US20230036133A1 - Multi-layered ceramic capacitor - Google Patents
Multi-layered ceramic capacitor Download PDFInfo
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- US20230036133A1 US20230036133A1 US17/953,735 US202217953735A US2023036133A1 US 20230036133 A1 US20230036133 A1 US 20230036133A1 US 202217953735 A US202217953735 A US 202217953735A US 2023036133 A1 US2023036133 A1 US 2023036133A1
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- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 77
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 12
- 239000003990 capacitor Substances 0.000 description 10
- 230000005684 electric field Effects 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 230000006866 deterioration Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 229910002113 barium titanate Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 229910000314 transition metal oxide Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
- H01G4/302—Stacked capacitors obtained by injection of metal in cavities formed in a ceramic body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/35—Feed-through capacitors or anti-noise capacitors
Definitions
- the present disclosure relates to a multilayer ceramic capacitor.
- a multilayer ceramic capacitor MLCC is one type of passive component, which controls an electrical signal on a circuit.
- a main role of such a multilayer ceramic capacitor is to accumulate charges in electrodes, to block direct current (DC) signals, and to pass alternating current (AC) signals. That is, such a multilayer ceramic capacitor can be seen to play a role in stabilizing an operation of an IC by bypassing and removing AC noise from a power line.
- the MLCC device may have characteristic deterioration due to a cross talk phenomenon as an electromagnetic distance of each layer is reduced.
- An aspect of the present disclosure is to prevent deterioration of electric field characteristics due to cross talk.
- Another aspect of the present disclosure is to significantly reduce an influence of a fringing field applied to an internal electrode.
- Another aspect of the present disclosure is to reduce noise caused by unwanted electric field signals.
- a multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes having different sizes to each other, and having first and second surfaces opposing each other in a stacking direction, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first and second surfaces and connected to the third and fourth surfaces, and opposing each other; and first and second external electrodes, and when a margin of the first internal electrode in a longitudinal direction is b and a margin of the second internal electrode in a longitudinal direction is a, a ratio (a/b) of the margin (a) of the second internal electrode in the longitudinal direction to the margin (b) of the first internal electrode in the longitudinal direction may be 0.33 or more (where, a>0 and b>0).
- a multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes having different sizes to each other, and having first and second surfaces opposing each other in a stacking direction, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first and second surfaces and connected to the third and fourth surfaces and opposing each other; and first and second external electrodes, and when a margin of the first internal electrode in a width direction is d and a margin of the second internal electrode in a width direction is c, a ratio (c/d) of the margin (c) of the second internal electrode in the width direction to the margin (d) of the first internal electrode in the width direction may be 0.33 or more (where, c>0 and d>0).
- FIG. 1 is a schematic perspective view of a multilayer ceramic capacitor according to an embodiment of the present disclosure
- FIG. 2 is a schematic perspective view of a body of a multilayer ceramic capacitor of FIG. 1 ;
- FIGS. 3 and 4 are plan views illustrating first and second internal electrodes respectively applied to the multilayer ceramic capacitor of FIG. 1 ;
- FIG. 5 is a plan view of overlap of the first and second internal electrodes applied to the multilayer ceramic capacitor of FIG. 1 ;
- FIG. 6 is a schematic perspective view of a multilayer ceramic capacitor according to another embodiment of the present disclosure.
- FIG. 7 is a schematic perspective view illustrating a body of the multilayer ceramic capacitor of FIG. 6 ;
- FIG. 8 is a plan view overlapping first and second internal electrodes applied to the multilayer ceramic capacitor of FIG. 6 ;
- FIG. 9 is a schematic perspective view of a multilayer ceramic capacitor according to another embodiment of the present disclosure.
- FIG. 10 is a schematic perspective view of a multilayer ceramic capacitor according to another embodiment of the present disclosure.
- FIG. 11 is a schematic perspective view illustrating a body of the multilayer ceramic capacitors of FIGS. 9 and 10 ;
- FIG. 12 is a plan view overlapping first and second internal electrodes of an embodiment which may be applied to the multilayer ceramic capacitors of FIGS. 9 and 10 ;
- FIG. 13 is a plan view overlapping first and second internal electrodes of another embodiment which may be applied to the multilayer ceramic capacitors of FIGS. 9 and 10 ;
- FIG. 14 is a plan view illustrating a second internal electrode applied to the multilayer ceramic capacitors of FIGS. 9 and 10 ;
- FIG. 15 is a plan view overlapping first and second internal electrodes of another embodiment which may be applied to the multilayer ceramic capacitors of FIGS. 9 and 10 ;
- FIG. 16 is a graph illustrating a cross talk level (S21-parameter) according to a ratio of margins of the multilayer ceramic capacitor in a longitudinal and/or a width direction according to a multilayer ceramic capacitor of the present disclosure.
- X, Y and Z shown in the figure represent a longitudinal direction (second direction), a width direction (third direction), and a thickness direction (first direction) of the capacitor body 110 , respectively.
- the Z direction may be conceptually the same as a stacking direction or a lamination direction in which dielectric layers are stacked and laminated.
- FIG. 1 is a schematic perspective view of a multilayer ceramic capacitor according to an embodiment of the present disclosure
- FIGS. 3 and 4 are plan views illustrating first and second internal electrodes respectively, applied to the multilayer ceramic capacitor of FIG. 1
- FIG. 5 is a plan view overlapping the first and second internal electrodes applied to the multilayer ceramic capacitor of FIG. 1 .
- a multilayer ceramic capacitor includes a body 110 including a dielectric layer 111 and first and second internal electrodes 121 and 122 having different sizes to each other, and having first and second surfaces S 1 and S 2 opposing each other in a stacking direction, third and fourth surfaces S 3 and S 4 connected to the first and second surfaces S 1 and S 2 and opposing each other, and fifth and sixth surfaces S 5 and S 6 connected to the first and second surfaces S 1 and S 2 and connected to the third and fourth surfaces S 3 and S 4 , and opposing each other; and first and second external electrodes 131 and 132 .
- a ratio (a/b) of the margin (a) of the second internal electrode 122 in the longitudinal direction to the margin (b) of the first internal electrode 121 in the longitudinal direction may be 0.33 or more (where, a>0 and b>0).
- the multilayer ceramic capacitor according to the present disclosure when the ratio (a/b) of the margin in the longitudinal direction and/or the ratio (c/d) of the margin in the width direction described later falls within a predetermined range, cross talk that may occur due to a fringing effect may be prevented as described later, thereby preventing deterioration of electric field characteristics.
- the fringing effect refers to an effect caused by lines of electric force diverging and converging circularly at an electrode end of the parallel plate capacitor, which may cause cross talk when an unwanted electric field signal is transferred to another port. This phenomenon is likely to occur when a plurality of small chips are mounted in a narrow area, or when several components are merged into a single chip.
- the multilayer ceramic capacitor of the present disclosure may solve this problem.
