KR101462753B1 - Laminated ceramic electronic parts and fabrication method thereof - Google Patents

Abstract

The present invention relates to a multilayer ceramic electronic device and a method of manufacturing the same, and in particular, to a ceramic body including a dielectric layer. And first and second internal electrodes arranged to face each other with the dielectric layer interposed therebetween in the ceramic body and cross-laminated so as to have a difference in printing width in the width direction, wherein the first and second internal electrodes And a minimum width of the first and second internal electrodes is defined as w, a width difference ratio (D) between the maximum width and the minimum width expressed by the following formula is 20 to 80% part,
[Expression] D = (Ww) / W x 100
.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a laminated ceramic electronic component and a manufacturing method thereof,

The present invention relates to a large-capacity multilayer ceramic electronic component having improved reliability by improving the step difference influence and a method of manufacturing the same.

2. Description of the Related Art In recent years, with the trend toward miniaturization of electronic products, multilayer ceramic electronic components are also required to be miniaturized and increased in capacity.

Accordingly, various attempts have been made to reduce the thickness and thickness of the dielectric and internal electrodes, and multilayer ceramic electronic components in which the thickness of the dielectric layer is thinned and the number of layers are increased have been produced in recent years.

In order to realize such large capacity, the step difference due to the thickness of the internal electrode coating increases as the dielectric layer thickness and the internal electrode layer thickness become thinner.

As the step difference value becomes larger, the density of the stepped portion of the internal electrode is lowered and cracks may occur.

Also, as the internal electrodes are stretched to fill the empty stepped portions, the breakage of the internal electrodes is increased and the reliability may be lowered.

On the other hand, as the thickness of the internal electrode layer becomes thinner, the thickness of the internal electrode layer becomes non-uniform, and the electrode layer is maintained in a continuous thickness, and is not connected.

Also, as the electrode is broken, the average thickness of the dielectric layer is the same, but a portion where the dielectric layer is thickened or thinned is generated, thereby deteriorating the insulation characteristic at the portion where the dielectric layer is thinned.

Korean Laid-Open Publication No. 2011-0074259

The present invention relates to a large-capacity multilayer ceramic electronic component having improved reliability by improving the step difference influence and a method of manufacturing the same.

One embodiment of the present invention relates to a ceramic body including a dielectric layer; And first and second internal electrodes arranged to face each other with the dielectric layer interposed therebetween in the ceramic body and cross-laminated so as to have a difference in printing width in the width direction, wherein the first and second internal electrodes And a minimum width of the first and second internal electrodes is defined as w, a width difference ratio (D) between the maximum width and the minimum width expressed by the following formula is 20 to 80% part,

[Expression] D = (W-w) / W x 100

.

The difference in print width between the first internal electrode and the second internal electrode may be 100 m or less.

The average thickness of the dielectric layer may be 0.6 mu m or less.

The average thickness of the first and second internal electrodes may be 0.6 탆 or less.

The width difference ratio between the first internal electrode and the second internal electrode may be 20 to 40% when the printing width of the first and second internal electrodes is 200 to 250 占 퐉.

The width difference ratio between the first internal electrode and the second internal electrode may be 40 to 70% when the printing width of the first and second internal electrodes is 300 to 400 μm.

The width difference ratio between the first internal electrode and the second internal electrode may be 20 to 80% when the printing width of the first and second internal electrodes is 500 μm or more.

In addition, the connectivity of the first or second internal electrode may be 90% or more.

Another embodiment of the present invention is a method for manufacturing a ceramic green sheet, comprising: preparing a ceramic green sheet using a slurry including ceramic powder; Forming an internal electrode pattern on the ceramic green sheet using a conductive metal paste; And ceramic green sheets laminated and sintered so as to face each other with the dielectric layer and the dielectric layer interposed therebetween, and first and second internal electrodes cross-laminated in such a manner that the printing widths are different from each other in the width direction, Wherein a maximum width of the first and second internal electrodes is defined as W and a minimum width of the first and second internal electrodes is defined as w, the maximum width and the minimum width (D) of 20 to 80% in the width direction of the multilayer ceramic electronic component,

[Expression] D = (W-w) / W x 100

.

