JP2012234986A - Inductor-integrated lead frame, electronic circuit module and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To dispense with a step of connecting a wiring lead and a coil together, and to improve reliability of electric connection between the wiring lead and the coil.SOLUTION: An inductor-integrated lead frame according to one embodiment of the present invention is made from one metal plate. The inductor-integrated lead frame comprises: a wiring lead frame part 3 which comprises a plurality of wiring leads 3a and a supporting frame 3b surrounding outer peripheries of the plurality of wiring leads 3a and supporting the plurality of wiring leads 3a; a connection lead part 4 which is provided in such a manner as to be elongated from the wiring leads 3a; and a planar coil part 2 which is connected to the wiring leads 3a via the connection lead part 4 and which is smaller than an area where the plurality of wiring leads 3a are positioned.

Description

  The present invention relates to an inductor-integrated lead frame, an electronic circuit module, and a manufacturing method thereof.

  2. Description of the Related Art Conventionally, there has been disclosed an electronic circuit module including a coil embedded in a magnetic body and an electronic component that constitutes an electric circuit together with the coil. For example, the electronic circuit module described in Patent Document 1 includes an insulating magnetic body 20, a coil 10 embedded in the magnetic body 20, a coil connection portion 32, and an element connection portion 31. A plurality of terminal electrodes 30 fixed to the electronic component 40 and an electronic component 40 that constitutes an electric circuit together with the coil 10 are provided.

  Patent Document 2 discloses a method of manufacturing a magnetic material in which insulating magnetic powder is deposited so as to embed the coil 11, the deposited insulating magnetic powder is pressure-molded, and a wiring is formed on the solidified surface thereby. Has been.

Japanese Patent Laid-Open No. 2003-188023 International Publication No. 2009/001944 Pamphlet

  In the electronic circuit module described in Patent Document 1, the coil 10 is electrically connected to the terminal electrode 30 via the coil connection portion 32. For this reason, there exists a problem that the reliability of the electrical connection of the coil 11 and the terminal electrode 30 is low. In particular, when the magnetic body 20 is pressure-molded after connecting the lead portions 13 and 14 of the coil 10 and the coil connection portion 32, the lead portions 13 and 14 and the coil connection portion 32 may be separated. Moreover, since the process of connecting the lead parts 13 and 14 of the coil 10 and the coil connection part 32 is necessary, there is a problem that the manufacturing efficiency is low.

  Furthermore, in the electronic circuit module disclosed in Patent Document 1, the resin 21 is filled in the recess 21 provided in the magnetic body 20, and the electronic component 40 is placed in the recess 21 defined by the magnetic body 20 and the element connection portion 31. Contained. However, since the upper surface of the resin 50 and the terminal surface of the terminal electrode 30 are not flush with each other, a gap is generated between the resin 50 and the printed board when the electronic circuit module is mounted on the printed board or the like, and the electronic component 40 There is also a problem that the heat cannot be efficiently radiated to the printed circuit board. In addition, in order to solve the problem of heat dissipation by making the upper surface of the resin 50 and the terminal surface of the terminal electrode 30 flush with each other, a complicated-shaped terminal member is required, which increases the manufacturing cost of the electronic circuit module. .

  Therefore, the present invention provides an inductor-integrated lead frame that can eliminate the step of connecting the wiring lead and the coil, and can improve the reliability of the electrical connection between the wiring lead and the coil. An object of the present invention is to provide an electronic circuit module excellent in heat dissipation and manufacturing cost.

An inductor-integrated lead frame according to an aspect of the present invention includes:
An inductor integrated lead frame made of a single metal plate,
A wiring lead frame portion having a plurality of wiring leads and a support frame that surrounds at least a part of the outer periphery of the plurality of wiring leads and supports the plurality of wiring leads;
A connection lead portion provided to extend from the wiring lead frame portion;
A planar coil portion that is connected to the wiring lead via the connection lead portion and is smaller than a region where the plurality of wiring leads are located;
It is characterized by providing.

In the inductor integrated lead frame,
The planar coil portion may include a straight portion that extends linearly from the connection lead portion, and a meander portion that is connected to an end portion of the direct portion and is formed in a zigzag shape.

In the inductor integrated lead frame,
The planar coil portion may be formed so as to wave in the thickness direction of the metal plate.

In the inductor integrated lead frame,
You may make it further provide the outer frame part which surrounds the said wiring lead frame part and the said planar coil part, and the runner part which connects the said outer frame part and the said wiring lead frame part.

In the inductor integrated lead frame,
An alignment hole may be provided in the outer frame portion.

An electronic circuit module according to an aspect of the present invention includes:
A plurality of wiring leads disposed on the same plane and having first and second surfaces facing each other;
An electronic component mounted on the first surface of the wiring lead;
A planar coil portion configured integrally with the wiring lead via a connection lead portion and provided on the second surface side of the wiring lead by bending the connection lead portion;
A magnetic part having metal particles and an insulator that insulates the metal particles, and provided on the second surface of the wiring lead so as to embed the planar coil part;
It is characterized by providing.

In the electronic circuit module,
A resin part that seals the electronic component and has a resin surface parallel to the first surface;
An external terminal electrically connected to the wiring lead and having a terminal surface parallel to the first surface;
The resin surface and the terminal surface may be flush with each other.

In the electronic circuit module,
The planar coil portion may include a straight portion that extends linearly from the connection lead portion, and a meander portion that is connected to an end portion of the direct portion and is formed in a zigzag shape.

In the electronic circuit module,
The planar coil portion may be formed so as to wave in a direction perpendicular to the first surface.

In the electronic circuit module,
The planar coil portion may be provided in parallel with the second surface of the wiring lead.