- a size of a fringing field may be reduced by a plurality of internal electrodes as a compensation pattern to each other, thereby preventing deterioration of electric field characteristics and generation of noise.
- margin may mean a difference in a size between the dielectric layer and the internal electrode, and may mean a distance between an end of the internal electrode and an end of the dielectric layer.
- “margin in the longitudinal direction” may mean the shortest distance from the end of the internal electrode in the longitudinal direction (second direction, X direction) to the end of the dielectric layer in the longitudinal direction (second direction, X direction), and may mean the shortest distance to the third surface S 3 or the fourth surface S 4 of the above-described body.
- “margin in the width direction” may mean a distance from the end of the internal electrode in the width direction (third direction, Y direction) to the end of the dielectric layer in the width direction (third direction, Y direction), and may mean the shortest distance to the fifth surface S 5 or the sixth surface S 6 of the above-described body.
- FIG. 12 is a cross-sectional view of a multilayer ceramic capacitor in which a first internal electrode 321 and a second internal electrode 322 are disposed.
- a margin (b) of the first internal electrode 321 in a longitudinal direction refers to the shortest distance from a position 1 to a position 3
- a margin (a) of the second internal electrode 322 in a longitudinal direction refers to the shortest distance from a position 2 to a position 3 .
- a margin d of the first internal electrode 321 in a width direction refers to the shortest distance from a position w 1 to a position w 3
- a margin c of the second internal electrode 322 refers the shortest distance from a position w 2 to a position w 3 .
- the capacitor body 110 is formed by laminating a plurality of dielectric layers 111 in the Z direction and then firing the plurality of dielectric layers 111 , a boundary between the adjacent dielectric layers 111 of the capacitor body 110 may be integrated, such that it may be difficult to confirm without using a scanning electron microscope (SEM).
- SEM scanning electron microscope
- the specific shape of the body is not particularly limited, but as illustrated, the body may be formed in a hexahedral shape or a similar shape. Due to shrinkage of the ceramic powder contained in the body during a firing process, the body may have a substantially hexahedral shape, although not a hexahedral shape with a completely straight line.
- the shape and dimensions of the capacitor body 110 and the number of laminated layers of the dielectric layer 111 are not limited to those illustrated in the drawings of the present embodiment.
- both surfaces of the capacitor body 110 opposing each other in the Z direction are defined as first and second surfaces S 1 and S 2
- both surfaces connected to the first and second surfaces S 1 and S 2 and opposing each other in the X direction are defined as third and fourth surfaces S 3 and S 4
- both surfaces connected to the first and second surfaces S 1 and S 2 and connected to the third and fourth surfaces S 3 and S 4 and opposing each other in the Y direction are defined as fifth and sixth surfaces S 5 and S 6 .
- a raw material for forming the dielectric layer 111 is not particularly limited as long as sufficient electrostatic capacitance may be obtained therewith.
- the raw material for forming the dielectric layer 511 may be a barium titanate (BaTiO 3 ) material, a lead composite perovskite material, a strontium titanate (SrTiO 3 ) material, or the like.
- a material for forming the dielectric layer 111 various ceramic additives, organic solvents, plasticizers, binders, dispersants, and the like, may be added to powders such as barium titanate (BaTiO 3 ) according to the purpose of the present disclosure.
- barium titanate BaTiO 3
- the ceramic additive for example, a transition metal oxide or a transition metal carbide, a rare earth element, magnesium (Mg), aluminum (Al), or the like, may be used.
- the plurality of internal electrodes 121 and 122 having different sizes to each other may be alternately disposed with the dielectric layer 111 interposed therebetween.
- the first and second internal electrodes 121 and 122 may be electrically separated from each other by the dielectric layer 111 disposed in the middle.
- a material for forming the first and second internal electrodes 131 ad 122 is not particularly limited, and may be formed using a conductive paste including one or more materials, for example, of silver (Ag), palladium (Pd), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), tin (Sn), tungsten (W), palladium (Pd), titanium (Ti) and alloys thereof.
- a conductive paste including one or more materials, for example, of silver (Ag), palladium (Pd), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), tin (Sn), tungsten (W), palladium (Pd), titanium (Ti) and alloys thereof.
- a printing method of the conductive paste a screen printing method or a gravure printing method may be used, but the present disclosure is not limited thereto.
- An average thickness of the first and second internal electrodes 121 and 122 may be 0.4 ⁇ m or less.
- the average thickness of the internal electrode may be an average of values measured at five different positions of the fired internal electrode.
- a lower limit of the average thickness of the first and second internal electrodes is not particularly limited, but may be, for example, 0.01 ⁇ m or more.
- a ratio (a/b) of the margin (b) of the first internal electrode 121 in the longitudinal direction and the margin (a) of the second internal electrode 122 may be 0.33 or more.
- a ratio (a/b) of the margin (b) of the first internal electrode 121 in the longitudinal direction and the margin (a) of the second internal electrode 122 in the longitudinal direction is 0.33 or more, the second internal electrode sufficiently functions as a compensation pattern and cross talk may be reduced.
- the ratio (a/b) is less than 0.33, a distance from the external electrode may be too close and a short may occur.
- an upper limit of the ratio (a/b) of the margin (b) of the first internal electrode 121 in the longitudinal direction and the margin (a) of the second internal electrode 122 in the longitudinal direction is not particularly limited, however, may be, for example, less than 1.
- the second internal electrode 122 may not function as a compensation pattern.
- the ratio (a/b) of the margin (b) of the first internal electrode in the longitudinal direction and the margin (a) of the second internal electrode in the longitudinal direction may be less than 1, e.g., 0.95 or less, 0.85 or less, 0.80 or less, 0.75 or less, 0.70 or less, or 0.67 or less.
- the ratio (a/b) of the margin (b) of the first internal electrode in the longitudinal direction and the margin (a) of the second internal electrode in the longitudinal direction satisfy the above range, thereby significantly reducing an impact of a fringing field applied to the end of the internal electrode, and significantly reducing cross talk.
- the ratio (a/b) of the margin (b) of the first internal electrode in the longitudinal direction to the margin (a) of the second internal electrode in the longitudinal direction satisfy the above range, thereby significantly reducing an impact of a fringing field applied to the end of the internal electrode, and significantly reducing cross talk.
- a difference (b-a) between the margin (b) of the first internal electrode in the longitudinal direction and the margin (a) of the second internal electrode in the longitudinal direction may be 10 ⁇ m or more.
- the difference (b-a) between the margin (b) of the first internal electrode in the longitudinal direction and the margin (a) of the second internal electrode in the longitudinal direction may mean a difference in the length of the margin (b) of the first internal electrode in the longitudinal direction and the length of the margin (a) of the second internal electrode in the longitudinal direction, and may mean a difference in lengths in the X direction.
