US20220018610A1

US20220018610A1 - Vapor chamber structure

Info

Publication number: US20220018610A1
Application number: US17/368,120
Authority: US
Inventors: Chih-Wei Chen; Cheng-Ju Chang; Jyun-Wei Huang
Original assignee: Auras Technology Co Ltd
Current assignee: Auras Technology Co Ltd
Priority date: 2020-07-20
Filing date: 2021-07-06
Publication date: 2022-01-20
Also published as: CN215491237U; TWI728942B; CN215466658U; TWI768877B; CN113966135A; TW202204840A; TWM612891U; TWM617759U; TW202204842A; TW202204839A; CN213907324U; TWM616962U; CN213583120U; CN215222826U; TWM617046U; TWM610451U; CN113959245A; CN215500169U; TWM621682U; CN113966134A

Abstract

A vapor chamber structure including a main vapor chamber, at least one heat dissipation structure, and a plurality of metal blocks is provided. The main vapor chamber includes an upper plate and a lower plate. The main vapor chamber further includes a first cavity formed between the upper plate and the lower plate. The heat dissipation structure is located on an outer surface of the upper plate and fluidly connected to the first cavity of the main vapor chamber. The metal blocks are disposed in the first cavity.

Description

RELATED APPLICATIONS

This application claims priority to U.S. Provisional Application Ser. No. 63/053,953, filed Jul. 20, 2020, the disclosures of which are incorporated herein by reference in their entireties.

TECHNICAL FIELD

The present disclosure generally relates to a vapor chamber. More particularly, the present disclosure relates to a vapor chamber structure.

BACKGROUND

The statements in this section merely provide background information related to the present disclosure and do not necessarily constitute prior art.
With the increasing development of computing technology, humans have generally used various electronic devices with high computing density per unit volume. Due to the increasing electronic component density of the electronic device, the performance of the electronic device is more excellent, and accompanied with high-intensity heat energy in a small area while operating. If this heat energy cannot be effectively dissipated from the internal small area, a high temperature may easily cause damage to the electronic components. Therefore, a structure capable of improving the heat dissipation of the electronic device is becoming more and more important.

