JPS59190717A - Proximity switch - Google Patents
Proximity switchInfo
- Publication number
- JPS59190717A JPS59190717A JP58065921A JP6592183A JPS59190717A JP S59190717 A JPS59190717 A JP S59190717A JP 58065921 A JP58065921 A JP 58065921A JP 6592183 A JP6592183 A JP 6592183A JP S59190717 A JPS59190717 A JP S59190717A
- Authority
- JP
- Japan
- Prior art keywords
- proximity switch
- lead frame
- chip
- detection coil
- switch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/945—Proximity switches
- H03K17/95—Proximity switches using a magnetic detector
- H03K17/9505—Constructional details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coils Or Transformers For Communication (AREA)
- Switches That Are Operated By Magnetic Or Electric Fields (AREA)
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
発明の分野
本発明は物体の通過の有無の検出や物体の位置制御に用
いられる高周波発振型の近接スイッチに関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a high frequency oscillation type proximity switch used for detecting the presence or absence of passage of an object and controlling the position of the object.
発明の背景
物体の近接を検知する近接スイッチはその用途に合わせ
て種々の形状のものが実用化されている。BACKGROUND OF THE INVENTION Proximity switches for detecting the proximity of objects have been put into practical use in various shapes depending on their uses.
第１図（ａ）〜（ｇ）は従来より用いられている種々の
近接スイッチを示す斜視図である。第１図（ａｌ〜ｔｅ
ｌの各近接スイッチの左端面、及び第１図（ｆｌ、 ＋
ｇ）の走接スイッチの上面に示ず１−＋」の記号は物体
の検知面であって、高周波発振型の近接スイッチの場合
にはその内部に検知コイルが埋め込まれている。FIGS. 1(a) to 1(g) are perspective views showing various conventional proximity switches. Figure 1 (al~te
1 (fl, +
The symbol "1-+" not shown on the top surface of the running switch in g) is the detection surface of an object, and in the case of a high frequency oscillation type proximity switch, a detection coil is embedded inside.
これらの近接スイッチはその形状に合わせて搬送ライン
や各種制御装置に取りイ」けられる。例えば第１図（，
１１の近接スイッチでは第２図ｔａ＋に示すように近接
スイッチの外周を覆うハンド１を用いて所望の位置に取
り付けられ、第Ｆ図（ｂ）や（ｆＬ （ｇ＋の近接スイ
ッチでは第２図（ｂｌに示すように設置台２にボルトに
よって固定される。又第１図（Ｃ１，（ｄｌ等の近接ス
イッチでは第２図ｆｃ）に示すようにＬ字型金具３を介
してボルトによって設置台２に固定される。更に第１図
（ｅｌのように近接スイッチの円筒状のケースの外周に
ネジ溝が切られているものにあっては、第２図Ｆｄｌ、
（Ｑｌに示すように雌ネジが切られた金属板４にねじ
込み、少なくとも一方からナンドで締め付りて金属板４
を貫通させて固定する。These proximity switches can be installed in conveyor lines and various control devices depending on their shape. For example, Figure 1 (,
The proximity switch No. 11 is attached to the desired position using the hand 1 that covers the outer periphery of the proximity switch as shown in Fig. 2 ta+, and the position shown in Fig. F (b) and (fL (for the g+ proximity switch Fig. 2 It is fixed to the installation stand 2 with bolts as shown in bl. Also, as shown in Fig. 1 (C1, (Fig. 2 fc for proximity switches such as DL), the installation stand is fixed with bolts through the L-shaped fitting 3. 2. Furthermore, in the case of a proximity switch with a threaded groove cut on the outer periphery of the cylindrical case of the proximity switch like the one shown in Fig. 1 (el),
(As shown in Ql, screw the female thread into the metal plate 4, tighten it with a nand from at least one side, and tighten the metal plate 4.)
Penetrate and fix.
またケースの全面にネジ溝が切られているものにあって
は、第２図（ｆｌに示すように金属体５に埋め込んで取
り何げてもよく、第２図（ｇ＋に示すように金属板４を
貫通させて取りイ」けてもよい。In addition, if the case has threaded grooves on the entire surface, it may be removed by embedding it in the metal body 5 as shown in Fig. 2 (fl), or it may be removed as shown in Fig. It may be removed by penetrating the plate 4.
