one metal from the Group VI metals and the other metal from the Group VII metals.
  • the alloy layers described herein includes only two metals with both metals being Group IV metals.
  • the alloy layers described herein includes only two metals with both metals being Group V metals.
  • the alloy layers described herein includes only two metals with both metals being Group VI metals.
  • the alloy layers described herein includes only two metals with both metals being Group VII metals.
  • the alloy layers described herein can also include Group II materials (Li, Be, B and C) or Group III materials (Na, Mg, Al, Si, P, and S) in addition to, or in place, of the other metals. These materials may be present in combination with one, two, three or more metals.
  • the alloy layer described herein comprises molybdenum and one or more additional metals, e.g., one or more additional metals selected from the group consisting of Group IV metals, Group V metals, Group VI metals and Group VII metals.
  • the metal alloy comprises molybdenum and only one additional metal, e.g., only one additional metal selected from the group consisting of Group IV metals, Group V metals, Group VI metals and Group VII metals.
  • the metal alloy comprises molybdenum and only two additional metals or materials, e.g., only two additional metals or materials selected from the group consisting of Group IV metals, Group V metals, Group VI metals, Group VII metals, Group II materials and Group III materials.
  • the surface coating has a single layer formed on the substrate, where the single layer comprises molybdenum and one or more additional metals, e.g., one or more additional metals selected from the group consisting of Group IV metals, Group V metals, Group VI metals and Group VII metals.
  • the surface coating has a single layer formed on the substrate, where the single layer comprises molybdenum and only one additional metal, e.g., only one additional metal selected from the group consisting of Group IV metals, Group V metals, Group VI metals and Group VII metals.
  • the surface coating has a single layer formed on the substrate, where the single layer comprises molybdenum and only two additional metals or materials, e.g., only two additional metal or material selected from the group consisting of Group IV metals, Group V metals, Group VI metals, Group VII metals, Group II materials and Group III materials.
  • the alloy layer described herein comprises tungsten and one or more additional metals, e.g., one or more additional metals selected from the group consisting of Group IV metals, Group V metals, Group VI metals and Group VII metals.
  • the metal alloy comprises tungsten and only one additional metal, e.g., only one additional metal selected from the group consisting of Group IV metals, Group V metals, Group VI metals and Group VII metals.
  • the metal alloy comprises tungsten and only two additional metals or materials, e.g., only two additional metals or materials selected from the group consisting of Group IV metals, Group V metals, Group VI metals, Group VII metals, Group II materials and Group III materials.
  • the surface coating has a single layer formed on the substrate, where the single layer comprises tungsten and one or more additional metals, e.g., one or more additional metals selected from the group consisting of Group IV metals, Group V metals, Group VI metals and Group VII metals.
  • the surface coating has a single layer formed on the substrate, where the single layer comprises tungsten and only one additional metal, e.g., only one additional metal selected from the group consisting of Group IV metals, Group V metals, Group VI metals and Group VII metals.
  • the surface coating has a single layer formed on the substrate, where the single layer comprises tungsten and only two additional metals or materials, e.g., only two additional metal or material selected from the group consisting of Group IV metals, Group V metals, Group VI metals, Group VII metals, Group II materials and Group III materials.
  • the alloy layer described herein comprises nickel and one or more additional metals, e.g., one or more additional metals selected from the group consisting of Group IV metals, Group V metals, Group VI metals and Group VII metals.
  • the metal alloy comprises nickel and only one additional metal, e.g., only one additional metal selected from the group consisting of Group IV metals, Group V metals, Group VI metals and Group VII metals.
  • the metal alloy comprises nickel and only two additional metals or materials, e.g., only two additional metals or materials selected from the group consisting of Group IV metals, Group V metals, Group VI metals, Group VII metals, Group II materials and Group III materials.
  • the surface coating has a single layer formed on the substrate, where the single layer comprises nickel and one or more additional metals, e.g., one or more additional metals selected from the group consisting of Group IV metals, Group V metals, Group VI metals and Group VII metals.
  • the surface coating has a single layer formed on the substrate, where the single layer comprises nickel and only one additional metal, e.g., only one additional metal selected from the group consisting of Group IV metals, Group V metals, Group VI metals and Group VII metals.
  • the surface coating has a single layer formed on the substrate, where the single layer comprises nickel and only two additional metals or materials, e.g., only two additional metal or material selected from the group consisting of Group IV metals, Group V metals, Group VI metals, Group VII metals, Group II materials and Group III materials.
  • the alloy layer comprises (i) molybdenum and (ii) at least one element selected from the group consisting of nickel, tungsten, cobalt, chromium, tin, phosphorous, iron, magnesium and boron or at least one compound comprising one or more of nickel, tungsten, cobalt, chromium, tin, phosphorous, iron, magnesium or boron.
  • the alloy excludes precious metals.
  • the alloy layer described herein comprises two or more of nickel, molybdenum, copper, phosphorous, boron, boron nitride, silicon carbide, aluminum oxide, molybdenum disulfide, carbon fibers, carbon nanotubes, particles, cobalt, tungsten, gold, platinum, silver, or alloys or combinations thereof.
  • the alloy layer described herein includes two or more of nickel, molybdenum, copper, phosphorous, boron, boron nitride, silicon carbide, aluminum oxide, molybdenum disulfide, carbon fibers, carbon nanotubes, particles, cobalt, tungsten, gold, platinum, silver, or alloys or combinations thereof.
  • the alloy layer described herein comprises an alloy of (i) molybdenum, molybdenum oxide or other compounds of molybdenum, and (ii) a transition metal, transition metal oxide or other compounds of a transition metal.
  • the alloy layer described herein includes only two metals from (i) molybdenum, molybdenum oxide or other compounds of molybdenum, and (ii) a transition metal, transition metal oxide or other compounds of a transition metal.
  • the metal alloy of the layers described herein includes only two metals from (i) tungsten, tungsten oxide or other compounds of tungsten, and (ii) a transition metal, transition metal oxide or other compounds of a transition metal.
  • the alloy layer described herein includes only two metals from (i) nickel, nickel oxide or other compounds of nickel, and (ii) a transition metal, transition metal oxide or other compounds of a transition metal.
  • the transition metal, transition metal oxide or other compounds of the transition metal comprises scandium, manganese, iron, cobalt, nickel, copper, zinc, yttrium, technetium, silver, cadmium, lanthanum, platinum, gold, mercury, actinium, and combinations thereof.
  • the metal alloy coating can include a Ni-Mo alloy, a Ni-W alloy or only have a Ni-Mo alloy or a Ni-W alloy.
  • the alloy layer exhibits at least two times more corrosion resistance compared to a chrome coating according to an ASTM B117 salt spray corrosion test. In some embodiments, the metal alloy layer does not exhibit hydrogen embrittlement as tested by an ASTM F519 standard.
  • these materials can be present in the metal alloy coating at 35% by weight or less (or 25% by weight or less) based on a weight of the alloy layer or the weight of the surface coating. In some other cases where the metal alloy layer includes molybdenum, molybdenum oxide or other compounds of molybdenum, these materials can be present in the metal alloy coating at 48% by weight or less based on a weight of the alloy layer or the surface coating.
  • the alloy layer may consist of a single layer.
  • two or more layers may be present in a surface coating.
  • the two layers may comprise the same or different materials. When the materials are the same, the materials may be present in different amounts in the two layers or may be deposited in different layers using different processes.
  • the alloy layer can include an alloy of molybdenum, e.g., molybdenum in combination with one or more of nickel, chromium, carbon, cobalt, tin, tungsten, aluminum, vanadium, titanium, niobium, iron, boron, phosphorous, magnesium or copper.
  • molybdenum may be present at 35% by weight or less and the other component can be present at 65% by weight or more. More than two components or metals may be present if desired.
  • the surface coating can include an alloy of molybdenum and one other metal or material, e.g., molybdenum in combination with only one of nickel, chromium, carbon, cobalt, tin, tungsten, aluminum, vanadium, titanium, niobium, iron, boron, phosphorous, magnesium or copper.
  • the surface coating can include an alloy of molybdenum and two other metals, e.g., molybdenum in combination with only two of nickel, chromium, carbon, cobalt, tin, tungsten, aluminum, vanadium, titanium, niobium, iron, boron, phosphorous, magnesium or copper.
  • the alloy layer can include an alloy of tungsten, e.g., tungsten in combination with one or more of nickel, molybdenum, chromium, carbon, cobalt, tin, aluminum, vanadium, titanium, niobium, iron, boron, phosphorous, magnesium or copper.
  • the surface coating can include an alloy of tungsten and one other metal or material, e.g., tungsten in combination with only one of nickel, molybdenum, chromium, carbon, cobalt, tin, aluminum, vanadium, titanium, niobium, iron, boron, phosphorous, magnesium or copper.
  • the surface coating can include an alloy of tungsten and two other metals, e.g., tungsten in combination with only two of nickel, molybdenum, chromium, carbon, cobalt, tin, aluminum, vanadium, titanium, niobium, iron, boron, phosphorous, magnesium or copper.
  • the surface coating can include an alloy of tungsten, e.g., tungsten in combination with one or more of chromium, molybdenum, carbon, cobalt, tin, aluminum, vanadium, titanium, niobium, iron, boron, phosphorous, magnesium or copper.
  • tungsten may be present at 35% by weight or less and the other component can be present at 65% by weight or more. More than two components or metals may be present if desired.
  • the surface coating can include an alloy of tungsten and one or two other metals or materials, e.g., tungsten in combination with only one of nickel, molybdenum, chromium, carbon, cobalt, tin, aluminum, vanadium, titanium, niobium, iron, boron, phosphorous, magnesium or copper.
  • the surface coating can include an alloy of tungsten and two other metals, e.g., tungsten in combination with only two of nickel, molybdenum, chromium, carbon, cobalt, tin, aluminum, vanadium, titanium, niobium, iron, boron, phosphorous, magnesium or copper.
  • the surface coatings described herein may provide desirable performance criteria including, but not limited to, a certain surface roughness (Ra) as described in the ISO 4287 and ISO 4288 standards.
  • Roughness can be measured, for example, using a profilometer.
  • Coating thickness may also be measured using a non-destructive technique such as a magnetic measurement tool, XRF, or sampling and destructive technique such as cross-section analysis.
  • the exact surface roughness (Ra) may vary, for example, and may be equal to or less than 1 micron or can be between 0.1 microns and 1 micron.
  • the devices may also have a desired coefficient of friction (CoF). This property generally depends on both the surfaces worn against each other and the fluid located between them.
  • CoF coefficient of friction
  • the roughness of each surface, the viscosity of the fluid, and the temperature of the test can impact coefficient of friction measurements.
  • CoF can be measured, for example, according to ASTM G99-17 or a block on ring test as specified in ASTM G77-17.
  • the coating, or one or more layers of the coating may provide a specific hardness as tested by ASTM E384-17.
  • the coating may have a hardness higher than 600 Vickers as measured per ASTM E384 -17.
  • any one or more of the layers have a hardness higher than 600 Vickers as measured per ASTM E384 - 17.
  • an outer layer of the coating may have a hardness higher than 600 Vickers as measured per ASTM E384 - 17.
  • one of the layers, when present by itself may have a hardness less than 600 Vickers as measured per ASTM E384 - 17.
  • a flat surface is not required and may not be desired in some instances.
  • a substrate (or any of the layers or both) may have a rough surface or be roughened purposefully or be smoothed purposefully as desired.
  • the substrate may have a textured surface including transferring texture which a partial or complete replica of the transferring texture shall be transferred to the other objects that come in contact with such a surface with transferring texture.
  • such a surface can be a part of an article or device that during use or movement contacts another material.
  • a steel work roll used in cold rolling processes where the surface of the work roll has certain transferring texture that can be transferred to the steel sheet during the rolling process.
  • a transferring texture can be a part of a mold which is designed to transfer the texture to another object.
  • the texture is transferred to a metal.
  • the texture is transferred to a polymer.
  • the texture is transferred to a molten metal which solidified afterward.
  • the texture is transferred to a liquid or fluid which solidified afterward.
  • the surface may have an adhesive roughness designed to increase the adhesion between such a surface and another surface or a coating applied on top.
  • the adhesive texture is used to increase the adhesion of the substrate to the thermal spray coatings.
  • the adhesive texture is used to increase the adhesion of a coating comprising tungsten the surface.
  • the adhesive layer is used to increase the adhesion of a coating comparing one or combination of nitride, a nitride, a metal carbide, a carbide, a boride, tungsten, tungsten carbide, a tungsten alloy, a tungsten compound, a stainless steel, a ceramic, chromium, chromium carbide, chromium oxide, a chromium compound, aluminum oxide, zirconia, titania, nickel, a nickel carbide, a nickel oxide, a nickel alloy, a cobalt compound, a cobalt alloy, a cobalt phosphorous alloy, molybdenum, a molybdenum compound, a nanocomposite, an oxide composite.
  • the roughness is added to impact the light reflection.
  • the surface roughness is altered to have less roughness.
  • the surface roughness, Ra may be altered to be less than 1 um.
  • the surface roughness is altered to be less than 0.5 um.
  • the surface with altered roughness is shiny.
  • the surface with altered roughness is exposed and is required to be touched by human.
  • the surface reflects less light and becomes less shiny.
  • the contact angle of water on the surface with altered roughness is less than the original surface.
  • the roughness may have irregular shapes or respective patterns.
  • the roughness of the surfaces with coating, Ra is less than 1 um.
  • the roughness of the surfaces with coating, Ra is more than 1 um and less than 10 um.
  • the roughness of the surfaces with coating, Ra is more than 10 um and less than 100 um, in another embodiment the Ra of the surfaces is less than 0.7.
  • the Ra is less than 0.5 um and more than 0.05 um.
  • the Ra is less than 0.5 um.
  • the Ra is less than 0.4 um.
  • the Ra is less than 0.3 um.
  • the Ra is less than 0.2 um.
  • the Ra is less than 0.1 um.
  • the patterns are made using grinding, blasting, sand blasting, abrasive blasting, sandblasting, burnishing, grinding, honing, mass finishing, tumble finishing, vibratory finishing, polishing, buffing, lapping, electrochemical etching, chemical etching, laser etching, laser patterning, or other methods.
  • the surface is textured using shot blasting (SB), laser beam texturing (LBT) and electrical discharge texturing (EDT) or electron beam texturing (EBT) is being evaluated. Electrical discharge texturing (EDT) can be used on steel substrate to create textures. Textures may be formed using an electrodeposition techniques. Textures may be formed using thermal spray techniques.
  • Cross section of the patterns may have specific geometries such as rectangles, triangles, stars, circles or a combinations of thereof.
  • the patterns may be in the shape of ridges, pillars, spirals, a combination of thereof or other shapes.
  • the Ra may be larger than 100 um.
  • the patterns may be created using cutting, milling, molding and or other tools.
  • the coatings or layers may include a single material, a combination of materials, an alloy, composites, or other materials and compositions as noted herein.
  • the metal alloy can include two or more materials, e.g., two or more metals.
  • one metal may be present at 79% by weight or more in the layer and the other material may be present at 21% by weight or less in the layer.
  • one of the layers described herein can include a molybdenum alloy, a tungsten alloy or a nickel alloy.
  • One of the materials may be present at 79% by weight or more in the layer and the other material(s) may be present at 21% by weight or less in the layer.
  • the metal alloy includes molybdenum
  • the molybdenum can be present at 21% by weight or less or 79% by weight or more in the layer and the other material(s) may be present so the sum of the weight percentages add to 100 weight percent.
  • the other material(s) can be present at 79% by weight or more in the layer and the molybdenum may be present at 21% by weight or less in the layer.
  • One or may layers can also include another metal or a metal alloy. There may also be minor impurities present that add negligible weight to the overall alloy layer or surface coating.
  • each material present may be selected to provide a layer or article with desired performance specifications.
  • the weight percentages can be based on weight of the alloy layer or the entire surface coating.
  • one metal in a layer is present at 35% by weight or less in the layer, e.g., is present at 34%, 33%, 32%, 31%, 30%, 29%, 28%, 27%, 26%, 25%, 24%, 23%, 22%, 21%, 20%, 19%, 18%, 17%, 16%, 15%, 14%, 13%, 12%, 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1% or less by weight in the layer or in the coating.
  • one or more of molybdenum, tungsten or cobalt can be present in the layer or in the coating at 35% by weight or less, e.g., 25%, 24%, 23%, 33%, 31%, 20%, 19%, 18%, 17%, 16%, 15%, 14%, 13%, 12%, 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1% or less in the layer or the coating.
  • one or more of the layers can include a metal in a layer that is present at 65% by weight or more, e.g., is present at 65%, 70%, 75%, 80%, 81%, 82%, 83%, 84%, 85%, 85%, 87%, 88%, 89%, 90%, 91%, 92%, 93%, 94%, 95%, 96%, 97%, 98%, 99% or more by weight in the layer or in the coating.
  • nickel can be present in the layer or in the coating at 65%, 70%, 75%, 80%, 81%, 82%, 83%, 84%, 85%, 85%, 87%, 88%, 89%, 90%, 91%, 92%, 93%, 94%, 95%, 96%, 97%, 98%, 99% or more by weight of the alloy layer or the surface coating.
  • molybdenum can be present in the layer or in the coating at 65%, 70%, 75%, 80%, 81%, 82%, 83%, 84%, 85%, 85%, 87%, 88%, 89%, 90%, 91%, 92%, 93%, 94%, 95%, 96%, 97%, 98%, 99% or more by weight of the alloy layer or the surface coating.
  • the alloy layers described herein may be present without any precious metals.
  • precious metals refers to gold, silver, ruthenium, rhodium, palladium, osmium, iridium, and platinum.
  • the alloy layer (and/or the entire surface coating) can be free of (has none of) each of gold, silver, ruthenium, rhodium, palladium, osmium, iridium, and platinum. Omission of the precious metals can reduce overall cost.
  • the nickel can be present without any tungsten or cobalt in that same layer.
  • the layer has neither of tungsten or cobalt, e.g., 0% by weight of the cobalt or tungsten is present. That layer may also have 0% by weight precious metals.
  • the alloy layers can include non-metal materials and additives as desired.
  • particles, nanoparticles, nanomaterials or other materials that include one or more of polytetrafluoroethylene (PTFE), SiC, SiO 2 , diamond, graphite, graphene, boron, boride, functionalized silicon particles, fluorosilicone, siloxanes, TiO 2 , nanotubes and nanostructures may be present in the metal alloy layer. Additional materials are described in more detail below.
  • one of the metals of the layers described herein is nickel.
  • one of the metals of the alloy layers described herein is molybdenum.
  • molybdenum a molybdenum alloy, molybdenum composite, a molybdenum-tin alloy, an alloy containing at least molybdenum and nickel, an alloy containing at least molybdenum and tin, an alloy containing at least molybdenum and cobalt, an alloy containing at least molybdenum and phosphorous, an alloy containing only nickel and molybdenum, an alloy containing only tin and molybdenum, an alloy containing only cobalt and molybdenum, an alloy containing only nickel, molybdenum and phosphorous, a molybdenum alloy including at least two metals other than precious metals, a molybdenum alloy including at least molybdenum and a transition metal, a molybdenum alloy including at least molybdenum and a transition metal other than precious metals, a molybdenum alloy including
  • one of the metals of the alloy layers described herein is cobalt.
  • cobalt, cobalt alloys, cobalt compounds, cobalt composites a cobalt-phosphorous alloy, a cobalt-molybdenum alloy, a cobalt-molybdenum-phosphorous alloy, a cobalt-tungsten alloy, a cobalt-tungsten-phosphorous alloy, cobalt alloy containing only cobalt and molybdenum, cobalt alloys including at least cobalt and a transition metal, cobalt alloys including at least two metals excluding precious metals, a cobalt alloy including at least cobalt and a refractory metal excluding precious metals, a cobalt alloy including at least cobalt and a refractory metal excluding tungsten, a cobalt alloy including at least cobalt and a refractory metal excluding tungsten and precious metals, a cobalt alloy including at least cobalt and excluding tungsten and precious
  • one of the metals of the alloy layers described herein is tin.
  • one of the metals of the alloy layers described herein is tungsten.
  • tungsten for example, tungsten, tungsten alloys, tungsten compounds, tungsten composites, a tungsten-phosphorous alloy, a tungsten-molybdenum alloy, a tungsten-molybdenum-phosphorous alloy, a tungsten alloy containing only tungsten and molybdenum, a tungsten alloy including at least tungsten and a transition metal, a tungsten alloy including at least two metals excluding precious metals, a tungsten alloy including at least tungsten and a refractory metal excluding precious metals, a tungsten alloy including at least tungsten and excluding nickel and precious metals, a composite alloy containing tungsten and particles, a composite alloy containing tungsten and nanoparticles, a composite alloy containing tungsten and SiO 2 , SiC or other silicon compounds, a composite alloys containing tungsten and boride, brome
  • one or more of the alloy layers described herein may be considered a “hard” layer.
  • the hard layer typically has a Vickers hardness higher than the substrate and/or any underlying layers. While not required, the hard layer is typically present as an outer layer.
  • the hard layer may comprise one or more of a nitride, a metal nitride, a carbide, a metal carbide, a boride, a metal boride, tungsten, tungsten carbide, a tungsten alloy, a tungsten compound, a stainless steel, a ceramic, chromium, chromium carbide, chromium oxide, a chromium compound, aluminum oxide, zirconia, titania, nickel, a nickel carbide, a nickel oxide, a nickel alloy, a cobalt compound, a cobalt alloy, a cobalt phosphorous alloy, molybdenum, a molybdenum compound, a nanocomposite, an oxide
  • FIG. 1 a simplified illustration of a substrate and an alloy layer of a surface coating is shown in FIG. 1 .