The difference in print width between the first internal electrode and the second internal electrode may be 100 m or less.

The average thickness of the dielectric layer may be 0.6 mu m or less.

The average thickness of the first and second internal electrodes may be 0.6 탆 or less.

The width difference ratio between the first internal electrode and the second internal electrode may be 20 to 40% when the printing width of the first and second internal electrodes is 200 to 250 占 퐉.

The width difference ratio between the first internal electrode and the second internal electrode may be 40 to 70% when the printing width of the first and second internal electrodes is 300 to 400 μm.

The width difference ratio between the first internal electrode and the second internal electrode may be 20 to 80% when the printing width of the first and second internal electrodes is 500 μm or more.

In addition, the connectivity of the first or second internal electrode may be 90% or more.

The number of layers of the ceramic green sheets may be 400 or more.

The conductive metal paste may include 40 to 50 parts by weight of a metal powder, and the metal may be one selected from the group consisting of Ni, Cu, Pd, and Pd-Ag alloy Or more.

According to the present invention, it is possible to realize a large-capacity multilayer ceramic electronic device having a reduced capacity of capacitive capacitance and reduced influence due to a step difference, thereby improving crack resistance and excellent withstand voltage characteristics and reliability.

1 is a perspective view schematically showing a multilayer ceramic capacitor according to an embodiment of the present invention.
2 is a cross-sectional view taken along line BB 'of FIG. 1 according to an embodiment of the present invention.
3 is a cross-sectional view taken along line BB 'of Fig. 1 according to another embodiment of the present invention.
4 is a manufacturing process diagram of a multilayer ceramic capacitor according to another embodiment of the present invention.
5 is a graph showing the thickness according to the printing width of the internal electrode.
6 is a SEM (Scanning Electron Microscope) photograph showing the connectivity of the internal electrodes of one embodiment and the comparative example of the present invention.
7 is a graph showing a percentage of the capacitance of the multilayer ceramic capacitor due to the difference in the printing width between the first internal electrode and the second internal electrode.

The embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art. Accordingly, the shapes and sizes of the elements in the drawings may be exaggerated for clarity of description, and the elements denoted by the same reference numerals in the drawings are the same elements.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

1 is a perspective view schematically showing a multilayer ceramic capacitor according to an embodiment of the present invention.

2 is a cross-sectional view taken along the line B-B 'in Fig. 1 according to an embodiment of the present invention.

3 is a cross-sectional view taken along line BB 'of Fig. 1 according to another embodiment of the present invention.

1 and 2, a multilayer ceramic electronic device according to an embodiment of the present invention includes a ceramic body 10 including a dielectric layer 1; And first and second internal electrodes (21, 22) arranged so as to face each other with the dielectric layer (1) therebetween in the ceramic body (10) and cross- The maximum width of the first and second internal electrodes 21 and 22 is defined as W and the minimum width of the first and second internal electrodes 21 and 22 is defined as w, The width difference D between the maximum width and the minimum width may be 20 to 80%

[Expression] D = (Ww) / W x 100.

Hereinafter, a multilayer ceramic electronic device according to an embodiment of the present invention will be described, but a laminated ceramic capacitor will be described, but the present invention is not limited thereto.

The ceramic body 10 is not particularly limited and may have, for example, a hexahedral shape.

In the multilayer ceramic capacitor of the present embodiment, the "longitudinal direction" is defined as a "L" direction, a "width direction" as a "W" direction, and a "thickness direction" as a "T" direction in FIG. Here, the 'thickness direction' can be used in the same concept as the stacking direction of the dielectric layers, that is, the 'lamination direction'.

A multilayer ceramic capacitor according to an embodiment of the present invention includes a ceramic body 10 including a dielectric layer 1; And first and second internal electrodes (21, 22) arranged so as to face each other with the dielectric layer (1) therebetween in the ceramic body (10) and cross- .

The first and second inner electrodes 21 and 22 are not particularly limited and may be made of a material selected from the group consisting of noble metal such as palladium (Pd), palladium-silver (Pd-Ag) alloy, ). ≪ / RTI >

The first and second external electrodes 31 and 32 may be formed on the outer side of the ceramic body 10 and may be electrically connected to the first and second internal electrodes 21 and 22. [ have.

