US20070051495A1 - Heat-dissipating device with thin fins - Google Patents

Heat-dissipating device with thin fins Download PDF

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Publication number
US20070051495A1
US20070051495A1 US11/219,789 US21978905A US2007051495A1 US 20070051495 A1 US20070051495 A1 US 20070051495A1 US 21978905 A US21978905 A US 21978905A US 2007051495 A1 US2007051495 A1 US 2007051495A1
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US
United States
Prior art keywords
fins
heat
base
dissipating device
grooves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/219,789
Inventor
Kuang-Ming Hsiao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Amulaire Thermal Tech Inc
Original Assignee
Amulaire Thermal Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amulaire Thermal Tech Inc filed Critical Amulaire Thermal Tech Inc
Priority to US11/219,789 priority Critical patent/US20070051495A1/en
Assigned to AERIS THERMAL TECHNOLOGY, INC. reassignment AERIS THERMAL TECHNOLOGY, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HSIAO, KUANG-MING
Assigned to AMULAIRE THERMAL TECHNOLOGY, INC. reassignment AMULAIRE THERMAL TECHNOLOGY, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AERIS THERMAL TECHNOLOGY, INC.
Publication of US20070051495A1 publication Critical patent/US20070051495A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention is related to a heat-dissipating device with thin fins, and more particularly, to a heat-dissipating device with fins thinner than conventional ones.
  • the number of fins of the heat-dissipating device can be increased to enlarge the heat-dissipating area, so the heat-dissipating efficiency can be enhanced.
  • the grooves of the present invention don't need to be narrowed, so the manufacture of the present invention is easy and the overall cost is low.
  • a heat-dissipating device is usually attached to the electronic heat source.
  • the heat-dissipating device has a larger heat-dissipating surface.
  • the heat-dissipating device uses its heat-dissipating fins to dissipate heat.
  • the conventional heat-dissipating device 9 includes a plate-shaped base 91 and multiple fins 92 .
  • the plate-shaped base 91 and the fins 92 are made of copper or aluminum, which has a good heat-transfer property.
  • the plate-shaped base 91 has multiple parallel grooves 911 .
  • the fins 92 are sheet-shaped. The lower ends of the fins 92 are first placed within the grooves 911 of the plate-shaped base 91 and then clipped or welded therein.
  • the fins 92 are periodically disposed on the plate-shaped base 91 and the spacing distance of the fins 92 is d.
  • the fins 92 can be made thinner, so the number of fins 92 can be increased without changing the spacing distance.
  • the grooves 911 of the plate-shaped base 91 must be narrowed correspondingly. This increases the difficulty and cost of manufacture.
  • An objective of the present invention is to provide a heat-dissipating device, which has fins thinner than conventional ones.
  • the number of fins of the heat-dissipating device can thus be increased to enlarge the heat-dissipating area, thereby enhancing the heat-dissipating efficiency thereof.
  • each of the fins has one end formed with a folded portion.
  • the ends of the folded portions are thicker than the fins themselves.
  • the grooves for disposition of the fines can be made wider, so the manufacture of the present invention is easy and the overall cost is low.
  • the present invention provides a heat-dissipating device, including a base and multiple fins.
  • the base has a plurality of grooves formed periodically thereon.
  • Each of the fins has an end formed with a folded portion. The ends with the folded portions are thicker than the fins themselves, and are fixed within the grooves of the base.
  • FIG. 1 is a cross-sectional view of a conventional heat-dissipating device
  • FIG. 2 is a cross-sectional view of another conventional heat-dissipating device
  • FIG. 3 is a decomposed view of a heat-dissipating device in accordance with the present invention.
  • FIG. 4 is a combined view of the heat-dissipating device in accordance with the present invention.
  • FIG. 5 is a cross-sectional view of a portion of the heat-dissipating device in accordance with the present invention.
  • the present invention provides a heat-dissipating device with thin fins. It includes a base 1 and multiple fins 2 .
  • the base 1 is made of copper or aluminum, which has a good heat-transfer property.
  • the base 1 has a central portion 11 and two wing portions 12 extending out from the central portion 11 .
  • the base 1 has multiple parallel grooves 13 , which are formed periodically on the central portion 11 and the wing portions 12 for disposition of the fins 2 .
  • the fins 2 are sheet-shaped and made of copper or aluminum, which has a good heat-transfer property.
  • the fins 2 are thinner than conventional ones, and each has one end formed with a folded portion 21 .
  • the folded portion 21 is formed at the end for disposition on the base 1 , i.e. the lower end. Since the folded portions 21 are formed by folding the fins 2 , they are thicker and have twice width of the fins 2 . Hence, the grooves 13 of the base 1 can be made wider than the fins 2 .
  • the base 1 is first heated to a temperature ranging from 1000-1100° C.
  • the base is completely softened and the folded portions 21 of the fins 2 can be easily disposed within the grooves 13 .
  • two opposite sides of the base 1 are pressed equivalently by an external force to change the shape of the groove 13 to clip the ends of the fins 2 with the folded portions 21 . In this way, the fins 2 are fixed on the base 1 .
  • the heat-dissipating device of the present invention is provided.
  • the method of using an external force to press two opposite sides of the base 1 to clip the fins 2 to fix the fins 2 on the base 1 is just a preferred embodiment.
  • the present invention is not limited thereto.
  • the fins 2 can be fixed on the base by welding or other methods.
  • the fins 2 of the present invention can be made thinner than the conventional ones, so the number of fins 2 can be increased without changing the spacing distance. In this way, the heat-dissipating area of the heat-dissipating device is enlarged and the heat-dissipating efficiency is thus enhanced effectively.
  • the lower ends of the fins 2 are formed with the folded portions 21 , so the lower ends of the fins 2 are thicker. In this way, although the fins 2 are made thinner, the grooves 13 of the base 1 don't need to be narrowed. Therefore, the grooves 13 can still be made relatively wider. This method lowers the difficulty and cost of manufacture.