SUMMARY

In order to effectively diffuse and dissipate a heat energy generated by a heat source, new heat dissipation devices having different shapes or materials are gradually being introduced. However, there is currently no satisfactory way to design a heat transfer structure able to dissipate the heat energy in both horizontal and vertical directions to provide a satisfactory structure able to meet the heat dissipation requirements of devices with high electronic component density in the future. Therefore, there is a need to provide a new vapor chamber structure able to effectively transfer the heat energy and dissipate the heat energy better than an existing technology.
One objective of the embodiments of the present invention is to provide a vapor chamber structure to effectively transfer the heat energy and dissipate the heat energy.
To achieve these and other advantages and in accordance with the objective of the embodiments of the present invention, as the embodiment broadly describes herein, the embodiments of the present invention provides a vapor chamber structure including a main vapor chamber, at least one heat dissipation structure and a plurality of metal blocks. The main vapor chamber is formed by an upper plate and a lower plate, and a first cavity is located between the upper plate and the lower plate. The heat dissipation structure is disposed on an outer surface of the upper plate and fluidly connected with the first cavity of the main vapor chamber first cavity. The metal blocks are disposed in the first cavity.
In some embodiments, the metal blocks are disposed on the lower plate and a steam channel is formed between the metal blocks and the upper plate.
In some embodiments, one of the metal blocks is extended to two opposite ends of the first cavity to prevent working fluids in two opposite areas of the first cavity from flowing into each other.
In some embodiments, the vapor chamber structure further includes a capillary structure located in the first cavity and disposed on the lower plate. The capillary structure contacts the metal blocks.
In some embodiments, the heat dissipation structure includes at least one auxiliary vapor chamber and at least one heat pipe. The auxiliary vapor chamber is disposed on the outer surface of the upper plate and fluidly connected to the first cavity of the main vapor chamber. The heat pipe is disposed on the outer surface and fluidly connected to the first cavity of the main vapor chamber.
In some embodiments, a quantity of the at least one auxiliary vapor chamber is multiple, a quantity of the at least one heat pipe is multiple, the auxiliary vapor chambers are spaced apart from each other, and the heat pipes are spaced apart from each other.
In some embodiments, the outer surface is extended along a first direction and a second direction, the auxiliary vapor chambers and the heat pipes are extended along a third direction, the first direction is perpendicular to the second direction, and the third direction is different from any combination direction of the first direction and the second direction.
In some embodiments, a first height of the auxiliary vapor chambers relative to the outer surface and along the third direction is lower than a heat pipe height of the heat pipes relative to the outer surface and along the third direction.
In some embodiments, the heat pipes include at least one first type heat pipe and at least one second type heat pipe. The first type heat pipe extends toward the third direction. A first portion of the second type heat pipe extends toward the third direction, a first end of the first portion contacts the outer surface, a second portion of the second type heat pipe extends toward the second direction, and the second portion is connected to a second end, opposite to the first end, of the first portion.
In some embodiments, a quantity of the at least one first type heat pipe is multiple, a quantity of the at least one second type heat pipe is multiple, the first type heat pipe and the auxiliary vapor chamber are alternately arranged along the second direction.
In some embodiments, the second type heat pipes are located between a portion of the auxiliary vapor chambers and another portion of the auxiliary vapor chambers, and no auxiliary vapor chamber is located between the second type heat pipes along the first direction.
In some embodiments, each of the auxiliary vapor chambers includes a second cavity, each of the heat pipes includes a hollow portion, and the second cavity and the hollow portion are fluidly connected to the first cavity.
In some embodiments, one of the metal blocks separates two adjacent heat pipes of the heat pipes, or one adjacent auxiliary vapor chamber of the auxiliary vapor chambers and one adjacent heat pipe of the heat pipes when the auxiliary vapor chambers, the heat pipes and the metal blocks are projected vertically onto the outer surface of the main vapor chamber.
Hence, the present disclosure provides a single main vapor chamber fluidly connected to different types of heat pipes and auxiliary vapor chambers, so that the thermal resistance is reduced when an actual heat flow is transferred, thereby effectively dissipating the heat energy and improving the heat dissipation efficiency.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing aspects and many of the attendant advantages of this invention will be more readily appreciated as the same becomes better understood by reference to the following detailed description, when taken in conjunction with the accompanying drawings, wherein:

FIG. 1A illustrates a schematic perspective view showing a vapor chamber structure according to one embodiment of the present invention;

FIG. 1B illustrates another schematic perspective view showing a vapor chamber structure according to one embodiment of the present invention;

FIG. 2 illustrates a schematic top view showing a vapor chamber structure according to one embodiment of the present invention;

FIG. 3 illustrates a schematic side view showing a vapor chamber structure according to one embodiment of the present invention;

FIG. 4 illustrates another schematic side view showing a vapor chamber structure according to one embodiment of the present invention; and

FIG. 5 illustrates an enlarged perspective view showing a portion of a vapor chamber structure according to one embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