The first and second external electrodes 31 and 32 may be formed of a conductive material having the same material as that of the internal electrode, but the present invention is not limited thereto. For example, copper (Cu), silver (Ag) ) Or the like.

The first and second external electrodes 31 and 32 may be formed by applying a conductive paste prepared by adding glass frit to the metal powder and then firing the paste.

According to an embodiment of the present invention, the first and second internal electrodes 21 and 22 may be cross-laminated in the ceramic body 10 such that the width of the ceramic body 10 varies in the width direction.

By laminating the first and second internal electrodes 21 and 22 such that the printing widths are different from each other in the width W direction, the influence of the step difference can be improved by increasing the distance between the internal electrodes that affect the step .

That is, in order to realize a large capacity of the multilayer ceramic capacitor, the step value due to the thickness of the internal electrode coating increases as the dielectric layer thickness and the internal electrode layer thickness become thinner, and as the step value becomes larger, the density of the internal electrode stepped portion decreases, Failure may occur.

Also, as the internal electrodes are stretched to fill the empty stepped portions, the breakage of the internal electrodes is increased and the reliability may be lowered.

According to an embodiment of the present invention, the above-described problems can be solved by cross-laminating the first and second internal electrodes 21 and 22 so that the printing widths are different in the width W direction, .

According to an embodiment of the present invention, when the maximum width of the first and second internal electrodes 21 and 22 is defined as W and the minimum width of the first and second internal electrodes 21 and 22 is defined as w, (D = (Ww) / W x 100) between the maximum width and the minimum width expressed by the following formula may be 20 to 80%.

The width difference D between the maximum width and the minimum width of the first internal electrode 21 and the second internal electrode 22 can be defined as a percentage of the difference between the maximum width and the minimum width.

That is, if the maximum width is W and the minimum width is w, the width difference ratio (D) = (Ww) / W × 100 can be defined.

The width difference D between the first internal electrode 21 and the second internal electrode 22 may be varied in accordance with the object of the present invention to minimize the influence of the step difference. For example, 20 to 80% Lt; / RTI >

The electrode having a larger print width among the first and second internal electrodes 21 and 22 may be the first electrode or the second electrode.

The case where the electrode having a larger print width is the first electrode is shown in Fig. 2, and the case where the electrode with the wider print width is the second electrode is shown in Fig.

Referring to FIG. 2, in the internal electrode of the multilayer ceramic capacitor according to the embodiment of the present invention, the printing width of the first internal electrode 21 may be wider. Referring to FIG. 3, The inner electrode of the multilayer ceramic capacitor according to the shape may have a wider print width of the second internal electrode 22. [

Specifically, when the printing width of the first and second internal electrodes 21 and 22 is 200 to 250 μm, the first internal electrode 21 and the second internal electrode 22 may have the same width, May be between 20 and 40%.

As described above, when the width difference ratio is 20 to 40%, it is possible to realize a multilayer ceramic capacitor having an improved withstand voltage and an excellent reliability by reducing the influence of the step and reducing the crack defect while maintaining the electrostatic capacity. have.

When the printing width of the electrode having a larger printing width is 200 to 250 μm, if the width difference ratio is less than 20%, there is little effect of reducing the step difference, which may cause a problem of occurrence of crack failure.

In addition, when the printing width of the electrode having a larger printing width is 200 to 250 μm, if the width difference ratio exceeds 40%, a problem of capacitance reduction may occur.

When the printing width of the first and second internal electrodes 21 and 22 is 300 to 400 μm, the width of the first internal electrode 21 and the second internal electrode 22 The width difference ratio may be 40 to 70%.

As described above, when the width difference ratio is 40 to 70%, it is possible to realize a multilayer ceramic capacitor having an improved withstand voltage and excellent reliability by reducing the influence of the step difference while maintaining the electrostatic capacity, have.

When the printing width of the electrode having a wider printing width is 300 to 400 μm, when the width difference ratio is less than 40%, there is little effect of reducing the step difference, which may cause a problem of occurrence of a crack defect.

In addition, when the width of the width of the electrodes is 300 to 400 μm, if the width difference ratio exceeds 70%, a problem of capacitance reduction may occur.

