US20150318198A1 - Substrate processing apparatus and substrate processing method - Google Patents

Substrate processing apparatus and substrate processing method Download PDF

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Publication number
US20150318198A1
US20150318198A1 US14/699,023 US201514699023A US2015318198A1 US 20150318198 A1 US20150318198 A1 US 20150318198A1 US 201514699023 A US201514699023 A US 201514699023A US 2015318198 A1 US2015318198 A1 US 2015318198A1
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Prior art keywords
substrate
processing
supporter
center
adjustor
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Abandoned
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US14/699,023
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English (en)
Inventor
Joji KUWAHARA
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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Assigned to SCREEN Holdings Co., Ltd. reassignment SCREEN Holdings Co., Ltd. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KUWAHARA, JOJI
Publication of US20150318198A1 publication Critical patent/US20150318198A1/en
Priority to US15/793,260 priority Critical patent/US10468284B2/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping

Definitions

  • the present invention relates to a substrate processing apparatus and a substrate processing method.
  • Substrate processing apparatuses are used to subject various types of substrates such as semiconductor substrates, substrates for liquid crystal displays, plasma displays, optical disks, magnetic disks, magneto-optical disks, and photomasks, and other substrates to various types of processing.
  • a substrate processing apparatus a plurality of substrates are sequentially transported by a transport device to a predetermined substrate supporter in a processing section.
  • the processing section performs predetermined processing on the substrate transported to the substrate supporter. It is desired that the substrate is supported by the substrate supporter with a center of the substrate accurately coinciding with a desired position in the substrate supporter in order to improve accuracy of processing for the substrate.
  • teaching is performed on a transport device, so that deviation between a position, in the substrate supporter, at which the substrate is to be supported and a position at which the substrate is actually supported is corrected.
  • a jig including an optical sensor is held by an arm of the transport device.
  • three pins are formed at the substrate supporter.
  • the jig that is held by the arm is brought closer to the three pins until the jig and the arm have a predetermined relative positional relationship.
  • the arm is moved in a plurality of predetermined directions, so that positions of two pins of the three pins are detected as position information by the optical sensor of the jig.
  • the position of the substrate supporter to which the arm accesses is set based on the detected position information.
  • An object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of transporting a substrate to a substrate supporter such that deviation between the substrate and the substrate supporter is reduced regardless of a distance of transportation of a transport device.
  • the one or plurality of correction information corresponding to the one or plurality of substrate supporters are acquired in advance for the adjustment of the position of the substrate by the position adjustor and are stored in the storage.
  • Each of the one or plurality of correction information indicates the position to be adjusted by the position adjustor when the substrate is transported to each of the one or plurality of substrate supporters from the position adjuster by the transport device in order for the center of the transported substrate to coincide with the reference position in the substrate supporter.
  • the position of the substrate is adjusted by the position adjuster before the substrate is transported to the one substrate supporter of the one or plurality of substrate supporters from the position adjuster based on the correction information, corresponding to the one substrate supporter, of the one or plurality of correction information that are stored in the storage.
  • the substrate of which the position is adjusted by the position adjuster is transported to the one substrate supporter by the transport device.
  • This configuration causes the one or plurality of correction information for adjusting the position of the substrate by the position adjustor to be acquired in advance and to be stored in the storage. Therefore, the alignment for coincidence of the center of the substrate with the reference position of each substrate supporter is performed by the position adjustor before the transportation of the substrate.
  • the substrate transported to the one substrate supporter by the transport device is supported by the substrate supporter with the center of the substrate coinciding with the reference position in the substrate supporter.
  • the substrate can be transported to each substrate supporter such that deviation between the substrate and each substrate supporter is reduced regardless of the distance of transportation of the transport device.
  • Each of the one or plurality of correction information may include a position with which the center of the substrate is to coincide in the position adjustor before the transportation of the substrate to each of the one or plurality of substrate supporters as a correction position, and the controller may control the position adjustor such that the center of the substrate coincides with the correction position corresponding to the one substrate supporter before the transportation of the substrate to the one substrate supporter.
  • the position of the substrate is adjusted such that the center of the substrate coincides with the correction position corresponding to the one substrate supporter before the transportation of the substrate.
  • the substrate can be transported to the substrate supporter such that the center of the substrate coincides with the reference position of the one substrate supporter.
  • Each of the one or plurality of substrate supporters may include a first rotation holding device that holds the substrate in a horizontal attitude and rotates the substrate about a rotation axis
  • the position adjustor may have a reference axis and be configured to detect an amount of deviation between the center of the substrate that is carried in and the reference axis
  • the controller may control the transport device such that the substrate is transported from the position adjustor to each substrate supporter, may control the first rotation holding device such that the transported substrate is rotated by a predetermined angle, may control the transport device such that the substrate is transported from the substrate supporter to the position adjustor, may detect an amount of deviation detected by the position adjustor before the transportation from the position adjuster to each substrate supporter as a first amount of deviation, may detect an amount of deviation detected by the position adjustor after the transportation from the substrate supporter to the position adjustor as a second amount of deviation and may calculate the correction position based on the first and second amounts of deviation, during acquisition of the correction information, wherein the storage may store the one or plurality of correction positions, corresponding
  • the amounts of deviation between the center of the substrate and the reference axis before and after the rotation by the first rotation holding device can be easily detected as the first and second amounts of deviation.
  • the correction position can be calculated by a geometric operation based on the first and second amounts of deviation.
  • the predetermined angle may be 180 degrees. In this case, the correction position can be easily calculated based on the first and second amounts of deviation.
  • Each of the one or plurality of substrate supporters may be configured to perform the processing on the substrate rotated by the first rotation holding device during the processing for the substrate.
  • the processing is performed on the substrate rotated by the first rotation holding device with the center of the substrate coinciding with the reference position of each substrate supporter.
  • accuracy of the processing for the substrate can be improved.
  • Each of the one or plurality of substrate supporters may include a guide mechanism that leads a position of the center of the substrate to the reference position
  • the position adjustor may have a reference axis and be configured to detect an amount of deviation between the center of the substrate that is carried in and the reference axis
  • the position of the center of the substrate may be led to the reference position by the guide mechanism in each of the one or plurality of substrate supporters during acquisition of the correction information
  • the controller may control the transport device such that the substrate is transported from each of the one or plurality of substrate supporters to the position adjustor, may acquire an amount of deviation detected by the position adjustor after transportation from the substrate supporter to the position adjustor and may calculate the correction position based on the acquired amount of deviation, during acquisition of the correction information
  • the storage may store the one or plurality of correction positions, corresponding to the one or plurality of substrate supporters, calculated by the controller as the one or plurality of correction information.
  • the substrate is supported with the position of the center of the substrate being led to the reference position by the guide mechanism. Therefore, the substrate is transported to the position adjustor, so that the correction information can be easily calculated.
  • the one or plurality of correction information can be acquired in advance during the acquisition of the correction information before the processing for the substrate and can be stored in the storage.
  • Each of the one or plurality of substrate supporters may be configured to perform temperature processing on the substrate during the processing for the substrate.
  • the temperature processing is performed on the substrate with the center of the substrate coinciding with the reference position of each substrate supporter.
  • accuracy of the temperature processing for the substrate can be improved.
  • the position adjustor may include a substrate holder that holds the substrate, a moving device that moves the substrate holder in a two-dimensional direction that is orthogonal to the reference axis, and a position detector that detects a position of an outer periphery of the substrate held by the substrate holder, and the controller may calculate a position of the center of the substrate based on the position of the outer periphery of the substrate detected by the position detector, and may control the moving device based on the calculated position of the center of the substrate such that the center of the substrate held by the substrate holder coincides with the correction position corresponding to the one substrate supporter, before the transportation of the substrate to the one substrate supporter during the processing for the substrate.
