US20210013075A1 - Substrate carrier and diffusion module thereof - Google Patents

Substrate carrier and diffusion module thereof Download PDF

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Publication number
US20210013075A1
US20210013075A1 US16/594,066 US201916594066A US2021013075A1 US 20210013075 A1 US20210013075 A1 US 20210013075A1 US 201916594066 A US201916594066 A US 201916594066A US 2021013075 A1 US2021013075 A1 US 2021013075A1
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Prior art keywords
air
cover
airtight
air diffusion
layer
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US16/594,066
Inventor
Ming-Chien Chiu
Chih-Ming Lin
Po-Ting Lee
Yu-Chen Chu
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Gudeng Precision Industrial Co Ltd
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Gudeng Precision Industrial Co Ltd
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Assigned to GUDENG PRECISION INDUSTRIAL CO., LTD. reassignment GUDENG PRECISION INDUSTRIAL CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHIU, MING-CHIEN, CHU, YU-CHEN, LEE, PO-TING, LIN, CHIH-MING
Publication of US20210013075A1 publication Critical patent/US20210013075A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67373—Closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67376—Closed carriers characterised by sealing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover

Definitions

  • the present invention relates to a semiconductor substrate carrier and diffusion module thereof, and more particularly, to a substrate carrier and its air diffusion module for achieving clean effect by uniform flow gas in air chamber of the substrate carrier.
  • Substrate and reticle are indispensable parts in semiconductor technology. Since the semiconductor structure is essentially a highly precise structure, the requirement for cleanliness in the manufacturing process per se are extremely fulfilled.
  • Substrate plays an important role in being a base material for all semiconductor components. It includes common silicon substrate (such as wafer), glass substrate, ceramic substrate and even sapphire substrate. In the final microstructure produced by semiconductor fabrication are micron or even nano-scale structure, the manufacturing processes need to be operated under extremely precise environment, without any small particles attached, otherwise the yield of the final semiconductor components will be reduced.
  • Carriers used for transporting components required for semiconductor manufacturing are required to have strict air tightness in order to prevent small particles from attaching to these components during loading or storage, thereby affecting the yield of semiconductor products.
  • purely air-tight means that it can only passively prevent small particles from entering, but unable to actively exclude small particles which have been previously attached to base materials such as substrate or reticle. Therefore, most semiconductor containers carrying such materials will cooperate with the use of clean system to actively decrease the possible risk of small particles.
  • the present invention discloses a substrate carrier and its air diffusion module.
  • the air diffusion module comprises a cover, at least one air intake part, an airtight layer, an air diffusion layer and a bearing portion.
  • the at least one air intake part is connected with the cover.
  • the airtight layer is connected with the cover and the at least one intake part.
  • the air diffusion layer is covered by the cover through the airtight layer.
  • the bearing portion is covered by the cover, the at least one intake part and the air diffusion layer.
  • the bearing portion can be configured on a semiconductor container.
  • the present invention proposes substrate carrier comprising a case, a door, at least one air intake and an air diffusion module.
  • the case is provided with an opening, and the door is covered with the opening.
  • the air diffusion module comprises a cover, at least one air intake part, an airtight layer, an air diffusion layer and a bearing portion.
  • the at least one air intake part is connected with the cover and said at least one air intake.
  • the airtight layer is connected with the cover and the at least one intake part.
  • the air diffusion layer is covered by the cover through the airtight layer.
  • the bearing portion is simultaneously covered by the cover, the at least one intake part and the air diffusion layer. The bearing portion is configured on the case.
  • FIG. 1 illustrates a schematic diagram of the structure of an embodiment of the invention.
  • FIG. 2 illustrates a system architecture diagram of the inner structure of the outer cover in an embodiment of the invention.
  • FIG. 3 illustrates a schematic diagram of a sagittal section of an embodiment of the invention.
  • FIG. 1 illustrates a schematic diagram of the structure of the embodiment of the present invention
  • FIG. 2 shows a schematic diagram of the inner structure of the outer cover of the embodiment of the present invention
  • a container 200 engaged with an air diffusion module 10 is provided.
  • the container 200 is a substrate carrier, and further, a front opening unified pod (FOUP).