- the difference (b-a) of the margin (b) of the first internal electrode in the longitudinal direction and the margin (a) of the second internal electrode in the longitudinal direction may be, for example, 10 ⁇ m or more, 14 ⁇ m or more, 18 ⁇ m or more, 22 ⁇ m or more, 26 ⁇ m or more or 30 ⁇ m, and an upper limit is not particularly limited, for example, may be 500 ⁇ m or less.
- an upper limit is not particularly limited, for example, may be 500 ⁇ m or less.
- a ratio (c/d) of the margin (d) of the first internal electrode in the width direction and the margin (c) of the second internal electrode in the width direction may be 0.33 or more (where, c>0 and d>0).
- Cross talk may be reduced in a range in which the ratio (c/d) of the margin (d) of the first internal electrode in the width direction and the margin (c) of the second internal electrode in the width direction is 0.33 or more.
- the ratio (c/d) is less than 0.33, a distance between the external electrodes may be excessively close, and a short may occur.
- an upper limit of the ratio (c/d) of the margin (d) of the first internal electrode in the width direction and the margin (c) of the second internal electrode in the width direction is not particularly limited, but may be, for example, less than 1.
- the ratio (c/d) is 1, the second internal electrode may not function as a compensation pattern.
- the ratio (c/d) of the margin (d) of the first internal electrode in the width direction and the margin (c) of the second internal electrode in the width direction may be less than 1, 0.95 or less, 0.85 or less, 0.80 or less, 0.75 or less, 0.70 or less, or 0.67 or less.
- the ratio (c/d) of the margin (d) of the first internal electrode in the width direction and the margin (c) of the second internal electrode in the width direction satisfies the above range, such that an impact of a fringing field applied to the end of the internal electrode may be significantly reduced, and cross talk may be significantly reduced.
- a difference (d-c) between the margin d of the first internal electrode in the width direction and the margin c of the second internal electrode in the width direction may be 10 ⁇ m or more.
- the difference (d-c) between the margin (d) of the first internal electrode in the width direction and the margin (c) of the second internal electrode in the width direction may mean the difference between the width of the margin (d) of the first internal electrode in the width direction and the margin (c) of the second internal electrode in the width direction, and may mean the difference of the width in the Y direction.
- the difference (d-c) between the margin (d) of the first internal electrode in the width direction and the margin (c) of the second internal electrode in the width direction may be, for example, 10 ⁇ m or more, 14 ⁇ m or more, 18 ⁇ m or more, 22 ⁇ m or more, 26 ⁇ m or more or 30 ⁇ m or more, and an upper limit thereof is not particularly limited, but may be, for example, 500 ⁇ m or less.
- an upper limit thereof is not particularly limited, but may be, for example, 500 ⁇ m or less.
- the first and second external electrodes 131 and 132 may be disposed to contact the first and second internal electrodes, respectively.
- the first and second external electrodes are in contact with the first and second internal electrodes, respectively, which may mean that the first internal electrode is connected to the first external electrode through a portion exposed to an outside of the body, and may mean that the second internal electrode is connected to the second external electrode through a portion exposed to an outside of the body.
- the first and second external electrodes 131 and 132 may be extended and disposed on a portion of four surfaces in contact with a surface in which the first and second internal electrodes are exposed.
- a method of forming the first and second external electrodes 131 and 132 need not be particularly limited.
- the first and second external electrodes 131 and 132 may be formed by dipping a body into a paste including a conductive metal and glass, or by transferring a dry film obtained by drying a metal paste on the body.
- the first and second external electrodes 131 and 132 may be one or more of silver (Ag), palladium (Pd), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), tin (Sn), tungsten (W), palladium (Pd), titanium (Ti), and alloys thereof.
- a plating layer may be formed on the first and second external electrodes 131 and 132 .
- the first and second internal electrodes may be disposed to be exposed to the third and fourth surfaces of the body, respectively.
- the first and second internal electrodes are exposed to the third and fourth surfaces of the body, which may mean that the first internal electrode and the second internal electrode are disposed to oppose each other in the X direction, and may mean that the first and second internal electrodes are disposed in the longitudinal direction.
- the first external electrode 131 and the second external electrode 132 may be disposed on the third surface and the fourth surface of the body, respectively, to be in contact with the first internal electrode 121 and the second internal electrode 122 .
- FIGS. 1 to 5 illustrate a multilayer ceramic capacitor according to the embodiment.
- a first internal electrode 121 and a second internal electrode 122 opposing each other in a X direction (longitudinal direction, second direction) may be disposed on the third surface S 3 and the fourth surface S 4 of the body 110 , respectively.
- the first external electrode 13 and the second external electrode 132 may be disposed on the third surface S 3 and the fourth surface S 4 of the body 110 , respectively, to be connected to the first internal electrode 121 and the second internal electrode 122 , respectively.
- the multilayer ceramic capacitor according to the present embodiment has the above structure, the multilayer ceramic capacitor has an appearance similar to that of a conventional MLCC.
- first and second internal electrodes may be disposed to be exposed to the fifth and sixth surfaces of the body.
- the first and second internal electrodes are exposed to the fifth and sixth surfaces of the body, which may mean that the first internal electrode and the second internal electrode are disposed to be opposed in a Y direction, and the first and internal electrode and the second internal electrode are disposed in a width direction.
- a first external electrode and a second external electrode may be disposed on the fifth and sixth surfaces of the body, respectively.
- the first external electrode and the second external electrode may be disposed on the fifth and sixth surfaces of the body to contact the first and second internal electrodes, respectively.
- FIGS. 6 to 8 illustrate a multilayer ceramic capacitor according to the embodiment.
- a first internal electrode 221 and a second internal electrode 222 opposing each other in a Y direction (width direction, third direction) may be disposed on the fifth surface S 5 and the sixth surface S 6 of the body 210 , respectively.
- the first external electrode 231 and the second external electrode 232 may be disposed on the fifth surface S 5 and the sixth surface S 6 of the body 210 , respectively, such that the first external electrode 231 and the second external electrode 232 may be connected to the first internal electrode 221 and the second internal electrode 222 , respectively, to each other.
- the multilayer ceramic capacitor according to the present embodiment has the above structure, the multilayer ceramic capacitor may have an appearance similar to that of a low inductance chip capacitor (LICC).
- LOC low inductance chip capacitor
- the multilayer ceramic capacitor of the present disclosure may further include a third external electrode, and the first internal electrode may be exposed to the third surface or the fourth surface of the body, and the second internal electrode may be disposed to be exposed to the fifth and sixth surfaces of the body.
- the first external electrode may be disposed on the third surface of the body
- the second external electrode may be disposed on the fourth surface of the body
- the third external electrode may be connected to the second internal electrode and may be disposed on the first surface, the second surface, the fifth surface, and the sixth surface of the body.
- FIGS. 9 to 14 illustrate a multilayer ceramic capacitor according to the present embodiment.
