US20140345830A1 - Dc motor device and dc fan using the same - Google Patents

Dc motor device and dc fan using the same Download PDF

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Publication number
US20140345830A1
US20140345830A1 US14/147,455 US201414147455A US2014345830A1 US 20140345830 A1 US20140345830 A1 US 20140345830A1 US 201414147455 A US201414147455 A US 201414147455A US 2014345830 A1 US2014345830 A1 US 2014345830A1
Authority
US
United States
Prior art keywords
sheet
heat dissipating
fins
retaining
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/147,455
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English (en)
Inventor
Yung-Li JANG
Kai-Hua Wang
Ming-Chih Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wistron Corp
Original Assignee
Wistron Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wistron Corp filed Critical Wistron Corp
Assigned to WISTRON CORP. reassignment WISTRON CORP. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, MING-CHIH, JANG, YUNG-LI, WANG, Kai-hua
Publication of US20140345830A1 publication Critical patent/US20140345830A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/30—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being attachable to the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/12—Fastening; Joining by methods involving deformation of the elements

Definitions

  • the present disclosure relates to a heat dissipating device, and in particular, to a heat dissipating device with fins.
  • the fins and the heat pipe are fixed on the substrate thereof by solder paste.
  • the solder paste should be reduced through the redesigning of the structure of the heat dissipating device.
  • manufacturing cost may be decreased because the solder process is performed by manual labor.
  • the present disclosure provides a heat dissipating device assembled without solder paste.
  • the present disclosure provides a heat dissipating device including a substrate, a plurality of the first fins and a heat pipe.
  • the substrate has a plurality of retaining holes.
  • Each of the first fins includes a heat dissipating sheet, a contacting sheet, and a retaining sheet.
  • the heat dissipating sheet has a receiving hole.
  • the contacting sheet is extended from the heat dissipating sheet.
  • the retaining sheet is extended from the heat dissipating sheet, and passes through one of the retaining holes.
  • the heat pipe is disposed on the receiving hole, and contacts with the contacting sheet.
  • the present disclosure provides a heat dissipating device including a substrate, a plurality of the first fins, and a heat pipe.
  • the substrate has a retaining hole.
  • Each of the first fins includes a heat dissipating sheet, a contacting sheet and a first retaining sheet.
  • the heat dissipating sheet has a receiving hole.
  • the contacting sheet is extended from the heat dissipating sheet, and has a first end.
  • the first retaining sheet is extended from the first end, and passes through the retaining hole.
  • the heat pipe is disposed on the receiving hole, contacting with the contacting sheet.
  • the heat dissipating device of the present disclosure is fastened on the substrate by the retaining sheets of the fins to fix the heat pipe between the fins and the substrate. Moreover, solder paste is not needed during the manufacturing process of the heat dissipating device of the present disclosure, meeting environmentally friendly considerations, and decreasing manufacturing costs.
  • FIG. 1 is a perspective view of a heat dissipating device according to a first embodiment of the present disclosure
  • FIG. 3 is a cross-sectional view of the heat dissipating device according to the first embodiment of the present disclosure
  • FIG. 4 is a perspective view of a first fin according to the first embodiment view of the present disclosure.
  • FIG. 5 is a perspective view of a second fin according to the first embodiment of the present disclosure.
  • FIG. 6 is a perspective view of a heat dissipating device according to a second embodiment of the present disclosure.
