US20140328042A1 - Power Supply Module - Google Patents
Power Supply Module Download PDFInfo
- Publication number
- US20140328042A1 US20140328042A1 US14/265,652 US201414265652A US2014328042A1 US 20140328042 A1 US20140328042 A1 US 20140328042A1 US 201414265652 A US201414265652 A US 201414265652A US 2014328042 A1 US2014328042 A1 US 2014328042A1
- Authority
- US
- United States
- Prior art keywords
- power supply
- coil
- supply module
- connector
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 15
- 239000004020 conductor Substances 0.000 claims abstract description 14
- 238000013459 approach Methods 0.000 claims description 9
- 239000006247 magnetic powder Substances 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 238000004382 potting Methods 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000013461 design Methods 0.000 abstract description 11
- 239000000463 material Substances 0.000 abstract description 5
- 239000003990 capacitor Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/40—Structural association with built-in electric component, e.g. fuse
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F2017/048—Fixed inductances of the signal type with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
Definitions
- the present disclosure relates generally to the field of power supply, and specifically to a power supply module.
- the traditional way for integrating a power supply module is that: the above electronic components are electrically connected together in advance, for example, all of the electronic components are mounted on a printed circuit board, and then encapsulated by resin from outside to form an integrated structure of the power supply module, as shown in FIG. 1 .
- the electronic components such as inductance, capacitance, resistance, integrated circuit chip, are connected, these electronic components are mostly electrically connected together by a circuit design around ports of the integrated circuit chip.
- an electronic part 40 (such as integrated circuit) is mounted on a component connection department 31 by electronic connection (equivalent to a First circuit design), the end of a winding of a coil 10 is electronically connected with different coil connection departments 32 (equivalent to a second circuit design), the multiple port electrodes 30 , the component connection department 31 and the coil connection departments 32 are integrally molded, and an electronic circuit module formed by pressing forming by a magnetic body 20 in the end.
- the object of the present disclosure is to provide a power supply module and a method for manufacturing the same.
- a power supply module includes:
- a coil including a coil body and a connecting terminal
- connection configured to be electrically connected with the coil and the electronic component
- a magnetic conductor configured to enclose in and around the coil body and the electronic component
- the connector is integrally formed with the integrated circuit chip when manufacturing the latter.
- electronic components also include a resistor and/or a capacitor.
- the connector includes a terminal configured to be electrically connected with external circuit.
- the connector is a lead frame.
- the magnetic conductor is formed from magnetic powder by an encapsulating approach.
- the encapsulating approach can be molding or potting.
- a method for manufacturing the power supply module includes the following steps:
- the connector electrically connecting the connector with a coil and electronic components at least including an integrated circuit chip, wherein the coil includes a coil body and a connecting terminal;
- the electronic components also include a resistance and/or a capacitance.
- the connector is a lead frame.
- the method also includes a step of cutting out the outer peripheral portion of the lead frame to make a terminal that can be used by a user.
- the structure of the power supply module is more compact and can better meet the needs of the miniaturization design, which reduces material consumption, simplifies procedure, reduces production costs and improve the performance.
- FIG. 1 is a sectional view for illustrating an electronic circuit module formation in the prior art.
- FIG. 2 is a structural diagram for illustrating a power supply module according to one embodiment of the present disclosure.
- FIG. 3 is a flow diagram or illustrating a method for manufacturing the power supply module according to one embodiment of the present disclosure.
- FIG. 4 is a sectional view for illustrating a manufactured power supply module according to one embodiment of the present disclosure.
- a power supply module is provided. As shown in FIG. 2 , in one embodiment of the present disclosure, the power supply module includes a coil, electronic components, a connector and a magnetic conductor.
- the coil includes a coil body and a connecting terminal, and preferably, the coil is a hollow coil.
- the coil is preferably made of a flat copper wire, a round copper wire or a wound wire of other shapes and is wound according to a certain number of turns and shape in advance.
- the electronic components include at least an integrated circuit chip which is a unit module preferably integrated a MOSFET, a drive circuit, a pulse width modulator and a controller.
- the electronic components also include a resistor, a capacitor or other electronic components.
- One or more integrated circuit chips can be provided upon the demands in use.