  • the position of the center of the substrate can be calculated with a simple configuration, and the position of the center of the substrate can coincide with each correction position.
  • Each of the one or plurality of substrate holders may have a preset reference direction
  • the position adjuster may be configured to be capable of adjusting a direction of the substrate that is carried in
  • each of the one or plurality of correction information may include a direction to be adjusted by the position adjustor when the substrate is transported to each of the one or plurality of substrate supporters from the position adjuster in order for a direction of the transported substrate to coincide with the reference direction in the substrate supporter.
  • the alignment for coincidence of the direction of the substrate with the reference direction of each substrate supporter is performed by the position adjustor before the transportation of the substrate.
  • the transport device can transport the substrate to each substrate supporter such that the direction of the substrate coincides with the reference direction of each substrate supporter.
  • the accuracy of the processing for the plurality of substrates can be uniform.
  • Each of the one or plurality of correction information may include a direction with which a direction of a notch of the substrate is to coincide in the position adjuster before the transportation of the substrate to each of the one or plurality of substrate supporters as a correction direction, and the controller may control the position adjustor such that the direction of the notch of the substrate coincides with the correction direction corresponding to the one substrate supporter, before the transportation of the substrate to the one substrate supporter.
  • the position of the substrate is adjusted such that the direction of the notch of the substrate coincides with the correction direction corresponding to the one substrate supporter before the transportation of the substrate.
  • the substrate can be transported to the substrate supporter such that the direction of the notch of the substrate coincides with the reference direction of the one substrate supporter.
  • the position adjuster may include a second rotation holding device that holds the substrate in a horizontal attitude and rotates the substrate about a rotation axis, a moving device that moves the second rotation holding device in a two-dimensional direction that is orthogonal to the reference axis, and a position detector that detects a position of an outer periphery of the substrate rotated by the second rotation holding device, and the controller may calculate the position of the center of the substrate and the direction of the notch of the substrate based on the position of the outer periphery of the substrate detected by the position detector, may control the second rotation holding device and the moving device based on the calculated position of the center of the substrate and the calculated direction of the notch of the substrate such that the center of the substrate held by the second rotation holding device coincides with the correction position corresponding to the one substrate supporter, and may control the second rotation holding device and the moving device based on the calculated position of the center of the substrate and the calculated direction of the notch of the substrate such that the direction of the notch of the substrate held by the second rotation holding device
  • the position of the center of the substrate can be calculated with a simple configuration, the position of the center of the substrate can coincide with each correction position, and the direction of the notch of the substrate can coincide with each correction direction.
  • a substrate processing method for performing processing on a substrate, including the steps of storing one or plurality of correction information, corresponding to one or plurality of substrate supporters, acquired in advance for adjustment of a position of the substrate by a position adjustor, adjusting the position of the substrate by the position adjustor based on the correction information, corresponding to one substrate supporter, of the one or plurality of correction information stored in the storage before the substrate is transported from the position adjustor to the one substrate supporter of the one or plurality of substrate supporters during the processing for the substrate, transporting the substrate of which the position is adjusted by the position adjustor to the one substrate supporter by a transport device, wherein each of the one or plurality of correction information indicates the position to be adjusted by the position adjustor when the substrate is transported to each of the one or plurality of substrate supporters from the position adjustor by the transport device in order for a center of the transported substrate to coincide with a reference position in the substrate supporter.
  • the one or plurality of correction information corresponding to the one or plurality of substrate supporters are acquired in advance for the adjustment of the position of the substrate by the position adjustor and are stored in the storage.
  • Each of the one or plurality of correction information indicates the position to be adjusted by the position adjustor when the substrate is transported to each of the one or plurality of substrate supporters from the position adjustor by the transport device in order for the center of the transported substrate to coincide with the reference position in the substrate supporter.
  • the position of the substrate is adjusted by the position adjustor based on the correction information, corresponding to the one substrate supporter, of the one or plurality of correction information stored in the storage before the substrate is transported from the position adjustor to the one substrate supporter of the one or plurality of substrate supporters during the processing for the substrate.
  • the substrate of which the position is adjusted by the position adjustor is transported to the one substrate supporter by the transport device.
  • This configuration causes the one or plurality of correction information for adjustment of the position of substrate by the position adjustor to be acquired in advance and to be stored in the storage. Therefore, the alignment for coincidence of the center of the substrate with the reference position of each substrate supporter is performed by the position adjustor before the transportation of the substrate.
  • the substrate that is transported to the one substrate supporter by the transport device is supported by the substrate supporter with the center of the substrate coinciding with the reference position in the substrate supporter, during the processing for the substrate.
  • the substrate can be transported to each substrate supporter such that the deviation between the substrate and each substrate supporter is reduced regardless of the distance of transportation of the transport device.
  • FIG. 1 is a schematic plan view showing a configuration of a substrate processing apparatus
  • FIG. 2 is a schematic side view of the substrate processing apparatus mainly showing a coating processing section, a development processing section and a cleaning drying processing section of FIG. 1 ;
  • FIG. 3 is a schematic side view of the substrate processing apparatus mainly showing thermal processing sections and a cleaning drying processing section of FIG. 1 ;
  • FIG. 4 is a side view mainly showing transport sections of FIG. 1 ;
  • FIG. 5 is a schematic perspective view for explaining a configuration of an aligner
  • FIG. 6 is a plan view of the aligner of FIG. 5 with a substrate being held;
  • FIG. 7 is a block diagram showing a configuration of a control system of the aligner
  • FIG. 8 is a diagram showing one example of position data acquired based on output signals of a line sensor
  • FIG. 9 is a block diagram showing a relationship between the aligner and a plurality of spin chucks
  • FIG. 10 is a diagram for explaining steps of acquiring correction information
  • FIG. 11 is a diagram for explaining the steps of acquiring the correction information
  • FIG. 12 is a diagram for explaining the steps of acquiring the correction information
  • FIG. 13 is a diagram for explaining the steps of acquiring the correction information
  • FIG. 14 is a diagram for explaining alignment for the substrate in substrate processing in a first processing block
  • FIG. 15 is a diagram for explaining the alignment for the substrate in the substrate processing in the first processing block
  • FIG. 16 is a diagram for explaining the alignment for the substrate in the substrate processing in the first processing block
  • FIGS. 17A to 17C are diagrams showing a configuration of a thermal processing unit
  • FIG. 18 is a diagram for explaining steps of acquiring the correction information in a second embodiment.
  • FIG. 19 is a diagram for explaining the steps of acquiring the correction information in the second embodiment.
  • a substrate refers to a semiconductor substrate, a substrate for a liquid crystal display, a substrate for a plasma display, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask or the like.
  • At least part of the substrate has a circular outer periphery.
  • the outer periphery except for a notch for positioning is circular, for example.
  • FIG. 1 is a schematic plan view showing a configuration of the substrate processing apparatus 100 .
  • FIG. 1 and subsequently given diagrams are accompanied by arrows that indicate X, Y, and Z directions orthogonal to one another for clarity of a positional relationship as needed.
  • the X and Y directions are orthogonal to each other within a horizontal plane, and the Z direction corresponds to a vertical direction.
  • the substrate processing apparatus 100 includes an indexer block 11 , a first processing block 12 , a second processing block 13 , a cleaning drying processing block 14 A and a carry-in carry-out block 14 B.
  • An interface block 14 is constituted by the cleaning drying processing block 14 A and the carry-in carry-out block 14 B.
  • An exposure device 15 is arranged to be adjacent to the carry-in carry-out block 14 B. In the exposure device 15 , exposure processing is performed on the substrate W using a liquid immersion method.
  • the indexer block 11 includes a plurality of carrier platforms 111 and a transport section 112 .
  • a carrier 113 for storing a plurality of substrates W in multiple stages is placed.
  • a controller 114 and a transport mechanism 115 are provided in the transport section 112 .