When the printing width of the first and second inner electrodes 21 and 22 is larger than 500 μm, the difference in width between the first inner electrode 21 and the second inner electrode 22 is 20 to 80%.

As described above, when the width difference ratio is 20 to 80%, it is possible to realize a multilayer ceramic capacitor having an improved withstand voltage and an excellent reliability by reducing the influence of the steps and reducing the crack defect while maintaining the electrostatic capacity. have.

If the printing width of the electrode having a wider printing width is 500 μm or more and the width difference ratio is less than 20%, there is little effect of reducing the step difference, which may cause a problem of occurrence of a crack defect.

In addition, when the printing width of the electrode having a larger printing width is 500 탆 or more, when the width difference ratio exceeds 80%, a problem of capacitance reduction may occur.

The difference in printing width between the first internal electrode 21 and the second internal electrode 22 is not particularly limited, but may be, for example, 100 μm or less.

When the difference in the printing width is 100 μm or less, it is possible to realize not only the effect of reducing the crack defect, the excellent withstand voltage characteristic and the reliability but also the capacitance of the multilayer ceramic capacitor.

That is, when the difference in the print width exceeds 100 μm, the capacitance of the multilayer ceramic capacitor may be lowered by 50% or more.

Therefore, in the multilayer ceramic capacitor according to the embodiment of the present invention, the difference in print width between the first internal electrode 21 and the second internal electrode 22 may be 100 μm or less.

According to one embodiment of the present invention, the average thickness of the dielectric layer 1 may be 0.6 m or less.

In one embodiment of the present invention, the thickness of the dielectric layer 1 may mean the average thickness of the dielectric layer 1 disposed between the internal electrode layers 21 and 22.

The average thickness of the dielectric layer 1 can be measured by scanning an image with a scanning electron microscope (SEM) on the cross section in the width direction of the ceramic body 10 as shown in FIG.

For example, as shown in FIG. 2, the width and the width direction (WT) section cut at the center in the length L direction of the ceramic body 10 are extracted from an image obtained by scanning with a scanning electron microscope (SEM) It is possible to measure the average value of any dielectric layer by measuring its thickness at 30 points equally spaced in the width direction.

The 30 equally spaced points may be measured at a capacitance forming part, which means a region where the first and second internal electrodes 21 and 22 overlap.

Further, when the average value is measured by extending the average value measurement to at least 10 dielectric layers, the average thickness of the dielectric layer can be further generalized.

If the average thickness of the dielectric layer 1 is 0.6 μm or less, the connectivity of the first and second internal electrodes 21 and 22 may be reduced. However, according to an embodiment of the present invention, By cross-lamination so that the widths are different from each other, the influence of the step difference can be minimized and the connectivity of the internal electrode can be increased.

When the average thickness of the dielectric layer 1 is 0.6 탆 or less, the electrodes are cut off and the average thickness of the dielectric layers is the same, but a part where the dielectric layers are thickened or thinned is generated, so that the dielectric strength characteristics are lowered at the portions where the dielectric layers are thinned, However, according to the embodiment of the present invention, the withstand voltage characteristic can be improved by increasing the connectivity of the internal electrode.

On the other hand, when the average thickness of the dielectric layer 1 is more than 0.6 탆, the average thickness of the dielectric layer is too thick, so that there is no problem in the withstand voltage characteristics and reliability as described above.

The average thickness after firing of the first and second internal electrodes 21 and 22 is not particularly limited as long as it can form an electrostatic capacity and may be, for example, 0.6 m or less.

In the multilayer ceramic electronic component according to an embodiment of the present invention, the connectivity of the first or second internal electrodes 21 and 22 may be 90% or more.

The interconnectivity of the internal electrodes may be defined as the length of a portion of the first or second internal electrode 21 or 22 where the actual electrode is formed.

For example, the connectivity of the internal electrodes can be measured by scanning an image with a scanning electron microscope (SEM) on the cross section in the width direction of the laminate body 10 as shown in FIG.