- the connector is electrically connected with the coil and the electronic components, for example, each connecting terminal of the coil can be respectively electrically connected with a corresponding terminal of the connector.
- the connector is integrally formed with the integrated circuit chip when manufacturing the latter.
- the connector is a lead frame, all the electronic components are electrically connected to the lead frame, and preferably, a part of the outer periphery of the lead frame corresponding to the connecting terminal of the coil, which is bent upward, is electrically connected with the connecting terminal of the coil. In this way, only one circuit design is needed in the present disclosure, one circuit design is saved compared with the prior art, so as to reduce material consumption.
- the setting of the connector can reduce damage to the integrated circuit chip that the integrated circuit chip is not easily affected by external electromagnetic interference, so as to improve the electromagnetic interference performance with the proposed structure, effectively resolve the electromagnetic interference problem in an integrated circuit chip.
- the integrated circuit will contact with the magnetic core and therefore, the heat from the integrated circuit can be transferred through the magnetic core to ambient. Therefore, the heat transfer characteristics can be improved.
- the connector includes a terminal configured to be electrically connected to an external device.
- the magnetic conductor encloses in and around the coil body and the electronic components.
- the magnetic conductor is generally designed in a cuboid or cube shape, and also can be designed in a cylinder shape or other shapes upon the demands in use.
- the magnetic conductor is formed from magnetic powder by molding, potting or other encapsulating approaches.
- a manufacturing method for the power supply module is provided. As shown in FIG. 3 in one embodiment of the present disclosure, the method includes the following steps:
- Step S 1 integrally forming a connector when manufacturing an integrated circuit chip.
- the connector is a lead frame.
- Step S 2 electrically connecting the connector with a coil and electronic components at least including an integrated circuit chip, where the coil includes a coil body and a connecting terminal.
- the integrated circuit chip is a unit module integrating a MOSFET, a drive circuit, a pulse width modulator and a controller.
- the electronic components also include a resistor, a capacitor or other electronic components.
- each connecting terminal of the coil can be respectively electrically connected with a corresponding terminal of the connector that the coil and other electronic components can be connected into a whole circuit by the lead frame.
- Step S 3 encapsulating the coil body and the electronic component with a magnetic conductor so that the magnetic conductor encloses in and around the coil.
- the magnetic conductor is formed from magnetic powder by molding, potting or other encapsulating approaches, namely the whole circuit is covered by the magnetic powder in the way of molding or other encapsulating approaches to form an entirety.
- the method also includes:
- FIG. 4 is a sectional view illustrating a manufactured power supply module according to one embodiment of the present disclosure. It can be observed from FIG. 4 that, the integrated circuit chip is electrically connected with the lead frame, two connecting terminals (pins) of the coil are respectively electrically connected to the corresponding terminals of the lead frame, the whole circuit connected by the coil and the integrated circuit chip is covered by the magnetic powder in the way of molding or other encapsulating approaches, and the peripheral portion of the lead frame is cut off to form coils pin and IC pins that can be used by a user.
- the power supply module of the present disclosure has the following advantages:
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Dc-Dc Converters (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Coils Or Transformers For Communication (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
A power supply module and a method for manufacturing the same are disclosed. The power supply module includes a coil including a coil body and a connecting terminal; electronic components at least including an integrated circuit chip; a connector configured to be electrically connected with the coil and the electronic component; and a magnetic conductor configured to enclose in and around the coil body and the electronic component, wherein the connector is integrally formed with the integrated circuit chip when manufacturing the latter. The present disclosure can make the structure of the power supply module be more compact to further meet the needs of miniaturization design, reduce material consumption, simplify procedure, and therefore reduce the production costs.
Description
- The present disclosure relates generally to the field of power supply, and specifically to a power supply module.
- In the field of electronic products, with the development of miniaturization and integration in the electronic industry, in order to provide an accurate voltage and an accurate current for an operation of an electronic product, electronic components such as inductance, capacitance, resistance and integrated circuit chip, are integrated into one power supply module, for example, Power Supply in Package, to perform voltage or current conversion, which is convenient for engineer to develop and for the customer to use.