An electronic circuit module manufacturing method according to an aspect of the present invention includes:
A wiring lead frame portion having a plurality of wiring leads and a support frame that surrounds at least a part of the outer periphery of the plurality of wiring leads and supports the wiring leads; and is provided to extend from the wiring lead frame portion. An inductor-integrated lead frame comprising: a connecting lead portion; and a planar coil portion that is connected to the wiring lead via the connecting lead portion and is smaller than a region where the plurality of wiring leads are located. Producing a metal plate by processing;
Bending the connection lead portion so that the planar coil portion is disposed above the magnetic body forming surface of the wiring lead frame portion;
Forming a magnetic body portion having metal particles and an insulator that insulates the metal particles in a magnetic body forming region of the magnetic body forming surface so as to embed the planar coil portion;
Mounting an electronic component on an electronic component mounting surface opposite to the magnetic body forming surface of the wiring lead frame portion;
A terminal lead frame having a plurality of protrusions projecting from the sides of the opening is formed by processing a single metal plate while providing an opening and a resin inlet connected to the opening. Process,
The terminal lead so that the convex portion straddles the inner edge of the support frame, at least a part of the convex portion is electrically connected to the wiring lead, and the mounted electronic component is accommodated in the opening. Superimposing a frame on the electronic component mounting surface of the wiring lead frame part;
Sealing the electronic component mounted on the electronic component mounting surface with resin;
After the resin is cured, the terminal lead frame is cut off so that at least a part of the protrusions of the terminal lead frame remains on the wiring leads, and the protrusions are electrically separated, and the wiring leads Cutting the support frame of the frame part to electrically separate the wiring leads; and
It is characterized by providing.

In the method for manufacturing the electronic circuit module,
The step of sealing the electronic component with resin includes
Forming a closing member on the terminal lead frame so as to cover the opening of the terminal lead frame and the resin inlet, and defining a recess by the opening and the closing member;
Injecting resin into the resin inlet from the magnetic body forming surface side, and filling the recess with resin;
May be provided.

In the method for manufacturing the electronic circuit module,
The magnetic body forming region may be located inside the inner edge of the support frame, and a part of the gap between the adjacent wiring leads may be an outlet for air generated when the recess is filled with resin.

In the method for manufacturing the electronic circuit module,
The step of sealing the electronic component with resin includes
Forming a closing member on the terminal lead frame so as to cover the opening of the terminal lead frame, and defining a sealing space by the opening, the closing member and the wiring lead frame portion;
A jig having a housing portion capable of housing the magnetic body portion is prepared, and the inductor integrated lead frame is mounted on the jig so that the magnetic body portion is housed in the housing portion of the jig. A step of placing;
Injecting resin into the resin inlet from the electronic component mounting surface side, and filling the sealing space with resin;
You may make it provide.

In the method for manufacturing the electronic circuit module,
Before injecting the resin into the sealing space, the through hole of the wiring lead frame part connecting the housing part of the jig and the sealing space may be closed with resin from the magnetic body forming surface side.

In the method for manufacturing the electronic circuit module,
The closing member may be formed by sticking an adhesive tape on the terminal lead frame, or pressing an elastic body on the terminal lead frame.

In the method for manufacturing the electronic circuit module,
The magnetic part is
An upper mold having a through-hole having the same cross-sectional shape as the shape of the magnetic body forming region, a lower mold having a flat upper surface, and a pressure mold fitted into the through-hole of the upper mold Prepare a press device with
The inductor-integrated lead frame is placed on the lower mold so that the electronic component mounting surface of the wiring lead frame portion is in contact with the upper surface of the lower mold,
The upper mold is placed on the inductor-integrated lead frame so that the planar coil portion is located in the through hole of the upper mold and the side surface of the through hole coincides with the boundary line of the magnetic body forming region. Place the mold,
Insulating magnetic powder containing metal particles covered with a thin layer of insulator is poured into the through hole of the upper mold, and the planar coil portion is embedded with the insulating magnetic powder,
Applying pressure to the insulating magnetic powder deposited in the through-hole of the upper mold by the pressurizing mold and press-molding, and then heating and curing the insulating magnetic powder that has been press-molded.
May be formed.

In the method for manufacturing the electronic circuit module,
When bending the connection lead portion, the connection lead portion is bent so that the distance between the planar coil portion and the wiring lead frame portion increases from the connection lead portion toward the distal end of the planar coil portion,
The planar coil portion may be parallel to the magnetic body forming surface of the wiring lead frame portion by the pressure of the pressurizing mold.

In the method for manufacturing the electronic circuit module,
When the inductor-integrated lead frame is manufactured, the planar coil portion may be formed so as to wave in the thickness direction of the metal plate.

In the method for manufacturing the electronic circuit module,
An alignment hole is provided in the inductor-integrated lead frame and the terminal lead frame,
The inductor integrated lead frame and the terminal lead frame may be aligned by inserting a pin into the alignment hole.

An electronic circuit module manufacturing method according to another aspect of the present invention includes:
An electronic component mounting surface is provided on the surface, and a step of producing a substrate having a plurality of wiring patterns formed on the electronic component mounting surface and an outer peripheral portion surrounding the plurality of wiring patterns;
Mounting electronic components on the electronic component mounting surface of the substrate;
A step of producing a terminal lead frame having a convex portion projecting from the side of the opening, provided with an opening and a resin inlet connected to the opening, by processing one metal plate; ,
The terminal lead so that the convex portion straddles the inner edge of the outer peripheral portion, at least a part of the convex portion is electrically connected to the wiring pattern, and the mounted electronic component is accommodated in the opening portion. Superimposing a frame on the electronic component mounting surface of the substrate;
Sealing the electronic component mounted on the electronic component mounting surface with resin;
After the resin is cured, a step of electrically separating the protrusions by cutting off the terminal lead frame so that at least a part of the protrusions of the terminal lead frame remains on the wiring pattern;
It is characterized by providing.

In the method for manufacturing the electronic circuit module,
The step of sealing the electronic component with resin includes
Forming a closing member on the terminal lead frame so as to cover the opening of the terminal lead frame and the resin inlet, and defining a recess by the opening and the closing member;
Injecting resin into the resin inlet from the opposite side of the electronic component mounting surface, and filling the recess with resin;
May be provided.

In the method for manufacturing the electronic circuit module,
The step of sealing the electronic component with resin includes
Forming a closing member on the terminal lead frame so as to cover the opening of the terminal lead frame, and defining a sealing space by the opening, the closing member and the wiring lead frame portion;
Placing the substrate on a flat plate, injecting resin into the resin inlet from the electronic component mounting surface side, and filling the sealing space with resin;
May be provided.

In the method for manufacturing the electronic circuit module,
The closing member may be formed by sticking an adhesive tape on the terminal lead frame, or pressing an elastic body on the terminal lead frame.

  Since the inductor-integrated lead frame according to one aspect of the present invention is made of one metal plate, there is no need to connect the planar coil portion and the wiring lead, and the planar coil portion and the wiring lead frame portion. The electrical connection between them can be ensured with high reliability. For this reason, when the magnetic body part for embedding the planar coil part is pressure-molded, the planar coil part and the wiring lead are not separated from each other, and the yield of the magnetic substrate can be improved.

  In the electronic circuit module according to one aspect of the present invention, the resin surface of the resin that seals the electronic component and the terminal surface of the external terminal are flush with each other. Therefore, when the electronic circuit module is mounted on a printed circuit board or the like, the resin surface is It comes into contact with the printed board, and the heat generated by the electronic component can be efficiently radiated to the printed board.

  In the method of manufacturing an electronic circuit module according to one aspect of the present invention, it is necessary to prepare a member having a complicated shape in order to configure a wiring lead, an external terminal, and a recess for storing a resin for sealing an electronic component. There is no. Therefore, an electronic circuit module can be manufactured at low cost. In addition, since it is not necessary to use a part of the wiring lead as an external terminal by bending the wiring lead, it is possible to prevent the magnetic part from cracking when the wiring lead is bent and to reduce the pitch of the wiring lead. Even in this case, an electrical short circuit between the wiring leads can be prevented.

FIG. 2A is a plan view of an inductor-integrated lead frame according to an embodiment of the present invention. (B) is sectional drawing which follows the AA line of (a). It is process sectional drawing for demonstrating the method to manufacture the electronic circuit module which concerns on embodiment of this invention. It is process sectional drawing for demonstrating the method to manufacture the electronic circuit module which concerns on embodiment of this invention following FIG. 2A. It is process sectional drawing for demonstrating the method to manufacture the electronic circuit module which concerns on embodiment of this invention following FIG. 2B. It is sectional drawing for demonstrating the process of pressure-molding the deposited insulating magnetic powder. It is sectional drawing for demonstrating the modification of a planar coil. It is a top view which shows an example of a terminal lead frame. It is a top view which shows the state which piled up the terminal lead frame on the electronic component mounting surface of the magnetic substrate in which the electronic component was mounted. It is sectional drawing of the inductor integrated lead frame and terminal lead frame which were mounted on the jig | tool so that a magnetic body part might be accommodated in the accommodating part of a jig | tool. 1 is an external perspective view of an electronic circuit module according to an embodiment of the present invention.

  Hereinafter, an inductor-integrated lead frame and an electronic circuit module manufacturing method according to embodiments of the present invention will be described with reference to the drawings. In addition, in each figure, the component which has an equivalent function is attached | subjected the same code | symbol, and detailed description of the component of the same code | symbol is not repeated.

(Inductor integrated lead frame)
FIG. 1A is a plan view of an inductor-integrated lead frame 1 according to an embodiment of the present invention. FIG.1 (b) has shown sectional drawing which follows the AA line of Fig.1 (a).

  As shown in FIG. 1A, the inductor-integrated lead frame 1 is made of one metal plate (for example, a copper plate), and includes a planar coil portion 2, a wiring lead frame portion 3, and connection leads. A portion 4, an outer frame portion 5, and a runner portion 6 are provided.

  As shown in FIG. 1B, one surface of the wiring lead frame portion 3 is an electronic component mounting surface 3X for mounting an electronic component, and the other surface is a magnetic material forming surface for forming a magnetic material. 3Y. The wiring lead frame portion 3 includes a plurality of wiring leads 3a and a support frame 3b that surrounds the outer periphery of the plurality of wiring leads 3a and supports the plurality of wiring leads 3a. In other words, the plurality of wiring leads 3 a are formed so as to protrude from the inner edge of the support frame 3 b (the boundary between the wiring leads 3 a and the support frame 3 b) toward the inside of the wiring lead frame portion 3.

  The planar coil part 2 is configured as an integral part of the wiring lead frame part 3 via the connection lead part 4. As shown in FIG. 1A, the planar coil portion 2 includes a straight portion 2a extending linearly from the connection lead portion 4, and a meander portion 2b connected to the end of the straight portion 2a and formed in a zigzag folded shape. Have. One end of the direct part 2 a is connected to the connection lead part 4, and one end of the meander part 2 b is connected to another connection lead part 4.

  As can be seen from FIG. 4 described later, the planar coil portion 2 may be formed so as to wave in the thickness direction of the metal plate constituting the inductor integrated lead frame 1.

  The outer frame part 5 is provided so as to surround the wiring lead frame part 3 and the planar coil part 2 as shown in FIG. The runner part 6 connects the outer frame part 5 and the planar coil part 2, or connects the outer frame part 5 and the support frame 3 b of the wiring lead frame part 3. Thereby, the planar coil portion 2 and the wiring lead frame portion 3 are supported and fixed to the outer frame portion 5. In addition, the runner part which connects the outer frame part 5 and the planar coil part 2 can also be abbreviate | omitted.

  Further, as shown in FIG. 1A, the outer frame portion 5 has an alignment hole for aligning the inductor integrated lead frame 1 and the terminal lead frame 14 when an electronic circuit module described later is manufactured. 5a may be provided.