  • FIG. 7 is an exploded view of the heat dissipating device according to the second embodiment of the present disclosure.
  • FIG. 8 is a perspective view of a first fin according to the second embodiment of the present disclosure.
  • FIG. 9 is a perspective view of a heat dissipating device according to a third embodiment of the present disclosure.
  • FIG. 10 is a perspective view of a substrate according to the third embodiment of the present disclosure.
  • FIG. 11 is a perspective view of the first fin and second fin according to the third embodiment of the present disclosure.
  • FIG. 12 is a perspective view of the first fins according to the third embodiment of the present disclosure.
  • FIG. 13 is a perspective view of the second fins according to the third embodiment of the present disclosure.
  • FIG. 1 is a perspective view of a heat dissipating device 1 according to a first embodiment of the present disclosure.
  • FIG. 2 is an exploded view of the heat dissipating device 1 according to the first embodiment of the present disclosure, wherein the retaining sheet 22 is unbent.
  • FIG. 3 is a cross-sectional view of the heat dissipating device 1 according to the first embodiment of the present disclosure.
  • FIG. 4 is a perspective view of a first fin 20 according to the first embodiment view of the present disclosure.
  • FIG. 5 is a perspective view of a second fin 30 according to the first embodiment of the present disclosure.
  • the heat dissipating device 1 may be disposed in a portable electronic device (not shown) to provide a dissipating function.
  • the heat dissipating device 1 includes a substrate 10 , a plurality of first fins 20 , a plurality of second fins 30 and a heat pipe 40 .
  • the substrate 10 may be a printed circuit board or a supporting board in an electronic device.
  • the supporting board is made of heat-conducting or electrically conducting material, such as metal, and is utilized for disposing a variety of electronic elements thereon, such as a printed circuit board, a power supply, or a fan.
  • the substrate 10 may be a sheet structure, and has a plurality of retaining holes 11 arranged along an arrangement direction D1.
  • the retaining holes 11 may be rectangular and extended along an extension direction D2, which is perpendicular to the arrangement direction D1.
  • a part of the retaining holes 11 are located at the edge of the substrate 10 , and is respectively communicated with the openings 12 located at the edge of the substrate 10 .
  • the first fins 20 is made from a metal sheet by a stamping process.
  • the first fins 20 may be a sheet structure including a first body 21 and two retaining sheets 22 .
  • the retaining sheets 22 are extended from the first body 21 , and contact with the substrate 10 .
  • the first body 21 includes a first heat dissipating sheet 211 , a first contacting sheet 212 , and a first spacing sheet 213 .
  • the first heat dissipating sheet 211 , the first contacting sheet 212 , the first spacing sheet 213 , and the retaining sheet 22 are formed as a single piece.
  • the first heat dissipating sheet 211 is a plate structure perpendicular to the arrangement direction D1.
  • the first heat dissipating sheet 211 has a receiving hole S1.
  • the first contacting sheet 212 , the first spacing sheet 213 , and the retaining sheets 22 are disposed on a surface 2111 (as shown in FIG. 4 ) of the first heat dissipating sheet 211 and extended from the first heat dissipating sheet 211 along the arrangement direction D1.
  • the first contacting sheet 212 , the first spacing sheet 213 , and the retaining sheets 22 are substantially perpendicular to the first heat dissipating sheet 211 and substantially parallel to the substrate 10 .
  • the first contacting sheet 212 is located at the edge of the receiving hole S1, and around the receiving hole S1.
  • the first spacing sheet 213 and the retaining sheets 22 are respectively located at two opposite sides of the first heat dissipating sheet 211 .
  • the retaining sheets 22 are respectively located at the two opposite sides of the receiving hole S1 and the first contacting sheet 212 .