Specifically, as shown in FIG. 2, the width and the width direction (WT) cross section cut at the central portion in the length L direction of the laminated body 10 are scanned by scanning electron microscope (SEM, Scanning Electron Microscope) Can be obtained by measuring the total length of the portion where the actual internal electrode is formed, with respect to the total length of the internal electrode cross-section.

The measurement of the connectivity between the first and second internal electrodes can be performed in a capacitance forming unit, which means a region where the first and second internal electrodes 21 and 22 overlap.

Further, the connectivity of the internal electrode layers can be further generalized by measuring the connectivity of the internal electrode layers by extending the lengths of the internal electrode layers to at least 10 internal electrode layers in the central portion of the length and the LT direction.

Specifically, if the total electrode length measured at one point of the first and second internal electrodes 21 and 22 is defined as A and the length of the portion where the actual electrode is formed is defined as c1, c2, c3, and cn, 1 and the second internal electrode can be expressed by (c1 + c2 + c3 + · + cn) / A.

Also, this means the application ratio of the internal electrode, which can also be defined as the ratio of the area of the internal electrode to the total area of the internal electrode at any one point.

The connection of the first or second internal electrodes 21 and 22 may be variously implemented according to the methods described later. In the multilayer ceramic electronic component according to an embodiment of the present invention, Connectivity is over 90%.

As a method for realizing the connectivity of the first or second internal electrodes 21 and 22 by more than 90%, there is a method of changing the particle size of the metal powder in the conductive paste forming the internal electrode or controlling the amount of the organic and ceramic added And the like.

In addition, it is possible to control the electrode connection property by controlling the heating rate and the firing atmosphere in the firing process.

According to one embodiment of the present invention, in order to realize the connectivity of the internal electrode layers, the first and second internal electrodes of the capacitance forming portion are cross-laminated so that the printing widths are different in the width W direction, You can use a method that minimizes the impact.

According to one embodiment of the present invention, by realizing the connectivity of the first or second internal electrodes 21 and 22 at 90% or more, it is possible to manufacture a high capacity multilayer ceramic capacitor having increased capacitance and excellent reliability.

4 is a manufacturing process diagram of a multilayer ceramic capacitor according to another embodiment of the present invention.

Referring to FIG. 4, a method of manufacturing a multilayer ceramic electronic device according to another embodiment of the present invention includes: preparing a ceramic green sheet using a slurry including ceramic powder; Forming an internal electrode pattern on the ceramic green sheet using a conductive metal paste; And ceramic green sheets laminated and sintered so as to face each other with the dielectric layer and the dielectric layer interposed therebetween, and first and second internal electrodes cross-laminated in such a manner that the printing widths are different from each other in the width direction, Wherein a maximum width of the first and second internal electrodes is defined as W and a minimum width of the first and second internal electrodes is defined as w,

The width difference ratio (D) between the maximum width and the minimum width expressed by the following equation may be 20 to 80%

[Expression] D = (Ww) / W x 100.

The dielectric layer may have an average thickness of 0.6 mu m or less, and the first and second internal electrodes may have an average thickness of 0.6 mu m or less.

The width difference ratio between the first internal electrode and the second internal electrode may be 20 to 40% when the printing width of the first and second internal electrodes is 200 to 250 占 퐉.

The width difference ratio between the first internal electrode and the second internal electrode may be 40 to 70% when the printing width of the first and second internal electrodes is 300 to 400 μm.

The width difference ratio between the first internal electrode and the second internal electrode may be 20 to 80% when the printing width of the first and second internal electrodes is 500 μm or more.

In addition, the connectivity of the first or second internal electrode may be 90% or more.

The number of layers of the ceramic green sheet is not particularly limited, and may be 400 layers or more, for example, for the production of a high-capacity multilayer ceramic electronic component.

When the number of the laminated layers is less than 400, the thickness of the dielectric layer and the internal electrode layer is too thick, so that the problem of the connectivity of the internal electrode and the problem of the withstand voltage characteristic may not occur.

That is, when the number of stacked layers is 400 or more, the thickness of the dielectric layer may be thinned to cause a problem of the connection of the internal electrodes, thereby deteriorating the withstand voltage characteristics. According to one embodiment of the present invention, 2 The internal electrodes 21 and 22 are cross-laminated so as to make a difference in the width of the print in the direction of the width W, whereby the cracks can be reduced, the interconnectivity of the internal electrodes and the withstand voltage characteristics can be improved.