  • the controller 114 controls various constituent elements of the substrate processing apparatus 100 .
  • the transport mechanism 115 holds and transports the substrate W.
  • a main panel PN is provided on a side surface of the transport section 112 .
  • the main panel PN is connected to the controller 114 .
  • a user can confirm the processing status of the substrate W in the substrate processing apparatus 100 and other information on the main panel PN.
  • An operation unit (not shown) composed of a keyboard, for example, is provided near the main panel PN. The user can set operation settings of the substrate processing apparatus 100 , for example, by operating the operation unit.
  • the first processing block 12 includes a coating processing section 121 , a transport section 122 and a thermal processing section 123 .
  • the coating processing section 121 and the thermal processing section 123 are provided to be opposite to each other with the transport section 122 sandwiched therebetween.
  • substrate platforms PASS 1 and below-mentioned substrate platforms PASS 2 to PASS 4 (see FIG. 4 ) on which the substrates W are placed are provided between the transport section 122 and the transport section 112 .
  • a transport mechanism 127 and a transport mechanism 128 (see FIG. 4 ) that is described below, which transport the substrates W, are provided in the transport section 122 .
  • the second processing block 13 includes a development processing section 131 , a transport section 132 and a thermal processing section 133 .
  • the development processing section 131 and the thermal processing section 133 are provided to be opposite to each other with the transport section 132 sandwiched therebetween.
  • Substrate platforms PASS 5 and below-mentioned substrate platforms PASS 6 to PASS 8 (see FIG. 4 ) on which the substrates W are placed are provided between the transport section 132 and the transport section 122 .
  • a transport mechanism 137 and a transport mechanism 138 (see FIG. 4 ) that is described below, which transport the substrates W, are provided in the transport section 132 .
  • the cleaning drying processing block 14 A includes cleaning drying processing sections 161 , 162 and a transport section 163 .
  • the cleaning drying processing sections 161 , 162 are provided to be opposite to each other with the transport section 163 sandwiched therebetween.
  • Transport mechanisms 141 , 142 are provided in the transport section 163 .
  • a placement buffer unit P-BF 1 and a placement buffer unit P-BF 2 (see FIG. 4 ) that is described below are provided between the transport section 163 and the transport section 132 .
  • the placement buffer units P-BF 1 , P-BF 2 are configured to be capable of storing the plurality of substrates W.
  • a substrate platform PASS 9 and placement cooling platforms P-CP are provided to be adjacent to the carry-in carry-out block 14 B between the transport mechanisms 141 , 142 .
  • Each of placement cooling platform P-CP includes a function of cooling the substrate W. In the placement cooling platform P-CP, the substrate W is cooled to a temperature suitable for the exposure processing.
  • a transport mechanism 146 is provided in the carry-in carry-out block 14 B.
  • the transport mechanism 146 carries in the substrate W to and carries out the substrate W from the exposure device 15 .
  • a substrate inlet 15 a for carrying in the substrate W and a substrate outlet 15 b for carrying out the substrate W are provided at the exposure device 15 .
  • FIG. 2 is a schematic side view of the substrate processing apparatus 100 mainly showing the coating processing section 121 , the development processing section 131 and the cleaning drying processing section 161 of FIG. 1 .
  • coating processing chambers 21 , 22 , 23 , 24 are provided in a stack.
  • development processing chambers 31 , 32 , 33 , 34 are provided in a stack.
  • a coating processing unit 129 is provided in each of the coating processing chambers 21 to 24 .
  • a development processing unit 139 is provided in each of the development processing chambers 31 to 34 .
  • Each coating processing unit 129 includes spin chucks 25 that hold the substrates W and cups 27 provided to cover the surroundings of the spin chucks 25 .
  • spin chucks 25 that hold the substrates W and cups 27 provided to cover the surroundings of the spin chucks 25 .
  • two pairs of the spin chucks 25 and the cups 27 are provided at each coating processing unit 129 .
  • Each spin chuck 25 is driven to be rotated by a driving device that is not shown (an electric motor, for example).
  • each coating processing unit 129 includes a plurality of processing liquid nozzles 28 that discharge a processing liquid and a nozzle transport mechanism 29 that moves these processing liquid nozzles 28 .
  • the spin chuck 25 is rotated by the driving device (not shown), any one of the plurality of processing liquid nozzles 28 is moved to a position above the substrate W by the nozzle transport mechanism 29 , and a processing liquid is discharged from the processing liquid nozzle 28 .
  • the processing liquid is applied to an upper surface of the substrate W.
  • a rinse liquid is discharged at a peripheral edge of the substrate W from an edge rinse nozzle (not shown).
  • the processing liquid adhering to the peripheral edge of the substrate W is removed.
  • a processing liquid for an anti-reflection film is supplied to the substrate W from the processing liquid nozzle 28 .
  • a processing liquid for a resist film is supplied to the substrate W from the processing liquid nozzle 28 .
  • Each development processing unit 139 includes spin chucks 35 and cups 37 similarly to the coating processing unit 129 .
  • three pairs of the spin chucks 35 and the cups 37 are provided in each development processing unit 139 .
  • Each spin chuck 35 is driven to be rotated by a driving device that is not shown (an electric motor, for example).
  • the development processing unit 139 includes two development nozzles 38 that discharge a development liquid and a moving mechanism 39 that moves the development nozzles 38 in the X direction.
  • the spin chuck 35 is rotated by the driving device (not shown) and the one development nozzle 38 supplies the development liquid to each substrate W while moving in the X direction. Thereafter, the other development nozzle 38 supplies the development liquid to each substrate W while moving. In this case, the development liquid is supplied to the substrate W, so that development processing for the substrate W is performed. Further, in the present embodiment, development liquids that are different from each other are discharged from the two development nozzles 38 . Thus, two types of the development liquids can be supplied to each substrate W.
  • a plurality (four in the present example) of cleaning drying processing units SD 1 are provided in the cleaning drying processing section 161 .
  • cleaning and drying processing for the substrate W before the exposure processing are performed.
  • a fluid box 50 is provided in the coating processing section 121 to be adjacent to the development processing section 131 .
  • a fluid box 60 is provided in the development processing section 131 to be adjacent to the cleaning drying processing block 14 A.
  • the fluid box 50 and the fluid box 60 each house fluid related elements used to supply a chemical liquid to the coating processing units 129 and the development processing units 139 and discharge the liquid and air out of the coating processing units 129 and the development processing units 139 .
  • the fluid related elements include pipes, joints, valves, flowmeters, regulators, pumps, temperature adjusters and the like.
  • FIG. 3 is a schematic side view of the substrate processing apparatus 100 mainly showing the thermal processing sections 123 , 133 and the cleaning drying processing section 162 of FIG. 1 .
  • the thermal processing section 123 has an upper thermal processing section 301 provided above, and a lower thermal processing section 302 provided below.
  • the upper thermal processing section 301 and the lower thermal processing section 302 one or plurality of aligners AL, a plurality of thermal processing units PHP, a plurality of adhesion reinforcement processing units PAHP and a plurality of cooling units CP are provided.
  • the aligner AL has an alignment function for the substrate W.
  • the alignment for the substrate W refers to arranging a direction of the notch formed at the substrate W to coincide with a specific direction with respect to a center of the substrate W and the center of the substrate to coincide with a specific position. Details of the aligner AL will be described below.
  • each thermal processing unit PHP heating processing and cooling processing for the substrate W are performed.
  • the heating processing and the cooling processing in the thermal processing unit PHP are simply referred to as thermal processing.
  • Adhesion reinforcement processing for improving adhesion between the substrate W and the anti-reflection film is performed in the adhesion reinforcement processing unit PAHP.
  • an adhesion reinforcement agent such as HMDS (hexamethyldisilazane) is applied to the substrate W, and the heating processing is performed on the substrate W.
  • the cooling processing for the substrate W is performed.