  • An article or device 100 includes a substrate 105 (which is shown as a section in FIG. 1 ) and a first layer 110 on a first surface 106 of the substrate 105 . While not shown, a layer or coating may also be present on surfaces 107 , 108 and 109 of the substrate 105 .
  • the layer 110 is shown in FIG. 1 as a solid layer with uniform thickness present across the surface 106 of the substrate 105 . This configuration is not required, and different areas of the layer 110 may include different thicknesses or even different materials. Further, certain areas of the surface 106 may not include any surface coating at all.
  • the substrate 105 may be, or may include, a metal material including, but not limited to, steel (carbon steel, tool steel, stainless steel, etc.), copper, copper alloys, aluminum, aluminum alloys, chromium, chromium alloys, nickel, nickel alloys, titanium, titanium alloys, nickel-chromium superalloys, nickel-molybdenum alloys, brass, Hastelloy, Inconel, Nichrome, Monel, other substrates that include at least one metal or substrates that are nitrided or carburized.
  • the substrate may be porous or may be non-porous.
  • the layer 110 typically includes one or more metals or two or more metals or three or more metals or materials.
  • the layer 110 can be a metal alloy formed from two or more metals.
  • the layer 110 is an alloy layer formed from only two metals or two materials.
  • the layer 110 is the only layer present in the surface coating.
  • the layer 110 is an outer or exposed layer such that the layer can contact surrounding fluid or other materials and protect the underlying substrate 105 and any layers between the layer 110 and the substrate 105 .
  • one of the metals in the layer 110 is nickel. In other embodiments, one of the metals in the layer 110 is molybdenum. In other embodiments, one of the metals in the layer 110 is tungsten. In other embodiments, one of the metals in the layer 110 is cobalt. In an additional embodiment, one of the metals in the layer 110 is molybdenum in the form of a molybdenum alloy. In other embodiments, the layer 110 can include a nickel alloy, a molybdenum alloy, a cobalt alloy, a tungsten alloy, or combinations thereof. In other examples, the layer 110 may be a nickel molybdenum alloy.
  • the layer 110 may consist of a nickel molybdenum alloy with no other materials being present in the layer 110 . In some configurations, the layer 110 may comprise a nickel molybdenum phosphorous alloy. In some configurations, the layer 110 may consist of a nickel molybdenum phosphorous alloy with no other materials being present in the layer 110 .
  • the exact thickness of the layer 110 may vary 1 micron to about 2 mm depending on the device where the layer 110 is present.
  • the layer 110 may have a thickness from about 5 microns to about 1 mm or about 7 microns to about 900 microns.
  • each layer may have a thickness from 1 micron to about 2 mm or the total thickness of all layers may be about 1 micron to about 2 mm.
  • the layer 110 can also include other materials, e.g., particles, fibers, non-metals (for example, phosphorous, boron, boron nitride, silicon compounds such as silicon dioxide, silicon carbide, etc.), aluminum oxide, molybdenum disulfide, carbon fibers, carbon nanotubes, cobalt, tungsten, tin, gold, platinum, silver and combinations thereof.
  • the particles can be soft particles such as polymer particles, PTFE particles, fluoropolymers, and other soft particles.
  • the particles can be hard particles such as diamond, boron, boron nitride, silicon compounds such as silicon dioxide, silicon carbide, etc.
  • the particles can be hydrophobic or hydrophilic.
  • Hydrophobic particles such PTFE particles, Teflon particles, Fluoropolymers, silicon base particles, hard particles functionalized in hydrophobic, hydrophilic or both groups.
  • PTFE particles Teflon particles, Fluoropolymers
  • silicon base particles hard particles functionalized in hydrophobic, hydrophilic or both groups.
  • silicon dioxide or silicon carbide functionalized in fluoro- compounds, molecules containing florin, silicon compounds, molecules containing silicon, and other polymers.
  • Other particles such as titanium dioxide, and other catalyst may be used as well either functionalized or as is.
  • the layer 110 can include a nickel molybdenum alloy, a nickel molybdenum alloy where a weight percentage of the molybdenum is less than 35% by weight, a nickel molybdenum phosphorous alloy where a weight percentage of the molybdenum is less than 35% by weight, a ductile alloy of a refractory metal with nickel, a ductile alloy of nickel and molybdenum, a brittle alloy of a refractory metal with nickel, a ductile alloy of nickel and molybdenum, a brittle alloy of a transition metal with molybdenum, a ductile alloy of a transition metal with molybdenum, an alloy of nickel and molybdenum with a hardness less than 1100 and higher than 500 Vickers, a nickel molybdenum alloy that provides a surface roughness Ra less than 1 micrometer, a nickel molybdenum alloy with uniform and non-uniform grain sizes, a nickel molybdenum with
  • the layer 110 on the substrate 105 can include a nickel tungsten alloy or a nickel tungsten alloy where it contains a third element including, but not limited to, an element that is a refractory metal, a precious metal, hard particles or other compounds such as phosphorous, boron, boron nitride, silicon carbide, aluminum oxide, molybdenum disulfide, hard particles with hardness of HV>750, hard particles with size less 500 nm, highly conductive particles, carbon nanotubes and/or carbon nano-particles. Combinations of these materials may also be present in the layer 110 on the substrate 105 .
  • a third element including, but not limited to, an element that is a refractory metal, a precious metal, hard particles or other compounds such as phosphorous, boron, boron nitride, silicon carbide, aluminum oxide, molybdenum disulfide, hard particles with hardness of HV>750, hard particles with size less 500 nm, highly conductive particles,
  • FIG. 2 a simplified illustration of another device is shown in FIG. 2 .
  • the article or the device 200 includes an intermediate layer 210 between the layer 110 and the underlying substrate 105 .
  • the intermediate layer 210 can improve adhesion, can improve corrosion, can brighten the coating or any combination thereof.
  • Such a layer can be less than 10 um, 9 um, 8 um, 7 um, 2 um, 1 um, 0.75 um, 0.5 um, or 0.25 um thick.
  • the layer 210 may be a strike layer, e.g., a nickel layer, added to the substrate 105 to improve adhesion between the substrate 105 and the layer 110 .
  • the layer 210 can function as a brightener to increase the overall shiny appearance of the article or device 200 .
  • a bright or semi-bright layer generally reflects a higher percentage of light than the layer 110 .
  • the layer 210 can act to increase corrosion resistance of the article or device 200 .
  • the substrate 105 used with the intermediate layer 210 may be, or may include, a metal material including, but not limited to, steel (carbon steel, tool steel, stainless steel, alloy steel, low alloy steel, etc.), copper, copper alloys, aluminum, aluminum alloys, chromium, chromium alloys, nickel, nickel alloys, molybdenum, molybdenum alloys, titanium, titanium alloys, nickel-chromium superalloys, nickel-molybdenum alloys, brass, bronze, a superalloy, Hastelloy, Inconel, Nichrome, Monel, or combinations thereof.
  • the substrate may be porous or may be non-porous.
  • the layer 210 can include one or more materials selected from the group consisting of Group II materials, Group III materials, a Group IV metal, a Group V metal, a Group VI metal and a Group VII metal. In some examples, the layer 210 is free of any precious metals. In other instances, the layer 210 only includes a single metal but may include other non-metal materials.
  • the layer 110 used with the intermediate layer 210 typically includes one or more metals or two or more metals.
  • the layer 110 used with the intermediate layer 210 can include any of those materials and configurations described in reference to FIG. 1 .
  • the layer 110 used with the layer 210 be a metal alloy formed from two or more metals.
  • one of the metals in the layer 110 used with the intermediate layer 210 is nickel.
  • one of the metals in the layer 110 used with the intermediate layer 210 is molybdenum.
  • one of the metals in the layer 110 used with the intermediate layer 210 is tungsten.
  • one of the metals in the layer 110 used with the intermediate layer 210 is cobalt.
  • one of the metals in the layer 110 used with the intermediate layer 210 is chrome.
  • the layer 110 used with the layer 210 can include only two metals or two materials or three metals or three materials.
  • the layer 110 used with the layer 210 can include only nickel and molybdenum or only nickel, molybdenum and phosphorous or only nickel and tungsten or only nickel and cobalt or only nickel, phosphorous and iron or only nickel and phosphorous.
  • the layer 110 used with the intermediate layer 210 can include a nickel alloy, a molybdenum alloy, a tungsten alloy, a cobalt alloy, a chrome alloy, or combinations thereof.
  • the layer 110 used with the intermediate layer 210 may be a nickel, nickel-molybdenum alloy, nickel-cobalt alloy, nickel-tungsten alloy, nickel-phosphorous ally, cobalt, cobalt-molybdenum alloy, cobalt-tungsten alloy, cobalt-phosphorous alloy, nickel-molybdenum-phosphorous alloy, cobalt-molybdenum-phosphorous alloy, cobalt-molybdenum-phosphorous alloy, cobalt-tungsten-phosphorous alloy, chrome, chrome alloy, molybdenum-tin alloy, chrome compounds.
  • the layer 110 used with the intermediate layer 210 may consist of a nickel-molybdenum alloy with no other materials being present in the layer 110 . In other configurations, the layer 110 used with the intermediate layer 210 may consist of a nickel-molybdenum-phosphorous alloy with no other materials being present in the layer 110 . In other configurations, the layer 110 used with the intermediate layer 210 may consist of a cobalt-molybdenum alloy with no other materials being present in the layer 110 . In other configurations, the layer 110 used with the intermediate layer 210 may consist of a cobalt-molybdenum-phosphorous alloy with no other materials being present in the layer 110 .
  • the layer 110 used with the intermediate layer 210 may consist of a nickel alloy including at least two metals excluding precious metals. In other configurations, the layer 110 used with the intermediate layer 210 may consist of a molybdenum alloy including at least two metals excluding precious metals. In other configurations, the layer 110 used with the intermediate layer 210 may consist of a molybdenum alloy including at least molybdenum and a transition metal. In other configurations, the layer 110 used with the intermediate layer 210 may consist of a molybdenum alloy including at least molybdenum and a transition metal excluding precious metals.
  • the exact thickness of the layer 110 used with the intermediate layer 210 may vary from 1 micron to about 2 mm depending on the article where the layer 110 is present.
  • the layer 110 may be about 10 microns to about 200 microns thick.
  • a thickness of the intermediate layer 210 may vary from 0.1 micron to about 2 mm, e.g., about 1 micron to about 20 microns.
  • the thickness of the layer 210 can be less than a thickness of the layer 110 or more than a thickness of the layer 110 .
  • two or more layers may be present on an underlying substrate.
  • an article or device 300 is shown that includes a first layer 110 and a second layer 320 on a substrate 105 .
  • the ordering of the layers 110 , 320 could be reversed, so the layer 320 is closer to the substrate 105 if desired.
  • the layers 110 , 320 can include the same or different materials or may include similar materials that have been deposited in a different manner or under different conditions.
  • the layers 110 , 320 in FIG. 3 can independently be any of those materials described herein, e.g., any of those materials described in reference to the layers of FIG. 1 or FIG. 2 .
  • the layers 110 , 320 can each be an alloy layer.
  • each of the layers 110 , 320 can include one or more of nickel, copper, molybdenum, cobalt or tungsten.
  • the layers may be formed in similar or different manners.
  • the layer 110 may be electrodeposited under basic conditions, and the layer 220 may be electrodeposited under acidic conditions.
  • the layers 110 , 320 can each independently include nickel, copper, molybdenum, cobalt or tungsten, but the layer 110 may be electrodeposited under basic conditions and the layer 220 may be deposited using a physical vapor deposition technique, a chemical vapor deposition, an atomic layer deposition, thermal spray technique or other methods.
  • the layers 110 , 320 can include metals other than copper, e.g., nickel, molybdenum, cobalt, tungsten, tin etc. or non-metals or both.
  • the different conditions can provide a different overall structure in the layers 110 , 320 even though similar materials may be present.
  • the layer 110 can improve adhesion of the layer 320 .
  • the layer 110 can “brighten” the surface of the device 300 so the device 300 has a shinier overall appearance.
  • the substrate 105 used with the layers 110 , 320 may be, or may include, a metal material including, but not limited to, steel (carbon steel, tool steel, stainless steel, alloy steel, low alloy steel, etc.), copper, copper alloys, aluminum, aluminum alloys, chromium, chromium alloys, nickel, nickel alloys, molybdenum, molybdenum alloys, titanium, titanium alloys, nickel-chromium superalloys, nickel-molybdenum alloys, brass, bronze, a superalloy, Hastelloy, Inconel, Nichrome, Monel, or combinations thereof.
  • the substrate 105 may be porous or may be non-porous.
  • the layers 110 , 320 typically each includes one or more metals or two or more metals.
  • the layers 110 , 320 can be a metal alloy formed from two or more metals.
  • one of the metals in the layers 110 , 320 is nickel.
  • one of the metals in the layers 110 , 320 is molybdenum.
  • one of the metals in the layers 110 , 320 is cobalt.
  • one of the metals in the layers 110 , 320 is tungsten.
  • the layers 110 , 320 need not have the same metal and desirably the metal in the layers 110 , 320 is different.
  • the layers 110 , 320 independently can include a nickel alloy, a molybdenum alloy, or combinations thereof.
  • the layers 110 , 320 independently may be a nickel-molybdenum alloy, a nickel-molybdenum-phosphorous alloy, a tungsten alloy, a nickel-tungsten alloy, etc.
  • one or both of the layers 110 , 320 may consist of a nickel molybdenum alloy with no other materials being present in each layer.
  • one of the layers 110 , 320 may consist of a nickel-molybdenum-phosphorous alloy with no other materials being present in each layer.
  • both of the layers 110 , 320 may consist of a nickel-molybdenum-phosphorous alloy with no other materials being present in each layer.
  • one or both of the layers 110 , 320 may consist of a nickel alloy including at least nickel and a transition metal.
  • one or both of the layers 110 , 320 may consist of a nickel alloy including at least nickel and a transition metal excluding precious metals.
  • one or both of the layers 110 , 320 may consist of a molybdenum alloy including at least molybdenum and a transition metal.
  • one or both of the layers 110 , 320 may consist of a molybdenum alloy including at least molybdenum and a transition metal excluding precious metals.
  • the exact thickness of the layers 110 , 320 may vary from 0.1 micron to about 2 mm depending on the device where the coating is present, and the thickness of the layers 110 , 320 need not be the same.
  • the layer 110 may be thicker than the layer 320 or may be less thick than the layer 320 .
  • an intermediate layer may be present between the first layer 110 and the second layer 320 .
  • the intermediate layer can include, for example, any of those materials described in reference to layer 210 herein.
  • an intermediate layer may be present between the substrate 105 and the layer 110 when the coating includes the first layer 110 and the second layer 120 .
  • the layer 320 may have a higher hardness than the layer 110 .
  • a hardness of the layer 320 may be greater than 750 Vickers.
  • the layer 320 may comprise one or more of a nitride, a metal nitride, a carbide, a metal carbide, a boride, a metal boride, tungsten, tungsten carbide, a tungsten alloy, a tungsten compound, a stainless steel, a ceramic, chromium, chromium carbide, chromium oxide, a chromium compound, aluminum oxide, zirconia, titania, nickel, a nickel carbide, a nickel oxide, a nickel alloy, a cobalt compound, a cobalt alloy, a cobalt phosphorous alloy, molybdenum, a molybdenum compound, a nanocomposite, an oxide composite, or combinations thereof.
  • a surface of the substrate may be treated or include a transferred surface, e.g., a carburized, nitrated, carbonitride, induction hardening, age hardening, precipitation hardening, gas nitriding, normalizing, subzero treatment, annealing, shot pinning, or chemically, thermally, or physically or a combination of thereof, modified surface, that is coated or treated with one or more other layers.
  • a transferred surface e.g., a carburized, nitrated, carbonitride, induction hardening, age hardening, precipitation hardening, gas nitriding, normalizing, subzero treatment, annealing, shot pinning, or chemically, thermally, or physically or a combination of thereof, modified surface, that is coated or treated with one or more other layers.
  • a transferred surface e.g., a carburized, nitrated, carbonitride, induction hardening, age hardening, precipitation hard
  • the layer 110 can be any of those materials described herein in reference to the layer 110 in FIGS. 1 - 3 , 5 A, 5 B and 12 . If desired and as shown in FIG. 4 B , a layer 420 can be present between the treated surface 410 and the layer 110 of a device 450 .
  • the thickness of the layer/treated surface 410 may vary, for example, from about 0.1 microns to about 50 millimeters.
  • the treated surface 410 can be harder than the underlying substrate 105 if desired.
  • the treated surface 410 may have a case hardness of 50-70 HRC.
  • the base material can be, but is not limited to, a steel (low carbon steel, stainless steel, nitride steel, a steel alloy, low alloy steel, etc.) or other metal based materials.
  • the exact result of treatment may vary and typically treatment may be performed to enhance adhesion, alter surface roughness, improve wear resistance, improve the internal stress, reduce the internal stress, alter the hardness, alter lubricity, or for other reasons.
  • the layer 110 may be used to protect device 450 against corrosion, wear, heat and other impacts. In some cases, the treated surface 410 can negatively reduce the resistance of device 450 against corrosion, wear, corrosion and wear combined, heat, heat and wear combined, corrosion and heat combined or other scenario and the layer 110 may be used to improve the performance as needed.
  • the substrate 105 in FIGS. 4 A and 4 B may be, or may include, a metal material including, but not limited to, steel (carbon steel, tool steel, stainless steel, alloy steel, low alloy steel, etc.), copper, copper alloys, aluminum, aluminum alloys, chromium, chromium alloys, nickel, nickel alloys, molybdenum, molybdenum alloys, titanium, titanium alloys, nickel-chromium superalloys, nickel-molybdenum alloys, brass, bronze, a superalloy, Hastelloy, Inconel, Nichrome, Monel, or combinations thereof.
  • the substrate 105 may be porous or may be non-porous.
  • the layer 110 in FIGS. 4 A and 4 B typically includes one or more metals or two or more metals as noted in connection with FIGS. 1 - 3 , 5 A, 5 B and 12 herein.
  • the layer 110 in FIGS. 4 A and 4 B can be a metal alloy formed from two or more metals.
  • one of the metals in the layer 110 in FIGS. 4 A and 4 B is nickel.
  • one of the metals in the layer 110 in FIGS. 4 A and 4 B is molybdenum.
  • one of the metals in the layer 110 in FIGS. 4 A and 4 B is cobalt.
  • one of the metals in the layer 110 in FIGS. 4 A and 4 B is tungsten.
  • one of the metals in the layer 110 in FIGS. 4 A and 4 B is tin. In an additional embodiment, one of the metals in the layer 110 in FIGS. 4 A and 4 B is chromium. In other embodiments, the layer 110 in FIGS. 4 A and 4 B can include a nickel alloy, a molybdenum alloy, or combinations thereof. In other embodiments, the layer 110 in FIGS. 4 A and 4 B can include a molybdenum alloy including at least two metals (optionally excluding precious metals), a molybdenum alloy including at least molybdenum and a transition metal, a molybdenum alloy including at least molybdenum and a transition metal excluding precious metals.
  • the layer 110 in FIGS. 4 A and 4 B can include a nickel alloy including at least two metals excluding precious metals, nickel alloy including at least nickel and a refractory metal, nickel alloy including at least nickel and a refractory metal excluding precious metals.
  • the layer 110 in FIGS. 4 A and 4 B may be a nickel-molybdenum alloy or a nickel-molybdenum-phosphorous alloy.
  • the layer 110 in FIGS. 4 A and 4 B may consist of a nickel molybdenum alloy or a nickel molybdenum phosphorous alloy with no other materials being present in the layer 110 .
  • the layer 110 can include any of those materials, and material combinations, described in reference to FIG. 1 , FIG. 2 , or FIG. 3 .
  • the exact thickness of the layer 110 in FIGS. 4 A and 4 B may vary from 1 micron to about 2 mm depending on the article or device where the layer 110 is present, e.g., the thickness may vary from about 5 microns to about 200 microns.
  • the intermediate layer 420 when present as shown in FIG. 4 B , can improve adhesion between the layer 110 and the layer/surface 410 .
  • copper, nickel, or other materials may be present as a thin layer, e.g., 1 micron thick or less, between the layer 110 and the layer/surface 410 .
  • two or more layers may be present between the layer/surface 410 and the layer 110 .
  • one or more layers may be present on top of the alloy layer 110 .
  • a metal layer, a metal alloy layer, a layer with particles or composite materials or a layer with other materials may be present on top of the layer 110 .
  • FIG. 5 A an article or device 500 is shown where a layer 510 is present on top of the layer 110 .
  • an additional layer 560 can be present between the layer 510 and the layer 110 as shown in FIG. 5 B .
  • the exact materials present in the layers 510 , 560 may vary depending on the end use application of the device 500 .
  • the substrate 105 in FIGS. 5 A and 5 B may be, or may include, a metal material including, but not limited to, steel (carbon steel, tool steel, stainless steel, alloy steel, low alloy steel, etc.), copper, copper alloys, aluminum, aluminum alloys, chromium, chromium alloys, nickel, nickel alloys, molybdenum, molybdenum alloys, titanium, titanium alloys, nickel-chromium superalloys, nickel-molybdenum alloys, brass, bronze, a superalloy, Hastelloy, Inconel, Nichrome, Monel, or combinations thereof.
  • the substrate 105 may be porous or may be non-porous.
  • the layer 110 in FIGS. 5 A and 5 B typically includes one or more metals or two or more metals as noted in connection with FIG. 1 -4B and 12.