  • the length of the retaining sheet 22 is greater than the length of the first spacing sheet 213 . In the embodiment, the length of the retaining sheet 22 is about at least two, three or four times that of the length of the first spacing sheet 213 .
  • the retaining sheets 22 and the first heat dissipating sheet 211 are respectively located at two opposite sides of the substrate 10 .
  • the second fins 30 are disposed on the first surface 13 of the substrate 10 , but not passing through the retaining holes 11 of the substrate 10 .
  • the second fins 30 include a second body 31 including a second heat dissipating sheet 311 , a second contacting sheet 312 , and a second spacing sheet 313 .
  • the second heat dissipating sheet 311 is substantially parallel to the first heat dissipating sheet 211 .
  • the structure of the second fins 30 is substantially the same as the structure of the first fins 20 . However, the second fins 30 excludes the retaining sheets 22 . Accordingly, for the description of the second fins 30 , reference can be made to the description of the first fins 20 .
  • the heat pipe 40 is extended along the arrangement direction D1 and disposed in the receiving holes S1 of the first fins 20 and the second fins 30 , and disposed on the substrate 10 .
  • the heat pipe 40 is a thin structure having a plane 41 , and thus, a heat source (not shown) may be disposed on an end of the plane 41 , wherein the heat source may be an electronic element, such as a chip.
  • the heat pipe 40 transmits the heat generated by the heat source to the first fins 20 and the second fins 30 for heat dissipation.
  • the heat pipe 40 may be a curved structure extended over the substrate 10 , and the heat source may be disposed on the substrate 10 .
  • the first fins 20 and the second fins 30 are alternately overlaid to each other along the arrangement direction D1, wherein one or more of the first fins 20 are adjacent to each other.
  • the second spacing sheet 313 abuts against an adjacent first spacing sheet 213 or another adjacent second spacing sheet 313
  • the second contacting sheet 312 abuts against an adjacent first contacting sheet 212 or another adjacent second contacting sheet 312 .
  • the first spacing sheets 213 , the second spacing sheets 313 , the first contacting sheets 212 , and the second contacting sheets 312 the first heat dissipating sheets 211 and the second heat dissipating sheets 311 are separated from each other stably.
  • the arrangement of the first fins 20 and the second fins 30 the numbers of the retaining holes 11 on the substrate 10 is decreased, and the strength of the substrate 10 is improved.
  • the heat pipe 40 is disposed on the receiving holes S1 of the first fins 20 and the second fins 30 , and contacts with the first contacting sheets 212 and the second contacting sheets 312 .
  • the substrate 10 is disposed on the heat pipe 40 , and the first fins 20 and the second fins 30 .
  • the retaining sheets 22 respectively pass through retaining holes 11 .
  • the retaining sheets 22 are bent and contacted with the second surface 14 , which is opposite to the first surface 13 , of the substrate 10 , to fasten the first fins 20 on substrate 10 .
  • the assembly of the heat dissipating device 1 is finished.
  • the first fins 20 and the second fins 30 are stably disposed on the heat pipe 40 .
  • the first heat dissipating sheets 211 press the heat pipe 40 to clamp the heat pipe 40 between the first surface 13 of the substrate 10 and the first heat dissipating sheets 211 .
  • solder paste is not needed for the assembly of the heat dissipating device 1 .
  • the assembly of the heat dissipating device 1 is able to be performed by automated equipment, and thus, labor and manufacturing costs are decreased.
  • first fins 20 or the second fins 30 includes a fastening element (not shown) to make the second fins 30 fix onto the first fins 20 or another adjacent second fin.
  • FIG. 6 is a perspective view of a heat dissipating device 1 a according to a second embodiment of the present disclosure.