The following description is of the best presently contemplated mode of carrying out the present disclosure. This description is not to be taken in a limiting sense but is made merely for the purpose of describing the general principles of the invention. The scope of the invention should be determined by referencing the appended claims.
Refer from FIG. 1A to FIG. 5. FIG. 1A illustrates a schematic perspective view showing a vapor chamber structure 1000 according to one embodiment of the present invention, and FIG. 1B illustrates another schematic perspective view thereof. In FIG. 1B, a first cavity 102 under the upper plate 110 of FIG. 1A is directly illustrated to clearly show the structure of some embodiments of the present disclosure and facilitate the explanation of the heat flow activity therein. FIG. 2 illustrates a schematic top view showing a vapor chamber structure 1000 according to one embodiment of the present invention. FIG. 3 illustrates a schematic side view showing a vapor chamber structure 1000 according to one embodiment of the present invention. FIG. 4 illustrates enclosed hollow spaces, i.e. cavity, within each element of the vapor chamber structure 1000 of FIG. 3. In addition, FIG. 5 illustrates an enlarged perspective view showing an E portion of the vapor chamber structure 1000 according to one embodiment of the present invention. The vapor chamber structure 1000 includes a main vapor chamber 100 and a heat dissipation structure (HDS). The heat dissipation structure (HDS) includes a plurality of auxiliary vapor chambers 200 and a plurality of heat pipes 300. The main vapor chamber 100 is formed by the upper plate 110 and the lower plate 120. The heat dissipation structure is disposed on an outer surface 112 of the upper plate 110. In detail, the auxiliary vapor chambers 200 are disposed on the outer surface 112 of the upper plate 110 and are directly fluidly connected to the main vapor chamber 100. The auxiliary vapor chambers 200 are spaced apart from each other on the main vapor chamber 100. That is to say, a plurality of auxiliary vapor chambers 200 are not in direct contact with each other. The heat pipes 300 are disposed on the outer surface 112 and are directly fluidly connected to the main vapor chamber 100. A plurality of heat pipes 300 are spaced apart from each other on the main vapor chamber 100. That is to say, a plurality of heat pipes 300 are not in direct contact with each other. By way of an integrated inner space communication formed in the main vapor chamber 100, the plurality of auxiliary vapor chambers 200 and the plurality of heat pipes 300, that is, gas and liquid able to theoretically diffuse or flow to different area in the inner space, the vapor chamber structure 1000 can further improve the heat dissipation efficiency compared to a vapor chamber on which heat pipes and vapor chambers are welded transfers heat through the heat conduction of the solid interfaces.
The outer surface 112 of the upper plate 110 are extended along the first direction D1 and the second direction D2. The first direction D1 is perpendicular to the second direction D2 to form a two dimensional plane, for example, the extending directions of the outer surface 112. The auxiliary vapor chambers 200 and the heat pipes 300 are extended to a third direction D3. The third direction D3 does not belong to any one direction on the plane formed by the first direction D1 and the second direction D2. That is to say, the third direction D3 does not belong to any one of the combinations of the first direction D1 and the second direction D2. In some embodiments, the third direction D3 is perpendicular to the first direction D1 and the second direction D2. In some embodiments, a first height H1 of the auxiliary vapor chambers 200, relative to the outer surface 112 and along the third direction D3, is lower than a heat pipe height H2 of the heat pipes 300, relative to the outer surface 112 and along the third direction D3, as illustrated in FIG. 3.
The heat pipes 300 may include a plurality of first type heat pipe 310 and a plurality of second type heat pipe 320 but not limited thereto. The first type heat pipe 310 is extended from the outer surface 112 of the upper plate 110 along the third direction D3. The heat pipe height H2 of the first type heat pipe 310 can be a second height H21. The second type heat pipe 320 may include a first portion 322 and a second portion 324. In FIG. 3, the first portion 322 is overlapped with the first type heat pipe 310. Please refer to FIG. 1B, the first portion 322 is annotated therein. The first portion 322 is extended from the outer surface 112 of the upper plate 110 along the third direction D3, and the first end 322A of the first portion 322 contacts the outer surface 112. In some embodiments, the second portion 324 of the second type heat pipe 320 is extended along a second direction D2. The second portion 324 connects to a second end 322B, opposite to the first end 322A, of the first portion 322. The heat pipe height H2 of the second type heat pipe 320 can be a third height H22, that is, a height of the second portion 324 facing away from the outer surface 112. In some embodiments, the third height H22 is smaller than the second height H21 and larger than the first height H1. With the above configuration, the heat energy from the main vapor chamber 100 can be easily diffused on a plane formed by the first direction D1 and the second direction D2 and a diffusion distance along the third direction D3 can be longer.