- the first internal electrode 321 may be exposed to the third surface S 3 or the fourth surface S 4 of the body 310
- the second internal electrode 322 may be disposed to be exposed to the fifth surface S 5 and the sixth surface S 6 of the body 310
- the first external electrode 331 and the second external electrode 332 may be respectively disposed on the third surface S 3 and the fourth surface S 4 of the body 310 to be connected to the first internal electrode 321 .
- the third external electrode 333 may be disposed on the first surface S 1 , the second surface S 2 , the third surface S 3 , and the sixth surface S 6 of the body 310 .
- the second internal electrode 322 disposed to be exposed to the fifth surface S 5 and the sixth surface S 6 of the body 310 may have a shape as shown in FIG. 13 , and for example, it may be a+shape.
- the third external electrode 333 may be disposed to connect the first surface S 1 , the second surface S 2 , the fifth surface S 5 , and the sixth surface S 6 of the body 310 , and as illustrated in FIG. 10 , may include a disconnection portion on the first surface S 1 and the second surface S 2 , or may not be disposed on the first surface S 1 and the second surface S 2 of the body 310 , but is not limited thereto.
- the multilayer ceramic capacitor may further include a third internal electrode.
- the first internal electrode may be disposed to be exposed to the third surface of the body and to be in contact with the first external electrode
- the third internal electrode may be disposed to be exposed to the fourth surface of the body and in contact with the second external electrode.
- the multilayer ceramic capacitor 310 may have a multilayer structure according to positions of the first internal electrode 321 and the third internal electrode 323 .
- the multilayer ceramic capacitor 310 according to the present embodiment may have a structure in which a plurality of the first internal electrode 321 and the second internal electrode 322 are alternately stacked, as illustrated in FIG. 12 , and a plurality of the second internal electrode 322 and the third internal electrode 323 are stacked, as illustrated in FIG. 13 on the stacked structure.
- a stacking number of the structure of FIG. 12 and a stacking number of the structure of FIG. 13 may be appropriately adjusted according to a purpose of use of the capacitor.
- the multilayer ceramic capacitor according to the present embodiment may have a three-terminal shaped capacitor, and one of the external electrodes may function as a ground electrode.
- a multilayer ceramic capacitor according to the present disclosure further includes a third external electrode.
- the first internal electrode may be disposed to be exposed to the third and fourth surfaces of the body, and the second internal electrode may be disposed to be exposed to the fifth and sixth surfaces of the body.
- the first external electrode may be disposed on the third surface of the body, the second external electrode may be disposed on the fourth surface of the body, and the third external electrode may be connected to the second internal electrode, and may be disposed on the first surface, the second surface, the fifth surface, and the sixth surface of the body.
- FIG. 15 is a cross-sectional view of a multilayer ceramic capacitor according to another embodiment.
- a first internal electrode 421 may be exposed to a third surface S 3 and a fourth surface S 4 of the body, and may be in contact with a first external electrode 431 and a second external electrode 432 .
- the second internal electrode 422 may be exposed to the fifth surface S 5 and sixth surface S 6 of the body, and may be in contact with the third external electrode 433 .
- the multilayer ceramic capacitor includes a third internal electrode and a third external electrode
- the thickness and a method of forming the third internal electrode and the third external electrode, and the like are the same as those of the first and second internal electrodes and the first and second external electrodes, the description thereof will be omitted.
- Table 1 below shows a scattering coefficient (S21-parameter) according to a ratio of a/b or a ratio of c/d.
- an influence of a fringing field applied to an end of the internal electrode can be minimized.
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Abstract
Description
- This application is the continuation application of U.S. patent application Ser. No. 16/782,616 filed on Feb. 5, 2020, which claims the benefit of priority to Korean Patent Application No. 10-2019-0086398 filed on Jul. 17, 2019 in the Korean Intellectual Property Office, the disclosures of which are incorporated herein by reference in their entirety.
- The present disclosure relates to a multilayer ceramic capacitor.
- A multilayer ceramic capacitor MLCC is one type of passive component, which controls an electrical signal on a circuit. A main role of such a multilayer ceramic capacitor is to accumulate charges in electrodes, to block direct current (DC) signals, and to pass alternating current (AC) signals. That is, such a multilayer ceramic capacitor can be seen to play a role in stabilizing an operation of an IC by bypassing and removing AC noise from a power line.
- The MLCC device may have characteristic deterioration due to a cross talk phenomenon as an electromagnetic distance of each layer is reduced.
- In particular, there is a problem in that the electric field characteristics are more likely to be weakened when a single integrated chip is used, as compared with a case of simply connecting the individual single components in parallel.
- An aspect of the present disclosure is to prevent deterioration of electric field characteristics due to cross talk.
- Another aspect of the present disclosure is to significantly reduce an influence of a fringing field applied to an internal electrode.
- Another aspect of the present disclosure is to reduce noise caused by unwanted electric field signals.
- According to an aspect of the present disclosure, a multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes having different sizes to each other, and having first and second surfaces opposing each other in a stacking direction, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first and second surfaces and connected to the third and fourth surfaces, and opposing each other; and first and second external electrodes, and when a margin of the first internal electrode in a longitudinal direction is b and a margin of the second internal electrode in a longitudinal direction is a, a ratio (a/b) of the margin (a) of the second internal electrode in the longitudinal direction to the margin (b) of the first internal electrode in the longitudinal direction may be 0.33 or more (where, a>0 and b>0).
- According to another embodiment of the present disclosure, a multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes having different sizes to each other, and having first and second surfaces opposing each other in a stacking direction, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first and second surfaces and connected to the third and fourth surfaces and opposing each other; and first and second external electrodes, and when a margin of the first internal electrode in a width direction is d and a margin of the second internal electrode in a width direction is c, a ratio (c/d) of the margin (c) of the second internal electrode in the width direction to the margin (d) of the first internal electrode in the width direction may be 0.33 or more (where, c>0 and d>0).