  • the layer 110 in FIGS. 5 A and 5 B can be a metal alloy formed from two or more metals.
  • one of the metals in the layer 110 in FIGS. 5 A and 5 B is nickel.
  • one of the metals in the layer 110 in FIGS. 5 A and 5 B is molybdenum.
  • one of the metals in the layer 110 in FIGS. 5 A and 5 B is tungsten.
  • one of the metals in the layer 110 in FIGS. 5 A and 5 B is cobalt.
  • the layer 110 in FIGS. 5 A and 5 B is chrome.
  • the layer 110 in FIGS. 5 A and 5 B can include a nickel alloy, a molybdenum alloy, a cobalt alloy, a tungsten alloy, or combinations thereof.
  • the layer 110 in FIGS. 5 A and 5 B may be a nickel-molybdenum alloy or a nickel-molybdenum-phosphorous alloy.
  • the layer 110 in FIGS. 5 A and 5 B may consist of a nickel-molybdenum alloy a nickel-molybdenum-phosphorous alloy with no other materials being present in the layer 110 .
  • the layer 110 in FIGS. 5 A and 5 B may include a nickel-molybdenum-phosphorous alloy.
  • the layer 110 in FIGS. 5 A and 5 B may consist of a nickel-cobalt alloy, nickel-tungsten alloy, nickel-phosphorous ally, cobalt, cobalt-molybdenum alloy, cobalt-tungsten alloy, cobalt-phosphorous alloy, nickel-molybdenum-phosphorous alloy, cobalt-molybdenum-phosphorous alloy, cobalt-tungsten-phosphorous alloy, chrome, chrome alloy, molybdenum-tin alloy, chrome compounds in the layer 110 .
  • 5 A and 5 B may consist of a molybdenum alloy including at least two metals (optionally excluding precious metals), a molybdenum alloy including at least molybdenum and a transition metal, a molybdenum alloy including at least molybdenum and a transition metal excluding precious metals, molybdenum alloy including at least molybdenum and a transition metal and phosphorous, molybdenum alloy including at least molybdenum and a transition metal and tin, molybdenum alloy composite including some particles and nano-particles.
  • the layers 510 , 560 may each independently be a nickel layer, a nickel molybdenum layer, a metal alloy, tin, chrome, or combinations of these materials.
  • the layers 510 may include a nitride, a metal carbide, a carbide, a boride, tungsten, tungsten carbide, a tungsten alloy, a tungsten compound, a stainless steel, a ceramic, chromium, chromium carbide, chromium oxide, a chromium compound, aluminum oxide, zirconia, titania, nickel, a nickel carbide, a nickel oxide, a nickel alloy, a cobalt compound, a cobalt alloy, a cobalt phosphorous alloy, molybdenum, a molybdenum compound, a nanocomposite, an oxide composite, or combinations thereof.
  • the layers 510 may protect layer 110 against wear. In another embodiment, the layers 110 may protect the substrate 105 against corrosion. In another embodiments, the layer 110 may protect layer 510 against delamination, chipping off, or wearing away, In another embodiment, layer 110 may increase the adhesion of layer 510 to the substrate 105 . In another embodiment, the layer 110 may improve the brightness for example by reflecting more light.
  • an article or device can include an outer metal layer and at least one underlying alloy layer.
  • FIG. 6 several layers are shown including layer 110 , 610 and 620 .
  • the substrate is intentionally omitted from FIGS. 6 - 8 to simplify the figures.
  • a substrate is typically adjacent to the layer 110 though it may adjacent to another layer if desired.
  • the layer 110 in FIG. 6 typically includes one or more metals or two or more metals as described in reference to FIG. 1 -5B and 12 or other materials as described herein.
  • the layer 110 in FIG. 6 can be a metal alloy formed from two or more metals.
  • one of the metals in the layer 110 in FIG. 6 is nickel. In other embodiments, one of the metals in the layer 110 in FIG.
  • the layer 110 in FIG. 6 is molybdenum.
  • the layer 110 in FIG. 6 can include a nickel alloy, a molybdenum alloy, or combinations thereof.
  • the layer 110 in FIG. 6 may be a nickel-molybdenum alloy or a nickel-molybdenum phosphorous alloy.
  • the layer 110 in FIG. 6 may consist of a nickel-molybdenum alloy or a nickel-molybdenum phosphorous alloy with no other materials being present in the layer 110 .
  • the exact thickness of the layer 110 in FIG. 6 may vary from 1 micron to about 2 mm, e.g., about 5 microns to about 200 microns, depending on the device where the layer 110 is present.
  • the layer 610 in FIG. 6 typically includes one or more metals or metal alloys, e.g., nickel, copper, molybdenum, nickel-molybdenum, nickel-molybdenum-phosphorous or combinations thereof.
  • the thickness of the layer 610 is typically can be more or less than that of the layer 110 .
  • the thickness of the layer 610 may vary from about 0.1 micron to about 1 micron.
  • the metal in the layer 610 may be present in the form of an alloy with another metal.
  • the layer 620 typically also includes one or more metals, e.g., nickel, copper, molybdenum, nickel-molybdenum, nickel-molybdenum-phosphorous or combinations thereof.
  • the metal of the layer 620 may be present in alloy or non-alloy form and can be present at a higher or lower thickness than a thickness of the layer 610 .
  • the layer 620 may be present at a thickness of about 0.1 micron to about 0.5 microns.
  • the layer 620 can increase wear resistance, can increase conductivity, can provide a shinier surface, etc.
  • the layers 610 , 620 can include the same materials, but the materials may be present in different amounts.
  • each of the layers 610 , 620 can be a nickel-molybdenum alloy, but an amount of molybdenum in the layer 610 is different than an amount of the molybdenum in the layer 620 .
  • the layer 110 described herein in reference to FIGS. 1 - 6 can be present between two non-compatible materials to permit the non-compatible materials to be present in a coating or device.
  • non-compatible generally refers to materials which do not readily bond or adhere to each other or have incompatible physical properties making them unsuitable to be used together.
  • a metal alloy in the layer 110 , it can be possible to include certain coatings in a device with a copper substrate.
  • an alloy layer of Ni-Mo or Ni-Mo-P may be present between a copper substrate and another metal layer.
  • the overall wear resistance of the outer metal layer can increase as well.
  • one or more of the layers shown in FIGS. 1 - 6 may include tin (Sn).
  • tin can provide some corrosion resistance.
  • FIG. 7 several layers are shown including layers 110 , 710 and 720 .
  • a substrate (not shown) is typically adjacent to the layer 110 though it maybe adjacent to the layer 72 if desired.
  • the layer 110 in FIG. 7 typically includes one or more metals or two or more metals as described in reference to FIGS. 1 - 6 and 12 or other materials as described herein.
  • the layer 110 in FIG. 7 can be a metal alloy formed from two or more metals.
  • one of the metals in the layer 110 in FIG. 7 is nickel.
  • one of the metals in the layer 110 in FIG. 7 is molybdenum.
  • the layer 110 in FIG. 7 can include a nickel alloy, a molybdenum alloy, or combinations thereof.
  • the layer 110 in FIG. 7 may be a nickel-molybdenum alloy or nickel-molybdenum-phosphorous alloy.
  • the layer 110 in FIG. 7 may consist of a nickel-molybdenum alloy or a nickel-molybdenum-phosphorous alloy with no other materials being present in the layer 110 .
  • the exact thickness of the layer 110 in FIG. 7 may vary from 1 micron to about 2 mm, e.g. about 5 microns to about 200 microns, depending on the article or device where the layer 110 is present.
  • the layer 710 in FIG. 7 typically includes one or more metals or metal alloys or combinations thereof.
  • the thickness of the layer 710 can be more thick or less thick than a thickness of the layer 110 .
  • the thickness of the layer 710 may vary from about 0.1 micron to about 1 micron.
  • the metal in the layer 710 may be present in the form of an alloy with another material, e.g., another metal.
  • the layer 720 can include, for example, tin or a tin alloy, etc.
  • the exact thickness of the layer 720 may vary and can be thicker or thinner than a thickness of the layer 710 .
  • the layer 720 may be present at a thickness of more than 5 microns, e.g.
  • the layer 720 can be present to assist in keeping the surface clean, can increase wear resistance, can increase conductivity, can provide a shinier surface, can resist hydraulic fluids, etc.
  • the layers 710 , 720 can include the same materials, but the materials may be present in different amounts.
  • each of the layers 710 , 720 can be a tin alloy, but an amount of tin in the layer 710 is different than an amount of tin in the layer 720 .
  • a tin or tin alloy layer may be present directly on a metal or metal alloy layer as shown in FIG. 8 .
  • Several layers are shown including layer 110 and 720 . No layer is present between the layer 110 and the layer 720 .
  • a substrate (not shown) is typically attached to the layer 110 .
  • the layer 110 in FIG. 8 typically includes one or more metals or two or more metals as described in reference to FIG. 1 , FIG. 2 or FIG. 3 or other materials as described herein.
  • the layer 110 in FIG. 8 can be a metal alloy formed from two or more metals.
  • one of the metals in the layer 110 in FIG. 8 is nickel. In other embodiments, one of the metals in the layer 110 in FIG.
  • the layer 110 in FIG. 8 is molybdenum.
  • the layer 110 in FIG. 8 can include a nickel alloy, a molybdenum alloy, or combinations thereof.
  • the layer 110 in FIG. 8 may be a nickel-molybdenum alloy or a nickel-molybdenum-phosphorous alloy.
  • the layer 110 in FIG. 8 may consist of a nickel-molybdenum alloy or a nickel-molybdenum-phosphorous alloy with no other materials being present in the layer 110 .
  • the layer 720 can include, for example, tin or a tin alloy, etc.
  • the exact thickness of the layer 720 may vary and is typically thicker than the layer 710 .
  • the layer 720 may be present at a thickness of more than 5 microns, e.g. 10-500 microns or 10-200 microns.
  • the layer 720 can be present to assist in keeping the surface clean, can increase wear resistance, can increase conductivity, can provide a shinier surface, etc.
  • the tin layers described in reference to FIGS. 7 and 8 could be replaced with a chromium layer.
  • chromium can be used to increase hardness and can also be used in decorative layers to enhance the outward appearance of the articles or devices.
  • One or both of the layers 710 , 720 could be a chromium layer or a layer comprising chromium.
  • an illustration is shown including a substrate 905 and a first layer 912 .
  • the surface of the substrate is shown as being rough for illustration purposes, and the layer 912 generally conforms to the various peaks and valleys on the surface.
  • the thickness of the layer 912 may be the same or may be different at different areas.
  • the substrate 905 may be, or may include, a metal material including, but not limited to, steel (carbon steel, tool steel, stainless steel, alloy steel, low alloy steel, etc.), copper, copper alloys, aluminum, aluminum alloys, chromium, chromium alloys, nickel, nickel alloys, molybdenum, molybdenum alloys, titanium, titanium alloys, nickel-chromium superalloys, nickel-molybdenum alloys, brass, bronze, a superalloy, Hastelloy, Inconel, Nichrome, Monel, or combinations thereof.
  • the substrate 905 may be porous or may be non-porous.
  • the coating 912 can be a metal alloy formed from two or more metals as described in reference to layer 110 in FIGS. 1 - 8 and 12 or other materials as described herein.
  • one of the metals in the coating 912 is nickel.
  • one of the metals in the coating 912 is molybdenum.
  • the coating 912 may be a nickel-molybdenum alloy or a nickel-molybdenum phosphorous alloy.
  • the coating 912 may consist of a nickel-molybdenum alloy or a nickel-molybdenum phosphorous alloy with no other materials being present in the coating 912 .
  • the exact thickness of the coating 912 may vary from 1 micron to about 2 mm, e.g. about 5 microns to about 200 microns, depending on the article or device where the coating 912 is present. While the exact function of the layer 912 may vary, as discussed further below, the layer 912 and roughened surface of the substrate 905 can provide a texture that renders the surface less prone to scattering light or showing fingerprints.
  • one or more layers may be present between the substrate 905 and the layer 912 .
  • one or more intermediate layers may be present between the substrate 905 and the layer 912 .
  • the intermediate layer(s) can improve adhesion between the layer 912 and the substrate 905 .
  • copper, nickel, or other materials may be present as a thin layer, e.g., 1 micron thick or less, between the coating 912 and the substrate 905 .
  • the intermediate layer(s) can function as a brightener to increase the overall shiny appearance of the article surface or device surface.
  • the intermediate layer(s) can act to increase corrosion resistance of the coating.
  • the substrate 905 used with the intermediate layer may be, or may include, a metal material including, but not limited to, steel (carbon steel, tool steel, stainless steel, etc.), copper, copper alloys, aluminum, aluminum alloys, chromium, chromium alloys, nickel, nickel alloys, titanium, titanium alloys, nickel-chromium superalloys, nickel-molybdenum alloys, brass, a plastic, a polymer or combinations thereof.
  • the coating 912 used with the intermediate layer(s) typically includes one or more metals or two or more metals.
  • the coating 912 used with the intermediate layer(s) can be a metal alloy formed from two or more metals as described in reference to the layer 110 in FIGS.
  • one of the metals in the coating 912 used with the intermediate layer(s) is nickel. In other embodiments, one of the metals in the coating 912 used with the intermediate layer(s) is molybdenum. In other embodiments, the coating 912 used with the intermediate layer(s) can include a nickel alloy, a molybdenum alloy or combinations thereof. In other examples, the coating 912 used with the intermediate layer(s) may be a nickel-molybdenum alloy or a nickel-molybdenum phosphorous alloy.
  • the coating 912 used with the intermediate layer(s) may consist of a nickel-molybdenum alloy or a nickel-molybdenum phosphorous alloy with no other materials being present in the coating 912 .
  • the exact thickness of the coating 912 used with the intermediate layer(s) may vary from 1 micron to about 2 mm, e.g. about 5 microns to about 200 microns, depending on the article or device where the coating 912 is present.
  • an article or device that includes a substrate 105 and a roughened surface layer 1012 .
  • the roughened surface layer 1012 can include any of those materials described in connection with the layer 110 .
  • the substrate 105 is generally smooth and the layer 1012 may be subjected to post deposition steps to roughen the surface layer 1012 .
  • the thickness of the layer 1012 is different at different areas.
  • the substrate 105 shown in FIG. 10 the substrate 105 shown in FIG.
  • the substrate 105 may be porous or may be non-porous.
  • the coating 1012 typically includes one or more metals or two or more metals as described in reference to the layer 110 in FIGS. 1 - 8 and 12 or other materials as described herein.
  • the coating 1012 can be a metal alloy formed from two or more metals.
  • one of the metals in the coating 1012 is nickel.
  • one of the metals in the coating 1012 is molybdenum.
  • the coating 1012 can include a nickel alloy, a molybdenum alloy, or combinations thereof.
  • the coating 1012 may be a nickel-molybdenum alloy or a nickel-molybdenum phosphorous alloy.
  • the coating 1012 may consist of a nickel-molybdenum alloy or a nickel-molybdenum phosphorous alloy with no other materials being present in the coating 1012 .
  • the exact thickness of the coating 1012 may vary from 0.1 micron to about 2 mm, e.g. about 5 microns to about 200 microns, depending on the article or device where the coating 1012 is present. While the exact function of the layer 1012 may vary, as discussed further below, the layer 1012 can provide a texture that renders the surface less prone to scattering light or showing fingerprints.
  • one or more layers may be present between the substrate 105 and the layer 1012 .
  • one or more intermediate layers may be present between the substrate 105 and the layer 1012 .
  • the intermediate layer(s) can improve adhesion between the layer 1012 and the substrate 105 .
  • copper, nickel or other materials may be present as a thin layer, e.g., 1 micron thick or less, between the coating 1012 and the substrate 105 .
  • the intermediate layer(s) can function as a brightener to increase the overall shiny appearance of the article or device. In other configurations, the intermediate layer(s) can act to increase corrosion resistance of the article or device.
  • the substrate 105 used with the intermediate layer may be, or may include, a metal material including, but not limited to, steel (carbon steel, tool steel, stainless steel, alloy steel, low alloy steel, etc.), copper, copper alloys, aluminum, aluminum alloys, chromium, chromium alloys, nickel, nickel alloys, molybdenum, molybdenum alloys, titanium, titanium alloys, nickel-chromium superalloys, nickel-molybdenum alloys, brass, bronze, a superalloy, Hastelloy, Inconel, Nichrome, Monel, or combinations thereof.
  • the substrate 105 may be porous or may be non-porous.
  • the coating 1012 used with the intermediate layer(s) typically includes one or more metals or two or more metals as described in reference to the layer 110 in FIGS. 1 - 8 and 12 or other materials as described herein.
  • the coating 1012 used with the intermediate layer(s) can be a metal alloy formed from two or more metals.
  • one of the metals in the coating 1012 used with the intermediate layer(s) is nickel.
  • one of the metals in the coating 1012 used with the intermediate layer(s) is molybdenum.
  • the coating 1012 used with the intermediate layer(s) can include a nickel alloy, a molybdenum alloy or combinations thereof.
  • the coating 1012 used with the intermediate layer(s) may be a nickel-molybdenum alloy or a nickel-molybdenum phosphorous alloy. In certain configurations, the coating 1012 used with the intermediate layer(s) may consist of a nickel-molybdenum alloy or a nickel-molybdenum-phosphorous alloy with no other materials being present in the coating 1012 .
  • the exact thickness of the coating 1012 used with the intermediate layer(s) may vary from 1 micron to about 2 mm, e.g. about 10 microns to about 200 microns, depending on the article or device where the coating 1012 is present.
  • a surface coating can be applied to a roughened surface to provide an overall smooth surface.
  • An illustration is shown in FIG. 11 where a roughened substrate 905 includes a layer 1110 that fills in the peaks and valleys and provides a generally smoother outer surface.
  • the surface layer 1110 can include any of those materials described in connection with the layer 110 in FIGS. 1 - 8 and 12 or other materials as described herein.
  • the substrate 905 may have been subjected to a roughening process and the layer 1110 may be subjected to post deposition steps, e.g., shot peening or other steps, to smooth the surface layer 1110 in the event that it is not smooth after deposition.
  • the substrate 905 may be, or may include, a metal material including, but not limited to, steel (carbon steel, tool steel, stainless steel, alloy steel, low alloy steel, etc.), copper, copper alloys, aluminum, aluminum alloys, chromium, chromium alloys, nickel, nickel alloys, molybdenum, molybdenum alloys, titanium, titanium alloys, nickel-chromium superalloys, nickel-molybdenum alloys, brass, bronze, a superalloy, Hastelloy, Inconel, Nichrome, Monel, or combinations thereof.
  • steel carbon steel, tool steel, stainless steel, alloy steel, low alloy steel, etc.
  • copper copper alloys
  • aluminum aluminum alloys
  • chromium, chromium alloys nickel, nickel alloys, molybdenum, molybdenum alloys
  • the substrate 905 may be porous or may be non-porous.
  • the coating 1110 typically includes one or more metals or two or more metals as described herein in connection with the layer 110 .
  • the coating 1110 can be a metal alloy formed from two or more metals.
  • one of the metals in the coating 1110 is nickel.
  • one of the metals in the coating 1110 is molybdenum.
  • the coating 1110 can include a nickel alloy, a molybdenum alloy, or combinations thereof.
  • the coating 1110 may be a nickel-molybdenum alloy or a nickel-molybdenum phosphorous alloy.
  • the coating 1110 may consist of a nickel-molybdenum alloy or a nickel-molybdenum-phosphorous alloy with no other materials being present in the coating 1110 .
  • the exact thickness of the coating 1110 may vary from 1 micron to about 2 mm, e.g., about 5 microns to about 200 microns, depending on the article or device where the coating 1110 is present. While the exact function of the layer 1110 may vary, as discussed further below, the layer 1110 can provide a smoother or shinier surface that is more aesthetically pleasing.
  • one or more layers may be present between the substrate 905 and the layer 1110 .
  • one or more intermediate layers may be present between the substrate 905 and the layer 1110 .
  • the intermediate layer(s) can improve adhesion between the layer 1110 and the substrate 905 .
  • copper, nickel or other materials may be present as a thin layer, e.g., 1 micron thick or less, between the coating 1110 and the substrate 905 .
  • the intermediate layer(s) can function as a brightener to increase the overall shiny appearance of the article or device. In other configurations, the intermediate layer(s) can act to increase corrosion resistance of the coating.
  • the substrate 105 used with the intermediate layer may be, or may include, a metal material including, but not limited to, steel (carbon steel, tool steel, stainless steel, alloy steel, low alloy steel, etc.), copper, copper alloys, aluminum, aluminum alloys, chromium, chromium alloys, nickel, nickel alloys, molybdenum, molybdenum alloys, titanium, titanium alloys, nickel-chromium superalloys, nickel-molybdenum alloys, brass, bronze, a superalloy, Hastelloy, Inconel, Nichrome, Monel, or combinations thereof.
  • the substrate 105 may be porous or may be non-porous.
  • the coating 1110 used with the intermediate layer(s) typically includes one or more metals or two or more metals.
  • the coating 1110 used with the intermediate layer(s) can be a metal alloy formed from two or more metals as described in reference to the layer 110 in FIGS. 1 - 8 and 12 or other materials as described herein.
  • one of the metals in the coating 1110 used with the intermediate layer(s) is nickel.
  • one of the metals in the coating 1110 used with the intermediate layer(s) is molybdenum.
  • the coating 1110 used with the intermediate layer(s) can include a nickel alloy, a molybdenum alloy, or combinations thereof.
  • the coating 1110 used with the intermediate layer(s) may be a nickel-molybdenum alloy or a nickel-molybdenum-phosphorous alloy. In certain configurations, the coating 1110 used with the intermediate layer(s) may consist of a nickel-molybdenum alloy or a nickel-molybdenum-phosphorous alloy with no other materials being present in the coating 1012 .