しかしながらこのように従来の近接スイッチはいずれも
固定のためのネジや取り付り板、固定用のナツト等を必
要とするため取り（＝ｊりに手間がかかり、取りイ」け
工具も必要とするという問題点があった。更に複写機や
自動販売機等、機器の内部に近接スイッチを使用する場
合には、検出センサのために余り多くの取り何りスペー
スがとれなかったり、信号伝送用のワイヤがあまり長（
伸ばせないことが多い。このような場合には従来の近接
スイッチは使いにくいという問題点があった。However, all conventional proximity switches require screws, mounting plates, nuts, etc. to fix them, so it is time-consuming to remove them and tools are also required. Furthermore, when using a proximity switch inside equipment such as a copying machine or a vending machine, there is a problem in that it does not take up much space for the detection sensor, or it requires If the wire is too long (
Often cannot be extended. In such cases, conventional proximity switches have the problem of being difficult to use.
発明の目的
本発明はこのような従来の近接スイッチの問題点を解消
するものであって、近接スイッチを集稍回路と同様に構
成することによって超小型化し、プリント基板に直接接
続できるようにして自動販売機等の機器に内蔵して使用
するといった用途に適した近接スイッチを提供すること
を目的とする。OBJECTS OF THE INVENTION The present invention solves the problems of conventional proximity switches, by making the proximity switch ultra-small by configuring it in the same way as an integrated circuit, and by making it possible to connect directly to a printed circuit board. The purpose of the present invention is to provide a proximity switch suitable for use by being built into equipment such as vending machines.
発明の構成と効果
本発明は検知コイルと、該検知コイルを発振回路要素と
する発振器を含むスイッチ回路部とを有し、物体の近接
を検知する高周波発振型の近接スイッチであって、検知
コイルはり−１Ｓフレームをスパイラル状に形成するこ
とによって構成され、スイッチ回路部はリードフレーム
上に配設され、樹脂モールド成形により一体に成形して
構成したことを特徴とするものである。Structure and Effects of the Invention The present invention provides a high-frequency oscillation type proximity switch for detecting the proximity of an object, which includes a detection coil and a switch circuit section including an oscillator using the detection coil as an oscillation circuit element. It is constructed by forming a beam-1S frame into a spiral shape, and the switch circuit section is disposed on the lead frame, and is characterized in that it is integrally formed by resin molding.
このような特徴を有する本発明によれば、近接スイッチ
をＩＣと共に同様の製造工程により構成することができ
る。従って部品数が大幅に叔少し、組立工数も大幅に減
少するので従来の近接スイッチに比べて極めて低価格化
することができる。叉近接スイッチ自体を極めて薄く小
型化することができるので狭いスペースにも近接スイッ
チを設けて物体検知をすることが可能となる。又本発明
では近接スイッチをプリント基板に直接接続することが
でき、それによって近接スイッチを所定の位置に固定す
ることができる。従ってネジ等の取り付は部材が不要と
なり、接続が容易で取り付げに要する手間と工数を大幅
に少なくすることができる。又プリント基板への接続と
同時に電気的な配線作業も完了する。そのため従来の近
接スイッチのようにワイヤによって電源や信号線を接続
する必要はなくノイズや誘導の影響を受けることが少な
くなり、信頼性を向上させることができる。According to the present invention having such features, the proximity switch can be constructed using the same manufacturing process as the IC. Therefore, the number of parts and the number of assembly steps are greatly reduced, so the price can be reduced significantly compared to conventional proximity switches. Since the proximity switch itself can be made extremely thin and compact, it is possible to provide the proximity switch even in a narrow space to detect objects. The present invention also allows the proximity switch to be connected directly to the printed circuit board, thereby securing the proximity switch in a predetermined position. Therefore, no members are required for attaching screws or the like, and the connection is easy and the labor and man-hours required for attachment can be significantly reduced. Also, the electrical wiring work is completed at the same time as the connection to the printed circuit board. Therefore, unlike conventional proximity switches, there is no need to connect the power supply and signal lines with wires, and the influence of noise and induction is reduced, making it possible to improve reliability.
