US20220012394A1 - Electronic signal verification using a translated simulated waveform - Google Patents
Electronic signal verification using a translated simulated waveform Download PDFInfo
- Publication number
- US20220012394A1 US20220012394A1 US17/370,930 US202117370930A US2022012394A1 US 20220012394 A1 US20220012394 A1 US 20220012394A1 US 202117370930 A US202117370930 A US 202117370930A US 2022012394 A1 US2022012394 A1 US 2022012394A1
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- waveform
- circuit
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- translated
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- 238000012795 verification Methods 0.000 title claims description 8
- 238000005259 measurement Methods 0.000 claims abstract description 37
- 238000000034 method Methods 0.000 claims description 77
- 230000008569 process Effects 0.000 claims description 40
- 238000013461 design Methods 0.000 claims description 22
- 238000004519 manufacturing process Methods 0.000 claims description 17
- 230000000007 visual effect Effects 0.000 claims description 13
- 230000003993 interaction Effects 0.000 claims description 3
- 230000003362 replicative effect Effects 0.000 claims description 2
- 230000000875 corresponding effect Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 230000006870 function Effects 0.000 description 4
- 238000013519 translation Methods 0.000 description 4
- 238000010200 validation analysis Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- 230000003190 augmentative effect Effects 0.000 description 2
- 238000004422 calculation algorithm Methods 0.000 description 2
- 238000011960 computer-aided design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 238000012952 Resampling Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000013473 artificial intelligence Methods 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 238000010801 machine learning Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012549 training Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/36—Circuit design at the analogue level
- G06F30/367—Design verification, e.g. using simulation, simulation program with integrated circuit emphasis [SPICE], direct methods or relaxation methods
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/3183—Generation of test inputs, e.g. test vectors, patterns or sequences
- G01R31/318342—Generation of test inputs, e.g. test vectors, patterns or sequences by preliminary fault modelling, e.g. analysis, simulation
- G01R31/318357—Simulation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/3183—Generation of test inputs, e.g. test vectors, patterns or sequences
- G01R31/318342—Generation of test inputs, e.g. test vectors, patterns or sequences by preliminary fault modelling, e.g. analysis, simulation
- G01R31/31835—Analysis of test coverage or failure detectability
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/32—Circuit design at the digital level
- G06F30/323—Translation or migration, e.g. logic to logic, hardware description language [HDL] translation or netlist translation
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/32—Circuit design at the digital level
- G06F30/33—Design verification, e.g. functional simulation or model checking
- G06F30/3308—Design verification, e.g. functional simulation or model checking using simulation
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/32—Circuit design at the digital level
- G06F30/333—Design for testability [DFT], e.g. scan chain or built-in self-test [BIST]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/394—Routing
- G06F30/3953—Routing detailed
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
- G06F2119/02—Reliability analysis or reliability optimisation; Failure analysis, e.g. worst case scenario performance, failure mode and effects analysis [FMEA]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Evolutionary Computation (AREA)
- Geometry (AREA)