  • the exact thickness of the coating 1110 used with the intermediate layer(s) may vary from 0.1 micron to about 2 mm, e.g. about 5 microns to about 200 microns, depending on the article or device where the coating 1110 is present.
  • a device or article described herein may include coating with a first layer, a second layer and a third layer on a surface of a substrate.
  • an article or device 1200 includes a substrate 105 , a first layer 110 , a second layer 320 and a third layer 1230 .
  • Each of the layers 110 , 320 and 1230 may include any of those materials described in connection with the layers 110 , 320 described above.
  • the layer 1230 may be a polymeric coating or a metal or non-metal based coating.
  • the layer 110 is typically a metal alloy layer including two or more metals as noted in connection with the layer 110 of FIGS. 1 - 8 or other materials as described herein.
  • the articles and devices described herein can include a substrate with a coated surface where the coated surface comprises a surface coating.
  • the surface coating may comprise two or more layers.
  • an alloy layer as noted in connection with layer 110 can be on a surface of a substrate 105 and a second layer can be on the alloy layer 110 .
  • the alloy layer can include molybdenum as noted herein, e.g., molybdenum in combination with one or more of nickel, tungsten, cobalt, chromium, tin, phosphorous, iron, magnesium or boron.
  • the second layer is on the alloy layer can may comprise a ceramic or an alloy or some material which may be harder than the underlying layer with molybdenum.
  • the alloy layer with molybdenum may be harder than the second layer depending on the intended use of the article or device.
  • the second layer may comprise one or more of tungsten, chromium, aluminum, zirconium, titanium, nickel, cobalt, molybdenum, silicon, boron or combinations thereof.
  • the ceramic comprises metal nitride, a nitride, a metal carbide, a carbide, a boride, tungsten, tungsten carbide, a tungsten alloy, a tungsten compound, a stainless steel, a ceramic, chromium, chromium carbide, chromium oxide, a chromium compound, aluminum oxide, zirconia, zirconium oxide titania, nickel, a nickel carbide, a nickel oxide, a nickel alloy, a cobalt compound, a cobalt alloy, a cobalt phosphorous alloy, molybdenum, a molybdenum compound, a nanocomposite, an oxide composite, or combinations thereof.
  • the second layer may have a Vickers hardness of 600 Vickers or more.
  • the articles or devices described herein may comprise materials which provide a lubricious alloy layer.
  • a substrate can include a coated surface with a smooth alloy layer.
  • the alloy layer can be formed on the substrate and may comprise molybdenum or other materials as noted in connection with the layer 110 in the figures. A weight percentage of the molybdenum or other metal may be 35% by weight or less. A surface roughness Ra of the lubricious alloy layer may be less than 1 micron.
  • the alloy layer can also include one or more of nickel, tungsten, cobalt, chromium, tin, phosphorous, iron, magnesium or boron.
  • the surface coating can include two or more layers.
  • a base layer may be present with an alloy layer formed or added to the base layer.
  • the base layer can be an intermediate layer between a substrate and the alloy layer or may be a standalone layer that is self-supporting and not present on any substrate.
  • the base layer may comprise one or more of a nickel layer, a copper layer, a nickel-phosphorous layer, a nickel-molybdenum layer or other materials.
  • the coating on the base layer may comprise one or more of molybdenum, nickel, tungsten, cobalt, chromium, tin, phosphorous, iron, magnesium or boron.
  • the alloy layer may be an exposed outer later or may be free of precious metals. If desired, particles may also be present in one or more of the layers. Illustrative particles are described herein.
  • a surface coating that includes two or more layers including the same materials may be present on the articles described herein.
  • one of the layers may be a standalone layer that is self-supporting and not present on any substrate.
  • a first alloy layer comprising nickel and molybdenum may be present in combination with a second alloy layer comprising nickel and molybdenum.
  • the amounts of the materials in different layers may be different or different layers may have different additives, e.g., different particles or other materials.
  • one of the layers may be rougher than the other layer by altering the amounts of the materials in one of the layers.
  • a weight percent of molybdenum in the second alloy layer can be less than 30% by weight and the roughness of the overall surface coating can be less than 1 um Ra.
  • Each of the two layers may independently include one or more of molybdenum, nickel, tungsten, cobalt, chromium, tin, phosphorous, iron, magnesium or boron.
  • one of the alloy layers may be free of precious metals. In other instances, each of the alloy layer is free of precious metals.
  • particles may also be present in one or more of the alloy layers. Illustrative particles are described herein.
  • an article can include a surface coating that has an alloy layer described herein along with a chromium layer on top of the alloy layer.
  • the alloy layer can include molybdenum and one or more of nickel, tungsten, cobalt, chromium, tin, phosphorous, iron, magnesium or boron.
  • the chromium layer may be an alloy including another metal or material. In some examples, the chromium layer is free of precious metals. In other instances, each of the alloy layer and the chromium layer is free of precious metals.
  • a surface coating can include a nickel molybdenum phosphorous (Ni-Mo-P) alloy layer.
  • Ni-Mo-P nickel molybdenum phosphorous
  • one or more other materials may be present in the nickel molybdenum phosphorous alloy layer.
  • one or more of tungsten, cobalt, chromium, tin, iron, magnesium or boron may be present. If desired, particles may also be present.
  • the Ni-Mo-P alloy layer may include molybdenum at 35% by weight or less in the alloy layer or in the surface coating.
  • the coating layers described herein can be applied to the substrate using suitable methodologies including, but not limited to, vacuum deposition, physical vapor deposition (PVD), chemical vapor deposition (CVD), plasma deposition, brushing, spin-coating, spray coating, electrodeposition/electroplating, electroless deposition/plating, high velocity oxygen fuel (HVOF) coating, thermal spraying or other suitable methods.
  • suitable methodologies including, but not limited to, vacuum deposition, physical vapor deposition (PVD), chemical vapor deposition (CVD), plasma deposition, brushing, spin-coating, spray coating, electrodeposition/electroplating, electroless deposition/plating, high velocity oxygen fuel (HVOF) coating, thermal spraying or other suitable methods.
  • one or more of the coating layers may be deposited using vacuum deposition.
  • vacuum deposition generally deposits a layer of material atom-by-atom or molecule-by-molecule on a surface of a substrate.
  • Vacuum deposition processes can be used to deposit one or more materials with a thickness from one or more atoms up to a few millimeters.
  • PVD physical vapor deposition
  • CVD chemical vapor deposition
  • plasma deposition e.g., plasma enhanced chemical vapor deposition or plasma assisted chemical vapor deposition
  • PD generally involves creating a plasma discharge from reacting gases including the material to be deposited and/or subjecting an already deposited material to ions in a plasma gas to modify the coating layer.
  • atomic layer deposition ALD can be used to provide a coating layer on a surface. In ALD, a substrate surface is exposed to repeated amounts of precursors that can react with a surface of a material to build up the coating layer.
  • one or more of the coating layers described herein can be deposited into a surface of a substrate using brushing, spin-coating, spray coating, dip coating, electrodeposition (e.g., electroplating, cathodic electrodeposition, anodic electrodeposition, etc.), electroless plating, electrocoating, electrophoretic deposition, or other techniques.
  • electrodeposition e.g., electroplating, cathodic electrodeposition, anodic electrodeposition, etc.
  • electroless plating e.g., electroplating, cathodic electrodeposition, anodic electrodeposition, etc.
  • electroless plating e.g., electroless plating, electrocoating, electrophoretic deposition, or other techniques.
  • one or more layers of the coating may be applied using electrodeposition.
  • electrodeposition uses a voltage applied to the substrate placed in a bath to form the coating on the charged substrate.
  • ionic species present in the bath can be reduced using the applied voltage to deposit the ionic species in a solid form onto a surface (or all surfaces) of the substrate.
  • the ionic species can be deposited to provide a metal coating, a metal alloy coating or combinations thereof.
  • the resulting properties of the formed, electrodeposited coating may be selected or tuned to provide a desired result.
  • the ionic species may be dissolved or solvated in an aqueous solution or water.
  • the aqueous solution may include suitable dissolved salts, inorganic species or organic species to facilitate electrodeposition of the coating layer(s) on the substrate.
  • the liquid used in the electrodeposition bath may generally be non-aqueous, e.g., include more than 50% by volume of non-aqueous species, and may include hydrocarbons, alcohols, liquified gases, amines, aromatics and other non-aqueous materials.
  • the electrodeposition bath includes the species to be deposited as a coating on the substrate.
  • the bath can include ionic nickel or solvated nickel.
  • molybdenum is deposited into a substrate, the bath can include ionic molybdenum or solvated molybdenum.
  • the bath can include more than a single species, e.g., the bath may include ionic nickel and ionic molybdenum that are co-electrodeposited to form a nickel-molybdenum alloy as a coating layer on a substrate.
  • the exact form of the materials added to the bath to provide ionic or solvated species can vary.
  • the species may be added to the bath as metal halides, metal fluorides, metal chlorides, metal carbonates, metal hydroxides, metal acetates, metal sulfates, metal nitrates, metal nitrites, metal chromates, metal dichromates, metal permanganates, metal platinates, metal cobalt-nitrites, metal hexachloroplatinates, metal citrates, ammonium salt of the metal, metal cyanides, metal oxides, metal phosphates, metal monobasic sodium phosphates, metal dibasic sodium phosphates, metal tribasic sodium phosphates, sodium salt of the metal, potassium salt of the metal, metal sulfamate, metal nitrite, and combinations thereof.
  • a single material that includes both of the metal species to be deposited can be dissolved in the electrodeposition bath, e.g., a metal alloy salt can be dissolved in a suitable solution prior to electrodeposition.
  • the specific materials used in the electrodeposition bath depends on the particular alloy layer to be deposited.
  • Illustrative materials include, but are not limited to, nickel sulfate, nickel sulfamate, nickel chloride, sodium tungstate, tungsten chloride, sodium molybdate, ammonium molybdate, cobalt sulfate, cobalt chloride, chromium sulfate, chromium chloride, chromic acid, stannous sulfate, sodium stannate, hypophosphite, sulfuric acid, nickel carbonate, nickel hydroxide, potassium carbonate, ammonium hydroxide, hydrochloric acid or other materials.
  • the exact amount or concentration of the species to be electrodeposited onto a substrate may vary.
  • the concentration of the species may vary from about 1 gram/Liter to about 400 grams/Liter.
  • additional material can be added to the bath to increase an amount of the species available for electrodeposition.
  • the concentration of the species to be deposited may be maintained at a substantially constant level during electrodeposition by continuously adding material to the bath.
  • the pH of the electrodeposition bath may vary depending on the particular ionic species present in the bath.
  • the pH may vary from 1 to about 13, but in certain instances, the pH may be less than 1, or even less than 0, or greater than 13 or even greater than 14.
  • the pH may range, in certain instances, from 4 to about 12. It will be recognized, however, that the pH may be varied depending on the particular voltage and electrodeposition conditions that are selected for use. Some pH regulators and buffers may be added to the bath.
  • pH regulators include but not limited to boric acid, hydrochloric acid, sodium hydroxide, potassium hydroxide, ammonium hydroxide, glycine, Sodium acetate, buffered saline, Cacodylate buffer, Citrate buffer, Phosphate buffer, Phosphate-citrate buffer, Barbital buffer, TRIS buffers, Glycine-NaOH buffer, and any combination thereof.
  • alloy plating can use a complexing agent.
  • a complexing agent for example, the main role of complexing agents in an alloy deposition process is making complexations of different metallic ions. Therefore, without a proper complexing agent, simultaneous deposition of nickel and molybdenum and alloy formation will not occur.
  • complexing agents include but are not limited to phosphates, phosphonates, polycarboxylates, zeolites, citrates, ammonium hydroxide, ammonium salts, citric acid, ethylenediaminetetraacetic acid, diethylene-triaminepentaacetic acid, aminopolycarboxylates, nitrilotriacetic acid, IDS (N-(1,2-dicarboxyethyl)-D,L-aspartic acid (iminodisuccinic acid), DS (polyaspartic acid), EDDS (N,N′-ethylenediaminedisuccinic acid), GLDA (N,N-bis(carboxylmethyl)-L-glutamic acid) and MGDA (methylglycinediacetic acid), hexamine cobalt (III) chloride, ethylene glycol-bis( ⁇ -aminoethyl ether)-N,N,N′,N′-tetraacetic acid
  • a suitable voltage can be applied to cathodes and anodes of the electrodeposition bath to promote formation of the layer(s) described herein on a substrate.
  • a direct current (DC) voltage can be used.
  • an alternating current (AC) optionally in combination with current pulses can be used to electrodeposit the layers.
  • AC electrodeposition can be carried out with an AC voltage waveform, in general sinusoidal, squared, triangular, and so on. High voltages and current densities can be used to favor the tunneling of electrons through an oxide base layer that can form on the substrate.
  • the base layer can conduct in the direction of the cathode, which favors the deposition of the material and avoids its reoxidation during the oxidant half-cycle.
  • illustrative current density ranges that can be used in electrodeposition include, but are not limited to 1 mA/cm 2 DC to about 600 mA/cm 2 DC, more particularly about 1 mA/cm 2 DC to about 300 mA/cm 2 DC.
  • the current density can vary from 5 mA/cm 2 DC to about 300 mA/cm 2 DC, from 20 mA/cm 2 DC to about 100 mA/cm 2 DC, from 100 mA/cm 2 DC to about 400 mA/cm 2 DC or any value falling within these illustrative ranges.
  • the exact time that the current is applied may vary from about 10 seconds to a few days, more particularly about 40 seconds to about 2 hours.
  • a pulse current can also be applied instead of a DC current if desired.
  • the electrodeposition may use pulse current or pulse reverse current is during the electrodeposition of the alloy layer.
  • PED pulse electrodeposition
  • the potential or current is alternated swiftly between two different values. This results in a series of pulses of equal amplitude, duration and polarity, separated by zero current.
  • Each pulse consists of an ON-time (TON) during which potential and/current is applied, and an OFF-time (TOFF) during which zero current is applied.
  • TON ON-time
  • TOFF OFF-time
  • the first layer and the second layer of the coating may be applied using the same or different electrodeposition baths.
  • a first layer can be applied using a first aqueous solution in an electrodeposition bath. After application of a voltage for a sufficient period to deposit the first layer, the voltage may be reduced to zero, the first solution can be removed from the bath and a second aqueous solution comprising a different material can be added to the bath. A voltage can then be reapplied to electrodeposit a second layer.
  • two separate baths can be used, e.g., a reel-to-reel process can be used, where the first bath is used to electrodeposit the first layer and a second, different bath is used to deposit the second layer.
  • individual articles may be connected such that they can be sequentially exposed to separate electrodeposition baths, for example in a reel-to-reel process.
  • articles may be connected to a common conductive substrate (e.g., a strip).
  • each of the electrodeposition baths may be associated with separate anodes and the interconnected individual articles may be commonly connected to a cathode.
  • illustrative materials include cations of one or more of the following metals: nickel, molybdenum, copper, aluminum, cobalt, tungsten, gold, platinum, palladium, silver, or combinations thereof.
  • the exact anion form of these metals may vary from chlorides, acetates, sulfates, nitrates, nitrites, chromates, dichromates, permanganates, platinates, cobalt nitrites, hexachloroplatinates, citrates, cyanides, oxides, phosphates, monobasic sodium phosphates, dibasic sodium phosphates, tribasic sodium phosphates and combinations thereof.
  • the electrodeposition process can be designed to apply an alloy layer including molybdenum and one or more of nickel, tungsten, cobalt, chromium, tin, phosphorous, iron, magnesium and boron or at least one compound comprising one or more of nickel, tungsten, cobalt, chromium, tin, phosphorous, iron, magnesium or boron.
  • the resulting alloy layer may be free of precious metals.
  • the coating layer 110 there may be no intervening or intermediate layers between the coating layer 110 and the substrate 105 .
  • the coating layer 110 can be deposited directly onto the substrate surface 105 without any intervening layer between them.
  • an intermediate layer may be present between the coating layer 110 and the surface 106 of the substrate 105 .
  • the intermediate layer can be formed using the same methods used to form the coating layer 110 or different methods used to form the coating layer 110 .
  • an intermediate layer can include one or more of copper, a copper alloy, nickel, a nickel alloy, a nickel-phosphorous alloy, a nickel-phosphorous alloy including hard particles or other compounds such as phosphorous, boron, boron nitride, silicon carbide, aluminum oxide, molybdenum disulfide, hard particles with a hardness of HV >1000, hard particles with size less 500 nm, highly conductive particles, carbon nanotubes and or carbon nano-particles.
  • the intermediate layer can include an alloy of nickel that is less magnetic than nickel alone.
  • the intermediate layer may be substantially less than the coating layer 110 and can be used to enhance adhesion of the coating layer 110 to the substrate 105 .
  • the intermediate layer can be 90%, 80%, 70%, 60%, 50%, 40%, 30%, 20% or 10% less thick than a thickness of the coating layer 110 .
  • the layer between the substrate and the alloy layer may be a “nickel strike” layer as is commonly known in the electroplating arts.
  • one or more of the materials of a coating layer can be provided using a soluble anode.
  • the soluble anode can dissolve in the electrodeposition bath to provide the species to be deposited.
  • the soluble anode may take the form of a disk, a rod, a sphere, strips of materials or other forms.
  • the soluble anode can be present in a carrier or basket coupled to a power source.
  • one or more of the coating layers described herein may be deposited using an anodization process.
  • Anodization generally uses the substrate as the anode of an electrolytic cell. Anodizing can change the microscopic texture of the surface and the resulting metal coating near the surface. For example, thick coatings are often porous and can be sealed to enhance corrosion resistance. Anodization can result in harder and more corrosion resistant surfaces.
  • one of the coating layers of the articles described herein can be produced using an anodization process and another coating layer may be produced using a non-anodization process. In other instances, each coating layer in the article can be produced using an anodization process. The exact materials and process conditions using anodization may vary.
  • the anodized layer is grown on a surface of the substrate by applying a direct current through an electrolyte solution including the material to be deposited.
  • the material to be deposited can include magnesium, niobium, tantalum, zinc, nickel, molybdenum, copper, aluminum, cobalt, tungsten, gold, platinum, palladium, silver, or alloys or combinations thereof.
  • Anodization is typically performed under acidic conditions and may include chromic acid, sulfuric acid, phosphoric acid, organic acids or other acids.
  • the coatings described herein may be applied in the presence of other additive or agents.
  • wetting agents, leveling agents, brighteners, defoaming agents and/or emulsifiers can be present in aqueous solutions that include the materials to be deposited onto the substrate surface.
  • Illustrative additive and agents include, but are not limited to, thiourea, domiphen bromide, acetone, ethanol, cadmium ion, chloride ion, stearic acid, ethylenediamine dihydrochloride (EDA), saccharin, cetyltrimethylammonium bromide (CTAB), sodium dodecyl sulfate, sodium lauryl sulfate (SLS), saccharine, naphthalene sulfonic acid, benzene sulfonic acid, coumarin, ethyl vanillin, ammonia, ethylene diamine, polyethylene glycol (PEG), bis(3-sulfopropyl)disulfide (SPS), Janus green B (JGB), azobenzene-based surfactant (AZTAB), the polyoxyethylene family of surface active agents, sodium citrate, perfluorinated alkylsulfate, additive K, calcium chloride, ammonium chlor
  • metal coatings can be produced on a substrate by autocatalytic chemical reduction of metal cations in a bath. In contrast to electrodeposition/electroplating, no external electric current is applied to the substrate in electroless plating. While not wishing to be bound by any particular configuration or example, electroless plating can provide more even layers of the material on the substrate compared to electroplating. Further, electroless plating may be used to add coatings onto non-conductive substrates.
  • the substrate itself may act as a catalyst to reduce an ionic metal and form a coating of the metal on the surface of the substrate.
  • the substrate may act to reduce two or more different ionic metals with the use of a complexing agent to form a metal alloy including the two different metals.
  • the substrate itself may not function as a catalyst but a catalytic material can be added to the substrate to promote formation of the metal coating on the substrate.
  • Illustrative catalytic materials that can be added to a substrate include, but are not limited to, palladium, gold, silver, titanium, copper, tin, niobium, and any combination thereof.
  • illustrative materials include one or more of the following cations: magnesium, niobium, tantalum, zinc, nickel, molybdenum, copper, aluminum, cobalt, tungsten, gold, platinum, palladium, silver, or alloys or combinations thereof.
  • any one or more of these cations can be added as a suitable salt to an aqueous solution.
  • Illustrative suitable salts include, but are not limited to, metal halides, metal fluorides, metal chlorides, metal carbonates, metal hydroxides, metal acetates, metal sulfates, metal nitrates, metal nitrites, metal chromates, metal dichromates, metal permanganates, metal platinates, metal cobalt nitrites, metal hexachloroplatinates, metal citrates, metal cyanides, metal oxides, metal phosphates, metal monobasic sodium phosphates, metal dibasic sodium phosphates, metal tribasic sodium phosphates and combinations thereof.
  • the substrates described herein may be subjected to pre-coating processing steps to prepare the substrate to receive a coating.
  • processing steps can include, for example, cleaning, electro-cleaning (anodic or cathodic), polishing, electro-polishing, pre-plating, thermal treatments, abrasive treatments and chemical treatments.
  • the substrates can be cleaned with an acid, a base, water, a salt solution, an organic solution, an organic solvent or other liquids or gases.
  • the substrates can be polished using water, an acid or a base, e.g., sulfuric acid, phosphoric acid, etc. or other materials optionally in the presence of an electric current.