  A magnetic body formation region M surrounded by a broken line in FIG. 1A indicates a region where a magnetic body portion 11 described later is formed. In the example shown in FIG. 1, the magnetic body forming region M is provided so that the boundary line thereof coincides with the inner edge of the support frame 3b (the boundary line between the wiring lead 3a and the support frame 3b). The boundary line of M may be inside the inner edge of the support frame 3b.

  As described above, the inductor-integrated lead frame 1 according to the present embodiment is manufactured from a single metal plate, and includes a plurality of wiring leads 3a and at least a part of the outer periphery of the plurality of wiring leads 3a. A wiring lead frame portion 3 having a support frame 3b that surrounds and supports a plurality of wiring leads 3a, a connection lead portion 4 provided so as to extend from the wiring lead frame portion 3, and wiring via the connection lead portion 4 A planar coil portion 2 that is connected to the lead 3a and is smaller than a region where the plurality of wiring leads 3a are located.

  According to such an inductor-integrated lead frame, it is not necessary to connect the planar coil portion and the wiring lead, and electrical connection between the planar coil portion and the wiring lead frame portion can be ensured with high reliability. .

(Electronic circuit module manufacturing method)
Next, a method for manufacturing an electronic circuit module using the inductor-integrated lead frame 1 will be described with reference to FIGS. 2A to 2C. 2A to 2C are process cross-sectional views for explaining a method for manufacturing an electronic circuit module according to the present embodiment.

(1) First, the inductor-integrated lead frame 1 is manufactured by processing a single metal plate. At this time, as can be seen from FIG. 4, the planar coil portion 2 may be formed so as to wave in the thickness direction of the metal plate. Thereby, the adhesiveness of the planar coil part 2 and the below-mentioned magnetic body part 11 improves. As a result, even when a crack occurs in the magnetic body portion 11 due to a change in environmental temperature, a temperature cycle test, or the like, it is possible to suppress the growth of the crack along the planar coil portion 2.

(2) Next, the runner part 6 that connects the planar coil part 2 and the outer frame part 5 is cut, and the planar coil part 2 is separated from the outer frame part 5. In addition, when the runner part 6 is not provided between the planar coil part 2 and the outer frame part 5, this process is unnecessary.

(3) Next, as shown in FIG. 2A (1), the connection lead portion 4 is bent so that the planar coil portion 2 is disposed above the magnetic body forming surface 3 Y of the wiring lead frame portion 3. For example, the planar coil portion 2 is bent substantially perpendicularly to the wiring lead frame portion 3 by bending the planar coil portion 2 to the magnetic material forming surface 3Y side at the connection portion B1 between the connection lead portion 4 and the wiring lead frame portion 3. Then, the planar coil part 2 is arranged above the magnetic body forming surface 3Y by bending at the connection part B2 between the connection lead part 4 and the planar coil part 2.

  As described above, since the planar coil portion 2 and the wiring lead frame portion 3 are configured as an integral unit, the step of connecting the planar coil portion 2 to the wiring lead frame portion 3 is unnecessary. Moreover, in the case of the conventional winding coil, in order to insulate between coil wires (conductive wire), it was necessary to coat | cover a coil wire with resin, but in the case of the planar coil part 2, it is not necessary to coat | cover the surface with resin. .

(4) Next, as shown in FIG. 2A (2), the magnetic body portion 11 is formed on the magnetic body forming surface 3Y so as to embed the planar coil portion 2. This process will be described in detail with reference to FIG. In order to press-form the magnetic body part 11, a press apparatus is prepared. As shown in FIG. 3, the press apparatus includes an upper mold 101 having a through hole 101 a, a lower mold 102 having a flat upper surface, and a press mold that fits into the through hole of the upper mold 101. 103. The through hole 101a of the upper mold 101 has the same cross-sectional shape as the magnetic body forming region M. The planar coil portion 2 is smaller than the magnetic body forming region M so that the planar coil portion 2 is embedded in the magnetic body portion 11.

  First, the inductor-integrated lead frame 1 is placed on the lower mold 102 so that the electronic component mounting surface 3X is in contact with the lower mold 102. Next, on the inductor-integrated lead frame 1, the planar coil portion 2 is positioned in the through hole 101 a of the upper mold 101 and the side surface of the through hole 101 a coincides with the boundary line of the magnetic body forming region M. Place the upper die 101 on the top. As a result, the inductor-integrated lead frame 1 is sandwiched between the upper mold 101 and the lower mold 102.

  Next, the insulating magnetic powder 11A is poured into the through hole 101a of the upper mold 101, and the planar coil portion 2 is embedded with the insulating magnetic powder 11A. The insulating magnetic powder 11A includes metal particles such as iron covered with a thin layer of an insulator (resin, glass, etc.).

  Next, a predetermined pressure (for example, 500 MPa to 1 GPa) is applied to the insulating magnetic powder 11 </ b> A deposited in the through hole 101 a by the pressurizing mold 103 to perform press molding. Thereafter, the pressure-molded insulating magnetic powder is cured (for example, 120 ° C. to 200 ° C.) and cured. By this curing process, the insulating thin layer covering the metal particles of the insulating magnetic powder 11A is melted, and the insulating magnetic body portion 11 is formed. That is, the magnetic body portion 11 configured to have an insulator and metal particles insulated by the insulator is formed.

  As described above, unlike the case of the winding coil, the planar coil portion 2 does not need to be covered with resin. For this reason, it is possible to set the temperature of a curing process higher than before. Therefore, a material (for example, glass) having a melting temperature higher than that of the resin can be used as the insulator covering the metal particles of the insulating magnetic powder 11A.

  By this step, as shown in FIG. 2A (2), the magnetic substrate 20 having the substantially rectangular parallelepiped magnetic body portion 11 in which the planar coil portion 2 and the connection lead portion 4 are embedded is manufactured.