Abstract

A heat-dissipating device with a base and multiple fins is described. The base has multiple grooves formed periodically thereon. Each of the fins has an end formed with a folded portion. The ends with the folded portions are thicker than the fins themselves and fixed within the grooves of the base. The fins can be made thinner than conventional ones. Hence, the number of the fins of the heat-dissipating device can be increased to enhance the heat-dissipating efficiency thereof. Furthermore, the grooves of the present invention can be made wider, so the manufacture of the present invention is easy and the overall cost is low.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention is related to a heat-dissipating device with thin fins, and more particularly, to a heat-dissipating device with fins thinner than conventional ones. Hence, the number of fins of the heat-dissipating device can be increased to enlarge the heat-dissipating area, so the heat-dissipating efficiency can be enhanced. Furthermore, the grooves of the present invention don't need to be narrowed, so the manufacture of the present invention is easy and the overall cost is low.
  • 2. Description of Related Art
  • With the rapid progress of computer industries, electronic heat sources, such as chips or central processing units (CPUs), have faster and faster processing speeds and produce increasing amounts of heat. In order to dissipate heat and maintain a normal operation state, a heat-dissipating device is usually attached to the electronic heat source. The heat-dissipating device has a larger heat-dissipating surface. The heat-dissipating device uses its heat-dissipating fins to dissipate heat.
  • Reference is made to FIG. 1. The conventional heat-dissipating device 9 includes a plate-shaped base 91 and multiple fins 92. The plate-shaped base 91 and the fins 92 are made of copper or aluminum, which has a good heat-transfer property. The plate-shaped base 91 has multiple parallel grooves 911. The fins 92 are sheet-shaped. The lower ends of the fins 92 are first placed within the grooves 911 of the plate-shaped base 91 and then clipped or welded therein. The fins 92 are periodically disposed on the plate-shaped base 91 and the spacing distance of the fins 92 is d.
  • Reference is made to FIG. 2. In order to enlarge the heat-dissipating area of the heat-dissipating device 9 to enhance the heat-dissipating efficiency, the fins 92 can be made thinner, so the number of fins 92 can be increased without changing the spacing distance. However, when the fins 92 are made thinner, the grooves 911 of the plate-shaped base 91 must be narrowed correspondingly. This increases the difficulty and cost of manufacture.
    • SUMMARY OF THE INVENTION
  • An objective of the present invention is to provide a heat-dissipating device, which has fins thinner than conventional ones. The number of fins of the heat-dissipating device can thus be increased to enlarge the heat-dissipating area, thereby enhancing the heat-dissipating efficiency thereof. Furthermore, each of the fins has one end formed with a folded portion. Thus, the ends of the folded portions are thicker than the fins themselves. Hence, the grooves for disposition of the fines can be made wider, so the manufacture of the present invention is easy and the overall cost is low.
  • For achieving the objective above, the present invention provides a heat-dissipating device, including a base and multiple fins. The base has a plurality of grooves formed periodically thereon. Each of the fins has an end formed with a folded portion. The ends with the folded portions are thicker than the fins themselves, and are fixed within the grooves of the base.
  • Numerous additional features, benefits and details of the present invention are described in the detailed description, which follows.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The foregoing aspects and many of the attendant advantages of this invention will be more readily appreciated as the same becomes better understood by reference to the following detailed description, when taken in conjunction with the accompanying drawings, wherein:
  • FIG. 1 is a cross-sectional view of a conventional heat-dissipating device;
  • FIG. 2 is a cross-sectional view of another conventional heat-dissipating device;
  • FIG. 3 is a decomposed view of a heat-dissipating device in accordance with the present invention;
  • FIG. 4 is a combined view of the heat-dissipating device in accordance with the present invention; and
  • FIG. 5 is a cross-sectional view of a portion of the heat-dissipating device in accordance with the present invention.
    • DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
  • Reference is made to FIGS. 3-5. The present invention provides a heat-dissipating device with thin fins. It includes a base 1 and multiple fins 2. The base 1 is made of copper or aluminum, which has a good heat-transfer property. In this embodiment, the base 1 has a central portion 11 and two wing portions 12 extending out from the central portion 11. The base 1 has multiple parallel grooves 13, which are formed periodically on the central portion 11 and the wing portions 12 for disposition of the fins 2.
  • The fins 2 are sheet-shaped and made of copper or aluminum, which has a good heat-transfer property. The fins 2 are thinner than conventional ones, and each has one end formed with a folded portion 21. The folded portion 21 is formed at the end for disposition on the base 1, i.e. the lower end. Since the folded portions 21 are formed by folding the fins 2, they are thicker and have twice width of the fins 2. Hence, the grooves 13 of the base 1 can be made wider than the fins 2.
  • In the process to combine the base 1 and the fins 2, the base 1 is first heated to a temperature ranging from 1000-1100° C. Thus, the base is completely softened and the folded portions 21 of the fins 2 can be easily disposed within the grooves 13. After the ends of the fins 2 with the folded portions 21 are placed in the grooves 13, two opposite sides of the base 1 are pressed equivalently by an external force to change the shape of the groove 13 to clip the ends of the fins 2 with the folded portions 21. In this way, the fins 2 are fixed on the base 1. According to the above disclosure, the heat-dissipating device of the present invention is provided.
  • The method of using an external force to press two opposite sides of the base 1 to clip the fins 2 to fix the fins 2 on the base 1 is just a preferred embodiment. The present invention is not limited thereto. The fins 2 can be fixed on the base by welding or other methods.
  • As shown in FIG. 5, the fins 2 of the present invention can be made thinner than the conventional ones, so the number of fins 2 can be increased without changing the spacing distance. In this way, the heat-dissipating area of the heat-dissipating device is enlarged and the heat-dissipating efficiency is thus enhanced effectively.
  • Furthermore, the lower ends of the fins 2 are formed with the folded portions 21, so the lower ends of the fins 2 are thicker. In this way, although the fins 2 are made thinner, the grooves 13 of the base 1 don't need to be narrowed. Therefore, the grooves 13 can still be made relatively wider. This method lowers the difficulty and cost of manufacture.
  • Although the present invention has been described with reference to the preferred embodiments thereof, it will be understood that the invention is not limited to the details thereof. Various substitutions and modifications have been suggested in the foregoing description, and others will occur to those of ordinary skill in the art. Therefore, all such substitutions and modifications are embraced within the scope of the invention as defined in the appended claims.

Claims (6)

1. A heat-dissipating device, comprising:
a base, including a plurality of grooves formed periodically thereon; and
a plurality of fins, wherein each fin has an end formed with a folded portion, ends with the folded portions being thicker than the fins themselves, and the ends with the folded portions being fixed within the grooves of the base.
2. The heat-dissipating device as claimed in claim 1, wherein the folded portions are formed at lower ends of the fins.
3. The heat-dissipating device as claimed in claim 1, wherein the base is made of copper or aluminum.
4. The heat-dissipating device as claimed in claim 1, wherein the base has a central portion and two wing portions extending from the central portion, and the grooves are formed periodically on the central portion and the wing portions.
5. The heat-dissipating device as claimed in claim 1, wherein the fins are made of copper or aluminum.
6. The heat-dissipating device as claimed in claim 1, wherein the base is first heated and thus softened, and two opposite sides of the base are then pressed equivalently by an external force to change a shape of the grooves, thereby clipping the ends with the folded portions.
US11/219,789 2005-09-07 2005-09-07 Heat-dissipating device with thin fins Abandoned US20070051495A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US11/219,789 US20070051495A1 (en) 2005-09-07 2005-09-07 Heat-dissipating device with thin fins