It is worth noting that, the main vapor chamber 100 and the auxiliary vapor chambers 200 can be any vapor chamber, and the heat pipes 300 can be any heat pipe without departing from the scope and the spirit of the present invention. The structure of the vapor chamber is generally flat. That is to say, if the vapor chamber is a flat cuboid formed by the length, width, and height along three different directions, the area formed by the length and the width is significantly larger than the area formed by the width and the height, and the area formed by the length and the height. In other words, the length and the width of the vapor chamber are much greater than the height. This shape of the vapor chamber is also an implicit structural feature according to the embodiments of the present invention. In addition, the structure of the heat pipe is a hollow columnar structure, which can be a hollow cylinder. The length of the central axis along the center of the hollow cylinder is generally significantly greater than the diameter of the cylinder. Of course, the structure of the heat pipe according to the embodiments of the present invention may include a cross section of the heat pipe along the diameter is polygonal or elliptical.
In some embodiments, the main vapor chamber 100 and the auxiliary vapor chambers 200 are extended along different directions and, for example, the main vapor chamber 100 may perpendicular to the auxiliary vapor chambers 200. In some embodiments, the extending direction of the plane formed by the length and width of the main vapor chamber 100 is different from the extending direction of the plane formed by the length and width of the auxiliary vapor chambers 200 and, for example, the outer surface 112 of the upper plate 110 of the main vapor chamber 100 is perpendicular to the plane formed by the length and width of the auxiliary vapor chambers 200.
In FIG. 2 and FIG. 3, the first type heat pipe 310 and the auxiliary vapor chambers 200 are alternately arranged along the second direction D2. That is to say, along the second direction D2, an auxiliary vapor chamber 200 is disposed between two adjacent first type heat pipes 310, and a first type heat pipe 310 is disposed between two adjacent auxiliary vapor chambers 200 along the second direction D2. In addition, along the first direction D1, the second type heat pipe 320 is disposed a portion of the auxiliary vapor chambers 200 and another portion of the auxiliary vapor chambers 200, and no auxiliary vapor chamber 200 is disposed between two second type heat pipes 320. The above arrangement is illustrated for some embodiments, and is not intended to limit the scope and the spirit of the present invention. In some embodiments, the heat source 400 is attached to the lower plate 120. In some embodiments, the vertical projection of the heat source 400 on the outer surface 112 is located at a geometry center of the vertical projection of the plurality of second type heat pipes 320 on the outer surface 112.
According to the component arrangement as illustrated in FIG. 2 and FIG. 3, the heat energy generated by the heat source 400 can be more smoothly transferred along the plane formed by the first direction D1 and the second direction D2, and the heat energy can be transferred by the auxiliary vapor chambers 200 formed on the main vapor chamber 100 along the third direction D3. The auxiliary vapor chamber 200 has a smallest height and the surface formed by the length and width thereof is greater than the outer surface of the heat pipe 300, and can transfer the heat energy to the heat dissipation fin assembly close to the main vapor chamber 100. By way of the first portion 322 of the second type heat pipe 320, the heat energy can be transferred to a middle layer, that is, a heat dissipation fin assembly slightly farther from the main vapor chamber 100. In addition, by way of the second portion 324 of the second type heat pipe 320, the heat energy can be further transferred to the plane formed by the first direction D1 and the second direction D2 from the middle layer. Furthermore, by way of the first type heat pipe 310 having the greatest height, the heat energy can be transferred to a heat dissipation fin assembly far away from the main vapor chamber 100 along the third direction D3. In combination with the first type heat pipe 310, the second type heat pipe 320 and the auxiliary vapor chambers 200, the main vapor chamber 100 can distribute the heat energy in three directions, thereby effectively distributing the heat energy to the heat dissipation fin assemblies arranged in different layers. In the vapor chamber structure 1000, the heat energy is transferred by the working fluid in the main vapor chamber 100 to absorb the heat energy generated by the heat source 400 by the liquid working fluid, the liquid working fluid is vaporized to gaseous working fluid, and the gaseous working fluid can transfer the heat energy in the vapor chamber structure 1000 along the first direction D1, the second direction D2 or the third direction D3.