  • the thermal processing section 133 has an upper thermal processing section 303 provided above and a lower thermal processing section 304 provided below.
  • One or plurality of aligners AL, a cooling unit CP, an edge exposure unit EEW and a plurality of thermal processing units PHP are provided in each of the upper thermal processing section 303 and the lower thermal processing section 304 .
  • the edge exposure unit EEW the exposure processing for the peripheral edge of the substrate W (edge exposure processing) is performed.
  • each thermal processing unit PHP provided to be adjacent to the cleaning drying processing block 14 A is configured to be capable of carrying in the substrate W from the cleaning drying processing block 14 A.
  • a plurality (five in the present example) of cleaning drying processing units SD 2 are provided in the cleaning drying processing section 162 .
  • each cleaning drying processing unit SD 2 the cleaning and drying processing for the substrate W after the exposure processing is performed.
  • FIG. 4 is a side view mainly showing the transport sections 122 , 132 , 163 of FIG. 1 .
  • the transport section 122 has an upper transport chamber 125 and a lower transport chamber 126 .
  • the transport section 132 has an upper transport chamber 135 and a lower transport chamber 136 .
  • the transport mechanism 127 is provided in the upper transport chamber 125
  • the transport mechanism 128 is provided in the lower transport chamber 126 .
  • the transport mechanism 137 is provided in the upper transport chamber 135
  • the transport mechanism 138 is provided in the lower transport chamber 136 .
  • the substrate platforms PASS 1 , PASS 2 are provided between the transport section 112 and the upper transport chamber 125
  • the substrate platforms PASS 3 , PASS 4 are provided between the transport section 112 and the lower transport chamber 126 .
  • the substrate platforms PASS 5 , PASS 6 are provided between the upper transport chamber 125 and the upper transport chamber 135
  • the substrate platforms PASS 7 , PASS 8 are provided between the lower transport chamber 126 and the lower transport chamber 136 .
  • the placement buffer unit P-BF 1 is provided between the upper transport chamber 135 and the transport section 163
  • the placement buffer unit P-BF 2 is provided between the lower transport chamber 136 and the transport section 163 .
  • the substrate platform PASS 9 and the plurality of placement cooling platforms P-CP are provided to be adjacent to the interface block 14 in the transport section 163 .
  • the transport mechanism 127 is configured to be capable of transporting the substrate W among the substrate platforms PASS 1 , PASS 2 , PASS 5 , PASS 6 , the coating processing chambers 21 , 22 ( FIG. 2 ) and the upper thermal processing section 301 ( FIG. 3 ).
  • the transport mechanism 128 is configured to be capable of transporting the substrate W among the substrate platforms PASS 3 , PASS 4 , PASS 7 , PASS 8 , the coating processing chambers 23 , 24 ( FIG. 2 ) and the lower thermal processing section 302 ( FIG. 3 ).
  • the transport mechanism 137 is configured to be capable of transporting the substrate W among the substrate platforms PASS 5 , PASS 6 , the placement buffer unit P-BF 1 , the development processing chambers 31 , 32 ( FIG. 2 ) and the upper thermal processing section 303 ( FIG. 3 ).
  • the transport mechanism 138 is configured to be capable of transporting the substrate W among the substrate platforms PASS 7 , PASS 8 , the placement buffer unit P-BF 2 , the development processing chambers 33 , 34 ( FIG. 2 ) and the lower thermal processing section 304 ( FIG. 3 ).
  • Each of the transport mechanisms 127 , 128 , 137 , 138 has hands H 1 , H 2 each transporting the substrate W while sucking the back surface of the substrate W and holding the substrate W.
  • H 1 , H 2 each transporting the substrate W while sucking the back surface of the substrate W and holding the substrate W.
  • the operation of the substrate processing apparatus 100 will be described with reference to FIGS. 1 to 4 .
  • the carrier 113 in which the unprocessed substrates W are stored is placed on the carrier platform 111 ( FIG. 1 ) in the indexer block 11 .
  • the transport mechanism 115 transports the unprocessed substrate W from the carrier 113 to the substrate platform PASS 1 , PASS 3 ( FIG. 4 ). Further, the transport mechanism 115 transports the processed substrate W that is placed on the substrate platform PASS 2 , PASS 4 ( FIG. 4 ) to the carrier 113 .
  • the transport mechanism 127 sequentially transports the substrate W placed on the substrate platform PASS 1 to the adhesion reinforcement processing unit PAHP ( FIG. 3 ), the cooling unit CP ( FIG. 3 ) and the aligner AL ( FIG. 3 ).
  • the transport mechanism 127 sequentially transports the substrate W aligned by the aligner AL to the coating processing chamber 22 ( FIG. 2 ), the thermal processing unit PHP ( FIG. 3 ), the cooling unit CP ( FIG. 3 ) and the aligner AL ( FIG. 3 ).
  • the transport mechanism 127 sequentially transports the substrate W aligned by the aligner AL again to the coating processing chamber 21 ( FIG. 2 ), the thermal processing unit PHP ( FIG. 3 ) and the substrate platform PASS 5 ( FIG. 4 ).
  • the substrate W is cooled to a temperature suitable for formation of the anti-reflection film in the cooling unit CP.
  • the anti-reflection film is formed on the substrate W by the coating processing unit 129 ( FIG. 2 ) in the coating processing chamber 22 after the alignment for the substrate W is performed.
  • the thermal processing for the substrate W is performed in the thermal processing unit PHP
  • the substrate W is cooled to a temperature suitable for the formation of the resist film in the cooling unit CP.
  • the resist film is formed on the substrate W by the coating processing unit 129 ( FIG. 2 ) in the coating processing chamber 21 after the alignment for the substrate W is performed again in the aligner AL.
  • the thermal processing for the substrate W is performed in the thermal processing unit PHP, and the substrate W is placed on the substrate platform PASS 5 .
  • the transport mechanism 127 transports the substrate W after the development processing that is placed on the substrate platform PASSE ( FIG. 4 ) to the substrate platform PASS 2 ( FIG. 4 ).
  • the transport mechanism 128 ( FIG. 4 ) sequentially transports the substrate W placed on the substrate platform PASS 3 to the adhesion reinforcement processing unit PAHP ( FIG. 3 ), the cooling unit CP ( FIG. 3 ) and the aligner AL ( FIG. 3 ). Then, the transport mechanism 128 sequentially transports the substrate W aligned by the aligner AL to the coating processing chamber 24 ( FIG. 2 ), the thermal processing unit PHP ( FIG. 3 ), the cooling unit CP ( FIG. 3 ) and the aligner AL ( FIG. 3 ). Next, the transport mechanism 128 sequentially transports the substrate W aligned by the aligner AL again to the coating processing chamber 23 ( FIG. 2 ), the thermal processing unit PHP ( FIG. 3 ) and the substrate platform PASS 7 ( FIG. 4 ).
  • the transport mechanism 128 ( FIG. 4 ) transports the substrate W after the development processing that is placed on the substrate platform PASS 8 ( FIG. 4 ) to the substrate platform PASS 4 ( FIG. 4 ).
  • the processing contents for the substrate W in the coating processing chambers 23 , 24 ( FIG. 2 ) and the lower thermal processing section 302 ( FIG. 3 ) are similar to the processing contents for the substrate W in the above-mentioned coating processing chambers 21 , 22 ( FIG. 2 ) and the upper thermal processing section 301 ( FIG. 3 ).
  • the transport mechanism 137 ( FIG. 4 ) transports the substrate W after the resist film formation that is placed on the substrate platform PASS 5 ( FIG. 4 ) to the aligner AL ( FIG. 3 ). Subsequently, the transport mechanism 137 sequentially transports the substrate W aligned by the aligner AL to the edge exposure unit EEW ( FIG. 3 ) and the placement buffer unit P-BF 1 ( FIG. 4 ). In this case, after the alignment for the substrate W is performed in the aligner AL, the edge exposure processing is performed on the substrate W in the edge exposure unit EEW. The substrate W after the edge exposure processing is placed on the placement buffer unit P-BF 1 .