- The above and other aspects, features, and advantages of the present disclosure will be more clearly understood from the following detailed description, taken in conjunction with the accompanying drawings, in which:
-
FIG. 1 is a schematic perspective view of a multilayer ceramic capacitor according to an embodiment of the present disclosure; -
FIG. 2 is a schematic perspective view of a body of a multilayer ceramic capacitor ofFIG. 1 ; -
FIGS. 3 and 4 are plan views illustrating first and second internal electrodes respectively applied to the multilayer ceramic capacitor ofFIG. 1 ; -
FIG. 5 is a plan view of overlap of the first and second internal electrodes applied to the multilayer ceramic capacitor ofFIG. 1 ; -
FIG. 6 is a schematic perspective view of a multilayer ceramic capacitor according to another embodiment of the present disclosure; -
FIG. 7 is a schematic perspective view illustrating a body of the multilayer ceramic capacitor ofFIG. 6 ; -
FIG. 8 is a plan view overlapping first and second internal electrodes applied to the multilayer ceramic capacitor ofFIG. 6 ; -
FIG. 9 is a schematic perspective view of a multilayer ceramic capacitor according to another embodiment of the present disclosure; -
FIG. 10 is a schematic perspective view of a multilayer ceramic capacitor according to another embodiment of the present disclosure; -
FIG. 11 is a schematic perspective view illustrating a body of the multilayer ceramic capacitors ofFIGS. 9 and 10 ; -
FIG. 12 is a plan view overlapping first and second internal electrodes of an embodiment which may be applied to the multilayer ceramic capacitors ofFIGS. 9 and 10 ; -
FIG. 13 is a plan view overlapping first and second internal electrodes of another embodiment which may be applied to the multilayer ceramic capacitors ofFIGS. 9 and 10 ; -
FIG. 14 is a plan view illustrating a second internal electrode applied to the multilayer ceramic capacitors ofFIGS. 9 and 10 ; -
FIG. 15 is a plan view overlapping first and second internal electrodes of another embodiment which may be applied to the multilayer ceramic capacitors ofFIGS. 9 and 10 ; and -
FIG. 16 is a graph illustrating a cross talk level (S21-parameter) according to a ratio of margins of the multilayer ceramic capacitor in a longitudinal and/or a width direction according to a multilayer ceramic capacitor of the present disclosure. - Hereinafter, embodiments of the present disclosure will be described as follows with reference to the attached drawings. The present disclosure may, however, be exemplified in many different forms and should not be construed as being limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be through and complete, and will fully convey the scope of the disclosure to those skilled in the art. Accordingly, shapes and sizes of elements in the drawings may be exaggerated for clarity of description, and elements indicated by the same reference numeral are same elements in the drawings.
- Throughout the specification, when a component is referred to as “comprise” or “comprising,” it means that it may include other components as well, rather than excluding other components, unless specifically stated otherwise.
- Hereinafter, when a direction of a
capacitor body 110 is defined to clearly explain an embodiment in the present disclosure, X, Y and Z shown in the figure represent a longitudinal direction (second direction), a width direction (third direction), and a thickness direction (first direction) of thecapacitor body 110, respectively. Further, in the present embodiment, the Z direction may be conceptually the same as a stacking direction or a lamination direction in which dielectric layers are stacked and laminated. -
FIG. 1 is a schematic perspective view of a multilayer ceramic capacitor according to an embodiment of the present disclosure,FIGS. 3 and 4 are plan views illustrating first and second internal electrodes respectively, applied to the multilayer ceramic capacitor ofFIG. 1 , andFIG. 5 is a plan view overlapping the first and second internal electrodes applied to the multilayer ceramic capacitor ofFIG. 1 . - Referring to
FIGS. 1 to 5 , a multilayer ceramic capacitor according to an embodiment of the present disclosure includes abody 110 including adielectric layer 111 and first and secondinternal electrodes external electrodes - In this case, when a margin of the first
internal electrode 121 in a longitudinal direction is b, and a margin of the secondinternal electrode 122 in a longitudinal direction is a, a ratio (a/b) of the margin (a) of the secondinternal electrode 122 in the longitudinal direction to the margin (b) of the firstinternal electrode 121 in the longitudinal direction may be 0.33 or more (where, a>0 and b>0). - In the multilayer ceramic capacitor according to the present disclosure, when the ratio (a/b) of the margin in the longitudinal direction and/or the ratio (c/d) of the margin in the width direction described later falls within a predetermined range, cross talk that may occur due to a fringing effect may be prevented as described later, thereby preventing deterioration of electric field characteristics. The fringing effect refers to an effect caused by lines of electric force diverging and converging circularly at an electrode end of the parallel plate capacitor, which may cause cross talk when an unwanted electric field signal is transferred to another port. This phenomenon is likely to occur when a plurality of small chips are mounted in a narrow area, or when several components are merged into a single chip. The multilayer ceramic capacitor of the present disclosure may solve this problem. A size of a fringing field may be reduced by a plurality of internal electrodes as a compensation pattern to each other, thereby preventing deterioration of electric field characteristics and generation of noise.
- In the present specification, “margin” may mean a difference in a size between the dielectric layer and the internal electrode, and may mean a distance between an end of the internal electrode and an end of the dielectric layer. In addition, in the present specification, “margin in the longitudinal direction” may mean the shortest distance from the end of the internal electrode in the longitudinal direction (second direction, X direction) to the end of the dielectric layer in the longitudinal direction (second direction, X direction), and may mean the shortest distance to the third surface S3 or the fourth surface S4 of the above-described body. In the present specification, “margin in the width direction” may mean a distance from the end of the internal electrode in the width direction (third direction, Y direction) to the end of the dielectric layer in the width direction (third direction, Y direction), and may mean the shortest distance to the fifth surface S5 or the sixth surface S6 of the above-described body.
-
FIG. 12 is a cross-sectional view of a multilayer ceramic capacitor in which a firstinternal electrode 321 and a secondinternal electrode 322 are disposed. Referring toFIG. 12 , a margin (b) of the firstinternal electrode 321 in a longitudinal direction refers to the shortest distance from a position 1 to a position 3, and a margin (a) of the secondinternal electrode 322 in a longitudinal direction refers to the shortest distance from a position 2 to a position 3. In addition, a margin d of the firstinternal electrode 321 in a width direction refers to the shortest distance from a position w1 to a position w3, and a margin c of the secondinternal electrode 322 refers the shortest distance from a position w2 to a position w3. - The
capacitor body 110 is formed by laminating a plurality ofdielectric layers 111 in the Z direction and then firing the plurality ofdielectric layers 111, a boundary between the adjacentdielectric layers 111 of thecapacitor body 110 may be integrated, such that it may be difficult to confirm without using a scanning electron microscope (SEM). - The specific shape of the body is not particularly limited, but as illustrated, the body may be formed in a hexahedral shape or a similar shape. Due to shrinkage of the ceramic powder contained in the body during a firing process, the body may have a substantially hexahedral shape, although not a hexahedral shape with a completely straight line. In addition, the shape and dimensions of the
capacitor body 110 and the number of laminated layers of thedielectric layer 111 are not limited to those illustrated in the drawings of the present embodiment. - In the present embodiment, for convenience of explanation, both surfaces of the
capacitor body 110, opposing each other in the Z direction are defined as first and second surfaces S1 and S2, both surfaces connected to the first and second surfaces S1 and S2 and opposing each other in the X direction are defined as third and fourth surfaces S3 and S4, and both surfaces connected to the first and second surfaces S1 and S2 and connected to the third and fourth surfaces S3 and S4 and opposing each other in the Y direction are defined as fifth and sixth surfaces S5 and S6. - According to an embodiment of the present disclosure, a raw material for forming the
dielectric layer 111 is not particularly limited as long as sufficient electrostatic capacitance may be obtained therewith. For example, the raw material for forming the dielectric layer 511 may be a barium titanate (BaTiO3) material, a lead composite perovskite material, a strontium titanate (SrTiO3) material, or the like. - In addition, a material for forming the
dielectric layer 111, various ceramic additives, organic solvents, plasticizers, binders, dispersants, and the like, may be added to powders such as barium titanate (BaTiO3) according to the purpose of the present disclosure. - As the ceramic additive, for example, a transition metal oxide or a transition metal carbide, a rare earth element, magnesium (Mg), aluminum (Al), or the like, may be used.