- The traditional way for integrating a power supply module is that: the above electronic components are electrically connected together in advance, for example, all of the electronic components are mounted on a printed circuit board, and then encapsulated by resin from outside to form an integrated structure of the power supply module, as shown in
FIG. 1 . When the electronic components such as inductance, capacitance, resistance, integrated circuit chip, are connected, these electronic components are mostly electrically connected together by a circuit design around ports of the integrated circuit chip. In the production process, two circuit design iterations are normally needed for the engineer, one is to design a lead frame in the integrated circuit and when the integrated circuits mold by a encapsulating approach, the outer peripheral part of the lead frame will be cut out to form a terminal for users, the other is to design a lead frame when inductance, capacitance, resistance and other electronic components are integrated with the integrated circuit. In addition, after the above electronic components mounted on a printed circuit board to form a power supply module, the printed circuit board needs to be provided with ports that can be used by a user. For example, in a patent JP2001386984, as shown inFIG. 1 , an electronic part 40 (such as integrated circuit) is mounted on acomponent connection department 31 by electronic connection (equivalent to a First circuit design), the end of a winding of acoil 10 is electronically connected with different coil connection departments 32 (equivalent to a second circuit design), themultiple port electrodes 30, thecomponent connection department 31 and thecoil connection departments 32 are integrally molded, and an electronic circuit module formed by pressing forming by amagnetic body 20 in the end. - Therefore, if simply combining each electronic component and integrated circuit together to form a power supply module according to method in the prior art, it not only increases production materials so as to make the production process more complicate, but also causes waste and increased cost.
- In order to solve the above problems in the prior art, the object of the present disclosure is to provide a power supply module and a method for manufacturing the same.
- According to an aspect of the present disclosure, a power supply module includes:
- a coil, including a coil body and a connecting terminal;
- electronic components, including at least an integrated circuit chip;
- a connection, configured to be electrically connected with the coil and the electronic component; and
- a magnetic conductor, configured to enclose in and around the coil body and the electronic component,
- wherein the connector is integrally formed with the integrated circuit chip when manufacturing the latter.
- Preferably, electronic components also include a resistor and/or a capacitor.
- Preferably, the connector includes a terminal configured to be electrically connected with external circuit.
- Preferably, the connector is a lead frame.
- Preferably, the magnetic conductor is formed from magnetic powder by an encapsulating approach.
- Preferably, the encapsulating approach can be molding or potting.
- According to another aspect the present disclosure, a method for manufacturing the power supply module includes the following steps:
- integrally forming a connector when manufacturing an integrated circuit chip;
- electrically connecting the connector with a coil and electronic components at least including an integrated circuit chip, wherein the coil includes a coil body and a connecting terminal; and
- enclose in and around the coil body and the electronic component with a magnetic conductor.
- Preferably, the electronic components also include a resistance and/or a capacitance.
- Preferably, the connector is a lead frame.
- Preferably, the method also includes a step of cutting out the outer peripheral portion of the lead frame to make a terminal that can be used by a user.
- With the above technical solution or the present disclosure, the structure of the power supply module is more compact and can better meet the needs of the miniaturization design, which reduces material consumption, simplifies procedure, reduces production costs and improve the performance.
-
FIG. 1 is a sectional view for illustrating an electronic circuit module formation in the prior art. -
FIG. 2 is a structural diagram for illustrating a power supply module according to one embodiment of the present disclosure. -
FIG. 3 is a flow diagram or illustrating a method for manufacturing the power supply module according to one embodiment of the present disclosure. -
FIG. 4 is a sectional view for illustrating a manufactured power supply module according to one embodiment of the present disclosure. - The present disclosure may be best understood by reference to the following description taken in conjunction with embodiments and reference to the accompanying drawings.
- According to an aspect of the present disclosure, a power supply module is provided. As shown in
FIG. 2 , in one embodiment of the present disclosure, the power supply module includes a coil, electronic components, a connector and a magnetic conductor. - The coil includes a coil body and a connecting terminal, and preferably, the coil is a hollow coil.
- The coil is preferably made of a flat copper wire, a round copper wire or a wound wire of other shapes and is wound according to a certain number of turns and shape in advance.