  As described above, since the planar coil portion 2 and the wiring lead frame portion 3 are formed from a single metal plate, the planar coil portion 2 and the wiring lead 3a are not separated by the pressure molding in this step. The yield of the magnetic substrate 20 can be improved.

  Note that the pressure applied to the insulating magnetic powder 11 </ b> A by the pressurizing mold 103 also acts on the planar coil portion 2. For this reason, the planar coil part 2 can be bent during pressure molding by utilizing this pressure. Therefore, the planar coil portion 2 and the wiring after molding of the magnetic body portion 11 are adjusted by adjusting in advance the angle formed between the planar coil portion 2 and the wiring lead frame portion 3 based on the pressure molding conditions such as pressure. The angle formed with the lead frame portion 3 can be set to a desired value. For example, as shown in FIG. 3, the planar coil portion 2 is adjusted slightly upward. That is, before pressurizing with the pressurizing mold 103, the connection lead portion 4 so that the distance between the planar coil portion 2 and the wiring lead frame portion 3 increases from the connection lead portion 4 toward the distal end of the planar coil portion 2. The flat coil portion 2 may be parallel to the magnetic body forming surface 3Y after pressure forming. Here, “parallel” includes not only the case of being completely parallel but also the case of being substantially parallel if an inductance value within the specification range can be obtained.

(5) Next, at a predetermined position (such as a mounting position of the electronic component) on the electronic component mounting surface 3X and at least a part of the outer frame portion 5 (a portion that abuts a convex portion 14a of the terminal lead frame 14 described later). Print cream solder. Thereafter, as shown in FIG. 2B (3), the electronic component 13 (control chip, resistor, capacitor, etc.) is mounted on the cream solder (not shown) printed on the electronic component mounting surface 3X.

(6) Next, a terminal lead frame 14 having an opening and a resin inlet that is connected to the opening and having a protrusion protruding from the side of the opening is manufactured. The terminal lead frame 14 is manufactured by processing a single metal plate (for example, a copper plate), and as shown in FIG. 5, a rectangular opening 14h is provided. Each of the sides is provided with three convex portions 14a facing the inside of the opening 14h. In addition, a resin inlet 14b that functions as a resin supply port for sealing the electronic component 13 in a subsequent process is provided so as to be connected to the opening 14h. In FIG. 5, the resin inlet 14b is provided only at one place in the upper right corner of the opening 14h. However, the resin inlet 14b has a plurality of locations (for example, the openings 14h) according to the characteristics of the resin sealing the electronic component 13. Other corners) may be provided. Also, the shape of the resin inlet 14b can be changed as appropriate according to the characteristics of the resin that seals the electronic component 13.

  In addition, as shown in FIG. 5, the terminal lead frame 14 may be provided with an alignment hole 14 c for use in alignment with the inductor integrated lead frame 1.

(7) Next, as shown in FIG. 2B (4) and FIG. 6, the convex portion 14a straddles the inner edge of the support frame 3b, and at least a part of the convex portion 14a is electrically connected to the wiring lead 3a, and the electron The terminal lead frame 14 is overlaid on the electronic component mounting surface 3X of the wiring lead frame portion 3 so that the electronic component 13 mounted on the component mounting surface 3X is accommodated in the opening 14h. At the time of this superposition, the wiring lead frame portion 3 and the terminal lead frame 14 may be aligned by inserting a pin having the same diameter as the alignment hole into the alignment holes 5a and 14c.

(8) Next, the cream solder is melted by reflow treatment, and the electronic component 13 and the terminal lead frame 14 are coupled to the inductor integrated lead frame 1.

(9) Next, as shown in FIG. 2C (5), a closing member 15 is formed on the terminal lead frame 14 so as to cover the opening 14h of the terminal lead frame 14 and the resin inlet 14b. The closing member 15 is formed, for example, by sticking an adhesive tape on the terminal lead frame 14 or pressing an elastic body such as Teflon on the terminal lead frame 14.

  By this step, the recess 12 is defined by the opening 14 h and the closing member 15. As can be seen from FIG. 6, this recess 12 is connected to the resin inlet 14b.

(10) Next, the electronic component 13 mounted on the electronic component mounting surface 3X is sealed with resin. More specifically, the inductor-integrated lead frame 1 and the terminal lead frame 14 are turned upside down so that the magnetic body forming surface 3Y is on the upper side, and a potting resin or the like is made from the magnetic body forming surface 3Y side to the resin inlet 14b. Resin is injected to fill the recess 12 with resin. At this time, since the upper surface of the convex portion 14a is covered with the closing member 15 covering the opening 14h, a terminal surface 17a of the external terminal 17 described later is protected from the injected resin.

In addition, as shown in FIG. 6, it is preferable that the penetration part T which penetrates the inductor integrated lead frame 1 and the terminal lead frame 14 is provided. Thereby, the air generated when the resin is injected into the concave portion 12 can be discharged from the penetrating portion T to the magnetic body forming surface 3Y side. In addition, by making the magnetic material type region M inside the inner edge of the support frame 3b of the wiring lead frame part 3, a part of the gap between the adjacent wiring leads 3a is not blocked by the magnetic body part 11, A part of this gap may be used as an air outlet. By providing the through portion T or the like that functions as an air discharge port in this way, it is possible to prevent voids from occurring in the resin portion 16 that seals the electronic component 13. Also, resin is injected from the electronic component mounting surface 3X side In addition, the electronic component 13 can be sealed. A method in this case will be described with reference to FIG.