- In an example of the present disclosure, the plurality of
internal electrodes dielectric layer 111 interposed therebetween. In this case, the first and secondinternal electrodes dielectric layer 111 disposed in the middle. - A material for forming the first and second
internal electrodes 131ad 122 is not particularly limited, and may be formed using a conductive paste including one or more materials, for example, of silver (Ag), palladium (Pd), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), tin (Sn), tungsten (W), palladium (Pd), titanium (Ti) and alloys thereof. As a printing method of the conductive paste, a screen printing method or a gravure printing method may be used, but the present disclosure is not limited thereto. - An average thickness of the first and second
internal electrodes - In an embodiment of the present disclosure, a ratio (a/b) of the margin (b) of the first
internal electrode 121 in the longitudinal direction and the margin (a) of the secondinternal electrode 122 may be 0.33 or more. When a ratio (a/b) of the margin (b) of the firstinternal electrode 121 in the longitudinal direction and the margin (a) of the secondinternal electrode 122 in the longitudinal direction is 0.33 or more, the second internal electrode sufficiently functions as a compensation pattern and cross talk may be reduced. When the ratio (a/b) is less than 0.33, a distance from the external electrode may be too close and a short may occur. - In an example, an upper limit of the ratio (a/b) of the margin (b) of the first
internal electrode 121 in the longitudinal direction and the margin (a) of the secondinternal electrode 122 in the longitudinal direction is not particularly limited, however, may be, for example, less than 1. When the ratio (a/b) is 1, the secondinternal electrode 122 may not function as a compensation pattern. The ratio (a/b) of the margin (b) of the first internal electrode in the longitudinal direction and the margin (a) of the second internal electrode in the longitudinal direction may be less than 1, e.g., 0.95 or less, 0.85 or less, 0.80 or less, 0.75 or less, 0.70 or less, or 0.67 or less. The ratio (a/b) of the margin (b) of the first internal electrode in the longitudinal direction and the margin (a) of the second internal electrode in the longitudinal direction satisfy the above range, thereby significantly reducing an impact of a fringing field applied to the end of the internal electrode, and significantly reducing cross talk. The ratio (a/b) of the margin (b) of the first internal electrode in the longitudinal direction to the margin (a) of the second internal electrode in the longitudinal direction satisfy the above range, thereby significantly reducing an impact of a fringing field applied to the end of the internal electrode, and significantly reducing cross talk. - In an embodiment according to the present disclosure, a difference (b-a) between the margin (b) of the first internal electrode in the longitudinal direction and the margin (a) of the second internal electrode in the longitudinal direction may be 10 μm or more. The difference (b-a) between the margin (b) of the first internal electrode in the longitudinal direction and the margin (a) of the second internal electrode in the longitudinal direction may mean a difference in the length of the margin (b) of the first internal electrode in the longitudinal direction and the length of the margin (a) of the second internal electrode in the longitudinal direction, and may mean a difference in lengths in the X direction. By making the difference (b-a) between the margin (b) of the first internal electrode in the longitudinal direction and the margin (a) of the second internal electrode in the
longitudinal direction 10 μm or more, noise of the multilayer ceramic capacitor may be effectively reduced. - The difference (b-a) of the margin (b) of the first internal electrode in the longitudinal direction and the margin (a) of the second internal electrode in the longitudinal direction may be, for example, 10 μm or more, 14 μm or more, 18 μm or more, 22 μm or more, 26 μm or more or 30 μm, and an upper limit is not particularly limited, for example, may be 500 μm or less. When the difference (b-a) of the margin (b) of the first internal electrode in the longitudinal direction and the margin (a) of the second internal electrode in the longitudinal direction satisfies the above-described range, a noise removing effect may be maximized.
- In another embodiment of the present disclosure, when a margin of the first internal electrode in the width direction is d and a margin of the second internal electrode in the width direction is c, a ratio (c/d) of the margin (d) of the first internal electrode in the width direction and the margin (c) of the second internal electrode in the width direction may be 0.33 or more (where, c>0 and d>0). Cross talk may be reduced in a range in which the ratio (c/d) of the margin (d) of the first internal electrode in the width direction and the margin (c) of the second internal electrode in the width direction is 0.33 or more. When the ratio (c/d) is less than 0.33, a distance between the external electrodes may be excessively close, and a short may occur.
- In an example, an upper limit of the ratio (c/d) of the margin (d) of the first internal electrode in the width direction and the margin (c) of the second internal electrode in the width direction is not particularly limited, but may be, for example, less than 1. When the ratio (c/d) is 1, the second internal electrode may not function as a compensation pattern. When the ratio (c/d) of the margin (d) of the first internal electrode in the width direction and the margin (c) of the second internal electrode in the width direction may be less than 1, 0.95 or less, 0.85 or less, 0.80 or less, 0.75 or less, 0.70 or less, or 0.67 or less. The ratio (c/d) of the margin (d) of the first internal electrode in the width direction and the margin (c) of the second internal electrode in the width direction satisfies the above range, such that an impact of a fringing field applied to the end of the internal electrode may be significantly reduced, and cross talk may be significantly reduced.
- In an embodiment according to the present disclosure, a difference (d-c) between the margin d of the first internal electrode in the width direction and the margin c of the second internal electrode in the width direction may be 10 μm or more. The difference (d-c) between the margin (d) of the first internal electrode in the width direction and the margin (c) of the second internal electrode in the width direction may mean the difference between the width of the margin (d) of the first internal electrode in the width direction and the margin (c) of the second internal electrode in the width direction, and may mean the difference of the width in the Y direction. By making the difference (d-c) between the margin (d) of the first internal electrode in the width direction and the margin (c) of the second internal electrode in the width direction to be 10 μm or more, the noise of the multilayer ceramic capacitor may be effectively reduced.
- The difference (d-c) between the margin (d) of the first internal electrode in the width direction and the margin (c) of the second internal electrode in the width direction may be, for example, 10 μm or more, 14 μm or more, 18 μm or more, 22 μm or more, 26 μm or more or 30 μm or more, and an upper limit thereof is not particularly limited, but may be, for example, 500 μm or less. When the difference (d-c) between the margin (d) of the first internal electrode in the width direction and the margin (c) of the second internal electrode in the width direction satisfies the above-described range, a noise removing effect may be maximized.