  • FOUP front opening unified pod
  • the container 200 that can be used in the embodiment of the present invention is not limited to this. Any container 200 that needs to be cleaned by intaking gas should be included in the scope of the present invention.
  • the air diffusion module 10 includes an outer cover 101 , at least one air intake part 102 , an airtight layer 103 , an air diffusion layer 104 and a bearing portion 105 .
  • the at least one air intake part 102 is connected with the outer cover 101 .
  • the at least one air intake part 102 is configured on the bottom of the outer cover 101 and bent to the container 200 .
  • a plurality of first locking part 106 is arranged on the outer cover 101 .
  • the container 200 and the bearing portion 105 correspond to the plurality of first locking part 106 and a plurality of second locking part 107 , respectively.
  • the at least air intake part 102 , the airtight layer 103 and the air diffusion layer 104 are able to be integrated and fixed to (on) the bearing portion 105 of the container 200 by the outer cover 101 . That is, the bearing portion 105 is simultaneously or sequentially tightly covered (close-fitting) by the outer cover 101 , the at least one intake part 102 and the air diffusion layer 104 .
  • the airtight layer 103 is connected with the outer cover 101 and the at least one intake part 102 . Furthermore, the airtight layer 103 needs to be designed in conjunction with the shape of the outer cover 101 and the at least one intake part 102 to reach the purpose of airtight. As shown in the embodiment of FIG. 1 , the airtight layer 103 in this embodiment is composed of an outer airtight part 108 , a plurality of airtight locking part 109 , an inner airtight part 110 and at least one intake airtight part 111 . The plurality of airtight locking part 109 are arranged on the outer airtight part 108 , which can enhance the air tightness of the joint between the first locking part 106 and the second locking part 107 .
  • the inner airtight part 110 is connected with the outer airtight part 108 to form a dual air-tight structure relative to the external environment.
  • the number and configuration of the at least one intake airtight part 111 correspond to the at least one intake part 102 and the at least one intake part 111 is connected with the outer airtight part 108 to form an air tightness defense. In this way, the airtight environment during the operation of the present embodiment can be substantially ensured and moderate air pressure control can be achieved.
  • the air diffusion layer 104 is tightly covered by the outer cover 101 through the airtight layer 103 .
  • a filter material is selected for the air diffusion layer 104 .
  • it can be made of sintered polymer or other porous materials.
  • the main function of the air diffusion layer 104 in this example is to maintain pressure and stabilize air pressure. After the pressure in the air chamber rises to a certain extent, the clean gas is blown uniformly and steadily through the filter material to achieve the effect of cleaning the inner part of the container 200 .
  • the combined structural schematic diagram of the outer cover 101 and the at least one intake part 102 is clearly shown in FIG. 2 .
  • the intake part 102 of the present embodiment is configured with at least one alignment part 112 .
  • the intake portion 102 can be accurately fixed to the bearing portion 105 through the setting of the at least alignment part 112 .
  • FIG. 3 it illustrates a sagittal section diagram of an embodiment of the present invention.
  • FIG. 3 shows a schematic diagram of the structure profile of the substrate carrier of the container 200 in operation.
  • the substrate carrier comprises a case 204 , a door 202 , at least one air intake 203 and an air diffusion module 10 .
  • the case 204 is provided with an opening 201 , and the door 202 is covered with the opening 201 .
  • the at least one air intake 203 is located at the bottom of the case 204 .
  • the air diffusion module 10 is applied the structure described in the embodiment of FIG. 1-2 , which comprises an outer cover 101 , at least one air intake part 102 , an air-tight layer 103 , an air diffusion layer 104 and a bearing portion 105 .
  • the at least one air intake part 102 is connected with the outer cover 101
  • the air-tight layer 103 is connected with the outer cover 101 and the at least one air intake part 102 .
  • the air diffusion layer 104 is tightly covered with the outer cover 101 through the airtight layer 103 , while the bearing portion 105 is tightly connected with the outer cover 101 , the at least one air intake part 102 and the air diffusion layer 104 .
  • the bearing portion 105 is arranged on the case 204 .
  • the air intake part 102 can be connected with the air intake 203 , and the clean gas collected through the air intake 203 can be further entered into the air intake part 102 .
  • the clean gas can enter the air chamber constructed by the outer cover 101 and the air diffusion layer 104 .
  • the pressure of clean gas is raised to the preset threshold, it is blown evenly to the case 204 to achieve the effect of gas diffusion cleanliness.