The arrangement of the vapor chamber structure 1000 takes into account the transfer of heat energy, the heat dissipation efficiency, the space utilization, and the flexible combination of the vapor chamber structure 1000 with various heat dissipation fin assemblies that can be attached later. In addition, as the auxiliary vapor chambers 200, the first type heat pipe 310 and the second type heat pipe 320 are matched in geometric shape and height position, the airflow flowing to the vapor chamber structure 1000 (this airflow is an external airflow rather than the foregoing gaseous working fluid) can be caused more disturbance and turbulence, thereby changing an one-dimensional conduction heat flow into a two-dimensional conduction heat flow, so as to reduce thermal resistance. In the present disclosure, the additional heat dissipation fin assembly is omitted in the drawings, and the drawings focus on the illustration of the vapor chamber structure 1000.
Refer to FIG. 4. FIG. 4 illustrates another schematic side view showing a vapor chamber structure to see through the vapor chamber structure 1000. In some embodiments, the main vapor chamber 100 includes a first cavity 102 disposed between the upper plate 110 and the lower plate 120. Each auxiliary vapor chamber 200 includes a second cavity 202. Each heat pipe 300 includes a hollow portion 302. The second cavity 202 and the hollow portion 302 are fluidly connected to the first cavity 102. In short, the heat dissipation structure (HDS) is fluidly connected to the first cavity 102. After the gaseous working fluid is condensed into the liquid working fluid, the working fluid may flow back to the first cavity 102 through the capillary structure (not shown) in the second cavity 202 and the hollow portion 302.
Refer to FIG. 5. A perspective enlarged portion E of the vapor chamber structure 1000 is illustrated to show the structure features thereof. Please also refer to FIG. 1B, FIG. 2, and FIG. 5. The vapor chamber structure 1000 may further include a plurality of metal blocks 500 disposed in the first cavity 102 of the main vapor chamber 100 and directly attached on the lower plate 120. The metal blocks 500 can be cooper blocks. When the auxiliary vapor chambers 200, the heat pipes 300 and the metal blocks 500 are projected onto the outer surface 112 of the upper plate 110 of the main vapor chamber 100 (similar to the viewing angle of FIG. 2), a metal blocks 500A of the plurality of metal blocks 500 separates two adjacent second type heat pipes 320. Another one metal block 500B of the plurality of metal blocks 500 separates an adjacent auxiliary vapor chamber 200 and an adjacent first type heat pipe 310. Therefore, the working fluid between the plurality of auxiliary vapor chambers 200 and the plurality of heat pipes 300 can be adjusted by the metal blocks 500 to prevent the working fluid from being grabbed. That is to say, the working fluid can be appropriately distributed in different areas to prevent the working fluid from being concentrated in some areas and decreasing in other areas, so as to solve the abnormal working problem caused by the liquid volume being lower than a required threshold. Hence, the vapor chamber structure 1000 of the present invention can appropriately distribute the working fluid to the areas have to reduce the temperature.
In detail, the metal blocks 500 can be disposed on the lower plate 120 to form a steam channel 1022 (the steam channel 1022 is also a part of the first cavity 102) between the upper plate 110 and the metal blocks 500, so that the metal blocks 500 will not excessively obstruct the working fluid flowing in the various areas disclosed in the present disclosure, that is, the gaseous working fluid can still moderately diffuse through the steam channel 1022 above the metal blocks 500. The vapor chamber structure 1000 may further include a capillary structure 600, located in the first cavity 102 and disposed on the lower plate 120. The capillary structure 600 is in contact with the metal blocks 500, and the structure allows the metal blocks 500 to be used as the boundary of the capillary structure 600, thereby achieving the effect of partitioning the capillary structure 600. The partition structure can separate the working fluid, i.e. the liquid working fluid, in a plurality of specific areas of the capillary structure 600 by way of the metal blocks 500, thereby separating from each other to a certain extent.