  • the substrates may be exposed to one or more gases prior to application of the coating layers to facilitate removal of oxygen or other gases from a surface of the substrate.
  • the substrate may be washed or exposed to an oil or hydrocarbon fluid prior to application of the coating to remove any aqueous solutions or materials from the surface.
  • the substrate may be heated or dried in an oven to remove any liquids from the surface prior to application of the coating. Other steps for treating the substrate prior to application of a coating may also be used.
  • the coatings layers described herein can be subjected to sealing. While the exact conditions and materials uses to seal the coatings can vary, sealing can reduce the porosity of the coatings and increase their hardness.
  • sealing may be performed by subjecting the coating to steam, organic additives, metals, metal salts, metal alloys, metal alloy salts, or other materials. The sealing may be performed at temperatures above room temperature, e.g., 30° C., 50° C., 90° C. or higher, at room temperature or below room temperature, e.g., 20° C. or less.
  • the substrate and coating layer may be heated to remove any hydrogen or other gases in the coating layer. For example, the substrate and coating can be baked to remove hydrogen from the article within 1-2 hours post-coating.
  • the coating layer may be sealed and then polished to reduce surface roughness.
  • a substrate to receive a coating can be cleaned.
  • the substrate can then be rinsed.
  • the substrate can then be subjected to acid treatment.
  • the acid treated substrate is then rinsed.
  • the rinsed substrate is then added to a plating tank.
  • the plated substrate can optionally be rinsed.
  • the substrate with the coated surface can then be subjected to post-plating processes. Each of these steps are discussed in more detail below.
  • An optional strike step to provide a nickel layer (or a layer of another material) on the surface of the substrate can be performed between steps the acid treatment step and the plating step if desired.
  • the cleaning step can be performed in the presence or absence of an electric current.
  • Cleaning is typically performed in the presence of one or more salts and/or a detergent or surfactant and may be performed at an acidic pH or a basic pH.
  • Cleaning is generally performed to remove any oils, hydrocarbons or other materials from the surface of the substrate.
  • the substrate is rinsed to remove any cleaning agents.
  • the rinsing is typically performed in distilled water but may be performed using one or more buffers or at an acidic pH or a basic pH. Rinsing may be performed once or numerous times.
  • the substrate is typically kept wet between the various steps to minimize oxide formation on the surface. A water break test can be performed to verify the surface is clean and/or free of any oils.
  • the substrate After rinsing, the substrate can be immersed in an acid bath to activate the surface for electrodeposition, e.g., to pickle the surface.
  • the exact acid used is not critical.
  • the pH of the acidic treatment may be 0-7 or even less than 0 if desired.
  • the time the substrate remains in the acid bath may vary, for example, from 10 seconds to about 10 minutes.
  • the acidic solution can be agitated or pumped over the substrate surface if desired, or the substrate may be moved within the acidic tank during the pickling process.
  • the surface can be rinsed to remove any acid.
  • the rinsing may be performed by immersing the pickled substrate into a rinse bath, by flowing rinse agent over the surface or both. Rinsing can be performed multiple times or a single time as desired.
  • a strike applies a thin layer of material to a substrate that is typically inert or less reactive with the material to be deposited.
  • inert substrates include, but are not limited to, stainless steels, titanium, certain metal alloys and other materials.
  • a thin layer of material e.g., up to a few microns thick, is applied using electrodeposition.
  • the rinsed, pickled substrate, or a rinsed substrate with the strike layer can then be subjected to an electrodeposition process as noted above to apply a layer of material to the substrate surface.
  • electrodeposition can be performed using AC voltages or DC voltages and various waveforms.
  • the exact current density used can vary to favor or disfavor a particular amount of the elements that end up in the resulting coating. For example, where an alloy layer includes two metals, the current density can be selected so one metal is present in a higher amount than the other metal in the resulting alloy layer.
  • the pH of the electrodeposition bath may also vary depending on the particular species that are intended to be present in the surface coating.
  • the exact temperature used during the electrodeposition process may vary from room temperature (about 25 deg. Celsius) up to about 85° C. The temperature is desirably less than 100 deg. Celsius so water in the electrodeposition bath does not evaporate to a substantial degree.
  • the electrodeposition bath can include the materials to be deposited along with optional agents including brighteners, levelers, particles, etc. as noted herein.
  • the electrodeposition bath can include a brightener.
  • Brighteners can generally be divided into two classes. Class I, or primary, brighteners include compounds such as aromatic or unsaturated aliphatic sulfonic acids, sulfonamides, sulfonimides, and sulfimides. Class I brighteners can be used in relatively high concentrations and produce a hazy or cloudy deposit on the metal substrate. Decomposition of Class I brighteners during the electroplating process can cause sulfur to be incorporated into the deposit, which reduces the tensile stress of the deposit.
  • Class II brighteners are used in combination with Class I brighteners to produce a fully bright and leveled deposit.
  • Class II brighteners are generally unsaturated organic compounds.
  • a variety of organic compounds containing unsaturated functional groups such as alcohol, diol, triol, aldehydic, olefinic, acetylinic, nitrile, and pyridine groups can be used as Class II brighteners.
  • Class II brighteners are derived from acetylinic or ethylenic alcohols, ethoxylated acetylenic alcohols, coumarins and pyridine based compounds.
  • a variety of amine compounds can also be used as brightening or leveling agents.
  • Acyclic amines can be used as Class II brighteners.
  • Acetylenic amines can be used in combination with acetylenic compounds to improve leveling and low current density coverage.
  • the resulting amount of metals present in the alloy layer can vary.
  • one of the metals e.g., molybdenum
  • one of the metals may be present up to about 35 weight percent based on a weight of the surface coating.
  • one of the metals e.g., molybdenum
  • one of the metals, e.g., molybdenum may be present up to about 16 weight percent based on a weight of the surface coating.
  • one of the metals may be present up to about 10 weight percent based on a weight of the surface coating. In some examples, one of the metals, e.g., molybdenum, may be present up to about 6 weight percent based on a weight of the surface coating.
  • the substrate with the surface coating can then be rinsed or can be subjected to another deposition process to apply a second layer onto the formed first layer.
  • the second deposition process can be, for example, vacuum deposition, physical vapor deposition (PVD), chemical vapor deposition (CVD), plasma deposition, brushing, spin-coating, spray coating, electrodeposition/electroplating, electroless deposition/plating, high velocity oxygen fuel (HVOF) coating, thermal spraying or other suitable methods.
  • a second electrodeposition step can be used to apply a second layer on top of the formed first layer.
  • the second layer can be an electrodeposited layer including one, two, three or more metal or other materials. If desired, additional layer can be formed on the second layer using electrodeposition or any of the other processes mentioned herein.
  • a layer of material can be deposited on a cleaned or pickled substrate prior to forming a layer using an electrodeposition process.
  • one or more layers can first be formed on a substrate using vacuum deposition, physical vapor deposition (PVD), chemical vapor deposition (CVD), plasma deposition, brushing, spin-coating, spray coating, electrodeposition/electroplating, electroless deposition/plating, high velocity oxygen fuel (HVOF) coating, thermal spraying or other suitable methods.
  • PVD physical vapor deposition
  • CVD chemical vapor deposition
  • plasma deposition brushing, spin-coating, spray coating, electrodeposition/electroplating, electroless deposition/plating, high velocity oxygen fuel (HVOF) coating, thermal spraying or other suitable methods.
  • a second layer can be formed on the first layer using an electrodeposition process as noted herein. If desired, the first formed layer can be activated by a pickling process prior to electrodeposition of the second layer on the first layer.
  • the substrate with the coated surface can then be subjected to one or more post-processing steps including, for example, rinsing, polishing, sanding, heating, annealing, consolidating, etching or other steps to either clean the coated surface or alter the physical or chemical properties of the coated surface.
  • post-processing steps including, for example, rinsing, polishing, sanding, heating, annealing, consolidating, etching or other steps to either clean the coated surface or alter the physical or chemical properties of the coated surface.
  • some portion of the coating can be removed using an acidic solution or a basic solution depending on the materials present in the coating.
  • a method of producing an alloy layer on a substrate comprises forming a coated surface on the substrate by electrodepositing an alloy layer on the surface of the substrate.
  • the electrodeposited alloy layer comprises (i) molybdenum and (ii) at least one element selected from the group consisting of nickel, tungsten, cobalt, chromium, tin, phosphorous, iron, magnesium and boron or at least one compound comprising one or more of nickel, tungsten, cobalt, chromium, tin, phosphorous, iron, magnesium or boron.
  • the method comprises, prior to electrodepositing the alloy layer, cleaning the substrate, rinsing the cleaned substrate, activating a surface of the cleaned substrate to provide an activated substrate, rinsing the activated substrate, and electrodepositing the alloy layer on the activated substrate.
  • the method comprises subjecting the electrodeposited alloy layer to a post deposition treatment process.
  • the post deposition treatment process is selected from the group consisting of rinsing, polishing, sanding, heating, annealing, and consolidating.
  • the method comprises providing an additional layer on the electrodeposited alloy layer.
  • the additional layer is provided using one of vacuum deposition, physical vapor deposition, chemical vapor deposition, plasma deposition, brushing, spin-coating, spray coating, electrodeposition/electroplating, electroless deposition/plating, high velocity oxygen fuel coating, or thermal spraying.
  • an intermediate layer of material prior to electrodepositing the alloy layer, can be provided between the substrate and the electrodeposited alloy layer.
  • the intermediate layer is provided using one of vacuum deposition, physical vapor deposition, chemical vapor deposition, plasma deposition, brushing, spin-coating, spray coating, electrodeposition/electroplating, electroless deposition/plating, high velocity oxygen fuel coating, or thermal spraying.
  • the electrodepositing uses a soluble anode or uses an insoluble anode. In some instances, the soluble anode comprises nickel or another metal.
  • the coating layers described herein can be applied to the substrate using suitable methodologies including, but not limited to, vacuum deposition, physical vapor deposition (PVD), chemical vapor deposition (CVD), plasma deposition, brushing, spin-coating, spray coating, electrodeposition/electroplating, electroless deposition/plating, high velocity oxygen fuel (HVOF) coating, thermal spraying or other suitable methods.
  • suitable methodologies including, but not limited to, vacuum deposition, physical vapor deposition (PVD), chemical vapor deposition (CVD), plasma deposition, brushing, spin-coating, spray coating, electrodeposition/electroplating, electroless deposition/plating, high velocity oxygen fuel (HVOF) coating, thermal spraying or other suitable methods.
  • one or more of the coating layers may be deposited using vacuum deposition.
  • vacuum deposition generally deposits a layer of material atom-by-atom or molecule-by-molecule on a surface of a substrate.
  • Vacuum deposition processes can be used to deposit one or more materials with a thickness from one or more atoms up to a few millimeters.
  • PVD physical vapor deposition
  • CVD chemical vapor deposition
  • plasma deposition e.g., plasma enhanced chemical vapor deposition or plasma assisted chemical vapor deposition
  • PD generally involves creating a plasma discharge from reacting gases including the material to be deposited and/or subjecting an already deposited material to ions in a plasma gas to modify the coating layer.
  • atomic layer deposition ALD can be used to provide a coating layer on a surface. In ALD, a substrate surface is exposed to repeated amounts of precursors that can react with a surface of a material to build up the coating layer.
  • one or more of the coating layers described herein can be deposited into a surface of a substrate using brushing, spin-coating, spray coating, dip coating, electrodeposition (e.g., electroplating, cathodic electrodeposition, anodic electrodeposition, etc.), electroless plating, electrocoating, electrophoretic deposition, or other techniques.
  • electrodeposition e.g., electroplating, cathodic electrodeposition, anodic electrodeposition, etc.
  • electroless plating e.g., electroplating, cathodic electrodeposition, anodic electrodeposition, etc.
  • electroless plating e.g., electroless plating, electrocoating, electrophoretic deposition, or other techniques.
  • one or more layers of the coating may be applied using electrodeposition.
  • electrodeposition uses a voltage applied to the substrate placed in a bath to form the coating on the charged substrate.
  • ionic species present in the bath can be reduced using the applied voltage to deposit the ionic species in a solid form onto a surface (or all surfaces) of the substrate.
  • the ionic species can be deposited to provide a metal coating, a metal alloy coating or combinations thereof.
  • the resulting properties of the formed, electrodeposited coating may be selected or tuned to provide a desired result.
  • the ionic species may be dissolved or solvated in an aqueous solution or water.
  • the aqueous solution may include suitable dissolved salts, inorganic species or organic species to facilitate electrodeposition of the coating layer(s) on the substrate.
  • the liquid used in the electrodeposition bath may generally be non-aqueous, e.g., include more than 50% by volume of non-aqueous species, and may include hydrocarbons, alcohols, liquified gases, amines, aromatics and other non-aqueous materials.
  • the electrodeposition bath includes the species to be deposited as a coating on the substrate.
  • the bath can include ionic nickel or solvated nickel.
  • molybdenum is deposited into a substrate, the bath can include ionic molybdenum or solvated molybdenum.
  • the bath can include more than a single species, e.g., the bath may include ionic nickel and ionic molybdenum that are co-electrodeposited to form a nickel-molybdenum alloy as a coating layer on a substrate.
  • the exact form of the materials added to the bath to provide ionic or solvated species can vary.
  • the species may be added to the bath as metal halides, metal fluorides, metal chlorides, metal carbonates, metal hydroxides, metal acetates, metal sulfates, metal nitrates, metal nitrites, metal chromates, metal dichromates, metal permanganates, metal platinates, metal cobalt-nitrites, metal hexachloroplatinates, metal citrates, ammonium salt of the metal, metal cyanides, metal oxides, metal phosphates, metal monobasic sodium phosphates, metal dibasic sodium phosphates, metal tribasic sodium phosphates, sodium salt of the metal, potassium salt of the metal, metal sulfamate, metal nitrite, and combinations thereof.
  • a single material that includes both of the metal species to be deposited can be dissolved in the electrodeposition bath, e.g., a metal alloy salt can be dissolved in a suitable solution prior to electrodeposition.
  • the specific materials used in the electrodeposition bath depends on the particular alloy layer to be deposited.
  • Illustrative materials include, but are not limited to, nickel sulfate, nickel sulfamate, nickel chloride, sodium tungstate, tungsten chloride, sodium molybdate, ammonium molybdate, cobalt sulfate, cobalt chloride, chromium sulfate, chromium chloride, chromic acid, stannous sulfate, sodium stannate, hypophosphite, sulfuric acid, nickel carbonate, nickel hydroxide, potassium carbonate, ammonium hydroxide, hydrochloric acid or other materials.
  • the exact amount or concentration of the species to be electrodeposited onto a substrate may vary.
  • the concentration of the species may vary from about 1 gram/Liter to about 400 grams/Liter.
  • additional material can be added to the bath to increase an amount of the species available for electrodeposition.
  • the concentration of the species to be deposited may be maintained at a substantially constant level during electrodeposition by continuously adding material to the bath.
  • the pH of the electrodeposition bath may vary depending on the particular ionic species present in the bath.
  • the pH may vary from 1 to about 13, but in certain instances, the pH may be less than 1, or even less than 0, or greater than 13 or even greater than 14.
  • the pH may range, in certain instances, from 4 to about 12. It will be recognized, however, that the pH may be varied depending on the particular voltage and electrodeposition conditions that are selected for use. Some pH regulators and buffers may be added to the bath.
  • pH regulators include but not limited to boric acid, hydrochloric acid, sodium hydroxide, potassium hydroxide, ammonium hydroxide, glycine, Sodium acetate, buffered saline, Cacodylate buffer, Citrate buffer, Phosphate buffer, Phosphate-citrate buffer, Barbital buffer, TRIS buffers, Glycine-NaOH buffer, and any combination thereof.
  • alloy plating can use a complexing agent.
  • a complexing agent for example, the main role of complexing agents in an alloy deposition process is making complexations of different metallic ions. Therefore, without a proper complexing agent, simultaneous deposition of nickel and molybdenum and alloy formation will not occur.
  • complexing agents include but are not limited to phosphates, phosphonates, polycarboxylates, zeolites, citrates, ammonium hydroxide, ammonium salts, citric acid, ethylenediaminetetraacetic acid, diethylene-triaminepentaacetic acid, aminopolycarboxylates, nitrilotriacetic acid, IDS (N-(1,2-dicarboxyethyl)-D,L-aspartic acid (iminodisuccinic acid), DS (polyaspartic acid), EDDS (N,N′-ethylenediaminedisuccinic acid), GLDA (N,N-bis(carboxylmethyl)-L-glutamic acid) and MGDA (methylglycinediacetic acid), hexamine cobalt (III) chloride, ethylene glycol-bis( ⁇ -aminoethyl ether)-N,N,N′,N′-tetraacetic acid
  • a suitable voltage can be applied to cathodes and anodes of the electrodeposition bath to promote formation of the layer(s) described herein on a substrate.
  • a direct current (DC) voltage can be used.
  • an alternating current (AC) optionally in combination with current pulses can be used to electrodeposit the layers.
  • AC electrodeposition can be carried out with an AC voltage waveform, in general sinusoidal, squared, triangular, and so on. High voltages and current densities can be used to favor the tunneling of electrons through an oxide base layer that can form on the substrate.
  • the base layer can conduct in the direction of the cathode, which favors the deposition of the material and avoids its reoxidation during the oxidant half-cycle.
  • illustrative current density ranges that can be used in electrodeposition include, but are not limited to 1 mA/cm 2 DC to about 600 mA/cm 2 DC, more particularly about 1 mA/cm 2 DC to about 300 mA/cm 2 DC.
  • the current density can vary from 5 mA/cm 2 DC to about 300 mA/cm 2 DC, from 20 mA/cm 2 DC to about 100 mA/cm 2 DC, from 100 mA/cm 2 DC to about 400 mA/cm 2 DC or any value falling within these illustrative ranges.
  • the exact time that the current is applied may vary from about 10 seconds to a few days, more particularly about 40 seconds to about 2 hours.
  • a pulse current can also be applied instead of a DC current if desired.
  • the electrodeposition may use pulse current or pulse reverse current is during the electrodeposition of the alloy layer.
  • PED pulse electrodeposition
  • the potential or current is alternated swiftly between two different values. This results in a series of pulses of equal amplitude, duration and polarity, separated by zero current.
  • Each pulse consists of an ON-time (TON) during which potential and/current is applied, and an OFF-time (TOFF) during which zero current is applied.
  • TON ON-time
  • TOFF OFF-time
  • the first layer and the second layer of the coating may be applied using the same or different electrodeposition baths.
  • a first layer can be applied using a first aqueous solution in an electrodeposition bath. After application of a voltage for a sufficient period to deposit the first layer, the voltage may be reduced to zero, the first solution can be removed from the bath and a second aqueous solution comprising a different material can be added to the bath. A voltage can then be reapplied to electrodeposit a second layer.
  • two separate baths can be used, e.g., a reel-to-reel process can be used, where the first bath is used to electrodeposit the first layer and a second, different bath is used to deposit the second layer.
  • individual articles may be connected such that they can be sequentially exposed to separate electrodeposition baths, for example in a reel-to-reel process.
  • articles may be connected to a common conductive substrate (e.g., a strip).
  • each of the electrodeposition baths may be associated with separate anodes and the interconnected individual articles may be commonly connected to a cathode.
  • illustrative materials include cations of one or more of the following metals: nickel, molybdenum, copper, aluminum, cobalt, tungsten, gold, platinum, palladium, silver, or combinations thereof.
  • the exact anion form of these metals may vary from chlorides, acetates, sulfates, nitrates, nitrites, chromates, dichromates, permanganates, platinates, cobalt nitrites, hexachloroplatinates, citrates, cyanides, oxides, phosphates, monobasic sodium phosphates, dibasic sodium phosphates, tribasic sodium phosphates and combinations thereof.
  • the electrodeposition process can be designed to apply an alloy layer including molybdenum and one or more of nickel, tungsten, cobalt, chromium, tin, phosphorous, iron, magnesium and boron or at least one compound comprising one or more of nickel, tungsten, cobalt, chromium, tin, phosphorous, iron, magnesium or boron.
  • the resulting alloy layer may be free of precious metals.
  • the coating layer 110 there may be no intervening or intermediate layers between the coating layer 110 and the substrate 105 .
  • the coating layer 110 can be deposited directly onto the substrate surface 105 without any intervening layer between them.
  • an intermediate layer may be present between the coating layer 110 and the surface 106 of the substrate 105 .
  • the intermediate layer can be formed using the same methods used to form the coating layer 110 or different methods used to form the coating layer 110 .
  • an intermediate layer can include one or more of copper, a copper alloy, nickel, a nickel alloy, a nickel-phosphorous alloy, a nickel-phosphorous alloy including hard particles or other compounds such as phosphorous, boron, boron nitride, silicon carbide, aluminum oxide, molybdenum disulfide, hard particles with a hardness of HV >1000, hard particles with size less 500 nm, highly conductive particles, carbon nanotubes and or carbon nano-particles.
  • the intermediate layer can include an alloy of nickel that is less magnetic than nickel alone.
  • the intermediate layer may be substantially less than the coating layer 110 and can be used to enhance adhesion of the coating layer 110 to the substrate 105 .
  • the intermediate layer can be 90%, 80%, 70%, 60%, 50%, 40%, 30%, 20% or 10% less thick than a thickness of the coating layer 110 .
  • the layer between the substrate and the alloy layer may be a “nickel strike” layer as is commonly known in the electroplating arts.
  • one or more of the materials of a coating layer can be provided using a soluble anode.
  • the soluble anode can dissolve in the electrodeposition bath to provide the species to be deposited.