- The first and second
external electrodes external electrodes - A method of forming the first and second
external electrodes external electrodes - In an embodiment of the present disclosure, the first and second
external electrodes external electrodes - In an embodiment of the present disclosure, the first and second internal electrodes may be disposed to be exposed to the third and fourth surfaces of the body, respectively. The first and second internal electrodes are exposed to the third and fourth surfaces of the body, which may mean that the first internal electrode and the second internal electrode are disposed to oppose each other in the X direction, and may mean that the first and second internal electrodes are disposed in the longitudinal direction. In this case, the first
external electrode 131 and the secondexternal electrode 132 may be disposed on the third surface and the fourth surface of the body, respectively, to be in contact with the firstinternal electrode 121 and the secondinternal electrode 122. -
FIGS. 1 to 5 illustrate a multilayer ceramic capacitor according to the embodiment. Referring toFIGS. 1 to 5 , in a multilayerceramic capacitor 100 according to the present embodiment, a firstinternal electrode 121 and a secondinternal electrode 122, opposing each other in a X direction (longitudinal direction, second direction) may be disposed on the third surface S3 and the fourth surface S4 of thebody 110, respectively. In addition, the first external electrode 13 and the secondexternal electrode 132 may be disposed on the third surface S3 and the fourth surface S4 of thebody 110, respectively, to be connected to the firstinternal electrode 121 and the secondinternal electrode 122, respectively. When the multilayer ceramic capacitor according to the present embodiment has the above structure, the multilayer ceramic capacitor has an appearance similar to that of a conventional MLCC. - In another embodiment of the present disclosure, first and second internal electrodes may be disposed to be exposed to the fifth and sixth surfaces of the body. The first and second internal electrodes are exposed to the fifth and sixth surfaces of the body, which may mean that the first internal electrode and the second internal electrode are disposed to be opposed in a Y direction, and the first and internal electrode and the second internal electrode are disposed in a width direction. In this case, a first external electrode and a second external electrode may be disposed on the fifth and sixth surfaces of the body, respectively. The first external electrode and the second external electrode may be disposed on the fifth and sixth surfaces of the body to contact the first and second internal electrodes, respectively.
-
FIGS. 6 to 8 illustrate a multilayer ceramic capacitor according to the embodiment. Referring toFIGS. 6 to 8 , in a multilayerceramic capacitor 200 according to the present embodiment, a firstinternal electrode 221 and a secondinternal electrode 222, opposing each other in a Y direction (width direction, third direction) may be disposed on the fifth surface S5 and the sixth surface S6 of thebody 210, respectively. In addition, the firstexternal electrode 231 and the secondexternal electrode 232 may be disposed on the fifth surface S5 and the sixth surface S6 of thebody 210, respectively, such that the firstexternal electrode 231 and the secondexternal electrode 232 may be connected to the firstinternal electrode 221 and the secondinternal electrode 222, respectively, to each other. When the multilayer ceramic capacitor according to the present embodiment has the above structure, the multilayer ceramic capacitor may have an appearance similar to that of a low inductance chip capacitor (LICC). - In another embodiment of the present disclosure, the multilayer ceramic capacitor of the present disclosure may further include a third external electrode, and the first internal electrode may be exposed to the third surface or the fourth surface of the body, and the second internal electrode may be disposed to be exposed to the fifth and sixth surfaces of the body. In this case, the first external electrode may be disposed on the third surface of the body, the second external electrode may be disposed on the fourth surface of the body, and the third external electrode may be connected to the second internal electrode and may be disposed on the first surface, the second surface, the fifth surface, and the sixth surface of the body.
-
FIGS. 9 to 14 illustrate a multilayer ceramic capacitor according to the present embodiment. Referring toFIGS. 9 to 13 , in a multilayerceramic capacitor 300 according to the present embodiment, the firstinternal electrode 321 may be exposed to the third surface S3 or the fourth surface S4 of thebody 310, and the secondinternal electrode 322 may be disposed to be exposed to the fifth surface S5 and the sixth surface S6 of thebody 310. In addition, the firstexternal electrode 331 and the secondexternal electrode 332 may be respectively disposed on the third surface S3 and the fourth surface S4 of thebody 310 to be connected to the firstinternal electrode 321. The thirdexternal electrode 333 may be disposed on the first surface S1, the second surface S2, the third surface S3, and the sixth surface S6 of thebody 310. In this case, the secondinternal electrode 322 disposed to be exposed to the fifth surface S5 and the sixth surface S6 of thebody 310 may have a shape as shown inFIG. 13 , and for example, it may be a+shape. - As illustrated in
FIG. 9 , the thirdexternal electrode 333 may be disposed to connect the first surface S1, the second surface S2, the fifth surface S5, and the sixth surface S6 of thebody 310, and as illustrated inFIG. 10 , may include a disconnection portion on the first surface S1 and the second surface S2, or may not be disposed on the first surface S1 and the second surface S2 of thebody 310, but is not limited thereto. - In an example, the multilayer ceramic capacitor may further include a third internal electrode. In this case, the first internal electrode may be disposed to be exposed to the third surface of the body and to be in contact with the first external electrode, and the third internal electrode may be disposed to be exposed to the fourth surface of the body and in contact with the second external electrode.
- Referring to
FIGS. 9 to 14 , in the above embodiment, the multilayerceramic capacitor 310 may have a multilayer structure according to positions of the firstinternal electrode 321 and the thirdinternal electrode 323. For example, the multilayerceramic capacitor 310 according to the present embodiment may have a structure in which a plurality of the firstinternal electrode 321 and the secondinternal electrode 322 are alternately stacked, as illustrated inFIG. 12 , and a plurality of the secondinternal electrode 322 and the thirdinternal electrode 323 are stacked, as illustrated inFIG. 13 on the stacked structure. In this case, a stacking number of the structure ofFIG. 12 and a stacking number of the structure ofFIG. 13 may be appropriately adjusted according to a purpose of use of the capacitor. - In the above embodiment, although a stacked structure of the first
internal electrode 321 ofFIG. 12 is disposed below and a stacked structure of the thirdinternal electrode 323 ofFIG. 13 is disposed above, on the contrary, a structure in which a stacked structure of the firstinternal electrode 321 ofFIG. 12 is disposed above and a stacked structure of the thirdinternal electrode 323 ofFIG. 13 is disposed below will naturally be included in the above example. When the multilayer ceramic capacitor according to the present embodiment has the above structure, the multilayer ceramic capacitor may have a three-terminal shaped capacitor, and one of the external electrodes may function as a ground electrode. - In another embodiment of the present disclosure, a multilayer ceramic capacitor according to the present disclosure further includes a third external electrode. The first internal electrode may be disposed to be exposed to the third and fourth surfaces of the body, and the second internal electrode may be disposed to be exposed to the fifth and sixth surfaces of the body. In this case, the first external electrode may be disposed on the third surface of the body, the second external electrode may be disposed on the fourth surface of the body, and the third external electrode may be connected to the second internal electrode, and may be disposed on the first surface, the second surface, the fifth surface, and the sixth surface of the body.