- Computer Networks & Wireless Communication (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Tests Of Electronic Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Debugging And Monitoring (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2023501454A JP2023535138A (ja) | 2020-07-09 | 2021-07-08 | 変換されたシミュレーション波形を用いた電子信号の検証 |
CN202180049023.XA CN115803640A (zh) | 2020-07-09 | 2021-07-08 | 使用转换仿真波形的电子信号验证 |
PCT/US2021/040963 WO2022011190A1 (en) | 2020-07-09 | 2021-07-08 | Electronic signal verification using a translated simulated waveform |
DE112021003675.0T DE112021003675T5 (de) | 2020-07-09 | 2021-07-08 | Elektronische signalüberprüfung mit einer übersetzten simulierten wellenform |
US17/370,930 US20220012394A1 (en) | 2020-07-09 | 2021-07-08 | Electronic signal verification using a translated simulated waveform |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US202063050053P | 2020-07-09 | 2020-07-09 | |
US17/370,930 US20220012394A1 (en) | 2020-07-09 | 2021-07-08 | Electronic signal verification using a translated simulated waveform |
Publications (1)
Publication Number | Publication Date |
---|---|
US20220012394A1 true US20220012394A1 (en) | 2022-01-13 |
Family
ID=79173695
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US17/370,930 Pending US20220012394A1 (en) | 2020-07-09 | 2021-07-08 | Electronic signal verification using a translated simulated waveform |
US17/370,976 Active US11520966B2 (en) | 2020-07-09 | 2021-07-08 | Automated assisted circuit validation |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US17/370,976 Active US11520966B2 (en) | 2020-07-09 | 2021-07-08 | Automated assisted circuit validation |
Country Status (5)
Country | Link |
---|---|
US (2) | US20220012394A1 (de) |
JP (2) | JP2023535138A (de) |
CN (3) | CN115803640A (de) |
DE (2) | DE112021003675T5 (de) |
WO (2) | WO2022011192A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114510902A (zh) * | 2022-04-20 | 2022-05-17 | 北京芯愿景软件技术股份有限公司 | 仿真结果的验证方法、装置、设备及计算机存储介质 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117115364B (zh) * | 2023-10-24 | 2024-01-19 | 芯火微测(成都)科技有限公司 | 微处理器sip电路测试状态监控方法、系统及存储介质 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020120922A1 (en) * | 2000-12-05 | 2002-08-29 | International Business Machines Corporation | Embedded hardware description language instrumentation |
US20020129326A1 (en) * | 2001-03-08 | 2002-09-12 | Nuber Paul D. | Method for inserting repeaters in hierarchical chip design |
US20040025136A1 (en) * | 2002-07-30 | 2004-02-05 | Carelli John A. | Method for designing a custom ASIC library |
US20050024057A1 (en) * | 2003-06-20 | 2005-02-03 | Romain Desplats | Methods of using measured time resolved photon emission data and simulated time resolved photon emission data for fault localization |
US6996068B1 (en) * | 2000-03-31 | 2006-02-07 | Intel Corporation | Audio testing in a packet switched network |
US20170147736A1 (en) * | 2015-11-19 | 2017-05-25 | International Business Machines Corporation | Automated scan chain diagnostics using emission |
US20180365370A1 (en) * | 2017-06-18 | 2018-12-20 | Coventor, Inc. | System and method for key parameter identification, process model calibration and variability analysis in a virtual semiconductor device fabrication environment |
US20220221411A1 (en) * | 2019-05-31 | 2022-07-14 | Hamamatsu Photonics K.K. | Semiconductor apparatus examination method and semiconductor apparatus examination apparatus |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5325309A (en) * | 1991-04-30 | 1994-06-28 | Lsi Logic Corporation | Method and apparatus for integrated circuit diagnosis |
US6671846B1 (en) * | 2000-06-20 | 2003-12-30 | Lsi Logic Corporation | Method of automatically generating schematic and waveform diagrams for isolating faults from multiple failing paths in a circuit using input signal predictors and transition times |
US7089517B2 (en) * | 2000-09-29 | 2006-08-08 | Advantest Corp. | Method for design validation of complex IC |
