US20100282444A1 - Heat-dissipating fin assembly with heat-conducting structure - Google Patents

Heat-dissipating fin assembly with heat-conducting structure Download PDF

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Publication number
US20100282444A1
US20100282444A1 US12/512,341 US51234109A US2010282444A1 US 20100282444 A1 US20100282444 A1 US 20100282444A1 US 51234109 A US51234109 A US 51234109A US 2010282444 A1 US2010282444 A1 US 2010282444A1
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US
United States
Prior art keywords
heat
dissipating fin
protrusions
dissipating
assembly according
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
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US12/512,341
Inventor
Kuo-Len Lin
Chih-Hung Cheng
Kuan-Da Pan
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KUAN DING TECHNOLOGY Co Ltd
CpuMate Inc
Golden Sun News Techniques Co Ltd
Original Assignee
KUAN DING TECHNOLOGY Co Ltd
CpuMate Inc
Golden Sun News Techniques Co Ltd
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Assigned to CPUMATE INC, GOLDEN SUN NEWS TECHNIQUES CO., LTD., KUAN DING TECHNOLOGY CO., LTD. reassignment CPUMATE INC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHENG, CHIH-HUNG, LIN, KUO-LEN, PAN, KUAN-DA
Publication of US20100282444A1 publication Critical patent/US20100282444A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • F28F1/325—Fins with openings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat-dissipating fin assembly, and in particular to a heat-dissipating fin assembly having surface processing.
  • a heat sink is attached to an electronic element that generates a large amount of heat, thereby dissipating the heat generated by the electronic element.
  • the heat sink may be a heat-dissipating fin assembly and a fan, whereby the heat generated by the electronic element can be conducted to the heat-dissipating fin assembly. Then, the airflow generated by the heat-dissipating fan takes away the heat of the heat-dissipating fin assembly by means of forced airflow, thereby reducing the temperature of the electronic element.
  • Taiwan Patent Publication No. M295287 discloses a plurality of air-guiding portions provided on one side of the heat-dissipating fin.
  • the air-guiding portion is constituted of a plurality of cusps formed by a pressing process.
  • the air-guiding portion in order not to block the forward movement of the airflow, is constituted of a plurality of cusps, so that the surface turbulence and the heat-dissipating area can be only increased to a limited extent.
  • the present invention is to provide a heat-dissipating fin assembly with heat-conducting structure, whereby the surface turbulence and the heat-dissipating area of the heat-dissipating fin can be increased so as to enhance the heat-exchange efficiency.
  • the present invention provides a heat-dissipating fin assembly with heat-conducting structure, whose one side is provided with an air-guiding piece for guiding airflow into channels among the heat-dissipating fins.
  • the present invention includes a first heat-dissipating fin and a second heat-dissipating fin.
  • the first heat-dissipating fin has a first surface.
  • the first surface is provided with a plurality of first protrusions arranged at intervals.
  • the second heat-dissipating fin is overlapped with the first heat-dissipating fin and has a second surface toward the first surface.
  • the second surface is provided with a plurality of second protrusions arranged at intervals.
  • the second protrusions are arranged to correspond to the first protrusions.
  • first heat-dissipating fin and the second heat-dissipating fin are provided with a plurality of corresponding first protrusions and second protrusions respectively
  • the first protrusions and the second protrusions that are arranged at intervals and correspond to each other can increase the surface turbulent between the first heat-dissipating fin and the second heat-dissipating fin.
  • the forward movement of airflow will not be affected while the heat-dissipating area there between can be increased. Therefore, the heat-exchange efficiency can be enhanced.
  • FIG. 1 is a perspective view showing the external appearance of the first heat-dissipating fin of the present invention
  • FIG. 2 is an assembled perspective view showing the first and second heat-dissipating fins of the present invention
  • FIG. 3 is an assembled top view showing the first and second heat-dissipating fins of the present invention.
  • FIG. 4 is a partially cross-sectional view taken along the line 4 - 4 in FIG. 3 ;
  • FIG. 5 is a schematic view (I) showing the operating state of the heat-dissipating fin of the present invention
  • FIG. 6 is a schematic view (II) showing the operating state of the heat-dissipating fin of the present invention
  • FIG. 7 is an assembled top view showing the first and second heat-dissipating fins according to the second embodiment of the present invention.
  • FIG. 8 is a partially assembled cross-sectional view showing the first and second heat-dissipating fins according to the second embodiment of the present invention.