  • FIG. 7 is an exploded view of the heat dissipating device 1 a according to the second embodiment of the present disclosure.
  • FIG. 8 is a perspective view of a first fin 20 a according to the second embodiment of the present disclosure.
  • the substrate 10 a has two retaining holes 11 a parallel to each other, and the retaining holes 11 a are extended along the arrangement direction D1.
  • the retaining sheet 22 a is extended from the first end 2121 of the sheet 212 along the extension direction D2.
  • the first fins 20 a and the second fins 30 are stacked along the arrangement direction D1, wherein the first fins 20 a are stacked to each other, and all of the first fins 20 a are located between the second fins 30 .
  • the retaining sheets 22 a are unbent.
  • the retaining sheets 22 a pass through the retaining holes 11 a and bend to the substrate 10 .
  • the second fins 30 may be excluded.
  • FIG. 9 is a perspective view of a heat dissipating device 1 b according to a third embodiment of the present disclosure.
  • FIG. 10 is a perspective view of a substrate 10 b according to the third embodiment of the present disclosure.
  • FIG. 11 is a perspective view of the first fins 20 b and the second fins 30 b according to the third embodiment of the present disclosure.
  • FIG. 12 is a perspective view of the first fins 20 b according to the third embodiment of the present disclosure.
  • FIG. 13 is a perspective view of the second fins 30 b according to the third embodiment of the present disclosure.
  • the substrate 10 b has a retaining hole 11 b extended along the arrangement direction D1.
  • Two L-shaped fastening elements 15 are disposed on the edge of the substrate 10 b , wherein the L-shaped fastening element 15 includes a first plate 151 and a second plate 152 .
  • the first plate 151 is connected to the edge of the substrate 10 , and is perpendicular to the substrate 10 .
  • the second plate 152 is connected to the first plate 151 , and is perpendicular to the first plate 151 and parallel to substrate 10 .
  • the retaining holes 11 , and the connection of the first plate 151 and the substrate 10 are extended along the arrangement direction D1.
  • the heat pipe 40 is located between the L-shaped fastening elements 15 and the substrate 10 .
  • the retaining sheets 22 b and 22 c of the first fins 20 b are respectively extended from the first end 2121 and the second end 2122 of the first contacting sheet 212 .
  • the retaining sheet 22 b and the retaining sheet 22 c are extended to each other.
  • the first spacing sheet 213 of the first embodiment may be excluded.
  • the second fins 30 b has a second body 31 b and a fastening portion 32 b .
  • the second body 31 b includes a second heat dissipating sheet 311 b and a second contacting sheet 312 b .
  • the second heat dissipating sheet 311 b and the second contacting sheet 312 b of the second fins 30 b are an L-shape.
  • the fastening portion 32 b is extended from one end of the second contacting sheet 312 b.
  • the retaining sheets 22 b and 22 c are unbent.
  • the retaining sheets 22 b pass through the retaining holes 11 b and are bent to the substrate 10 .
  • the retaining sheets 22 c and the fastening portions 32 b are bent to the heat pipe 40 , and fastened on heat pipe 40 .
  • the heat dissipating device of the present disclosure is fastened on the substrate by the retaining sheets of the fins to fix the heat pipe between the fins and the substrate. Moreover, solder paste is not needed during the manufacturing process of the heat dissipating device of the present disclosure for environmentally friendly considerations, and thus, the manufacturing costs are decreased.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Geometry (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
US14/147,455 2013-05-27 2014-01-03 Dc motor device and dc fan using the same Abandoned US20140345830A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201310201784.X 2013-05-27
CN201310201784.XA CN104185401A (zh) 2013-05-27 2013-05-27 散热装置