  • the transport mechanism 137 ( FIG. 4 ) takes out the substrate W after the exposure processing and the thermal processing from the thermal processing unit PHP ( FIG. 3 ) that is adjacent to the cleaning drying processing block 14 A.
  • the transport mechanism 137 sequentially transports the substrate W to the cooling unit CP ( FIG. 3 ), any one of the development processing chambers 31 , 32 ( FIG. 2 ), the thermal processing unit PHP ( FIG. 3 ) and the substrate platform PASS 6 ( FIG. 4 ).
  • the development processing for the substrate W is performed by the development processing unit 139 in any one of the development processing chambers 31 , 32 after the substrate W is cooled to a temperature suitable for the development processing in the cooling unit CP. Thereafter, the thermal processing for the substrate W is performed in the thermal processing unit PHP, and the substrate W is placed on the substrate platform PASS 6 .
  • the transport mechanism 138 ( FIG. 4 ) transports the substrate W after the resist film formation that is placed on the substrate platform PASS 7 to the aligner AL ( FIG. 3 ). Then, the transport mechanism 138 sequentially transports the substrate W aligned by the aligner AL to the edge exposure unit EEW ( FIG. 3 ) and the placement buffer unit P-BF 2 ( FIG. 4 ).
  • the transport mechanism 138 takes out the substrate W after the exposure processing and the thermal processing from the thermal processing unit PHP ( FIG. 3 ) that is adjacent to the cleaning drying processing block 14 .
  • the transport mechanism 138 sequentially transports the substrate W to the cooling unit CP ( FIG. 3 ), any one of the development processing chambers 33 , 34 ( FIG. 2 ), the thermal processing unit PHP ( FIG. 3 ) and the substrate platform PASS 8 ( FIG. 4 ).
  • the processing contents for the substrate W in the development processing chambers 33 , 34 and the lower thermal processing section 304 are similar to the processing contents for the substrate W in the above-mentioned development processing chambers 31 , 32 and upper thermal processing section 303 .
  • the transport mechanism 141 ( FIG. 1 ) transports the substrate W that is placed on the placement buffer unit P-BF 1 , P-BF 2 ( FIG. 4 ) to the cleaning drying processing unit SD 1 ( FIG. 2 ) in the cleaning drying processing section 161 .
  • the transport mechanism 41 transports the substrate W from the cleaning drying processing unit SD 1 to the placement cooling unit P-CP ( FIG. 4 ).
  • the substrate W is cooled in the placement cooling platform P-CP to a temperature suitable for the exposure processing in the exposure device 15 ( FIG. 1 ) after the cleaning and drying processing for the substrate W are performed in the cleaning drying processing unit SD 1 .
  • the transport mechanism 142 ( FIG. 1 ) transports the substrate W after the exposure processing that is placed on the substrate platform PASS 9 ( FIG. 4 ) to the cleaning drying processing unit SD 2 ( FIG. 3 ) in the cleaning drying processing section 162 . Further, the transport mechanism 142 transports the substrate W after the cleaning and drying processing to the thermal processing unit PHP ( FIG. 3 ) in the upper thermal processing section 303 or the thermal processing unit PHP ( FIG. 3 ) in the lower thermal processing section 304 from the cleaning drying processing unit SD 2 . In this thermal processing unit PHP, post-exposure bake (PEB) processing is performed.
  • PEB post-exposure bake
  • the transport mechanism 146 ( FIG. 1 ) transports the substrate W before the exposure processing that is placed on the placement cooling platform P-CP ( FIG. 4 ) to the substrate inlet 15 a ( FIG. 1 ) of the exposure device 15 . Further, the transport mechanism 146 ( FIG. 1 ) takes out the substrate W after the exposure processing from the substrate outlet 15 b ( FIG. 1 ) of the exposure device 15 and transports the substrate W to the substrate platform PASS 9 ( FIG. 4 ).
  • the substrate W before the exposure processing is temporarily stored in the placement buffer unit P-BF 1 , P-BF 2 .
  • the development processing unit 139 ( FIG. 2 ) in the second processing block 13 cannot receive the substrate W after the exposure processing, the substrate W after the exposure processing is temporarily stored in the placement buffer unit P-BF 1 , P-BF 2 .
  • the processing for the substrate W in the coating processing chambers 21 , 22 , the development processing chambers 31 , 32 and the upper thermal processing sections 301 , 303 that are provided above, and the processing for the substrate W in the coating processing chambers 23 , 24 , the development processing chambers 33 , 34 and the lower thermal processing sections 302 , 304 that are provided below can be concurrently performed.
  • FIG. 5 is a schematic perspective view for explaining a configuration of the aligner AL.
  • FIG. 6 is a plan view of the aligner AL of FIG. 5 with the substrate W being held.
  • the aligner AL includes a moving device 500 , a rotation holding device 504 and a line sensor 505 .
  • the moving device 500 includes a support member 501 , a Y direction movable portion 502 and an X direction movable portion 503 .
  • the Y direction movable portion 502 is configured to be movable in the Y direction with respect to the support member 501 .
  • the X direction movable portion 503 is configured to be movable in the X direction with respect to the Y direction movable portion 502 .
  • the rotation holding device 504 is fixed to the X direction movable portion 503 .
  • the rotation holding device 504 is made of a suction-type spin chuck, for example, and sucks the back surface of the substrate W and holds the substrate W.
  • This rotation holding device 504 is driven to be rotated about a rotation axis RA in the vertical direction by a motor (not shown) provided at the X direction movable portion 503 .
  • the substrate W is rotated about the rotation axis RA.
  • An origin position O is set in advance in the aligner AL.
  • coordinates of the origin position O are (0, 0).
  • the Y direction movable portion 502 and the X direction movable portion 503 are positioned such that the rotation axis RA of the rotation holding device 504 coincides with the origin position O.
  • a CCD (a charge-coupled device) line sensor is used as the line sensor 505 , for example.
  • the line sensor 505 is used to measure a position of the outer periphery of the substrate W in the X direction.
  • the line sensor 505 is arranged to extend in the X direction.
  • FIG. 7 is a block diagram showing a configuration of a control system of the aligner AL.
  • the aligner AL further includes a memory 506 and a controller 510 . Correction information for performing the alignment for the substrate W, described below, is stored in the memory 506 .
  • the controller 510 is constituted by a CPU (Central Processing Unit).
  • the controller 510 may be realized by the controller 114 of FIG. 1 .
  • the controller 510 controls the Y direction movable portion 502 and the X direction movable portion 503 of the moving device 500 and the rotation holding device 504 based on output signals of the line sensor 505 . Further, the controller 510 controls the Y direction movable portion 502 and the X direction movable portion 503 of the moving device 500 and the rotation holding device 504 based on the correction information stored in the memory 506 .
  • a direction of a straight line that connects a center WC and the notch NT of the substrate W is referred to as a direction of the notch NT.
  • the X direction is a reference direction.
  • An angle, which the direction of the notch NT forms with the reference direction (the X direction) is referred to as a rotation direction offset amount ⁇ off.
  • the direction of the notch NT coincides with the reference direction. That is, the rotation direction offset amount ⁇ off is 0°.
  • an amount of deviation from the rotation axis RA to the center WC of the substrate W in the X direction is referred to as an X offset amount Xoff
  • an amount of deviation from the rotation axis RA to the center WC of the substrate W in the Y direction is referred to as a Y offset amount Yoff.
  • the center WC of the substrate W does not coincide with the rotation axis RA of the rotation holding device 504 . That is, the center WC of the substrate W deviates from the rotation axis RA.
  • the rotation holding device 504 is rotated by 360° about the rotation axis RA.