The conductive metal paste is not particularly limited and may include, for example, 40 to 50 parts by weight of a metal powder, which is selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), and palladium ) Alloy. ≪ / RTI >

The method of manufacturing a multilayer ceramic electronic device according to the above-described embodiment is characterized in that the first internal electrode and the second internal electrode are arranged in the width direction so that the width difference ratio between the first internal electrode and the second internal electrode is 20 to 80% This is the same as the general method except that cross-lamination is carried out with a difference in printing width.

The multilayer ceramic electronic device manufactured by the above manufacturing method minimizes the influence of the step between the internal electrodes, thereby reducing the occurrence of cracks and increasing the connectivity of the internal electrodes. Therefore, the multilayer ceramic electronic device having excellent withstand voltage characteristics and reliability can be realized.

Hereinafter, the present invention will be described in more detail by way of examples, but the present invention is not limited thereto.

In this embodiment, the multilayer ceramic capacitor to which the dielectric layer 1 having an average thickness of 0.6 m or less is applied is cross-deposited so that the width difference ratio between the first internal electrode and the second internal electrode is 20 to 80% , Withstand voltage and reliability.

The multilayer ceramic capacitor according to this embodiment was fabricated by the following steps.

First, a slurry including a powder such as barium titanate (BaTiO ₃ ) having an average particle diameter of 0.1 μm was applied on a carrier film and dried to form a plurality of ceramic green sheets (thickness: 1.05 μm and 0.95 μm) Whereby the dielectric layer 1 is formed.

Next, an internal electrode conductive paste containing nickel powder having an average nickel particle size of 0.1 to 0.2 μm and 40 to 50 parts by weight was prepared.

The internal electrode conductive paste was applied on the green sheet by a screen printing method to form internal electrodes, and 400 to 500 layers were laminated to form a laminate.

Thereafter, chips of size 1005 were produced by compression and cutting, and the chips were fired at a temperature of 1050 to 1200 ° C in a reducing atmosphere of 0.1% or less of H ₂ .

Next, a multilayer ceramic capacitor was manufactured through an external electrode, a plating process, and the like.

The comparative example was produced in the same manner as in the above example except that the printed width between the first and second internal electrodes was not different.

Table 1 below is a table comparing the step difference according to the thickness and the number of layers of the ceramic green sheet.

Sheet thickness (μm) Number of layers Step difference (%) Remarks (Internal electrode coating thickness, μm)
Comparative Example
0.5 500 50.0

0.5

0.7 400 41.7 1.0 300 33.3
Example
0.5 500 25.0 0.7 400 20.8 1.0 300 16.7

Referring to Table 1, it can be seen that the comparative example has a larger step difference than the embodiment in respect of the same green sheet thickness and lamination number.

That is, in the case of the multilayer ceramic capacitor according to one embodiment of the present invention, it is understood that the step difference ratio is reduced by crossing the first internal electrode and the second internal electrode such that the width difference ratio is 20 to 80%.

The step rate (%) can be obtained by (the thickness of the internal electrode x the number of layers) / {(thickness of the green sheet + thickness of the internal electrode) x number of layers.

5 is a graph showing the thickness according to the printing width of the internal electrode.

5, between the printing width of the internal electrode and the printing thickness, the printing thickness tends to increase as the printing width decreases, and the printing width also relates to the electrostatic capacity. Therefore, It is possible to cross-laminate such that the printing width is different.

Table 2 below is a table comparing the thickness ratios when the crossing layers are laminated so that the printing widths of the internal electrodes are different.

Narrow width (μm) 50 80 100 200 250 300 400 500 600


Wide width
(μm)


50 0.00 - - - - - - - - 80 0.11 0.00 - - - - - - - 100 0.14 0.04 0.00 - - - - - - 200 0.17 0.07 0.03 0.00 - - - - - 250 0.15 0.05 0.01 -0.02 0.00 - - - - 300 0.08 0.04 -0.09 -0.13 -0.10 0.00 - - - 400 0.09 0.05 0.01 -0.11 -0.08 0.02 0.00 - - 500 0.07 0.02 -0.10 -0.15 -0.11 -0.01 -0.03 0.00 - 600 0.06 0.04 0.01 -0.16 -0.12 -0.02 -0.04 0.01 0.00

Referring to Table 2, when the thickness ratio has a negative value, the influence of the step difference can be minimized, and thus the width change ratio that can minimize the influence of the step difference can be shown.