In more detail, the capillary structure 600 includes a first capillary structure 610, a second capillary structure 620 and a third capillary structure 630. In some embodiments, the first capillary structure 610 is directly attached on the lower plate 120, and in contact with the lateral surfaces of the metal blocks 500A and the lateral surfaces of the metal blocks 5006. In FIG. 5, the upper plate 110 and the lower plate 120 are illustrated transparently illustrated with dashed lines to show the elements disposed in the first cavity 102. In addition, the first capillary structure 610 is directly attached on the lower plate 120 illustrated with dashed lines. In some embodiments, the metal blocks 500A are further extended to two opposite ends of the first cavity 102. In detail, the edge of the metal blocks 500A fits the capillary structure 600, for example, the first capillary structure 610, along the second direction D2. In this way, the metal blocks 500A can completely separate the working fluid in two opposite areas of the first cavity 102 along the first direction D1, thereby regarding as a relatively strong partition structure for separating the working fluid. The second capillary structure 620 and the third capillary structure 630 are disposed on the first capillary structure 610. The first capillary structure 610 is disposed between the second capillary structure 620 and the lower plate 120, and the first capillary structure 610 is disposed between the third capillary structure 630 and the lower plate 120. The working fluid in the second cavity 202 and the hollow portion 302 can deliver to the third capillary structure 630 through the second capillary structure 620 to continuously dissipate heat energy generated by the heat source 400.
The third capillary structure 630 is in contact with the metal blocks 500A which is in contact with the lower plate 120. From the top view as illustrated in FIG. 2, the third capillary structure 630 is located near the geometry center C of the lower plate 120, and is surrounded by the second type heat pipes 320. That is to say, the second type heat pipes 320 are closer to the third capillary structure 630 compared with the first type heat pipes 310 and the auxiliary vapor chambers 200. As shown in FIG. 2 and FIG. 5, the thickness of the third capillary structure 630 is thicker than the thickness of the second capillary structure 620. Therefore, the third capillary structure 630 can temporarily store more working fluid therein as a main distribution structure of the working fluid in the vapor chamber structure 1000. One end of each second capillary structure 620 is in contact with the third capillary structure 630, and another end of each second capillary structure 620 is located in the projection area of the first type heat pipe 310 or the auxiliary vapor chambers 200 on the lower plate 120 or the first capillary structure 610. Therefore, the working fluid can be delivered from the first type heat pipe 310 and the auxiliary vapor chambers 200 to the first cavity 102 at a nearest distance (i.e. the distance between the upper plate 110 and the lower plate 120 in the third direction D3) to connect to the third capillary structure 630 near the geometry center C of the lower plate 120 so as to improve the heat dissipation effect. In some embodiments, the another end of the second capillary structure 620 may contact the first type heat pipe 310 or the auxiliary vapor chambers 200, and further extended into the hollow portion 302 of the first type heat pipe 310 or the second cavity 202 of the auxiliary vapor chambers 200, but not limited to this.
Although the drawings of the present disclosure depict a plurality of auxiliary vapor chambers 200 and a plurality of heat pipes 300, but not limited to this. In a most simplified structure of the vapor chamber structure 1000, the vapor chamber structure 1000 according to some embodiments of the present disclosure may only include a main vapor chamber 100, an auxiliary vapor chamber 200, and a heat pipe 300, and the structural features of the configuration and the extending direction thereof are the same as the multiple foregoing mentioned embodiments.
Accordingly, the embodiments of the present disclosure provide a vapor chamber structure in which an auxiliary vapor chamber and a heat pipe are fluidly connected to a same main vapor chamber. The vapor chamber structure can fit more types of the heat dissipation fins and make the airflow generate more turbulence, thereby enhancing the heat dissipation effect. Different types of the heat pipes in combination with the auxiliary vapor chambers can fit different height heat dissipation fins relative to the main vapor chamber to receive heat energy transferred from the heat source on the lower plate of the main vapor chamber. In addition, in some embodiments, the combination of the metal blocks and the capillary structure, and the positional relationship between the metal blocks, the capillary structure, the vapor chamber and the heat pipes can properly maintain the working fluid volume in each areas of the main vapor chamber, thereby improving the heat transfer and heat dissipation efficiency thereof.
As is understood by a person skilled in the art, the foregoing preferred embodiments of the present invention are illustrative of the present invention rather than limiting of the present invention. It is intended that various modifications and similar arrangements be included within the spirit and scope of the appended claims, the scope of which should be accorded the broadest interpretation so as to encompass all such modifications and similar structures.