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080060793A1 (en) * 2006-09-08 2008-03-13 Tsung-Hsien Huang Cooler device
US20090145580A1 (en) * 2007-12-10 2009-06-11 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat sink and a method of manufacturing the heat sink
US20090284933A1 (en) * 2008-05-15 2009-11-19 Edison Opto Corporation Combination type heat dissipation module
US20100263850A1 (en) * 2009-04-17 2010-10-21 Tsung-Hsien Huang Heat sink
ITBO20110499A1 (en) * 2011-08-24 2013-02-25 Mecc Al S R L METHOD FOR THE REALIZATION OF A SINK AND SINK WHEN OBTAINED
US20140345830A1 (en) * 2013-05-27 2014-11-27 Wistron Corp. Dc motor device and dc fan using the same
US20150136363A1 (en) * 2013-11-18 2015-05-21 Tsung-Hsien Huang Combination heat sink assembly
US20170175744A1 (en) * 2015-12-21 2017-06-22 Ingersoll-Rand Company Compressor with ribbed cooling jacket
US9802280B2 (en) * 2012-08-01 2017-10-31 Asia Vital Components Co., Ltd. Heat sink structure and manufacturing method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5771966A (en) * 1995-12-15 1998-06-30 Jacoby; John Folded conducting member heatsinks and method of making same
US6049458A (en) * 1997-12-01 2000-04-11 Hon Hai Precision Ind. Co., Ltd. Protective cap for thermal grease of heat sink
US6742581B2 (en) * 2001-11-21 2004-06-01 Fujikura Ltd. Heat sink and fin module

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5771966A (en) * 1995-12-15 1998-06-30 Jacoby; John Folded conducting member heatsinks and method of making same
US6049458A (en) * 1997-12-01 2000-04-11 Hon Hai Precision Ind. Co., Ltd. Protective cap for thermal grease of heat sink
US6742581B2 (en) * 2001-11-21 2004-06-01 Fujikura Ltd. Heat sink and fin module

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080060793A1 (en) * 2006-09-08 2008-03-13 Tsung-Hsien Huang Cooler device
US20090145580A1 (en) * 2007-12-10 2009-06-11 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat sink and a method of manufacturing the heat sink
US20090284933A1 (en) * 2008-05-15 2009-11-19 Edison Opto Corporation Combination type heat dissipation module
US20100263850A1 (en) * 2009-04-17 2010-10-21 Tsung-Hsien Huang Heat sink
US8555952B2 (en) * 2009-04-17 2013-10-15 Tsung-Hsien Huang Heat sink with fins having angled foot portion
ITBO20110499A1 (en) * 2011-08-24 2013-02-25 Mecc Al S R L METHOD FOR THE REALIZATION OF A SINK AND SINK WHEN OBTAINED
US9802280B2 (en) * 2012-08-01 2017-10-31 Asia Vital Components Co., Ltd. Heat sink structure and manufacturing method thereof
US20140345830A1 (en) * 2013-05-27 2014-11-27 Wistron Corp. Dc motor device and dc fan using the same
US20150136363A1 (en) * 2013-11-18 2015-05-21 Tsung-Hsien Huang Combination heat sink assembly
US9297597B2 (en) * 2013-11-18 2016-03-29 Tsung-Hsien Huang Combination heat sink assembly
US20170175744A1 (en) * 2015-12-21 2017-06-22 Ingersoll-Rand Company Compressor with ribbed cooling jacket
US10718334B2 (en) * 2015-12-21 2020-07-21 Ingersoll-Rand Industrial U.S., Inc. Compressor with ribbed cooling jacket

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AS Assignment

Owner name: AERIS THERMAL TECHNOLOGY, INC., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HSIAO, KUANG-MING;REEL/FRAME:016811/0037

Effective date: 20050906

AS Assignment

Owner name: AMULAIRE THERMAL TECHNOLOGY, INC., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:AERIS THERMAL TECHNOLOGY, INC.;REEL/FRAME:017335/0293

Effective date: 20060313

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION