US20170285685A1 - Heat Dissipating Structures and Mobility Apparatus for Electronic Headset Frames - Google Patents

Heat Dissipating Structures and Mobility Apparatus for Electronic Headset Frames Download PDF

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Publication number
US20170285685A1
US20170285685A1 US15/479,026 US201715479026A US2017285685A1 US 20170285685 A1 US20170285685 A1 US 20170285685A1 US 201715479026 A US201715479026 A US 201715479026A US 2017285685 A1 US2017285685 A1 US 2017285685A1
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US
United States
Prior art keywords
headset
visual display
display
base
wearable display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US15/479,026
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English (en)
Inventor
Guy A. Mascaro
Mark Gamache
Matthew David Walsh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hodei Technology LLC
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=60000643&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=US20170285685(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Individual filed Critical Individual
Priority to US15/479,026 priority Critical patent/US20170285685A1/en
Priority to US15/704,922 priority patent/US10088867B2/en
Publication of US20170285685A1 publication Critical patent/US20170285685A1/en
Priority to US16/112,733 priority patent/US10317942B1/en
Assigned to HODEI TECHNOLOGY, LLC reassignment HODEI TECHNOLOGY, LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: Mascaro, Guy A., WALSH, MATTHEW KEVIN, GAMACHE, MARK
Priority to US16/434,848 priority patent/US10627862B1/en
Abandoned legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/163—Wearable computers, e.g. on a belt
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops

Definitions

  • the present disclosure relates to electronic devices including a frame configured to be worn on the head of a user.
  • Electronic headset frames such as Google® Glass Enterprise Edition visual display, serve as an optical display designed as a pair of glasses to be mounted to the head of a user. These electronic headset frames are capable of not only displaying images, but also recording the visuals of a user. These electronic headset frames may include an arm or “pod” which houses components such as the microprocessor, which are subject to overheating after a period of time due to the heat generated by electronic chips in the microprocessor which cause the device to either malfunction or shut off. Additionally, these electronic headset frames are currently provided via immobile eyeglasses which restrict the user's vertical field of view.
  • a wearable display includes a headset configured to be worn by a user and a visual display assembly including a support body supported by the headset and a visual display supported by the support body to be positioned forward of a user's eye wearing the headset.
  • the wearable display further includes an electrical component in communication with the visual display and a heat sink in thermal communication with the electrical component.
  • the heat sink includes a base positioned to receive heat from the electrical component and a plurality of heat fins in thermal communication with the base to dissipate heat from the electrical component into the environment.
  • a wearable display includes a headset configured to be worn by a user and a visual display assembly including a support body supported by the headset and a visual display supported by the support body to be positioned forward of a user's eye wearing the headset.
  • the wearable display further includes an adjustable support assembly coupling the support body to the headset in one of a plurality of positions.
  • FIG. 1 is an overall view of wearable display including a headset and a visual display positionable in a user's field of vision;
  • FIG. 2 is a perspective view of the visual display showing a heat sink coupled to the visual display;
  • FIG. 3 is a perspective view of the heatsink of FIG. 2 showing the heatsink including a plurality of heat fins and tab that provides a cradle;
  • FIG. 4 is an end view of the heat sink of FIG. 2 showing the cradle
  • FIG. 5 is a top plan view of the heat sink showing the heat sink including a plurality of connections in the tab to communicate with electrical components of the visual display;
  • FIG. 6 is a bottom view of the heat sink of FIG. 2 showing the tab including a micro USB port;
  • FIG. 7 is an elevation view of the heat sink of FIG. 2 ;
  • FIG. 8 is a top view of the clamping structure of the mobility apparatus including a view of the square hole;
  • FIG. 9 is a perspective view of an adjustable support assembly that couples the visual display to the headset.
  • FIG. 10 is another perspective view of the adjustable support assembly
  • FIG. 11 is an exploded view of the adjustable support assembly
  • FIG. 12 is a side elevation view of a base of the adjustable support assembly and a screw that clamps the visual display to the headset;
  • FIG. 13 is a bottom view of the base of FIG. 12 ;
  • FIG. 14 is a perspective view of the base of FIG. 12 ;
  • FIG. 15 is another perspective view of the base of FIG. 12 ;
  • FIG. 16 is an elevation view of the base of FIG. 16 .
  • a wearable display 10 includes a headset 12 positionable on a user's head (not shown) and visual display assembly 14 , also referred to as a glass pod 14 .
  • Glass pod 14 includes a support body 16 coupled to headset 12 that wraps around the side of a user's head to a position in front of the user's field of view.
  • Glass pod 14 further includes a visual display 18 supported by support body 16 positioned in the users field of view.
  • Visual display 18 is preferably transparent and configured to display images, data, etc. in the user's field of view.
  • Glass pod 14 is preferably a Google® Enterprise Edition visual display. Additional details of suitable visual display assemblies are provided in U.S. Pat. No. 8,493,204 and U.S.
  • other headset configurations may be provided, such as glasses and other headset configurations known to those of ordinary skill in the art.
  • Glass pod 14 is connected to headset 12 with an adjustable support assembly 20 .
  • Support assembly 20 allows a user to adjust the position of visual display 18 .
  • glass pod 14 can be rotated to be within the user's field of view; however, in other embodiments, glass pod 14 can be rotated to be inside and outside of the user's field of view or a multitude of other angles relative to the user's range of head motions, preferably within a 360 degree radius.
  • Glass pod 14 includes several electrical components that provide power, communications, processing, and otherwise support the features of glass pod 14 .
  • glass pod 14 includes a battery 22 positioned inside support body 16 , a microprocessor/CPU 24 , a camera 19 (shown extended from its normal position in FIG. 1 ), a touchpad (not shown), a speaker (not shown), and a microphone (not shown).
  • a battery 22 positioned inside support body 16
  • a microprocessor/CPU 24 a camera 19 (shown extended from its normal position in FIG. 1 ), a touchpad (not shown), a speaker (not shown), and a microphone (not shown).
  • a camera 19 shown extended from its normal position in FIG. 1
  • a touchpad not shown
  • a speaker not shown
  • a microphone not shown.
  • the electronic components may be partially or fully disabled to eliminate and/or reduce the heat generation.
  • a particular feature(s) of glass pod 14 may be disabled.
  • glass pod 14 is provide with a heat sink 26 as shown in FIG
  • heat sink 26 is coupled to an outer side of glass pod 14 , forward of a user's ear when worn by a user.
  • Heat sink 26 is positioned to receive heat from microprocessor 24 and to dissipate the heat away from microprocessor 24 and preferably away from the user.
  • heat sink 24 is made of aluminum.
  • heat sink 24 may be made of other metals and other materials having high thermal conductivity.
  • heat sink 26 includes a base 28 , a plurality of heat fins 30 , a communications tab 32 , an upper lip 34 , and a heat transfer extension 36 .
  • base 28 is contoured to match an outer profile of support assembly 20 .
  • base 28 is adhered to support assembly 20 with a thermally conductive adhesive.
  • Upper lip 34 is positioned on top of support assembly 20 and transitions from wider to narrower to match a thickness of support assembly 20 .
  • Upper lip 34 may also be adhered to support structure with thermally conductive adhesive.
  • the thermally conductive adhesive has a thermal conductivity greater than the thermal conductive of the material of support assembly 20 .
  • heat transfer extension 36 is substantially cylindrical and positioned in contact, preferably direct contact, with CPU 24 to facilitate the transfer of heat from CPU 24 to base 28 .
  • plastic support assembly 20 of pod 14 that protects CPU 24 is drilled to include a small hole (not shown) that receives extension 26 to contact CPU 24 .
  • the heat that comes from CPU 24 is then transferred to extension 22 and into base 28 , and then released through base 28 and primarily through heat fins 30 .
  • CPU 24 may also be connected to extension 22 by using a thermal adhesive.
  • heat fins 30 have approximately the same width. As shown in FIG. 7 , heat fins 30 have a length that varies with the counter of the lower edge of base 28 , which matches the counter of the underside of support assembly 20 .
  • heat sink 26 may also include tab/extension 32 that cradles and underside of support assembly 20 .
  • tab 32 includes a micro USB port 35 .
  • Micro USB 35 provides power and data connection points to pod 14 to external sources.
  • tab 32 includes a plurality of contacts/connections (female) 36 that align with electrical connection points (male) on support assembly 20 .
  • Tab 32 converts the existing power and data connection points of pod 14 to micro USB port 35 .
  • Micro USB 35 is connected to pod 14 by soldering the existing data connection points of pod 14 to data and power connection points 36 of tab 32 . With micro USB port 35 , pod 14 can be charged and communicate/transmit data simultaneously.
  • heat sink 26 is not provided.
  • heat transfer extension 36 is not provided and/or tab 32 is not provided.
  • wearable display 10 includes adjustable support assembly 20 .
  • Support assembly 20 includes a headset base 38 , a fastener 40 (see FIG. 11 ), a pod/visual display base 42 , a rubber O-ring 44 positioned between headset base 38 and pod base 42 , a clamp 46 , partially defined by pod base 42 , a screw 48 , and knob 50 .
  • Other than a portion of fastener 40 most of adjustable support assembly 20 is positioned externally of a headband 52 of headset 12 .
  • Fastener 40 includes a head 54 positioned on the interior of headband 52 and a shaft 56 that extends through headband 52 through a hole 58 in headband 52 .
  • headset base 38 includes a cylindrical bore 60 that receives a cylindrical portion 62 of shaft 56 .
  • O-ring 44 is positioned over shaft 56 .
  • Pod base 42 includes a square bore 64 that receives a square portion 66 of shaft 56 .
  • Knob 50 includes a threaded bore 68 that receives a threaded end 70 of shaft 56 .
  • Clamp 46 defines an opening 72 sized to receive support assembly 20 as shown in FIGS. 14 and 15 .
  • Screw 48 extending through clamp 46 into opening 72 and is tightened to secure pod 14 to pod base 42 and therefore headset 12 .
  • screw 48 may be loosened.
  • screw 48 is again tightened.
  • the direction of camera 19 can be adjusted so that camera 19 can be pointed at a locus of activity, such as a surgical site. The images captured by camera 19 can be transmitted to others for viewing and commentary, if necessary.
  • pod 14 with visual display 18 may be rotated about a horizontal axis of rotation relative to headset 12 .
  • a user at least partially unscrews knob 50 , which relieve compression placed on O-ring 44 and friction provided between headset base 38 and pod base 42 by O-ring 44 . By reducing this friction, it is easier/possible to rotate pod 12 relative to headset 12 .
  • knob 50 is tightened so that O-ring is compressed, creating friction to hold pod 14 in place. If O-ring 44 is decompressed enough, it is possible to apply enough force/torque to pod 14 to overcome the friction created by O-ring 44 without having to loosen knob 50 .