Claims

What is claimed is:

1. A vapor chamber structure, comprising:

a main vapor chamber comprising an upper plate, a lower plate and a first cavity located between the upper plate and the lower plate; and

at least one heat dissipation structure disposed on an outer surface of the upper plate and fluidly connected to the first cavity of the main vapor chamber; and

a plurality of metal blocks disposed in the first cavity.

2. The vapor chamber structure of claim 1, wherein the metal blocks disposed on the lower plate and a steam channel is formed between the metal blocks and the upper plate.

3. The vapor chamber structure of claim 2, wherein one of the metal blocks is extended to two opposite ends of the first cavity to prevent working fluids in two opposite areas of the first cavity from flowing into each other.

4. The vapor chamber structure of claim 1, further comprising a capillary structure located in the first cavity and disposed on the lower plate, wherein the capillary structure contacts the metal blocks.

5. The vapor chamber structure of claim 1, wherein the at least one heat dissipation structure comprises:

at least one auxiliary vapor chamber disposed on the outer surface of the upper plate and fluidly connected to the first cavity of the main vapor chamber; and

at least one heat pipe disposed on the outer surface and fluidly connected to the first cavity of the main vapor chamber.

6. The vapor chamber structure of claim 1, wherein a quantity of the at least one auxiliary vapor chamber is multiple, a quantity of the at least one heat pipe is multiple, the auxiliary vapor chambers are spaced apart from each other, and the heat pipes are spaced apart from each other.

7. The vapor chamber structure of claim 6, wherein the outer surface is extended along a first direction and a second direction, the auxiliary vapor chambers and the heat pipes are extended along a third direction, the first direction is perpendicular to the second direction, and the third direction is different from any combination direction of the first direction and the second direction.

8. The vapor chamber structure of claim 7, wherein a first height of the auxiliary vapor chambers relative to the outer surface and along the third direction is lower than a heat pipe height of the heat pipes relative to the outer surface and along the third direction.

9. The vapor chamber structure of claim 7, wherein the heat pipes comprise:

at least one first type heat pipe extending toward the third direction; and

at least one second type heat pipe, a first portion of the second type heat pipe extending toward the third direction, a first end of the first portion contacting the outer surface, a second portion of the second type heat pipe extending toward the second direction, the second portion being connected to a second end, opposite to the first end, of the first portion.

10. The vapor chamber structure of claim 9, wherein a quantity of the at least one first type heat pipe is multiple, a quantity of the at least one second type heat pipe is multiple, the first type heat pipe and the auxiliary vapor chamber are alternately arranged along the second direction.

11. The vapor chamber structure of claim 10, wherein the second type heat pipes are located between a portion of the auxiliary vapor chambers and another portion of the auxiliary vapor chambers, and no auxiliary vapor chamber is located between the second type heat pipes along the first direction.

12. The vapor chamber structure of claim 6, wherein each of the auxiliary vapor chambers comprises a second cavity, each of the heat pipes comprises a hollow portion, and the second cavity and the hollow portion are fluidly connected to the first cavity.

13. The vapor chamber structure of claim 12, wherein one of the metal blocks separates two adjacent heat pipes of the heat pipes, or one adjacent auxiliary vapor chamber of the auxiliary vapor chambers and one adjacent heat pipe of the heat pipes when the auxiliary vapor chambers, the heat pipes and the metal blocks are projected vertically onto the outer surface of the main vapor chamber.