実施例の説明
第３図は一般的な高周波発振型の近接スイッチの構成を
示すブロック図である。本図に示すように高周波発振型
近接スイッチでは検知素子とじて検知コイルＬを用い、
この検知コイルＩ−に発振回路１０が接続され、更に発
振状態検出回路１１か接続されている。発振回路は當に
一定の周波数で発振を続けておりその発振状態は発振状
態検出回路１１で常にチェックされている。そして物体
が近接すると発振状態が変化するので出力回路１２より
出力を出して物体の近接を検出している。又多くの近接
スイッチではその動作を確認するだめの動作表示灯１３
が設けられる。高周波発振型の近接スイッチはこのよう
な構成を持つので、小型化しようとすれば検知コイルＬ
とスイッチ回路部とを共に小型化しなげればならない。DESCRIPTION OF THE EMBODIMENTS FIG. 3 is a block diagram showing the configuration of a general high frequency oscillation type proximity switch. As shown in this figure, a high frequency oscillation type proximity switch uses a detection coil L as a detection element.
An oscillation circuit 10 is connected to this detection coil I-, and an oscillation state detection circuit 11 is also connected thereto. The oscillation circuit continues to oscillate at a constant frequency, and the oscillation state is constantly checked by the oscillation state detection circuit 11. When an object approaches, the oscillation state changes, so an output is output from the output circuit 12 to detect the proximity of the object. Also, many proximity switches have an operation indicator light 13 to confirm their operation.
is provided. The high frequency oscillation type proximity switch has such a configuration, so if you want to make it smaller, the detection coil L
It is necessary to downsize both the switch circuit section and the switch circuit section.
第４図（ａｌ及び第４図（ｂｌは本発明の一実施例であ
る高周波発振型の近接スイッチの組立状態を示す斜視図
及び上面図である。本実施例においては検知コイルに銅
叉は銅合金等の良導体であるリードフレームを用い、リ
ードフレームをプレスによる打抜き又はエツチングによ
りスパイラル状に構成して検知コイルＬとしている。こ
のリードフレームには加工前に検知コイルＬとして構成
する部分を金メッキとしたものを用いてもよい。このよ
うにして平面状のスパイラルコイルを形成し、且つ電子
回路との接続は通常のｒｃ実装の場合と同様にボンディ
ング等によって実現している。次に第３図に示したスイ
ッチ回路部、即ち発振回路１０゜発振状態検出回路１１
．出力回路１２を集積回路化してワンチップに構成した
近接スイッチ専用のＩＣチップ２１を用いる。ＩＣチッ
プ２】も通糸゛のＩＣを製造する場合と同様にリードフ
レーム２０ｂ上に形成している。リードフレームによっ
て構成されている検知コイルＬの両端はワイヤホンディ
ングによってこのＩＣチップ２１に接続される。ＩＣチ
ップ２１の他の入出力端も図示のようにワイヤボンディ
ングによって他のリードフレーム２０ｃ、２０ｂ、２０
ｄ、２０ｅに接続される。FIG. 4 (al) and FIG. 4 (bl) are a perspective view and a top view showing the assembled state of a high frequency oscillation type proximity switch which is an embodiment of the present invention. Using a lead frame made of a good conductor such as a copper alloy, the lead frame is formed into a spiral shape by punching or etching with a press to form the sensing coil L.The part of the lead frame that will form the sensing coil L is plated with gold before processing. In this way, a planar spiral coil is formed, and the connection with the electronic circuit is realized by bonding etc. as in the case of normal RC mounting.Next, the third The switch circuit shown in the figure, that is, the oscillation circuit 10° and the oscillation state detection circuit 11
．． An IC chip 21 dedicated to a proximity switch is used, in which the output circuit 12 is integrated into a single chip. The IC chip 2 is also formed on the lead frame 20b in the same manner as in the case of manufacturing the thread-threading IC. Both ends of the detection coil L constituted by a lead frame are connected to this IC chip 21 by wire bonding. Other input/output terminals of the IC chip 21 are also connected to other lead frames 20c, 20b, 20 by wire bonding as shown in the figure.
d, connected to 20e.