  • FIGS. 1 and 2 are perspective views showing the external appearance of the heat-dissipating fin assembly of the present invention.
  • the heat-dissipating fin assembly of the present invention includes a first heat-dissipating fin 10 and a second heat-dissipating fin 20 that are overlapped with each other.
  • the first heat-dissipating fin 10 has a first surface 11 .
  • the first surface 11 is provided with a plurality of first protrusions 12 .
  • Each of the first protrusion 12 is a rib.
  • the first protrusions 12 are arranged at intervals and parallel to one another obliquely.
  • Each of the two opposite sides 101 , 102 of the first heat-dissipating fin 10 is perpendicularly bent toward the same direction to form a first bending piece 13 , so that a gap can be formed between the first heat-dissipating fin 10 and the second heat-dissipating fin 20 by supporting of the first bending pieces 13 when they are overlapped with each other.
  • the height of the first bending piece 13 is larger than that of the first protrusion 12 .
  • the other side of the first heat-dissipating fin 10 that is perpendicular to the first bending piece 13 is provided with two first air-guiding pieces 14 , 14 a .
  • the two first air-guiding pieces 14 , 14 a form an opposite inclined angle with respect to the first surface 11 respectively.
  • the number and arrangement of the air-guiding pieces can be changed according to practical demands. Alternatively, there may be only one air-guiding piece.
  • the first heat-dissipating piece 10 can be provided with a plurality of through-holes 100 for allowing at least one heat pipe 30 ( FIG. 5 ) to penetrate therein.
  • the first heat-dissipating fin 10 is provided with a flange 15 at the periphery of the through-hole 100 so as to increase the contact area between the first heat-dissipating fin 10 and the heat pipe 30 .
  • the first heat-dissipating fin 10 is provided with a plurality of other first protrusions 12 a .
  • the first protrusions 12 , 12 a are located on both sides of the through-hole 100 and are oriented in opposite directions. Since the heat-dissipating fins are overlapped with each other, the other surface 11 ′ of the first heat-dissipating fin 10 opposite to the first surface 11 is provided with a plurality of second protrusions 12 ′. The second protrusions 12 ′ on the other surface 11 ′ are staggered with respect to the second protrusions 12 on the first surface 11 . Since the heat-dissipating fins are made of materials of good heat-dissipating property (such as aluminum), the ribs on its surface can be formed by means of a pressing process. Thus, the other surface of the rib forms a trough. As a result, the second protrusions 12 ′ form a plurality of troughs on the first surface 11 .
  • the second heat-dissipating fins 20 are overlapped with the first heat-dissipating fins 10 .
  • the arrangement of the second heat-dissipating fin 20 is substantially the same as that of the second heat-dissipating fin 10 and has a second surface 21 toward the first surface 11 .
  • the second surface 21 is provided with a plurality of second protrusions 22 , 22 a .
  • the arrangement of the second protrusions 22 , 22 a correspond to that of the first protrusions 12 , 12 a .
  • the second protrusions 22 , 22 a are ribs arranged at intervals and parallel to one another obliquely.
  • the opposite two sides 201 , 202 of the second heat-dissipating fin 20 are bent toward the same side to form a second bending piece 23 , while the other side 203 is provided with two first air-guiding pieces 24 , 24 a .
  • the second heat-dissipating fin 20 is provided with a through-hole 200 and a second flange 25 to correspond to the first heat-dissipating fin 10 .
  • the difference between the second heat-dissipating fin 20 and the first heat-dissipating fin 10 lies in that: the second protrusions 22 , 22 a are arranged obliquely in a direction opposite to that of the first protrusions 12 , 12 a .
  • the second protrusions 22 , 22 a are staggered with respect to the first protrusions 12 , 12 a .
  • the second heat-dissipating fin 20 is also provided with a plurality of second protrusions 22 ′ on the other surface 21 ′ opposite to the second surface 21 .
  • FIGS. 3 and 4 are a top view and a cross-sectional view showing the overlapping of the first heat-dissipating fin 10 and the second heat-dissipating fin 20 . It can be seen that, when overlapped, the first protrusions 12 and the second protrusions 22 are staggered to form a plurality of contacting points A. The second bending piece 23 is overlapped on the first bending piece 13 , so that an airflow channel is formed there between.