  • the soluble anode may take the form of a disk, a rod, a sphere, strips of materials or other forms.
  • the soluble anode can be present in a carrier or basket coupled to a power source.
  • one or more of the coating layers described herein may be deposited using an anodization process.
  • Anodization generally uses the substrate as the anode of an electrolytic cell. Anodizing can change the microscopic texture of the surface and the resulting metal coating near the surface. For example, thick coatings are often porous and can be sealed to enhance corrosion resistance. Anodization can result in harder and more corrosion resistant surfaces.
  • one of the coating layers of the articles described herein can be produced using an anodization process and another coating layer may be produced using a non-anodization process. In other instances, each coating layer in the article can be produced using an anodization process. The exact materials and process conditions using anodization may vary.
  • the anodized layer is grown on a surface of the substrate by applying a direct current through an electrolyte solution including the material to be deposited.
  • the material to be deposited can include magnesium, niobium, tantalum, zinc, nickel, molybdenum, copper, aluminum, cobalt, tungsten, gold, platinum, palladium, silver, or alloys or combinations thereof.
  • Anodization is typically performed under acidic conditions and may include chromic acid, sulfuric acid, phosphoric acid, organic acids or other acids.
  • the coatings described herein may be applied in the presence of other additive or agents.
  • wetting agents, leveling agents, brighteners, defoaming agents and/or emulsifiers can be present in aqueous solutions that include the materials to be deposited onto the substrate surface.
  • Illustrative additive and agents include, but are not limited to, thiourea, domiphen bromide, acetone, ethanol, cadmium ion, chloride ion, stearic acid, ethylenediamine dihydrochloride (EDA), saccharin, cetyltrimethylammonium bromide (CTAB), sodium dodecyl sulfate, sodium lauryl sulfate (SLS), saccharine, naphthalene sulfonic acid, benzene sulfonic acid, coumarin, ethyl vanillin, ammonia, ethylene diamine, polyethylene glycol (PEG), bis(3-sulfopropyl)disulfide (SPS), Janus green B (JGB), azobenzene-based surfactant (AZTAB), the polyoxyethylene family of surface active agents, sodium citrate, perfluorinated alkylsulfate, additive K, calcium chloride, ammonium chlor
  • metal coatings can be produced on a substrate by autocatalytic chemical reduction of metal cations in a bath. In contrast to electrodeposition/electroplating, no external electric current is applied to the substrate in electroless plating. While not wishing to be bound by any particular configuration or example, electroless plating can provide more even layers of the material on the substrate compared to electroplating. Further, electroless plating may be used to add coatings onto non-conductive substrates.
  • the substrate itself may act as a catalyst to reduce an ionic metal and form a coating of the metal on the surface of the substrate.
  • the substrate may act to reduce two or more different ionic metals with the use of a complexing agent to form a metal alloy including the two different metals.
  • the substrate itself may not function as a catalyst but a catalytic material can be added to the substrate to promote formation of the metal coating on the substrate.
  • Illustrative catalytic materials that can be added to a substrate include, but are not limited to, palladium, gold, silver, titanium, copper, tin, niobium, and any combination thereof.
  • illustrative materials include one or more of the following cations: magnesium, niobium, tantalum, zinc, nickel, molybdenum, copper, aluminum, cobalt, tungsten, gold, platinum, palladium, silver, or alloys or combinations thereof.
  • any one or more of these cations can be added as a suitable salt to an aqueous solution.
  • Illustrative suitable salts include, but are not limited to, metal halides, metal fluorides, metal chlorides, metal carbonates, metal hydroxides, metal acetates, metal sulfates, metal nitrates, metal nitrites, metal chromates, metal dichromates, metal permanganates, metal platinates, metal cobalt nitrites, metal hexachloroplatinates, metal citrates, metal cyanides, metal oxides, metal phosphates, metal monobasic sodium phosphates, metal dibasic sodium phosphates, metal tribasic sodium phosphates and combinations thereof.
  • the substrates described herein may be subjected to pre-coating processing steps to prepare the substrate to receive a coating.
  • processing steps can include, for example, cleaning, electro-cleaning (anodic or cathodic), polishing, electro-polishing, pre-plating, thermal treatments, abrasive treatments and chemical treatments.
  • the substrates can be cleaned with an acid, a base, water, a salt solution, an organic solution, an organic solvent or other liquids or gases.
  • the substrates can be polished using water, an acid or a base, e.g., sulfuric acid, phosphoric acid, etc. or other materials optionally in the presence of an electric current.
  • the substrates may be exposed to one or more gases prior to application of the coating layers to facilitate removal of oxygen or other gases from a surface of the substrate.
  • the substrate may be washed or exposed to an oil or hydrocarbon fluid prior to application of the coating to remove any aqueous solutions or materials from the surface.
  • the substrate may be heated or dried in an oven to remove any liquids from the surface prior to application of the coating. Other steps for treating the substrate prior to application of a coating may also be used.
  • the coatings layers described herein can be subjected to sealing. While the exact conditions and materials uses to seal the coatings can vary, sealing can reduce the porosity of the coatings and increase their hardness.
  • sealing may be performed by subjecting the coating to steam, organic additives, metals, metal salts, metal alloys, metal alloy salts, or other materials. The sealing may be performed at temperatures above room temperature, e.g., 30° C., 50° C., 90° C. or higher, at room temperature or below room temperature, e.g., 20° C. or less.
  • the substrate and coating layer may be heated to remove any hydrogen or other gases in the coating layer. For example, the substrate and coating can be baked to remove hydrogen from the article within 1-2 hours post-coating.
  • the coating layer may be sealed and then polished to reduce surface roughness.
  • an electrodeposition process can include cleaning a substrate to receive a coating.
  • the substrate can then be rinsed.
  • the substrate can then be subjected to acid treatment.
  • the acid treated substrate is then rinsed.
  • the rinsed substrate is then added to a plating tank.
  • the plated substrate can optionally be rinsed.
  • the substrate with the coated surface can then be subjected to post-plating processes. Each of these steps are discussed in more detail below.
  • An optional strike step to provide a nickel layer (or a layer of another material) on the surface of the substrate can be performed if desired.
  • the cleaning step can be performed in the presence or absence of an electric current.
  • Cleaning is typically performed in the presence of one or more salts and/or a detergent or surfactant and may be performed at an acidic pH or a basic pH.
  • Cleaning is generally performed to remove any oils, hydrocarbons or other materials from the surface of the substrate.
  • the substrate is rinsed to remove any cleaning agents.
  • the rinsing is typically performed in distilled water but may be performed using one or more buffers or at an acidic pH or a basic pH. Rinsing may be performed once or numerous times.
  • the substrate is typically kept wet between the various steps to minimize oxide formation on the surface. A water break test can be performed to verify the surface is clean and/or free of any oils.
  • the substrate After rinsing, the substrate can be immersed in an acid bath to activate the surface for electrodeposition, e.g., to pickle the surface.
  • the exact acid used is not critical.
  • the pH of the acidic treatment may be 0-7 or even less than 0 if desired.
  • the time the substrate remains in the acid bath may vary, for example, from 10 seconds to about 10 minutes.
  • the acidic solution can be agitated or pumped over the substrate surface if desired, or the substrate may be moved within the acidic tank during the pickling process.
  • the surface can be rinsed to remove any acid.
  • the rinsing may be performed by immersing the pickled substrate into a rinse bath, by flowing rinse agent over the surface or both. Rinsing can be performed multiple times or a single time as desired.
  • a strike applies a thin layer of material to a substrate that is typically inert or less reactive with the material to be deposited.
  • inert substrates include, but are not limited to, stainless steels, titanium, certain metal alloys and other materials.
  • a thin layer of material e.g., up to a few microns thick, is applied using electrodeposition.
  • the rinsed, pickled substrate, or a rinsed substrate with the strike layer can then be subjected to an electrodeposition process as noted above to apply a layer of material to the substrate surface.
  • electrodeposition can be performed using AC voltages or DC voltages and various waveforms.
  • the exact current density used can vary to favor or disfavor a particular amount of the elements that end up in the resulting coating. For example, where an alloy layer includes two metals, the current density can be selected so one metal is present in a higher amount than the other metal in the resulting alloy layer.
  • the pH of the electrodeposition bath may also vary depending on the particular species that are intended to be present in the surface coating.
  • the exact temperature used during the electrodeposition process may vary from room temperature (about 25 deg. Celsius) up to about 85° C. The temperature is desirably less than 100 deg. Celsius so water in the electrodeposition bath does not evaporate to a substantial degree.
  • the electrodeposition bath can include the materials to be deposited along with optional agents including brighteners, levelers, particles, etc. as noted herein.
  • the electrodeposition bath can include a brightener.
  • Brighteners can generally be divided into two classes. Class I, or primary, brighteners include compounds such as aromatic or unsaturated aliphatic sulfonic acids, sulfonamides, sulfonimides, and sulfimides. Class I brighteners can be used in relatively high concentrations and produce a hazy or cloudy deposit on the metal substrate. Decomposition of Class I brighteners during the electroplating process can cause sulfur to be incorporated into the deposit, which reduces the tensile stress of the deposit.
  • Class II brighteners are used in combination with Class I brighteners to produce a fully bright and leveled deposit.
  • Class II brighteners are generally unsaturated organic compounds.
  • a variety of organic compounds containing unsaturated functional groups such as alcohol, diol, triol, aldehydic, olefinic, acetylinic, nitrile, and pyridine groups can be used as Class II brighteners.
  • Class II brighteners are derived from acetylinic or ethylenic alcohols, ethoxylated acetylenic alcohols, coumarins and pyridine based compounds.
  • a variety of amine compounds can also be used as brightening or leveling agents.
  • Acyclic amines can be used as Class II brighteners.
  • Acetylenic amines can be used in combination with acetylenic compounds to improve leveling and low current density coverage.
  • the resulting amount of metals present in the alloy layer can vary.
  • one of the metals e.g., molybdenum
  • one of the metals may be present up to about 35 weight percent based on a weight of the surface coating.
  • one of the metals e.g., molybdenum
  • one of the metals, e.g., molybdenum may be present up to about 16 weight percent based on a weight of the surface coating.
  • one of the metals may be present up to about 10 weight percent based on a weight of the surface coating. In some examples, one of the metals, e.g., molybdenum, may be present up to about 6 weight percent based on a weight of the surface coating.
  • the substrate with the surface coating can then be rinsed or can be subjected to another deposition process to apply a second layer onto the formed first layer.
  • the second deposition process can be, for example, vacuum deposition, physical vapor deposition (PVD), chemical vapor deposition (CVD), plasma deposition, brushing, spin-coating, spray coating, electrodeposition/electroplating, electroless deposition/plating, high velocity oxygen fuel (HVOF) coating, thermal spraying or other suitable methods.
  • a second electrodeposition step can be used to apply a second layer on top of the formed first layer.
  • the second layer can be an electrodeposited layer including one, two, three or more metal or other materials. If desired, additional layer can be formed on the second layer using electrodeposition or any of the other processes mentioned herein.
  • a layer of material can be deposited on a cleaned or pickled substrate prior to forming a layer using an electrodeposition process.
  • one or more layers can first be formed on a substrate using vacuum deposition, physical vapor deposition (PVD), chemical vapor deposition (CVD), plasma deposition, brushing, spin-coating, spray coating, electrodeposition/electroplating, electroless deposition/plating, high velocity oxygen fuel (HVOF) coating, thermal spraying or other suitable methods.
  • PVD physical vapor deposition
  • CVD chemical vapor deposition
  • plasma deposition brushing, spin-coating, spray coating, electrodeposition/electroplating, electroless deposition/plating, high velocity oxygen fuel (HVOF) coating, thermal spraying or other suitable methods.
  • a second layer can be formed on the first layer using an electrodeposition process as noted herein. If desired, the first formed layer can be activated by a pickling process prior to electrodeposition of the second layer on the first layer.
  • the substrate with the coated surface can then be subjected to one or more post-processing steps including, for example, rinsing, polishing, sanding, heating, annealing, consolidating, etching or other steps to either clean the coated surface or alter the physical or chemical properties of the coated surface.
  • post-processing steps including, for example, rinsing, polishing, sanding, heating, annealing, consolidating, etching or other steps to either clean the coated surface or alter the physical or chemical properties of the coated surface.
  • some portion of the coating can be removed using an acidic solution or a basic solution depending on the materials present in the coating.
  • a method of producing an alloy layer on a substrate comprises forming a coated surface on the substrate by electrodepositing an alloy layer on the surface of the substrate.
  • the electrodeposited alloy layer comprises (i) molybdenum and (ii) at least one element selected from the group consisting of nickel, tungsten, cobalt, chromium, tin, phosphorous, iron, magnesium and boron or at least one compound comprising one or more of nickel, tungsten, cobalt, chromium, tin, phosphorous, iron, magnesium or boron.
  • the method comprises, prior to electrodepositing the alloy layer, cleaning the substrate, rinsing the cleaned substrate, activating a surface of the cleaned substrate to provide an activated substrate, rinsing the activated substrate, and electrodepositing the alloy layer on the activated substrate.
  • the method comprises subjecting the electrodeposited alloy layer to a post deposition treatment process.
  • the post deposition treatment process is selected from the group consisting of rinsing, polishing, sanding, heating, annealing, and consolidating.
  • the method comprises providing an additional layer on the electrodeposited alloy layer.
  • the additional layer is provided using one of vacuum deposition, physical vapor deposition, chemical vapor deposition, plasma deposition, brushing, spin-coating, spray coating, electrodeposition/electroplating, electroless deposition/plating, high velocity oxygen fuel coating, or thermal spraying.
  • an intermediate layer of material prior to electrodepositing the alloy layer, can be provided between the substrate and the electrodeposited alloy layer.
  • the intermediate layer is provided using one of vacuum deposition, physical vapor deposition, chemical vapor deposition, plasma deposition, brushing, spin-coating, spray coating, electrodeposition/electroplating, electroless deposition/plating, high velocity oxygen fuel coating, or thermal spraying.
  • the electrodepositing uses a soluble anode or uses an insoluble anode. In some instances, the soluble anode comprises nickel or another metal.
  • the rotational substrate of the rotational devices described herein may comprise a coated surface. At least one surface of the substrate comprises a coated surface, with a surface coating comprising an alloy layer.
  • the alloy layer can include molybdenum and at least one element selected from the group consisting of nickel, tungsten, cobalt, chromium, tin, phosphorous, iron, magnesium and boron or at least one compound comprising one or more of nickel, tungsten, cobalt, chromium, tin, phosphorous, iron, magnesium or boron.
  • the alloy layer is present on all outer surfaces of the substrate.
  • the substrate is cylindrical, and wherein the alloy layer is present on curved surfaces of the cylindrical substrate.
  • the alloy layer comprises molybdenum or tungsten and at least one element selected from the group consisting of nickel, cobalt, chromium, tin, phosphorous, iron, magnesium and boron or at least one compound comprising one or more of nickel, cobalt, chromium, tin, phosphorous, iron, magnesium or boron.
  • the molybdenum is present in the surface coating at 35% or less by weight based on a weight of the surface coating, or at 25% or less by weight based on a weight of the surface coating, or at 15% or less by weight based on a weight of the surface coating. In other embodiments, the molybdenum is present in the alloy layer at 35% or less by weight based on a weight of the alloy layer, or at 25% or less by weight based on a weight of the alloy layer, or at 15% or less by weight based on a weight of the alloy layer.
  • the molybdenum is present in the surface coating at 65% or more by weight based on a weight of the surface coating, or at 75% or more by weight based on a weight of the surface coating, or at 85% or more by weight based on a weight of the surface coating. In other examples, the molybdenum is present in the alloy layer at 65% or less by weight based on a weight of the alloy layer, or at 75% or less by weight based on a weight of the alloy layer, or at 85% or less by weight based on a weight of the alloy layer.
  • the tungsten is present in the surface coating at 35% or less by weight based on a weight of the surface coating, or at 25% or less by weight based on a weight of the surface coating, or at 15% or less by weight based on a weight of the surface coating. In other embodiments, the tungsten is present in the alloy layer at 35% or less by weight based on a weight of the alloy layer, or at 25% or less by weight based on a weight of the alloy layer, or at 15% or less by weight based on a weight of the alloy layer.
  • the tungsten is present in the surface coating at 65% or more by weight based on a weight of the surface coating, or at 75% or more by weight based on a weight of the surface coating, or at 85% or more by weight based on a weight of the surface coating. In other examples, the tungsten is present in the alloy layer at 65% or less by weight based on a weight of the alloy layer, or at 75% or less by weight based on a weight of the alloy layer, or at 85% or less by weight based on a weight of the alloy layer.
  • the alloy layer consists essentially of nickel and molybdenum or consists essentially of nickel, molybdenum and one of tin, phosphorous, iron, magnesium or boron.
  • the coated surface comprises a surface roughness Ra of less than 1 micron, and the molybdenum is present in the alloy layer at 20% or less by weight based on a weight of the surface coating, and the surface coating excludes precious metals.
  • the alloy layer consists essentially of nickel and tungsten or consists essentially of nickel, tungsten and one of tin, phosphorous, iron, magnesium or boron.
  • the coated surface comprises a surface roughness Ra of less than 1 micron, and the tungsten is present in the alloy layer at 20% or less by weight based on a weight of the surface coating, and the surface coating excludes precious metals.
  • the alloy layer is an electrodeposited alloy layer or is an exposed outer layer of the surface coating.
  • the exposed outer layer (i) consists essentially of molybdenum and only one of nickel, tungsten, cobalt, tin, phosphorous, iron, chromium, magnesium or boron, or (ii) consists essentially of molybdenum and only two of nickel, tungsten, cobalt, tin, phosphorous, iron, chromium, magnesium or boron, or (iii) consists essentially of both molybdenum and phosphorous and at least one of nickel, cobalt, tin, chromium, tungsten, iron, magnesium or boron.
  • the exposed outer layer (i) consists essentially of tungsten and only one of nickel, molybdenum, cobalt, tin, phosphorous, iron, chromium, magnesium or boron, or (ii) consists essentially of tungsten and only two of nickel, molybdenum, cobalt, tin, phosphorous, iron, chromium, magnesium or boron, or (iii) consists essentially of both molybdenum and phosphorous and at least one of nickel, cobalt, tin, chromium, molybdenum, iron, magnesium or boron.
  • the alloy layer is an electrodeposited alloy layer, and further comprises an intermediate layer between the surface of the substrate and the alloy layer, wherein the intermediate layer comprises one or more of nickel, nickel alloys, copper, copper alloys, nickel-tungsten alloys, cobalt alloys, nickel-phosphorous alloys, alloys of molybdenum or tungsten or both and at least one of nickel, cobalt, chromium, tin, phosphorous, iron or boron.
  • the surface coating comprises an additional layer formed on the alloy layer, wherein the additional layer comprises one or more of nickel, nickel alloys, nickel-tungsten alloys, cobalt alloys, cobalt-phosphorous alloys, nickel-phosphorous alloys, alloys of molybdenum and at least one of nickel, cobalt, chromium, tin, phosphorous, iron or boron, ceramics, ceramic comprises compounds of tungsten, chromium, aluminum, zirconium, titanium, nickel, cobalt, molybdenum, silicon, boron, metal nitride, a nitride, a metal carbide, a carbide, a boron, tungsten, tungsten carbide, chromium carbide, chromium oxide, aluminum oxide, zirconia, zirconium oxide, titania, nickel carbide, nickel oxide, nanocomposite, an oxide composite, or combinations thereof.
  • the additional layer comprises one or more of nickel, nickel alloys, nickel-tungsten alloys
  • the alloy layer further comprises one or more particles selected from the group consisting of solid nanoparticles, polymeric particles, hard particles, silicon dioxide particles, silicon carbide particles, titanium dioxide particles, polytetrafluoroethylene particles, hydrophobic particles, diamond particles, particles functionalized with hydrophobic groups, solid particles and combinations thereof.
  • the alloy layer is present as an exposed outer layer of the surface coating, wherein the exposed outer layer is an electrodeposited alloy layer, and wherein the electrodeposited alloy layer excludes precious metals.
  • the alloy layer further comprises particles.
  • the substrate is configured to rotate circumferentially during use of the rotational device.
  • the alloy layer is present as an exposed outer alloy layer of the surface coating, wherein the exposed outer layer is an electrodeposited exposed outer alloy layer, wherein the electrodeposited exposed outer alloy layer is free of precious metals, and wherein the molybdenum is present in the electrodeposited exposed outer alloy layer at 35% by weight or less based on a weight of the surface coating.
  • the alloy layer is present as an exposed outer alloy layer of the surface coating, wherein the exposed outer layer is an electrodeposited exposed outer alloy layer, wherein the electrodeposited exposed outer alloy layer is free of precious metals, and wherein the tungsten is present in the electrodeposited exposed outer alloy layer at 35% by weight or less based on a weight of the surface coating.
  • the coated surface comprises a surface roughness Ra of less than 1 micron.
  • the substrate is configured as a piston member. In other embodiments, the substrate is configured as an operating rod.
  • the substrate can rotate about an axis.
  • the axis may be a longitudinal axis L A or a transverse axis T A .
  • a cylindrical substrate 1310 is shown with a longitudinal axis L A and a transverse axis T A .
  • the substrate need not be cylindrical but may take other forms including planar shapes, curved shapes and other shapes.
  • a cylindrical shape is shown in FIGS. 13 A and 13 B for illustration. As shown in FIG. 13 B , the substrate 1310 can rotate circumferentially about the longitudinal axis L A .
  • the substrate 1310 can rotate clockwise as shown by arrow 1312 or can rotate counterclockwise as shown by arrow 1314 about the longitudinal axis L A .