リードフレーム２Ｏｄ上には近接スイッチの動作表示灯
として用いる発光ダイオードのチップ２２が接続されて
いる。こうしてリードフレームの中央部を構成した後、
第４図（ｂ）に示すように破線部分２３を樹脂モールド
により低圧成形して立体的に成形する。そして一点鎖線
で示す部分等の不要なリードフレーム端部を切断して第
５図に６＋Ｊ視図を示すように各端子を折り曲げてデュ
アル・インライン型の近接スイッチを構成する。この時
発光ダイオードのチップ２２の発光が樹脂モールド成形
後に検知できるようにこのチップの上部だ４ｊをライト
ガイド２４として透明樹脂により成形する。A light emitting diode chip 22 used as an operation indicator of the proximity switch is connected to the lead frame 2Od. After constructing the central part of the lead frame in this way,
As shown in FIG. 4(b), the broken line portion 23 is formed three-dimensionally by low-pressure molding using a resin mold. Then, unnecessary end portions of the lead frame, such as the portion shown by the dashed line, are cut off, and each terminal is bent as shown in the 6+J perspective view in FIG. 5, thereby constructing a dual in-line type proximity switch. At this time, the upper part 4j of the light emitting diode chip 22 is molded with transparent resin as a light guide 24 so that the light emission from the light emitting diode chip 22 can be detected after resin molding.
このようにすればその上面に検知面２５を有する近接ス
イッチとして構成することができる。In this way, it can be constructed as a proximity switch having the detection surface 25 on its upper surface.
第６図ｆａ）及び第６図（ｂｌは本発明の他の実施例を
示す近接スイッチの組立図及びその上面図である。Figures 6 (fa) and 6 (bl) are an assembled view and a top view of a proximity switch showing another embodiment of the present invention.
本実施例は近接スイッチのＩＣチップ２１をスパイラル
状に構成したリードフレーム３０の中央部に配置したも
のである。即ち前述した実施例と同様にリードフレーム
を打抜き又はエツチングにより平面状のスパイラルコイ
ルＬとし、その中央に近接スイッチの回路部であるＩＣ
チップ２１を配置する。そしてそのＩＣチップ２１の電
極部とリードフレームの各端子を３０ｂ、３０ｃ、３０
ｄ。In this embodiment, an IC chip 21 of a proximity switch is arranged in the center of a lead frame 30 having a spiral shape. That is, in the same way as in the embodiment described above, a planar spiral coil L is formed by punching or etching the lead frame, and an IC, which is the circuit section of the proximity switch, is placed in the center of the spiral coil L.
Place the chip 21. Then, connect the electrode portion of the IC chip 21 and each terminal of the lead frame to 30b, 30c, 30.
d.
３０ｆにワイヤボンディングによって電気的に接続する
。リードフレーム３０ｃには前述した実施例と同しく発
光ダイオードチップ２２を設ける。30f by wire bonding. A light emitting diode chip 22 is provided on the lead frame 30c in the same way as in the embodiment described above.
こうしてリードフレームと検知回路部を一体に構成した
後樹脂モールドによって成形しり一トフレームの不要部
分を切り取ってフラントバンク型もしくはデュアル・イ
ン・ライン型の近接スイッチとして構成する。このよう
に検知コイルの中央にＩＣチップを設けた構造によれば
コイルの巻数を増やすことができ近接スイッチの実装面
積を小さくすることかできる。従って近接スイッチ自体
を極めて小型に構成することが可能となる。After the lead frame and the detection circuit are integrally formed in this way, unnecessary parts of the end frame molded by resin molding are cut out to form a flank bank type or dual-in-line type proximity switch. With this structure in which the IC chip is provided in the center of the detection coil, the number of turns of the coil can be increased and the mounting area of the proximity switch can be reduced. Therefore, it becomes possible to configure the proximity switch itself to be extremely compact.