Publications (1)

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US20140345830A1 true US20140345830A1 (en) 2014-11-27

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US14/147,455 Abandoned US20140345830A1 (en) 2013-05-27 2014-01-03 Dc motor device and dc fan using the same

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US (1) US20140345830A1 (zh)
CN (1) CN104185401A (zh)
TW (1) TWI487476B (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017028066A (ja) * 2015-07-21 2017-02-02 株式会社リコー 放熱器、放熱ユニット及び画像形成装置
CN111954432A (zh) * 2019-05-15 2020-11-17 中科寒武纪科技股份有限公司 散热装置和板卡
US20210270538A1 (en) * 2019-09-05 2021-09-02 Ldc Precision Engineering Co., Ltd. Fast heat-sinking device for evaporators
US20230235968A1 (en) * 2022-01-21 2023-07-27 Dongguan Hanxu Hardware Plastic Technology Co., Ltd. Tight-fit riveting structure for clustered radiation fin set and heat pipe and riveting method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110459968A (zh) * 2019-08-19 2019-11-15 徐州三科电气有限公司 一种安全性高的高压电器放置装置

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US4009752A (en) * 1975-02-24 1977-03-01 Honeywell Information Systems Inc. Warp-resistant heat sink
US6257314B1 (en) * 1999-05-27 2001-07-10 Chaun-Choung Industrial Corp. Radiator shaping device
US6408935B1 (en) * 2000-08-16 2002-06-25 Thermal Corp. Heat sink assembly with over-molded cooling fins
US6742573B2 (en) * 1999-08-18 2004-06-01 The Furukawa Electric Co., Ltd. Heat sink including a heat dissipating fin and method for fixing the heat dissipating fin
US20070051495A1 (en) * 2005-09-07 2007-03-08 Kuang-Ming Hsiao Heat-dissipating device with thin fins
US7275587B2 (en) * 2006-01-20 2007-10-02 Hua-Shou Kuo Combination cooler module
US20080060793A1 (en) * 2006-09-08 2008-03-13 Tsung-Hsien Huang Cooler device
US20090194254A1 (en) * 2008-02-01 2009-08-06 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device for led lamp

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TW201109901A (en) * 2009-09-11 2011-03-16 Foxconn Tech Co Ltd Heat sink
TW201122784A (en) * 2009-12-24 2011-07-01 Shi-Ming Chen Method of tightly combining heat sink fins and hot pipe.
CN102522381B (zh) * 2011-12-22 2015-09-30 东莞汉旭五金塑胶科技有限公司 一种散热器及其制造方法

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Publication number Priority date Publication date Assignee Title
US4009752A (en) * 1975-02-24 1977-03-01 Honeywell Information Systems Inc. Warp-resistant heat sink
US6257314B1 (en) * 1999-05-27 2001-07-10 Chaun-Choung Industrial Corp. Radiator shaping device
US6742573B2 (en) * 1999-08-18 2004-06-01 The Furukawa Electric Co., Ltd. Heat sink including a heat dissipating fin and method for fixing the heat dissipating fin
US6408935B1 (en) * 2000-08-16 2002-06-25 Thermal Corp. Heat sink assembly with over-molded cooling fins
US20070051495A1 (en) * 2005-09-07 2007-03-08 Kuang-Ming Hsiao Heat-dissipating device with thin fins
US7275587B2 (en) * 2006-01-20 2007-10-02 Hua-Shou Kuo Combination cooler module
US20080060793A1 (en) * 2006-09-08 2008-03-13 Tsung-Hsien Huang Cooler device
US20090194254A1 (en) * 2008-02-01 2009-08-06 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device for led lamp

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017028066A (ja) * 2015-07-21 2017-02-02 株式会社リコー 放熱器、放熱ユニット及び画像形成装置
CN111954432A (zh) * 2019-05-15 2020-11-17 中科寒武纪科技股份有限公司 散热装置和板卡
EP3739285A1 (en) * 2019-05-15 2020-11-18 Cambricon Technologies Corporation Limited Heat dissipation device and board card
US20210270538A1 (en) * 2019-09-05 2021-09-02 Ldc Precision Engineering Co., Ltd. Fast heat-sinking device for evaporators
US11747091B2 (en) * 2019-09-05 2023-09-05 Ldc Precision Engineering Co., Ltd. Fast heat-sinking device for evaporators
US20230235968A1 (en) * 2022-01-21 2023-07-27 Dongguan Hanxu Hardware Plastic Technology Co., Ltd. Tight-fit riveting structure for clustered radiation fin set and heat pipe and riveting method
US11953268B2 (en) * 2022-01-21 2024-04-09 Dongguan Hanxu Hardware Plastic Technology Co., Ltd. Tight-fit riveting structure for clustered radiation fin set and heat pipe and riveting method

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Publication number Publication date
CN104185401A (zh) 2014-12-03
TWI487476B (zh) 2015-06-01
TW201446124A (zh) 2014-12-01

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