- The electronic components include at least an integrated circuit chip which is a unit module preferably integrated a MOSFET, a drive circuit, a pulse width modulator and a controller. In another embodiment of the present disclosure, the electronic components also include a resistor, a capacitor or other electronic components.
- One or more integrated circuit chips can be provided upon the demands in use.
- The connector is electrically connected with the coil and the electronic components, for example, each connecting terminal of the coil can be respectively electrically connected with a corresponding terminal of the connector.
- Wherein, the connector is integrally formed with the integrated circuit chip when manufacturing the latter.
- In one embodiment of the present disclosure, the connector is a lead frame, all the electronic components are electrically connected to the lead frame, and preferably, a part of the outer periphery of the lead frame corresponding to the connecting terminal of the coil, which is bent upward, is electrically connected with the connecting terminal of the coil. In this way, only one circuit design is needed in the present disclosure, one circuit design is saved compared with the prior art, so as to reduce material consumption.
- In addition, the setting of the connector can reduce damage to the integrated circuit chip that the integrated circuit chip is not easily affected by external electromagnetic interference, so as to improve the electromagnetic interference performance with the proposed structure, effectively resolve the electromagnetic interference problem in an integrated circuit chip. In addition, the integrated circuit will contact with the magnetic core and therefore, the heat from the integrated circuit can be transferred through the magnetic core to ambient. Therefore, the heat transfer characteristics can be improved.
- In another embodiment of the present disclosure, the connector includes a terminal configured to be electrically connected to an external device.
- The magnetic conductor encloses in and around the coil body and the electronic components. The magnetic conductor is generally designed in a cuboid or cube shape, and also can be designed in a cylinder shape or other shapes upon the demands in use.
- In one embodiment of the present disclosure, the magnetic conductor is formed from magnetic powder by molding, potting or other encapsulating approaches.
- According to another aspect of the present disclosure, a manufacturing method for the power supply module is provided. As shown in
FIG. 3 in one embodiment of the present disclosure, the method includes the following steps: - Step S1, integrally forming a connector when manufacturing an integrated circuit chip.
- Preferably, the connector is a lead frame.
- Step S2, electrically connecting the connector with a coil and electronic components at least including an integrated circuit chip, where the coil includes a coil body and a connecting terminal.
- The integrated circuit chip is a unit module integrating a MOSFET, a drive circuit, a pulse width modulator and a controller. In another embodiment of the present disclosure, the electronic components also include a resistor, a capacitor or other electronic components.
- In one embodiment of the present disclosure, each connecting terminal of the coil can be respectively electrically connected with a corresponding terminal of the connector that the coil and other electronic components can be connected into a whole circuit by the lead frame.
- Step S3, encapsulating the coil body and the electronic component with a magnetic conductor so that the magnetic conductor encloses in and around the coil.
- In one embodiment of the present disclosure, the magnetic conductor is formed from magnetic powder by molding, potting or other encapsulating approaches, namely the whole circuit is covered by the magnetic powder in the way of molding or other encapsulating approaches to form an entirety.
- If the connector is a lead frame, the method also includes:
- cutting out the outer peripheral portion of the lead frame to make a terminal that can be used by a user.
-
FIG. 4 is a sectional view illustrating a manufactured power supply module according to one embodiment of the present disclosure. It can be observed fromFIG. 4 that, the integrated circuit chip is electrically connected with the lead frame, two connecting terminals (pins) of the coil are respectively electrically connected to the corresponding terminals of the lead frame, the whole circuit connected by the coil and the integrated circuit chip is covered by the magnetic powder in the way of molding or other encapsulating approaches, and the peripheral portion of the lead frame is cut off to form coils pin and IC pins that can be used by a user. - Therefore, compared with the power supply module in the prior art as shown in
FIG. 1 , the power supply module of the present disclosure has the following advantages: - 1. making the structure more compact to better meet the needs of the miniaturization design; and
- 2. reducing material consumption and simplifying procedure and therefore reducing production costs.
- The embodiments are chosen and described in order to explain the basic idea of the disclosure and their practical application so as to activate others skilled in the art to utilize the disclosure and various embodiments and with various modifications as are suited to the particular use contemplated. Alternative embodiments will become apparent to those skilled in the art to which the present disclosure pertains without departing from its spirit and scope.
Claims (10)
1. A power supply module, comprising:
a coil, comprising a coil body and a connecting terminal;
electronic components, comprising at least an integrated circuit chip;
a connector, configured to be electrically connected with the coil and the electronic components; and
a magnetic conductor, configured to enclose in and around the coil body and the electronic component,
wherein the connector is integrally formed with the integrated circuit chip when manufacturing the latter.
2. The power supply module of claim 1 , wherein the coil is a hollow coil.
3. The power supply module of claim 1 , wherein the electronic components further comprises a resistance and/or a capacitance.
4. The power supply module of claim 1 , wherein the connector comprises a terminal configured to be electrically connected to the external circuit.
5. The power supply module of claim 1 , wherein the connector is a lead frame.
6. The power supply module of claim 1 , wherein the magnetic conductor is formed from magnetic powder by an encapsulating approach.
7. The power supply module of claim 6 , wherein the encapsulating approach is molding or potting.
8. A method for manufacturing the power supply module of claim 1 , comprising:
integrally forming a connector when manufacturing an integrated circuit chip;
electrically connecting the connector with a coil and electronic components comprising at least an integrated circuit chip, wherein the coil comprises a coil body and a connecting terminal; and
enclose in and around the coil body and the electronic component with a magnetic conductor.
9. The method of claim 8 , wherein the connector is a lead frame.
10. The method of claim 9 , wherein the method further comprises:
cutting out the outer peripheral portion of the lead frame to make a terminal that can be used by a user.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310160722.9 | 2013-05-03 | ||
CN201310160722 | 2013-05-03 | ||
CN201310160722.9A CN104135139B (en) | 2013-05-03 | 2013-05-03 | A kind of power supply module |
Publications (2)
Publication Number | Publication Date |
---|---|
US20140328042A1 true US20140328042A1 (en) | 2014-11-06 |
US10080297B2 US10080297B2 (en) | 2018-09-18 |
Family
ID=51807709
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/265,652 Active 2035-01-16 US10080297B2 (en) | 2013-05-03 | 2014-04-30 | Power supply module |
Country Status (2)
Country | Link |
---|---|
US (1) | US10080297B2 (en) |
CN (1) | CN104135139B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20190269015A1 (en) * | 2016-11-17 | 2019-08-29 | Sony Corporation | Electronic component, power supply device, and method of manufacturing coil |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI614777B (en) * | 2015-12-18 | 2018-02-11 | Thin inductor structure and manufacturing method | |
US12017294B2 (en) | 2020-02-28 | 2024-06-25 | The Esab Group Inc. | Electromagnetic components cooling apparatus, method, and configuration |
CN114334676B (en) * | 2021-12-22 | 2023-11-21 | 深圳市沃芯半导体技术有限公司 | Packaging method of power chip and corresponding packaging structure |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11299225A (en) * | 1998-02-10 | 1999-10-29 | Fuji Electric Co Ltd | Dc-dc converter |
JP2003188023A (en) * | 2001-12-20 | 2003-07-04 | Toko Inc | Electronic circuit module |
US20040239467A1 (en) * | 2003-05-28 | 2004-12-02 | Cyntec Company | Configuration and method for manufacturing compact high current inductor coil |
US20090207574A1 (en) * | 2008-02-18 | 2009-08-20 | Cyntec Co., Ltd | Electronic package structure |
JP2010022098A (en) * | 2008-07-09 | 2010-01-28 | Murata Mfg Co Ltd | Power conversion/transmission device and non-contact type charged device |
US20110242775A1 (en) * | 2010-04-02 | 2011-10-06 | Astec International Limited | Inductors Occupying Space Above Circuit Board Components |
JP2011222598A (en) * | 2010-04-05 | 2011-11-04 | Shindengen Electric Mfg Co Ltd | Method for manufacturing magnetic body substrate, magnetic body substrate, and electronic circuit module |
JP2012234986A (en) * | 2011-05-02 | 2012-11-29 | Shindengen Electric Mfg Co Ltd | Inductor-integrated lead frame, electronic circuit module and method for manufacturing the same |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1838348A (en) * | 2005-03-24 | 2006-09-27 | 台达电子工业股份有限公司 | Passive element packaging structure and making method thereof |
CN102857088B (en) * | 2012-08-28 | 2016-01-20 | 胜美达电机(香港)有限公司 | Power supply module |
-
2013
- 2013-05-03 CN CN201310160722.9A patent/CN104135139B/en active Active
-
2014
- 2014-04-30 US US14/265,652 patent/US10080297B2/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11299225A (en) * | 1998-02-10 | 1999-10-29 | Fuji Electric Co Ltd | Dc-dc converter |
JP2003188023A (en) * | 2001-12-20 | 2003-07-04 | Toko Inc | Electronic circuit module |
US20040239467A1 (en) * | 2003-05-28 | 2004-12-02 | Cyntec Company | Configuration and method for manufacturing compact high current inductor coil |
US20090207574A1 (en) * | 2008-02-18 | 2009-08-20 | Cyntec Co., Ltd | Electronic package structure |
JP2010022098A (en) * | 2008-07-09 | 2010-01-28 | Murata Mfg Co Ltd | Power conversion/transmission device and non-contact type charged device |
US20110242775A1 (en) * | 2010-04-02 | 2011-10-06 | Astec International Limited | Inductors Occupying Space Above Circuit Board Components |
JP2011222598A (en) * | 2010-04-05 | 2011-11-04 | Shindengen Electric Mfg Co Ltd | Method for manufacturing magnetic body substrate, magnetic body substrate, and electronic circuit module |
JP2012234986A (en) * | 2011-05-02 | 2012-11-29 | Shindengen Electric Mfg Co Ltd | Inductor-integrated lead frame, electronic circuit module and method for manufacturing the same |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20190269015A1 (en) * | 2016-11-17 | 2019-08-29 | Sony Corporation | Electronic component, power supply device, and method of manufacturing coil |
US10917971B2 (en) * | 2016-11-17 | 2021-02-09 | Sony Corporation | Electronic component, power supply device, and method of manufacturing coil |
Also Published As
Publication number | Publication date |
---|---|
CN104135139A (en) | 2014-11-05 |
CN104135139B (en) | 2018-01-26 |
US10080297B2 (en) | 2018-09-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11942263B2 (en) | Supportable package device and package assembly | |
US11769621B2 (en) | Inductor with an electrode structure | |
US10080297B2 (en) | Power supply module | |
US6879238B2 (en) | Configuration and method for manufacturing compact high current inductor coil | |
US10148172B2 (en) | Power supply module | |
EP2802064A1 (en) | Power module and encapsulation method thereof | |
CN104701009A (en) | Small-sized chip type surface mounting (SMD) high-voltage and safety standard recognized ceramic capacitor | |
US11348808B2 (en) | Switch-mode converter module | |
US8854167B2 (en) | Magnetic assembly | |
TW201336362A (en) | A package structure and the method to fabricate thereof | |
CN203691210U (en) | Integrated packaging power supply | |
US11017934B2 (en) | Electronic module | |
US9691537B2 (en) | Power supply module | |
CN115021590A (en) | Intelligent power module | |
CN109036848B (en) | Capacitor of microwave oven | |
CN209374221U (en) | Sustainable formula packaging and package assembling | |
CN112637982A (en) | Circuit module, electromagnetic induction heating circuit module and processing technology thereof | |
CN104821641B (en) | A kind of wireless charging device | |
CN204633435U (en) | A kind of wireless charging device | |
CN203721718U (en) | Packaging structure for million sets of encoding transmitting chips | |
CN207895844U (en) | A kind of active SMD electromagnetic buzzers | |
JP4514497B2 (en) | Manufacturing method of semiconductor device | |
US20190172638A1 (en) | Process for making a low-profile choke | |
CN2453614Y (en) | Solid relay | |
JP3847242B2 (en) | Semiconductor device and manufacturing method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: SUMIDA ELECTRIC (H.K.) COMPANY LIMITED, CHINA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:WU, ZHUO;MALCOLM, DOUGLAS JAMES;LIU, YANFEI;SIGNING DATES FROM 20140519 TO 20140520;REEL/FRAME:033013/0024 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YR, SMALL ENTITY (ORIGINAL EVENT CODE: M2551); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY Year of fee payment: 4 |