尚これらの実施例において、リードフレームのフラット
コイルとなる部分の裏面にはフェライト板等を貼付して
おけば近接スイッチの検知面をその上面に限定すること
が可能となる。In these embodiments, if a ferrite plate or the like is attached to the back surface of the portion of the lead frame that will become the flat coil, the detection surface of the proximity switch can be limited to the upper surface thereof.
第１図（δ）〜（ｇｌは実施例の各種の近接スイフチの
外観を示す斜視図、第２図（ａｌ〜（ｇｌはこれらの近
接スイッチの取りイ」げ状態を示す図、第３図は一般的
な高周波発振型の近接スイッチの構成を示すブロック図
、第４図（ａｌ及び第４図（ｂｌは本発明の一実施例を
示す近接スイッチの組立状態を示す斜視図及び」二面図
、第５図はこの実施例による近接スイッチの組立完了後
の状態を示す斜視図、第６図（ａ）及び第６図（ｂ）は
本発明の他の実施例による近接スイッチの斜視図及び上
面図である。
Ｌ−−−−−−一検知コイル １０−−−発振回路
１１−−−−−一−発振状態検知回路 １２− 出
力回路１３−−−−−動作表示灯 ２０ａ〜２０ｆ、
３０ａ〜３０ ｆ−−−リードフレーム ２１−Ｉ
Ｃチップ ２２−−−−−−一発光ダイオードチノプ
２３−−−−−−一樹脂 ２４・−−−−一−ラ
イトガイド ２５−−検知面
特許出願人 立石電機株式会社
代理人 弁理士 岡本宜喜（他１名）
第１図
（８） （ｂ） （ｃ）
（ｄ） （ｅ）
（ｆ） （ｇ）
１
Ｌ」
（ａ） （ｂ）（ｃ）
（ｄ）（ｅ）
（ｆ） （ｇ）第３図
伽
第４図（ａ）
第４ 図（ｂ）Figures 1 (δ) to (gl are perspective views showing the external appearance of various proximity switches of the embodiments, Figures 2 (al to (gl) are views showing the removed state of these proximity switches, and Figure 3 4(a) and 4(b) are a block diagram showing the configuration of a general high-frequency oscillation type proximity switch, and FIG. 5 is a perspective view showing the state of the proximity switch according to this embodiment after assembly is completed, and FIGS. 6(a) and 6(b) are perspective views of a proximity switch according to another embodiment of the present invention. and a top view.L-----1 detection coil 10--Oscillation circuit
11-----Oscillation state detection circuit 12-Output circuit 13--Operation indicator light 20a to 20f,
30a~30f---Lead frame 21-I
C-chip 22--------One light emitting diode tip 23------One resin 24・------One light guide 25---Detection surface Patent applicant Tateishi Electric Co., Ltd. agent Patent attorney Okamoto Yoshiki (1 other person) Figure 1 (8) (b) (c) (d) (e) (f) (g) 1 L” (a) (b) (c)
(d)(e)
(f) (g) Figure 3 Figure 4 (a) Figure 4 (b)
Claims (3)
る発振器を含むスイッチ回路部とを有し、物体の近接を
検知する高周波発振型の近接スイッチにおいて、 前記検知コイルはリードフレームをスパイラル状に形成
することによって構成され、前記スイッチ回路部はリー
ドフレーム上に配設され、樹脂モールド成形により一体
に成形して構成したことを特徴とする近接スイッチ。(1) In a high-frequency oscillation type proximity switch that detects the proximity of an object and has a detection coil and a switch circuit section including an oscillator using the detection coil as an oscillation circuit element, the detection coil has a lead frame in a spiral shape. 1. A proximity switch, characterized in that the switch circuit section is arranged on a lead frame and integrally formed by resin molding.
とする特許請求の範囲第１項記載の近接スイッチ。(2) The proximity switch according to claim 1, wherein the switch circuit section is an integrated circuit.