  • the substrate W held by the rotation holding device 504 is rotated by 360°.
  • the controller 510 of FIG. 7 acquires the output signal of the line sensor 505 as position data.
  • the position data indicates the position of the X direction of the outer periphery of the substrate W that is detected by the line sensor 505 .
  • FIG. 8 is a diagram showing one example of the position data acquired based on the output signals of the line sensor 505 .
  • the ordinate indicates the position data
  • the abscissa indicates the rotation angle of the substrate W.
  • the controller 510 acquires the position data for every rotation of the substrate W by 0.1°, for example. In this case, 3600 of the position data are acquired.
  • the controller 510 detects position data Pn corresponding to the notch NT based on a change in the position data and calculates the rotation direction offset amount ⁇ off of the notch NT based on the rotation angle corresponding to the position data Pn.
  • controller 510 calculates the X offset amount Xoff and the Y offset amount Yoff of the center WC of the substrate W with respect to the rotation axis RA based on a change in the position data.
  • the X offset amount Xoff and the Y offset amount Yoff are calculated in the following formula.
  • the X offset amount Xoff and the Y offset amount Yoff are calculated in the following formula.
  • the X offset amount Xoff and the Y offset amount Yoff are calculated using the above formulas (1), (2). Further, when the notch NT is at any one of the rotation angles 0°, 90°, 180°, 270° or a position in the vicinity of them, the X offset amount Xoff and the Y offset amount Yoff are calculated using the above formulas (3), (4).
  • the transport mechanism 127 , 128 , 137 , 138 of FIG. 4 performs the transportation of the substrate W according to a predetermined transport path during installation or maintenance of the substrate processing apparatus 100 .
  • the teaching for correcting deviation between a position at which the substrate W is to be supported and a position at which the substrate W is actually supported is not performed on the transport mechanism 127 , 128 , 137 , 138 .
  • the position at which the substrate W is to be supported is the spin chuck 25 of FIG. 2 and a spin chuck (not shown) of the edge exposure unit EEW of FIG. 3 .
  • the substrate W is transported to the spin chuck 25 by the transport mechanism 127 , 128 , the substrate W is sometimes held by the spin chuck 25 with a rotational center of the spin chuck 25 being deviating from the center WC of the substrate W.
  • the substrate W is transported to the edge exposure unit EEW by the transport mechanism 137 , 138 , the substrate W is sometimes held by the spin chuck with a rotational center of the spin chuck of the edge exposure unit EEW being deviating from the center WC of the substrate W.
  • the alignment for the substrate W is performed in advance by the aligner AL such that, when the substrate W is transported to the spin chuck 25 , the rotational center of the spin chuck 25 coincides with the center WC of the substrate W.
  • the rotational center of the spin chuck 25 is equivalent to a reference position.
  • the alignment for the substrate W is performed in advance by the aligner AL such that, when the substrate W is transported to the edge exposure unit EEW, the rotational center of the spin chuck of the edge exposure unit EEW coincides with the center WC of the substrate W.
  • FIG. 9 is a block diagram showing a relationship between the aligner AL and the plurality of spin chucks 25 .
  • two spin chucks 25 in the coating processing chamber 21 are referred to as the spin chucks 25 a , 25 b , respectively, and two spin chucks 25 in the coating processing chamber 22 are referred to as the spin chucks 25 c , 25 d , respectively.
  • the correction information CIa, CIb, CIc, CId are stored in the memory 506 of the aligner AL provided in the upper thermal processing section 301 .
  • the correction information CIa to CId are correction information for performing the alignment such that the rotational centers of the spin chucks 25 a to 25 d respectively coincide with the centers WC of the substrates W.
  • the correction information CIa to CId are acquired during the installation or maintenance of the substrate processing apparatus 100 and are stored in the memory 506 . The steps of acquiring the correction information CIa will be described below.
  • FIGS. 10 to 13 are diagrams for explaining the steps of acquiring the correction information CIa.
  • a direction in which an arrow X is directed is referred to as a +X direction
  • a direction that is opposite to the arrow X is referred to as a ⁇ X direction.
  • a direction in which an arrow Y is directed is referred to as a +Y direction
  • a direction opposite to the arrow Y is referred as a ⁇ Y direction.
  • the substrate W is carried in the aligner AL and held by the rotation holding device 504 .
  • a position of the center WC of the substrate W at this time is P 1 .
  • the X offset amount Xoff and the Y offset amount Yoff of the substrate W are calculated.
  • the calculated X offset amount Xoff and Y offset amount Yoff are Xoff 1 and Yoff 1 , respectively. Therefore, coordinates of the position P 1 are (Xoff 1 , Yoff 1 ).
  • the substrate W is moved by a distance Lx in the +X direction and is moved by a distance Ly in the +Y direction by the transport mechanism 127 .
  • the substrate W is transported from the aligner AL to the spin chuck 25 a .
  • a rotational center 25 C of the spin chuck 25 a does not coincide with the center WC of the substrate W.
  • the substrate W is rotated by a predetermined angle by the spin chuck 25 a .
  • the rotation angle of the substrate W is preferably 180°.
  • the rotational center 25 C of the spin chuck 25 a is a middle point between the center WC of the substrate W of FIG. 11 before the rotation and the center WC of the substrate W of FIG. 12 after the rotation.
  • the substrate W is moved by the distance Lx in the ⁇ X direction and is moved by the distance Ly in the ⁇ Y direction by the transport mechanism 127 .
  • the substrate W is transported from the spin chuck 25 a to the aligner AL.
  • a position of the center WC of the substrate W at this time is P 2 .
  • the X offset amount Xoff and the Y offset amount Yoff of the substrate W are calculated.
  • the calculated X offset amount Xoff and Y offset amount Yoff are Xoff 2 and Yoff 2 , respectively. Therefore, coordinates of the position P 2 are (Xoff 2 , Xoff 2 ).
  • a correction position P 0 is calculated based on the calculated X offset amounts Xoff 1 , Xoff 2 and Y offset amounts Yoff 1 , Yoff 2 .
  • the correction position P 0 is a position at which the center WC of the substrate W is to be in the aligner AL when the substrate W is transported from the aligner AL to the spin chuck 25 a in order for the center WC of the substrate W to coincide with the rotational center 25 C of the spin chuck 25 in the spin chuck 25 a .
  • the correction position P 0 is a middle point between the positions P 1 , P 2 .
  • An X coordinate of the correction position P 0 is (Xoff 1 +Xoff 2 )/2
  • a Y coordinate of the correction position P 0 is (Yoff 1 +Yoff 2 )/2.
  • the correction positions P 0 corresponding to the respective spin chucks 25 b to 25 d of FIG. 9 are calculated by the steps as described above.
  • the correction positions P 0 corresponding to the respective spin chucks 25 a to 25 d are stored in the memory 506 of FIG. 9 as the correction information CIa to CId, respectively.
  • the correction information CIa to CId may include constant values of the rotation direction offset amounts ⁇ off corresponding to the spin chucks 25 a to 25 d as correction directions.
  • FIGS. 14 to 16 are diagrams for explaining the alignment for the substrate W in the substrate processing by the first processing block 12 .
  • the transport mechanism 127 sequentially transports the substrate W placed on the substrate platform PASS 1 of FIG. 4 to the adhesion reinforcement processing unit PAHP ( FIG. 3 ), the cooling unit CP ( FIG. 3 ) and the aligner AL ( FIG. 3 ).
  • the rotation axis RA of the rotation holding device 504 coincides with the origin position O.
  • the substrate W on which the adhesion reinforcement processing and the cooling processing are performed is held by the rotation holding device 504 .
  • the X offset amount Xoff, the Y offset amount Yoff and the rotation direction offset amount ⁇ off of the substrate W are calculated.
  • a direction of the center WC and the notch NT of the substrate W are detected.