US7408336B2 (en) * | 2005-10-26 | 2008-08-05 | International Business Machines Corporation | Importation of virtual signals into electronic test equipment to facilitate testing of an electronic component |
KR100858651B1 (ko) * | 2006-11-01 | 2008-09-16 | 주식회사 유니테스트 | 순차적 반도체 테스트 장치 |
US8463587B2 (en) * | 2009-07-28 | 2013-06-11 | Synopsys, Inc. | Hierarchical order ranked simulation of electronic circuits |
US8769360B2 (en) * | 2010-10-14 | 2014-07-01 | International Business Machines Corporation | Dynamic detection and identification of the functional state of multi-processor cores |
US9304163B2 (en) * | 2013-11-07 | 2016-04-05 | Qualcomm Incorporated | Methodology for testing integrated circuits |
US9990455B1 (en) * | 2017-12-13 | 2018-06-05 | Tactotek Oy | Arrangement and method for facilitating electronics design in connection with 3D structures |
US11113444B2 (en) * | 2018-06-27 | 2021-09-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Machine-learning based scan design enablement platform |
KR102565184B1 (ko) * | 2018-07-09 | 2023-08-08 | 에스케이하이닉스 주식회사 | 디지털 회로를 모델링하는 회로 모듈 및 이를 포함하는 시뮬레이션 장치 |
-
2021
- 2021-07-08 CN CN202180049023.XA patent/CN115803640A/zh active Pending
- 2021-07-08 US US17/370,930 patent/US20220012394A1/en active Pending
- 2021-07-08 US US17/370,976 patent/US11520966B2/en active Active
- 2021-07-08 WO PCT/US2021/040965 patent/WO2022011192A1/en active Application Filing
- 2021-07-08 CN CN202180049130.2A patent/CN115843466A/zh active Pending
- 2021-07-08 DE DE112021003675.0T patent/DE112021003675T5/de active Pending
- 2021-07-08 JP JP2023501454A patent/JP2023535138A/ja active Pending
- 2021-07-08 DE DE112021003677.7T patent/DE112021003677T5/de active Pending
- 2021-07-08 CN CN202180049025.9A patent/CN115803642A/zh active Pending
- 2021-07-08 JP JP2023501452A patent/JP2023534200A/ja active Pending
- 2021-07-08 WO PCT/US2021/040963 patent/WO2022011190A1/en active Application Filing
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6996068B1 (en) * | 2000-03-31 | 2006-02-07 | Intel Corporation | Audio testing in a packet switched network |
US20020120922A1 (en) * | 2000-12-05 | 2002-08-29 | International Business Machines Corporation | Embedded hardware description language instrumentation |
US20020129326A1 (en) * | 2001-03-08 | 2002-09-12 | Nuber Paul D. | Method for inserting repeaters in hierarchical chip design |
US20040025136A1 (en) * | 2002-07-30 | 2004-02-05 | Carelli John A. | Method for designing a custom ASIC library |
US20050024057A1 (en) * | 2003-06-20 | 2005-02-03 | Romain Desplats | Methods of using measured time resolved photon emission data and simulated time resolved photon emission data for fault localization |
US20170147736A1 (en) * | 2015-11-19 | 2017-05-25 | International Business Machines Corporation | Automated scan chain diagnostics using emission |
US20180365370A1 (en) * | 2017-06-18 | 2018-12-20 | Coventor, Inc. | System and method for key parameter identification, process model calibration and variability analysis in a virtual semiconductor device fabrication environment |
US20220221411A1 (en) * | 2019-05-31 | 2022-07-14 | Hamamatsu Photonics K.K. | Semiconductor apparatus examination method and semiconductor apparatus examination apparatus |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114510902A (zh) * | 2022-04-20 | 2022-05-17 | 北京芯愿景软件技术股份有限公司 | 仿真结果的验证方法、装置、设备及计算机存储介质 |
Also Published As
Publication number | Publication date |
---|---|
DE112021003675T5 (de) | 2023-05-04 |
CN115803642A (zh) | 2023-03-14 |
US20220012397A1 (en) | 2022-01-13 |
JP2023534200A (ja) | 2023-08-08 |
JP2023535138A (ja) | 2023-08-16 |
WO2022011192A1 (en) | 2022-01-13 |
CN115803640A (zh) | 2023-03-14 |
US11520966B2 (en) | 2022-12-06 |
WO2022011190A1 (en) | 2022-01-13 |
CN115843466A (zh) | 2023-03-24 |
DE112021003677T5 (de) | 2023-05-04 |
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Owner name: TEKTRONIX, INC, OREGON Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:BURGESS, DAVID EVERETT;REEL/FRAME:056819/0383 Effective date: 20210707 |
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