に形成されたリードフレームによる検知コイルの中央終
端に実装されてなることを特徴とする特許請求の範囲第
２項記載の近接スイッチ。(3) The proximity switch according to claim 2, wherein the integrated circuit of the switch circuit section is mounted at the central end of a detection coil formed by a lead frame formed in a spiral shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58065921A JPS59190717A (en) | 1983-04-13 | 1983-04-13 | Proximity switch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58065921A JPS59190717A (en) | 1983-04-13 | 1983-04-13 | Proximity switch |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59190717A true JPS59190717A (en) | 1984-10-29 |
| JPH0435859B2 JPH0435859B2 (en) | 1992-06-12 |
Family
ID=13300913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58065921A Granted JPS59190717A (en) | 1983-04-13 | 1983-04-13 | Proximity switch |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59190717A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0710919A3 (en) * | 1994-10-21 | 1997-03-26 | Giesecke & Devrient Gmbh | Contactless module |
| WO1998013869A1 (en) * | 1996-09-26 | 1998-04-02 | Sican Gesellschaft Für Silizium-Anwendungen Und Cad/Cat Niedersachsen Mbh | Integrated circuit with an inductive component |
| EP0902472A2 (en) * | 1997-09-15 | 1999-03-17 | Microchip Technology Inc. | Combination inductive coil and integrated circuit semiconductor chip in a single lead frame package and method therefor |
| EP1091404A1 (en) * | 1999-10-06 | 2001-04-11 | Lucent Technologies Inc. | Multifunction lead frame and integrated circuit package incorporating the same |
| WO2006085363A1 (en) * | 2005-02-09 | 2006-08-17 | Renesas Technology Corp. | Semiconductor apparatus and electronic circuit |
| JP2008543092A (en) * | 2005-06-03 | 2008-11-27 | インターナショナル・ビジネス・マシーンズ・コーポレーション | Apparatus and method for packaging an antenna for an integrated circuit chip for millimeter wave applications |
| JP2012234986A (en) * | 2011-05-02 | 2012-11-29 | Shindengen Electric Mfg Co Ltd | Inductor-integrated lead frame, electronic circuit module and method for manufacturing the same |
| WO2016026476A1 (en) * | 2014-08-22 | 2016-02-25 | Balluff Gmbh | Inductive proximity sensor of integrated design |
-
1983
- 1983-04-13 JP JP58065921A patent/JPS59190717A/en active Granted
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0710919A3 (en) * | 1994-10-21 | 1997-03-26 | Giesecke & Devrient Gmbh | Contactless module |
| US5946198A (en) * | 1994-10-21 | 1999-08-31 | Giesecke & Devrient Gmbh | Contactless electronic module with self-supporting metal coil |
| WO1998013869A1 (en) * | 1996-09-26 | 1998-04-02 | Sican Gesellschaft Für Silizium-Anwendungen Und Cad/Cat Niedersachsen Mbh | Integrated circuit with an inductive component |
| EP0902472A2 (en) * | 1997-09-15 | 1999-03-17 | Microchip Technology Inc. | Combination inductive coil and integrated circuit semiconductor chip in a single lead frame package and method therefor |
| EP0902472A3 (en) * | 1997-09-15 | 2000-10-18 | Microchip Technology Inc. | Combination inductive coil and integrated circuit semiconductor chip in a single lead frame package and method therefor |
| EP1091404A1 (en) * | 1999-10-06 | 2001-04-11 | Lucent Technologies Inc. | Multifunction lead frame and integrated circuit package incorporating the same |
| WO2006085363A1 (en) * | 2005-02-09 | 2006-08-17 | Renesas Technology Corp. | Semiconductor apparatus and electronic circuit |
| JP2008543092A (en) * | 2005-06-03 | 2008-11-27 | インターナショナル・ビジネス・マシーンズ・コーポレーション | Apparatus and method for packaging an antenna for an integrated circuit chip for millimeter wave applications |
| JP2012234986A (en) * | 2011-05-02 | 2012-11-29 | Shindengen Electric Mfg Co Ltd | Inductor-integrated lead frame, electronic circuit module and method for manufacturing the same |
| WO2016026476A1 (en) * | 2014-08-22 | 2016-02-25 | Balluff Gmbh | Inductive proximity sensor of integrated design |
| US10298230B2 (en) | 2014-08-22 | 2019-05-21 | Balluff Gmbh | Inductive proximity sensor of integrated design |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0435859B2 (en) | 1992-06-12 |
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