Abstract

This invention proposes a substrate carrier and an air diffusion module thereof. The air diffusion module comprises a cover, at least one air inlet, an airtight layer, an air diffusion layer and an engaging portion. The at least one air inlet is connected with the cover, and the airtight layer is connected with the cover and the at least one air inlet. Furthermore, the air diffusion layer is connected with the cover via the airtight layer, and the engaging portion engages and tightly connected with the cover, the at least one air inlet and the air diffusion layer. The engaging portion is configured on the substrate carrier as a semiconductor container.

Description

    TECHNICAL FIELD
  • The present invention relates to a semiconductor substrate carrier and diffusion module thereof, and more particularly, to a substrate carrier and its air diffusion module for achieving clean effect by uniform flow gas in air chamber of the substrate carrier.
    • BACKGROUND OF RELATED ARTS
  • Substrate and reticle are indispensable parts in semiconductor technology. Since the semiconductor structure is essentially a highly precise structure, the requirement for cleanliness in the manufacturing process per se are extremely fulfilled.
  • Substrate plays an important role in being a base material for all semiconductor components. It includes common silicon substrate (such as wafer), glass substrate, ceramic substrate and even sapphire substrate. In the final microstructure produced by semiconductor fabrication are micron or even nano-scale structure, the manufacturing processes need to be operated under extremely precise environment, without any small particles attached, otherwise the yield of the final semiconductor components will be reduced.
  • Carriers used for transporting components required for semiconductor manufacturing are required to have strict air tightness in order to prevent small particles from attaching to these components during loading or storage, thereby affecting the yield of semiconductor products. However, purely air-tight means that it can only passively prevent small particles from entering, but unable to actively exclude small particles which have been previously attached to base materials such as substrate or reticle. Therefore, most semiconductor containers carrying such materials will cooperate with the use of clean system to actively decrease the possible risk of small particles.
  • In traditional technology, gas flowing in most semiconductor containers is achieved through the intake and outlet. With the intake and outlet of Extreme Clean Dry Air (XCDA), the previously attached particles are removed. Although it is feasible to control the gas flowing through the valve on the semiconductor container, there is still a risk that the gas cannot be completely cleaned b just by uniformly blown on the semiconductor material such as the substrate or reticle.
  • In fact, the development of technology creates installing diffusion device with tubular or perforated structures in the semiconductor container. However, since most semiconductor containers already have a unified standard specification, most of the diffusion mechanisms that need to be installed inside the semiconductor containers need to be specially designed to avoid the bearing area of substrate or reticle. The design of the inner part of the semiconductor container also makes the replacement more inconvenient.
    • SUMMARY
  • To resolve the drawbacks of the prior arts, the present invention discloses a substrate carrier and its air diffusion module.
  • The air diffusion module comprises a cover, at least one air intake part, an airtight layer, an air diffusion layer and a bearing portion. The at least one air intake part is connected with the cover. The airtight layer is connected with the cover and the at least one intake part. The air diffusion layer is covered by the cover through the airtight layer. The bearing portion is covered by the cover, the at least one intake part and the air diffusion layer. The bearing portion can be configured on a semiconductor container.
  • According an aspect, the present invention proposes substrate carrier comprising a case, a door, at least one air intake and an air diffusion module.
  • The case is provided with an opening, and the door is covered with the opening. The air diffusion module comprises a cover, at least one air intake part, an airtight layer, an air diffusion layer and a bearing portion. The at least one air intake part is connected with the cover and said at least one air intake. The airtight layer is connected with the cover and the at least one intake part. The air diffusion layer is covered by the cover through the airtight layer. The bearing portion is simultaneously covered by the cover, the at least one intake part and the air diffusion layer. The bearing portion is configured on the case.
  • Embodiments of the invention are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings in which like reference numerals refer to similar elements.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 illustrates a schematic diagram of the structure of an embodiment of the invention.
  • FIG. 2 illustrates a system architecture diagram of the inner structure of the outer cover in an embodiment of the invention.
  • FIG. 3 illustrates a schematic diagram of a sagittal section of an embodiment of the invention.
    •  DETAILED DESCRIPTION OF THE INVENTION
  • In order to understand the technical features and practical efficacy of the present invention and to implement it in accordance with the contents of the specification, hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
  • Referring to FIG. 1 and FIG. 2, FIG. 1 illustrates a schematic diagram of the structure of the embodiment of the present invention, and FIG. 2 shows a schematic diagram of the inner structure of the outer cover of the embodiment of the present invention. As shown in FIG. 1, a container 200 engaged with an air diffusion module 10 is provided. In this embodiment, the container 200 is a substrate carrier, and further, a front opening unified pod (FOUP). Of course, the container 200 that can be used in the embodiment of the present invention is not limited to this. Any container 200 that needs to be cleaned by intaking gas should be included in the scope of the present invention.