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Eyeglasses (AREA)
  • Helmets And Other Head Coverings (AREA)
US15/479,026 2016-04-04 2017-04-04 Heat Dissipating Structures and Mobility Apparatus for Electronic Headset Frames Abandoned US20170285685A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US15/479,026 US20170285685A1 (en) 2016-04-04 2017-04-04 Heat Dissipating Structures and Mobility Apparatus for Electronic Headset Frames
US15/704,922 US10088867B2 (en) 2016-04-04 2017-09-14 Heat dissipating structures and mobility apparatus for electronic headset frames
US16/112,733 US10317942B1 (en) 2016-04-04 2018-08-26 Heat dissipating structures and mobility apparatus for electronic headset frames
US16/434,848 US10627862B1 (en) 2016-04-04 2019-06-07 Heat dissipating structures and mobility apparatus for electronic headset frames

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662318141P 2016-04-04 2016-04-04
US201662318554P 2016-04-05 2016-04-05
US15/479,026 US20170285685A1 (en) 2016-04-04 2017-04-04 Heat Dissipating Structures and Mobility Apparatus for Electronic Headset Frames

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US15/704,922 Continuation US10088867B2 (en) 2016-04-04 2017-09-14 Heat dissipating structures and mobility apparatus for electronic headset frames

Publications (1)

Publication Number Publication Date
US20170285685A1 true US20170285685A1 (en) 2017-10-05

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ID=60000643

Family Applications (4)

Application Number Title Priority Date Filing Date
US15/479,026 Abandoned US20170285685A1 (en) 2016-04-04 2017-04-04 Heat Dissipating Structures and Mobility Apparatus for Electronic Headset Frames
US15/704,922 Expired - Fee Related US10088867B2 (en) 2016-04-04 2017-09-14 Heat dissipating structures and mobility apparatus for electronic headset frames
US16/112,733 Expired - Fee Related US10317942B1 (en) 2016-04-04 2018-08-26 Heat dissipating structures and mobility apparatus for electronic headset frames
US16/434,848 Expired - Fee Related US10627862B1 (en) 2016-04-04 2019-06-07 Heat dissipating structures and mobility apparatus for electronic headset frames

Family Applications After (3)

Application Number Title Priority Date Filing Date
US15/704,922 Expired - Fee Related US10088867B2 (en) 2016-04-04 2017-09-14 Heat dissipating structures and mobility apparatus for electronic headset frames
US16/112,733 Expired - Fee Related US10317942B1 (en) 2016-04-04 2018-08-26 Heat dissipating structures and mobility apparatus for electronic headset frames
US16/434,848 Expired - Fee Related US10627862B1 (en) 2016-04-04 2019-06-07 Heat dissipating structures and mobility apparatus for electronic headset frames

Country Status (6)

Country Link
US (4) US20170285685A1 (zh)
EP (1) EP3440530A4 (zh)
CN (1) CN109313472A (zh)
AU (1) AU2017246385A1 (zh)
CA (1) CA3019937A1 (zh)
WO (1) WO2017176771A1 (zh)

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CN106932905A (zh) 2017-02-27 2017-07-07 阿里巴巴集团控股有限公司 虚拟现实头戴设备
CN107967046B (zh) * 2017-11-16 2020-11-10 常州信息职业技术学院 一种电子通信设备用散热器

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Also Published As

Publication number Publication date
WO2017176771A1 (en) 2017-10-12
US10088867B2 (en) 2018-10-02
US10627862B1 (en) 2020-04-21
CA3019937A1 (en) 2017-10-12
EP3440530A4 (en) 2019-11-06
CN109313472A (zh) 2019-02-05
US10317942B1 (en) 2019-06-11
US20180004248A1 (en) 2018-01-04
AU2017246385A1 (en) 2018-10-25
EP3440530A1 (en) 2019-02-13

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STCB Information on status: application discontinuation

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Owner name: HODEI TECHNOLOGY, LLC, INDIANA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:GAMACHE, MARK;MASCARO, GUY A.;WALSH, MATTHEW KEVIN;SIGNING DATES FROM 20181002 TO 20181004;REEL/FRAME:047081/0783