That is, the width difference ratio between the first internal electrode and the second internal electrode may be 20 to 40% when the printing width of the first and second internal electrodes is 200 to 250 占 퐉.

The width difference ratio between the first internal electrode and the second internal electrode may be 40 to 70% when the printing width of the first and second internal electrodes is 300 to 400 μm.

The width difference ratio between the first internal electrode and the second internal electrode may be 20 to 80% when the printing width of the first and second internal electrodes is 500 μm or more.

Table 3 below is a table comparing crack incidence rates, capacitances, withstand voltage and high temperature accelerated life failure rates according to Examples and Comparative Examples of the present invention.

division Crack defect rate (%) Capacitance (μF) Withstanding voltage (V) High temperature accelerated life
Failure rate (Fit) Comparative Example 5 12.7 40 14 Example 2 11.8 43 6

Referring to Table 3, in the case of the multilayer ceramic capacitor according to an embodiment of the present invention, the electrostatic capacitance is somewhat reduced, but the cracking rate is reduced from 5% to 2%, the withstand voltage is improved And the reliability is also excellent.

6 is a SEM (Scanning Electron Microscope) photograph showing the connectivity of the internal electrodes of one embodiment and the comparative example of the present invention.

Referring to FIG. 6, in the case of the multilayer ceramic capacitor according to an embodiment of the present invention, the interconnectivity of the internal electrodes is 90% or more, and electrode connectivity is uniform over the entire region.

7 is a graph showing a percentage of the capacitance of the multilayer ceramic capacitor due to the difference in the printing width between the first internal electrode and the second internal electrode.

Referring to FIG. 7, it can be seen that when the difference in the printing width exceeds 100 μm, the electrostatic capacity of the multilayer ceramic capacitor is reduced by 50% or more.

Therefore, according to an embodiment of the present invention, the difference in print width between the first internal electrode and the second internal electrode can be 100 m or less.

As a result, in the multilayer ceramic electronic device according to the embodiment of the present invention, the influence of the difference in level between the internal electrodes is minimized, and the occurrence of cracks is reduced and the connectivity of the internal electrodes is increased. Thus, a multilayer ceramic electronic component having excellent withstand voltage characteristics and reliability can be realized .

The present invention is not limited by the above-described embodiments and the accompanying drawings, but is intended to be limited only by the appended claims. It will be apparent to those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. something to do.

1: dielectric layer 10: ceramic body
21, 22: first and second inner electrodes
31, 32: external electrodes

Claims (18)