  • FIGS. 5 and 6 show the operating state of the heat-conducting structure of the heat-dissipating fin of the present invention.
  • the elements of the first heat-dissipating fin 10 and the second heat-dissipating fin 20 are described as an example.
  • the first heat-dissipating fins 10 and the second heat-dissipating fins 20 are overlapped orderly to form a heat-dissipating fin assembly 1 .
  • a plurality of heat pipes 30 penetrates into the heat-dissipating fin assembly 1 .
  • One side of the heat-dissipating fin assembly 1 is provided with an axial fan 40 .
  • the airflow generated by the axial fan 40 is guided by the two second air-guiding pieces 14 , 14 a into the heat-dissipating fin assembly 1 .
  • the airflow entering the airflow channels passes through the staggered first protrusions 12 and the second protrusions 22 to generate turbulence. Since the first protrusions 12 and the second protrusions 22 are brought into point contact with each other, the forward movement of the airflow will not be affected.
  • the generation of the turbulence can extend the time for the airflow to stay in the channels, thereby taking away more heat of the heat-dissipating fins to enhance the heat-exchange efficiency.
  • first protrusions 12 and the second protrusions 22 increase the heat-dissipating area of the first heat-dissipating fins 10 and the second heat-dissipating fins 20 , thereby facilitating the turbulence to take away more heat and accelerating the heat dissipation.
  • FIGS. 7 and 8 are a top view and a cross-sectional view showing the overlapping of the first heat-dissipating fin and the second heat-dissipating fin according to the second embodiment of the present invention.
  • the second embodiment is substantially identical to the first embodiment, and it has a first heat-dissipating fin 50 and a second heat-dissipating fin 60 .
  • a first surface 51 of the first heat-dissipating fin 50 is provided with a first protrusion 51 .
  • a first surface 61 of the second heat-dissipating fin 60 is provided with a second protrusion 61 .
  • each of the first protrusion 51 and the second protrusion 61 is a semi sphere. It can be seen that, when overlapped, the first protrusions 52 and the second protrusions 62 are brought into contact with each other to form a plurality of contact points B.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Geometry (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention relates to a heat-dissipating fin capable of increasing surface turbulence, which includes a first heat-dissipating fin and a second heat-dissipating fin. A first surface of the first heat-dissipating fin is provided with a plurality of first protrusions arranged at intervals. The second heat-dissipating fin has a second surface toward the first surface. The second surface is also provided with a plurality of second protrusions arranged at intervals. The second protrusions are arranged to correspond to the first protrusions. The second heat-dissipating fin is overlapped with the first heat-dissipating fin. With the arrangement of the first protrusions and the second protrusions, the heat-dissipating area of the first heat-dissipating fin and the second heat-dissipating fin can be increased so as to increase the surface turbulence. Thus, the heat-exchange efficiency can be enhanced.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to a heat-dissipating fin assembly, and in particular to a heat-dissipating fin assembly having surface processing.
  • 2. Description of Prior Art
  • Generally speaking, a heat sink is attached to an electronic element that generates a large amount of heat, thereby dissipating the heat generated by the electronic element. The heat sink may be a heat-dissipating fin assembly and a fan, whereby the heat generated by the electronic element can be conducted to the heat-dissipating fin assembly. Then, the airflow generated by the heat-dissipating fan takes away the heat of the heat-dissipating fin assembly by means of forced airflow, thereby reducing the temperature of the electronic element.
  • With the highly-developed semiconductor technology, computer hardware is developed to be operated in high speed or frequency in order to improve its efficiency. As a result, the power consumed by the computer hardware also increases accordingly. The heat generated by present electronic elements is much larger than that generated by traditional electronic elements. In order to improve the heat-dissipating efficiency, Taiwan Patent Publication No. M295287 discloses a plurality of air-guiding portions provided on one side of the heat-dissipating fin. The air-guiding portion is constituted of a plurality of cusps formed by a pressing process. With this arrangement, the airflow can be stayed on the heat-dissipating fin for more time and the heat-dissipating area of the heat-dissipating fin can be increased. In this way, the heat can be taken away from the heat-dissipating fin.
  • However, in the above structure, in order not to block the forward movement of the airflow, the air-guiding portion is constituted of a plurality of cusps, so that the surface turbulence and the heat-dissipating area can be only increased to a limited extent. Thus, it is an important issue to provide a heat-dissipating fin assembly that generates more turbulence and has a larger heat-dissipating area so as to increase the heat-exchange efficiency.