  First, the closing member 15 is formed on the terminal lead frame 14 so as to cover the opening 14h. Thereby, a sealing space is defined by the opening 14 h, the closing member 15, and the wiring lead frame portion 3. Next, a jig 30 having a housing portion 30a capable of housing the magnetic body portion 11 is prepared. Then, as shown in FIG. 7, the inductor-integrated lead frame 1 is placed on the jig 30 so that the magnetic body portion 11 is accommodated in the accommodating portion 30 a of the jig 30. Next, resin is injected into the sealing space from the electronic component mounting surface 3X side through the resin inlet 14b, and the sealing space is set so that the electronic component 13 mounted on the electronic component mounting surface 3X is embedded. Fill with resin.

  When this method is adopted, before injecting the resin into the sealing space, the through-holes in the wiring lead frame portion 3 (the above-described through-portion T and adjacent ones) connecting the housing portion 30a of the jig 30 and the sealing space. It is preferable to close a part of the gap between the matching wiring leads 3a) with a resin (for example, silicone resin) from the magnetic body forming surface 3Y side. Thereby, it can prevent that resin inject | poured into sealing space flows down into the accommodating part 30a of the jig | tool 30. FIG.

  (11) Next, after the resin injected into the recess 12 is cured and the blocking member 15 is peeled off, the terminal lead frame 14 and the support are supported along the boundary line of the magnetic body forming region M as shown in FIG. Cut off the frame 3b. When the magnetic body forming region M is set inside the inner edge of the support frame 3b, the space between the inner edge of the support frame 3b and the boundary line of the magnetic body forming region M is cut. Accordingly, at least a part of the convex portion 14a remains on the wiring lead 3a while being electrically connected to the wiring lead 3a and electrically separated from the other convex portion 14a, and becomes the external terminal 17. In addition, the plurality of wiring leads 3a that are electrically connected via the support frame 3b are electrically separated.

  That is, in this step, the terminal lead frame 14 is cut off so that at least a part of the convex portion 14a of the terminal lead frame 14 remains on the wiring lead 3a to electrically separate the convex portions 14a from each other, and the wiring lead frame portion. 3 is cut off to electrically separate the wiring leads 3a from each other.

  In the method of manufacturing the electronic circuit module according to the present embodiment described above, the resin for sealing the electronic component 13 is filled in the recess 12 or the sealing space. For this reason, it is not necessary to prepare a member having a complicated shape in order to configure the wiring lead and the external terminal and to form the concave portion for storing the sealing resin. Further, the size and shape of the recess 12 and the sealing space can be easily changed depending on the thickness of the terminal lead frame 14 and the shape of the opening 14h. As a result, according to the electronic circuit module manufacturing method of the present embodiment, the electronic circuit module can be manufactured at low cost.

  Further, in the method of manufacturing the electronic circuit module according to the present embodiment, it is not necessary to bend the wiring lead 3a and make a part of the wiring lead 3a an external terminal. For this reason, it is possible to prevent the magnetic body portion 11 from being cracked when the wiring lead 3a is bent, and to prevent an electrical short circuit between the wiring leads 3a even when the wiring leads 3a have a narrow pitch. .

  Further, in the method of manufacturing the electronic circuit module according to the present embodiment, when the support frame 3b is cut off and the wiring leads 3a are electrically separated, the magnetic body portion 11 is not cut, so that the magnetic body portion 11 is damaged. Can be prevented.

  In the electronic circuit module manufacturing method according to the present embodiment, the outer frame portion 5 is also cut off together with the support frame 3b, so that the manufacturing efficiency of the electronic circuit module can be improved.

  Further, in the method of manufacturing the electronic circuit module according to the present embodiment, since the convex portion 14a is covered by the closing member 15 that covers the opening portion 14h, the upper surface of the convex portion 14a that becomes the terminal surface of the external terminal 17 is made of sealing resin. Can be protected.

  FIG. 8 is an external perspective view of the electronic circuit module 50 created by the above process. A specific example of the electronic circuit module 50 includes a power supply module such as a DC-DC converter.

  As shown in FIGS. 2C (6) and 8, the electronic circuit module 50 is disposed on the same plane, and has a first surface (electronic component mounting surface 3X) and a second surface (magnetic body forming surface 3Y). A plurality of wiring leads 3a having a plurality of wiring leads 3a, an electronic component 13 mounted on the first surface of the wiring leads 3a, and the wiring leads 3a via the connection leads 4, and the connection leads 4 are bent. Thus, the wiring lead 3a has the planar coil portion 2 provided on the second surface side of the wiring lead 3a, the metal particles and an insulator that insulates the metal particles, and is embedded in the planar coil portion 2. And a magnetic part 11 provided on the second surface.

  Further, the electronic circuit module 50 seals the electronic component 13 and is electrically connected to the resin lead 16 having the resin surface 16a parallel to the first surface and the wiring lead 3a, and to the first surface. And an external terminal 17 having a terminal surface 17a parallel to the resin surface 16a. The resin surface 16a and the terminal surface 17a are flush with each other. Therefore, when the electronic circuit module 50 is mounted on a printed circuit board or the like, the resin surface 16a comes into contact with the printed circuit board, and the heat generated by the electronic component 13 can be efficiently radiated to the printed circuit board.

  In the description of the method for manufacturing the electronic circuit module, the magnetic substrate 20 is used. However, the present invention is not limited to this. That is, instead of the magnetic substrate, an electronic circuit module can be manufactured in the same manner as described above using a substrate such as a printed circuit board having a wiring pattern on the surface.

  The manufacturing method of the electronic circuit module in this case is as follows.

(1) First, an electronic component mounting surface is provided on the surface, and a substrate having a plurality of wiring patterns formed on the electronic component mounting surface and an outer peripheral portion surrounding the plurality of wiring patterns is manufactured.

(2) Next, an electronic component is mounted on the electronic component mounting surface.

(3) Next, by processing one metal plate, an opening and a resin inlet that is connected to the opening are provided, and a terminal having a convex portion protruding from the side of the opening A lead frame is produced.

(4) Next, the convex portion straddles the inner edge of the outer peripheral portion (a boundary line between the outer peripheral portion and the region where the wiring pattern is formed), and at least a part of the convex portion is electrically connected to the wiring pattern. In addition, the terminal lead frame is overlaid on the electronic component mounting surface of the substrate so that the mounted electronic component is accommodated in the opening.