  • In the embodiment of FIG. 1, it can be clearly seen that the air diffusion module 10 includes an outer cover 101, at least one air intake part 102, an airtight layer 103, an air diffusion layer 104 and a bearing portion 105. The at least one air intake part 102 is connected with the outer cover 101. In the present embodiment, the at least one air intake part 102 is configured on the bottom of the outer cover 101 and bent to the container 200. In the present embodiment, a plurality of first locking part 106 is arranged on the outer cover 101. The container 200 and the bearing portion 105 correspond to the plurality of first locking part 106 and a plurality of second locking part 107, respectively.
  • Through this structure of this embodiment, the at least air intake part 102, the airtight layer 103 and the air diffusion layer 104 are able to be integrated and fixed to (on) the bearing portion 105 of the container 200 by the outer cover 101. That is, the bearing portion 105 is simultaneously or sequentially tightly covered (close-fitting) by the outer cover 101, the at least one intake part 102 and the air diffusion layer 104.
  • The airtight layer 103 is connected with the outer cover 101 and the at least one intake part 102. Furthermore, the airtight layer 103 needs to be designed in conjunction with the shape of the outer cover 101 and the at least one intake part 102 to reach the purpose of airtight. As shown in the embodiment of FIG. 1, the airtight layer 103 in this embodiment is composed of an outer airtight part 108, a plurality of airtight locking part 109, an inner airtight part 110 and at least one intake airtight part 111. The plurality of airtight locking part 109 are arranged on the outer airtight part 108, which can enhance the air tightness of the joint between the first locking part 106 and the second locking part 107.
  • The inner airtight part 110 is connected with the outer airtight part 108 to form a dual air-tight structure relative to the external environment. The number and configuration of the at least one intake airtight part 111 correspond to the at least one intake part 102 and the at least one intake part 111 is connected with the outer airtight part 108 to form an air tightness defense. In this way, the airtight environment during the operation of the present embodiment can be substantially ensured and moderate air pressure control can be achieved.
  • The air diffusion layer 104 is tightly covered by the outer cover 101 through the airtight layer 103. In this embodiment, a filter material is selected for the air diffusion layer 104. Furthermore, it can be made of sintered polymer or other porous materials. The main function of the air diffusion layer 104 in this example is to maintain pressure and stabilize air pressure. After the pressure in the air chamber rises to a certain extent, the clean gas is blown uniformly and steadily through the filter material to achieve the effect of cleaning the inner part of the container 200.
  • As shown in FIG. 2, the combined structural schematic diagram of the outer cover 101 and the at least one intake part 102 is clearly shown in FIG. 2. Because the outer cover 101 and the intake part 102 must be fixed to the bearing part 105 of the container 200, in order to ensure that the intake part 102 can accurately engage with the bearing portion 105, the intake part 102 of the present embodiment is configured with at least one alignment part 112. The intake portion 102 can be accurately fixed to the bearing portion 105 through the setting of the at least alignment part 112.
  • Please refer to FIG. 3, it illustrates a sagittal section diagram of an embodiment of the present invention. As shown in FIG. 3, it shows a schematic diagram of the structure profile of the substrate carrier of the container 200 in operation. The substrate carrier comprises a case 204, a door 202, at least one air intake 203 and an air diffusion module 10.
  • The case 204 is provided with an opening 201, and the door 202 is covered with the opening 201. The at least one air intake 203 is located at the bottom of the case 204. The air diffusion module 10 is applied the structure described in the embodiment of FIG. 1-2, which comprises an outer cover 101, at least one air intake part 102, an air-tight layer 103, an air diffusion layer 104 and a bearing portion 105. The at least one air intake part 102 is connected with the outer cover 101, and the air-tight layer 103 is connected with the outer cover 101 and the at least one air intake part 102. The air diffusion layer 104 is tightly covered with the outer cover 101 through the airtight layer 103, while the bearing portion 105 is tightly connected with the outer cover 101, the at least one air intake part 102 and the air diffusion layer 104. The bearing portion 105 is arranged on the case 204.
  • From the embodiment of FIG. 3, obviously, the air intake part 102 can be connected with the air intake 203, and the clean gas collected through the air intake 203 can be further entered into the air intake part 102. Under the protection of the double air-tight structure of the air-tight layer 103, the clean gas can enter the air chamber constructed by the outer cover 101 and the air diffusion layer 104. When the pressure of clean gas is raised to the preset threshold, it is blown evenly to the case 204 to achieve the effect of gas diffusion cleanliness.
  • As is understood by a person skilled in the art, the foregoing preferred embodiments of the present invention are illustrated of the present invention rather than limiting of the present invention. It is intended to cover various modifications and similar arrangements included within the spirit and scope of the appended claims, the scope of which should be accorded the broadest interpretation so as to encompass all such modifications and similar structure. While the preferred embodiment of the invention has been illustrated and described, it will be appreciated that various changes can be made therein without departing from the spirit and scope of the invention.