    • SUMMARY OF THE INVENTION
  • The present invention is to provide a heat-dissipating fin assembly with heat-conducting structure, whereby the surface turbulence and the heat-dissipating area of the heat-dissipating fin can be increased so as to enhance the heat-exchange efficiency.
  • The present invention provides a heat-dissipating fin assembly with heat-conducting structure, whose one side is provided with an air-guiding piece for guiding airflow into channels among the heat-dissipating fins.
  • The present invention includes a first heat-dissipating fin and a second heat-dissipating fin. The first heat-dissipating fin has a first surface. The first surface is provided with a plurality of first protrusions arranged at intervals. The second heat-dissipating fin is overlapped with the first heat-dissipating fin and has a second surface toward the first surface. The second surface is provided with a plurality of second protrusions arranged at intervals. The second protrusions are arranged to correspond to the first protrusions.
  • In comparison with prior art, since the first heat-dissipating fin and the second heat-dissipating fin are provided with a plurality of corresponding first protrusions and second protrusions respectively, the first protrusions and the second protrusions that are arranged at intervals and correspond to each other can increase the surface turbulent between the first heat-dissipating fin and the second heat-dissipating fin. Thus, the forward movement of airflow will not be affected while the heat-dissipating area there between can be increased. Therefore, the heat-exchange efficiency can be enhanced.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a perspective view showing the external appearance of the first heat-dissipating fin of the present invention;
  • FIG. 2 is an assembled perspective view showing the first and second heat-dissipating fins of the present invention;
  • FIG. 3 is an assembled top view showing the first and second heat-dissipating fins of the present invention;
  • FIG. 4 is a partially cross-sectional view taken along the line 4-4 in FIG. 3;
  • FIG. 5 is a schematic view (I) showing the operating state of the heat-dissipating fin of the present invention;
  • FIG. 6 is a schematic view (II) showing the operating state of the heat-dissipating fin of the present invention;
  • FIG. 7 is an assembled top view showing the first and second heat-dissipating fins according to the second embodiment of the present invention; and
  • FIG. 8 is a partially assembled cross-sectional view showing the first and second heat-dissipating fins according to the second embodiment of the present invention.
    •  DETAILED DESCRIPTION OF THE INVENTION
  • The characteristics and technical contents of the present invention will be described with reference to the accompanying drawings. However, the drawings are illustrative only but not used to limit the present invention.
  • Please refer to FIGS. 1 and 2, which are perspective views showing the external appearance of the heat-dissipating fin assembly of the present invention. The heat-dissipating fin assembly of the present invention includes a first heat-dissipating fin 10 and a second heat-dissipating fin 20 that are overlapped with each other.
  • The first heat-dissipating fin 10 has a first surface 11. The first surface 11 is provided with a plurality of first protrusions 12. Each of the first protrusion 12 is a rib. The first protrusions 12 are arranged at intervals and parallel to one another obliquely. Each of the two opposite sides 101, 102 of the first heat-dissipating fin 10 is perpendicularly bent toward the same direction to form a first bending piece 13, so that a gap can be formed between the first heat-dissipating fin 10 and the second heat-dissipating fin 20 by supporting of the first bending pieces 13 when they are overlapped with each other. The height of the first bending piece 13 is larger than that of the first protrusion 12. The other side of the first heat-dissipating fin 10 that is perpendicular to the first bending piece 13 is provided with two first air-guiding pieces 14, 14 a. The two first air-guiding pieces 14, 14 a form an opposite inclined angle with respect to the first surface 11 respectively. However, those skilled in this art may appreciate that the number and arrangement of the air-guiding pieces can be changed according to practical demands. Alternatively, there may be only one air-guiding piece.
  • Furthermore, the first heat-dissipating piece 10 can be provided with a plurality of through-holes 100 for allowing at least one heat pipe 30 (FIG. 5) to penetrate therein. The first heat-dissipating fin 10 is provided with a flange 15 at the periphery of the through-hole 100 so as to increase the contact area between the first heat-dissipating fin 10 and the heat pipe 30. Further, in order to increase the turbulence and the heat-dissipating area, the first heat-dissipating fin 10 is provided with a plurality of other first protrusions 12 a. The first protrusions 12, 12 a are located on both sides of the through-hole 100 and are oriented in opposite directions. Since the heat-dissipating fins are overlapped with each other, the other surface 11′ of the first heat-dissipating fin 10 opposite to the first surface 11 is provided with a plurality of second protrusions 12′. The second protrusions 12′ on the other surface 11′ are staggered with respect to the second protrusions 12 on the first surface 11. Since the heat-dissipating fins are made of materials of good heat-dissipating property (such as aluminum), the ribs on its surface can be formed by means of a pressing process. Thus, the other surface of the rib forms a trough. As a result, the second protrusions 12′ form a plurality of troughs on the first surface 11.