(5) Next, the electronic component mounted on the electronic component mounting surface is sealed with resin.

In addition, the process of sealing an electronic component with resin includes
Forming a closing member on the terminal lead frame so as to cover the opening of the terminal lead frame and the resin inlet, and defining a recess by the opening and the closing member;
A step of injecting resin into the resin inlet from the opposite side of the electronic component mounting surface and filling the recess with resin.

In addition, the process of sealing the electronic component with resin
Forming a closing member on the terminal lead frame so as to cover the opening of the terminal lead frame, and defining a sealing space by the opening, the closing member and the wiring lead frame portion;
A step of placing the substrate on a flat plate, injecting resin into the resin inlet from the electronic component mounting surface side, and filling the sealing space with resin.

(6) Next, after the resin is cured, the terminal lead frame is cut off so that at least a part of the protrusions of the terminal lead frame remains on the wiring pattern, and the protrusions are electrically separated. Let In addition, when the wiring pattern is electrically connected in the outer peripheral portion and finally needs to be electrically separated, the outer peripheral portion of the substrate may be cut off together with the terminal lead frame.

  Based on the above description, those skilled in the art may be able to conceive additional effects and various modifications of the present invention, but the aspects of the present invention are not limited to the individual embodiments described above. . You may combine suitably the component covering different embodiment. Various additions, modifications, and partial deletions can be made without departing from the concept and spirit of the present invention derived from the contents defined in the claims and equivalents thereof.

DESCRIPTION OF SYMBOLS 1 Inductor integrated lead frame 2 Planar coil part 2a Direct part 2b Meander part 3 Wiring lead frame part 3a Wiring lead 3b Support frame 3X Electronic component mounting surface 3Y Magnetic body formation surface 4 Connection lead part 5 Outer frame part 5a Positioning hole 6 Runner part 11A Insulating magnetic powder 11 Magnetic body part 12 Concave part 13 Electronic component 14 Terminal lead frame 14a Convex part 14b Resin inlet 14c Positioning hole 14h Opening part 15 Closing member 16 Resin part 16a Resin surface 17 External terminal 17a Terminal surface 20 Magnetic substrate 30 Jig 30a Housing portion 50 Electronic circuit module 101 Upper mold 101a Through hole 102 Lower mold 103 Pressure mold B1, B2 Connection site M Magnetic body formation region T Through portion

Claims (24)

