US20200373073A1 - Wireless charging module and manufacturing method thereof - Google Patents

Wireless charging module and manufacturing method thereof Download PDF

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Publication number
US20200373073A1
US20200373073A1 US15/930,139 US202015930139A US2020373073A1 US 20200373073 A1 US20200373073 A1 US 20200373073A1 US 202015930139 A US202015930139 A US 202015930139A US 2020373073 A1 US2020373073 A1 US 2020373073A1
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United States
Prior art keywords
heat dissipating
coil
dissipating layer
magnetic shield
shield part
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Abandoned
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US15/930,139
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English (en)
Inventor
Hong Zhang
Chengliang Zhang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunshan Liantao Electronics Co Ltd
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Kunshan Liantao Electronics Co Ltd
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Assigned to KUNSHAN LIANTAO ELECTRONIC CO., LTD reassignment KUNSHAN LIANTAO ELECTRONIC CO., LTD ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ZHANG, CHENGLIANG, ZHANG, HONG
Publication of US20200373073A1 publication Critical patent/US20200373073A1/en
Priority to US17/975,020 priority Critical patent/US20230047913A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F38/00—Adaptations of transformers or inductances for specific applications or functions
    • H01F38/14—Inductive couplings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/08—Cooling; Ventilating
    • H01F27/22—Cooling by heat conduction through solid or powdered fillings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2876—Cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H01F27/36—Electric or magnetic shields or screens
    • H01F27/365—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H01F27/36—Electric or magnetic shields or screens
    • H01F27/366—Electric or magnetic shields or screens made of ferromagnetic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/005—Mechanical details of housing or structure aiming to accommodate the power transfer means, e.g. mechanical integration of coils, antennas or transducers into emitting or receiving devices
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/02—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries for charging batteries from ac mains by converters

Definitions

  • the present disclosure relates to the technical field of charging apparatus, particularly to a wireless charging module and manufacturing method thereof.
  • Wireless charging also known as inductive charging or non-contact charging, is a charging technology derived from wireless power transfer technology.
  • the coil generates heat when the current is passing through, and produces a large amount of heat in a narrow and sealed space of an apparatus, resulting in decreasing of the charging efficiency, working efficiency and service life of electronic device.
  • the conventional wireless charging module bonds one side of the coil and the spacer, and attaches the other side of the coil with an ordinary film.
  • the ordinary film has low thermal conductivity and large thermal resistance, and it is difficult to completely discharge the air on the interface during the process of attaching the non-flat coil with the spacer.
  • the thermal resistance of the air with low thermal conductivity is large, so the heat transfer efficiency is low.
  • the embodiments of the present disclosure provide a wireless charging module and manufacturing method thereof to solve the problems of poor heat dissipating of ordinary film in the prior art.
  • a wireless charging module which comprises a magnetic shield part, a coil and a first heat dissipating layer.
  • the coil is disposed on the magnetic shield part, and the first heat dissipating layer is disposed on the surface of the coil away from the magnetic shield part.
  • the manufacturing method comprises forming the first heat dissipating layer on the surface of the coil and securing the magnetic shield part to the surface of the coil away from the first heat dissipating layer.
  • the first heat dissipating layer can completely cover the coil.
  • the first heat dissipating layer with excellent radiation heat dissipation capability is helpful for heat dissipating of the coil, and the thickness of the first heat dissipating layer is controllable so an effective and stable heat dissipating performance can be provided without increasing the thickness and cost of the wireless charging module.
  • FIG. 1 is a schematic diagram of the first embodiment of the wireless charging module of the present disclosure
  • FIG. 2 is a manufacturing flow chart of the first embodiment of the wireless charging module of the present disclosure
  • FIG. 3 is a schematic diagram of the second embodiment of the wireless charging module of the present disclosure.
  • FIG. 4 is a manufacturing flow chart of the second embodiment of the wireless charging module of the present disclosure.
  • FIG. 5 is a schematic diagram of the third embodiment of the wireless charging module of the present disclosure.
  • FIG. 6 is a manufacturing flow chart of the third embodiment of the wireless charging module of the present disclosure.
  • FIG. 7 is a schematic diagram of the fourth embodiment of the wireless charging module of the present disclosure.
  • FIG. 8 is a schematic diagram of the fifth embodiment of the wireless charging module of the present disclosure.
  • FIG. 9 is a schematic diagram of the sixth embodiment of the wireless charging module of the present disclosure.
  • FIG. 10 is a schematic diagram of the seventh embodiment of the wireless charging module of the present disclosure.
  • the terms “include”, “contain”, and any variation thereof are intended to cover a non-exclusive inclusion. Therefore, a process, method, object, or device that includes a series of elements not only includes these elements, but also includes other elements not specified expressly, or may include inherent elements of the process, method, object, or device. If no more limitations are made, an element limited by “include a/an . . . ” does not exclude other same elements existing in the process, the method, the article, or the device which includes the element.
  • FIG. 1 is a schematic diagram of the first embodiment of the wireless charging module of the present disclosure.
  • a wireless charging module 1 of the present embodiment is applied for wireless charging technology.
  • the wireless charging module 1 of the present disclosure can be used for a charging device of a charging end (i.e., a transmitting end) or an electronic device of an end to be charged (i.e., a receiving end), and the wireless charging module 1 of the charging device delivers energy to the wireless charging module 1 of the electronic device through inductive coupling to charge the electronic device.
  • the wireless charging module 1 comprises a magnetic shield part 11 , a coil 13 and a first heat dissipating layer 15 .
  • the coil 13 has a first surface 131 and a second surface 133 opposite to the first surface 131 .
  • the magnetic shield part 11 is disposed on the first surface 131 of the coil 13
  • the first heat dissipating layer 15 is disposed on the second surface 133 of the coil 13
  • the second surface 133 is away from the magnetic shield part 11 .
  • the first heat dissipating layer 15 can be completely attached to the second surface 133 of the coil 13
  • the first heat dissipating layer 15 having fine radiation heat dissipation capability is able to provide effective heat dissipation for the coil 13 .
  • the thermal conductivity coefficient of the first heat dissipating layer is between 0.5 to 2000 W/m ⁇ K and the radiation coefficient of the first heat dissipating layer is between 0.90 and 0.95. In some embodiment, the thermal conductivity coefficient of the first heat dissipating layer is between 50 to 2000 W/m ⁇ K.
  • the thickness of the first heat dissipating layer 15 affects the overall thickness and heat dissipation of the wireless charging module 1 , and the thickness of the first heat dissipating layer 15 can be adjusted according to the requirements of the user. In the present embodiment, the first heat dissipating layer 15 has a thickness of 5 to 20 um.
  • the coil 13 is generally made of copper, and the coil 13 is flat wound and attached to the surface of the magnetic shield part 11 .
  • the magnetic shield part 11 can be a hard magnetic plate and a soft magnetic plate.
  • the hard magnetic plate is a ferrite sheet sintered at a high temperature, has a high magnetic permeability, and is suitable for the emitting end.