  • The second heat-dissipating fins 20 are overlapped with the first heat-dissipating fins 10. The arrangement of the second heat-dissipating fin 20 is substantially the same as that of the second heat-dissipating fin 10 and has a second surface 21 toward the first surface 11. The second surface 21 is provided with a plurality of second protrusions 22, 22 a. The arrangement of the second protrusions 22, 22 a correspond to that of the first protrusions 12, 12 a. The second protrusions 22, 22 a are ribs arranged at intervals and parallel to one another obliquely. The opposite two sides 201, 202 of the second heat-dissipating fin 20 are bent toward the same side to form a second bending piece 23, while the other side 203 is provided with two first air-guiding pieces 24, 24 a. The second heat-dissipating fin 20 is provided with a through-hole 200 and a second flange 25 to correspond to the first heat-dissipating fin 10. The difference between the second heat-dissipating fin 20 and the first heat-dissipating fin 10 lies in that: the second protrusions 22, 22 a are arranged obliquely in a direction opposite to that of the first protrusions 12, 12 a. That is to say, the second protrusions 22, 22 a are staggered with respect to the first protrusions 12, 12 a. Similarly, the second heat-dissipating fin 20 is also provided with a plurality of second protrusions 22′ on the other surface 21′ opposite to the second surface 21.
  • Please refer to FIGS. 3 and 4, which are a top view and a cross-sectional view showing the overlapping of the first heat-dissipating fin 10 and the second heat-dissipating fin 20. It can be seen that, when overlapped, the first protrusions 12 and the second protrusions 22 are staggered to form a plurality of contacting points A. The second bending piece 23 is overlapped on the first bending piece 13, so that an airflow channel is formed there between.
  • Please refer to FIGS. 5 and 6, which show the operating state of the heat-conducting structure of the heat-dissipating fin of the present invention. In the following, the elements of the first heat-dissipating fin 10 and the second heat-dissipating fin 20 are described as an example. In use, the first heat-dissipating fins 10 and the second heat-dissipating fins 20 are overlapped orderly to form a heat-dissipating fin assembly 1. Further, a plurality of heat pipes 30 penetrates into the heat-dissipating fin assembly 1. One side of the heat-dissipating fin assembly 1 is provided with an axial fan 40. The airflow generated by the axial fan 40 is guided by the two second air-guiding pieces 14, 14 a into the heat-dissipating fin assembly 1. The airflow entering the airflow channels passes through the staggered first protrusions 12 and the second protrusions 22 to generate turbulence. Since the first protrusions 12 and the second protrusions 22 are brought into point contact with each other, the forward movement of the airflow will not be affected. The generation of the turbulence can extend the time for the airflow to stay in the channels, thereby taking away more heat of the heat-dissipating fins to enhance the heat-exchange efficiency. Further, the first protrusions 12 and the second protrusions 22 increase the heat-dissipating area of the first heat-dissipating fins 10 and the second heat-dissipating fins 20, thereby facilitating the turbulence to take away more heat and accelerating the heat dissipation.
  • Please refer to FIGS. 7 and 8, which are a top view and a cross-sectional view showing the overlapping of the first heat-dissipating fin and the second heat-dissipating fin according to the second embodiment of the present invention. The second embodiment is substantially identical to the first embodiment, and it has a first heat-dissipating fin 50 and a second heat-dissipating fin 60. A first surface 51 of the first heat-dissipating fin 50 is provided with a first protrusion 51. A first surface 61 of the second heat-dissipating fin 60 is provided with a second protrusion 61. The only difference lies in that each of the first protrusion 51 and the second protrusion 61 is a semi sphere. It can be seen that, when overlapped, the first protrusions 52 and the second protrusions 62 are brought into contact with each other to form a plurality of contact points B.