A ceramic body including a dielectric layer; And
And first and second internal electrodes arranged to face each other with the dielectric layer interposed therebetween in the ceramic body and cross-stacked so as to have a difference in printing width in the width direction,
If a maximum width of the first and second internal electrodes is defined as W and a minimum width of the first and second internal electrodes is defined as w,
(D) between the maximum width and the minimum width expressed by the following formula is 20 to 80%, and the printing width of the electrode having a larger printing width of the first and second internal electrodes is 200 to 250 占 퐉, 1 multilayer ceramic electronic component having a width difference ratio between the internal electrode and the second internal electrode of 20 to 40%
[Expression] D = (Ww) / W x 100.
The method according to claim 1,
Wherein a difference in print width between the first internal electrode and the second internal electrode is 100 mu m or less.
The method according to claim 1,
Wherein the dielectric layer has an average thickness of 0.6 占 퐉 or less.
The method according to claim 1,
Wherein an average thickness of said first and second internal electrodes is 0.6 占 퐉 or less.
delete A ceramic body including a dielectric layer; And
And first and second internal electrodes arranged to face each other with the dielectric layer interposed therebetween in the ceramic body and cross-stacked so as to have a difference in printing width in the width direction,
If a maximum width of the first and second internal electrodes is defined as W and a minimum width of the first and second internal electrodes is defined as w,
(D) between the maximum width and the minimum width expressed by the following formula is 20 to 80%, and the printing width of the electrode having a larger printing width among the first and second internal electrodes is 300 to 400 占 퐉, 1 multilayer ceramic electronic part having a width difference ratio between the internal electrode and the second internal electrode of 40 to 70%
[Expression] D = (Ww) / W x 100.
A ceramic body including a dielectric layer; And
And first and second internal electrodes arranged to face each other with the dielectric layer interposed therebetween in the ceramic body and cross-stacked so as to have a difference in printing width in the width direction,
If a maximum width of the first and second internal electrodes is defined as W and a minimum width of the first and second internal electrodes is defined as w,
(D) between the maximum width and the minimum width expressed by the following formula is 20 to 80%, and when the printing width of an electrode having a larger printing width of the first and second internal electrodes is 500 m or more, A multilayer ceramic electronic component having a width difference ratio of 20 to 80% between the internal electrode and the second internal electrode,
[Expression] D = (Ww) / W x 100.
The method according to claim 1,
Wherein the connection of the first or second internal electrode is 90% or more.
Providing a ceramic green sheet using a slurry comprising ceramic powder;
Forming an internal electrode pattern on the ceramic green sheet using a conductive metal paste; And
The ceramic green sheet is laminated and sintered to form a ceramic body including first and second internal electrodes which are disposed so as to face each other with the dielectric layer and the dielectric layer interposed therebetween, ; ≪ / RTI >
If a maximum width of the first and second internal electrodes is defined as W and a minimum width of the first and second internal electrodes is defined as w,
(D) between the maximum width and the minimum width expressed by the following formula is 20 to 80%, and the printing width of the electrode having a larger printing width of the first and second internal electrodes is 200 to 250 占 퐉, Wherein a difference in width between the first internal electrode and the second internal electrode is 20 to 40%
[Expression] D = (Ww) / W x 100.
10. The method of claim 9,
Wherein a difference in print width between the first internal electrode and the second internal electrode is 100 mu m or less.
10. The method of claim 9,
Wherein an average thickness of the dielectric layer is 0.6 mu m or less.
10. The method of claim 9,
Wherein the average thickness of the first and second internal electrodes is 0.6 占 퐉 or less.
delete Providing a ceramic green sheet using a slurry comprising ceramic powder;
Forming an internal electrode pattern on the ceramic green sheet using a conductive metal paste; And
The ceramic green sheet is laminated and sintered to form a ceramic body including first and second internal electrodes which are disposed so as to face each other with the dielectric layer and the dielectric layer interposed therebetween, ; ≪ / RTI >
If a maximum width of the first and second internal electrodes is defined as W and a minimum width of the first and second internal electrodes is defined as w,
(D) between the maximum width and the minimum width expressed by the following formula is 20 to 80%, and the printing width of the electrode having a larger printing width among the first and second internal electrodes is 300 to 400 占 퐉, Wherein the difference in width between the first internal electrode and the second internal electrode is 40 to 70%
[Expression] D = (Ww) / W x 100.
Providing a ceramic green sheet using a slurry comprising ceramic powder;
Forming an internal electrode pattern on the ceramic green sheet using a conductive metal paste; And
The ceramic green sheet is laminated and sintered to form a ceramic body including first and second internal electrodes which are disposed so as to face each other with the dielectric layer and the dielectric layer interposed therebetween, ; ≪ / RTI >
If a maximum width of the first and second internal electrodes is defined as W and a minimum width of the first and second internal electrodes is defined as w,
(D) between the maximum width and the minimum width expressed by the following formula is 20 to 80%, and when the printing width of an electrode having a larger printing width of the first and second internal electrodes is 500 m or more, Wherein a width difference ratio between the internal electrode and the second internal electrode is 20 to 80%
[Expression] D = (Ww) / W x 100.
10. The method of claim 9,
Wherein the connectivity of the first or second internal electrode is 90% or more.
10. The method of claim 9,
Wherein the number of layers of the ceramic green sheets is 400 or more.
10. The method of claim 9,
Wherein the conductive metal is at least one selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), and palladium-silver (Pd-Ag) alloys.

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