An inductor integrated lead frame made of a single metal plate,
A wiring lead frame portion having a plurality of wiring leads and a support frame that surrounds at least a part of the outer periphery of the plurality of wiring leads and supports the plurality of wiring leads;
A connection lead portion provided to extend from the wiring lead frame portion;
A planar coil portion that is connected to the wiring lead via the connection lead portion and is smaller than a region where the plurality of wiring leads are located;
An inductor-integrated lead frame comprising:   The planar coil portion includes a straight portion extending linearly from the connection lead portion, and a meander portion connected to an end portion of the straight portion and formed in a zigzag shape. The inductor integrated lead frame as described.   3. The inductor-integrated lead frame according to claim 1, wherein the planar coil portion is formed so as to wave in the thickness direction of the metal plate.   4. The apparatus according to claim 1, further comprising: an outer frame portion that surrounds the wiring lead frame portion and the planar coil portion; and a runner portion that connects the outer frame portion and the wiring lead frame portion. An inductor-integrated lead frame according to claim 1.   5. The inductor-integrated lead frame according to claim 1, wherein an alignment hole is provided in the outer frame portion. A plurality of wiring leads disposed on the same plane and having first and second surfaces facing each other;
An electronic component mounted on the first surface of the wiring lead;
A planar coil portion configured integrally with the wiring lead via a connection lead portion and provided on the second surface side of the wiring lead by bending the connection lead portion;
A magnetic part having metal particles and an insulator that insulates the metal particles, and provided on the second surface of the wiring lead so as to embed the planar coil part;
An electronic circuit module comprising: A resin part that seals the electronic component and has a resin surface parallel to the first surface;
An external terminal electrically connected to the wiring lead and having a terminal surface parallel to the first surface;
The electronic circuit module according to claim 6, wherein the resin surface and the terminal surface are flush with each other.   The planar coil portion includes a straight portion that extends linearly from the connection lead portion, and a meander portion that is connected to an end portion of the straight portion and is formed in a zigzag shape. The inductor-integrated lead frame according to claim 7.   9. The inductor-integrated lead frame according to claim 6, wherein the planar coil portion is formed so as to wave in a direction perpendicular to the first surface.   10. The inductor integrated lead frame according to claim 6, wherein the planar coil portion is provided in parallel with the second surface of the wiring lead. A wiring lead frame portion having a plurality of wiring leads and a support frame that surrounds at least a part of the outer periphery of the plurality of wiring leads and supports the wiring leads; and is provided to extend from the wiring lead frame portion. An inductor-integrated lead frame comprising: a connecting lead portion; and a planar coil portion that is connected to the wiring lead via the connecting lead portion and is smaller than a region where the plurality of wiring leads are located. Producing a metal plate by processing;
Bending the connection lead portion so that the planar coil portion is disposed above the magnetic body forming surface of the wiring lead frame portion;
Forming a magnetic body portion having metal particles and an insulator that insulates the metal particles in a magnetic body forming region of the magnetic body forming surface so as to embed the planar coil portion;
Mounting an electronic component on an electronic component mounting surface opposite to the magnetic body forming surface of the wiring lead frame portion;
A terminal lead frame having a plurality of protrusions projecting from the sides of the opening is formed by processing a single metal plate while providing an opening and a resin inlet connected to the opening. Process,
The terminal lead so that the convex portion straddles the inner edge of the support frame, at least a part of the convex portion is electrically connected to the wiring lead, and the mounted electronic component is accommodated in the opening. Superimposing a frame on the electronic component mounting surface of the wiring lead frame part;
Sealing the electronic component mounted on the electronic component mounting surface with resin;
After the resin is cured, the terminal lead frame is cut off so that at least a part of the protrusions of the terminal lead frame remains on the wiring leads, and the protrusions are electrically separated, and the wiring leads Cutting the support frame of the frame part to electrically separate the wiring leads; and
An electronic circuit module manufacturing method comprising: The step of sealing the electronic component with resin includes
Forming a closing member on the terminal lead frame so as to cover the opening of the terminal lead frame and the resin inlet, and defining a recess by the opening and the closing member;
Injecting resin into the resin inlet from the magnetic body forming surface side, and filling the recess with resin;
The manufacturing method of the electronic circuit module of Claim 11 characterized by the above-mentioned.   The magnetic body forming region is located on the inner side of the inner edge of the support frame, and a part of the gap between the adjacent wiring leads is used as an outlet for air generated when the recess is filled with resin. The manufacturing method of the electronic circuit module of Claim 12. The step of sealing the electronic component with resin includes
Forming a closing member on the terminal lead frame so as to cover the opening of the terminal lead frame, and defining a sealing space by the opening, the closing member and the wiring lead frame portion;
A jig having a housing portion capable of housing the magnetic body portion is prepared, and the inductor integrated lead frame is mounted on the jig so that the magnetic body portion is housed in the housing portion of the jig. A step of placing;
Injecting resin into the resin inlet from the electronic component mounting surface side, and filling the sealing space with resin;
The manufacturing method of the electronic circuit module of Claim 11 characterized by the above-mentioned.   Before injecting the resin into the sealing space, the through hole of the wiring lead frame part connecting the housing part of the jig and the sealing space is closed with the resin from the magnetic body forming surface side. The manufacturing method of the electronic circuit module of Claim 14.   16. The electronic device according to claim 11, wherein the closing member is formed by sticking an adhesive tape on the terminal lead frame or pressing an elastic body on the terminal lead frame. Circuit module manufacturing method. The magnetic part is
An upper mold having a through-hole having the same cross-sectional shape as the shape of the magnetic body forming region, a lower mold having a flat upper surface, and a pressure mold fitted into the through-hole of the upper mold Prepare a press device with
The inductor-integrated lead frame is placed on the lower mold so that the electronic component mounting surface of the wiring lead frame portion is in contact with the upper surface of the lower mold,
The upper mold is placed on the inductor-integrated lead frame so that the planar coil portion is located in the through hole of the upper mold and the side surface of the through hole coincides with the boundary line of the magnetic body forming region. Place the mold,
Insulating magnetic powder containing metal particles covered with a thin layer of insulator is poured into the through hole of the upper mold, and the planar coil portion is embedded with the insulating magnetic powder,
Applying pressure to the insulating magnetic powder deposited in the through-hole of the upper mold by the pressurizing mold and press-molding, and then heating and curing the insulating magnetic powder that has been press-molded.
The method of manufacturing an electronic circuit module according to claim 11, wherein the electronic circuit module is formed. When bending the connection lead portion, the connection lead portion is bent so that the distance between the planar coil portion and the wiring lead frame portion increases from the connection lead portion toward the distal end of the planar coil portion,
18. The method of manufacturing an electronic circuit module according to claim 17, wherein the planar coil portion is parallel to a magnetic body forming surface of the wiring lead frame portion by the pressure of the pressurizing mold. .   19. The electronic circuit module according to claim 11, wherein when the inductor-integrated lead frame is manufactured, the planar coil portion is formed so as to wave in the thickness direction of the metal plate. Method. An alignment hole is provided in the inductor-integrated lead frame and the terminal lead frame,
20. The electronic circuit module according to claim 11, wherein the inductor-integrated lead frame and the terminal lead frame are aligned by inserting a pin into the alignment hole. Method. An electronic component mounting surface is provided on the surface, and a step of producing a substrate having a plurality of wiring patterns formed on the electronic component mounting surface and an outer peripheral portion surrounding the plurality of wiring patterns;
Mounting electronic components on the electronic component mounting surface of the substrate;
A step of producing a terminal lead frame having a convex portion projecting from the side of the opening, provided with an opening and a resin inlet connected to the opening, by processing one metal plate; ,
The terminal lead so that the convex portion straddles the inner edge of the outer peripheral portion, at least a part of the convex portion is electrically connected to the wiring pattern, and the mounted electronic component is accommodated in the opening portion. Superimposing a frame on the electronic component mounting surface of the substrate;
Sealing the electronic component mounted on the electronic component mounting surface with resin;
After the resin is cured, a step of electrically separating the protrusions by cutting off the terminal lead frame so that at least a part of the protrusions of the terminal lead frame remains on the wiring pattern;
An electronic circuit module manufacturing method comprising: The step of sealing the electronic component with resin includes
Forming a closing member on the terminal lead frame so as to cover the opening of the terminal lead frame and the resin inlet, and defining a recess by the opening and the closing member;
Injecting resin into the resin inlet from the opposite side of the electronic component mounting surface, and filling the recess with resin;
The method of manufacturing an electronic circuit module according to claim 21, comprising: The step of sealing the electronic component with resin includes
Forming a closing member on the terminal lead frame so as to cover the opening of the terminal lead frame, and defining a sealing space by the opening, the closing member and the wiring lead frame portion;
Placing the substrate on a flat plate, injecting resin into the resin inlet from the electronic component mounting surface side, and filling the sealing space with resin;
The method of manufacturing an electronic circuit module according to claim 21, comprising:   24. The electronic device according to claim 21, wherein the closing member is formed by sticking an adhesive tape on the terminal lead frame or pressing an elastic body on the terminal lead frame. Circuit module manufacturing method.

Images