  • the substrate rotates about the transverse axis T A , it can rotate end over end or in some manner other than rotation circumferentially.
  • a substrate 1410 of a rotational device is shown in FIG. 14 .
  • the substrate 1410 includes a coated surface with a surface coating 1420 as noted herein.
  • the surface coating 1420 can include any of those layers described in reference to FIGS. 1 - 12 herein.
  • the surface coating 1420 can include an alloy layer comprising (i) molybdenum and (ii) at least one element selected from the group consisting of nickel, tungsten, cobalt, chromium, tin, phosphorous, iron, magnesium and boron or at least one compound comprising one or more of nickel, tungsten, cobalt, chromium, tin, phosphorous, iron, magnesium or boron.
  • the surface coating 1420 can include an alloy layer comprising (i) tungsten and (ii) at least one element selected from the group consisting of nickel, molybdenum, cobalt, chromium, tin, phosphorous, iron, magnesium and boron or at least one compound comprising one or more of nickel, molybdenum, cobalt, chromium, tin, phosphorous, iron, magnesium or boron.
  • the substrate may be configured as a rotor as shown in FIG. 15 .
  • the rotor 1500 generally includes a shaft 1510 and one or more gears or couplers 1522 , 1524 that can couple to other components.
  • the coupler 1524 can couple to a motor, engine or other component to cause rotation of the shaft 1510 .
  • the coupler 1522 can couple to another component to turn that component.
  • the coupler 1522 can couple to blades or other structures to turn those structures during use.
  • the blades can be present in a pump, a vehicle (e.g., a helicopter or plane), a ship (e.g., a propeller) or in other devices.
  • One or more surfaces of the rotor 1500 may include a coated surface as described herein.
  • a surface of the rotor 1500 can include an alloy layer comprising (i) molybdenum and (ii) at least one element selected from the group consisting of nickel, tungsten, cobalt, chromium, tin, phosphorous, iron, magnesium and boron or at least one compound comprising one or more of nickel, tungsten, cobalt, chromium, tin, phosphorous, iron, magnesium or boron.
  • the alloy layer on the rotor can be present on all outer surfaces of the substrate if desired. In some examples, the alloy layer is present on curved surfaces of the rotor 1500 or the rotor shaft 1510 .
  • the alloy layer of the rotor 1500 comprises molybdenum and at least one element selected from the group consisting of nickel, tungsten, cobalt, chromium, tin, phosphorous, iron, magnesium and boron or at least one compound comprising one or more of nickel, tungsten, cobalt, chromium, tin, phosphorous, iron, magnesium or boron.
  • the molybdenum is present in the surface coating at 35% or less by weight based on a weight of the surface coating, or at 25% or less by weight based on a weight of the surface coating, or at 15% or less by weight based on a weight of the surface coating or is present in the alloy layer at 35% or less by weight based on a weight of the alloy layer, or at 25% or less by weight based on a weight of the alloy layer, or at 15% or less by weight based on a weight of the alloy layer, or is present in the surface coating at 65% or more by weight based on a weight of the surface coating, or at 75% or more by weight based on a weight of the surface coating, or at 85% or more by weight based on a weight of the surface coating, or is present in the alloy layer at 65% or less by weight based on a weight of the alloy layer, or at 75% or less by weight based on a weight of the alloy layer, or at 85% or less by weight based on a weight of the alloy layer.
  • the alloy layer of the rotor 1500 consists essentially of nickel and molybdenum or consists essentially of nickel, molybdenum and one of tin, phosphorous, iron, magnesium or boron.
  • the coated surface of the rotor 1500 comprises a surface roughness Ra of less than 1 micron, and the molybdenum is present in the alloy layer at 20% or less by weight based on a weight of the surface coating, and the surface coating excludes precious metals.
  • the alloy layer of the rotor 1500 is an electrodeposited alloy layer or is an exposed outer layer of the surface coating.
  • the exposed outer layer of the rotor 1500 (i) consists essentially of molybdenum and only one of nickel, tungsten, cobalt, tin, phosphorous, iron, chromium, magnesium or boron, or (ii) consists essentially of molybdenum and only two of nickel, tungsten, cobalt, tin, phosphorous, iron, chromium, magnesium or boron, or (iii) consists essentially of both molybdenum and phosphorous and at least one of nickel, cobalt, tin, chromium, tungsten, iron, magnesium or boron.
  • the alloy layer of the rotor 1500 is an electrodeposited alloy layer
  • the coating further comprises an intermediate layer between the surface of the substrate and the alloy layer, wherein the intermediate layer comprises one or more of nickel, nickel alloys, copper, copper alloys, nickel-tungsten alloys, cobalt alloys, nickel-phosphorous alloys, alloys of molybdenum or tungsten or both and at least one of nickel, cobalt, chromium, tin, phosphorous, iron or boron.
  • the coating on the rotor 1500 comprises an additional layer formed on the alloy layer, wherein the additional layer comprises one or more of nickel, nickel alloys, nickel-tungsten alloys, cobalt alloys, cobalt-phosphorous alloys, nickel-phosphorous alloys, alloys of molybdenum and at least one of nickel, cobalt, chromium, tin, phosphorous, iron or boron, ceramics, ceramic comprises compounds of tungsten, chromium, aluminum, zirconium, titanium, nickel, cobalt, molybdenum, silicon, boron, metal nitride, a nitride, a metal carbide, a carbide, a boron, tungsten, tungsten carbide, chromium carbide, chromium oxide, aluminum oxide, zirconia, zirconium oxide, titania, nickel carbide, nickel oxide, nanocomposite, an oxide composite, or combinations thereof.
  • the additional layer comprises one or more of nickel, nickel alloys, nickel
  • the alloy layer on the rotor 1500 further comprises one or more particles selected from the group consisting of solid nanoparticles, polymeric particles, hard particles, silicon dioxide particles, silicon carbide particles, titanium dioxide particles, polytetrafluoroethylene particles, hydrophobic particles, diamond particles, particles functionalized with hydrophobic groups, solid particles and combinations thereof.
  • the alloy layer of the rotor 1500 is present as an exposed outer layer of the surface coating, wherein the exposed outer layer is an electrodeposited alloy layer, and wherein the electrodeposited alloy layer excludes precious metals.
  • the alloy layer further comprises particles.
  • the alloy layer of the rotor 1500 is present as an exposed outer alloy layer of the surface coating, wherein the exposed outer layer is an electrodeposited exposed outer alloy layer, wherein the electrodeposited exposed outer alloy layer is free of precious metals, and wherein the molybdenum is present in the electrodeposited exposed outer alloy layer at 35% by weight or less based on a weight of the surface coating.
  • the coated surface of the rotor 1500 comprises a surface roughness Ra of less than 1 micron.
  • the alloy layer of the rotor 1500 comprise (i) tungsten and (ii) at least one element selected from the group consisting of nickel, molybdenum, cobalt, chromium, tin, phosphorous, iron, magnesium and boron or at least one compound comprising one or more of nickel, molybdenum, cobalt, chromium, tin, phosphorous, iron, magnesium or boron.
  • the alloy layer of the rotor 1500 is present on all outer surfaces of the substrate.
  • the substrate of the rotor 1500 is cylindrical, and wherein the alloy layer is present on curved surfaces of the cylindrical substrate.
  • the alloy layer of the rotor comprises tungsten and at least one element selected from the group consisting of nickel, molybdenum, cobalt, chromium, tin, phosphorous, iron, magnesium and boron or at least one compound comprising one or more of nickel, molybdenum, cobalt, chromium, tin, phosphorous, iron, magnesium or boron.
  • the tungsten is present in the surface coating at 35% or less by weight based on a weight of the surface coating, or at 25% or less by weight based on a weight of the surface coating, or at 15% or less by weight based on a weight of the surface coating or at 35% or less by weight based on a weight of the alloy layer, or at 25% or less by weight based on a weight of the alloy layer, or at 15% or less by weight based on a weight of the alloy layer, or at 65% or more by weight based on a weight of the surface coating, or at 75% or more by weight based on a weight of the surface coating, or at 85% or more by weight based on a weight of the surface coating, or at 65% or less by weight based on a weight of the alloy layer, or at 75% or less by weight based on a weight of the alloy layer, or at 85% or less by weight based on a weight of the alloy layer.
  • the alloy layer of the rotor 1500 consists essentially of nickel and tungsten or consists essentially of nickel, tungsten and one of tin, phosphorous, iron, magnesium or boron.
  • the coated surface comprises a surface roughness Ra of less than 1 micron, and the tungsten is present in the alloy layer at 20% or less by weight based on a weight of the surface coating, and the surface coating excludes precious metals.
  • the alloy layer is an electrodeposited alloy layer or is an exposed outer layer of the surface coating.
  • the exposed outer layer of the rotor 1500 (i) consists essentially of tungsten and only one of nickel, molybdenum, cobalt, tin, phosphorous, iron, chromium, magnesium or boron, or (ii) consists essentially of tungsten and only two of nickel, molybdenum, cobalt, tin, phosphorous, iron, chromium, magnesium or boron, or (iii) consists essentially of both tungsten and phosphorous and at least one of nickel, cobalt, tin, chromium, molybdenum, iron, magnesium or boron.
  • the alloy layer of the rotor 1500 is an electrodeposited alloy layer, and further comprising an intermediate layer between the surface of the substrate and the alloy layer, wherein the intermediate layer comprises one or more of nickel, nickel alloys, copper, copper alloys, nickel-molybdenum alloys, cobalt alloys, nickel-phosphorous alloys, alloys of tungsten or molybdenum or both and at least one of nickel, cobalt, chromium, tin, phosphorous, iron or boron.
  • the rotor coating comprises an additional layer formed on the alloy layer, wherein the additional layer comprises one or more of nickel, nickel alloys, nickel-molybdenum alloys, cobalt alloys, cobalt-phosphorous alloys, nickel-phosphorous alloys, alloys of tungsten and at least one of nickel, cobalt, chromium, tin, phosphorous, iron or boron, ceramics, ceramic comprises compounds of molybdenum, chromium, aluminum, zirconium, titanium, nickel, cobalt, tungsten, silicon, boron, metal nitride, a nitride, a metal carbide, a carbide, a boron, molybdenum, molybdenum carbide, chromium carbide, chromium oxide, aluminum oxide, zirconia, zirconium oxide, titania, nickel carbide, nickel oxide, nanocomposite, an oxide composite, or combinations thereof.
  • the additional layer comprises one or more of nickel, nickel alloys
  • the alloy layer of the rotor comprises one or more particles selected from the group consisting of solid nanoparticles, polymeric particles, hard particles, silicon dioxide particles, silicon carbide particles, titanium dioxide particles, polytetrafluoroethylene particles, hydrophobic particles, diamond particles, particles functionalized with hydrophobic groups, solid particles and combinations thereof.
  • the alloy layer of the rotor 1500 is present as an exposed outer layer of the surface coating, wherein the exposed outer layer is an electrodeposited alloy layer, and wherein the electrodeposited alloy layer excludes precious metals.
  • the alloy layer of the rotor 1500 further comprises particles.
  • the alloy layer of the rotor is an exposed outer alloy layer of the surface coating, wherein the exposed outer layer is an electrodeposited exposed outer alloy layer, wherein the electrodeposited exposed outer alloy layer is free of precious metals, and wherein the tungsten is present in the electrodeposited exposed outer alloy layer at 35% by weight or less based on a weight of the surface coating.
  • the coated surface comprises a surface roughness Ra of less than 1 micron.
  • the rotational devices described herein may have one or more blades.
  • a helicopter blade on a main rotational shaft, a blade on a tail rotor of a helicopter, a turbine blade, a fan blade or other devices with blades may include a coated surface as described herein.
  • a blade 1610 is shown attached to a main rotor of a helicopter 1600 .
  • the helicopter 1600 also comprises a blade 1620 on a tail rotor.
  • Either or both of the blades 1610 , 1620 can include a coated surface as described herein.
  • the blades 1610 , 1620 can include an alloy layer as described in connection with FIGS. 1 - 12 .
  • the blades 1610 , 1620 can include a surface coating comprising an alloy layer comprising (i) molybdenum or tungsten and (ii) at least one element selected from the group consisting of nickel, cobalt, chromium, tin, phosphorous, iron, magnesium and boron or at least one compound comprising one or more of nickel, cobalt, chromium, tin, phosphorous, iron, magnesium or boron.
  • a blade 1700 of a turbine is shown in FIG. 17 .
  • the turbine may be part of an engine, may be used to generate power or may be used in other applications.
  • An impeller blade 1800 of a pump is shown in FIG. 18 .
  • the blade 1800 may be present in a pump to drive fluid, e.g., air or liquid, through a space or fluid line.
  • the blades 1700 , 1800 can include molybdenum or tungsten in combination with one or more at least one element selected from the group consisting of nickel, cobalt, chromium, tin, phosphorous, iron, magnesium and boron or at least one compound comprising one or more of nickel, cobalt, chromium, tin, phosphorous, iron, magnesium or boron.
  • the surface coating of the blade comprises an alloy layer comprising (i) molybdenum and (ii) at least one element selected from the group consisting of nickel, tungsten, cobalt, chromium, tin, phosphorous, iron, magnesium and boron or at least one compound comprising one or more of nickel, tungsten, cobalt, chromium, tin, phosphorous, iron, magnesium or boron.
  • the surface coating of the blade comprises an alloy layer comprising (i) tungsten and (ii) at least one element selected from the group consisting of nickel, molybdenum, cobalt, chromium, tin, phosphorous, iron, magnesium and boron or at least one compound comprising one or more of nickel, molybdenum, cobalt, chromium, tin, phosphorous, iron, magnesium or boron.
  • the alloy layer is present on all outer surfaces of the substrate.
  • the substrate of the blade is curved, and wherein the alloy layer is present on curved surfaces of the curved substrate.
  • the alloy layer of the blade comprises molybdenum and at least one element selected from the group consisting of nickel, tungsten, cobalt, chromium, tin, phosphorous, iron, magnesium and boron or at least one compound comprising one or more of nickel, tungsten, cobalt, chromium, tin, phosphorous, iron, magnesium or boron.
  • the molybdenum is present in the surface coating at 35% or less by weight based on a weight of the surface coating, or at 25% or less by weight based on a weight of the surface coating, or at 15% or less by weight based on a weight of the surface coating, or is present in the alloy layer at 35% or less by weight based on a weight of the alloy layer, or at 25% or less by weight based on a weight of the alloy layer, or at 15% or less by weight based on a weight of the alloy layer, or is present in the surface coating at 65% or more by weight based on a weight of the surface coating, or at 75% or more by weight based on a weight of the surface coating, or at 85% or more by weight based on a weight of the surface coating, or is present in the alloy layer at 65% or less by weight based on a weight of the alloy layer, or at 75% or less by weight based on a weight of the alloy layer, or at 85% or less by weight based on a weight of the surface coating, or
  • the coated surface of the blade comprises a surface roughness Ra of less than 1 micron, and the molybdenum is present in the alloy layer at 20% or less by weight based on a weight of the surface coating, and the surface coating excludes precious metals.
  • the alloy layer of the blade is an electrodeposited alloy layer or is an exposed outer layer of the surface coating.
  • the exposed outer layer (i) consists essentially of molybdenum and only one of nickel, tungsten, cobalt, tin, phosphorous, iron, chromium, magnesium or boron, or (ii) consists essentially of molybdenum and only two of nickel, tungsten, cobalt, tin, phosphorous, iron, chromium, magnesium or boron, or (iii) consists essentially of both molybdenum and phosphorous and at least one of nickel, cobalt, tin, chromium, tungsten, iron, magnesium or boron.
  • the alloy layer of the blade is an electrodeposited alloy layer, and further comprises an intermediate layer between the surface of the substrate and the alloy layer, wherein the intermediate layer comprises one or more of nickel, nickel alloys, copper, copper alloys, nickel-tungsten alloys, cobalt alloys, nickel-phosphorous alloys, alloys of molybdenum or tungsten or both and at least one of nickel, cobalt, chromium, tin, phosphorous, iron or boron.
  • the surface coating of the blade further comprises an additional layer formed on the alloy layer, wherein the additional layer comprises one or more of nickel, nickel alloys, nickel-tungsten alloys, cobalt alloys, cobalt-phosphorous alloys, nickel-phosphorous alloys, alloys of molybdenum and at least one of nickel, cobalt, chromium, tin, phosphorous, iron or boron, ceramics, ceramic comprises compounds of tungsten, chromium, aluminum, zirconium, titanium, nickel, cobalt, molybdenum, silicon, boron, metal nitride, a nitride, a metal carbide, a carbide, a boron, tungsten, tungsten carbide, chromium carbide, chromium oxide, aluminum oxide, zirconia, zirconium oxide, titania, nickel carbide, nickel oxide, nanocomposite, an oxide composite, or combinations thereof.
  • the additional layer comprises one or more of nickel, nickel alloys, nickel-
  • the alloy layer of the blade further comprises one or more particles selected from the group consisting of solid nanoparticles, polymeric particles, hard particles, silicon dioxide particles, silicon carbide particles, titanium dioxide particles, polytetrafluoroethylene particles, hydrophobic particles, diamond particles, particles functionalized with hydrophobic groups, solid particles and combinations thereof.
  • the alloy layer of the blade is present as an exposed outer layer of the surface coating, wherein the exposed outer layer is an electrodeposited alloy layer, and wherein the electrodeposited alloy layer excludes precious metals.
  • the alloy layer of the blade further comprises particles.
  • the alloy layer of the blade comprises tungsten and at least one element selected from the group consisting of nickel, molybdenum, cobalt, chromium, tin, phosphorous, iron, magnesium and boron or at least one compound comprising one or more of nickel, molybdenum, cobalt, chromium, tin, phosphorous, iron, magnesium or boron.
  • the tungsten is present in the surface coating at 35% or less by weight based on a weight of the surface coating, or at 25% or less by weight based on a weight of the surface coating, or at 15% or less by weight based on a weight of the surface coating, or the tungsten is present in the alloy layer at 35% or less by weight based on a weight of the alloy layer, or at 25% or less by weight based on a weight of the alloy layer, or at 15% or less by weight based on a weight of the alloy layer, or the tungsten is present in the surface coating at 65% or more by weight based on a weight of the surface coating, or at 75% or more by weight based on a weight of the surface coating, or at 85% or more by weight based on a weight of the surface coating, or the tungsten is present in the alloy layer at 65% or less by weight based on a weight of the alloy layer, or at 75% or less by weight based on a weight of the alloy layer, or at 85% or less by weight based
  • the alloy layer of the blade consists essentially of nickel and tungsten or consists essentially of nickel, tungsten and one of tin, phosphorous, iron, magnesium or boron.
  • the coated surface of the blade comprises a surface roughness Ra of less than 1 micron, and the tungsten is present in the alloy layer at 20% or less by weight based on a weight of the surface coating, and the surface coating excludes precious metals.
  • the alloy layer is an electrodeposited alloy layer or is an exposed outer layer of the surface coating.
  • the exposed outer layer of the blade (i) consists essentially of tungsten and only one of nickel, molybdenum, cobalt, tin, phosphorous, iron, chromium, magnesium or boron, or (ii) consists essentially of tungsten and only two of nickel, molybdenum, cobalt, tin, phosphorous, iron, chromium, magnesium or boron, or (iii) consists essentially of both tungsten and phosphorous and at least one of nickel, cobalt, tin, chromium, molybdenum, iron, magnesium or boron.
  • the alloy layer of the blade is an electrodeposited alloy layer, and further comprises an intermediate layer between the surface of the substrate and the alloy layer, wherein the intermediate layer comprises one or more of nickel, nickel alloys, copper, copper alloys, nickel-molybdenum alloys, cobalt alloys, nickel-phosphorous alloys, alloys of tungsten or molybdenum or both and at least one of nickel, cobalt, chromium, tin, phosphorous, iron or boron.
  • the surface coating of the blade further comprises an additional layer formed on the alloy layer, wherein the additional layer comprises one or more of nickel, nickel alloys, nickel-molybdenum alloys, cobalt alloys, cobalt-phosphorous alloys, nickel-phosphorous alloys, alloys of tungsten and at least one of nickel, cobalt, chromium, tin, phosphorous, iron or boron, ceramics, ceramic comprises compounds of molybdenum, chromium, aluminum, zirconium, titanium, nickel, cobalt, tungsten, silicon, boron, metal nitride, a nitride, a metal carbide, a carbide, a boron, molybdenum, molybdenum carbide, chromium carbide, chromium oxide, aluminum oxide, zirconia, zirconium oxide, titania, nickel carbide, nickel oxide, nanocomposite, an oxide composite, or combinations thereof.
  • the additional layer comprises one or more of nickel, nickel
  • the alloy layer of the blade comprises one or more particles selected from the group consisting of solid nanoparticles, polymeric particles, hard particles, silicon dioxide particles, silicon carbide particles, titanium dioxide particles, polytetrafluoroethylene particles, hydrophobic particles, diamond particles, particles functionalized with hydrophobic groups, solid particles and combinations thereof.
  • the blade is present in a main rotor of a helicopter or is present in a turbine or is present in a pump.
  • the alloy layers described herein may be present in a rotational shaft.
  • a rotational shaft is typically rod shaped as shown in FIG. 14 and may be solid or hollow or have hollow sections.
  • the rotational shaft can connect to other components so as the shaft rotates the other components can move.
  • One end of the rotational shaft can couple to a motor, engine or other driving device, and some other portion of the rotational shaft can couple to a component to be moved.
  • the rotational shaft may comprise an alloy layer as described herein.
  • a rotational shaft comprises a substrate that rotates about an axis, e.g., a longitudinal axis. At least one surface of the substrate comprises a coated surface.