  • the manufacture of the soft magnetic plate starts with adding the alloy magnetic powder to the plastic or rubber and is followed by a forming processing.
  • the soft magnetic plate can be punched into desired shapes and sizes according to the wireless charging schemes and can be customized according to user requirements.
  • the soft magnetic plate is suitable for the receiving end.
  • the coil 13 and the magnetic shield part 11 are bonded to each other by the first adhesive member 17 .
  • the first adhesive member 17 is a double-sided tape 171 in the present embodiment.
  • the step S 1 is first performed to form a first heat dissipating layer 15 on the surface of the coil 13 , wherein the first heat dissipating layer 15 is formed on the coil 13 by spraying, coating, or physical vapor deposition (PVD), so that the first heat dissipating layer 15 can be completely attached to the coil 13 .
  • the first heat dissipating layer 15 is formed on the coil 13 by evaporation or sputtering.
  • the step S 3 is then performed to secure the magnetic shield part 11 to the surface of the coil 13 away from the first heat dissipating layer 15 , wherein the first adhesive member 17 is formed on the surface of the coil 13 away from the first heat dissipating layer 15 , and the magnetic shield part 11 is attached to the first adhesive member 17 .
  • a wireless charging module 1 is provided in the present embodiment, which can be used for a charging end (i.e., a transmitting end) and an end to be charged (i.e., a receiving end).
  • the wireless charging module 1 can perform conductive heat dissipation by attaching the heat dissipating layer 15 to the surface of the coil 13 .
  • the thermal energy generated by the coil 13 can be dissipated from the first heat dissipating layer 15 to the outside to prevent the heat energy generated by the coil 13 from accumulating in the wireless charging module 1 .
  • the external heat transfer efficiency of the coil 13 is therefore improved.
  • FIG. 3 is a schematic diagram of the second embodiment of the wireless charging module of the present disclosure.
  • the difference between the present embodiment and the first embodiment is that the wireless charging module of the second embodiment further comprises a second heat dissipating layer 19 .
  • the second heat dissipating layer 19 is disposed on the surface of the magnetic shield part 11 away from the coil 13 , that is, the second heat dissipating layer 19 and the coil 13 are respectively located on opposite sides of the magnetic shield part 11 .
  • the second heat dissipating layer 19 is a heat dissipating component, e.g. heat sink or a heat dissipating fin, made of metal materials with excellent thermal conductivity such as copper or silver.
  • the second heat dissipating layer 19 is bonded to the magnetic shield part 11 by a second adhesive member 21 to secure the second heat dissipating layer 19 onto the magnetic shield part 11 .
  • the second adhesive member 21 is a double-sided tape 211 .
  • the second heat dissipating layer 19 onto one side surface of the magnetic shield part 11 helps the heat of the magnetic shield part 11 from the coil 13 to dissipate from the second heat dissipating layer 19 to the outside.
  • the thermal energy generated by the wireless charging module 1 of the present embodiment can be conducted from the first heat dissipating layer 15 to the outside, and can also be conducted from the second heat dissipating layer 19 to the outside at the same time, thereby improving the overall heat dissipation.
  • FIG. 4 is a manufacturing flow chart of the second embodiment of the wireless charging module of the present disclosure.
  • the steps S 1 and S 3 are first performed as FIG. 2 .
  • a step S 31 of the second embodiment is performed to form a second heat dissipating layer 19 on the surface of the magnetic shield part 11 away from the coil 13 .
  • the second heat dissipating layer 19 is disposed on the surface of the magnetic shield part 11 away from the coil 13 by the second adhesive member 21 .
  • the second adhesive member 21 is formed on the surface of the magnetic shield part 11 away from the coil 13 , and the second heat dissipating layer 19 is attached to the second adhesive member 21 .
  • FIG. 5 is a schematic diagram of the third embodiment of the wireless charging module of the present disclosure.
  • the wireless charging module of the third embodiment further comprises a second heat dissipating layer 23 .
  • the second heat dissipating layer 23 is disposed on the surface of the magnetic shield part 11 away from the coil 13 .
  • the material and the functional effects of the second heat dissipating layer 23 are the same as those of the first heat dissipating layer 15 , and therefore will not be described again.
  • the present embodiment differs from the second embodiment, in that the second adhesive member 21 is omitted, and the heat of the magnetic shield part 11 is more effectively dissipated by the second heat dissipating layer 23 directly contacting the magnetic shield part 11 .
  • FIG. 6 is a manufacturing flow chart of the third embodiment of the wireless charging module of the present disclosure.
  • the steps S 1 and S 3 are the same as the aforementioned description
  • a step S 33 of the third embodiment is further performed after the step S 3 to form a second heat dissipating layer 19 on the surface of the magnetic shield part 11 away from the coil 13 , where the second heat dissipating layer 23 is disposed on the surface of the magnetic shield part 11 away from the coil 13 by spraying, coating, or physical vapor deposition.
  • the second heat dissipating layer 23 is disposed on the surface of the magnetic shield part 11 away from the coil 13 by evaporation or sputtering.
  • FIG. 7 is a schematic diagram of a schematic diagram of the fourth embodiment of the wireless charging module of the present disclosure.
  • the difference between the present embodiment and the first embodiment is that the first adhesive member 17 of the fourth embodiment is a thermal conductive film 173 or a thermal paste.