  • the alignment for the substrate W is performed by the aligner AL as shown in FIG. 15 based on the correction information stored in the memory 506 of FIG. 9 .
  • the substrate W is rotated by the rotation holding device 504 such that the rotation direction offset amount ⁇ off is the constant value.
  • the rotation direction offset amount ⁇ off is 90°.
  • the constant value of the rotation direction offset amount ⁇ off is included in the correction information CIc as the correction direction.
  • the correction position P 0 is acquired based on the correction information CIc stored in the memory 506 .
  • the substrate W is moved in the X and Y directions by the moving device 500 such that the center WC of the rotated substrate W coincides with the acquired correction position P 0 .
  • the substrate W is moved by a predetermined constant distance in the +X direction and is moved by a predetermined constant distance in the +Y direction by the transport mechanism 127 .
  • the substrate W is held by the spin chuck 25 c with the direction of the notch NT being constant and the rotational center 25 C of the spin chuck 25 c coinciding with the center WC of the substrate W.
  • the anti-reflection film is formed on the substrate W by the coating processing unit 129 ( FIG. 2 ).
  • the transport mechanism 127 sequentially transports the substrate W on which the anti-reflection film is formed in the coating processing chamber 22 to the thermal processing unit PHP ( FIG. 3 ), the cooling unit CP ( FIG. 3 ) and the aligner AL.
  • the rotation axis RA of the rotation holding device 504 coincides with the origin position O.
  • the substrate W on which the thermal processing and the cooling processing are performed is held by the rotation holding device 504 as described above.
  • the direction of the center WC and the notch NT of the substrate W are detected.
  • the substrate W is rotated by the rotation holding device 504 such that the rotation direction offset amount ⁇ off is the constant value.
  • the constant value of the rotation direction offset amount ⁇ off is included in the correction information CIa as the correction direction.
  • the correction position P 0 is acquired based on the correction information CIa stored in the memory 506 of FIG. 9 .
  • the substrate W is moved in the X and Y directions by the moving device 500 such that the center WC of the rotated substrate W coincides with the acquired correction position P 0 .
  • the substrate W is moved by a predetermined constant distance in the +X direction and is moved by a predetermined constant distance in the +Y direction by the transport mechanism 127 .
  • the substrate W is held by the spin chuck 25 a with the direction of the notch NT being constant and the rotational center 25 C of the spin chuck 25 a of FIG. 10 coinciding with the center WC of the substrate W.
  • the resist film is formed on the substrate W by the coating processing unit 129 ( FIG. 2 ) in the coating processing chamber 21 ( FIG. 2 ).
  • the substrate W on which the resist film is formed in the coating processing chamber 21 is sequentially transported to the thermal processing unit PHP ( FIG. 3 ) and the substrate platform PASS 5 ( FIG. 4 ).
  • the substrate W on which the thermal processing is performed is placed on the substrate platform PASS 5 .
  • the alignment for the substrate W is performed by the aligner AL based on the correction information corresponding to the position at which the substrate W is to be supported. Specifically, the alignment for the substrate W for coincidence of the rotational center 25 C of the spin chuck 25 c with the center WC of the substrate W is performed based on the correction information CIc. Further, the alignment for the substrate W for coincidence of the rotational center 25 C of the spin chuck 25 a with the center WC of the substrate W is performed based on the correction information CIa.
  • the rotational center 25 C of the spin chuck 25 c can coincide with the center WC of the substrate W in the coating processing chamber 22
  • the rotational center 25 C of the spin chuck 25 a can coincide with the center WC of the substrate W in the coating processing chamber 21 .
  • accuracy of formation of the anti-reflection film of the substrate W and accuracy of formation of the resist film of the substrate W can be improved.
  • the processing is performed on the substrates W with the directions of the notches NT being constant, the accuracy of the formation of the anti-reflection films and the accuracy of the formation of the resist films of the plurality of substrates W can be uniform.
  • the plurality of correction information CIa to CId respectively corresponding to the plurality of spin chucks 25 a to 25 d are acquired in advance during the acquisition of the correction information and are stored in the memory 506 .
  • the position of the substrate W is adjusted by the aligner AL before the substrate W is transported from the aligner AL to any one of the spin chucks 25 a to 25 d during the processing for the substrate W based on the correction information corresponding to the spin chuck 25 stored in the memory 506 .
  • the substrate W of which the position is adjusted by the aligner AL is transported to the spin chuck 25 by the transport mechanism 127 .
  • This configuration causes the plurality of correction information CIa to CId for adjusting the position of the substrate W by the aligner AL to be acquired in advance and to be stored in the memory 506 . Therefore, the alignment for the coincidence of the center WC of the substrate W with the rotational center 25 C of each spin chuck 25 a to 25 d is performed by the aligner AL before the transportation of the substrate W. Further, the alignment for the coincidence of the direction of the notch NT of the substrate W with the constant direction is performed by the aligner AL before the transportation of the substrate W.
  • the center WC coincides with the rotational center 25 C in the spin chuck 25 and the notch NT is directed in the constant direction.
  • the substrate W is supported by the spin chuck 25 .
  • the substrate W can be transported to each spin chuck 25 a to 25 d such that deviation between the substrate W and each spin chuck 25 a to 25 d is reduced regardless of a distance of transportation of the transport mechanism 127 .
  • the processing is performed on the substrate W that is rotated by each spin chuck 25 a to 25 d with the center WC of the substrate W coinciding with the rotational center 25 C of each spin chuck 25 a to 25 d and the notch NT being directed in the constant direction.
  • accuracy of the processing for the substrate W can be improved, and the accuracy of the processing for the plurality of substrates W can be uniform.
  • the position at which the substrate W is to be supported is the center of the rotation holding device such as the spin chuck in the first embodiment, the invention is not limited to this.
  • the position at which the substrate W is to be supported may be a thermal processing unit and the like that does not have the rotation holding device.
  • alignment for the substrate W that is transported to the thermal processing unit is performed by the aligner.
  • the substrate processing apparatus according to the second embodiment differences from the substrate processing apparatus 100 according to the first embodiment will be described below.
  • FIGS. 17A , 17 B, 17 C are diagrams showing a configuration of the thermal processing unit PHP.
  • FIG. 17A is a plan view of the thermal processing unit PHP
  • FIG. 17B is a cross sectional view taken along the line A-A of the thermal processing unit PHP of FIG. 17A .
  • the thermal processing unit PHP includes a heater 401 and a plurality of guide members 402 .
  • the heater 401 is a disk-shaped hot plate.
  • the plurality of guide members 402 are provided along an edge of the heater 401 at substantially equal intervals. In the example of FIG. 17A , the six guide members 402 are provided at intervals of substantially 60°.
  • each guide member 402 has a truncated cone shape.
  • the substrate W is led downward along inclined side surfaces of the guide members 402 as indicated by the arrow in FIG. 17C .
  • the substrate W is supported above the heater 401 .
  • the aligner AL is further provided in the interface block 14 of FIG. 1 .
  • the aligner AL is arranged above the substrate platform PASS 9 of FIG. 4 , for example. Steps of acquiring the correction information for performing the alignment for the substrate W that is transported from the aligner AL in the interface block 14 to the thermal processing unit PHP in the upper thermal processing section 303 of the second processing block 13 of FIG. 3 will be described below.
  • FIGS. 18 and 19 are diagrams for explaining steps of acquiring the correction information in the second embodiment.
  • the substrate W is supported in the thermal processing unit PHP.
  • the supporting center 401 C of the heater 401 is equivalent to the reference position.
  • the substrate W may be supported in the thermal processing unit PHP by the transfer of the substrate W from the aligner AL to the thermal processing unit PHP by the transport mechanism 142 .
  • the substrate W may be supported in the thermal processing unit PHP by a user of the substrate processing apparatus 100 .