  • the coated surface comprises a surface coating, wherein the surface coating comprises an alloy layer comprising (i) molybdenum and (ii) at least one element selected from the group consisting of nickel, tungsten, cobalt, chromium, tin, phosphorous, iron, magnesium and boron or at least one compound comprising one or more of nickel, tungsten, cobalt, chromium, tin, phosphorous, iron, magnesium or boron.
  • the alloy layer of the rotational shaft comprises (i) tungsten and (ii) at least one element selected from the group consisting of nickel, molybdenum, cobalt, chromium, tin, phosphorous, iron, magnesium and boron or at least one compound comprising one or more of nickel, molybdenum, cobalt, chromium, tin, phosphorous, iron, magnesium or boron.
  • the alloy layer of the rotations shaft is present on all outer surfaces of the substrate.
  • the substrate is cylindrical, and wherein the alloy layer is present on curved surfaces of the cylindrical substrate.
  • the alloy layer of the rotational shaft comprises molybdenum and at least one element selected from the group consisting of nickel, tungsten, cobalt, chromium, tin, phosphorous, iron, magnesium and boron or at least one compound comprising one or more of nickel, tungsten, cobalt, chromium, tin, phosphorous, iron, magnesium or boron.
  • the molybdenum is present in the surface coating at 35% or less by weight based on a weight of the surface coating, or at 25% or less by weight based on a weight of the surface coating, or at 15% or less by weight based on a weight of the surface coating, or is present in the alloy layer at 35% or less by weight based on a weight of the alloy layer, or at 25% or less by weight based on a weight of the alloy layer, or at 15% or less by weight based on a weight of the alloy layer, or is present in the surface coating at 65% or more by weight based on a weight of the surface coating, or at 75% or more by weight based on a weight of the surface coating, or at 85% or more by weight based on a weight of the surface coating, or is present in the alloy layer at 65% or less by weight based on a weight of the alloy layer, or at 75% or less by weight based on a weight of the alloy layer, or at 85% or less by weight based on a weight of the alloy layer, or
  • the alloy layer of the rotations shaft consists essentially of nickel and molybdenum or consists essentially of nickel, molybdenum and one of tin, phosphorous, iron, magnesium or boron.
  • the coated surface of the rotational shaft comprises a surface roughness Ra of less than 1 micron, and the molybdenum is present in the alloy layer at 20% or less by weight based on a weight of the surface coating, and the surface coating excludes precious metals.
  • the alloy layer of the rotational shaft is an electrodeposited alloy layer or is an exposed outer layer of the surface coating.
  • the exposed outer layer of the rotational shaft (i) consists essentially of molybdenum and only one of nickel, tungsten, cobalt, tin, phosphorous, iron, chromium, magnesium or boron, or (ii) consists essentially of molybdenum and only two of nickel, tungsten, cobalt, tin, phosphorous, iron, chromium, magnesium or boron, or (iii) consists essentially of both molybdenum and phosphorous and at least one of nickel, cobalt, tin, chromium, tungsten, iron, magnesium or boron.
  • the alloy layer of the rotational shaft is an electrodeposited alloy layer
  • the surface coating further comprises an intermediate layer between the surface of the substrate and the alloy layer, wherein the intermediate layer comprises one or more of nickel, nickel alloys, copper, copper alloys, nickel-tungsten alloys, cobalt alloys, nickel-phosphorous alloys, alloys of molybdenum or tungsten or both and at least one of nickel, cobalt, chromium, tin, phosphorous, iron or boron.
  • the surface coating of the rotational shaft comprises an additional layer formed on the alloy layer, wherein the additional layer comprises one or more of nickel, nickel alloys, nickel-tungsten alloys, cobalt alloys, cobalt-phosphorous alloys, nickel-phosphorous alloys, alloys of molybdenum and at least one of nickel, cobalt, chromium, tin, phosphorous, iron or boron, ceramics, ceramic comprises compounds of tungsten, chromium, aluminum, zirconium, titanium, nickel, cobalt, molybdenum, silicon, boron, metal nitride, a nitride, a metal carbide, a carbide, a boron, tungsten, tungsten carbide, chromium carbide, chromium oxide, aluminum oxide, zirconia, zirconium oxide, titania, nickel carbide, nickel oxide, nanocomposite, an oxide composite, or combinations thereof.
  • the additional layer comprises one or more of nickel, nickel alloys, nickel
  • the alloy layer of the rotational shaft further comprises one or more particles selected from the group consisting of solid nanoparticles, polymeric particles, hard particles, silicon dioxide particles, silicon carbide particles, titanium dioxide particles, polytetrafluoroethylene particles, hydrophobic particles, diamond particles, particles functionalized with hydrophobic groups, solid particles and combinations thereof.
  • the alloy layer of the rotational shaft is present as an exposed outer layer of the surface coating, wherein the exposed outer layer is an electrodeposited alloy layer, and wherein the electrodeposited alloy layer excludes precious metals.
  • the alloy layer of the rotational shaft is an exposed outer alloy layer of the surface coating, wherein the exposed outer layer is an electrodeposited exposed outer alloy layer, wherein the electrodeposited exposed outer alloy layer is free of precious metals, and wherein the molybdenum is present in the electrodeposited exposed outer alloy layer at 35% by weight or less based on a weight of the surface coating.
  • the coated surface of the rotational shaft comprises a surface roughness Ra of less than 1 micron.
  • the alloy layer of the rotational shaft comprises tungsten and at least one element selected from the group consisting of nickel, molybdenum, cobalt, chromium, tin, phosphorous, iron, magnesium and boron or at least one compound comprising one or more of nickel, molybdenum, cobalt, chromium, tin, phosphorous, iron, magnesium or boron.
  • the tungsten is present in the surface coating at 35% or less by weight based on a weight of the surface coating, or at 25% or less by weight based on a weight of the surface coating, or at 15% or less by weight based on a weight of the surface coating, or is present in the alloy layer at 35% or less by weight based on a weight of the alloy layer, or at 25% or less by weight based on a weight of the alloy layer, or at 15% or less by weight based on a weight of the alloy layer, or is present in the surface coating at 65% or more by weight based on a weight of the surface coating, or at 75% or more by weight based on a weight of the surface coating, or at 85% or more by weight based on a weight of the surface coating, or is present in the alloy layer at 65% or less by weight based on a weight of the alloy layer, or at 75% or less by weight based on a weight of the alloy layer, or at 85% or less by weight based on a weight of the alloy layer, or is present
  • the alloy layer of the rotational shaft consists essentially of nickel and tungsten or consists essentially of nickel, tungsten and one of tin, phosphorous, iron, magnesium or boron.
  • the coated surface comprises a surface roughness Ra of less than 1 micron, and the tungsten is present in the alloy layer at 20% or less by weight based on a weight of the surface coating, and the surface coating excludes precious metals.
  • an exposed outer layer of the rotational shaft (i) consists essentially of tungsten and only one of nickel, molybdenum, cobalt, tin, phosphorous, iron, chromium, magnesium or boron, or (ii) consists essentially of tungsten and only two of nickel, molybdenum, cobalt, tin, phosphorous, iron, chromium, magnesium or boron, or (iii) consists essentially of both tungsten and phosphorous and at least one of nickel, cobalt, tin, chromium, molybdenum, iron, magnesium or boron.
  • the alloy layer is an exposed outer alloy layer of the surface coating, wherein the exposed outer layer is an electrodeposited exposed outer alloy layer, wherein the electrodeposited exposed outer alloy layer is free of precious metals, and wherein the tungsten is present in the electrodeposited exposed outer alloy layer at 35% by weight or less based on a weight of the surface coating.
  • the alloy layer of the rotational shaft further comprises particles.
  • the substrate is configured to rotate circumferentially during use of the rotational shaft.
  • the rotational devices described herein may be one component of a larger rotational device.
  • an impeller 1900 (or a propellor) including a blade 1910 can include a coated surface as described herein, e.g., any of those layers and materials as described in connection with FIGS. 1 - 12 .
  • a windmill 2000 is shown comprising a blade 2010 .
  • the blade 202 can include a coated surface as described herein, e.g., any of those layers and materials as described in connection with FIGS. 1 - 12 .
  • a gear 2100 is shown that can include a surface coating as described herein, e.g., any of those layers and materials as described in connection with FIGS. 1 - 12 .
  • One or more of the blades or gears of a turbine e.g., a steam turbine, airplane turbine, turbine used in nuclear power generation, etc. may comprise a coated surface as described herein, e.g., any of those layers and materials as described in connection with FIGS. 1 - 12 .
  • MaxShield-V1 has a thickness between 20 to 30 ⁇ m.
  • MaxShield-V1 was also tested as plated, after bake-relief at 190° C. for 23 hours (V1-BR), and after heat treatment at 400 C for 2 hours (V1-HT).
  • MaxShield-V2 has a thickness between 70 to 90 ⁇ m. Manufacturing MaxShield-V2 uses a heat-treatment process to improve hardness and wear performance.
  • MaxShield-V3 is similar to MaxShield-V2 but it is not heat-treated.
  • MaxShield hard chrome electroplating
  • FIG. 22 demonstrates a hydraulic bar coated in MaxShield and compares that with that coated in EHC. Both MaxShield and EHC were grinded and polished after plating. Through some preliminary tests, we could enable black version of the coating. The coating can be further polished and machined to change the appearance. It is conformal and can be applied on rough surfaces.
  • MaxShield ranges from one micron to 75 microns. Coatings thicker than 0.5 mm can also be created. The coating thickness can be less than one micrometer and possibly higher than 1.5 mm if needed. The coating thickness is mainly controlled by deposition time.
  • a testing lab (NADCAP-certified testing facility, Assured Testing Services) was used to measure corrosion.
  • the test was a standard corrosion test, also known as salt fog test. During this test, the coated sample is exposed to 5% sodium chloride mist which simulates marine environment corrosion. The test was done according to ASTM B117-19 by the testing lab. In this test, the corrosion performance of EHC coating and electroless nickel coating is compared with that of our coating up to 5000 hours of exposure to the salt fog.
  • Assured Testing Services determined the corrosion ratings of different samples according to the ASTM D610 Rust Grade. This standard implies a rating range between 0 to 10 with 10 corresponding to the best corrosion resistance and 0 corresponding to the worse corrosion resistance.
  • the testing lab also performed the salt spray test on three samples of MaxShield-Vl coating.
  • the test has also been performed on two samples of MaxShield-V2 and MaxShield-V3 coatings.
  • Assured Testing Services scribed one MaxShield-V1 coating and tested that in the salt spray chamber as well.
  • FIGS. 23 A and 23 B show the carbon steel samples coated with EHC and electroless nickel coating with respective corrosion rating of 4 and 0 after 1000 hours exposure to the salt fog. Both these two samples were produced by independent plating shops. According to the ASTM D610, a corrosion rate of 0 for electroless nickel after 1000 hours indicates rust formation over 50% of the surface area. In addition, a corrosion rate of 4 for EHC coating indicates that 3 to 10% of the surface area is corroded after 1000 hours. The images of all five MaxShield coatings after 1000 hours exposure to the salt spray are shown in FIGS. 24 A- 24 E . Four of these samples exhibit the rating of 9, while the corrosion rating for one of the Maxshield-V1 samples after 1000 hours is 10. Corrosion rate of 9 indicates rust formation in less than 0.03% of the surface area according to the ASTM D610 standard. Maxshield-V1 sample with rating 10 did not rust at all in the first 1000 hours.
  • FIG. 25 compares the results of the salt spray test for our coatings with that of EHC coating. As this figure shows, corrosion rating of EHC coating reduces sharply to 4 after 400 hours exposure to the salt spray while the corrosion rate of our coating remains above 9 up to 1000 hours exposure.
  • MaxShield-V1 coating For the scribed MaxShield-V1 coating, the corrosion rate of 9 was obtained on the areas far from the scribed region. Creep measurement rating of 8 was obtained for the scribed region on this sample based on ASTM D1654. The preliminary tests on the scribed surface shows that MaxShield is not expected to raise a significant risk of accelerated corrosion if it gets scratched and the underneath steel surface gets exposed at the location of the scratch.
  • Corrosion test results after 1000 hours Salt spray corrosion test was continued on MaxShield samples after 1000 hours. Rating of the samples at different times of the salt spray test and their appearance after 5000 hours are shown in FIGS. 26 A- 26 E . As shown in Table 1, ratings of Maxshield-V2 and MaxShield-V3 remain at 9 up to 4000 hours of the salt spray.
  • MaxShield-V1-sample 1 ( FIG. 26 A ) MaxShield-V1-sample2 ( FIG. 26 B ) MaxShield-V1-sample 3 ( FIG. 26 C ) MaxShield-V3 ( FIG. 26 D ) MaxShield-V2 ( FIG. 26 E ) 200 10 10 10 10 10 10 10 400 10 10 10 10 10 10 600 10 10 9 9 10 800 9 10 9 9 9 9 1000 9 10 9 9 9 9 3000 7 9 8 9 9 9 4000 7 9 8 9 9 9 5000 7 9 8 9 9 9
  • MaxShield-V1 exhibit a corrosion rating of 7, 9, and 8, respectively.
  • MaxShield-V1 has lower thickness compared to Maxshield-V2 and MaxShield-V3. For thinner coatings, there is more chance for the corrosive media to get to the base steel substrate from the pinholes and defects on the coating and result in corrosion. This may be the reason that Maxshield-V2 and MaxShield-V3 perform better than MaxShield-V1 at this elongated exposure to the corrosive media. As shown in the images in FIGS. 26 A- 26 E , MaxShield creates greenish tarnish that can easily be distinguished from rust.
  • Testing lab NADCAP-certified testing facility, Assured Testing Services. Procedure: The test was performed on three sets of samples. Each set includes four notched bars covered with a version of the MaxShield coating. The images of one of these notched bars before and after applying the coating are shown in FIG. 27 . The bars were tested per ASTM F519-18 for 200 hours of sustained loads in the amount of 75% of their fracture strength by the testing lab. Results: All four notched bars of both MaxShield-V1 and MaxShield-V2 passed the test and did not exhibit any fracture. These results demonstrate that MaxShield-V1 and MaxShield-V2 coatings do not cause hydrogen-induced cracking and can resist against hydrogen embrittlement.
  • MaxShield-V3 is a thicker version of MaxShield-V1 that provides more protection against hydrogen embrittlement. Therefore, since MaxShield-V1 has passed the test, MaxShield-V3 would also be expected to pass the test.
  • FIGS. 28 A and 28 B shows the images of MaxShield-V1 ( FIG. 28 B ) and MaxShield-V2 ( FIG. 28 A ) coatings after 6 percent elongation.
  • the microscopic image of MaxShield-V1 coating is demonstrated in FIG. 29 . As FIG. 28 A- 29 show, the coating exhibits at least 6% ductility without any fracture or blistering.
  • Friction coefficient of MaxShield-V2 and MaxShield-V3 coatings were measured per ASTM G99-17 specification by EP Laboratories. As shown in FIG. 30 , the test was involved in applying 20 N force through a hard ball made of 440C stainless steel onto the lubricated coating surface that rotates 200 revolution per minute.
  • One of the main characteristics of EHC is its low friction coefficient or its slippery nature in lubricated environments. In this test, friction coefficient of EHC was also measured and compared with MaxShield coatings.
  • Friction coefficients measured for EHC coating, Maxshield-V2, and MaxShield-V3 coatings are shown in Table 2. As shown in this table, friction coefficients of both versions of MaxShield are slightly lower than EHC coating. Based on these results, we expect almost similar performance of MaxShield coating in the lubricated wear conditions. It is worth mentioning that MaxShield-V1 can have a lower performance in aggressive wear environments, and this is the reason that it has not been tested here.
  • FIGS. 32 A and 32 B shows the images of the two carbon steel bars coated with MaxShield-V1 after ( FIG. 32 B ) and before ( FIG. 32 A ) the test.
  • the surfaces covered with MaxShield-V1 coating were free of hydrogen induced blisters or cracking.
  • MaxShield-V2 and MaxShield-V3 are less susceptible to hydrogen sulfide cracking compared to MaxShield-V1 because of their larger thickness. This is the reason that this test was just performed on MaxShield-V1.
  • Elevated temperature performance and comparison with EHC An important point that has also been highlighted in Table 3 is that hardness of EHC coating reduces at high temperatures (4). At the normal bake-relief process at 190° C. for 23 hours hardness of EHC reduces from 800 -1000 to a value between 700 -750. Furthermore, as exhibited by the cross-sectional images discussed in Example 11, heat ruins the integrity of the EHC coating by creating large macro-cracks in its structure. Therefore, it is expected that the coating loses its corrosion protection at higher temperatures. As a result, regardless of environmental regulations and mandates on eliminating EHC coating, this coating does not perform at high operating temperatures.
  • MaxShield-V2 coating is expected to increase at high temperatures.
  • the coatings will be exposed to heat.
  • MaxShield is expected to improve in its hardness in these environments.
  • Taber wear index is the milligram weight loss per 1000 cycles.
  • the samples were prepared and tested as plated (MaxShield-V1) and after heat treatment at 400 C for 2 hours (MaxShield-V2).
  • the TWI results for MaxShield samples are shown in FIG. 35 .
  • This Figure also shows the TWI values for as-plated, heat-treated EHC, and electroless Nickel coatings. The test has been done on at least three different samples for each coating and the results for the electroless nickel and EHC coatings match with those in the literature (2). These results exhibit the average TWI of 6 and 5 for as-plated and heat-treated MaxShield, respectively, that are very close to those obtained for EHC. TWI of heat-treated MaxShield is even slightly better that TWI of 6 for heat-treated EHC.
  • electroless Nickel coating is accepted as one of its viable replacements in the industry.
  • as-plated version of our coating (MaxShield-V3) with average TWI of 6 is expected to exhibit better wear performance compared to as-plated electroless nickel with average TWI of 15.
  • a heat-treated version of our coating (MaxShield-V2) with average TWI of 5 also exhibits better wear performance compared to heat-treated electroless nickel with average TWI of 7.
  • An average TWI of heat-treated EHC is 6 and is more than the average TWI of 5 for MaxShield-V2 coating.
  • Test was performed based on the ASTM G-77-17 by Falex corporation who is one of the industry pioneers in performing this test.
  • a test block was loaded with 30 pounds against a test ring that rotates at a 197 rpm for 500.000 revolutions.
  • Block scar volume was calculated from the block scar width
  • ring scar volume was calculated from ring weight loss.
  • coefficient of friction (CoF) values were continuously measured during the test.
  • the test was performed on a ring sample coated with MaxShield with minimum thickness of 0.006”.
  • the ring was made of 4620 steel. It was grounded and polished to a coating thickness of 0.003” to 0.005” and to a surface finish of 4 to 8 microinches.
  • the block was an uncoated PH13-8Mo steel. The test on chrome coated ring is ongoing and the results will be provided soon.
  • FIG. 37 compares the corrosion rate of modified MaxShield-V1 coating with existing nickel coating, Monel, Inconel and Hastelloy.
  • the rate reported for these coatings in FIG. 37 is the average of the corrosion test obtained for at least three different samples. As this figure shows, the corrosion rate of MaxShield-V1 coating (less than 13 milli-inch per year, sometimes as low as 1.5 milli-inch per year) is much lower than that of the existing nickel coating (80 milli-inch per year) (6).
  • FIG. 37 also shows the corrosion rate of corrosion-resistant bulk materials, Hastelloy ® B2 and Inconel ® , against the concentrated HC1 solution, based on the values published in the literature (7) (8).
  • Hastelloy ® 15 milli-inch per year
  • Inconel ® 39 milli-inch per year
  • Hastelloy ® and Inconel ® are superalloys known for their extreme corrosion resistance in HC1 environment. EHC coating dissolves in concentrated HC1 in less than 10 minutes and its corrosion rate is not on the scale of this figure.
  • Maxterial Inc. Procedure This test was done in Maxterial to study the cross-section of MaxShield, measure the thickness and evaluate the effect of the heat treatment on coating structure. All the metallographic works have been done by Maxterial using our in-house facility. EHC samples with the thickness of around 100 ⁇ m were provided to us by a chrome plating shop. The cross-section of the as-plated and heat-treated EHC and MaxShield-V1 samples are shown in FIGS. 38 A and 38 B , respectively. The heat treatment has been done at 400 C for 2 hours. This cross-sectional analysis was performed on the modified MaxShield-V1 in 2021.
  • MaxShield can be machined without any adhesion failure.
  • machining chrome is known to be problematic because of chipping, and flaking issue.
  • MaxShield has much better ductility than EHC.
  • MaxShield adheres well to most substrates.
  • MaxShield is typically produced sing a typical electroplating process. The processes include proper cleaning and activation of the substrate following by the electrodeposition. Some of the process factors of MaxShield are: Power source: MaxShield uses a DC-current power source; Deposition rate: MaxShield’s typical deposition rate (1.5 mil/hr) is twice faster that the deposition rate of EHC (0.7 mil/hour). MaxShield’s deposition rate can change depending on multiple factors such as current density; Plating efficiency: Plating efficiency of MaxShield (80-90%) is much higher than that of EHC (10-35%). It is worth mentioning that, in most cases, plating efficiency of EHC is below 20%; Electroplating processes temperatures: MaxShield’s plating temperature is in the normal range of the industry (140-170 F)
  • MaxShield successfully passed both tests.
  • MaxShield coating and the chemicals used in manufacturing MaxShield referred to as LeanX, are free from substances of very high concerns (SVHC).
  • both MaxShield and LeanX are free from chromium, cadmium, cyanide, lead and fluoro Compounds such as PFOS and PFAS.

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