  • the thermal paste is made of a thermosetting reactive thermal paste material such as moisture curing type thermal silicone, and the above thermal conductive film 173 has the same effect as the thermal paste. Therefore, the thermal conductive film 173 will be described as example in the present embodiment.
  • the magnetic isolation member 11 is bonded to the coil 13 by the thermal conductive film 173 .
  • the first adhesive member 17 is a non-solid material that can be applied to the gap of the non-flat surface of the coil 13 to reduce the gap between the magnetic shield part 11 , the coil 13 and the first adhesive member 17 .
  • the gap can be filled by the first adhesive member 17 , and therefore there is no gap existing between the magnetic shield part 11 and the coil 13 creating an excellent thermal conductivity interface and reducing the interface thermal resistance by prevent air having a low thermal conductivity from being filled in the gap, which lowers the thermal conductivity between magnetic shield part 11 , the coil 13 and the first adhesive member 17 .
  • the thermosetting reactive thermal paste possesses high adhesion, high resistance to high and low temperature, and excellent reliability.
  • the first adhesive member 17 also forms an excellent thermal interface between the magnetic shield part 11 and the coil 13 , where the thermal conductive film 173 disposed in between the magnetic isolation member 11 and the coil 13 is used for heat dissipation, resulting an approximate 8% temperature reduction in average temperature of the coil 13 .
  • on one surface of the coil 13 is provided with a first heat dissipating layer 15 and on the other surface is provided with a second heat dissipating layer 19 .
  • the heat dissipating of the coil 13 by the two dissipating layers has an advantage of achieving a 14.7% temperature reduction, so that the average temperature of the coil 13 drops significantly by a 2 to 4° C.
  • FIG. 8 is a schematic diagram of the fifth embodiment of the wireless charging module of the present disclosure.
  • the difference between the present embodiment and the second embodiment is that the first adhesive member 17 of the embodiment is a thermal conductive film 173 having the same effect as that of the fourth embodiment, which is advantageous for the coil 13 for heat dissipating. Therefore, detailed description of the present embodiment will not be repeated.
  • the effect of the heat dissipating of the present embodiment exceeds that of the second embodiment.
  • FIG. 9 is a schematic diagram of the sixth embodiment of the wireless charging module of the present disclosure.
  • the difference between the present embodiment and the fifth embodiment is that the second adhesive member 21 of the embodiment is a thermal conductive film 213 or a thermal paste having the same effect as that of the fourth embodiment. Therefore, detailed description of the present embodiment will not be repeated.
  • the thermal conductive film 213 facilitates the connection and the heat dissipation of the magnetic separating part 11 and the second heat dissipating layer 19 .
  • the effect of the heat dissipating of the present embodiment exceeds that of the fifth embodiment.
  • FIG. 10 is a schematic diagram of the seventh embodiment of the wireless charging module of the present disclosure.
  • the difference between the present embodiment and the third embodiment is that the first adhesive member 17 of the embodiment is a thermal conductive film 173 having the same effect as that of the fourth embodiment, which is advantageous for the coil 13 for heat dissipating. Therefore, detailed description of the present embodiment will not be repeated.
  • the effect of the heat dissipating of the present embodiment exceeds that of the third embodiment.
  • the present disclosure further provides an electronic device in which a wireless charging module 1 is disposed for the function of charging with another wireless charging module 1 of another electronic device.
  • the wireless charging module 1 of another electronic device delivers energy to the wireless charging module 1 of the electronic device through inductive coupling to conduct charging.
  • the present disclosure discloses a wireless charging module and manufacturing method thereof.
  • the heat conduction and dissipation of the wireless charging module are directly conducted by the first heat dissipating layer attaching to the surface of the coil, and the first heat dissipating layer is capable of providing an effective heat dissipation to the coil.
  • the first adhesive member between the magnetic shield part and the coil is a thermal conductive film, which not only secures the magnetic shield part onto the coil, but also forms an excellent thermal interface between the magnetic shield part and the coil, so that heat can be dissipated from one side of the coil by the first heat dissipating layer and from the other side of the coil by the first adhesive member and the magnetic shield part, thereby the heat dissipation of the wireless charging module is effectively improved.
  • the wireless charging module of the present disclosure further comprises a second heat dissipating layer disposed on a surface of the magnetic shield part away from the coil, and the second heat dissipating layer is capable of enhancing the heat dissipation efficiency of the magnetic shield part.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Manufacturing & Machinery (AREA)
  • Charge And Discharge Circuits For Batteries Or The Like (AREA)
  • Regulation Of General Use Transformers (AREA)
  • Housings And Mounting Of Transformers (AREA)
  • Coils Of Transformers For General Uses (AREA)
US15/930,139 2019-05-23 2020-05-12 Wireless charging module and manufacturing method thereof Abandoned US20200373073A1 (en)

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US17/975,020 US20230047913A1 (en) 2019-05-23 2022-10-27 Manufacturing method of wireless charging module

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CN201910432430.3 2019-05-23
CN201910432430.3A CN110048515B (zh) 2019-05-23 2019-05-23 无线充电模组及其制作工艺

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CN110048515A (zh) 2019-07-23
JP6995926B2 (ja) 2022-01-17
CN110048515B (zh) 2023-11-28
US20230047913A1 (en) 2023-02-16

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