  • the substrate W is moved by a predetermined constant distance in the +X direction and is moved by a predetermined constant distance in the +Y direction by the transport mechanism 142 .
  • the substrate W is transported from the thermal processing unit PHP to the aligner AL.
  • the position of the center WC of the substrate W at this time is a correction position P 0 .
  • the rotation axis RA of the rotation holding device 504 coincides with the origin position O.
  • the X offset amount Xoff and the Y offset amount Yoff of the substrate W are calculated, so that the correction position P 0 is calculated.
  • coordinates of the correction position P 0 are (Xoff, Yoff).
  • the respective correction positions P 0 corresponding to the plurality of other respective thermal processing units PHP are calculated by the similar steps.
  • the plurality of respective calculated correction positions P 0 are stored in the memory 506 of FIG. 9 as the plurality of respective correction information.
  • the correction information may include the constant value of the rotation direction offset amount ⁇ off corresponding to the thermal processing unit PHP as the correction direction.
  • the transport mechanism 142 ( FIG. 1 ) sequentially transports the substrate W after the exposure processing that is placed on the substrate platform PASS 9 ( FIG. 4 ) to the cleaning drying processing unit SD 2 and the aligner AL.
  • the rotation axis RA of the rotation holding device 504 coincides with the origin position O.
  • the substrate W on which the cleaning drying processing is performed is held by the rotation holding device 504 .
  • the X offset amount Xoff, the Y offset amount Yoff and the rotation direction offset amount ⁇ off of the substrate W are calculated.
  • the direction of the center WC and the notch NT of the substrate W are detected.
  • the substrate W is rotated by the rotation holding device 504 in the aligner AL based on the correction information stored in the memory 506 of FIG. 9 such that the rotation direction offset amount ⁇ off is the constant value.
  • the constant value of the rotation direction offset amount ⁇ off is included in the correction information as the correction direction.
  • the correction position P 0 is acquired based on the correction information stored in the memory 506 of FIG. 9 .
  • the substrate W is moved in the X and Y directions by the moving device 500 such that the center WC of the rotated substrate W coincides with the acquired correction position P 0 .
  • the substrate W is moved by a predetermined constant distance in the +X direction and is moved by a predetermined constant distance in the +Y direction by the transport mechanism 142 .
  • the substrate W is supported in the thermal processing unit PHP with the direction of the notch NT being constant and the supporting center 401 C of the heater 401 of the thermal processing unit PHP coinciding with the center WC of the substrate W.
  • PEB processing is performed on the substrate W.
  • the alignment for the substrate W is performed by the aligner AL based on the correction information corresponding to the position at which the substrate W is to be supported. Specifically, the alignment for the substrate W for the coincidence of the supporting center 401 C of the heater 401 of the thermal processing unit PHP with the center WC of the substrate W is performed based on the correction information.
  • the supporting center 401 C of the heater 401 can coincide with the center WC of the substrate W in the thermal processing unit PHP.
  • accuracy of the PEB processing for the substrate W can be improved.
  • accuracy of the PEB processing for the plurality of substrates W can be uniform.
  • the processing is performed on the substrate W with the direction of the notch NT being constant, when a malfunction occurs in the PEB processing for the substrate W, it is easier to perform analysis of the cause.
  • transport mechanism 127 , 128 , 137 , 138 , 142 is a transport robot that can freely transport the substrate W in the X, Y and Z directions in the first and second embodiments, the invention is not limited to this.
  • the transport mechanism 127 , 128 , 137 , 138 , 142 may be a single-axis robot (an electric slider) that can transport the substrate W in one direction.
  • the transport mechanism 127 , 128 , 137 , 138 , 142 may be a cylindrical coordinate robot.
  • the transport mechanism 127 , 128 , 137 , 138 , 142 is any one of these robots, even when the teaching is performed on the transport mechanism 127 , 128 , 137 , 138 , 142 , the direction of the notch NT cannot coincide with a specific direction with respect to the center of the substrate W.
  • the alignment for the substrate W is performed in advance in the aligner AL, so that the direction of the notch NT can coincide with the specific direction with respect to the center of the substrate W using the single-axis robot or the cylindrical coordinate robot.
  • the alignment is performed such that the direction of the notch NT coincides with the specific direction with respect to the center WC of the substrate W, and the alignment is performed such that the center WC of the substrate W coincides with the specific position in the first and second embodiments.
  • the alignment may be performed such that the center WC of the substrate W coincides with a specific position without the coincidence of the direction of the notch NT with the specific direction with respect to the center WC of the substrate W.
  • the invention is not limited to this.
  • the substrate W may be rotated by the spin chuck by any angle during the acquisition of the correction information of FIG. 11 .
  • the correction position P 0 of FIG. 13 can be calculated by a geometric operation based on the position of the center WC before the rotation of the substrate W and the position of the center WC after the rotation of the substrate W.
  • the substrate W is an example of a substrate
  • the substrate processing apparatus 100 is an example of a substrate processing apparatus
  • the rotational center 25 C or the supporting center 401 C is an example of a reference position.
  • the coating processing chamber 21 to 24 , the edge exposure unit EEW or the thermal processing unit PHP is an example of a substrate supporter
  • the aligner AL is an example of a position adjuster
  • the transport mechanism 127 , 128 , 137 , 138 , 142 is an example of a transport device.
  • the correction information CIa to CId is an example of correction information
  • the memory 506 is an example of a storage
  • the controller 510 is an example of a controller
  • the correction position P 0 is an example of a correction position
  • the spin chuck 25 is an example of a first rotation holding device.
  • the guide member 402 is an example of a guide mechanism
  • the rotation holding device 504 is an example of a substrate holder or a second rotation holding device
  • the moving device 500 is an example of a moving device
  • the line sensor 505 is an example of a position detector
  • the notch NT is an example of a notch.
  • the present invention can be effectively utilized for processing various types of substrates.

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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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CN107039320A (zh) * 2015-11-12 2017-08-11 株式会社迪思科 旋转装置
CN108352350A (zh) * 2016-06-30 2018-07-31 日本电产三协株式会社 搬运系统
US10395968B2 (en) * 2017-01-27 2019-08-27 SCREEN Holdings Co., Ltd. Substrate transport device, detection position calibration method and substrate processing apparatus
US20190287831A1 (en) * 2018-03-14 2019-09-19 Kokusai Electric Corporation Substrate processing apparatus, substrate processing system and method of manufacturing semiconductor device
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US11382246B2 (en) * 2017-10-06 2022-07-05 Fuji Corporation Substrate work system under adjustable rail spacing distance
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JP6703785B2 (ja) * 2016-05-09 2020-06-03 キヤノン株式会社 基板処理装置、および物品製造方法
JP6754247B2 (ja) * 2016-08-25 2020-09-09 株式会社Ｓｃｒｅｅｎホールディングス 周縁部処理装置および周縁部処理方法
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JP6966913B2 (ja) * 2017-09-29 2021-11-17 川崎重工業株式会社 基板搬送装置及び基板載置部の回転軸の探索方法
JP2024031324A (ja) * 2022-08-26 2024-03-07 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP2024054636A (ja) * 2022-10-05 2024-04-17 川崎重工業株式会社 ロボットシステム、アライナおよび半導体基板のアライメント方法

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US11382246B2 (en) * 2017-10-06 2022-07-05 Fuji Corporation Substrate work system under adjustable rail spacing distance
US20190287831A1 (en) * 2018-03-14 2019-09-19 Kokusai Electric Corporation Substrate processing apparatus, substrate processing system and method of manufacturing semiconductor device
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JP6285275B2 (ja) 2018-02-28
KR102369833B1 (ko) 2022-03-03
KR20150125593A (ko) 2015-11-09
US10468284B2 (en) 2019-11-05
JP2015211206A (ja) 2015-11-24
US20180047603A1 (en) 2018-02-15

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