-
FIG. 15 is a cross-sectional view of a multilayer ceramic capacitor according to another embodiment. Referring toFIG. 15 , a firstinternal electrode 421 may be exposed to a third surface S3 and a fourth surface S4 of the body, and may be in contact with a firstexternal electrode 431 and a secondexternal electrode 432. In addition, the second internal electrode 422 may be exposed to the fifth surface S5 and sixth surface S6 of the body, and may be in contact with the thirdexternal electrode 433. - When the multilayer ceramic capacitor includes a third internal electrode and a third external electrode, since the thickness and a method of forming the third internal electrode and the third external electrode, and the like, are the same as those of the first and second internal electrodes and the first and second external electrodes, the description thereof will be omitted.
- Table 1 below shows a scattering coefficient (S21-parameter) according to a ratio of a/b or a ratio of c/d.
-
TABLE 1 a/b or c/ d 1 0.917 0.833 0.667 0.5 0.333 S21[dB]@10 −41.66 −45.58 −49.41 −59.4 −67.85 −78.39 MHz Reduction rate 0% 9% 19% 43% 63% 88% - Referring to Table 1, when the ratio of (a/b or c/d) is 1, it can be confirmed that the same result is obtained as not applying a compensation pattern, and as the ratio (a/b or c/d) are lowered, a reduction rate is increased. In particular, it can be confirmed that a sharp numerical change appears based on 0.667. In addition, it can be confirmed that a very high reduction rate appears when the ratio (a/b or c/d) is 0.33. This is further illustrated in
FIG. 16 , which shows a graph illustrating a cross talk level (S21-parameter) according to a ratio of margins of the multilayer ceramic capacitor in a longitudinal and/or a width direction according to a multilayer ceramic capacitor of the present disclosure. - Through the above Table 1, in the multilayer ceramic capacitor according to the present disclosure, it can be confirmed that an influence of the fringing field applied to the end of the internal electrode may be significantly reduced and deterioration of electric field characteristics due to cross talk may be prevented, and noise caused by the unwanted electric field signals may be reduced, by using the second internal electrode as a compensation pattern.
- As set forth, according to an embodiment of the present disclosure, it is possible to prevent deterioration of an electric field characteristic due to cross talk.
- According to another embodiment of the present disclosure, an influence of a fringing field applied to an end of the internal electrode can be minimized.
- According to another embodiment of the present disclosure, it is possible to provide a multilayer ceramic capacitor capable of reducing noised caused by unwanted electric field signals.
- While the example embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations could be made without departing from the scope of the present invention as defined by the appended claims.
Claims (21)
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US17/953,735 US20230036133A1 (en) | 2019-07-17 | 2022-09-27 | Multi-layered ceramic capacitor |
US18/519,368 US20240096559A1 (en) | 2019-07-17 | 2023-11-27 | Multi-layered ceramic capacitor |
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KR1020190086398A KR20190116135A (en) | 2019-07-17 | 2019-07-17 | Multi-layered ceramic capacitor |
US16/782,616 US11495409B2 (en) | 2019-07-17 | 2020-02-05 | Multi-layered ceramic capacitor |
US17/953,735 US20230036133A1 (en) | 2019-07-17 | 2022-09-27 | Multi-layered ceramic capacitor |
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US17/953,735 Abandoned US20230036133A1 (en) | 2019-07-17 | 2022-09-27 | Multi-layered ceramic capacitor |
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JP (2) | JP2021019183A (en) |
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US11631541B2 (en) * | 2020-03-24 | 2023-04-18 | Tdk Corporation | Multilayer capacitor |
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JPS5875827A (en) * | 1981-10-30 | 1983-05-07 | 富士通株式会社 | Internal electrode structure for multilayer ceramic condenser |
JPH0342669Y2 (en) * | 1985-03-28 | 1991-09-06 | ||
JPH03207273A (en) * | 1990-01-09 | 1991-09-10 | Daikin Ind Ltd | Controller for modulating pulse width of inverter |
JPH0653075A (en) * | 1992-07-27 | 1994-02-25 | Mitsubishi Materials Corp | Laminated ceramic capacitor for balanced line |
JPH08250369A (en) * | 1995-03-14 | 1996-09-27 | Mitsubishi Materials Corp | Multilayered ceramic capacitor |
JP3671703B2 (en) * | 1998-11-16 | 2005-07-13 | 松下電器産業株式会社 | Multilayer ceramic capacitor |
JP2012156315A (en) | 2011-01-26 | 2012-08-16 | Murata Mfg Co Ltd | Multilayer ceramic electronic component |
JP2012190874A (en) | 2011-03-09 | 2012-10-04 | Taiyo Yuden Co Ltd | Multilayer ceramic capacitor and manufacturing method therefor |
JP5278476B2 (en) | 2011-03-30 | 2013-09-04 | Tdk株式会社 | Multilayer capacitor |
KR101832490B1 (en) | 2011-05-31 | 2018-02-27 | 삼성전기주식회사 | Multilayer ceramic capacitor |
KR101548771B1 (en) | 2011-06-23 | 2015-09-01 | 삼성전기주식회사 | Chip type laminated capacitor |
JP2013115425A (en) * | 2011-11-30 | 2013-06-10 | Samsung Electro-Mechanics Co Ltd | Multilayer ceramic electronic component and manufacturing method for the same |
JP2013165211A (en) | 2012-02-13 | 2013-08-22 | Murata Mfg Co Ltd | Method of manufacturing laminated ceramic capacitor and laminated ceramic capacitor |
JP2014027255A (en) * | 2012-06-22 | 2014-02-06 | Murata Mfg Co Ltd | Ceramic electronic component and ceramic electronic device |
KR101462753B1 (en) | 2013-01-24 | 2014-11-17 | 삼성전기주식회사 | Laminated ceramic electronic parts and fabrication method thereof |
KR101548797B1 (en) | 2013-04-08 | 2015-08-31 | 삼성전기주식회사 | A multilayer ceramic capacitor and a method for manufactuaring the same |
KR20140038914A (en) | 2013-10-29 | 2014-03-31 | 삼성전기주식회사 | Multi-layered ceramic capacitor and board for mounting the same |
US9396879B2 (en) | 2013-10-29 | 2016-07-19 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor and board having the same |
JP6525669B2 (en) * | 2015-03-27 | 2019-06-05 | Tdk株式会社 | Multilayer ceramic electronic components |
US10468185B2 (en) * | 2017-06-02 | 2019-11-05 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor and board having the same mounted thereon |
JP7040534B2 (en) * | 2017-12-29 | 2022-03-23 | 株式会社村田製作所 | Multilayer ceramic capacitors, monolithic ceramic capacitor mounting structures and electronic component series |
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US20210020374A1 (en) | 2021-01-21 |
US20240096559A1 (en) | 2024-03-21 |
CN115602446A (en) | 2023-01-13 |
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CN112242244A (en) | 2021-01-19 |
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