Claims (10)

What is claimed is:
1. An air diffusion module, comprising:
a cover;
at least one air intake part connected with said cover;
an airtight layer connected with said cover and said at least one intake part;
an air diffusion layer covered by said cover through said airtight layer; and
a bearing portion covered by said cover, said at least one intake part and said air diffusion layer;
wherein said bearing portion is configured on a container.
2. The air diffusion module of claim 1, wherein said cover is configured with a plurality of first locking part.
3. The air diffusion module of claim 2, wherein said bearing portion is configured with a plurality of second locking part corresponding to said plurality of first locking part.
4. The air diffusion module of claim 1, wherein said airtight layer comprises:
an outer airtight part;
a plurality of airtight locking part arranged on said outer airtight part;
an inner airtight part connected with said outer airtight part; and
at least one intake airtight part connected with said outer airtight part.
5. The air diffusion module of claim 1, wherein said at least one intake part is configured with at least one alignment part.
6. The air diffusion module of claim 1, wherein said air diffusion layer is made of a filter material.
7. The air diffusion module of claim 1, wherein said container is a front opening unified pod.
8. A substrate carrier, comprising:
a case provided with an opening;
a door covered with said opening;
at least one air intake located at a bottom of said case;
an air diffusion module which comprises:
a cover;
at least one air intake part connected with said cover and said at least one air intake;
an airtight layer connected with said cover and said at least one intake part;
an air diffusion layer covered by said cover through said airtight layer; and
a bearing portion covered by said cover, said at least one intake part and said air diffusion layer, wherein said bearing portion is configured on said case.
9. The substrate carrier of claim 8, wherein said cover is configured with a plurality of first locking part, and wherein said bearing portion is configured with a plurality of second locking part corresponding to said plurality of first locking part.
10. The substrate carrier of claim 8, wherein said substrate carrier is a front opening unified pod.
US16/594,066 2019-07-13 2019-10-06 Substrate carrier and diffusion module thereof Abandoned US20210013075A1 (en)

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KR102396244B1 (en) 2022-05-09
TWI727795B (en) 2021-05-11
CN112289719A (en) 2021-01-29
JP2021015979A (en) 2021-02-12
US11508594B2 (en) 2022-11-22
SG10202006027VA (en) 2021-02-25
CN112289718A (en) 2021-01-29
KR20210008460A (en) 2021-01-22
US20210013076A1 (en) 2021-01-14
TW202102416A (en) 2021-01-16
JP7024159B2 (en) 2022-02-24

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