  • Although the present invention has been described with reference to the foregoing preferred embodiments, it will be understood that the invention is not limited to the details thereof. Various equivalent variations and modifications can still occur to those skilled in this art in view of the teachings of the present invention. Thus, all such variations and equivalent modifications are also embraced within the scope of the invention as defined in the appended claims.

Claims (18)

1. A heat-dissipating fin assembly, comprising:
a first heat-dissipating fin having a first surface, the first surface being provided with a plurality of first protrusions arranged at intervals;
a second heat-dissipating fin overlapped with the first heat-dissipating fin and having a second surface toward the first surface, the second surface being provided with a plurality of second protrusions arranged at intervals, the second protrusions being arranged to correspond to the first protrusions.
2. The heat-dissipating fin assembly according to claim 1, wherein the first heat-dissipating fin is provided with a through-hole for allowing a heat pipe to penetrate therein.
3. The heat-dissipating fin assembly according to claim 2, wherein the first heat-dissipating fin is provided with first flange at a periphery of the through-hole.
4. The heat-dissipating fin assembly according to claim 2, wherein the first heat-dissipating fin is provided with a plurality of other first protrusions, the first protrusions and the other first protrusions are provided on both sides of the through-hole respectively.
5. The heat-dissipating fin assembly according to claim 1, wherein each of two opposite sides of the first heat-dissipating fin is bent toward the same direction to form a first bending piece, thereby forming a gap when the first heat-dissipating fin is overlapped with the second heat-dissipating fin.
6. The heat-dissipating fin assembly according to claim 5, wherein the height of the first bending piece is larger than that of the first protrusion.
7. The heat-dissipating fin assembly according to claim 5, wherein an another side of the first heat-dissipating fin that is perpendicular to the first bending piece is provided with two first air-guiding pieces, and the two first air-guiding pieces are inclined reversely with respect to the first surface.
8. The heat-dissipating fin assembly according to claim 1, wherein an another surface of the first heat-dissipating fin opposite to the first surface is provided with a plurality of first protrusions, and the first protrusions on the another surface are staggered with respect to the first protrusions on the first surface.
9. The heat-dissipating fin assembly according to claim 1, wherein the second heat-dissipating fin is provided with a through-hole for allowing a heat pipe to penetrate therein.
10. The heat-dissipating fin assembly according to claim 9, wherein the second heat-dissipating fin is provided with a second flange at the periphery of the through-hole to increase the contact area between the second heat-dissipating fin and the heat pipe.
11. The heat-dissipating fin assembly according to claim 10, wherein the second heat-dissipating fin is provided with a plurality of other second protrusions, the second protrusions and the other second protrusions are provided on both sides of the through-hole respectively.
12. The heat-dissipating fin assembly according to claim 1, wherein two opposite sides of the second heat-dissipating fin are bent toward the same side to form a second bending piece, thereby forming a gap when the second heat-dissipating fin is overlapped with the first heat-dissipating fin.
13. The heat-dissipating fin assembly according to claim 12, wherein the height of the second bending piece is larger than that of the second protrusion.
14. The heat-dissipating fin assembly according to claim 12, wherein the other side of the second heat-dissipating fin that is perpendicular to the second bending piece is provided with two second air-guiding pieces, the two air-guiding pieces are inclined reversely with respect to the second surface.
15. The heat-dissipating fin assembly according to claim 1, wherein the other surface of the second heat-dissipating fin opposite to the second surface is also provided with a plurality of other second protrusions, the second protrusions on the other surface are staggered with respect to the second protrusions on the second surface.
16. The heat-dissipating fin assembly according to claim 1, wherein each of the first protrusion and the second protrusion is a rib, the first protrusions and the second protrusions are arranged at intervals and parallel to each other obliquely, the second protrusions are inclined in a direction opposite to that of the first protrusions.
17. The heat-dissipating fin assembly according to claim 1, wherein each of the first protrusion and the second protrusion is a semi sphere.
18. The heat-dissipating fin assembly according to claim 1, wherein the first protrusion and the second protrusion are brought into contact with each other.
US12/512,341 2009-05-05 2009-07-30 Heat-dissipating fin assembly with heat-conducting structure Abandoned US20100282444A1 (en)

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TW098207615U TWM363618U (en) 2009-05-05 2009-05-05 Thermal conducting structure of heat sink fins
TW098207615 2009-05-05
CN2009201544943U CN201429360Y (en) 2009-05-05 2009-05-14 Heat conduction structure of radiating fins

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